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With particular material

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174250000 - Preformed panel circuit arrangement (e.g., printed circuit)

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
174257000 Conducting (e.g., ink) 521
174258000 Insulating 283
174259000 Adhesive/bonding 57
Entries
DocumentTitleDate
20090205853METHOD FOR APPLYING A METAL ON A SUBSTRATE - There is disclosed a method for applying a first metal on a substrate, which method comprises the steps a) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.08-20-2009
20100071937CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME - A circuit board includes a dielectric layer, a circuit layer, and an insulation layer. The circuit layer is disposed on the dielectric layer and has a pad region and a trace region. The insulation layer is disposed on the circuit layer and covers the trace region. Here, a thickness of the pad region is less than a thickness of the trace region.03-25-2010
20100101839DISPLAY APPARATUS - A display apparatus includes a first substrate including a plurality of pixels, a first electrode arranged on the first substrate, a second substrate facing the first substrate, and a second electrode arranged on the second substrate and spaced apart from the first electrode, the second electrode to form an electric field in cooperation with the first electrode. At least one of the first and second electrodes includes a transparent conductive nanomaterial having a transmittance of no less than 73% to no more than 100% and a sheet resistance of 0 ohms to 100 ohms.04-29-2010
20100025088CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM - The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same.02-04-2010
20090044970Methods for fabricating current-carrying structures using voltage switchable dielectric materials - A method comprises providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.02-19-2009
20090308643CROSSLINKABLE THERMOSET MONOMER, COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD COMPRISING THE THERMOSET MONOMER AND PRINTED CIRCUIT BOARD USING THE COMPOSITION - Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.12-17-2009
20100044083Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same - A method of manufacturing a build-up printed circuit board structure for increasing fine circuit density includes providing a core carrier board; forming a plurality of first conductive pads on a top surface of the core carrier board; forming a first dielectric layer on the core carrier board in order to cover the first conductive pads; drilling the first dielectric layer to form a patterned first electroplated layer on the first dielectric layer; forming a second dielectric layer, and the first dielectric layer and the patterned first electroplated layer being covered by the second dielectric layer; drilling the second dielectric layer and the first dielectric layer to form a patterned second electroplated layer on the second dielectric layer; and forming a third dielectric layer, and the second dielectric layer and the patterned second electroplated layer being covered by the third dielectric layer; and removing the core carrier board.02-25-2010
20090056991Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom - The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against chemical attack, the manufacture of localized conductive coatings, the manufacture of chemical sensors, for example in the fields of chemistry and molecular biology, the manufacture of biomedical equipment, and the like. In another aspect, the present invention provides a printed circuit board, a printed circuit board, comprising: at least one metal layer; a layer of organic molecules attached to the at least one metal layer; and an epoxy layer atop said layer of organic molecules.03-05-2009
20090056989PRINTED CIRCUIT BOARD AND METHOD FOR PREPARATION THEREOF - Disclosed is a method for preparing a printed circuit board. The method comprises forming a conductive layer on an insulated layer substrate. The method further includes partitioning the conductive layer into a first area and a second area by applying a photoresist mask. Furthermore, the method includes applying a first etching process to the conductive layer to pattern a first set of features on the first area of the conductive layer. Thereafter, the method includes applying a second etching process to the conductive layer to pattern a second set of features on the second area of the conductive layer. The second set of features on the second area of the conductive layer has a finer pitch as compared to the first set of features on the first area of the conductive layer.03-05-2009
20090236128PRINTED WIRING BOARD WITH RESIN COMPLEX LAYER AND MANUFACTURING METHOD THEREOF - A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material, and a conductive circuit is formed over the resin complex layer.09-24-2009
20100084170COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM - A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.04-08-2010
20090194320White Prepreg, White Laminated Plate, and Metal Foil Clad White Laminated Plate - [Problems] White laminates for print wire boards heretofore have problems of discoloring of thermosetting resin portion and reduction of reflectance. In LEDs of type using UV emitting device have not been appropriate in mounting recent high luminous intensity LED, a requirement for substrates which are not discolored towards UV and heat is becoming strong, since substrates on which the LED chip is mounted are deteriorated and discolored by UV. Further, in mounting chip LED, accuracy of board thickness is also required in order to avoid liquid leakage during sealing process of the chip LED.08-06-2009
20080264680Voltage-Operated Layer Arrangement - A voltage-operated layer arrangement having a substrate (10-30-2008
20110272185PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm11-10-2011
20100170706ELECTRONIC MODULE AND METHOD FOR MANUFACTURING AN ELECTRONIC MODULE - An electronic module includes a first substrate having at least one electronic component, and a housing embedded in the substrate and designed as an injection molded housing or a transfer molded housing, and which includes electrical leads protruding from the housing, connected to the first substrate and designed as a pressed screen. At least one further second substrate provided with second electrical is embedded in the housing, the second leads being designed as a second pressed screen, and the two pressed screens being directly connected to each other in at least one location.07-08-2010
20090266589PROCESS FOR PRODUCING METAL WIRING BOARD - Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.10-29-2009
20120080217ELECTROSTATIC CAPACITIVE TYPE TOUCH SCREEN PANEL - A touch screen panel according to an embodiment includes a substrate; an electrode forming part including a plurality of first electrode serials arranged in parallel in a first direction and a plurality of second electrode serials arranged in parallel in a second direction to cross the first direction, and each of the first electrode serials including a plurality of first electrode patterns, each of the second electrode serials including a plurality of second electrode patterns; and a routing wire forming part formed on the substrate outside the electrode forming part, and including a plurality of first routing wires connected to the plurality of first electrode serials, respectively and a plurality of second routing wires connected to the plurality of second electrode serials, respectively.04-05-2012
20100018758PRINTED WIRING BOARD - A printed wiring board which includes a core substrate and a plurality of buildup layer. The core substrate contains carbon fiber. The plurality of buildup layers is stacked on the core substrate. The buildup layer includes an insulating layer and a conductive wiring layer. The insulating layer contains a resin material having a glass fiber cloth embedded therein.01-28-2010
20090294157ELECTRO-OPTIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electro-optic device includes a substrate a metal thin film pattern formed on the substrate, and a transparent electrode pattern formed to cover the metal thin film pattern, wherein one side of the metal thin film pattern is formed to be exposed to the outside of the transparent electrode pattern.12-03-2009
20110266037ELECTRONIC PART, ELECTRONIC MEMBER CONNECTION METHOD, AND CIRCUIT CONNECTION MEMBER - An electronic part includes a first electronic member having a wiring side. An anisotropic conductive sheet has a first side and a second side opposite to the first side and is disposed on the first electronic member so that the wiring side contacts the first side. A second electronic member has a third side and a fourth side opposite to the third side and is disposed on the anisotropic conductive sheet so that the second side contacts the third side. The second electronic member is electrically connected to the first electronic member through the anisotropic conductive sheet. An elastic body has a fifth side and a sixth side opposite to the fifth side and is disposed on the second electronic member so that the fourth side contacts the fifth side. A pressing member is disposed on the sixth side of the elastic body.11-03-2011
20080202799EMBEDDING AN ELECTRONIC COMPONENT BETWEEN SURFACES OF A PRINTED CIRCUIT BOARD - A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component. In some embodiments the hole and inserted component are located directly below a pin pad for a surface mounted device, for example an integrated circuit, providing the equivalent of zero wire and line lengths with no net increase in printed circuit board area.08-28-2008
20100139953DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - a display device which can prevent a contact defect of a driver IC and a manufacturing method thereof are disclosed.06-10-2010
20090139752ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE - Provided is a novel electronic device that comprises graphite, graphene or the like.06-04-2009
20090050354PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD HAVING THE SAME - A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.02-26-2009
20080314627ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 12-25-2008
20110139496RESIN COMPOSITION - A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.06-16-2011
20090242246PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.10-01-2009
20090314528WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD - A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.12-24-2009
20100206621WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT - A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively, an electronic component joined to the electrodes with the solders, a sealing resin provided between the insulating board and the electronic component, a component-fixing layer provided on the upper surface of the insulating board and the first wiring pattern and having an insulating property, a second wiring pattern on the component-fixing layer, and an interlayer wiring connecting the first wiring pattern to the second wiring pattern. The solder resist surrounds the electrodes. The sealing resin entirely covers the solders and the solder resist. This wiring board can be efficiently manufactured by simple processes.08-19-2010
20120193131METAL BASE CIRCUIT BOARD AND PRODUCTION METHOD THEREOF - The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.08-02-2012
20110083884NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond.04-14-2011
20110147056CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME - A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The first dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit layer and an intaglio pattern. The antagonistic activation layer is disposed on the second surface of the dielectric layer. The first conductive layer is disposed in the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer via the first conductive layer.06-23-2011
20110083883WIRING BOARD AND MOUNT STRUCTURE - A circuit board provided with a first resin layer and with a first conductive layer formed on the first resin layer. The first conductive layer has a metal carbide layer containing a carbide of a transition metal selected from Group IV, Group V, or Group VI in the Periodic Table and bonded to the first resin layer. The first resin layer has a first region to which the metal carbide layer is bonded and a second region located in an inner portion of the first resin layer from the first region. The first region has a larger ratio of number of atoms of nitrogen relative to number of atoms of carbon than in the second region.04-14-2011
20090218118BOARD AND MANUFACTURING METHOD FOR THE SAME - A board includes a core board, an electronic component arranged on the core board, and an intermediate layer that includes resin containing carbon fibers and that surrounds the electronic component from the side.09-03-2009
20100038119Metal Deposition - Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.02-18-2010
20100065310METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP - A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield.03-18-2010
20110100684METHOD FOR MANUFACTURING AN ELECTRICAL CONDUCTOR BY APPLYING AT LEAST ONE PASTE, IN PARTICULAR A THICK-FILM PASTE - A method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste, to a substrate by a dispensing operation, wherein the paste is applied in at least one strand.05-05-2011
20110100685SUBSTRATE ANCHOR STRUCTURE AND METHOD - An electrical structure and method of forming. The electrical structure includes a first substrate, a first dielectric layer, an underfill layer, a first solder structure, and a second substrate. The first dielectric layer is formed over a top surface of the first substrate. The first dielectric layer includes a first opening extending through a top surface and a bottom surface of said first dielectric layer. The first solder structure is formed within the first opening and over a portion of the top surface of said first dielectric layer. The second substrate is formed over and in contact with the underfill layer.05-05-2011
20110031000RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).02-10-2011
20100065309ELECTRICAL AND OPTICAL HYBRID BOARD AND MANUFACTURING METHOD OF THE SAME - To provide an electrical and optical hybrid board that has on one surface an optical waveguide and on the other surface an electrical interconnect pattern or the like, in which the core pattern and electrical interconnect pattern or the like are positioned in place with high accuracy, and a method of manufacturing the same. The method includes: preparing laminate 03-18-2010
20110114372PRINTED WIRING BOARD - A printed wiring board has an insulation layer having upper and lower surfaces, an upper-surface circuit formed on the upper surface of the insulation layer, a resin insulation layer formed on the upper surface of the insulation layer and the upper-surface circuit and having a via-conductor opening through the resin insulation layer, a conductive circuit formed on the resin insulation layer, and a via conductor formed in the opening. The resin insulation layer has first and second surfaces. The second surface of the resin insulation layer faces the upper surface of the insulation layer. The conductive circuit is formed on the first surface of the resin insulation layer. The via conductor is connecting the conductive circuit and the upper-surface circuit. The opening has an inner wall which has a diameter decreasing from the second surface of the resin insulation layer toward the first surface of the resin insulation layer.05-19-2011
20110067907LOW TEMPERATURE CURABLE PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM MANUFACTURED BY USING THE SAME - The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.03-24-2011
20100071938METHODS OF TREATING A SURFACE TO PROMOTE METAL PLATING AND DEVICES FORMED - Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.03-25-2010
20100000770Conducting Nanotubes or Nanostructures Based Composites, Method of Making Them and Applications - An electromagnetic interference (EMI) shielding material includes a matrix of a dielectric or partially conducting polymer, such as foamed polystyrene, with carbon nanotubes or other nanostructures dispersed therein in sufficient concentration to make the material electrically conducting. The composite is formed by dispersing the nanotube material in a solvent in which the dielectric or partially conducting polymer is soluble and mixing the resulting suspension with the dielectric or partially conducting polymer. A foaming agent can be added to produce a lightweight foamed material. An organometallic compound can be added to enhance the conductivity further by decomposition into a metal phase.01-07-2010
20090008138THERMOSETTING RESIN COMPOSITION AND USES THEREOF - The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.01-08-2009
20110315434FINE ALUMINUM HYDROXIDE POWDER FOR FILLING IN RESIN AND METHOD FOR PRODUCING THE SAME - The object of the present invention is to provide an aluminum hydroxide powder for filling in resin, which is excellent fillability in resin. Provided is an aluminum hydroxide powder forfilling in resin, being characterized in that it comprises a gibbsite crystal structure.12-29-2011
20110017498Photosensitive dielectric film - A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.01-27-2011
20110088930PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.04-21-2011
20090056990ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS - An electro-optic device includes a pixel electrode, an insulating film, a first conductive film, and a second conductive film. The second conductive film that is formed between the pixel electrode and the insulating film and formed in an island shape so as to overlap with a contact hole formed in the insulating film.03-05-2009
20100051332CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.03-04-2010
20100051331CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.03-04-2010
20100032192INTERLAYER DIELECTRIC FILM WITH CARRIER MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD THEREWITH - An objective of this invention is to provide an interlayer dielectric film with a carrier material used in a multilayer printed circuit board, which exhibits sufficient rigidity for a thin multilayer printed circuit board.02-11-2010
20090020321METAL-CERAMIC SUBSTRATE - In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning, an intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.01-22-2009
20110120757METHOD FOR SELECTIVE DEPOSITION AND DEVICES - A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is has in its backbone, side chains, or both backbone and side chains, multiple secondary or tertiary amide groups that are represented by the following acetamide structure: >N—C(═O)—. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.05-26-2011
20110036620PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME - The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is disposed on the additional circuit structure. A conductive bump pattern is disposed in the solder mask insulating layer, wherein the conductive bump pattern extends into the opening horizontally, wherein a side, a portion of an upper surface and a portion of a lower surface of the conductive bump pattern are exposed from the opening from the opening. A solder ball is formed in the opening, wherein the solder ball is electrically connected to the additional circuit structure.02-17-2011
20100224394Module Substrate and Production Method - A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers all outer edges of the pads. A window is cut out of the covering layer. A metallic coating is applied to each pad exclusively within the window.09-09-2010
20100175914PASSIVE ELECTRICAL DEVICES AND METHODS OF FABRICATING PASSIVE ELECTRICAL DEVICES - A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.07-15-2010
20090025966Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board - The present invention provides: a copper-clad laminate, facilitating the formation of highly reliable fine wires, in which copper foil has been formed firmly on a flat and smooth surface; a laminate; an electroless plating material; a fiber-resin composite; and a printed wiring board obtained with use of them. Further, the present invention provides a method for manufacturing a multilayer printed wiring board on which fine wires can be formed with high accuracy and a multilayer printed wiring board that is obtained by the method. A copper-clad laminate of the present invention includes a plated copper layer (01-29-2009
20130126219MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES - Provided is a circuit board that includes a first layer on which circuit patterns are disposed, a second layer opposite to the first layer and on which external terminals are disposed, and a core portion disposed between the first and second layers and including a first ply and a second ply which are stacked. The first ply includes a first fiber bundle extending in a first direction, a second fiber bundle extending in a second direction, and a non-fiber area defined by the first and second fiber bundles. The second ply includes a first fiber bundle extending in a third direction and a second fiber bundle extending in a fourth direction. The first and second fiber bundles of the second ply overlap at least part of the non-fiber area of the first ply.05-23-2013
20130140064METHOD OF MAKING ELECTRONIC DEVICES USING SELECTIVE DEPOSITION - Electronic devices can be prepared by forming a patterned thin film on a suitable receiver substrate. A cyanoacrylate polymer is used as a deposition inhibitor material and applied first as a deposition inhibitor material. The deposition inhibitor material can be patterned to provide selected areas on the receiver substrate where the deposition inhibitor is absent. An inorganic thin film is then deposited on the receiver substrate using a chemical vapor deposition technique only in those areas where the deposition inhibitor material is absent. The cyanoacrylate polymer deposition inhibitor material can be applied by thermal transfer from a donor element to a receiver substrate before a patterned thin film is formed.06-06-2013
20130140065CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME - An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.06-06-2013
20120273262TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes two transparent conductive films stacked on top of each other and a plurality of embedded conductive circuits formed between the two transparent conductive films and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface on the top side thereof for an external object to touch.11-01-2012
20110308843TRANSPARENT THIN PLATE - Provided is a transparent thin plate including a transparent substrate in a sheet form, a mesh layer formed on a surface of the transparent substrate and made of an opaque material having a structure wherein an outline of meshes is made of bands that are very thin and have a substantially equal width, and having a light transmittance of 50% or more, and a colored layer that is arranged in a state that the layer is laminated in a partial area of the mesh layer and on the surface of the mesh layer, and has a color different from that of the opaque material constituting the mesh layer.12-22-2011
20120031655Multi-Layer Circuit Assembly And Process For Preparing The Same - A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.02-09-2012

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