Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


With encapsulated wire

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

174250000 - Preformed panel circuit arrangement (e.g., printed circuit)

Patent class list (only not empty are listed)

Deeper subclasses:

Entries
DocumentTitleDate
20130025914WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a conductor electrically connected to the conductor in the first rigid wiring board, and an insulation layer formed over the first rigid wiring board and the second rigid wiring board. The first rigid wiring board has a wall surface defining the accommodation portion and having a concavo-convex shaped portion, and the second rigid wiring board has a side surface facing against the wall surface of the first rigid wiring board and having a concavo-convex shaped portion such that the concavo-convex shaped portion of the side surface of the second rigid wiring board engages with the concavo-convex shaped portion of the wall surface of the first rigid wiring board.01-31-2013
20100071935SHIELDED FLEXIBLE CIRCUITS AND METHODS FOR MANUFACTURING SAME - A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member. Said polyimide support member is flexible along at least one axis, and said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member.03-25-2010
20130037310EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.02-14-2013
20130037309TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRATED METAL BASE PACKAGING METHOD - The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit.02-14-2013
20120175153WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.07-12-2012
20120175152HIGH-SPEED SIGNAL TRANSMISSION BOARD - A high-speed signal transmission board includes a first board part including a first ground pattern, a first insulating layer formed on a first surface and a second surface of the first ground pattern, and a first electrically conductive pattern formed on a surface of the first insulating layer; a second board part including a second ground pattern, a second insulating layer formed on a first surface and a second surface of the second ground pattern, and a second electrically conductive pattern formed on a surface of the second insulating layer; and a connecting part connecting the first electrically conductive pattern of the first board part and the second electrically conductive pattern of the second board part with the first board part and the second board part facing each other.07-12-2012
20100044081LAMINATED BODY, METHOD OF MANUFACTURING SUSBTRATE, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 μm or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate.02-25-2010
20120205142WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate is configured such that each of laminate portions provided above and below a substrate core includes insulating layers and conductor layers stacked alternately. Of the conductor layers of the laminate portions, signal line layers are treated with a silane coupling treatment, which is a surface modification treatment, so that each signal line comprises a flat surface. A roughening treatment is performed on the remaining conductor layers of the laminate portions such that the surfaces of these layers are roughened. This structure provides an advantage when high-frequency signals are transmitted through the signal line layers. That is, when each signal line comprises a flat surface, an increase in conductor loss due to the skin effect can be prevented. In addition, by means of chemical bonding attained through the silane coupling treatment, the reliability of adhesion between the signal line layers and the insulating layer is sufficiently attained.08-16-2012
20100101836METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD OF PRODUCING RESIN SUBSTRATE AND COMPONENT-INCORPORATED SUBSTRATE, AND RESIN SUBSTRATE AND COMPONENT-INCORPORATED SUBSTRATE - A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.04-29-2010
20100108361WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces.05-06-2010
20130081859Multilayer Circuit Board and Manufacturing Method Thereof - A multilayer circuit board is provided, which includes multiple core boards stacked together. The core board includes an insulation layer and at least one conductor layer attached together. The conductor layer includes a circuit. The core board has at least one identification conductor disposed at an edge of at least one conductor layer. The identification conductor forms an identification pattern on a side surface of the core board along a stacking direction of the core boards. The identification patterns of the multiple core boards are different from each other on the side surface of the multilayer circuit board along the stacking direction of the core boards. A manufacturing method of the multilayer circuit board is further provided.04-04-2013
20120181065Multi-Layered Circuit Board Device - A multi-layered circuit board device includes an isolative layer and a wiring layer sequentially provided on a circuit board in a PCB, ceramic, LTCC or aluminum nitride build-up process. Thus, the thickness of the multi-layered circuit board device is small and the density of the multi-layered the circuit board device is high. Furthermore, the structure of the multi-layered circuit board device is simple and the cost of the multi-layered circuit board device is low. The layers are connected to one another in the PCB, ceramic, LTCC or aluminum nitride build-up process without having to use additional alignment target points.07-19-2012
20130048344HIGH FREQUENCY CIRCUIT BOARD - In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency signal, and the semi-rigid cable comprises a central conductor, an outer conductor, and an insulating layer between the central conductor and the outer conductor.02-28-2013
20130087365METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES - A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.04-11-2013
20130056247WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD - A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 03-07-2013
20130056246GLASS PANEL HAVING ULTRASONICALLY INTEGRATED CONDUCTING WIRES - A glazing and a process for manufacturing such a glazing, the glazing integrating a conducting wire, wherein a surface of the glazing includes a substrate made of a polymer material wherein the conducting wire is partly sunken and at the very most flush with the surface of the polymer material, or a substrate made of mineral glass or made of a polymer material onto which the conducting wire is adhesively bonded. The glazing can be applied in a transport vehicle, building trades, street furniture, interior fittings, electrical goods or electronics.03-07-2013
20120217043METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.08-30-2012
20120103664MULTILAYERED PRINTED CIRCUIT BOARD, MORE PARTICULARLY FLAME-RESISTANT AND/OR SMOKE-SUPPRESSING MULTILAYERED PRINTED CIRCUIT BOARD - In the case of a multilayered printed circuit board (05-03-2012
20130062099MULTIPLE LAYER Z-AXIS INTERCONNECT APPARATUS AND METHOD OF USE - A multiple layered apparatus and method for forming a z-axis interconnect is provided. The multiple layered apparatus comprises a protective layer, a dielectric layer, a conductive layer, and a support layer. A method for forming a z-axis interconnect using the multiple layer apparatus resulting in a thinner and less expensive structure for printed circuit board applications.03-14-2013
20130062101MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE - A multilayer wiring board includes inner-layer wiring boards each having wirings on both sides thereof; electrically insulating substrates each having through-holes filled with a conductive paste;03-14-2013
20130062100CIRCUIT BOARD STRUCTURE - Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.03-14-2013
20110011627PARTS MADE OF ELECTROSTRUCTURAL COMPOSITE MATERIAL - A rigid structural part made of laminated composite material incorporates electrically conducting cables, the structural part includes at least two structural layers including fibers held in place by a thermosetting or thermoplastic matrix, at least one conducting network layer located between two of the at least two structural layers, the at least one conducting network layer including a network of electrically conducting cables, said electrically conducting cables being arranged throughout said structural part in a substantially regular manner and being electrically insulated from said two structural layers by a dielectric material. The structural part also includes electrical connections, to which electrically conducting cables of the at least one network layer are electrically connected so as to form an electrical network by assembling several structural parts.01-20-2011
20090242238Buried pattern substrate - A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of the insulation layer, and such that the other end portion is exposed at the other surface of the insulation layer.10-01-2009
20130068508CERAMIC PRINTED CIRCUIT BOARD STRUCTURE - A ceramic printed circuit board (PCB) structure includes a ceramic substrate, silver paste layers and nano-enamel layers. A first silver paste layer of the silver paste layers is provided on the ceramic substrate. The other silver paste layers of the silver paste layers and the nano-enamel layer of the nano-enamel layers are interleaved with each other, and each silver paste layer consists of a circuit pattern for electrically connecting a plurality of electrical elements. Each nano-enamel layer except the last nano-enamel layer of the nano-enamel layers consists of an interlayer electrical connection line for electrically connecting two corresponding circuit patterns on two adjacent nano-enamel layers so as to form the ceramic PCB structure with a multilayer of circuit patterns. The working temperature and the electrical insulation are thus greatly improved.03-21-2013
20130068507Multi-Layer Wire Structure for High Efficiency Wireless Communication - A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.03-21-2013
20120111609PRINTED CIRCUIT BOARD HAVING PLATING PATTERN BURIED IN VIA - A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler.05-10-2012
20120234580CIRCUIT BOARD - A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises a conducting region surrounding a non-conducting region that is substantially centered around a point where the via intersects the surface; a smallest width dimension, e.g. diameter of the non-conducting region is greater than or equal to 4 times the diameter of the via; the via connects a conductive contact pad on one printed circuit board layer to a conductive contact pad on another printed circuit board layer, with the printed circuit board with the non-conducting region lying between the two connected layers; and the largest width dimension of the conductive contact pads on the surfaces of the printed circuit board layers connected by the via are less than the smallest width dimension of the non-conducting region.09-20-2012
20130161073METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD - A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured.06-27-2013
20120186856MULTI-LAYER FLEXIBLE PRINTED CIRCUIT BOARD FOR ELECTRONIC DEVICE - A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.07-26-2012
20120186857METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT - A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.07-26-2012
20110272178SUBSTRATE FOR AN ELECTRICAL DEVICE - Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.11-10-2011
20110284269MULTILAYER WIRING SUBSTRATE - To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer 11-24-2011
20110297426WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer.12-08-2011
20110297425WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a plurality of insulating layers; and a plurality of wiring layers being alternately laminated, wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside, a cross-sectional shape of a sidewall of the opening portion is concaved and curved, and the outermost wiring layer has a recess on a side exposed to the outside.12-08-2011
20110284268FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT - Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.11-24-2011
20110290537MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes a substrate body in turn including a plurality of conductor layers and a plurality of insulating layers that are laminated alternately. The plurality of conductor layers include an uppermost conductor layer that includes a plurality of conductor patterns and a lowermost conductor layer that includes a plurality of conductor patterns. A plurality of semiconductor devices is respectively mounted on the plurality of conductor patterns of the uppermost conductor layer. The plurality of conductor patterns of the lowermost conductor layer includes a plurality of heat releasing patterns. The plurality of heat releasing patterns is respectively provided in one-to-one correspondence with the plurality of semiconductor devices. Each of the heat releasing patterns has an area no less than an area of the corresponding semiconductor device. Each of the heat releasing patterns is connected to the corresponding semiconductor device via a corresponding heat releasing via.12-01-2011
20120097430PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME - A packaging substrate and a method of fabricating the packaging substrate. The packaging substrate includes: a dielectric layer that has an external contact surface and an opposing chip mounting surface; a circuit layer that is embedded in the dielectric layer and exposed from the external contact surface and the chip mounting surface, the circuit layer having wire-bonding pads, conductive pads, and a circuit that electrically connects the wire-bonding pads and the conductive pads, wherein the widths of the wire-bonding pads, conductive pads, and the circuit narrow gradually from chip mounting surface to the external contact surface; and a first insulating protective layer disposed on the external contact surface of the dielectric layer and covering the dielectric layer and the circuit layer, a plurality of conductive pad openings being formed in the first insulating protective layer for exposing the conductive pads. The dielectric layer is used directly as a foundation of the packaging substrate, thereby providing advantage in miniaturization, simpler fabrication procedure, and thus low cost production.04-26-2012
20120228007PRINTED CIRCUIT BOARD AND METHOD OF MANUFATURING THE SAME - Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.09-13-2012
20120228006PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION - A printed circuit board (PCB) is disclosed. The PCB includes a substrate have a top surface and a bottom surface. A first conductive layer is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net and a second signal net. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening to expose a portion of the second signal net. And, a second conductive layer is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential.09-13-2012
20090277667PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).11-12-2009
20110266034Preventing breakage of long metal signal conductors on semiconductor substrates - An apparatus includes a volume of insulator disposed over a top surface of a semiconductor substrate, a tube of soft dielectric, and a metal conductor. The insulator has a hardness of more than approximately three gigaPascals (gPa) and the soft dielectric has a hardness of less than three gPa. The tube of soft dielectric and the metal conductor are both embedded within the volume of insulator. The tube defines a central volume and the metal conductor extends in a direction through the central volume for a distance of at least one inch. The metal conductor is encircled by the soft dielectric when the apparatus is viewed in a cross-sectional plane perpendicular to the direction. The metal conductor may include a plurality of bend portions. The metal conductor does not break when the apparatus is temperature cycled over a range from zero to eighty five degrees Celsius.11-03-2011
20110266033MULTILAYER BOARD - A multilayer board includes a thermoplastic resin film layer, a pattern layer layered on the thermoplastic resin film layer, and a conductor pattern. The thermoplastic resin film layer is made of a plurality of thermoplastic resin films layered with each other, and has two adhesive layers and an interlayer located between the two adhesive layers. Each of the adhesive layers has an interlayer connector passing through the adhesive layer in a thickness direction. The conductor pattern is located on at least one of the pattern layer and the interlayer at a position opposing to the interlayer connector.11-03-2011
20120292083METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.11-22-2012
20130213692FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD - A method of fabricating a circuit board includes the following steps. A first and a second patterned conductive layer are plated on the first and the second surface of a core substrate, respectively. A first and a second extending pad are individually plated on a first and a second pad of the first and the second patterned conductive layer, respectively. A first and a second thermal-curing type dielectric layer are individually formed on the first and the second surface to cover the first and the second patterned conductive layer and the first and the second extending pad, respectively. A portion of the first and the second thermal-curing type dielectric layer respectively covering the top of the first and the second extending pad are removed. A protective film covers the second extending pad. The extending pad is removed by an etching process.08-22-2013
20120168205METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.07-05-2012
20130118780WIRELESS TERMINAL WITH REDUCED SPECIFIC ABSORPTION RATE PEAK AND IMPLEMENTATION METHOD THEREOF - The disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method.05-16-2013
20100206618Coreless Substrate and Method for Making the Same - The present invention relates to a coreless substrate and a method for making the same. The method for making the coreless substrate includes: (a) providing a carrier and a first conductive layer, wherein the carrier has a first surface and a second surface, and the first conductive layer is disposed on the first surface of the carrier; (b) forming a first embedded circuit on the first conductive layer; (c) forming a first dielectric layer so as to cover the first embedded circuit; (d) removing the carrier; (e) removing part of the first conductive layer so as to form at least one first pad; and (f) forming a first solder mask so as to cover the first embedded circuit and the first dielectric layer and to expose the first pad. Therefore, the coreless substrate of the present invention has high density of layout and involves low manufacturing cost.08-19-2010
20100206617ELECTRICAL ISOLATING STRUCTURE FOR CONDUCTORS IN A SUBSTRATE - A substrate has a first dielectric layer; a first conductive layer on the first dielectric layer; a second dielectric layer on the first conductive layer; an elongated signal conductor embedded within the second dielectric layer; a second conductive layer on the second dielectric layer; a first conductive groove and second conductive groove through the second conductive layer, the second dielectric layer, the first conductive layer and into the first dielectric layer and extending continuously along the length of and on opposing sides of the signal conductor, the grooves having conductive side walls providing an electrical connection between the first conductive layer and the second conductive layer; first and second conductive end walls joining the first groove and second groove; and at least one insulating area through at least one of the first and second conductive layers to provide conductor access.08-19-2010
20090229863Conductor Carrier and Arrangement Comprising a Conductor Carrier - A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms a first overlapping region with the first or second recess of the contact insulating film. The conductor carrier also includes an insulating region which separates the first printed conductor from the second printed conductor in an insulating manner due to the contact insulating film being less raised than outside the insulating region, and extends between the first and second recesses of the contact insulating film in a meandering manner. A configuration having the conductor carrier is also provided.09-17-2009
20090200064Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport - Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (08-13-2009
20090145630Printed wiring board and method for manufacturing printed wiring board - To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible and substantial miniaturization can be achieved. In order to achieve this object, a printed wiring board obtained by etching a metal-clad laminate including a conductive layer and an insulating layer is employed, in which a first circuit and a second circuit having different thicknesses formed in a same reference plane coexist. In addition, it is characterized in that a thicker circuit of the first circuit or the second circuit has a clad-like configuration in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked. Further, a manufacture of the printed wiring board is characterized in that a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked is a start material, and selective etching characteristic between the different kind of metal layer and the copper layer is effectively utilized.06-11-2009
20090229862MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive.09-17-2009
20120193126METHOD OF FORMING SENSORS AND CIRCUITS ON COMPONENTS - A method for depositing a powder metal onto a surface of the substrate and a substrate with conductive elements provided on a surface of the substrate are disclosed. The conductive elements are formed by cold spray depositing at least one layer of powder metal onto the surface of the substrate to form at least one conductive element on the surface of the article.08-02-2012
20100147561WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME - A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin.06-17-2010
20120103663WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a heat sink to dissipate heat generated in an electronic part mounted in an electronic part loading area on a principal surface of the wiring substrate, an encapsulation resin to cover the heat sink, an inner connection terminal having an end face electrically connected to an electrode of the electronic part, and an outer connection terminal electrically connected to the inner connection terminal via a wiring and having an end face for inputting and outputting of a signal with an external device. The encapsulation resin is arranged to cover a part of the wiring, the inner connection terminal except the end face, and the outer connection terminal except the end face. A surface of the heat sink, the end face of the inner connection terminal, and the end face of the outer connection terminal are flush with and exposed to the principal surface.05-03-2012
20130213693CIRCUIT BOARD, STRUCTURAL UNIT THEREOF AND MANUFACTURING METHOD THEREOF - A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board.08-22-2013
20130213694PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.08-22-2013
20120193128PRINTED CIRCUIT BOARD - Embodiments of the present invention provide a multi layered printed circuit board, PCB, with via holes connecting different signal layers of the PCB. The via holes are connected to pads in the signal layers and are surrounded by anti-pads in the ground layers. In accordance with further embodiments of the invention the pads have a shape wherein a first path, stretching from the center of the pad and substantially in a direction in which adjacent routing channels extend, to a first point located on the edge of the pad, is longer than a second path, stretching from the center of the pad and substantially in a direction towards the adjacent routing channels to a second point located on the edge of the pad.08-02-2012
20120193127SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.08-02-2012
20100243296DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT USING THE SAME - A dielectric porcelain composition contains a major component represented by a composition formula (BaO.xTiO09-30-2010
20100243297PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.09-30-2010
20100252304WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.10-07-2010
20100252303CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.10-07-2010
20090283299COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME - According to one embodiment, a component-embedded printed circuit board is provided with a built-in component mounted on a component mounting surface of a substrate and enclosed by an insulating layer, an interior pattern layer for heat radiation which is provided on the opposite side of the built-in component from the substrate and radiates heat generated from the built-in component, and an exterior pattern layer for heat radiation connected to the interior pattern layer for heat radiation.11-19-2009
20090107701PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME - A PCB having an adhesive layer and a semiconductor package using the same. The PCB includes a body substrate, a solder resist layer including an open portion that exposes a portion of the body substrate, and an adhesive layer formed on the body substrate in the open portion. The adhesive layer may include a solid die attach film or a liquid adhesive. A semiconductor chip may be attached to the adhesive layer. The semiconductor chip and the PCB may be molded by an encapsulant, thereby substantially covering the semiconductor chip and the PCB with the encapsulant.04-30-2009
20110030995Printed Circuit Board Removing Bonding Sheet Around Signal Transmission Line - There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer, a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer.02-10-2011
20090065239Printed circuit board and method of manufacturing the same - A printed circuit board on which protective plating has been carried out as surface treatment is provided. The printed circuit board includes a part of a wiring pattern formed with an upper surface and side surfaces of a conductive part including the wiring pattern being exposed on a substrate. Surfaces of exposed parts of the conductive part are covered with the protective plating.03-12-2009
20100059253LAMINATED GLASS COMPRISING A FIXATION DEVICE INTRODUCED IN A PORTHOLE FOR OBJECTS - In a laminated glass sheet with a fixing device introduced into a through-hole for objects, particularly for antennas, the through-hole is made up of holes of different sizes in two rigid sheets of the lamination, and the fixing device includes at least two parts introduced into the through-hole, pressing against surfaces around the edge of the through-hole, which surfaces are situated one facing the other. The two parts of the fixing device press from both sides against the surfaces around the edge surrounding the smaller hole made in the sheet, in that region of the walls of a smaller hole that exhibits an edge compression stress that is increased by heat treatment by comparison with the remainder of the surface of the sheet.03-11-2010
20120061126PASTE COMPOSITION AND PRINTED CIRCUIT BOARD - A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer.03-15-2012
20110147050PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board (06-23-2011
20080230258PRINTED CIRCUIT BOARD, DESIGN METHOD THEREOF AND MAINBOARD OF TERMINAL PRODUCT - A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board.09-25-2008
20110253422WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.10-20-2011
20120199380PRINTED CIRCUIT BOARD - The present invention concerns a printed circuit board, PCB. The PCB comprises a number of signal layers comprising routing channels and at least one ground layer being adjacent to at least one signal layer. A number of via holes connects different signal layers of the PCB. In the signal layers the via holes are connected to pads and in the ground layers they are be surrounded by anti-pads. The pads are shaped such that at least a part of a via hole connected to the pad is on the outside of, or in close proximity to, the edge of the pad, irrespective of where on the pad the centre of the via hole is positioned.08-09-2012
20090255715Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented.10-15-2009
20090139749Method For The Preparation Of A Flexible Transducer Unit, The Flexible Transducer Unit So Prepared And An Array Containing Such Flexible Transducer Units - The present invention relates to a method for the preparation of a flexible transducer unit from a wafer containing a plurality of transducer structures comprising a substrate, a metal-oxide layer, at least one mesh structure in said metal-oxide layer and electric wires including at least one first contact pad in said metal-oxide layer. The method includes the steps of: etch the metal-oxide layer to release said mesh; form a sealing layer on the mesh; form a first flexible material layer on the metal-oxide layer; and remove the substantial thickness of the substrate, sufficient to make the transducer structure flexible. Alternatively the first flexible material layer may be formed before the mesh is released. The method may further include the step of forming a second flexible layer in the back side of the wafer. A novel structure of the flexible transducer unit prepared according to the invented method is also disclosed. An array containing a plurality of the flexible transducer units is also disclosed.06-04-2009
20120031649CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.02-09-2012
20100181100COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section.07-22-2010
20110186334Apparatus with a Wire Bond and Method of Forming the Same - In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.08-04-2011
20100025081WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE - A wiring substrate includes a frame-shaped reinforcing plate in which an opening portion is provided in a center portion, an interposer arranged in the opening portion of the reinforcing plate and having such a structure that a wiring layer connected mutually via a through electrode is formed on both surface sides of a substrate respectively, a resin portion filled between a side surface of the interposer and a side surface of the opening portion of the reinforcing plate, and coupling the interposer and the reinforcing plate, and an n-layered (n is an integer of 1 or more) lower wiring layer connected the wiring layer on the lower surface side of the interposer to extend from the interposer to an outer area.02-04-2010
20090173521Wired circuit board - A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is 07-09-2009
20130192880PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion.08-01-2013
20120031650SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS - A method for manufacturing a semiconductor device that improves the reliability of a metal cap layer and productivity. The method includes an insulation layer step of superimposing an insulation layer(02-09-2012
20110114368ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME - A small-sized electronic circuit component comprising micro-wiring and a method for manufacturing the same are provided. The electronic circuit component is manufactured by a manufacturing method comprising the steps of forming a recessed portion which is to be a three-dimensional wiring in the surface of an insulating base material of the electronic circuit component comprising the wiring, forming a first metal layer which is to be an electroplated conductive layer on the surface of the insulating base material including the recessed portion, selectively forming a second metal layer which is to be the wiring only in the recessed portion which is to be the wiring, and removing the first metal layer formed on the surface other than in the recessed portion which is to be the wiring.05-19-2011
20120037403Method for Electrically Conductively Connecting Conductor Tracks in Conductor Carriers and System Comprising such Conductor Carriers - A method for electrically conductively connecting conductor tracks in conductor carriers, preferably printed circuit boards or conductor foils is disclosed. A first and second conductor carrier are provided, into which a respective conductor track is embedded, which are exposed at a contact region. For the purpose of fusing the material of the conductor tracks, said material is subjected to punctiform heating via the in the opposite direction to the exposed contact region of the first conductor carrier faces. A connection location of conductor tracks which can be produced cost-effectively and is well protected is provided as a result.02-16-2012
20120305291PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF - Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).12-06-2012
20120097429PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes: a dielectric layer having two opposite surfaces; a wiring layer embedded in the dielectric layer and exposed from the two opposite surfaces of the dielectric layer, wherein the wiring layer has solder pads, conductive pads and circuit wires electrically connecting the solder pads and the conductive pads; and a first insulating protection layer disposed on one of the two opposite surfaces of the dielectric layer to cover the dielectric layer and the wiring layer and having a plurality of openings for exposing the conductive pads, respectively. The package substrate, by directly using the dielectric layer as a base, provides a package substrate having reduced thickness and lower fabrication costs compared to the prior art.04-26-2012
20110315432METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE PATTERN AND METHOD FOR MANUFACTURING ELECTRO-OPTIC DEVICE HAVING THE TRANSPARENT ELECTRODE PATTERN - Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the transparent electrode, and forming an insulating protective layer in an edge region of the patterned transparent electrode through a printing process. In accordance with the method, the insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process so that an apparatus and method for manufacturing the insulating protective layer can be simplified, resulting in a decrease in manufacturing cost.12-29-2011
20120043114DEVICE-EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.02-23-2012
20120000695RESIN CIRCUIT BOARD - A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and the second conductor layer have a higher thermal expansion coefficient than the first conductor layer such that the thermal expansion coefficient changes gradually, allowing a stress resulting from a difference in thermal expansion coefficient to be relieved.01-05-2012
20120152595Multilayer printed circuit board and method of manufacturing the same - The present invention provides a method of manufacturing a multilayer printed circuit board including: forming a first printed circuit on a base substrate; applying a first insulator on a portion of the first printed circuit; forming a second printed circuit on the first insulator and a connection pattern of the first printed circuit; and applying a second insulator on the base substrate except the second printed circuit. According to the present invention, it is possible to simultaneously electrically connect multilayer printed circuits without a via hole.06-21-2012
20120111608Wired circuit board - A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.05-10-2012
20120012366POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND DRY FILM MANUFACTURED FROM THE SAME - The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.01-19-2012
20120055698SINGLE LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURNING THE SAME - Disclosed herein are a single layer printed circuit board and a method for manufacturing the same. The single layer printed circuit board includes: an insulating layer having a plurality of holes, which are filled with a plating layer to form circuit patterns; a first protection layer stacked on one surface of the insulating layer to protect the circuit patterns formed in the insulating layer, the first protection layer having holes for exposing portions of the plating layer of the insulating layer; and a second protection layer formed on the opposite surface of the surface of the insulating layer, on which the first protection layer is formed, to protect the circuit patterns formed in the insulating layer. According to the present invention, a thin type printed circuit board can be provided.03-08-2012
20090133904MODULE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board.05-28-2009
20120125667PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board includes a first circuit pattern formed on a core substrate; an insulating layer stacked on the core substrate to cover the first circuit pattern and having a uniform surface roughness on a nano scale; a second circuit pattern formed on the insulating layer; and a via pattern electrically connecting the first circuit pattern to the second circuit pattern and penetrating through the insulating layer.05-24-2012
20120160545CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.06-28-2012
20120160544CORELESS LAYER BUILDUP STRUCTURE WITH LGA - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.06-28-2012
20120211265FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER - The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads.08-23-2012
20120168204SYSTEM FOR DEPOSITING MICROWIRE - A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.07-05-2012
20120312584PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes a core board, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core board. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded bump pads are located on an upper surface of the insulating layer.12-13-2012
20100051324DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE - An aspect of the present invention comprises a method of forming holes in a dielectric substrate comprising the steps of applying a layer of photoresist to a dielectric substrate, exposing portions of the photoresist to actinic radiation through a photomask to form a pattern in the photoresist for an array of holes to be etched in the substrate, developing the photoresist, etching the dielectric substrate to form an array of holes, each hole extending at least partially through the dielectric substrate, and removing the excess photoresist. Another aspect of the present invention is a method of simultaneously forming holes in a dielectric substrate some of which extend partially through the substrate and some of which extend completely through the substrate. Other aspects of the present invention are dielectric substrates formed using the methods of the invention.03-04-2010
20120247812SEMICONDUCTOR DEVICE WITH POWER SUPPLY LINE SYSTEM OF REDUCED RESISTANCE - A semiconductor device with a power wiring system. The device includes a multi-level wiring structure including a lower-level wiring layer and an upper-level wiring layer over the lower-level wiring layer, and the power wiring system includes a first power supply line and a second power supply line provided as the first-level wiring layer and extending in a first direction in substantially parallel to each other, a third power supply line provided as the upper-level wiring layer and extending in the first direction with overlapping the first power supply line, the first and third power supply lines conveying first and second power voltages, respectively, which are different from each other, and a fourth power supply line provided as the upper-level wiring layer and extending in the first direction with overlapping the second power supply line, the second and fourth power supply lines conveying the second and first power voltages, respectively.10-04-2012
20120247814WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a wiring substrate, includes obtaining a laminated body in which a first copper tin alloy layer and a copper layer are arranged in sequence on a first coupling agent layer, on a first insulating resin layer, forming a seed layer on the copper layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a metal plating layer in the opening portion of the plating resist by applying an electroplating that utilizes the seed layer as a plating power feeding path, removing the plating resist, and forming a first wiring layer on the first coupling agent layer by etching the seed layer, the copper layer, and the first copper tin alloy layer while using the metal plating layer as a mask.10-04-2012
20120247813PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a metal sheet having metal members and connectors joining the metal members, forming a structure having core substrates which are connected through the connectors and which have insulation structure portions covering the metal members, respectively, cutting the connectors in the structure such that an independent core substrate having a recessed portion is formed and a respective one of the connectors is removed from the independent core substrate, and covering the recess portion of the independent core substrate with a resin. The covering of the recess portion includes either forming an interlayer insulation layer on a surface of the independent core substrate or forming interlayer insulation layers on opposing surfaces of the independent core substrate.10-04-2012
20120247811COMPOSITE CIRCUIT BOARD WITH FRACTURABLE STRUCTURE - A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable.10-04-2012
20120255764PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.10-11-2012
20120073862Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate - A wiring substrate includes a wiring pattern, which includes an upper surface forming a desired recognition mark, and a solder resist layer, which covers the wiring pattern. The solder resist layer includes a recess that entirely exposes the upper surface of the wiring pattern. The solder resist layer includes a solder resist layer formed at a region corresponding to the recess and a solder resist layer formed outside the recess. The recess entirely exposes the upper surface of the wiring pattern as the recognition mark, and the solder resist layer is formed at portions outside the upper surface of the wiring pattern.03-29-2012
20120073861PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer.03-29-2012
20120261165INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME - An interconnect device and a method for fabricating same. An embodiment of the invention includes sequential steps of providing a flexible substrate, forming vias through the flexible substrate, applying a conductive seed layer including first and second portions, applying conductive materials including first and second portions, copper plating the substrate, and then removing the second portions of the conductive seed layer and the conductive materials.10-18-2012
20120325523STRUCTURE, WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - A structure (12-27-2012
20110214903FUNCTIONAL PANEL AND METHOD FOR JOINING SAME - There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding.09-08-2011
20110220397ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic component includes forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.09-15-2011
20110220396WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a substrate containing a carbon material, a first insulating layer formed over the substrate, an interlayer formed over the first insulating layer, the interlayer including a metal plate having a smaller coefficient of thermal expansion than the first insulating layer while having a greater elastic modulus than the first insulating layer, and a second insulating layer formed over the interlayer.09-15-2011
20100230138WIRING BOARD - A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ=0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.09-16-2010
20120279758TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded therein and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the embedded conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger or touch pen) to touch.11-08-2012
20120279759TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof for an external object to touch. The second coating layer is substantially formed by mixing silicon oxide, aluminum oxide, lithium oxide and Teflon.11-08-2012
20120138340MULTILAYER SUBSTRATE - A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.06-07-2012
20130008698MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE - A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi).01-10-2013
20130020110METHOD OF MANUFACTURING FILM PRODUCT USING THERMAL ROLL IMPRINTING AND BLADE COATING, AND SECURITY FILM AND FILM INTEGRAL ELECTRIC DEVICE USING THE SAME - An aspect of the present invention provides a method of manufacturing a film product using thermal roll imprinting and blade coating. A method of manufacturing a film product using thermal roll imprinting and blade coating according to an exemplary embodiment of the present invention includes a preparing step of preparing a first transparent film; an imprinting step of transporting the first transparent film between a thermal roll provided with an imprint mask and a support roll to form a groove of a fine pattern on the first transparent film; and a blading step of filling a filling material of a paste state having at least one property of light blocking and conductivity in the groove of the first transparent film by a doctor blade.01-24-2013
20130020109Package and Manufacturing Method of the Same - Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary.01-24-2013
20130168134PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.07-04-2013
20130168135INDIVIDUALLY ADDRESSABLE BAND ELECTRODE ARRAYS AND METHODS TO PREPARE THE SAME - Band electrode arrays, methods of manufacturing, and a method of using are disclosed. The arrays have individually addressable band electrodes such that diffusion layers of the band electrodes overlap. An exemplary method of manufacturing may comprise: a first insulating layer is disposed on a substrate; a first band electrode is disposed on the first insulating layer; a second insulating layer is disposed on the first insulating layer and completely covers the first band electrode; a second band electrode is disposed on the second insulating layer; a third insulating layer is disposed on the second insulating layer and completely covers the second band electrode; the first and second band electrodes are electrically insulated from each other and individually addressable; cross-sectional surfaces of the first and second band electrodes are exposed on the test surface; and these exposed cross-sectional surfaces substantially overlap each other in a direction perpendicular to the substrate.07-04-2013
20130133928PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.05-30-2013
20130092420EMBEDDED MULTILAYER PRINTED CIRCUIT BOARD AND METHOD - An embedded multilayer printed circuit board includes first, second and third circuit substrates, and a flexible circuit substrate. The first circuit substrate includes a first base layer and a first electrically conductive layer. The second circuit substrate includes a second base layer and a second circuit layer. The second circuit substrate also defines a receiving hole. The third circuit substrate includes a third circuit layer, a third base layer, a fourth circuit layer, and an electronic element mounted on the third circuit layer. The third circuit layer and the fourth circuit layer are formed on the opposite sides of the third base layer. The electronic element is received in the receiving hole.04-18-2013
20130098663TOUCH PANEL SENSOR - A capacitive touch panel sensor in which waviness generated in a film furnished with a transparent electrode pattern can be small. The touch panel sensor according to the present invention includes a first film, a first transparent electrode pattern formed on the first film, a first adhesive layer laminated on the first film so as to cover the first transparent electrode pattern, a second film laminated on the first adhesive layer, a second adhesive layer laminated on the second film, a third film laminated on the second adhesive layer, and a second transparent electrode pattern formed on the third film, wherein Da/Db is 0.5 to 0.9 where a total thickness of the second film and the second adhesive layer is Da, and a distance between the first transparent electrode pattern and the second transparent electrode pattern is Db.04-25-2013
20130098662METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD, AND MULTI-LAYER CIRCUIT BOARD - A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer.04-25-2013
20130146335STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AND A METHOD OF FORMING THE STRUCTURE - Disclosed are embodiments of a structure with a metal silicide transparent conductive electrode, which is commercially viable, robust and safe to use and, thus, optimal for incorporation into devices, such as flat panel displays, touch panels, solar cells, light emitting diodes (LEDs), organic optoelectronic devices, etc. Specifically, the structure can comprise a substrate (e.g., a glass or plastic substrate) and a transparent conducting film on that substrate. The transparent conducting film can comprise a metal silicide nanowire network. For example, in one embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires fused together in a disorderly arrangement so that they form a mesh. In another embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires patterned so that they form a grid. Also disclosed herein are various different method embodiments for forming such a structure.06-13-2013
20130146336PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.06-13-2013
20130146337MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment of the present invention includes: an insulation layer; an inner-layer pad disposed inside the insulation layer; an inner-layer circuit wiring disposed inside the insulation layer and formed to be thinner than that of the inner-layer pad; a via connected with the inner-layer pad by penetrating the insulation layer; and an outer-layer circuit wiring formed on an outside surface of the insulation layer.06-13-2013
20080196928Method For the Production of a Functional Constructional Unit, and Functional Constructional Unit - The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which are provided with different properties are applied layer by layer, partially in some parts, so as to create an encapsulation from the first material and a strip conductor structure from the second material, one or several functional units being embedded in the layer structure and being contacted with the strip conductor structure when the materials are applied. The disclosed method makes it possible to carefully structure a unit while offering a great degree of creative freedom.08-21-2008
20120273258PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.11-01-2012
20120273257TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded into the first coating layer and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.11-01-2012
20110232943MULTILAYER WIRING BOARD - There is provided a multilayer wiring board, which has a board body formed with two opposite main surfaces and includes a first resin insulating layer, a second resin insulating layer laminated to the first resin insulating layer and a wiring pattern arranged between the first and second resin insulating layers with a first surface of the wiring pattern abutting the first resin insulating layer and a second surface of the wiring pattern abutting the second resin insulating layer. The multilayer wiring board is characterized in that the wiring pattern extends in a plane direction of the board body and is embedded in both of the first and second resin insulating layers.09-29-2011
20130180763Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.07-18-2013
20130180762Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers.07-18-2013
20110284270LOW-TEMPERATURE SINTERING CERAMIC MATERIAL AND CERAMIC SUBSTRATE - A low-temperature sintering ceramic material showing little variation in composition after firing, realizing high bending strength in a sintered body, and capable of forming a reliable ceramic substrate showing high peel strength of a surface electrode includes a main constituent ceramic material containing about 48 weight % to about 75 weight % in terms of SiO11-24-2011
20110290536WIRING SUBSTRATE - A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue.12-01-2011
20110308840WIRING SUBSTRATE - A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.12-22-2011
20130186674MULTI-LAYER PRINTED CIRCUIT BOARD (PCB) - Embodiments of the present disclosure relate to the field of printed circuit boards and particularly to a multi-layer printed circuit board. The multi-layer printed circuit board includes at least two inner-layer circuit boards, each of which has a non-circuit pattern area including a welding area. Each welding area has at least one welding hole. Further, at least one prepreg is used to fill between two adjacent inner-layer circuit boards and is melted to fill into the welding hole in a welding process. In the multi-layer printed circuit board according to the embodiments of the disclosure, a welding area is arranged in a non-circuit pattern area, and one or more welding holes are arranged in the welding area so that a prepreg between two inner-layer circuit boards can be melted filling into the welding hole(s) in a welding process, thus enhancing effectively an adhesive force binding the inner-layer circuit boards.07-25-2013
20120285730UNIVERSAL CHIP CARRIER AND METHOD - A method of fabricating chip carriers suitable for use in packaging integrated circuits and other electronic, electro-mechanical and opto-electronic devices is described. In general, a number of wires (or wires and rods) are arranged in parallel in a wiring fixture. After the wires are positioned, they are encapsulated to form an encapsulated wiring block. The wiring block is then sliced to form a number of discrete panels. Preferably, the various wires are geometrically positioned such that each resulting panel has a large number of device areas defined therein. The encapsulant in each panel effectively forms a substrate and the wire segments in each panel form conductive vias that extend through the substrate. The resulting panels/chip carriers can then be used in a wide variety of packaging applications.11-15-2012
20120018195Printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.01-26-2012
20120018194MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF - Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer.01-26-2012
20120018193Multi layer circuit board and method of manufacturing the same - There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented.01-26-2012
20130192879MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board has a core substrate including first insulation layers, first conductive patterns formed on the first insulation layers, and first via conductors formed through the first insulation layers and connecting the first conductive patterns, and a buildup layer formed on the core substrate and including second insulation layers, second conductive patterns formed on the second insulation layers, and second via conductors formed through the second insulation layers and connecting the second conductive patterns. Each of the first insulation layers includes an inorganic reinforcing fiber material, each of the second insulation layers does not include an inorganic reinforcing fiber material, and the core substrate includes an inductor having the first conductive patterns and the first via conductors.08-01-2013
20130192881PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME - Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.08-01-2013
20130199824MICROELECTRONICS DEVICE INCLUDING ANISOTROPIC CONDUCTIVE LAYER AND METHOD OF FORMING THE SAME - A microelectronics device includes a first substrate, first electrodes disposed on the first substrate, an insulating layer covering the first electrodes, the insulating layer including openings on the first electrodes, and an anisotropic conductive film on the insulating layer, the anisotropic conductive film including conductive particles electrically connected to the first electrodes through the openings.08-08-2013
20130199825COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY - Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (08-08-2013
20130199826Assembling and Packaging a Discrete Electronic Component - An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.08-08-2013
20120085569EMBEDDED STRUCTURE - An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.04-12-2012
20130206458PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - In a suspension board, a conductor layer having a predetermined pattern is formed on the upper surface of a first insulating layer. The first insulating layer has a thick portion having a large thickness and a thin portion having a small thickness. A reinforcing layer is formed on the upper surface of the first insulating layer so as to overlap with a boundary between the thick portion and the thin portion.08-15-2013

Patent applications in class With encapsulated wire