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Convertible shape (e.g., flexible) or circuit (e.g., breadboard)

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174250000 - Preformed panel circuit arrangement (e.g., printed circuit)

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DocumentTitleDate
20130043065FLEXIBLE SUBSTRATES AND METHOD OF MANUFACTURING THE SAME - A flexible substrate includes a flexible mother substrate and a planarization layer on the flexible mother substrate. Here, the flexible mother substrate includes a transparent textile and a resin layer. The transparent textile includes a plurality of first transparent fibers and a plurality of second transparent fibers crossing the plurality of first transparent fibers, and the resin layer coats the transparent textile to fill a space between the first and second transparent fibers. The planarization layer includes an organic material having a curable contraction rate of no greater than about 20%.02-21-2013
20090266585Flame-Retardant Composition for Solder Resist and Cured Product Thereof - There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble resin comprising either or both (A1) a carboxyl group-containing epoxy (meth)acrylate or (A2) a carboxyl group-containing urethane (meth)acrylate obtained by reacting an epoxy resin with two or more epoxy groups in the molecule (a), an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c), (B) a compound having an ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, (D) a phosphorus-containing epoxy resin having a specific structure and (E) a hydrated metal compound. The composition of the invention can be suitably used as a solder resist or cover lay film for an FPC.10-29-2009
20100089622Barrier Film for Flexible Copper Substrate and Sputtering Target for Forming Barrier Film - A barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is provided. The barrier film has a thickness of 3 to 150 nm and a film thickness uniformity of 10% or less at 1σ. A sputtering target for forming a barrier film comprising a Co—Cr alloy containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is also provided. The relative magnetic permeability in the in-plane direction of the sputtered face of the target is 100 or less. The barrier film for a flexible copper substrate and the sputtering target for forming such barrier film have a film thickness that is thin enough to prevent film peeling and inhibiting the diffusion of copper to a resin film such as polyimide, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch and has barrier characteristics that will not change even when the temperature rises due to heat treatment or the like.04-15-2010
20130025915ARESISTIVE DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.01-31-2013
20100051326FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE - A flex-rigid wiring board including a rigid printed wiring board having a rectangular shape and having a rigid base material and a conductor, and a flexible printed wiring board having a flexible base material and a conductor formed over the flexible base material. The conductor of the flexible printed wiring board is electrically connected to the conductor of the rigid printed wiring board. The flexible printed wiring board is connected to the rigid printed wiring board and extends from one or more sides of the rectangular shape of the rigid printed wiring board such that the flexible printed wiring board extends in a direction which makes an acute angle with respect to one or more sides of the rectangular shape of the rigid printed wiring board.03-04-2010
20080257586FLEXIBLE CIRCUIT STRUCTURE WITH STRETCHABILITY AND METHOD OF MANUFACTURING THE SAME - A manufacturing method of a flexible circuit structure with stretchability includes the following steps. A plurality of compressible flexible bumps is formed on a flexible substrate; next, a metal circuit is formed on the flexible substrate and each of the compressible flexible bumps. When an external tensile force is applied on the flexible substrate, the capability of the metal circuit in withstanding the external tensile force is improved due to flexibility of the compressible flexible bumps, and thus, the stretchability of the flexible circuit is improved.10-23-2008
20100147564ASYMMETRIC LINEAR POLYIMIDES AND THEIR POLYIMIDE PRECURSORS, AND THEIR MANUFACTURING METHODS - Disclosed is a linear polyimide precursor having an intrinsic viscosity of not less than 0.5 dL/g and composed of a repeating unit represented by at least one formula selected from the group consisting of the general formula (1) below and the general formula (2) below. In the general formulae (1) and (2), X represents a divalent aromatic group other than a residue of 1,4-bis(4-aminophenoxy)benzene and a residue of bis(4-amino-3-methylphenyl)methane or an aliphatic group. Since this linear polyimide precursor has high glass transition temperature and high toughness, while exhibiting excellent solubility and thermoplasticity, it is suitably used as a raw material for an asymmetric polyimide which is useful as an adhesive resin for flexible printed circuits (FPC) or the like.06-17-2010
20100147563SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER - Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.06-17-2010
20100038115Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil - It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.02-18-2010
20120175154FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - [Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield.07-12-2012
20090120672METHOD FOR MANUFACTURING A LAMINATE COVER, LAMINATE PROTECTIVE LAYER, AND LAMINATE ELECTRONIC DEVICE HAVING A REDUCED COST, MANUFACTURING TIME, WEIGHT, AND THICKNESS - A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.05-14-2009
20130032381FLEXIBLE WIRING MODULE AND FLEXIBLE WIRING DEVICE - According to one embodiment, a flexible wiring module includes a flexible wiring board which comprises electric wiring lines and an insulating layer that covers the surfaces of the electric wiring lines and which has a pair of end areas separate from each other in a wiring length direction and a wiring area sandwiched between the end areas. At least one through slit is made in the wiring area so as to connect the end areas, thereby dividing the wiring area into wiring fins. A stacked part where at least a part of the wiring fins are stacked in a thickness direction of the wiring fins is bundled together with a conductive band to form a wire-bundle area. In the wire-bundle area, the electric wiring line of at least one of the wiring fins is exposed and direct contact with the band.02-07-2013
20100044082WIRING BOARD - A wiring board including two wiring layers and a flexible core layer is provided. The flexible core layer is disposed between the wiring layers, and the flexible core layer is an insulator. A flexure of the wiring board is between 0 degree and 170 degrees.02-25-2010
20100116526EXTREMELY STRETCHABLE ELECTRONICS - In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.05-13-2010
20100116525FLEXIBLE PRINTED WIRING BOARD - A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.05-13-2010
20100108363VIA STRUCTURE IN MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a via structure in a multi-layer substrate, comprising a first metal layer, a dielectric layer and a second metal layer. The first metal layer has an upper surface. The dielectric layer covers the first metal layer in which a via is opened to expose the upper surface. The second metal layer is formed in the via and contacts an upper surface and an inclined wall of the via. A contacting surface of the second metal layer has a top line lower than the upper edge of the inclined wall. Alternatively, the second metal layer can be formed on the dielectric layer as being a metal line simultaneously as formed in the via as being a pad. The metal line and the pad are connected electronically. The aforesaid metal second layer can be formed in the via and on the dielectric layer by a metal lift-off process.05-06-2010
20130098665FLEXIBLE PRINTED CIRCUIT BOARD AND PRODUCTION METHOD OF SAME - The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.04-25-2013
20130081860MITIGATION OF BLOCK BENDING IN A RING LASER GYROSCOPE CAUSED BY THERMAL EXPANSION OR COMPRESSION OF A CIRCUIT BOARD - An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.04-04-2013
20090050352SUBSTRATE STRUCTURES FOR FLEXIBLE ELECTRONIC DEVICES AND FABRICATION METHODS THEREOF - The invention provides flexible electronic substrate structures and fabrication methods thereof. The flexible electronic substrate structures include a large scale carrier and a plurality of flexible substrates disposed on the large scale carrier, wherein the flexible substrate includes polymeric material formed by coating. The flexible substrates are patterned polymer materials formed by a coating process, wherein the coating process comprises doctor knife coating, spin coating, or table coating.02-26-2009
20120181068CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME - A circuit substrate capable of reducing and preventing deviations of circuit characteristics includes a relatively hard region and a relatively soft region. A main body of the circuit substrate includes a stack of a plurality of flexible sheets made of a flexible material and includes rigid regions and a flexible region, the flexible region being more easily deformable than the rigid regions. Wiring conductors are disposed in the main body and define circuitry. Reinforcing insulative films are disposed so as to cover the portions where the wiring conductors are not disposed in the rigid regions on the flexible sheets when seen in plan view from the z-axis direction.07-19-2012
20090044968FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.02-19-2009
20100006323Rigid-flex printed circuit board with weakening structure - A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.01-14-2010
20130087370METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α04-11-2013
20130087369FABRIC TYPE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed are a fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board according to the present invention includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to an other side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board according to the present invention includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to an other side of the fabrics.04-11-2013
20090321110MICRO ELECTRO-MECHANICAL SYSTEM - In one embodiment, a MEMS includes a MEMS chip package, a first printed circuit board (PCB), an anisotropic conductive layer, a second PCB and at least one electrical wire. The MEMS chip package includes an exposed connecting portion, and at least one metallic pad formed on the exposed connecting portion. The first PCB is laminated on the connecting portion. The first PCB includes at least one first connecting metallic pad and at least one second connecting metallic pad. The first connecting metallic pad is electrically connected to a corresponding second connecting metallic pad. The anisotropic conductive layer is sandwiched between the metallic pads of the MEMS chip package and the first connecting metallic pads of the first PCB. The metallic pad of the MEMS chip package is electrically connected to the respective first connecting metallic pad of the PCB via the anisotropic conductive layer. One end of each electrical wire being bonded to a respective second connecting metallic pad and the other end being bonded to the second PCB. The MEMS actuator can be easily connected to driver circuit via tiny copper wires.12-31-2009
20090114427CIRCUIT JOINING ASSEMBLY MATERIALS FOR MULTI-LAYER LIGHTNING PROTECTION SYSTEMS ON COMPOSITE AIRCRAFT - An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a second end portion, and a dielectric material between the first conductive layer and the second conductive layer.05-07-2009
20130056249FLEXIBLE CONDUCTIVE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND ELECTRODE, WIRING, ELECTROMAGNETIC WAVE SHIELD AND TRANSDUCER USING THE FLEXIBLE CONDUCTIVE MATERIAL - A flexible conductive material of the present invention includes an elastomer and a conductive material including silver at least in a surface. The conductive material is chemically bonded to the elastomer directly or indirectly and is thus incorporated into a mesh structure of the elastomer. Volume resistivity is 1×1003-07-2013
20130056248FLEXIBLE CIRCUIT BOARD AND ITS METHOD FOR PRODUCTION - A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.03-07-2013
20120217045THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM FOR FLEXIBLE WIRING BOARD, AND FLEXIBLE WIRING BOARD - A thermosetting resin composition which contains a polyurethane resin and a curing agent, the polyurethane resin including a constitutional unit derived from an alicyclic diol and having an acid value of 10 to 35 mgKOH/g.08-30-2012
20090294155FLEXIBLE PRINTED CIRCUIT BOARD, SHIELD PROCESSING METHOD FOR THE CIRCUIT BOARD AND ELECTRONIC APPARATUS - According to one embodiment, there is provided a flexible printed circuit board including a base layer, a signal layer formed on a surface of the base layer, a cover layer covering the signal layer, a connecting pattern portion formed in the signal layer, an opening formed in the cover layer and surrounds periphery of the connecting pattern portion, a conductive shield material covering the cover layer in which part of the conductive shield material fills the opening, thereby adhering to an upper face and sides of the connecting pattern portion, and a protective layer covering the conductive shield material.12-03-2009
20090056982Process for producing a double-sided flexible printed board and double-sided flexible printed board - [Problems] To provide a process for producing a printed board having sufficient heat resistance. 03-05-2009
20090056981THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD - The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.03-05-2009
20090266587FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING FINE PITCH THEREIN - Provided is a method of forming a fine pitch in a flexible printed circuit board (FPCB) having an increased adhesive property of wirings and an improved insulating property between the wirings. The method includes etching regions where wirings are to be formed on a base substrate; forming conductive layers on the etched regions; forming a photoresist film on a substrate between the etched regions; forming the wirings by forming the conductive layers on the etched regions to be higher than the substrate; and removing the photoresist film.10-29-2009
20090266586PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 10-29-2009
20130062102DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a double-sided flexible printed circuit board in which circuit patterns are formed, including an insulating substrate, conduction layers sputtered on both sides of the insulating substrate, a through hole formed to connect circuits formed in the both sides, seed layers formed on the conduction layers of the both sides, and pattern plating layers formed on an inner wall of the through hole and on the respective seed layers, and a method of manufacturing the same. Accordingly, the loss of a circuit width can be minimized because a sputtering-type material not an adhesive is used between the insulating substrate and the thin copper (Cu) layer. Further, productivity can be improved because a roll-to-roll process can be used. In addition, the thickness of a circuit can be controlled and micro circuit patterns can be formed because a semi-additive method is used.03-14-2013
20120222889POLYAMIDEIMIDE ADHESIVES FOR PRINTED CIRCUIT BOARDS - The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.09-06-2012
20110011630SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion.01-20-2011
20110011629Electrodynamic arrays having nanomaterial electrodes - An electrodynamic array of conductive nanomaterial electrodes and a method of making such an electrodynamic array. In one embodiment, a liquid solution containing nanomaterials is deposited as an array of conductive electrodes on a substrate, including rigid or flexible substrates such as fabrics, and opaque or transparent substrates. The nanomaterial electrodes may also be grown in situ. The nanomaterials may include carbon nanomaterials, other organic or inorganic nanomaterials or mixtures.01-20-2011
20090236126Flexible Wiring Board - A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 09-24-2009
20090014204FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.01-15-2009
20090008132FLEXIBLE WIRING BOARD FOR TAPE CARRIER PACKAGE - A flexible wiring board for a tape carrier package with reduced tackiness and a tape carrier package formed by using the flexible wiring board is disclosed. The flexible wiring board for a tape carrier package has an insulating film 01-08-2009
20090008131Flexible printed-circuit board - A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 01-08-2009
20130133931PRINTED WIRING BOARD - Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small. The printed wiring board includes a wiring board main body, and a reinforcing plate attached to the wiring board main body, the reinforcing plate includes first and second reinforcing portions which are arranged to be mutually spaced apart, and a connecting portion which integrally connects the first reinforcing portion with the second reinforcing portion, and the connecting portion includes a first portion which has a cross-sectional area smaller than a cross-sectional area of the first reinforcing portion and smaller than a cross-sectional area of the second reinforcing portion, and a second portion of which a cross-sectional area increases along a direction from the first portion to at least one of the first reinforcing portion and the second reinforcing portion.05-30-2013
20080296048FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS - A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.12-04-2008
20130161077DIFFERENTIAL SIGNAL TRANSMISSION CIRCUIT AND METHOD FOR MANUFACTURING SAME - A differential signal transmission circuit comprises: an insulating layer; two signal lines provided in parallel on one surface of the insulating layer; a GND line formed on each of outer sides of the two signal lines on the one surface of the insulating layer; and a wiring line layer formed on the other surface of the insulating layer, the differential signal transmission circuit being configured by a double-sided flexible printed circuit board, the signal lines, the GND line and the wiring line layer being formed by a semi-additive method on the insulating layer, and the signal line and the GND line being formed such that a distance S between the two signal lines is greater than a distance D between the signal line and the GND line.06-27-2013
20130161078RIGID-FLEX CIRCUIT BOARD AND MANUFACTURING METHOD - Disclosed herein is a cost effective rigid- flex circuit board comprising a flexible section which contents at least one flexible flat cable for interconnect, and a plurality of rigid sections which consists of at least one rigid printed circuit board (06-27-2013
20100089621NUCLEATION LAYER FOR THIN FILM METAL LAYER FORMATION - A conductive film is formed on a flexible polymer support by applying a seed layer comprising gallium oxide, indium oxide, magnesium oxide, zinc oxide or mixture (including mixed oxides) thereof to the flexible polymer support, and applying an extensible, visible light-transmissive metal layer over the seed layer. The seed layer oxide desirably promotes deposition of the subsequently-applied metal layer in a more uniform or more dense fashion, or promotes earlier formation (viz., at a thinner applied thickness) of a continuous metal layer. The resulting films have high visible light transmittance and low electrical resistance.04-15-2010
20130161076CONNECTION UNIT - A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.06-27-2013
20130161075CONNERTING STRUCTURE OF TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a connecting structure of a touch panel and a method for manufacturing the same. The connecting structure of the present invention includes a flexible film; a first electrode formed on one surface of the flexible film; a second electrode formed on the other surface of the flexible film; and a folding part extendedly formed from a side end of the flexible film to be foldably bonded to one surface of the flexible film, wherein the second electrode extends along an outer surface of the folding part so that the first electrode and the second electrode formed at the folding part are disposed on a co-plane.06-27-2013
20090107704COMPOSITE SUBSTRATE - A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.04-30-2009
20090084584Printed circuit board - A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.04-02-2009
20110048771ELECTRONIC APPARATUS AND FLEXIBLE SUBSTRATE WIRING METHOD - An electronic apparatus includes: a flexible substrate including, a first portion having a first wiring pattern, and a second portion connected to the first portion and having a second wiring pattern whose pattern width is wider than a pattern width of the first wiring pattern, wherein the second portion is supported by the first portion; a support unit configured to support the first portion of the flexible substrate; a first circuit unit connected to one of the first and second portions; and a second circuit unit connected to the first circuit unit via the first portion and second wiring patterns.03-03-2011
20100186998POLYAMIDEIMIDE RESIN FOR FLEXIBLE PRINTED CIRCUIT BOARDS; METAL-CLAD LAMINATE, COVERLAY, AND FLEXIBLE PRINTED CIRCUIT BOARD THAT USE THIS RESIN; AND RESIN COMPOSITION - The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.07-29-2010
20120097433SIGNAL LINE AND CIRCUIT SUBSTRATE - A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.04-26-2012
20110132643FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD - Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes <100> in a surface of the metal foil.06-09-2011
20110278047FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board includes: a substrate having a first edge and a second edge; a first wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a second wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a first solder pattern disposed on the lead connection portion of the first wiring pattern; and a second solder pattern disposed on the lead connection portion of the second wiring pattern and having a length longer than the first solder pattern.11-17-2011
20110278049PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM COMPRISING THE SAME - The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.11-17-2011
20110278048STRUCTURE FOR CONNECTING FLEXIBLE CIRCUIT TO TARGET MEMBER - A high-density, narrow-pitch, and high-pin-count connecting structure with a very low mounting height is realized at low cost.11-17-2011
20110278046TEMPERATURE TOLERANT COVER LAYER CONSTRUCTION - The present invention relates to flex cables, and more particularly to a temperature tolerant cover layer construction for a flex cable. In one embodiment, a flex cable designed to be bent to a particular curved shape includes one or more slits formed in the inner cover layer, to reduce the amount of material in the cover layer on the inside radius of the curve. By reducing the amount of cover layer material on the inside of the curve, the slits reduce the compressive stress in the cover layer. The slits are formed prior to laminating the flex cable so that upon lamination the flexible filler material below the cover layer fills the slits, providing a compliant, protective layer that bends into the desired curve and protects the active components inside the cable. The slits reduce the compressive stress along the inside cover layer and thereby prevent the cover layer from separating from the rest of the cable when the flex cable is subjected to high temperature conditions.11-17-2011
20100155108Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof - The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.06-24-2010
20110120754MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.05-26-2011
20110272182CARBOXYL GROUP-CONTAINING POLYURETHANE - An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a) that includes an organic residue derived from a dimer diol, a polyisocyanate (b) and a carboxyl group-containing polyol (c).11-10-2011
20110272180METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION, FLEXIBLE CIRCUIT CONFIGURATION, AND ELECTRICAL CIRCUIT CONFIGURATION HAVING SUCH A FLEXIBLE CIRCUIT CONFIGURATION - For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.11-10-2011
20110272183(POLY)CARBONATE POLYOL AND CARBOXYL GROUP-CONTAINING POLYURETHANE OBTAINED FROM THE (POLY)CARBONATE POLYOL - An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C11-10-2011
20110272181Multilayer Stretchable Cable - According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.11-10-2011
20100170704FABRIC ABLE TO FORM ELECTRONIC ELEMENT - A cloth material that can form an electronic component includes a cloth material layer, which includes at least one crevice; and a conductive area included in the cloth material layer, wherein a shape of the crevice and a shape of the conductive area change with an outside force. A cloth material that can form an electronic component includes two cloth material layers stacked to form a crevice therebetween; and a conductive area located on the two cloth material layers spanning from one side of the crevice to the other side of the crevice, wherein a shape of the crevice and the conductive area changes with an outside force.07-08-2010
20100170702ELECTRICALLY CONDUCTIVE MODULE - An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.07-08-2010
20100170700SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.07-08-2010
20110139491ELECTRODE OF BIOSENSOR, MANUFACTURING METHOD THEREOF, AND BIOSENSOR THEREOF - The present invention discloses an electrode of a biosensor, a manufacturing method thereof, and a biosensor thereof. The electrode of the biosensor comprises a flexible insulation layer, a resin layer, a first metal layer, a second metal layer, a third metal layer and a fourth metal layer. The resin layer is disposed between the flexible insulating layer and the first metal layer. The second metal layer is disposed between the first metal layer and the third metal layer, and the fourth metal layer is disposed on the third metal layer. The material of the first metal layer comprises copper foil. The material of the second metal layer comprises palladium. The material of the third metal layer comprises nickel, and the material of the fourth metal layer comprises gold or palladium. The electrode further comprises a biological active substance immobilized on the surface of the plurality of metal layers.06-16-2011
20110290538CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME - A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.12-01-2011
20100078200FLEX CIRCUIT ASSEMBLY WITH A DUMMY TRACE BETWEEN TWO SIGNAL TRACES - A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned between the two signal traces and coupled with the first adhesive layer. The flex circuit comprises a second adhesive layer coupled with the signal traces, the dummy trace, and the first adhesive layer, and a cover film coupled with the second adhesive layer.04-01-2010
20090145633DIRECT ATTACH INTERCONNECT FOR CONNECTING PACKAGE AND PRINTED CIRCUIT BOARD - A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. The spring contacts are individually disposed within a passage in the housing such that a top end of the spring contacts extends out through the top housing side and a bottom end of the spring contacts extend out through the bottom housing side. The middle portion of each spring contact includes a connector which movably connects the middle portion of the spring contact to the passage for the spring contact such that the spring contact is movable along the x, y, and z axes. The bottom end of each spring contact includes a solder sphere and a solder pad. The top end of each spring contact is a land grid array or a pin rid array socket connector.06-11-2009
20090145631RECONFIGURABLE SYSTEM THAT EXCHANGES SUBSTRATES USING COULOMB FORCES TO OPTIMIZE A PARAMETER - A reconfigurable system is described that can optimize the performance of the system. Substrates can be detached, levitated, moved, dropped and reattached as desired by the use of Coulomb forces generate between Coulomb islands. Thus, a system using a first set of substrates for a given frequency range can be exchanged with a second set of substrates operable at a different frequency range by the use of Coulomb forces. Making this exchange in an RF system can improve the selectivity and decrease the power dissipation of the system. One of the exchanges can involve inductor to shift the frequency of oscillation, for example. A control unit can be used to control the movement and replacement of all substrates. The formation of minimal energy potentials of Coulomb forces are determined to move a substrate over an underlying substrate.06-11-2009
20100263918LAYOUT METHOD AND CIRCUIT BOARD - A circuit board and a layout method therefor are provided. The circuit board is adapted for coupling between two circuits and includes multiple first pins, multiple second pins, a chip-disposing area for disposing a circuit chip, and a routing area including electrical routes. The first pins are coupled to one the circuit, and the second pins are coupled to the other one circuit. Two terminals of each of a first group of electrical routes of the electrical routes respectively are coupled to one of the first pins and the chip-disposing area, and two terminals of each of a second group of electrical routes of the electrical routes respectively are coupled to the chip-disposing area and one of the second pins. The second group of electrical routes and at least one of the first pins therebetween do not have any one of the first group of electrical routes.10-21-2010
20100263916Circuit board assembly - A circuit board assembly includes a printed circuit board having a board substrate, a transmission member having a flexible substrate, and an elastic clamping frame. The elastic clamping frame is in the form of a single piece and includes upper and lower walls and press protrusions protruding from one of the upper and lower walls. A stack of a connecting portion of the flexible substrate and a connecting portion of the board substrate is tightly disposed between the upper and lower walls such that each of the conductive fingers of the transmission member and a corresponding one of the conductive fingers of the printed circuit board are pressed against each other by the pressing action of the press protrusions.10-21-2010
20100032191FLEXIBLE PRINTED CIRCUITBOARD STRUCTURE - A flexible printed circuitboard structure is disclosed, which comprises: a flexible printed circuitboard (FPC), having at least a soldering pad and at least a solder pasted pad area formed thereon; wherein, by using the extending of a side of the at least one solder pasted pad area as the base line, a bending line is formed on the FPC in a manner that it is prevented from passing through the at least one soldering pad and is disposed at a specific distance away from the periphery of the same. By the configuration of the solder pasted pad area to defined the bending line on the FPC, the bending stress problems caused when the FPC is being bended, such as solder crack and broken circuit, etc., can be prevented.02-11-2010
20090242242ELECTRONIC COMPONENT MOUNTING BOARD, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC CIRCUIT UNIT - An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.10-01-2009
20110168432METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN, AND AN ELECTRICALLY CONDUCTIVE PATTERN PRODUCED THEREBY - Provided are a method for producing an electrically conductive pattern, and an electrically conductive pattern produced by the method, the method including the steps of: a) forming an electrically conductive pattern on a substrate, and b) blackening the surface of the electrically conductive pattern by immersing the electrically conductive pattern in a halogen solution which oxidizes the surface of the electrically conductive pattern.07-14-2011
20120024576BUNDLED FLEXIBLE CIRCUIT BOARD BASED FLAT CABLE WITH WATER RESISTANT SECTION - A flat cable includes an enclosure sleeve that encloses a selected section of a cluster section of a flexible substrate. The enclosure sleeve has opposite ends respectively coupled to a first water resistant member and a second water resistant member. Each of the water resistant members includes a base forming a hollow channel and an insertion end extending from the base. The insertion end is fit to an inside wall or an outside wall of an end of the enclosure sleeve. The first water resistant member, the second water resistant member, and the enclosure sleeve are combined together to form a water resistant section arranged at a selected section of the flexible substrate. When the flexible substrate is subjected to a stretching force in an extension direction of the flexible substrate or a torque applied in a rotation direction thereof, the flexible substrate is allowed to undergo relative displacement with respect to the first water resistant member, the second water resistant member, and the enclosure sleeve.02-02-2012
20100018756POLYAMIDEIMIDE RESIN, AS WELL AS A COLORLESS AND TRANSPARENT FLEXIBLE METAL-CLAD LAMINATE AND CIRCUIT BOARD OBTAINED THEREFROM - [Object] To provide a flexible metal-clad laminate having excellent heat resistance, flexibility and low thermal expansion together with sufficient colorless transparency and a flexible printed circuit board using the same.01-28-2010
20110198111FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.08-18-2011
20090145634FLEXIBLE PRINTED CIRCUITBOARD WITH REINFORCEMENT STRUCTURE - A flexible printed circuitboard (FPC) with reinforcement structure is disclosed, which comprises: a flexible printed circuitboard (FPC), configured with an extended part at a side thereof; and an a stiffener, stacking on a surface of the FPC on the area excepting the extended part while configuring a recess on the stiffener at the position thereof corresponding to the extending direction of the extended part. With the aforesaid structure, it can reduce the shear stress from concentrating at the joint between the extended part and the FPC and thus prevent the FPC from breaking so that the strength of the FPC can be enhanced.06-11-2009
20090145632FLEXIBLE PRINTED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by printing the ink onto the silver foil and then attaching the reinforcement plate, especially printing the ink in the form of a dot, strip or mesh, the total thickness of the flexible printed circuit will not increase while the surface roughness of the silver foil increases, resulting in increase of adhesion of the reinforcement plate. This strengthens the attachment between the reinforcement plate and the silver foil, meeting the requirement of peeling-resistant strength between the reinforcement plate and the silver foil.06-11-2009
20090095510ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING THE SAME - An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.04-16-2009
20110192636TOUCH PANEL ROLL AND MANUFACTURING METHOD THEREOF - A touch panel roll and a manufacturing method thereof are provided. The method includes providing a first structure roll and a second structure roll. A manufacturing method of the first structure roll includes forming an opening in a first flexible substrate, wherein conductive lines respectively connected with electrodes extend to the opening. A manufacturing method of the second structure roll includes forming conductive lines respectively connected with electrodes and independent conductive lines corresponding to the conductive lines in the first structure roll on a second flexible substrate, wherein one end of each conductive line in the second structure roll is located at a position corresponding to the opening. The method further includes laminating the first structure roll and the second structure roll by a roll-to-roll process.08-11-2011
20090218117Flexible printed circuit board and manufacturing method for the same - The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 09-03-2009
20100116527ELECTRICALLY CONDUCTIVE, THERMOSETTING ELASTOMERIC MATERIAL AND USES THEREFOR - An electrically conductive, thermosetting elastomeric composition is provided. The composition may comprise: an initially substantially non-electrically conductive, thermosetting base polymer; a particulate filler comprising electrically conductive particles; and an electrically conductive polymer additive. The non-electrically conductive, thermosetting base polymer, the particulate filler and the electrically conductive polymer additive are mixed substantially macroscopically homogeneously.05-13-2010
20090211790Connecting structure and connecting method, liquid ejection head and method of manufacturing same - The connecting structure of a flexible circuit board and electronic components, includes: the flexible circuit board having: a pattern of wires, holes passing through the flexible circuit board in a thickness direction of the wires at parts of the wires to which the electronic components are connected, and a weakened part arranged on a bending line in a bending part of the flexible circuit board on which the flexible circuit board bends when the wires are connected with the electronic components; and the electronic components respectively having projections on parts to which the wires are connected, wherein the wires are electrically connected with the electronic components in a state where the projections are inserted in the holes and the flexible circuit board bends on the weakened part.08-27-2009
20100084169FLEXIBLE MULTILAYER WIRING BOARD - It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained by forming an inner layer wiring on both sides of an insulating layer, an outer layer wiring situated on at least one side of the inner layer board, and insulating adhesive sheets lying between the inner layer board and outer layer wiring. One of the insulating adhesive sheets are composed of an imide group-containing polymer.04-08-2010
20090120671FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.05-14-2009
20090120670BENDABLE AREA DESIGN FOR FLEXIBLE PRINTED CIRCUITBOARD - A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized.05-14-2009
20090205852CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.08-20-2009
20090188702FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.07-30-2009
20090166065Thin multi-chip flex module - A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.07-02-2009
20090090541STACKED SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - Provided is a stacked semiconductor device including a first flexible layer and a second flexible layer combined together, serving as a flexible substrate body being bent somewhere such that a surface of the first flexible layer itself is face-to-face clipped, two semiconductor chips each embedded in the flexible substrate body, and an adhesive layer sandwiched in a gap between the face-to-face surface of the first flexible layer. The active surface of each of the semiconductor chips has plurality of electrode pads thereon electrically connected to a first circuit layer on the second flexible layer. The semiconductor chips are stacked up and embedded in the flexible substrate body, thereby reducing package height to achieve miniaturization of electronic products. A method for fabricating the stacked semiconductor device is also provided.04-09-2009
20130098664Resolution-Adjustable Touch Panel and Manufacturing Method Thereof - A resolution-adjustable touch panel and a manufacturing method thereof. The resolution-adjustable touch panel includes a substrate, a plurality of first, second, third and fourth sensor strings, and a flexible printed circuit. The flexible printed circuit board includes a plurality of first, second, third and fourth pins. The first and third pins are respectively and electrically connected to the first and third sensor strings, and the second and fourth pins are respectively and electrically connected to the second and fourth sensor strings by dummy pins. From this, a different-resolution touch panel can be made from the substrate with the same sensor string. Thus, the cost for masks can be reduced.04-25-2013
20090277668Infrared emitter with flexible Circuit board - An apparatus for coupling to an appliance includes an infrared emitter, and a flexible printed circuit board coupled to the emitter. The circuit board includes a first surface and a generally opposing second surface. At least a portion of the circuit board is flexible. The apparatus also includes a pair of circuit traces disposed on the circuit board, and an adhesive portion coupled to the first surface of the circuit board for coupling the circuit board to the appliance.11-12-2009
20090277669FLEXIBLE PRINTED CIRCUITBOARD WITH ANTI-SOLDER CRACK STRUCTURE - A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved.11-12-2009
20090283301Multilayer wiring board and method for manufacturing the same - A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.11-19-2009
20090038828FLEXIBLE PRINTED CIRCUIT BOARD SUBSTRATE AND FLEXIBLE PRINTED CIRCUIT BOARD FABRICATED USING THE SAME - The present invention relates to a flexible printed circuit board substrate and FPCB made from the flexible printed circuit board substrate. In one embodiment, a flexible printed circuit board substrate includes a dielectric layer, a rolled copper foil and an electroplated copper foil disposed on two opposite surfaces of the dielectric layer respectively. The contact fingers are made from electroplated copper foil, as a result, the contact fingers are stronger than that made from rolled copper foil. Furthermore, electroplated copper foils are cheaper than rolled copper foils.02-12-2009
20080314621Parallel chip embedded printed circuit board and manufacturing method thereof - A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.12-25-2008
20080251280SOLDERING STRUCTURE BETWEEN CIRCUIT BOARDS - A substrate coupling structure including a flexible circuit board having first conductors provided thereon, a rigid circuit board having second conductors provided thereon so as to face the first conductors, solder plating disposed on at least one of the first conductors and the second conductors, and an insulating layer which has a thickness larger than the sum of thicknesses of the first and second conductors while having a thickness smaller than the sum of the thicknesses of the first and second conductors plus a thickness of the solder plating.10-16-2008
20110180307FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.07-28-2011
20110180306FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.07-28-2011
20090166063STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME - An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula:07-02-2009
20090166066COPPER FOIL - A copper foil according to the present invention has a B/A ratio within a range of 1.2 to 3.0, where B is an inclination value of a straight line in a straight portion of a rising area near the origin of a stress-strain curve of the copper foil which is measured before the copper foil is heated to 300° C.; and A is an inclination value of a straight line in a straight portion of a rising area near the origin of a stress-strain curve of the copper foil that is measured after the copper foil is heated to 300° C.07-02-2009
20090166064CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.07-02-2009
20120292084FLEXIBLE BASE MATERIAL AND FLEXIBLE ELECTRONIC DEVICE - The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress, which is cancelled off more than 90% of the first stress, to the flexible substrate.11-22-2012
20080289861Multi-Layer Flexible Printed Circuit Board and Method For Manufacturing the Same - Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion sheet, and a lower base layer under to the adhesion sheet.11-27-2008
20080289859Flex-Rigid Wiring Board and Manufacturing Method Thereof - A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent. Thus, the proposed flex-rigid printed wiring board is excellent in connection reliability, permitting to prevent the base material from being easily deformed near the bending portion, conductor circuit from being broken and the flexible substrate from being waved. The similar effect can also be attained with the wiring patterns of the conductor circuit on the flexible substrate being formed wide or curved in the width direction at the bending portion.11-27-2008
20100018755ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECTED STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER BY USE OF THE TAPE - The anisotropic conductive tape (01-28-2010
20110203837FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.08-25-2011
20080302559Flexible and elastic dielectric integrated circuit - General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.12-11-2008
20090321111FLEXIBLE PRINTED CIRCUIT MODULE - A flexible printed circuit module includes a main body and at least one connecting socket. The main body includes a first connecting end, a strip body and a second connecting end. The first connecting end and the second connecting end each includes a connector, disposed thereon respectively. The strip body includes a plurality of internal circuits including a grounding circuit assembled therein, the internal circuits electronically connect with the two connectors. The connecting socket is mounted on the main body and electronically connects with one of the two connectors and has a conductive coating covered on an area of the main body surrounding the connecting socket electronically connecting with the grounding circuit.12-31-2009
20080277145Flexible printed circuit - A flexible printed circuit includes a flexible substrate, a plurality of first conductive wires, and a plurality of second conductive wires. The flexible substrate includes a first surface and a second surface facing the first surface. The first conductive wires are provided on the first surface. The first conductive wires extend from an edge of the flexible substrate to another edge of the flexible substrate. The second conductive wires are provided on the second surface. The second conductive wires extend from an end of the flexible substrate to a predetermined portion of the flexible substrate. A part of each second conductive wire at the predetermined portion of the flexible substrate is electrically connected with the first conductive wire via a conductive structure.11-13-2008
20080210457Tape carrier for semiconductor device and method for making same - A tape carrier for semiconductor device has a resin tape provided with an opening section for bonding, and a wiring lead formed on the resin tape. The wiring lead has a notched section disposed in the opening section and including a notch width W09-04-2008
20100126757DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes: a substrate; a plurality of pixels which are mounted on the substrate, each pixel including a pixel electrode; and switching elements which are mounted on the substrate, each switching element being connected to the pixel electrode. The substrate includes: a flexible insulation substrate; a first insulation layer which is formed over the insulation substrate and includes a plurality of insulation films which are spaced apart from each other, and the switching element is formed on any one of the respective insulation films. The display device can enhance flexibility thereof while forming relatively hard background films thereon.05-27-2010
20130118783CIRCUIT BOARD AND STORAGE DEVICE HAVING THE SAME - A circuit board includes a first pinout set of USB 2.0 standard provided on the circuit board; a second pinout set provided on the circuit board; and a flexible metal strip having a jut and four pinouts corresponding to StdA_SSRX−, StdA_SSRX+, StdA_SSTX−, and StdA_SSTX+ of USB 3.0 standard.05-16-2013
20120292085FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Provided is a flexible printed circuit having a multilayered structure including three conductive layers. The flexible printed circuit includes: a first unit substrate formed of a first insulating layer made of liquid crystal polymer or fluorine resin and having a signal transmission circuit formed on one surface of the first insulating layer and a first conductive layer formed on the other surface thereof; a second unit substrate formed of a second insulating layer made of liquid crystal polymer or fluorine resin and having a second conductive layer formed on one surface of the second insulating layer; and an adhesive layer made of an epoxy thermal curing adhesive for bonding the first unit substrate and the second unit substrate in a state that the one surface of the first insulating layer is faced with the other surface of the second insulating layer.11-22-2012
20080289862Electronic component package - An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.11-27-2008
20080271913Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure - An electronic components mounted wiring body (11-06-2008
20100270060PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured.10-28-2010
20110005811METHOD OF MANUFACTURING RIGID-FLEX CIRCUIT BOARD, AND THE RIGID-FLEX CIRCUIT BOARD - A method of manufacturing a rigid-flex circuit board includes preparing a first and a second coverlay film (01-13-2011
20080257589Method for the production of expandable circuit carrier and expandable circuit carrier - The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.10-23-2008
20080257587Rigid-flex printed circuit board with weakening structure - A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.10-23-2008
20090078453Polyimide Film - The present invention relates to polyimide film for insulating material etc. prepared by reacting a mixture of 4,4-oxydiphthalic anhydride and at least one monomer of aromatic or aliphatic tetracarboxylic dianhydride with a mixture of p-phenylenediamine and at least one monomer of flexible diamines, and having excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance etc, a TAB tape applying the polyimide film, and flexible printed wiring board.03-26-2009
20090183900Anti-static Spacer for High Temperature Curing Process of Flexible Printed Circuit Board - The present invention relates to a spacer for a flexible printed circuit board used in a high temperature process. In particular, in the spacer formed with a permanent anti-static layer for the flexible printed circuit board used in the high temperature process of the present invention, the anti-static layer is formed by coating an anti-static solution comprising a metal oxide, an organic or inorganic binder, and additives for supplying a releasing property, as effective ingredients, and drying it to thereby provide the permanent anti-static property and the releasing property on the surface of the spacer, and the spacer can be used at a high temperature process. The spacer of the present invention is not a spacer for use in general delivery, which can be used in room temperature, and the spacer of the present invention can be used at a high temperature of above 150° C., and does not produce black impurities, and further has the releasing property for preventing the separation of the solder resist of the flexible printed circuit board during the high temperature process.07-23-2009
20090139750Printed wiring board and printed circuit board unit and electronic apparatus - A printed wiring board has a rigid insulating layer. A first substrate is partly overlaid on the front surface of the rigid insulating layer. The first substrate has a free end located outside the contour of the rigid insulating layer. A second substrate is partly overlaid on the back surface of the rigid insulating layer. The second substrate has a free end located outside the contour of the rigid insulating layer. The second substrate has the front surface opposed to the back surface of the first substrate. A component or components can thus be disposed on the back surface of the first substrate and the front surface of the second substrate outside the contour of the rigid insulating layer. The mounting area for components can be increased.06-04-2009
20090025962Electronic Module Expansion Bridge - Taught herein is an electronic module expansion bridge (01-29-2009
20090000809Flexible substrate - According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with the second apparatus and a hollow arranged between the first end and the second end; a signal line arranged on a surface of the base material, the signal line capable of electrically connecting the first apparatus and the second apparatus, the signal line having a constant characteristic impedance along the signal line in association with the base material; and a line arranged on the base material and over the hollow, the line capable of electrically connecting the first apparatus and the second apparatus.01-01-2009
20090250250ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device includes an electro-optical panel, a first wiring board and a second wiring board. The first wiring board having a one-side first connection terminal electrically connected to the panel-side connection terminal at one end of a first wiring forming surface and having an other-side first connection terminal at the other end of the first wiring forming surface. The second wiring board having one-side second connection terminal electrically connected to the other-side first connection terminal at one end of a second wiring forming surface and having the other-side second connection terminal at the other end of the second wiring forming surface.10-08-2009
20120067624CONNECTION STRUCTURE AND CONNECTION METHOD OF WIRING BOARD - A connection structure for connecting a wiring board to a to-be-connected body having electric contacts, the wiring board including: a base having board-side contacts provided on its facing surface that is to face the to-be-connected body; and a cover film which covers the facing surface except the board-side contacts and a non-covered partial region of the facing surface, the connection structure including: conduction portions formed of electrically conductive resin, for bonding the electric contacts and the board-side contacts to permit electrical conduction therebetween; and a reinforcement portion formed of the same resin as the conduction portions and disposed at a position which is different from positions of the conductive portions and at which the reinforcement portion extends across both of a surface of the cover film and a surface of the non-covered partial region of the base, the reinforcement portion bonding the to-be-connected body and the wiring board for reinforcing connection therebetween.03-22-2012
20110030998PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):02-10-2011
20090050353MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.02-26-2009
20090084583MULTILAYER PRINTED WIRING BOARD AND METHOD FOR FABRICATION THEREOF - Provided is a multilayer printed wiring board having a terminal portion of high quality. This multilayer printed wiring board has a flexible portion having flexibility, the flexible portion that can be bent when used, a rigid portion formed continuously with the flexible portion, the rigid portion having greater rigidity than the flexible portion, and a terminal portion formed continuously with the flexible portion at an end portion of the flexible portion. The rigid portion includes a rigid layer having insulation properties. The terminal portion includes an insulating layer formed of the same material as that for the rigid layer, the insulating layer having a conductive layer formed on the surface thereof, the conductive layer having a predetermined terminal pattern and serving as a connecting terminal.04-02-2009
20110139493FLEXIBLE SUBSTRATE AND ELECTRIC CIRCUIT STRUCTURE - Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate is connected, is also provided. A wiring pattern (06-16-2011
20110139492MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - A multilayer flexible printed circuit board includes a core material made of an insulating material having bendability. A solid layer is provided on one surface of the core material. The solid layer is made of an electrically conductive material to form a ground plane. A wiring layer is provided on the other surface of the core material. The wiring layer is made of an electrically conductive material having a controlled impedance. The core material, the solid layer and the wiring layer together form one set of lamination. A plurality of sets of the lamination are laminated via an insulation layer.06-16-2011
20090101393Metallic Laminate and Method for Preparing the Same - The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.04-23-2009
20100155107INTER-LAYER CONNECTION FOR FOIL MEMS TECHNOLOGY - The invention relates to a method of manufacturing conductive inter-layer connections in a microsystem built by a patterned stack of flexible foils (06-24-2010
20090211791SUBSTRATE FORMED ON CARRIER HAVING RETAINING FEATURES AND RESULTANT ELECTRONIC DEVICE - A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method.08-27-2009
20130213696METAL-CLAD LAMINATE, METHOD FOR PRODUCING SAME, AND FLEXIBLE PRINTED BOARD - A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.08-22-2013
20090229865CONDUCTOR FOR FLEXIBLE SUBSTRATE AND FABRICATION METHOD OF SAME, AND FLEXIBLE SUBSTRATE USING SAME - A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, according to the present invention comprises: a base conductor made of Cu or Cu-alloy; a plating film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed on a surface of the plating film, in which the surface oxide film includes oxide of an element other than Sn or a mixture of Sn oxide and oxide of an element other than Sn.09-17-2009
20090260860FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and adjacent to a differential pair.10-22-2009
20090242243PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD - A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers.10-01-2009
20090242241FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING SAME - A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.10-01-2009
20100170703RIGID-FLEX MODULE AND MANUFACTURING METHOD - Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane (07-08-2010
20120193129PROCESS FOR PRODUCING GLASS CLOTH SUBSTRATE AND PRINTED WIRING BOARD - The present invention provides a process for producing a glass cloth substrate including: an impregnating step of impregnating a surface-treated glass cloth with a liquid composition including a solvent and a polyester to obtain a liquid composition-impregnated glass cloth, and a substrate preparing step of removing the solvent from the liquid composition in the liquid composition-impregnated glass cloth to obtain a glass cloth substrate. According to the present invention, adherability between the liquid crystal polyester and the glass cloth is improved, and the heat resistance at moisture absorption of the glass cloth substrate is improved.08-02-2012
20100147562Fabric Circuits and Method of Manufacturing Fabric Circuits - A flexible, fabric-based circuit comprises a non-conductive flexible layer of fabric and a conductive flexible layer of fabric adjacent thereto. A non-conductive thread, an adhesive, and/or other means may be used for attaching the conductive layer to the non-conductive layer. In some embodiments, the layers are attached by a computer-driven embroidery machine at pre-determined portions or locations in accordance with a pre-determined attachment layout before automated cutting. In some other embodiments, an automated milling machine or a computer-driven laser using a pre-designed circuit trace as a template cuts the conductive layer so as to separate an undesired portion of the conductive layer from a desired portion of the conductive layer. Additional layers of conductive fabric may be attached in some embodiments to form a multi-layer construct.06-17-2010
20090288860FLEXIBLE PRINTED CIRCUIT AND METHOD FOR MAKING SAME - A flexible printed circuit (11-26-2009
20100163283ELECTRONIC CIRCUITRY INTEGRATED IN FABRICS - The following invention discloses a type of electronic circuits that is realized directly on textile. The circuit has opto-electronic functions that are realized with a number of components integrated into the textile. These components comprise electronically and/or optically active material, that are supported by fabric elements. The components furthermore include an electrolyte. The components have lest two separated structures of an active material, and the electrolyte is in direct contact with the two separated active structures in that component. The separated structures can control their electrical and optical character through the electrolyte. These types of devices are very suitable for implementation in textile, since they are quite insensitive to the spacing between the separated active structures.07-01-2010
20090314524METHOD OF MANUFACTURING HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND HYBRID STRUCTURE THEREOF - Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.12-24-2009
20120138343THREE DIMENSIONAL INTERPOSER DEVICE, CHIP PACKAGE AND PROBE CARD CONTACTOR - A three-dimensional grid array interposer includes first and second arrays of electrical terminals arranged in grid-like patterns having grid pitches of (X1,Y1) and (X2,Y2), where each electrical terminal of the first array corresponds to an electrical terminal of the second array, forming a corresponding pair of electrical terminals. The interposer also includes a plurality of stacked substrates, each substrate having a first surface, a second surface, a first edge, and a second edge, with each substrate having a row of electrical terminals of the first array along the first surface at the first edge and a row of electrical terminals of the second array along the first surface at its second edge, with a trace running along the first surface between each electrical terminal of each corresponding pair of electrical terminals. Spacers can be used to provide desired space transformation.06-07-2012
20100258338FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer, upper and lower ground layers, and two dielectric layers. The signal layer includes a differential pair comprising two transmission lines to transmit a pair of differential signal. The dielectric layers are respectively located on and under the signal layer to sandwich the signal layer. The upper ground layer is attached to the dielectric layer on the signal layer. The lower ground layer is attached to the dielectric layer under the signal layer. Each ground layer defines a void therein aligning with the differential pair. Dielectric coefficients of the two dielectric layers are different.10-14-2010
20130213695METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME - The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.08-22-2013
20130213697FLEXIBLE LED DEVICE WITH WIRE BOND FREE DIE - An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.08-22-2013
20100186996THERMOSETTING RESIN COMPOSITION - The thermosetting resin composition according to the present invention includes a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity.07-29-2010
20100163282PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND ELECTRIC DEVICE - Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.07-01-2010
20100258337FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer, upper and lower ground layers, and two dielectric layers. The signal layer includes a differential pair comprising two transmission lines to transmit a pair of differential signals. The dielectric layers are located on and under the signal layer to sandwich the signal layer. The upper ground layer is attached to the dielectric layer on the signal layer, opposite to the signal layer. The lower ground layer is attached to the dielectric layer under the signal layer, opposite to the signal layer. Each ground layer includes a grounded sheet made of conductive material. Two voids are defined in each ground layer and located at opposite sides of the corresponding grounded sheet. Distances between the middle line of the grounded sheet of each ground layer and middle lines of the two transmission lines are equal.10-14-2010
20090078452FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.03-26-2009
20100018754FLEXIBLE PRINTED CIRCUIT LAYOUT AND METHOD THEREOF - The present invention discloses a flexible printed circuit (FPC) layout and a method thereof. The flexible printed circuit (FPC) layout method comprises steps of: providing a circuit board body; disposing at least an electroplating point on the circuit board body; disposing a plurality of solder pads on the circuit board body, the plurality of solder pads comprising at least a first solder pad and at least a second solder pad being connected respectively to the electroplating point through an internal wire, the first solder pad being further connected to an electroplating zone on the circuit board body through an external wire; performing an electroplating process from the electroplating zone through the external wire so that the external wire, the first solder pad connected to the external wire, the electroplating point connected through the internal wire to the first solder pad, and the second solder pad connected through the internal wire to the electroplating point are electroplated and electrically connected; and providing at least a via hole at the electroplating point on the circuit board body to form an open circuit between the first solder pad and the second solder pad. By using the disclosed method, the flexible printed circuit layout of the present invention can be formed.01-28-2010
20100186995Connecting device for cables and jumper wires - A connecting device for cables and jumper wires according to the present invention at least comprises a flexible flat cable and a second connecting member, wherein the flexible flat cable and the second connecting member are linked to each other and positioned by a circuit board for turn-on, and the to circuit board is provided thereon with a plurality of circuits, and the flexible flat cable is provided with a plurality of first pins connected to each of the circuits, and the second connecting member is also provided with a plurality of second pins connected to each of the circuits, and the arranging order of each first pin differs from that of each second pin so that each circuit on the circuit board can provide a jumper connection between the flexible flat cable and the second connecting member.07-29-2010
20100155109FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material, and a flexible wiring board including a flexible base material and having a conductive layer over the flexible base material. The conductive layer of the flexible wiring board is electrically connected to the conductive layer of the rigid wiring board. The flexible wiring board has a cut portion and one or more folding portions formed by using the cut portion and folding one or more portions of the flexible wiring board such that the flexible wiring board is extended in length.06-24-2010
20100212938FLEXIBLE PRINTED BOARD - A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.08-26-2010
20100276183FLEXIBLE PRINTED CIRCUIT BOARD - An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t11-04-2010
20100212937PROCESS FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD - According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.08-26-2010
20100230140RIGID-FLEX PRINTED CIRCUIT BOARD MODULE, AND MANUFACTURING METHOD AND PROCESSING METHOD THEREFOR - A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured.09-16-2010
20130126216ELECTRICALLY CONDUCTIVE, THERMOSETTING ELASTOMERIC MATERIAL AND USES THEREFOR - An electrically conductive, thermosetting elastomeric composition is provided. The composition may comprise: an initially substantially non-electrically conductive, thermosetting base polymer; a particulate filler comprising electrically conductive particles; and an electrically conductive polymer additive. The non-electrically conductive, thermosetting base polymer, the particulate filler and the electrically conductive polymer additive are mixed substantially macroscopically homogeneously.05-23-2013
20100084168Manufacturing method of a flexible printed circuit board and a structure thereof - In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit.04-08-2010
20100025085ELECTRONIC APPARATUS, FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD - According to one embodiment, an electronic apparatus includes a casing and a flexible printed wiring board contained in the casing. The flexible printed wiring board includes an insulating layer, which is sheet-like, a signal line formed on a first surface of the insulating layer, and a ground layer, which is conductive and formed on a second surface of the insulating layer opposite to the first surface. The ground layer includes a mesh portion having a mesh structure and a thin film portion which fills cells in the mesh structure of the mesh portion.02-04-2010
20110056732FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided are a flex-rigid wiring board in which resin that is easily affected by chemicals can be protected reliably without any increase in the number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible section (A) and a rigid section (B). The flexible section (A) includes a base film (03-10-2011
20100200278Flexible Pixel Array Substrate and Flexible Display - A flexible pixel array substrate includes a flexible base, at least one first driving transistor, at least one second driving transistor and at least one pixel electrode. The first driving transistor is disposed on the flexible base and has a first current channel. The second driving transistor is disposed on the flexible base and has a second current channel. The first current channel is not parallel to the second current channel. The pixel electrode is disposed on the flexible base. The pixel electrode is electrically connected to first driving transistor. The pixel electrode is electrically connected to the second driving transistor. In addition, a flexible display applying the flexible pixel array substrate is also provided. Besides, another flexible pixel array substrate and another flexible display applying the same are also provided.08-12-2010
20100000767Tab tape for tape carrier package - A TAB tape for a tape carrier package may have at least one opening formed in a connection portion. The at least one opening may be provided in the connection portion and a portion of the corresponding second lead. The at least one opening may be arranged near a boundary between the corresponding first lead and the connection portion. The at least one opening may be sized to reduce the change of the lead width from the first lead to the second lead.01-07-2010
20090242240Flexible circuit board, flexible circuit board positioning method, flexible circuit board positioning structure, droplet ejection head and image forming device - A flexible circuit board with which positioning relative to a corresponding member is easy, a flexible circuit board positioning method for positioning the flexible circuit board at the corresponding member, a flexible circuit board positioning structure that positions the flexible circuit board at the corresponding member, a droplet ejection head that employs the flexible circuit board, and an image forming device that employs the droplet ejection head. A positioning hole in the flexible circuit board is configured with a broad portion at a leading end side with respect to a direction of movement at a time of positioning. Even if the positioning hole is offset in a lateral direction relative to a positioning pin, this offset is absorbed and the positioning pin can be accommodated in the positioning hole.10-01-2009
20110114370DUAL-LAYER FLEXIBLE PRINTED CIRCUIT - A dual-layer flexible printed circuit is disclosed. The dual-layer flexible printed circuit includes an inner flexible printed circuit and an outer flexible printed circuit which overlaps the inner flexible printed circuit. The inner flexible printed circuit can be bent and forms a protrusion offset from the outer flexible printed circuit. The dual-layer flexible printed circuit further includes a fixing element to secure the protrusion to prevent the protrusion from extruding along a longitudinal direction of the dual-layer flexible printed circuit.05-19-2011
20090114428PRINTED WIRING BOARD - A printed wiring board which is sufficiently prevented from being damaged at the time of heating is provided. This printed wiring board comprises a flexible board having flexibility, a lamination portion which is formed on at least one surface of the flexible board and includes an insulation layer and a conductive layer laminated, and a barrier layer which is disposed between the flexible board and the lamination portion, or between the insulation layer and the conductive layer of the lamination portion and has water-vapor permeability lower than that of the insulation layer of the lamination portion.05-07-2009
20090071697Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof - The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A)03-19-2009
20090071696PARTIALLY RIGID FLEXIBLE CIRCUITS AND METHOD OF MAKING SAME - The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.03-19-2009
20090107703WIRING BOARD, PACKAGING BOARD AND ELECTRONIC DEVICE - To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers (04-30-2009
20090107702PRINTED INTERCONNECTION BOARD AND METHOD OF MANUFACTURING THE SAME - A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.04-30-2009
20100294545INTERCONNECT FOR TIGHTLY PACKED ARRAYS WITH FLEX CIRCUIT - Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials11-25-2010
20110247863FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING SAME - [Object] To provide a flexible printed board improved in bendability.10-13-2011
20100294544Bending-Type Rigid Printed Wiring Board and Process for Producing the Same - This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (11-25-2010
20100170701POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD - A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).07-08-2010
20100300730Electronic apparatus and flexible printed circuit thereof - A flexible printed circuit for an electronic apparatus is disclosed. The flexible printed circuit is capable of being bended along a radial direction. The flexible printed circuit comprises a first base film, a first copper foil layer, and a cover layer. The first copper foil layer is disposed on the first base film, and the cover layer is disposed on the first copper foil layer. The cover layer comprises an opening, and the first copper foil layer forms an exposed area via the opening. At least one boundary is formed between the exposed area and the cover layer, wherein the at least one boundary is not a single straight line substantially parallel to the radial direction.12-02-2010
20110127071FLEXIBLE PCB OF SPINDLE MOTOR - Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.06-02-2011
20100193223SOLDER RESIST COATING FOR RIGID-FLEX CIRCUIT BOARDS AND METHOD OF PRODUCING THE SOLDER RESIST COATING - A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.08-05-2010
20110024162FLEXIBLE WIRING UNIT AND ELECTRONIC APPARATUS - A flexible wiring unit (02-03-2011
20110024160MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD - A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.02-03-2011
20110024161Method and Apparatus for Aligning and Installing Flexible Circuit Interconnects - A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.02-03-2011
20110030997FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a differential pair arranged in a signal layer and a ground sheet arranged in a ground layer. The differential pair includes a number of section pairs, each of which includes two sections arranged in two transmission lines of the differential pair respectively. The ground sheet is opposite to a space between the two transmission lines of the differential pair. The differential pair is equivalent to a filter which includes several capacitors and several inductors. Each of the plurality of section pairs can achieve a desired characteristic impedance by adjusting a first distance between each section and the ground sheet, and a second distance between the two sections of each of the plurality of section pairs.02-10-2011
20110030996CIRCUIT SUBSTRATE FOR ELECTRONIC DEVICE - In one embodiment, an electronic device comprises a substrate, a plurality of circuit traces on a substrate, wherein at least a subset of the plurality of circuit traces comprise at least one tab trace. A plurality of the tab traces are excised from the substrate, and at least one electronic component is positioned proximate at least one tab trace on the substrate. The electrical component comprises at least one electrical contact on an upper surface of the component. The tab trace is lifted and inverted to establish an electrical connection between an electrically conductive portion of the tab trace and an electrical contact on an upper surface of the at least one electronic component.02-10-2011
20090101394PHOTOSENSITIVE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING CIRCUT BOARD HAVING INSULATIVE COVER LAYER FORMED OF PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises:04-23-2009
20110209901COATED POLYESTER FILM - A method of improving the flexibility of a coated polyester substrate for an electronic device comprising a coated polyester substrate layer and an electrode layer comprising conductive material, said method comprising: (a) providing a polyester film; and (b) disposing an organic/inorganic hybrid coating on one or both surfaces of said polyester film, wherein said coating is derived from a coating composition comprising a low molecular weight reactive component selected from monomeric acrylates and/or an unsaturated oligomeric component selected from acrylates, polyether acrylates, epoxy acrylates and polyester acrylates; a solvent; and inorganic particles, and optionally further comprising a photoinitiator.09-01-2011
20090032290FLEXIBLE PRINTED CIRCUIT BOARD BASE FILM, FLEXIBLE LAMINATES AND FLEXIBLE PRINTED CIRCUIT BOARDS INCLUDING SAME - A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.02-05-2009
20100193224METHOD OF FORMING CONDUCTIVE PATTERN AND SUBSTRATE HAVING CONDUCTIVE PATTERN MANUFACTURED BY THE SAME METHOD - The present invention relates to a method for manufacturing a board that includes a conductive pattern, which comprises the steps of 1) discharging a conductive inorganic composition that includes a conductive inorganic metal particle on a substrate; 2) discharging a conductive organic composition that includes a conductive organic metal complex on the conductive inorganic composition; and 3) sintering the conductive inorganic composition and the conductive organic composition, and a board that includes a conductive pattern manufactured by using the same. A board that includes a conductive pattern according to the present invention may have high conductivity even though it is sintered at a lower sintering temperature than a board that includes a conductive pattern formed by using only an organic material or only an inorganic material.08-05-2010
20110083882CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The present disclosure relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board having a first through hole is disposed on the first conductive layer. The conductive unit is exposed to the first through hole. The first through hole is filled with a conductive material, such that the conductive material is electrically connected to the conductive unit.04-14-2011
20100038116PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.02-18-2010
20100038117TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME - Example embodiments are directed to a tape wiring substrate including a film having an upper surface including a chip mounting area, the chip mounting area further including an inner area and a peripheral area, the film further including a lower surface, and vias penetrating the film, the vias being located in the inner area, an upper metal layer on the upper surface of the film and connected to electrode bumps of a semiconductor chip, and a lower metal layer on the lower surface of the film. Example embodiments are directed to a tape wiring substrate including a film having an upper surface including a chip mounting area, a lower surface, and vias penetrating the film, an upper metal layer on the upper surface of the film and connected to electrode bumps of a semiconductor chip, and a lower metal layer on the lower surface of the film, the vias being located outside of the chip mounting area. Example embodiments are directed to packages including tape wiring substrates.02-18-2010
20110247864THERMOSETTING INK COMPOSITION - The present invention provides a thermosetting ink composition having excellent balance concerning screen printability capable of preventing oozing and bleeding at the time of screen printing, electric insulating reliability and adhesion with an objective for coating. The thermosetting ink composition of the invention comprises a thermosetting resin (A) having a value “a” of less than 0.60 in the following formula (1) showing the relationship between the intrinsic viscosity [η] and the absolute molecular weight M of the resin:10-13-2011
20100059254Conductor module and electromagnetic welding method - The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.03-11-2010
20110094776Multilayer rigid flexible printed circuit board and method for manufacturing the same - The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.04-28-2011
20110147053PRINTED WIRING BOARD - A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.06-23-2011
20110094775DOUBLE-SIDE-CONDUCTING FLEXIBLE-CIRCUIT FLAT CABLE WITH CLUSTER SECTION - Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.04-28-2011
20110094774MULTI-LAYER INTERCONNECTION STRUCTURE MANUFACTURING METHOD THEREOF - Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.04-28-2011
20110100683ELECTRONIC TEXTILE - The invention relates to an electronic textile comprising a textile substrate having a substrate electrode, and an electronic component having a component electrode. The component electrode is in electrically conductive contact with the substrate electrode via a coupling layer having a directionally dependent conductance so as to preferentially allow an electrical current to flow between the substrate electrode and the component electrode. As the coupling layer does not have to be patterned to prevent the occurrence of parasitic electrical currents, the electrically conductive contact between the substrate electrode and the component electrode has an improved reliability.05-05-2011
20110100682DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable has two conductor wires disposed to be parallel with each other, a flat insulating member collectively covering the two conductor wires, the insulating member having flat portions facing to each other in a direction perpendicular to an alignment direction of the two conductor wires to sandwich the two conductor wires, a shield conductor including a metal foil tape and being wound around an outer periphery of the insulating member, a drain wire provided to contact with the shield conductor at a position corresponding to the flat portion, and a jacket jacketing the drain wire and the shield conductor.05-05-2011
20110073353CONDUCTIVE FABRIC AND METHOD FOR FORMING THE SAME - A conductive fabric and a method for forming the same are provided. The conductive fabric comprises a first layer and a second layer. The first layer has at least one first conductive thread and a plurality of first non-conductive threads. The at least one first conductive thread is woven within the plurality of first non-conductive threads. The second layer has at least one second conductive thread and a plurality of second non-conductive threads. The at least one second conductive thread is woven within the plurality of second non-conductive threads. The first layer is woven with the second layer and insulated from the second layer so that an electronic component can be attached to and electrically connect to the at least one first conductive thread of the first layer and the at least one second conductive thread of the second layer.03-31-2011
20110247862Flexible Printed Circuit Cable With Multi-Layer Interconnection - A multi-layer flexible printed circuit cable (flex circuit) with an electrical interconnection between independent conductive layers, and a method for forming the same. In accordance with various embodiments, a partial aperture is formed in the flex circuit that extends through a first conductive layer and an intervening insulative layer to an underlying surface of a second conductive layer that spans the partial aperture. A solder material is reflowed within the partial aperture to electrically interconnect the first and second conductive layers.10-13-2011
20110067903BUNDLED FLEXIBLE FLAT CIRCUIT CABLE - A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.03-24-2011
20110061903Multilayered printed wiring board and method for manufacturing the same - A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.03-17-2011
20110017497ELECTRIC DEVICE - An electric device, in particular a mechatronic gear, motor, or brake control device in a motor vehicle, includes an electronic component having at least one electric contact surface for electrically contacting the component. A flexible circuit board with a conduction path structure includes at least one contact pad and conduction lines between two flexible, non-conducting films. A respective contact pad of the flexible circuit board is electrically connected, in particular by welding, to a respective contact surface of the component for creating at least one contact point. A sealing element is disposed on a side of the flexible circuit board opposite the component and an internal space is bounded by a wall. The sealing element is pressed against the flexible circuit board at an edge of the wall so that the edge surrounds at least one of the contact points.01-27-2011
20110147052POLYIMIDE FILM - Disclosed is a polyimide film for insulating material prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board.06-23-2011
20110147054PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE - A photosensitive conductive film 06-23-2011
20110147051CAPACITIVE SWITCH SENSORS ON DECORATIVE IN-MOLD FILMS BACKGROUND - This invention is related to process for the production of a interior trim piece, comprising the steps of: —providing a film layer—applying conductive ink/paint to the back surface of the film layer to provide a circuit path and—attaching a substrate on the back surface of the film layer. This invention further relates to a interior trim piece comprising a film layer with a circuit path on its back surface, whereas the circuit path is made from conductive ink/paint.06-23-2011
20100300731FLEXIBLE CIRCUIT BOARD MATERIAL AND METHOD FOR PRODUCING THE SAME - A method for producing a flexible circuit board material having a polymer substrate and a copper layer. The method includes depositing a layer of titanium oxide to be between the polymer substrate and the copper layer. The layer of titanium oxide and the copper layer are deposited using vacuum methods.12-02-2010
20100252307FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board includes a substrate, signal lines, a first reinforcing layer, and a second reinforcing layer. The first surface of the substrate includes a layout zone and a reinforcing zone disposed nearby the layout zone. The signal lines are disposed on the layout zone. The first reinforcing layer is disposed on the reinforcing zone. The second reinforcing layer is disposed on the second surface of the substrate.10-07-2010
20110253426CURABLE COMPOSITION - It is an object of the present invention to provide a curable composition which provides a cured product excellent in low warpage properties and long-term electrical insulation reliability and causes little bleeding during screen printing. The present invention is a curable composition comprising the following components (a) to (e): a component (a): polyurethane having a functional group capable of curing reaction and a carbonate bond, a component (b): γ-butyrolactone, a component (c): diethylene glycol diethyl ether, a component (d): inorganic fine particles and/or organic fine particles, and a component (e): a compound having two or more epoxy groups in one molecule.10-20-2011
20110253424FLEXIBLE PRINTED CIRCUIT BOARD - A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.10-20-2011
20110174524FLEXIBLE CIRCUITS - The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.07-21-2011
20090260859FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer comprising a differential pair, a ground layer comprising a grounded sheet made of conductive material, and a dielectric layer located between the signal layer and the ground layer. A void is located on the two opposite sides of the grounded sheet in the ground layer. The differential pair comprises two transmission lines and each transmission line is capable of transmitting a differential signal. The distances between the middle line of the grounded sheet and the middle line of each of the two transmission lines are equal.10-22-2009
20090000808Flexible Printed Circuit Board And Method Of Fabricating The Same - Flexible printed circuit board and a method for fabricating the same are introduced. The circuit board of the flexible printed circuit board is mainly made up of a PI substrate having a circuit layer, and a polyimide layer press-bonded onto the PI substrate by using an adhesive layer. In order for the circuit layer to be conducting, the PI substrate is to be etched to precisely form a micro-through hole on the circuit layer, instead of punching the through hole onto the polyimide layer before it is press-bonded onto an existing PI substrate having a circuit layer as used in conventional method. As a result, the alignment of the through hole with respect to the circuit layer is more precise.01-01-2009
20110209902CURRENT COLLECTOR SYSTEMS FOR USE IN FLEXIBLE PHOTO ELECTRICAL AND DISPLAY DEVICES AND METHODS OF FABRICATION - A conductor assembly for use in fabricating a photoelectrical device is disclosed including: a number of electrically conductive filaments; a number of substantially transparent filaments; and wherein the conductive and transparent filaments are joined together to form a flexible web. Photoelectrical devices or sub-assemblies fabricated to include the conductor assembly are also disclosed.09-01-2011
20090211789Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board - Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.08-27-2009
20090126976FLEXIBLE WIRING BOARD, METHOD OF PRODUCING THE SAME AND IMAGING DEVICE - A flexible wiring board is formed with a first mounting surface, a first erected surface portion, a relay portion, a second erected surface portion and a second mounting surface. The first erected surface portion and the second erected surface portion are positioned on the same plane. The second mounting surface is fixed. When the first mounting surface is moved in the X-axis direction, the force in the X-axis direction acts on the relay portion as a force from a direction outside of the plane since the first erected surface portion and the second erected surface portion are positioned on the same plane. Therefore, the relay portion is bent and a suppressed reaction force acts on the first mounting surface and on the second mounting surface.05-21-2009
20080296049Printed Circuit Board - A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.12-04-2008
20080289860Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board - An object of the present invention is to provide a flexible printed wiring board and multilayered flexible printed wiring board in which, in methods of laminating substrates comprising a non-adhering section and an adhering section, adhesion of the FPC substrates of the flexure part can be prevented and adequate flex resistance can be maintained.11-27-2008
20120199382FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE - The present invention has an object of obtaining excellent anti-noise performance and a high level of flexibility in a flexible circuit board. A flexible circuit board 08-09-2012
20080264678Member for Interconnecting Wiring Films and Method for Producing the Same - The connection resistance between a metal bump (10-30-2008
20080202796Flexible Wiring Cable - A flexible wiring cable includes a flexible flat base, and a plurality of first and second leads wired on first and second surfaces of the base respectively. First and second circuit elements are mounted on the first and second leads respectively. A plurality of terminal electrodes is provided on the first surface of the base. The terminal electrodes include a plurality of first terminal electrodes formed on the first leads and a plurality of second terminal electrodes formed on the second leads, being exposed to the outside of the first surface side via through holes formed in the base.08-28-2008
20110253427PARALLEL LIGHT-EMITTING CIRCUIT OF PARALLEL LED LIGHT-EMITTING DEVICE AND CIRCUIT BOARD THEREOF - A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns are oppositely formed on the electrical insulation board. Each wire pattern is connected to the corresponding power wire and has a matrix main loop having closed loops and a plurality of sub-wires formed inside the corresponding closed loop. A plurality of LEDs are respectively mounted on the corresponding closed loop and electrically connect with the two sub-wires of the two wire patterns. When a DC power supply is inputted to the power wires, a current of the DC power supply uniformly flows through the matrix main loop and the sub-wires, so that the LEDs electrically connected to the corresponding sub-wires receive approximately equal current to further emit light with uniform brightness.10-20-2011
20100282497CIRCUIT BOARD - Release papers (11-11-2010
20110114371COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURES USING THE SAME - A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 μm. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.05-19-2011
20110132641FLEXIBLE CABLE AND METHODS OF MANUFACTURING SAME - A flexible cable for carrying RF signals and method of manufacturing same. The cable includes an elongate base substrate including a dielectric layer with an upper metal layer deposited on one side and a lower metal layer deposited on its other side. It further includes two parallel spaced-apart series of vias formed along the length of the base substrate, each via electrically interconnecting the upper metal layer and the lower metal layer, whereby a rectangular cross-sectional waveguide is provided between the upper metal layer, the lower metal layer and the two series of vias.06-09-2011
20110253425ROLL-TO-ROLL DIGITAL PHOTOLITHOGRAPHY - Methods of making flexible circuit films include providing a polymer film or other flexible substrate having a plurality of alignment marks and a photosensitive material thereon. The substrate passes around a suitable roller, belt, or other inelastic conveyor such that the substrate and the conveyor move together at least from a first location to a second location. Positions of a first set of the alignment marks on a first portion of the substrate are measured when such portion is at the first location, and the measured positions can be used to calculate a distortion of the substrate. The photosensitive material is then patternwise exposed when the first portion of the substrate has moved to the second location. The patternwise exposing is based on the measured positions of the first set of alignment marks, and may include exposing the web with a distortion-adjusted pattern. Related systems and articles are also disclosed.10-20-2011
20110067905FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR FORMING MONITOR - The disclosure relates to a flexible printed circuit board and a method for manufacturing a monitor. The flexible printed circuit board is disposed on a portion of an upper surface of a substrate and is folded to a sidewall and a lower surface of the substrate. The flexible printed circuit board includes a flexible substrate and an insulating layer surrounding the flexible substrate. The insulating layer has an opening at least exposing a portion of the flexible substrate situated relative to the sidewall of the substrate.03-24-2011
20110067904FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other.03-24-2011
20090308639FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board that can be used for mounting a light emitting diode. The flexible printed circuit board includes a lower insulator, an upper insulator, and a conductive pattern disposed between the upper and lower insulators. A white film is attached to the top of the upper insulator. Alternatively, the upper insulator is formed of a white insulation material. The flexible printed circuit board has a planar surface and can be properly assembled to other components.12-17-2009
20100025084PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD - There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same. There is provided a photosensitive thermosetting resin composition of an alkali development type and a flexible printed circuit board using the same, the photosensitive thermosetting resin composition including: (A) a resin component having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution; (B) a phosphorus-containing epoxy thermosetting resin component; (C) a photopolymerization initiator; (D) an organophosphorus compound; and (E) a diluent, and having excellent performance in all the properties comparable to those of conventional photosensitive thermosetting resin compositions using brominated epoxy resin and a halogen-based flame retardant, and having an excellent property of not generating hydrogen bromide which has been a problem at the time of the combustion.02-04-2010
20100025087FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.02-04-2010
20100025086METHOD FOR PRODUCING A FLEXI-RIGID PRINTED CIRCUIT BOARD AND FLEXI-RIGID PRINTED CIRCUIT BOARD - The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone (02-04-2010
20100025083FLEXIBLE CIRCUIT BOARD - A flexible circuit board uses a specific structure to alleviate mechanical stress thereof. The flexible circuit board has a flexible film, a plurality of inner leads, a plurality of outer leads, and a plurality of connection portion. Each of the connection portions a corresponding one of the inner leads with a corresponding one of the outer leads. A first width of the inner leads is greater than a second width of the outer leads. Due to rounded concave sections and rounded convex sections of the connection portions, if the flexible circuit board is bent, the mechanical stress around corners of joint portions of the connection portions with the inner leads and the outer leads could be alleviated.02-04-2010
20120037406METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN ELECTRODE - A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include depositing a second material over the offset region and the opening, the second material being different from the first material and providing a second mask over the second material, the second mask having an opening over a portion of the second material that is over the offset region.02-16-2012
20090283300Flex Circuit with Single Sided Routing and Double Sided Attach - A flex circuit having conductive traces formed on only one side of a base film for attaching to both sides of a DITO touch sensor panel is disclosed. By having conductive traces formed on only one side of the base film, the number of process steps and fabrication cost can be reduced because only a single etching step is needed. Furthermore, because the flex circuit is thinner, the resultant space savings can be utilized for other features in a device without enlarging the overall device package.11-19-2009
20080283278Flexible Circuit Substrate - The present invention is directed to a substrate for subsequent eutectic bonding with a subsequently applied metal to provide, or as a precursor to the provision of, a circuit substrate. The circuit substrate comprises a dielectric film and a layer of an oxide or oxides of a metal on the film. The metal oxide layer has been formed by sputtering the metal of the metal oxide or oxides onto a surface of the film in the presence of an inert atmosphere save for at least one reactive gas content to provide the oxygen of the oxides.11-20-2008
20090151988Flexible printed circuit board and method of manufacturing the same - An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.06-18-2009
20110132642Flexible Wiring Substrate - A plurality of protruding substrate portions (06-09-2011
20120145438COPPER ALLOY FOIL, FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD FOR PRODUCING COPPER ALLOY FOIL - The zirconium content of the alloy composition of a copper alloy foil of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. As shown in FIG. 06-14-2012
20120097432ELECTRODE ARRAY - An electrode array is provided. The electrode array includes a substrate; and a plurality of electrodes, each of which has a first part with a first width and a second part with a second width different from the first width, wherein the plurality of electrodes are configured in compensation with each other on the substrate.04-26-2012
20120037405FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm.02-16-2012
20120305295THERMOSETTING COMPOSITION - It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.12-06-2012
20120305294FLEXIBLE PRINTED WIRING BOARD HAVING CONNECTOR CONNECTING PORTION - A flexible printed wiring board capable of preventing plated leads from peeling off due to repeated insertion and extraction of a connector connecting portion into and from a connector without bringing about an increase in the whole length of the flexible printed wiring board even when the flexible printed wiring board is a one-sided or double-sided one. First plated leads are provided in a manner extending from conductor patterns located outermost in a width direction of the connector connecting portion among a plurality of conductor patterns and reaching sides of the flexible printed wiring board in a width direction. Second plated leads are provided in a manner extending from leading ends of the other conductor patterns among the plurality of conductor patterns in a direction in which the connector connecting portion is inserted into the connector and reaching a leading end face of the flexible printed wiring board.12-06-2012
20120305293CIRCUIT BOARD ASSEMBLY AND METHOD OF ASSEMBLING CIRCUIT BOARDS - According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.12-06-2012
20120043119COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS - An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.02-23-2012
20120043118ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME - Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.02-23-2012
20120043117SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD - A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.02-23-2012
20120000696LIQUID COVERLAYS FOR FLEXIBLE PRINTED CIRCUIT BOARDS - The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.01-05-2012
20090314523Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board - An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multilayer flexible printed wiring board or a flex-rigid printed wiring board. This adhesive sheet is used for bonding of a flexible printed wiring board made of a polyimide resin, and comprises a woven or nonwoven fabric as the base and a resin composition. The resin composition contains, as essential components, (a) an epoxy resin having two or more of epoxy groups in one molecule; (b) a polycarbodiimide resin dispersible in a solvent, in which the epoxy resin (a) is also dispersible, and having a number average molecular weight of 2000 or more and less than 10000; and (c) an imidazole curing agent. A weight ratio of the component (a) and the component (b) is in a range of 80:20 to 20:80.12-24-2009
20120043116Interconnection Structure Of Interposer With Low CTE And Packaging Component Having The Same - Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.02-23-2012
20120043115FLEXIBLE CIRCUIT STRUCTURE WITH STRETCHABILITY AND METHOD OF MANUFACTURING THE SAME - In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.02-23-2012
20120006583DISCHARGE GAP FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR - The present invention provides an electrostatic discharge protector capable of simply taking ESD measures with a free shape against electronic circuit boards having various designs, having excellent regulation accuracy for an operating voltage and capable of downsizing and cost decreasing, and also provides a discharge gap filling composition capable of using in the production of the electrostatic discharge protector.01-12-2012
20120006582FLEXIBLE BOARD FOR TRANSMITTING SIGNALS - Provided is a flexible board for transmitting signals which includes: a dielectric on which different signal lines are respectively disposed on independent separation regions on opposite surfaces of opposite sides thereof; a metallic shielding portion that is spaced apart from each other at intervals at a boundary between the separation regions and shields interference between the different signal lines; and a ground conductive layer that is formed on a portion of the dielectric and is electrically connected to the metallic shielding portion.01-12-2012
20120111612THERMOSETTING ADHESIVE TAPE OR SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD - The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)−(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.05-10-2012
20120111613COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME AND LAMINATED BOARD - A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.05-10-2012
20110094773OFFSET ELECTRODE - An electrode including a non-conductive substrate having a top surface and at least one channel extending therethrough, an electrically conductive trace material positioned adjacent a portion of the top surface of the non-conductive substrate and extending through the channel, and adapted for electrically coupling to a power source, and second and third electrically conductive materials that are inert or more corrosion resistant than the trace material. The second material is positioned adjacent to and entirely covering a top surface of the trace material, and the third material is positioned adjacent to and entirely covering a top surface of the second electrically conductive material, and covers a portion of a top surface of the non-conductive substrate surrounding the second electrically conductive material. The electrode further includes a conductive hydrogel positioned adjacent to a portion of a top surface of the third electrically conductive material, but laterally offset from the trace material.04-28-2011
20120205144TRANSPARENT FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a transparent flexible printed wiring board which is excellent in flexibility, heat resistance and adhesion between a transparent film and a transparent conductive film.08-16-2012
20120205143MANUFACTURING APPARATUS, MANUFACTURING METHOD AND PACKAGED DEVICE - It is an objective of the present invention to eliminate wafer testing. Provided is a manufacturing apparatus comprising a detecting section that detects a position of a device terminal of a device; a generating section that generates a substrate-side terminal, which connects to the device terminal, on a substrate at a position corresponding to the device terminal; and a mounting section that mounts the device on the substrate and connects the device terminal to the substrate-side terminal. The detecting section captures an image of the device and detects the position of the device terminal based on the captured image, and the generating section prints a pattern of the substrate-side terminal on the substrate at a position corresponding to the device terminal.08-16-2012
20120012369CIRCUIT BOARD - A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in plan in the z-axis direction, are overlaid on the external electrodes and are not connected to one another in regions in which the internal conductors are overlaid on the external electrodes.01-19-2012
20120012367Flexible Laminate and Flexible Electronic Circuit Board Formed by using the same - An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).01-19-2012
20120012368MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.01-19-2012
20120055702COMPLIANT PRINTED FLEXIBLE CIRCUIT - A compliant printed flexible circuit including a flexible polymeric film and at least one dielectric layer bonded to the polymeric film with recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the recesses to form a circuit geometry. At least one dielectric covering layer is printed over at least the circuit geometry. Openings can be printed in the dielectric covering layer to provide access to at least a portion of the circuit geometry.03-08-2012
20120055699ANTI-DEFLECTION STRUCTURE FOR FLEXIBLE CIRCUIT BOARD - An anti-deflection structure for a flexible circuit board includes a flexible circuit board, at least one electronic element, and at least one anti-deflection element. The electronic element and the anti-deflection element are disposed on the flexible circuit board. The electronic element provides a weld for being soldering to the flexible circuit board. The anti-deflection element is arranged around the weld of the electronic element. By means of the anti-deflection element absorbing an external force in time of bending the flexible circuit board, the external force is not directly imparted upon the weld. Therefore, the weld does not deviate from the flexible circuit board easily, and the electronic element does not depart from the flexible circuit board, either.03-08-2012
20120055701HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT - An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second surface, distal ends extending above the first surface, and intermediate portions engaged with an engagement region of the substrate located between the first surface and the recesses. Retention members are coupled with at least a portion of the proximal ends to retain the contact members in the through holes. The retention members can be made from a variety of materials with different levels of conductivity, ranging from highly conductive to non-conductive.03-08-2012
20120055700DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE FOR FIXING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD WITH THE SAME - Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.03-08-2012
20100186997CRIMPED SOLDER ON A FLEXIBLE CIRCUIT BOARD - A method for attaching a fusible member to a flexible circuit board includes providing the flexible circuit board including an electrode and a hole near each other, placing the fusible member in the hole, and deforming the fusible member to fix the fusible member to the flexible circuit board. A flexible circuit board includes an electrode, a hole, and a fusible member fixed to the hole and arranged to establish an electrical connection with the electrode when the fusible member is fused to the electrode.07-29-2010
20100263917Preparing Method for Printed Circuit Boards by Directing Printing and Printed Circuit Boards Prepared by the Method - A method of preparing printed circuit boards (PCB) or flexible printed circuit boards (FPCB) by direct printing includes: 1) a step of printing a pattern on substrate with a paste composition including conductive particles, polyamic acid as binder and solvent; 2) a step of baking the printed substrate to imidize the polyamic acid; and 3) a step of electro-plating the printed substrate. Printed circuit boards (PCB) or flexible printed circuit boards (FPCB) are produced by applying an addition method of direct printing while to simplify processes, to save time and cost, and to minimize waste.10-21-2010
20100096164FILM AND FLEXIBLE METAL-CLAD LAMINATE - A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.04-22-2010
20100096168ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS - A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.04-22-2010
20100096167Flexible printed circuit board for large capacity signal transmission medium - Provided is a flexible printed circuit board (FPCB) for a large capacity signal transmission medium that may maintain an impedance suitable for accurately transmitting a large capacity signal such as a low-voltage differential signaling (LVDS) signal and may also have an excellent flexibility. A copper foil large capacity signal wire includes a plurality of first pads and a plurality of second pads that are spaced apart from each other at predetermined intervals and are alternately provided, to receive a large capacity signal from a television main board and to transmit the received large capacity signal to a display device. The first pad has a positive phase and the second pad has a negative phase. A copper foil ground layer is attached at a distance from the cooper foil large capacity signal layer to ground the large capacity signal that is transmitted to and is returned from the display device. An insulating layer is attached between the copper foil large capacity signal wire and the copper ground layer to insulate between the copper foil large capacity signal wire and the cooper foil ground layer. A width of each of the first pad and the second pad of the copper foil large capacity signal wire has a range of 40 to 400 μm, an interval between the first pad and the second pad has a range of 40 to 450 μm, a thickness of each of the first pad, the second pad, and the copper foil ground layer has a range of 17 to 40 μm, and a thickness of the insulating layer has a range of 10 to 170 μm, so that the first pad and the second pad may be controlled to be 80 to 110Ω impedance.04-22-2010
20100096166Flexible Circuit Assemblies without Solder and Methods for their Manufacture - The present invention provides an electronic assembly 04-22-2010
20100096165GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD - A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.04-22-2010
20110088929METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved.04-21-2011
20090133907Novel polyimide copolymer and metal laminate using the same - A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D05-28-2009
20090133906FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A flexible printed circuit board (FPCB) and FPCB manufacturing method that improves a signal transfer characteristic at a high speed. The FPCB includes an insulating layer having a signal pattern that transfers signals, a cover layer formed on the signal pattern, and a shielding layer formed at a position opposite to the signal pattern. The shielding layer faces at least one of the insulating layer and the cover layer across anspace formed there between.05-28-2009
20090133905HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER - A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 μm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).05-28-2009
20090308638FLEXIBLE PRINTED CIRCUIT BOARD, METHOD OF FABRICATING THE FLEXIBLE PRINTED CIRCUIT BOARD, AND DISPLAY DEVICE HAVING THE FLEXIBLE PRINTED CIRCUIT BOARD - Provided are a flexible printed circuit board (PCB), which can contribute to the reduction of damage to wiring layers and wiring defects regardless of a decrease in the width of wiring layers and can thus contribute to the miniaturization of various products, a method of fabricating the flexible PCB, and a display device having the flexible PCB. The flexible PCB includes a base film, one or more first pad patterns formed on the base film, one or more second pad patterns formed on the base film and connected to the one or more first pad patterns, a cover film formed on the one or more first pad patterns and the base film and exposing the one or more second patterns, and a plurality of expanded portions corresponding to the boundaries between the one or more first pad patterns and the one or more second pad patterns and having a greater width than the one or more first pad patterns and the one or more second pad patterns.12-17-2009
20120118616NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD - A negative photosensitive resin composition contains a polyimide precursor resin obtained by condensation polymerization of a carboxylic anhydride component containing an aromatic tetracarboxylic dianhydride and a diamine component containing an aromatic diamine, a photopolymerizable monomer, and a photopolymerization initiator, wherein a compound having a photoreactive functional group and a glycidyl group is contained as the photopolymerizable monomer in an amount of 0.05% to 15% by weight relative to the total solid content of the negative photosensitive resin composition. Accordingly, a negative photosensitive resin composition is provided in which non-exposed areas have excellent solubility in a developing solution and degradation of the film located in exposed areas, the degradation being caused by the developing solution, is suppressed. Also provided are a printed circuit board and a polyimide film using the negative photosensitive resin composition.05-17-2012
20120312586FLEXIBLE PRINTED BOARD - A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.12-13-2012
20100288539PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A printed wiring board is provided, having conductor patterns formed on a surface of an insulating substrate, wherein the conductor pattern is formed by lamination of a base metal pattern formed by patterning a base metal film which is formed on a surface of the insulating substrate, and plating a metal pattern formed on the base metal pattern by selective plating after the base metal pattern is formed.11-18-2010
20100288538Flakes Made of Materials Such as Glass - The present invention provides flake having a thickness up to 350 nm, the flake being made of basalt, ceramics, alumina, graphite, a metal, a metal oxide or a combination of any two or more thereof. Equipment for manufacturing such flake is also described as is a method for the manufacture of the flake. The equipment comprises a cup mounted for rotation and for receiving molten glass. The equipment further comprises either insulating means extending at least partially around said cup or means for heating the cup while it is rotating.11-18-2010
20100206620Printed Board, Image Pickup Apparatus and Camera - The present invention relates to a bendable printed board, an image pickup apparatus, and a camera. The bendable printed board is provided with: a first end connected to a moving body movable in an arbitral direction within a predefined plane; a second end connected to a fixed body with slack providing movability to the moving body; and a slit formed on at least a part of a slack portion of the printed board.08-19-2010
20120132458FLEXIBLE CIRCUIT BOARD - In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 05-31-2012
20120132459CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES - Circuit boards having a polymer substrate, a first electrode and a second electrode disposed on a surface of the polymer substrate, and at least one nanostructure electrically connected to the first and second electrodes are generally disclosed.05-31-2012
20120312585Soft Electrode Material and Manufacturing Method Thereof - There is provided a soft electrode material including an electrode layer containing a mixture of carbon black and at least one selected from carbon nanotube and graphene, so that the soft electrode material can facilitate various transformation thereof in response to physical transformation of an electrode, such as warpage, elongation, and the like; prevent the rapid reduction in electric conductivity of an electrode while maintaining flexibility and elasticity of the electrode at the time of the transformation; and provide excellent reliability, and thus, electrical-mechanical energy conversion efficiency of a soft electronic component such as an actuator including the soft electrode material, can be increased, and electric conductivity of the electrode layer can be improved as the electrical-mechanical conversion efficiency increases.12-13-2012
20120168207FLEXIBLE MULTILAYER TYPE THIN FILM CAPACITOR AND EMBEDDED PRINTED CIRCUIT BOARD USING THE SAME - Provided is a flexible multilayer thin film capacitor using a flexible metal substrate, including: a metal substrate; a metal oxide layer formed on the whole surface of the metal substrate; a plurality of first internal electrode layers selectively applied on a first surface of the metal substrate using a metal material; a plurality of dielectric layers formed to be sequentially multi-layered on the whole surface of the first internal electrode layers using a dielectric material; a plurality of second internal electrode layers selectively applied on the dielectric layers using a metal material; a protecting layer applied on a surface of one of the plurality of second internal electrode layers; and a single pair of external electrodes connected to contact with the plurality of first internal electrode layers and the plurality of second internal electrode layers, respectively, and soldered on conductive inter-layer pads of a printed circuit board.07-05-2012
20100051327MULTILAYER-WIRED SUBSTRATE - Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.03-04-2010
20100051325FLEX-RIGID PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board.03-04-2010
20100012355METHOD FOR PRODUCING A FLEXIBLE CONDUCTOR CARRIER AND ARRANGEMENT COMPRISING THE FLEXIBLE CONDUCTOR CARRIER - A method for producing a first flexible conductor carrier includes applying at least one conductor track to a base insulating film. A covering layer is applied to the conductor track and the base insulating film in such a way that, in at least one conduction region of the first flexible conductor carrier, the conductor track is completely enclosed by the covering layer and the base insulating film. The base insulating film is free of the conductor track and the covering layer in at least one insulating region. The conductor track is free of the covering layer in at least one contact region of the first flexible conductor carrier.01-21-2010
20100270059PRINTED WIRING BOARD - It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (10-28-2010
20120228009ELECTRONIC APPARATUS AND FLEXIBLE PRINTED WIRING BOARD - According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.09-13-2012
20120186860CIRCUIT BOARD - A circuit board prevents breakage at a boundary between a rigid region and a flexible region and includes a body including stacked flexible sheets, and rigid regions and a flexible region more flexible than the rigid regions. A circuit is defined by a conductor provided in the body. In the flexible region on a principal surface of the body, grooves are arranged to be in contact with boundaries between the flexible region and the rigid regions and to extend along the boundaries.07-26-2012
20120186859WIRING BOARD AND METHOD OF MANUFACTURING THE WIRING BOARD - A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the substrate and which is to be connected to the a common-electrode connection terminal of the actuator via a second bump; and a second wire having electrical continuity with the second connection electrode portion. The second connecting electrode portion is located in an edge portion of the substrate. The second wire has a conducive-material absent portion that is located between an edge of the substrate and the second connecting electrode portion.07-26-2012
20120186858FLEXIBLE CIRCUIT BOARD - A flexible circuit board includes a base film which is composed of an aluminum sheet and first protective films formed on the respective surfaces of the aluminum sheet and has a sprocket hole and a device hole, a predetermined conductor pattern which is formed on a surface of the base film, and a second protective film which is composed of aluminum and an electrically insulative film formed on a surface of the aluminum and is formed so as to cover the predetermined conductor pattern.07-26-2012
20090032289Circuit board having two or more planar sections - A single circuit board has at least two planar sections and a bent section linking the planar sections. The circuit board has a circuit layer disposed on an insulating layer to provide routings and electrical connections to the electronic components on the two planar sections. The circuit layer has at least one circuit section on each of the two planer sections and one circuit section on the bent section. The single circuit board can have a ground plane or a second circuit layer disposed on the insulting layer on the opposite side of the circuit layer. The planar sections can be located on the same plane or on different planes. The multi-section circuit board can be made from a single-plane circuit board by using a mechanical tool to bend the board into shape.02-05-2009
20090020318Circuit board, and semiconductor device - A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.01-22-2009
20090020317WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.01-22-2009
20120228010PREPREG, LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING - Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D09-13-2012
20100326706ELECTRONIC APPARATUS AND FLEXIBLE PRINTED WIRING BOARD - According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.12-30-2010
20100326705Flexible-circuit-board cable with positioning structure for insertion - Provided is a flexible-circuit-board cable having a positioning structure. A connection zone is defined in a free end of the flexible-circuit-board cable and is provided with a plurality of conductive contacts. The connection zone has a first surface on which at least one projection section is formed and a second surface. A shielding layer overlaps the projection section and a portion of the first surface. The second surface of the connection zone is also bonded to a shielding layer. When the connection zone of the flexible-circuit-board cable is inserted into an insertion space defined in a connector, the first and second local zones of the connection zone formed by the shielding layers and the projection section are put into engagement with and thus positioned and retained by walls on opposite sides of the insertion space of the connector to thereby fix within the connector.12-30-2010
20100326704SOLDERING PAD LAYOUT FOR FLEXIBLE PRINTED CIRCUIT BOARD - A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced.12-30-2010
20100326703IN VIVO SENSING DEVICE WITH A FLEXIBLE CIRCUIT BOARD AND METHOD OF ASSEMBLY THEREOF - A flexible circuit board for being inserted into an in-vivo imaging device is provided. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope. A method of assembling an in-vivo imaging device which may enclose such a full-flexible circuit board is also provided.12-30-2010
20110120755Flexible Display Apparatus and Method of Manufacturing Flexible Display Apparatus - A flexible display apparatus and a method of manufacturing the flexible display apparatus. Even if a passivation layer is thin, the passivation layer is highly planarized, thereby preventing a protective film and the passivation layer from becoming detached from each other.05-26-2011
20120261167Transparent Electrodes, Electrode Devices, and Associated Methods - Transparent electrodes, devices incorporating such electrodes, and associated methods are provided. In one aspect, for example, a method for fabricating a transparent electrode can include providing a carbon-insoluble support substrate, forming a carbon-soluble layer on the support substrate, and applying a carbon source to the carbon-soluble layer to form a plurality of graphene layers on the carbon-soluble layer. In another aspect, the method can further include providing a transparent substrate having an adhesive surface, applying the adhesive surface to the plurality of graphene layers such that the transparent substrate is adhered thereto, and removing the carbon-soluble layer and the support substrate from the plurality of graphene layers.10-18-2012
20110036619FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided are a flex-rigid wiring board having an increased shielding effect and improved productivity with reduced number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible cable section (02-17-2011
20120325525Electrode Array and Method of Fabrication - An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.12-27-2012
20120325524FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board has a first rigid wiring board having a first inner layer and a first terminal on the first inner layer, a second rigid wiring board having a second inner layer and a second terminal on the second inner layer, and a flexible wiring board connecting the boards and having third and fourth terminals on the flexible board. The first and second boards have openings and are positioned such that the boards are spaced apart and form a recess portion formed of the openings facing each other, the flexible board is in the recessed portion such that the first terminal is connected to the third terminal and the second terminal is connected to the fourth terminal, and the first board has an interlayer conductor through an insulation layer in the first board such that the conductor is not directly under the first terminal.12-27-2012
20110226513ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE - Disclosed is an electronic component package 09-22-2011
20100230139PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY - A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.09-16-2010
20120318565DUAL EPOXY DIELECTRIC AND PHOTOSENSITIVE SOLDER MASK COATINGS, AND PROCESSES OF MAKING SAME - A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.12-20-2012
20120325528BUNDLED FLEXIBLE FLAT CIRCUIT CABLE - A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.12-27-2012
20120325527BUNDLED FLEXIBLE FLAT CIRCUIT CABLE - A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.12-27-2012
20120325526BUNDLED FLEXIBLE FLAT CIRCUIT CABLE - A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.12-27-2012
20120279762COMPOSITION FOR FORMING STRETCHABLE CONDUCTIVE PATTERN, METHOD OF PRODUCING THE STRETCHABLE CONDUCTIVE PATTERN USING THE COMPOSITION, AND ELECTRONIC DEVICE INCLUDING STRETCHABLE CONDUCTIVE ELECTRODE - A method of forming a stretchable conductive pattern includes forming a base substrate; forming a plurality of non-linear trench lines that include peaks and valleys arranged at constant intervals in the base substrate; forming a polymer-metal precursor mixture pattern by filling the trench lines with a mixture of the polymer-metal precursor; converting the polymer-metal precursor mixture of the polymer-metal precursor mixture pattern into a polymer gel/metal nano-particle complex to form a polymer gel/metal nano-particle complex pattern; and primarily transferring the polymer gel/metal nano-particle complex pattern in the base substrate onto an acceptor base substrate.11-08-2012
20120279763METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE - Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.11-08-2012
20120090879FLEXIBLE PRINT CIRCUIT BENDING METHOD FOR CONNECTING IN A PHONE AND FLEXIBLE PRINT - The present invention discloses a flexible print circuit board bending method for connecting in a smart phone and a flexible print circuit board thereof. In the method, several portions of a flexible print circuit board is bend to suit multiple electronic units mounted on the front or rear casing of a smart phone. Consequently, there is only one surface of the flexible print circuit board needs to be processed to dispose connecting points, so cost of manufacturing the smart phone could be decreased. Besides, bending the flexible print circuit board to suit the electronic units could avoid space waste in the smart phone, such that helps to efficiently narrow down the scale of the smart phone.04-19-2012
20120285731ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE BONDING STRUCTURE - An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.11-15-2012
20120285732MULTI-LAYER WIRING BOARD - It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (11-15-2012
20120138342CONDUCTIVE OPTICAL DEVICE, INFORMATION INPUT APPARATUS, AND DISPLAY APPARATUS - Provided is a conductive optical device including a substrate having flexibility; structural elements which are constructed with a plurality of convex portions or concave portions with a fine pitch which is equal to or less than the wavelength of visible light arranged on a surface of the substrate; and a transparent conductive layer which is formed on the structural elements, wherein the aspect ratio of the structural elements is equal to or more than 0.1 and equal to or less than 1.8, wherein the transparent conductive layer has a surface emulating the structural elements, and wherein a conductivity with respect to the bending test is maintained.06-07-2012
20090218116BUILT-IN METHOD OF THERMAL DISSIPATION LAYER FOR DRIVER IC SUBSTRATE AND STRUCTURE THEREOF - A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.09-03-2009
20080236872Printed Wiring Board, Process For Producing the Same and Semiconductor Device - The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm10-02-2008
20120247816FLEXIBLE WIRING SUBSTRATE, METHOD FOR ASSEMBLING FLEXIBLE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING LIQUID JETTING APPARATUS - A flexible wiring substrate includes: a flexible base material; a wire provided on the base material; and an inspection wire provided on the base material, having an inspection segment which breaks up under a condition that the inspection segment is folded with not less than a predetermined curvature and a non-inspection segment which does not break up under a condition that the non-inspection segment is folded with not less than the predetermined curvature.10-04-2012
20130133930PRINTED WIRING BOARD - Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small.05-30-2013
20130133929POLYIMIDE FILM - Disclosed is a polyimide film for insulating material prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board.05-30-2013
20080257588Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material - A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material (10-23-2008
20080202797FLEXIBLE WIRING CABLE - A plurality of first output terminals is provided along one side of a circuit element, and a plurality of input terminals and a plurality of second output terminals are provided adjacently along the other opposite side thereof. Leads include a first output lead extending from the first output terminal to an output connection electrode, and a second output lead extending from the second output terminal to the output connection electrode. The second output lead is extended from the other side of the circuit element to one side of the circuit element through a surface of a flexible wiring cable opposite the circuit element and further extended in parallel with the first output lead and connected to the output connection electrode.08-28-2008
20110214905Circuit Board with Flexible Region and Method for Production Thereof - A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.09-08-2011
20130146338PRINTED FLEXIBLE MULTILAYER TWISTED-PAIR SHIELDED HIGH SPEED DATA CABLE - A twisted-pair cable and methods are disclosed. The twisted-pair cable comprises a first layer comprising a first non-conductive. A second layer is coupled to the first layer, and comprises a printed circuit patterned with first diagonal conductor segments. A third layer is coupled to the second layer, and comprises a non-conductive strip. A fourth layer is coupled to the third layer, and comprises a printed circuit patterned with second diagonal conductor segments. The first diagonal conductor segments and the second diagonal conductor segments are coupled at respective segment ends such that at least two wires are formed around the non-conductive strip. A fifth layer is coupled to the fourth layer, and comprises a second non-conductive.06-13-2013
20080196929Optical transmitter module - An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.08-21-2008
20100307797FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING SAME - To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.12-09-2010
20120273259SIGNAL TRANSMISSION DEVICES AND PORTABLE RADIO COMMUNICATION DEVICES COMPRISING SUCH SIGNAL TRANSMISSION DEVICES - In an exemplary embodiment, a signal transmission device generally includes a foldable conductive trace carrier having a first side and a second side. The carrier has a midsection between a first lateral section and a second lateral section. The midsection includes a first central primary conductive trace. First and second secondary conductive traces are respectively on each side of the primary conductive trace on the first side. The carrier is foldable for folding the first lateral section over the first side of the midsection and the second lateral section under the second side of the midsection. The first lateral section includes a first solid area of conductive material, and the second lateral section includes a second solid area of conductive material for forming a shielded conductor when the carrier is folded.11-01-2012
20130153269WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.06-20-2013
20100314159PRINTED CIRCUIT BOARD - The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.12-16-2010
20110232945TRANSPARENT CONDUCTIVE FILMS, ARTICLES, AND METHODS - Transparent conductive films, articles made from them, and methods of making them are disclosed. Some transparent conductive films include flexible glass substrates and conductive layers containing metal nanoparticles. Others include at least one layer with cell walls that contain metal nanorods or conductive nanowires. Still others include a substrate with a coating disposed on it, with the coating including conductive components and photopolymers. Such films are useful in such articles as electronic displays, touch screens, and the like.09-29-2011
20110232944LIQUID CRYSTALLINE THERMOSET OLIGOMER OR POLYMER AND THERMOSETTING COMPOSITION AND SUBSTRATE INCLUDING THE SAME - A liquid crystalline thermoset oligomer or polymer including a structural unit of Chemical Formulae 1 and 2; and a functional group of Chemical Formula A,09-29-2011
20110232946Flexible Printed Board - Flexible printed board, in particular for the spatial connection of electronic components, comprising a carrier foil (09-29-2011
20130180764Flexible Circuitry with Heat and Pressure Spreading Layers - A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.07-18-2013
20130153270FLEXIBLE DISPLAY - A flexible display including a flexible substrate, an array circuit layer, a protection film, and an adhesive layer is provided. The flexible substrate has a first surface and a second surface, disposed opposite to each other. The array circuit layer is disposed on the second surface of the flexible substrate. The protection film is disposed on the first surface of the flexible substrate. The adhesive layer is disposed between the protection film and the flexible substrate, and has a thickness, substantially greater than or equal to 30 micrometers.06-20-2013
20110303439ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME - Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.12-15-2011
20110303438Composition for Polyimide Resin, and Polyimide Resin Made of the Composition for Polyimide Resin - A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein 12-15-2011
20110308841COVERLAY FILM, METHOD FOR MANUFACTURING COVERLAY FILM, AND FLEXIBLE PRINTED WIRING BOARD - Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.12-22-2011
20080230259Method and Structure for Implementing Control of Mechanical Flexibility With Variable Pitch Meshed Reference Planes Yielding Nearly Constant Signal Impedance - A method and structure are provided for implementing flexible circuits of various electronic packages and circuit applications. A meshed reference plane includes a variable mesh pitch arranged for control of mechanical flexibility. A dielectric core separates a signal layer from the variable pitch meshed reference plane. An electrically conductive coating covers the surface of the variable pitch meshed reference plane yielding substantially constant signal impedance for the signal layer.09-25-2008
20120018197NOVEL DUCTILE METAL FOIL LAMINATE AND METHOD FOR PRODUCING THE SAME - Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer and the second polyimide layer are joined together by an epoxy adhesive, and a method of manufacturing the same. The inventive flexible metal clad laminate can maintain the intrinsic properties of polyimide, and thus, can exhibit good heat resistance and flexibility to comparable with a conventional two-layer, double-sided flexible copper clad laminate, and a manufacturing process thereof is simple and easy, thus ensuring enhanced productivity and economical effectiveness.01-26-2012
20120018196FLEXIBLE PRINTED CIRCUIT BOARD WITH WATERPROOF STRUCTURE - Disclosed is a flexible printed circuit board with waterproof structure, including a flexible substrate that has a first surface on which a first metal layer is bonded. The first metal layer has an upper surface forming a covered area and at least one mounting zone and the metal layer forms on a surface thereof within the mounting zone a bonding improved waterproof structure. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way not to cover the mounting zone of the first metal so as to expose the mounting zone. A water resistant member is securely mounted to the mounting zone of the first metal layer. The flexible substrate also has a second surface to which a second metal layer and a second insulation layer are mounted. The second metal layer also forms a mounting zone, which is not covered by the second insulation layer so as to expose for mounting the water resistant member. The metal surface inside the mounting zone also forms bonding improved waterproof structure. The waterproof structure improves the bonding strength between the flexible printed circuit board and the water resistant member through proper arrangement and selection of shape, size, and distribution density of holes that are defined in the exposed metal surface. Alternatively, the holes can be made completely through the metal layer in order to also feature control of impedance for high frequency signals.01-26-2012
20120024577POLYAMIDE FILMS FOR FLEXIBLE PRINTED CIRCUIT BOARDS - The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein the polymer film has an average coefficient of thermal expansion in plane in the temperature range of 20° C.-Tg, measured in plane with the method according to ASTM D969-08, of at most 40 ppm/K. The said film can be made from a polyamide moulding composition comprising said polyamide by film casting followed by axial stretching. The film has properties suitable for carrier films in flexible printed circuit boards.02-02-2012
20120085570POLYAMIC ACID SOLUTION, POLYIMIDE RESIN AND FLEXIBLE METAL CLAD LAMINATE USING THE SAME - Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.04-12-2012

Patent applications in class Convertible shape (e.g., flexible) or circuit (e.g., breadboard)