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Preformed panel circuit arrangement (e.g., printed circuit)

Subclass of:

174 - Electricity: conductors and insulators

174680100 - CONDUITS, CABLES OR CONDUCTORS

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
174256000 With particular material 925
174261000 With particular conductive connection (e.g., crossover) 734
174260000 With electrical device 480
174254000 Convertible shape (e.g., flexible) or circuit (e.g., breadboard) 354
174255000 With particular substrate or support structure 299
174251000 With encapsulated wire 150
174252000 With cooling means 119
174268000 With single conductive plane (e.g., tape, cable) 23
174253000 Micropanel 4
20110192635MICROSTRUCTURE AND MICROSTRUCTURE MANUFACTURE METHOD - A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.08-11-2011
20090038827Control Grid for Solar Energy Concentrators and Similar Equipment - This invention provides a better means to achieve affordable solar energy, as well as other technologies. It does so by improving control grids (for addressing and alignment) in solar concentrators and optical equipment in general. Thus troublesome and expensive grid material like Indium Tin Oxide (ITO) can be replaced by more manageable, hardier, and in the long run relatively less expensive nanotubes; or a carbon grid simply laid down by ordinary photocopy (Xerographic) reduction techniques. The instant invention relates to improvements in the control (addressing and alignment) grid for Solar Energy Concentrators; and similar equipment such as Optical Switches [e.g. cf. M. Rabinowitz U.S. Pat. No. 6,976,445]; and Display devices such as Dynamic Reflection, Illumination, and Projection equipment [e.g. cf. M. Rabinowitz U.S. Pat. No. 7,130,102]; as well as display equipment in general. The control grid acts to address and align active optical elements such as mirrored balls, multipainted balls, electrophoretic, and magnetophoretic cells in solar concentrators [e.g. cf. M. Rabinowitz U.S. Pat. Nos. 7,133,183 and 6,843,573]; and in other equipment. Methods of fabricating the grids are also described.02-12-2009
20130168138SUBSTRATE HAVING TRANSPARENT CONDUCTIVE LAYER, METHOD FOR PRODUCING SAME, TRANSPARENT CONDUCTIVE FILM LAMINATE FOR TOUCH PANEL, AND TOUCH PANEL - A substrate having a transparent conductive layer has a transparent conductive pattern that is not easily visually recognizable by a naked human eye on a transparent substrate and can be formed by a simple and efficient method. In the case where a transparent conductive pattern is formed on a transparent substrate, the pattern region does not include conductive regions covered with uniform transparent conductive films or a high-resistance region that is not covered with the transparent conductive film, the high-resistance region electrically insulating the conductive regions. Instead of the conductive regions or the high-resistance region, the inventors use a region having a structure including a mixture of a portion covered with the transparent conductive film and a portion not covered with the transparent conductive film, thereby solving the foregoing visual recognition issue.07-04-2013
20130186675METALLIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURE THEREOF - The present invention provides a metallized via-holed ceramic substrate having (1) a sintered ceramic substrate, (2) an electroconductive via formed in the sintered ceramic substrate, having an electroconductive metal closely filled in a through-hole of the sintered ceramic substrate, wherein the electroconductive metal contains a metal (A) with melting point of 600° C. to 1100° C., a metal (B) with higher melting point than the metal (A), and an active metal, (3) a wiring pattern on at least one face of the sintered ceramics substrate, having an electroconductive surface layer and a plating layer thereon, wherein the electroconductive surface layer consists of an electroconductive metal containing the metal (A), the metal (B), and an active metal, (4) an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate, and (5) an active layer formed in the interface between the electroconductive surface layer and the sintered ceramic substrate.07-25-2013
Entries
DocumentTitleDate
20090255714Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board - A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.10-15-2009
20130025913METHOD FOR SURFACE-TREATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate.01-31-2013
20130043062METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE - The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.02-21-2013
20130043063METHOD OF PRODUCING PRINTED CIRCUIT BOARD, AND PRINTED BOARD PRODUCED BY THE METHOD - A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.02-21-2013
20120160542CROSSTALK REDUCTION ON MICROSTRIP ROUTING - In some embodiments a plurality of differential pair traces include microstrip routing and a layer is formed over the plurality of differential pair traces. The layer formed over the plurality of differential pair traces is a thick solder mask, a dielectric layer, and/or a solder mask with a high dielectric constant. Other embodiments are described and claimed.06-28-2012
20110203835Conductive magnetic filler, resin composition containing the filler, electromagnetic interference suppressing sheet using the resin composition and applications thereof, and process for producing the electromagnetic interference suppressing sheet - There are provided a soft magnetic material in the form of particles for suppressing occurrence of electromagnetic interference which is capable of exhibiting the suppressing effect in a broad frequency range from a low frequency band to a high frequency band, as well as an electromagnetic interference suppressing sheet using the material. When a conductive magnetic filler prepared by mixing a conductive carbon with soft magnetic particles at a volume ratio of 3 to 10:50 to 70 is highly filled in a sheet material, there can be obtained an electromagnetic interference suppressing sheet which is suitable for high-density mounting to electronic equipments, has an excellent electromagnetic absorption in a near electromagnetic field, and is fully suppressed from undergoing electromagnetic reflection thereon.08-25-2011
20130043060METHOD FOR FORMING CORELESS FLIP CHIP BALL GRID ARRAY (FCBGA) SUBSTRATES AND SUCH SUBSTRATES FORMED BY THE METHOD - A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.02-21-2013
20090194318Printed circuit board and method for manufacturing the same - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method for manufacturing a printed circuit board can include forming a circuit pattern over a seed layer that is formed over an insulation layer, pressing the circuit pattern such that the circuit pattern and the seed layer corresponding with the circuit pattern are buried in the insulation layer, and removing the exposed seed layer. This method can prevent undercuts caused by etching in the seeds positioned between the circuit pattern and the insulation layer, and can thereby prevent the circuit pattern from becoming detached. Also, the adhesion between the circuit pattern and the insulation layer can be increased, making it possible to implement a finer circuit pattern over the insulation layer.08-06-2009
20130043061CIRCUIT STRUCTURE OF ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD - The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.02-21-2013
20130075134PREPARING A SUBSTRATE FOR EMBEDDING WIRE - A portion of the surface of a substrate may be prepared for mounting an antenna wire such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to the pattern for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining or removing material from adjacent the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points, securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document.03-28-2013
20100084165CERAMIC COMPACT, CERAMIC PART, METHOD FOR PRODUCING CERAMIC COMPACT, AND METHOD FOR PRODUCING CERAMIC PART - A ceramic compact having a patterned conductor is obtained by coating the patterned conductor with a slurry and then by hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.04-08-2010
20080257584Multilayer wiring board - A multilayer wiring board includes a substrate and even numbered wiring patterns. The substrate is made of an insulating material. Each of the even numbered wiring patterns is made of a conductive material, and the wiring patterns are laminated onto one another in a lamination direction via the substrate. One of the wiring patterns has a generally equivalent volume to that of a corresponding one of the wiring patterns. Here, the one of the wiring patterns is located on one plane symmetrical to a corresponding plane, on which the corresponding one of the wiring patterns is located, relative to a central position of the wiring patterns in the lamination direction.10-23-2008
20130075135PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method of manufacturing the same are disclosed. An embodiment of the present invention provides a printed circuit board in which a plurality of printing areas are formed, wherein a plurality of alignment marks are formed in each of the printing areas.03-28-2013
20100147559Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier - The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.06-17-2010
20130037308REINFORCED GLASS CELL AND METHOD FOR FABRICATING THE SAME AND COVER GLASS HAVING THE REINFORCED GLASS CELL - A method of fabricating a reinforced glass cell including the following steps is provided. First, a mother glass having a plurality of glass cell predetermined regions is provided. A portion of the mother glass disposed on the outer edge of each glass cell predetermined region is removed, so as to form at least one through trench and at least one linking bridge. Herein, the through trench exposes the periphery section of each glass cell predetermined region, and the glass cell predetermined regions are formed as an entire patterned mother glass by the linking bridges. A reinforcing process is performed to the entire patterned mother glass, so that the exposed periphery sections of the glass cell predetermined regions are formed into reinforced sections. The linking bridges are removed so as to separate the glass cell predetermined regions having the reinforced sections to form a plurality of reinforced glass cells.02-14-2013
20120175150Layout method and layout structure of touch panel electrode - A layout method of a touch panel electrode includes the steps of: providing a substrate; forming a first electro-conductive layer, having pattern blocks disposed adjacently to one another, on one side of the substrate, wherein the first electro-conductive layer is transparent; forming an alignment film on the one side of the substrate; forming an second electro-conductive layer, having wires to be connected to at least one of the pattern blocks, on the one side of the substrate; and forming a protection layer on the second electro-conductive layer to protect the second electro-conductive layer. The present invention can reduce the processes of manufacturing the conventional electrode, especially do not needs to form another electro-conductive layer and another protection layer on the other side of the substrate, and can effectively prevent the electrostatic charge effect and increase the capacitance and sensitivity.07-12-2012
20120175151SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF - A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.07-12-2012
20100163281BASE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD OF FABRICATING THEREOF - A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.07-01-2010
20090120668Cabled Signaling System and Components Thereof - An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.05-14-2009
20130032380ELECTRONIC APPARATUS - An electronic apparatus 02-07-2013
20100044080Metal Deposition - Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.02-25-2010
20100044079Metal Deposition - Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.02-25-2010
20100044078PROCESS FOR PRODUCING CIRCUIT BOARD - Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.02-25-2010
20090211786PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING - Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin.08-27-2009
20090159314SHIELDLESS, HIGH-SPEED, LOW-CROSS-TALK ELECTRICAL CONNECTOR - An electrical connector may include a first connector with electrically-conductive contacts. The contacts may have blade-shaped mating ends, and may be arranged in a centerline. The electrical connector may include a second connector with electrically-conductive receptacle contacts, which may also be arranged in a centerline. The connectors may be mated such that the mating portion of a first contact in the second connector may physically contact of a corresponding blade-shaped mating end of a contact in the first connector.06-25-2009
20100108360MEMBRANE CIRCUIT BOARD - The invention discloses a membrane circuit board including a substrate, a plurality of first signal pins and a second signal pin. The first signal pins and the second signal pin are disposed on the substrate. The substrate has a first edge. Each of the first signal pins has a first terminal, and the first terminal has a first width. The second signal pin has a second terminal, which is disposed between the first edge and the first terminal. The second terminal has a second width. The second width is larger than the first width. Accordingly, the membrane circuit board may have high error tolerance and better quality control efficiency.05-06-2010
20100084164ELECTRONIC COMPONENT MOUNTING METHOD - A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.04-08-2010
20130081858PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveling process (pre-soldering process) and an electroless gold plating process is inhibited; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film.04-04-2013
20130081857METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE AND MULTI-PIECE SUBSTRATE - A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.04-04-2013
20130081856TOUCH PANEL - A touch panel is disclosed, which includes a transparent substrate, a decorative layer, a first conductive layer, a second conductive layer and an isolation layer. The decorative layer is formed on a portion of a surface of the transparent substrate, and the other portion of the surface of the transparent substrate and the decorative layer is coated with the first conductive layer. The isolation layer is disposed between the first and second conductive layers.04-04-2013
20120181064CAPACITIVE TOUCH PANEL HAVING DUAL RESISTIVE LAYER - A patterned substrate for a touch screen sensor assembly that includes a plurality of electrodes that are formed from a first transparent conductive layer that has a first surface resistivity. The substrate also has a plurality of traces that may be used to couple the electrodes controller associated with the touch screen sensor assembly. The traces are formed from a second conductive layer that has a second surface resistivity that is less than the surface resistivity of the first conductive layer. The first and second conductive layers may be formed from indium tin oxide (ITO) having different surface resistivities. A second, similarly configured substrate can be provided and may be spaced apart from the first substrate by a dielectric spacer.07-19-2012
20090044967CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND DISPLAY DEVICE - A circuit board, an electronic circuit device, and a display device, in which generation of an edge short-circuit is prevented, includes wirings that are arranged much more densely. A circuit board includes a substrate having a first main surface on which a semiconductor integrated circuit is mounted and a second main surface; a plurality of first wirings including a bump connecting terminal on the first main surface; and a plurality of second wirings on the second main surface, wherein the plurality of the second wirings are arranged independently from each other and overlap with a region where the semiconductor integrated circuit is mounted, and the circuit board includes a wiring portion on the second main surface in a region overlapping with a region where the bump connecting terminal is arranged.02-19-2009
20130048343CIRCUIT BOARD WITH HANDLES - The circuit board includes a main body, at least one handle, and at least one connecting element. The main body defines at least one through hole. One end of each of the at least one handle defines a positioning portion. The positioning portion of each of the at least one handle extends through a corresponding one of the at least one through hole and is engaged with one of the at least one connecting elements.02-28-2013
20130048342CIRCUIT BOARD - A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.02-28-2013
20100006322Sim Card Structure - In a SIM card structure, there are included a carrier substrate and a plurality of chips. The carrier substrate is provided at a central area with at least two parallelly arranged first weakening lines, and at two laterally opposite areas with a group of equally spaced second weakening lines each. The second weakening lines in each group are perpendicularly extended from one of the first weakening line toward one lateral edge of the carrier substrate, such that a plurality of card bodies is defined on the carrier substrate. Each of the card bodies is provided at a predetermined position with a receiving area for one of the chips to attach thereto and thereby forms a SIM card. Less material and storage room are needed for manufacturing and storing the card bodies, respectively. And, each of the SIM cards can be conveniently separated from the carrier substrate for use.01-14-2010
20100326702INTEGRATED CIRCUIT ASSEMBLY - Methods and apparatus for forming an integrated circuit assembly are presented, for example, three dimensional integrated circuit assemblies. Lower height 3DIC assemblies due Use of, for example, thinned wafers, low-height solder bumps, and through silicon vias provide for low height three dimensional integrated circuit assemblies. For example, a method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.12-30-2010
20100270058METHODS FOR MAKING ELECTRONIC DEVICES - The present disclosure describes methods for making an electronic device. Methods for making electronic devices include providing a first electrode, an electro-responsive layer, and a second electrode. A first conductive nanostructured grid is deposited on a surface of the first electrode. The electro-responsive layer is facing the first conductive nanostructured grid. The electro-responsive layer is positioned between the first electrode and the second electrode. An electronic device having a first nanostructured grid deposited on a first electrode is described.10-28-2010
20090301764METHOD FOR SMOOTHING ELECTRODE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND CERAMIC SUBSTRATE - A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The base including the electrode disposed thereon is prepared and a surface of the electrode is smoothed by vibrating media such that the media are arranged to be in contact with the electrode.12-10-2009
20090301763INK, METHOD OF FORMING ELECTRICAL TRACES USING THE SAME AND CIRCUIT BOARD - An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles.12-10-2009
20090301760Method of Soldering a Module Board - As BGA's and CSP's become widespread, the number of steps in soldering module boards to rigid printed wiring boards increases. A printed circuit board warps due to heating during reflow, so even if mounting is carried out at a temperature sufficiently exceeding the melting point of a solder alloy, there was a problem of the phenomenon of fusion defects in which the solder bumps of a module board of a CSP, a BGA, or the like and the mounting paste do not fuse or parts having leads and solder paste do not fuse, resulting in conduction defects.12-10-2009
20090301761Cable assembly having connector with interior printed circuit board facilitating termination - A cable assembly includes an insulated housing (12-10-2009
20130056244PATTERNED TRANSPARENT CONDUCTORS AND RELATED MANUFACTURING METHODS - A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.03-07-2013
20130056245PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including a base substrate; and a circuit pattern formed on the base substrate and including a first metal layer having an inclined surface on both upper sides thereof and a second metal layer formed on the inclined part.03-07-2013
20130056243DISPLAY DEVICE INCLUDING TOUCH PANEL - Disclosed herein is a structure of an FPC integrated touch panel. According to preferred embodiments of the present invention, a transparent substrate configured of a flexible transparent film is provided and an extension part protruded to the transparent substrate is integrally formed with the transparent substrate, such that a separate FPC needs not to be manufactured, thereby saving process time and manufacturing costs. In addition, the exemplary embodiments of the present invention bend an inactive area unnecessarily occupying an area of the transparent substrate to a side of the touch panel, thereby implementing a touch panel widening a substantial area of an active region.03-07-2013
20120217042DEVICE FOR REFLECTING ACCELERATED ELECTRONS - The invention relates to a device by means of which accelerated electrons emitted by an electron source can be reflected onto a surface region of an object (08-30-2012
20090095509CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section is formed; cable layers being respectively laminated on the both side faces of the core section; a plated layer coating an inner face of the pilot hole; and an insulating material filling a space between the plated layer and an outer circumferential face of the plated through-hole section.04-16-2009
20090095508Printed circuit board and method for manufacturing the same - A printed circuit board and a method for manufacturing the same are disclosed. The manufacturing method includes: forming a first plating resist corresponding to the circuit pattern on a surface of each of a first carrier and a second carrier; forming a second plating resist corresponding to the pad on each of the surfaces; forming the pad by performing plating over each of the surfaces; stripping the second plating resists; forming the circuit pattern by performing plating over each of the surfaces; pressing the first carrier and the second carrier with an insulation layer interposed between the first carrier and the second carrier such that the circuit patterns face each other; and removing the first carrier and the second carrier. Since plating bars need not be used, the degree of freedom in designing circuits can be increased, and circuits of higher densities can be designed.04-16-2009
20090095507METHOD OF SELECTIVE COATING OF A COMPOSITE SURFACE PRODUCTION OF MICROELECTRONIC INTERCONNECTIONS USING SAID METHOD AND INTEGRATED CIRCUITS - The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also to processes and methods for fabricating microsystems and connectors.04-16-2009
20090056979Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module - A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.03-05-2009
20090056978MULTILAYER CERAMIC CIRCUIT BOARD HAVING PROTRUDING PORTION AND METHOD FOR MANUFACTURING THE SAME - A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring layer, and a protruding portion formed on a surface of a top ceramic wiring layer due to the disposition of the one or two or more lifting layers. The protruding portion smoothly protrudes and has a large area and high flatness. The multilayer ceramic circuit board is formed by disposing lifting layers as an inner layer of a plurality green sheets or as a lower layer lower than a bottom green sheet, and firing under pressure the resulting laminate in a state constrained by an elastic constraining sheet and a rigid constraining sheet.03-05-2009
20090056977PRODUCTION METHOD OF SOLDER CIRCUIT BOARD - A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.03-05-2009
20090266583PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE - The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy acrylate monomer, and a polymerizable monomer having a benzyl alcohol group; a laminate; a method of producing a metal plated material; a metal plated material; a method of producing a metal pattern material; a metal pattern material; and a wiring substrate.10-29-2009
20090266582THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.10-29-2009
20120222887PARTIALLY MULTILAYERED WIRING BOARD AND METHOD OF MANUFACTURING PARTIALLY MULTILAYERED WIRING BOARD - In order to provide a partially multilayered wiring board without exposing circuits of a mother board printed board even if not separately performing protection process, such as gold plating, a partially multilayered wiring board 09-06-2012
20110011626PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.01-20-2011
20090236125Multi-layer board and manufacturing method thereof - A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.09-24-2009
20130068506PLATING SYSTEM AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a plating pattern and a method of manufacturing the same. The plating pattern includes: a base substrate; a conductive polymer formed on the base substrate and patterned to be selectively deactivated by having a deactivator added thereto; and a plating layer formed on portions of the conductive polymer except for the deactivated portions.03-21-2013
20130068505PERFORATED MOTHER SHEET FOR PARTIAL EDGE CHEMICAL STRENGTHENING - Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges.03-21-2013
20090301762OLIGOMERIC HALOGENATED CHAIN EXTENDERS FOR PREPARING EPOXY RESINS - An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.12-10-2009
20120111607CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS - A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.05-10-2012
20130133927ELECTRODE STRUCTURE WITH SPATIAL INTERPOLATION FOR CAPACITIVE TOUCH PANEL - A touch panel includes first and second sets of electrodes separated by a dielectric and oriented so that the electrodes of the first set intersect with the electrodes of the second set without touching. Each of the electrodes can be made of a plurality of individual conductors shorted together. The conductors can be provided in the form of flat cable or clockspring material.05-30-2013
20120234579METHOD FOR CONTACTING A CHIP - The invention relates to a method for contacting a chip with a conductor arrangement and also to a conductor arrangement, particularly a transponder antenna, an intermediate carrier or the like, with a carrier substrate (09-20-2012
20130161070TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a touch panel and a method for manufacturing the same. A touch panel 06-27-2013
20130161071CONNECTION STRUCTURE, CONNECTION METHOD AND DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A connection structure for connecting an outer conductor of a differential signal transmission cable to a substrate includes a connecting member including a main body portion and a protruding portion protruding from the main body portion. The outer conductor is connected via the connecting member to the substrate. The connecting member is solder-connected to the outer conductor via the main body portion and is solder-connected to the substrate via the protruding portion.06-27-2013
20130161072Methods and Apparatuses for Detecting Registration Offsets - A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a printed circuit board (PCB) substrate. The first pattern has a reference scale. The method further includes transferring a second pattern to a metal layer on a second side opposite to the first side of the PCB substrate. The second pattern has a measurement scale. The second pattern is transferred by aligning an origin of the measurement scale with an origin of the reference scale in an apparatus such that at least a portion of the reference scale is overlapped with the measurement scale. The method includes etching the metal layers of the PCB substrate and measuring an offset in the patterns on the PCB substrate by using the reference scale and the measurement scale.06-27-2013
20100132980WIRING BOARD AND FABRICATION METHOD THEREFOR - A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.06-03-2010
20090314520Method and Apparatus for Spraying on a Track, in Particular a Conductor Track, and Electrical Component with a Conductor Track - A method and an apparatus for spraying a track, in particular a conductor track, onto a substrate under mild conditions, includes generating a cold plasma having a plasma temperature of less than 3000 K in a spray lance, introducing a powder into the spray lance with the aid of a carrier gas and leading the powder to a frontal exit opening, where it exits and impinges on the substrate. An electrical component including an electrically conductive conductor track applied to a substrate, is also provided.12-24-2009
20110278045Capacitive power and ground plane structure utilizing fractal elements for the reduction of radiated emissions - The construction of a capacitive Power and/or Ground plane sandwich with fractal element structures to achieve the reduction or elimination of radiated emissions as “noise” from the planes. This may be achieved in several formats, including the patterning of fractal elements on the outside edge of the ground plane, the patterning of fractal elements on the outside edge of the power plane and the patterning of fractal elements within both of the planes. Fractal element structures may also be formed on the edges of circuit lines, or other conductive elements within the printed circuit board. The ability of these fractal patterns to absorb or reject frequencies on the planes due to the operation of an electronic device on the printed circuit board enhancing and aiding the capacitive effect of the plane in the reduction or elimination of radiated emissions as electronic noise. By utilizing this design maximum quieting of electronic noise may be achieved in all axis (X,Y,Z) without the use of surface bypass capacitors or conventional techniques such as edge plating or via hole edge stitching.11-17-2011
20120186855SUBSTRATE OF TOUCH PANEL IN MANUFACTURING AND THE METHOD FOR FORMING THE SAME - A substrate is formed with a plurality of identical positioning indications which cause the coordinate on the upper or lower surfaces of the substrate are identical; the identical positioning indications is selected from one of a plurality of holes formed on an area out of the touch sensing area of the touch panel; a plurality of gaps at edges of the substrate and vertical to the upper or lower main surface of the substrate; positioning indications formed by engraving of laser; and a pair of positioning indications on the upper and lower main surface of the substrate and positioned along a same line vertical to the upper or lower main surface of the substrate; and a combination of above mentioned ways; after manufacturing process, the positioning indications can be removed or not removed. A method for forming the same is also included.07-26-2012
20110284267CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer.11-24-2011
20090166061PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB strip - A PCB strip, a PCB strip assembly device, and methods of fabricating a PCB strip and using a PCB strip assembly device are provided. According to example embodiments, a PCB strip may include a PCB main body including a working area based on a process execution unit, wherein the working area may be divided into a first working area and a second working area and a plurality of units on the working area arrayed with a given interval in at least a width direction of the PCB main body, wherein the plurality of units may be arrayed on the first working area and the second working area and units on the first working area may be symmetric to units on the second working area with respect to a point of symmetry at a center of width of the working area.07-02-2009
20110272176PATTERN ELECTRODE MANUFACTURING METHOD AND PATTERN ELECTRODE - The present invention can easily provide a method of manufacturing a pattern electrode with excellent electroconductivity and excellent transparency and a pattern electrode manufactured according to the method. The method of manufacturing a pattern electrode is characterized in that it comprises the steps of forming on a substrate an electroconductive layer containing metal nanowires, and carrying out pattern printing on the electroconductive layer employing a metal nanowire removing solution, followed by washing with water.11-10-2011
20100170699PASSIVATED THIN FILM AND METHOD OF PRODUCING SAME - A method of producing a passivated thin film material is disclosed wherein an insulating thin film layer (07-08-2010
20110297423PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board, including a base substrate, a first bump including a first metal layer formed on the base substrate and a second metal layer formed on the first metal layer, and a second bump including a third metal layer formed on the base substrate, in which the first bump has a height greater than that of the second bump. Because the heights of the first bump and the second bump are different, even when the printed circuit board warps, an electrical connection between the printed circuit board and an external substrate does not become broken. A method of manufacturing the printed circuit board is also provided.12-08-2011
20110290534PRINTED CIRCUIT BOARD - A printed circuit board includes a mounting area. The mounting area includes a first mounting portion and a second mounting portion. The first and second mounting portions partially overlap. The first mounting portion includes a number of first holes, a number of second holes, and a third hole. The first holes, the second holes, and the third hole are configured for the mounting of signal pins of a universal serial bus (USB) pin. The second mounting portion includes the first holes and a number of fixing holes. The first holes are configured for the mounting of signal pins of a USB connector. The fixing holes are configured for the mounting of fixing pins of the USB connector.12-01-2011
20110290535WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.12-01-2011
20110139490Wired circuit board assembly sheet - A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.06-16-2011
20090032287RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD USING THEM, AND MANUFACTURING METHOD THEREOF - The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.02-05-2009
20120228005METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND COLLECTIVE BOARD - A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.09-13-2012
20090101391Circuit board having barcode and fabrication method thereof - A circuit board having barcode and fabrication method thereof are disclosed. The method of the present invention includes the steps of providing a substrate body that has an insulation layer covered with a copper foil; forming a dry film on the copper foil; disposing a film having a circuit pattern and a barcode pattern on the dry film and performing an exposure process so as to harden portions of the dry film at positions corresponding to the circuit pattern and the barcode pattern; performing a development process such that non-hardened portions of the dry film are removed and portions of the dry film that are hardened are remained as an etch mask; and performing an etch process so as to remove portions of the copper foil that are exposed from the dry film. Thus, circuit and barcode are formed in the copper foil at the same time, thereby saving cost and eliminating time for manually attaching barcode.04-23-2009
20100218977PACKAGED DEVICE AND PRODUCING METHOD THEREOF - A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.09-02-2010
20120097427LAMINATED FILM AND MOLDED BODY - A laminated film includes a structure where each 200 layers or more of a layer composed of a resin A (A layer) and a layer composed of a resin B (B layer) are alternately laminated, wherein a relative reflectance in a wavelength range of 400 nm to 1000 nm is 30% or more, tensile stresses at 100% elongation in a longitudinal direction and a width direction of the film are 3 MPa or more and 90 MPa or less in a tensile test at 150° C., and the number of layers with a layer pair-thickness of 120 nm or more and less than 220 nm is 1.05 times or more to 2.5 times or less the number of layers with a layer-thickness of 220 nm or more and 320 nm or less.04-26-2012
20120097426STRUCTURE FOR SHORTING LINE CONNECTING SIGNAL LINES OF FLAT PANEL DISPLAY DEVICE - A shorting line connecting first and second signal lines arranged in parallel with each other in a flat panel display device is disclosed. The shorting line includes a first branch portion connected with the first signal line and branched from the first signal line toward the second signal line; a second branch portion connected with the second signal line and extended from the second signal line toward the first signal line; and a connection portion connecting the first branch portion to the second branch portion, wherein one end of the connection portion is connected with the first branch portion at a first angle, and another end of the connection portion is connected with the second branch portion at a second angle.04-26-2012
20090242236METHOD OF FORMING CONDUCTIVE TRACKS - A patterned electrical conductor having improved resolution and conductivity is obtained by forming a latent image by exposing, to pressure or sensitising radiation according to a desired conductive track pattern, a pressure-sensitive or photosensitive element having a support substrate and a pressure-sensitive or photosensitive material coated thereon, being capable of providing a latent image upon exposure and comprising a pressure-sensitive or photosensitive metal salt dispersed in a binder, which binder is susceptible to decomposition and/or dissolution upon treatment with an enzyme solution, developing the latent image to form a developed image formed by a first metal (e.g. silver) corresponding to the desired conductive track pattern, treating the developed image with an enzyme capable of decomposing or dissolving the binder and electroless plating and/or electroplating the developed metal image with a plating of a second metal (e.g. silver) to improve the conductivity of the developed metal image to form a conductive track according to the desired pattern, wherein the step of treating the developed image with the enzyme is prior to and/or during the plating step(s).10-01-2009
20110214902PACKAGE STRUCTURE AND ELECTRONIC APPARATUS OF THE SAME - A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.09-08-2011
20090101390Electronic control unit and process of producing the same - An electronic control unit includes a printed wiring board (04-23-2009
20090314521Method for Producing Parts for Passive Electronic Components and Parts Produced - Method for producing parts for passive electronic components according to which: a laminated strip (12-24-2009
20090151984Composite resin molded article, laminate, multi-layer circuit board, and electronic device - A composite resin molded article produced by impregnating cloth made from long fibers of a liquid crystal polymer with a curable resin composition which comprises a polymer (A) and a curing agent (B), the polymer (A) having a weight average molecular weight of 10,000 to 250,000 and containing 5 to 60 mol % of a carboxyl group or a carboxylic anhydride group; a method for manufacturing the composite resin molded article; a cured product produced by curing the composite resin molded article; a laminate made by laminating a substrate having a conductive layer (I) on the surface and an electrical insulating layer made of the cured product; a method for manufacturing the laminate; a multilayer circuit board comprising the laminate and a conductive layer (II) formed on an electrical insulating layer of the laminate; a method for manufacturing the circuit board; and an electronic device having the multilayer circuit board are provided. The composite resin molded article and the cured product thereof have excellent flame retardancy, electric insulation properties, and crack resistance, and generates only a very small amount of toxic substances during incineration. The laminate and multilayer circuit board have a low thermal expansion and a high modulus of elasticity. The conductive layer (II) exhibits high adhesion to a smooth electrical insulating layer, even if conductive layer (II) is formed on the electrical insulating layer by a deposition method and thus possesses high reliability. The multilayer circuit board has excellent electrical properties, and therefore can be used suitably as a substrate for a semiconductor device such as a CPU and memory, as well as other surface-mounted components in electronic devices.06-18-2009
20090151987COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.06-18-2009
20090071694CIRCUIT CARD AND METHOD FOR INCREASING THE RESISTANCE OF A CIRCUIT CARD TO THE FORMATION OF CONDUCTIVE FILAMENTS - The present invention relates to a circuit card (03-19-2009
20090151985METHOD OF DICING A CIRCUIT BOARD SHEET AND PACKAGE CIRCUIT BOARD - When package circuit boards are formed by dicing a circuit board sheet with a core substrate that conducts electricity, conductive material is not exposed from the outer side surfaces of the package circuit boards, thereby preventing electrical shorting of the package circuit boards. A method of dicing a circuit board sheet includes: a step of forming a circuit board sheet by forming a core portion that includes a conductive material and providing a wiring layer on the surface of the core portion; a step of forming concave channels in a thickness direction of the circuit board sheet from one surface of the circuit board sheet so as to pass through at least the core portion; a step of forming an insulating cover layer on a surface of the wiring layer and inside the concave channels; and a step of dicing the circuit board sheet within widths of the concave channels with positions of the concave channels as dicing positions.06-18-2009
20120024574PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.02-02-2012
20120024573Printed circuit board and manufacturing method thereof - There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.02-02-2012
20090145629Micromachine and Method for Manufacturing the Same - A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.06-11-2009
20100122837Circuit Board and Method of Producing a Circuit Board - A rigid circuit board is provided which contains at least one integral limb shaped to provide predetermined movement at a free end of the limb in at least two mutually perpendicular planes. The rigid circuit board provides a rewiring structure at a low cost and is adaptable for use in a wide range of applications.05-20-2010
20100139952FLUX FORMULATIONS - Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.06-10-2010
20120228003PRINTED WIRING BOARD AND ELECTRONIC DEVICE - A printed wiring board has an aperture with a continuous peripheral face. The aperture has a mounting hole portion and an insertion hole portion. The mounting hole portion is disposed adjacent to a side edge of the printed wiring board. The insertion hole portion is disposed between the mounting hole portion and the side edge of the printed wiring board. The insertion hole portion is spaced apart from the side edge of the printed wiring board by a distance that is at least equal to a thickness of the printed wiring board.09-13-2012
20100084163WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.04-08-2010
20100078199ENERGY CONDITIONING CIRCUIT ARRANGEMENT FOR INTEGRATED CIRCUIT - The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.04-01-2010
20110192634Circuit Board - A circuit board comprises at least one mounting hole for coupling a weld screw. At least one notch for receiving solder is formed in an inner wall of the mounting hole.08-11-2011
20090205851ELECTRONIC CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME - The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or the like. The invention relates to a method for manufacturing a circuit pattern-provided substrate, in which a desired circuit pattern comprising a thin film layer is formed on a substrate, which method includes: a step of forming a resist layer on the substrate; a step of forming an opening of a shape corresponding to a desired circuit pattern in the resist layer; a step of forming a thin film layer; and a step of peeling off the resist layer and the thin film layer formed on the resist layer, wherein the cross-sectional shape in the opening of the resist layer has a cross-sectional shape of eaves type having a space at a boundary part between the resist layer and the substrate, the height and the width of the space are determined such that when the thin film layer is formed in the thin film layer forming step, an end of the thin film layer formed on the substrate in the opening does not go up onto a foot of the resist layer.08-20-2009
20090260855Wired circuit board assembly sheet - A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.10-22-2009
20090188699PRINTED CIRCUIT BOARD - A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.07-30-2009
20090272562METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.11-05-2009
20090114426Wired circuit board - A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.05-07-2009
20090294153Printing using a structure coated with ultraviolet radiation responsive material - Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.12-03-2009
20090288857MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - Disclosed is a multilayer wiring board in which a copper foil is bonded by a thermocompression bonding onto an insulating layer having a bump for interlayer connection buried therein, and the copper foil and the bump are electrically connected to each other. The copper foil is provided with an oxide film having a thickness of 50 Å to 350 Å on a surface in contact with the bump and an insulating layer. In a manufacturing process, for example, an oxide coating of the copper foil to be subject to the thermocompression bonding is removed by acid cleaning, and then an oxide film having an appropriate thickness is formed by irradiating the copper foil with ultraviolet light. Consequently, reliability in electrical connection between the copper foil and the burn is adequately ensured, while achieving sufficient mechanical connection strength between the copper foil and the insulating layer.11-26-2009
20090294152PRINTED CIRCUIT BOARD - A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid.12-03-2009
20090139747Substrate panel - A substrate panel is disclosed. The substrate panel may include a pair of clamp contacts, a plurality of bus lines located between the pair of clamp contacts, and a plurality of substrate units supplied with an electric current by way of the plurality of bus lines, where the bus lines closer to the proximal clamp contact are arranged with larger intervals.06-04-2009
20110203836PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 08-25-2011
20090166060Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring Board - An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.07-02-2009
20080251279WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.10-16-2008
20110266032CIRCUIT LAYOUT STRUCTURE - A circuit layout structure includes a wafer having at least a cell region and a scribe line region defined thereon, a metal pattern formed in a first insulating layer in the scribe line region, a second insulating layer and a hard mask layer formed on the metal pattern and the first insulating layer, and at least a dummy pattern formed in the second insulating layer and the hard mask layer in the scribe line region. The dummy pattern has a transmission rate between 0% and 1%.11-03-2011
20110180305ELECTRODE ARRAY AND METHOD OF FABRICATION - An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.07-28-2011
20090166059CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, a main circuit, and two shielding circuits. The dielectric layer has an active surface. The main circuit is embedded in the dielectric layer and the shielding circuits are disposed at the dielectric layer. The shielding circuits are respectively located at two sides of the main circuit. The thickness of the shielding circuits is larger than the thickness of the main circuit.07-02-2009
20090166058PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer having a base portion, and at least two extending portions. The at least two extending portions are extended from edges near at least one corner of the base portion for preventing the PCB from forming constructive interferences and lowering the resonance magnitude thereof.07-02-2009
20080277144METHOD FOR INDICATING QUALITY OF A CIRCUIT BOARD - A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around each circuit board unit and extended to form a plating trace in an inner-layer circuit structure of each circuit board unit. The inner-layer circuit structure is inspected in quality to maintain or break connection between the plating trace and plating bus if the quality is good or not. At least one circuit structure is formed on the inner-layer circuit structure and electrically connected to the plating trace to form a conductive mark on each circuit board unit. A metal protection layer is formed on the at least one circuit structure via the plating bus, and the conductive mark with the metal protection layer indicates that the inner-layer circuit structure of the circuit board unit is good.11-13-2008
20080277141CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME - A circuit board including a dielectric layer, a circuit layer, at least one conductive joint column, and a solder mask layer is provided. The circuit layer having at least one pad is in contact with the dielectric layer. The conductive joint column is disposed on the pad. The solder mask layer is disposed on the dielectric layer and covers the circuit layer. The solder mask layer is in contact with the conductive joint column, and the conductive joint column penetrates the solder mask layer. A height of the conductive joint column is larger than a thickness of the solder mask layer. The enhanced reliability of bonding between another component and the conductive joint column will be provided. Further, a method of fabricating a circuit board is also provided.11-13-2008
20080283277WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD - A wiring board 11-20-2008
20080283276WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.11-20-2008
20080289858PRINTED CIRCUITS AND METHOD FOR MAKING SAME - A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.11-27-2008
20080308302Printed circuit board with anti-oxidation layer - An anti-oxidant printed circuit board includes at least one layer of insulative base board, some circuits on the base board, at least one electric pad and a notch. The electric pad includes an upper surface plated with at least one layer of anti-oxidant metal foil, a lower surface attached to the base board, a connecting portion connected to the circuit and having a first side surface, and a matching portion connected to complementary connector and having a second side surface. The notch is formed on the second side surface and filled with antioxidant.12-18-2008
20080308300METHOD OF MANUFACTURING ELECTRICALLY CONDUCTIVE STRIPS - A silver layer (12-18-2008
20080277142Wired circuit board - A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 11-13-2008
20080257583LAYOUT CIRCUIT - The layout circuit comprises a first 3×2 grid array and a second 3×2 grid array. The first 3×2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential contact points are arranged diagonally into the first 2×2 array and the first and second signal contact points are also arranged diagonally into the first 2×2 array. The second 3×2 grid array comprises fourth, fifth and sixth signal contact points and the third and fourth fixed potential contact points are coupled to the first fixed potential. The third and fourth fixed potential contact points are arranged diagonally into the second 2×2 array and the fourth and fifth signal contact points are also arranged diagonally into the second 2×2 array.10-23-2008
20080283275Metal Deposition - A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed regions of the adjacent catalytic layer inactive. The laser-patterned substrate is then exposed to a reaction solution which initiates the growth of a metal film on the unexposed regions of the catalytic layer.11-20-2008
20120292082ANISOTROPIC CONDUCTIVE FILM - In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a conductive particle-containing layer containing a polymerizable acrylic compound, a film-forming resin, a polymerization initiator, and conductive particles, the insulating adhesive layer and the conductive particle-containing layer each contain a thiol compound in order not to decrease the adhesion strength to an adherend and to improve connection reliability. Examples of the thiol compound may include pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), and dipentaerythritol hexakis(3-mercaptopropionate).11-22-2012
20080308301PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD - The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole.12-18-2008
20130118779CLEARANCE FILLING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A clearance filling PCB includes pin contact units on a surface of the external layer of the PCB and clearance filling units formed by molding a clearance between the pin contact units and polishing an insulating layer so that the height of the insulating layer becomes equal to the height of the pin contact units in order to prevent the sliding of a fine pitch circuit with a pin and induce accurate contact between the fine pitch circuit and the pin, and a method of manufacturing the same. The height of the insulating layer is made equal to the height of the pin contact units by molding the clearance between the pin contact units on the surface of the external layer of the PCB, and the sliding of a fine pitch circuit, requiring contacts, with a pin can be prevented.05-16-2013
20090032285MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE - A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.02-05-2009
20080271912PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Provided is a printed circuit board which can be improved in plating adhesiveness to give high reliability and productivity by reducing development residues in opening portions such as a minute pad formed in a predetermined region of an alkali development type solder resist layer, and a manufacturing method thereof. An alkali development type solder resist layer containing a carboxyl group-containing urethane (meth)acrylate compound as a carboxyl group-containing resin is formed on a substrate surface with a conductor pattern formed thereon, and the alkali development type solder resist layer is exposed in a predetermined opening pattern, developed in a dilute aqueous alkaline solution, washed with water containing 30 to 1,000 ppm of divalent metal ions, and then thermally cured to form an opening portion at a predetermined position of the alkali development type solder resist layer.11-06-2008
20080271911Submerged Electrode and Material Thereof - [Problems] To provide an electrode that is stable in liquid and is capable of processing a large volume of liquid and a small electrode that is capable of processing a large volume of liquid at high speed; provide a liquid processor and method of processing liquid in which the electrode is used; provide and electrode material being hard to be damaged by thermal stress; and provide an electrode, liquid processor and method of processing liquid in which the electrode material is used.11-06-2008
20110203834PRINTED CIRCUIT BOARD - There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.08-25-2011
20090139748WIRING SUBSTRATE - A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.06-04-2009
20090025961Electronic component-embedded board and method of manufacturing the same - A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 01-29-2009
20090025960CABLE-TYPE COMPOSITE PRINTED WIRING BOARD, CABLE COMPONENT, AND ELECTRONIC DEVICE - An embodiment of the present invention is provided with a first wiring board, a cable component juxtaposed with the first wiring board, and second wiring boards laminated onto the first wiring board, which have a second conductor layer pattern connected to the cable component and a second insulating substrate. The cable component comprises a cable having a conductor wire and a sheath portion insulating the conductor wire and a planetary gear-shaped conductor wire coupler connected to the conductor wire and having conductor wire projections which, by passing through the second insulating substrate, abut against the second conductor layer pattern.01-29-2009
20090139745REPAIR DEVICE FOR PRINTED CIRCUIT BOARD - A repair device for a PCB includes a clamp portion having a plurality of receptacles defined therein, a connector head having a plurality of contacts configured to connect with the PCB, a plurality of conductive lines arranged side by side, and a lead wire. One end of each of the conductive lines is clamped by the clamp portion and exposed to outside of the clamp portion via a corresponding receptacle of the clamp portion, the other end of each of the conductive lines is connected to a corresponding contact of the connector head. Two ends of the lead wire are electrically connected to two of the conductive lines via the corresponding receptacles, thereby switching signal transmission from one of the input terminal of the PCB to another input terminal of the PCB.06-04-2009
20120138339METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE - The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material (06-07-2012
20120138336PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern.06-07-2012
20090250247CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board including a first dielectric layer having a first surface and a second surface, a first circuit layer, a second dielectric layer, and a second circuit layer is provided. At least one trench is formed on the first surface, and the first circuit layer is formed on an inside wall of the trench. In addition, the second dielectric layer is disposed in the trench, and covers the first circuit layer. The second circuit layer is disposed in the trench, and the second dielectric layer is located between the first circuit layer and the second circuit layer. A manufacturing method of the circuit board is further provided.10-08-2009
20090250246SOLDER BY NUMBERS, A METHOD AND SYSTEM FOR POPULATING PRINTED CIRCUIT BOARDS - An electronic circuit assembly comprises a printed circuit board including a plurality of electrically-conductive traces disposed on at least one face of the printed circuit board and a circuit schematic layout. The plurality of electrically-conductive traces is configured to mount and electrically couple a plurality of types of electronic devices. The circuit schematic layout includes a map arranged similarly to the layout of the plurality of electrically-conductive traces disposed on the at least one face of the printed circuit board. A plurality of layout column markers and a plurality of layout row markers and a plurality of color-coded regions are marked directly onto the map. Each color of the plurality of color-coded regions is indicative of a particular one of the plurality of types of electronic devices.10-08-2009
20120067622Protective Cover For A Flexible Printed Circuit Board - The invention relates to a protective cover (03-22-2012
20090200063EMBEDDED SPARK GAP - A multilayer printed circuit board may include a first layer, a second layer, and a third layer, the second layer being between the first layer and the second layer. The second layer may include a spark gap.08-13-2009
20090084582Printed circuit board having stepped conduction layer - A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, where the connecting region is stepped to a lower height than those of the base regions. The stepped conduction layer in the printed circuit board can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc.04-02-2009
20110139489PRINTED CIRCUIT BOARD - A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed on one surface of the insulation substrate and connected to a second power source, a separator, which separates the first ground from the second ground, a first signal line, which is stacked on at least one of the first ground and the second ground, and a second signal line, which is stacked on at least one of the first ground and the second ground and is adjacent to the first signal line. The separator can include a curved part, which is bent in between the first signal line and the second signal line.06-16-2011
20090114425CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME - A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.05-07-2009
20090229860Green sheet for multi-layered electronics parts and manufacturing method for green chip using the same - The present invention relates to a green sheet for multi-layered electronics parts and a manufacturing method of a green chip using the same. The present invention provides a green sheet for multi-layered electronics parts including a green sheet; and an internal electrode formed on the green sheet and having a gap formed therein.09-17-2009
20110220395CARRIER SYSTEM WITH MULTI-TIER CONDUCTIVE POSTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a carrier system includes: providing a carrier base; forming a recess in the carrier base with the recess around a planar surface; forming a first barrier on the planar surface; forming a second barrier on the carrier base in the recess; forming a first post on the first barrier; and forming a second post on the second barrier.09-15-2011
20090211785PRINTED CIRCUIT BOARD WITH EDGE MARKINGS - A multilayer printed circuit board may include traces that are printed on selected layers of the board so that the traces extend to the edge of the corresponding layer. When the layers are assembled together, the ends of the traces may be viewable on a side of the printed circuit board. The traces may be arranged to convey information. For example, trace ends may be readable as one or more binary words, as alphanumeric characters or as a bar code.08-27-2009
20090211787PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body, and a write wiring trace and a read wiring trace are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring traces. A write wiring trace and a read wiring trace are formed on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring traces. The width of the wiring trace is larger than the width of the wiring trace, and the width of the wiring trace is larger than the width of the wiring trace.08-27-2009
2009022985910G XFP compliant PCB - The present invention is a specially designed PCB that allows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield connecting to the EMI gasket, guard ground traces in the second layer surrounding the differential pair signal traces, openings in the copper of the third layer beneath the XFP cage ground shield and XFP connector pads, and ground vias at the XFP connector and PHY connector pads.09-17-2009
20090229861WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are disposed in the first openings and in the second openings. In addition, top portions of the solder bumps disposed in the first openings have a flat face, while top portions of the solder bumps disposed in the second openings have a non-flat face.09-17-2009
20100012353ELONGATED SEMICONDUCTOR DEVICES, METHODS OF MAKING SAME, AND SYSTEMS FOR MAKING SAME - A patterned conductive layer is disposed around a nonplanar substrate, where a boundary of the conductive layer is defined by a single groove that traverses a perimeter of the substrate a plurality of times. A patterned conductive layer is disposed around a nonplanar substrate, where the patterned conductive layer is divided into a plurality of conductive islands by a groove that extends through a thickness of the conductive layer and traverses a perimeter of the substrate a plurality of times, and a groove extends through the thickness of the conductive layer and traverses a length of the substrate. A method of patterning a conductive layer disposed around a nonplanar substrate includes scribing the conductive layer thereby forming a continuous groove that traverses a perimeter of the conductive layer a plurality of times.01-21-2010
20090260856ELECTRONIC COMPONENT MODULE - An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes outer peripheral land rows, each of which is arranged in a line along each side of the rear surface with the exception of corner portions of the rear surface. The plurality of bonding material applying lands includes corner portion inner lands, each of which is arranged on the rear surface at a location that is shifted inwardly in a substantially diagonal direction from the corner portion and is adjacent to the bonding material applying lands closest to the corner portion at ends of the outer peripheral land rows that are arranged in lines along two sides that are connected by the corner portion.10-22-2009
20100263913METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS - In one embodiment, a sub-pad assembly of metal structures is located directly underneath a metal pad. The sub-pad assembly includes an upper level metal line structure abutting the metal pad, a lower level metal line structure located underneath the upper level metal line structure, and a set of metal vias that provide electrical connection between the lower level metal line structure located underneath the upper level metal line structure. In another embodiment, the reliability of a C4 ball is enhanced by employing a metal pad structure having a set of integrated metal vias that are segmented and distributed to facilitate uniform current density distribution within the C4 ball. The area10-21-2010
20100263914Floating Metal Elements in a Package Substrate - A plurality of metal elements formed in an electronic package. The electronic package includes an electronic substrate and a plurality of metal elements disposed in a layer of the substrate. The plurality of metal elements do not serve an electrical function in the layer. Also, each of the plurality of metal elements is floating in the layer. In another embodiment, a method for optimizing the design of a package substrate is provided. The method includes identifying a space in a layer of the substrate that is free of metal and forming a plurality of metal elements in the identified space, where the plurality of metal elements do not serve an electrical function.10-21-2010
20100147558Anchor pin lead frame - In some embodiments, a surface mount component includes a housing and one or more leads extending from the housing, wherein the one or more leads define respective voids through respective ends of the one or more leads. For example, the one or more leads may define a through-hole at respective ends of the one or more leads. For example, the fixing material may include solder. For example, the solder may form a pin which helps secure the surface mount component to the printed circuit board. Other embodiments are disclosed and claimed.06-17-2010
20100147560WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure.06-17-2010
20120103662Printed circuit board and manufacturing method thereof - Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.05-03-2012
20100193222Array Substrate, and Method for Repairing Thereof, and Display Panel and Display Apparatus Comprising the Same - An array substrate includes: a base having an active region and a peripheral region adjoining to the active region; a plurality of signal lines disposed on the base; and at least one repair structure disposed on the peripheral region and having at least one first repair line and at least one second repair line having a first sub-line and a second sub-line. The first sub-line is located between the first repair line and the second sub-line. The signal lines have a plurality of groups; the first repair line crosses over at least two of the groups of the signal lines; and at least one of the groups of the signal lines is crossed over by only one of the first sub-line and the second sub-line.08-05-2010
20090288858CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a circuit structure is provided as follows. Firstly, a base conductive layer is formed on the carrier board and a first patterned plating-resistant layer having at least one trench for exposing a part of the base conductive layer is formed on the base conductive layer. A first patterned conductive layer is then formed in the trench and a second patterned plating-resistant layer is formed which covers a part of the first patterned conductive layer and a part of the first patterned plating-resistant layer. A second patterned conductive layer is formed on the exposed first patterned conductive layer. The first and the second patterned plating-resistant layers and the base conductive layer exposed by the first patterned conductive layer are removed. Then, a patterned solder mask is formed for covering a part of the first patterned conductive layer.11-26-2009
20100186994IMPROVEMENTS IN AND RELATING TO MANUFACTURE OF ELECTRICAL CIRCUITS FOR ELECTRICAL COMPONENTS - A method of forming an electrical circuit for an electrical component comprises the steps of; producing an electrical circuit from a planar conductive material, the circuit including tracks and tie bars between tracks; over-moulding the electrical circuit ith plastics material leaving tie bars in apertures; and removing the tie bars after the over-moulding process.07-29-2010
20100258336POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT - Provided are a positive photosensitive resin composition that is developable in an alkaline aqueous solution and gives a good shaped pattern that is excellent in heat resistance and mechanical property, a method for producing the pattern and an electronic component. The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure represented by a general formula (3) crosslinkable or polymerizable with said component (a).10-14-2010
20090314519Direct layer laser lamination for electrical bump substrates, and processes of making same - A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug.12-24-2009
20100218978METHOD OF MAKING AN ELECTRICAL CIRCUIT - A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.09-02-2010
20100155106METHOD AND APPARATUS FOR OPTICAL DIFFERENTIATION TO DETECT MISSING COMPONENTS ON A CIRCUIT BOARD - Implementations of the present invention may involve methods for providing an optical differentiation on a printed circuit board to assist in identifying a missing or improperly mounted component. The optical differentiation may be such that, when a component of the board is missing or improperly attached to the board, a distinct optical difference is created on the board in the visible or non-visible spectrum. Several implementations may create a visible color difference, a non-visible mark, a recognizable shape, texture change, cross hatching or other form of physical modification beneath the component or on the printed circuit board. Other implementations may include the optical differentiation within a silk-screen of the board or on an internal layer of the board.06-24-2010
20090078451PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.03-26-2009
20100230137METHOD FOR MANUFACTURING CONDUCTIVE PATTERN FORMING BODY - A method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. The method for manufacturing a conductive pattern forming body includes a process of preparing a pattern forming body substrate including a base material, and a photocatalyst containing layer formed on the base material including a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced; a process of forming wettability pattern including a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy; a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and a process of forming a conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.09-16-2010
20100276182METHOD FOR HOT EMBOSSING AT LEAST ONE CONDUCTOR TRACK ONTO A SUBSTRATE AND SUBSTRATE HAVING AT LEAST ONE CONDUCTOR TRACK - In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.11-04-2010
20100243295NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF - A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.09-30-2010
20100252302CIRCUIT BOARD FOR MULTI-TYPE HEAT DISSIPATING DEVICES - The invention discloses a circuit board. The circuit board includes a body having an electric component holding portion according to the invention. A plurality of groups of fixing holes for fixing various types of heat dissipating devices are formed on the body adjacent to the electric component holding portion. With such a systematized layout, as a result, the number of fixing holes arranged is increased to improve the compatibility of circuit board for various heat dissipating devices, in spite of a limited space allowed on the circuit board.10-07-2010
20100000765SUBSTRATE FOR A DISPLAY PANEL, A DISPLAY PANEL HAVING THE SUBSTRATE, A PRODUCTION PROCESS OF THE SUBSTRATE, AND A PRODUCTION PROCESS OF THE DISPLAY PANEL - A substrate for a display panel in which insulation breakdown of an insulating film can be prevented, a display panel having the substrate, a production process of the substrate and a production process of the display panel.01-07-2010
20090020315AUTOMATED DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS AND MULTILAYER PRINTED CIRCUITS - A method for making multilayer printed circuits includes a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, b) imaging the coated substrate with a circuit design, c) developing the imaged substrate, d) directly plating the developed image onto the coated substrate, e) coating the plated substrate with a liquid photoimageable cover coat, f) imaging the coated plated substrate with a predesigned circuitry, g) developing the liquid photoimageable cover coat, and repeating steps a) through d). Steps e) through g) are then repeated followed by steps a) through d) until a desired number of layers is achieved for the multilayer circuit. The method may be automated by having a conveyer like system which automatically unrolls and directs a roll of non-metallized substrate through various coating, imaging, developing, and plating stations.01-22-2009
20090020314DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS - A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.01-22-2009
20090020313CIRCUIT LOGIC EMBEDDED WITHIN IC PROTECTIVE LAYER - A system comprising a first layer comprising one or more metal sub-layers and a protective overcoat (PO) layer adjacent to the first layer. The PO layer is adapted to protect the first layer, and a circuit logic is at least partially embedded within the PO layer. The circuit logic couples to one of the metal sub-layers.01-22-2009
20100200276IMPLEMENTATIONS OF TWISTED DIFFERENTIAL PAIRS ON A CIRCUIT BOARD - A twisted differential conductor pair is formed on a circuit board that includes first-third conductors. The second conductor includes first-third portions. The second portion of the second conductor extends between an end of the first conductor and an end of the third conductor, and couples an end of the first portion of the second conductor to an end of the third portion of the second conductor. A solder mask layer is formed over the first, second, and third conductors on the circuit board. An end of the first conductor and the end of the third conductor are exposed through the solder mask layer. The exposed end of the first conductor is coupled to the exposed end of the third conductor over the solder mask layer with a bridge. This configuration may be repeated to create multiple twists along the twisted differential conductor pair.08-12-2010
20090260854ELECTRONIC CIRCUIT BOARD - A resist opening 10-22-2009
20090188700Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base material - An electrode substrate of the present invention includes a first conductive layer made of a first conductive material and a second conductive layer made of a second conductive material formed on a transparent base material, wherein the first conductive layer is formed on the transparent base material, the second conductive layer is formed on the transparent base material to cover the first conductive layer, both the first conductive layer and the second conductive layer form a fine wiring pattern, the second conductive layer has a width not less than 1.5 times and not more than 300 times that of the first conductive layer, and the second conductive material has a light transmissivity higher than that of the first conductive material, and a conductivity lower than that of the first conductive material.07-30-2009
20100218979Conductivity Enhanced Transparent Conductive Film and Method of Making the Same - Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film by dipping the carbon nanotube composite film in an acid solution, followed by washing the carbon nanotube composite film with distilled water and drying the washed carbon nanotube composite film to form a transparent electrode on the base substrate. The transparent conductive film can have excellent conductivity, transparency and bending properties following acid treatment, so that it can be used in touch screens and transparent electrodes of foldable flat panel displays. Further, the carbon nanotube composite conductive film can have improved conductivity while maintaining transparency after acid treatment.09-02-2010
20090139746Substrate panel - A substrate panel is disclosed. The substrate panel may include a clamp contact, a bus line formed at a distance from the clamp contact, and a plurality of substrate units supplied with an electric current by way of the bus line, where an insulation part may be formed between the clamp contact and the bus line, through which electricity may not flow.06-04-2009
20080302558PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME - This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.12-11-2008
20090107699Method of manufacturing printed circuit board and printed circuit board manufactured by the same - A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.04-30-2009
20080264672Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same - A process for preparing a photoimprinted film, a composition for forming a photoimprinted film and a photoimprinted film comprising a dielectric constant of less than about 3.5. The method includes providing a material film having a composition including at least one silica source capable of being sol-gel processed, at least one photoactive compound and at least one solvent; and water. The composition contains less than about 0.1% by weight of an added acid. A mold having mold features is provided. The mold is positioned in sufficient contact with the material film to allow the material to contact at least a portion of the mold features. The material film is then exposed to a radiation source and the film is cured to form a solidified material film. The mold is separated from the solidified material, wherein the material includes film features corresponding to the mold features.10-30-2008
20090071693NEGATIVE PHOTOSENSITIVE MATERIAL AND CIRCUIT BOARD - To provide a negative photosensitive material containing a quaternary ammonium salt in an amount of 5 to 30 weight parts based on 100 weight parts of a polyimide precursor having repeating units of the following general formula (I), wherein said quaternary ammonium salt is a photobase generator for generating a tertiary amine by irradiation with an active ray, and said tertiary amine contains one or more nitrogen atoms and oxygen atoms respectively in a molecule,03-19-2009
20090107700PRINTED BOARD - A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate member from a terminal portion where the terminals are formed, and a plurality of slits are formed extending in a direction perpendicular to the specific arrangement direction.04-30-2009
20100294542SUBSTRATE FOR ELECTRICAL DEVICE - Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.11-25-2010
20100294541DISPLAY DEVICE - A display device includes: a first line and a second line which are arranged adjacent to and parallel to each other in a spaced-apart manner; a conductive layer which is arranged at a position where the conductive layer overlaps with the first line and the second line; and an insulation layer which is interposed between the first and second lines and the conducive layer. Here, the conductive layer includes a first overlapping portion which overlaps with the first line, a second overlapping portion which overlaps with the second line, and a connecting portion which connects the first overlapping portion and the second overlapping portion between the first overlapping portion and the second overlapping portion.11-25-2010
20110127070EMBEDDED PRINTED CIRCUIT BOARD, MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.06-02-2011
20110127069PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer, and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined, when the distance between the pair of differential transmission lines is greater or less than the first distance, an eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines increases. A second distance less than the first distance is set between the pair of differential transmission lines which makes the eye width and the eye height meet requirement of the differential transmission lines for the eye diagram.06-02-2011
20090065238PRINTED CIRCUIT BOARD - An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.03-12-2009
20120241196CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A circuit board includes a substrate and a conductor layer disposed on the substrate. The conductor layer includes conducting wires and gapped electrostatic protected areas (EPAs) forming a reticulated pattern and electrically isolated from the conducting wires. The manner and method of construction of the circuit board reduces warping and bulging, to induce more reliable component connections. A method for manufacturing the circuit board is also provided.09-27-2012
20120145437WIRING BOARD AND ELECTRONIC COMPONENT DEVICE - A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.06-14-2012
20100132981PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.06-03-2010
20110061899PIXEL ARRAY - A pixel array including first signal lines, second signal lines, switch devices, and pixel units coupling to the first signal lines and the second signal lines through the switch devices is provided. The first signal lines and the second signal lines are formed on different films. Each of the pixel units includes a common electrode line. In each of the pixel units of an i03-17-2011
20090032286Epoxy Resin Composition - To provide an epoxy resin composition that can afford a printed wiring board excellent in heat resistance, adhesiveness, prepreg storage stability, and insulation reliability.02-05-2009
20090032288CONNECTOR AND PRINTED CIRCUIT BOARD - A connector including a first pin and a second pin is disclosed. The first pin includes a first side including a first protrudent part. The second pin includes a second side facing the first side. The first protrudent part approaches the second side.02-05-2009
20110240344DEPOSITION OF NANOWIRES AND OTHER NANOSCALE OBJECTS ON SURFACES - The present invention generally relates to the deposition of nanowires and other nanoparticles on surfaces. According to one aspect of the invention, a fluid containing nanoscale objects, such as nanowires, is deposited on a surface having one or more relatively hydrophilic regions and one or more relatively hydrophobic regions. If the fluid is hydrophilic, it will preferentially be located in the relatively hydrophilic regions (or vice versa if the fluid is relatively hydrophobic). The fluid is then allowed to evaporate to cause the nanoscale objects to deposit. For instance, the rate of evaporation may be controlled so as to allow the nanoscale objects to substantially deposit at the centers of the regions and/or at a rate that causes the nanoscale objects to become substantially aligned. In some cases, the regions may be relatively small, e.g., having a minimum surface dimension of less than about 3000 nm. In one set of embodiments, one or more cylindrical droplets may be formed on the surface. For example, the surface may contain a relatively hydrophilic region, having a large surface aspect ratio, surrounded by a relatively hydrophobic region, such that an aqueous fluid deposited on the relatively hydrophilic region forms a cylindrical droplet. Other aspects of the present invention are directed to methods for creating and using such articles, methods for promoting such articles, or the like.10-06-2011
20110209900CABLE GUIDE AND METHOD OF CABLE TERMINATION - A cable guide is used to constrain and locate wires or cables for preparation for and for connection to a circuit board or connector, for termination. The cable guide has openings that receive and secure wires during the termination process. A shaft of the cable guide may be used to secure, in a repeatable manner, a predetermined length of the wires with ends offset from a cable jacket, or other reference on or near the end of the cable. The cable guide and the cable/wires may be secured in a fixture that allows the wire ends to be repeatably scored to remove insulation.09-01-2011
20090242237Surface mount device jumper and surface mount device jumper assembly - A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.10-01-2009
20090260853WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed. The conductor circuit covered with the etching resist layer is a part of the second portion of the conductor circuit exposed by removing the plating resist.10-22-2009
20100059252METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE AND COMPOSITE SHEET - A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate.03-11-2010
20100059251PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD - Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved.03-11-2010
20090151986Method of manufacturing wiring board, wiring board, and semiconductor device - A plurality of mounting terminals, a plane electrode formed around the plurality of mounting terminals, and a plurality of interconnects for plating, each of which is respectively connected to the plane electrode and a plurality of the mounting terminals different from each other are formed at one surface of the wiring board. The method of manufacturing the wiring board includes forming a mask film for plating on the insulating base, and forming a plated film on the mounting terminals and the interconnects for plating exposed out from the mask film; disposing, on the mask film for plating, a mask for removing interconnect so as to cover the plurality of openings for mounting terminals out of the regions having the plated film formed therein; and removing, through the mask for removing interconnect, the plated film and the interconnects for plating exposed out from the mask for removing interconnect.06-18-2009
20110100680WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first rigid wiring board having a first wiring layer on a first main surface, a second rigid wiring board having a second wiring layer on a second main surface, a first connection portion connecting the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer, the second wiring layer and the first connection portion. In such a wiring board, the first rigid wiring board and the second rigid wiring board are positioned in such a way that the first main surface and the second main surface are set at substantially the same level, and the first wiring layer and the second wiring layer are electrically connected by the first connection portion.05-05-2011
20110073352PAIRED LOW-CHARACTERISTIC IMPEDANCE POWER LINE AND GROUND LINE STRUCTURE - Disclosed is a paired low-characteristic impedance power line and ground line structure in which loop inductance is substantially 0. The paired low-characteristic impedance power line and ground line structure includes a laminated sheet in which a metal wiring layer having a power line and a ground line is provided on the surface of an insulating sheet, an insulating thin-film layer provided so as to cover the power line and the ground line, and a resistive layer provided on the surface of the insulating thin-film layer.03-31-2011
20110061898REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVELY-WIDENED MESH - One embodiment of the invention provides a multi-layered ceramic package. The ceramic package includes a signal layer having a plurality of signal lines and a mesh reference layer parallel to the signal layer. The mesh reference layer includes a plurality of intersecting reference lines of varying reference-line width in the plane of the mesh layer. The mesh reference lines may be widened in locations of probable signal cross-talk. Other embodiments of the invention include software for optimizing a ceramic package design by selectively widening mesh lines in regions of probable cross-talk, and systems for designing and manufacturing such a ceramic package.03-17-2011
20110067901PACKAGE SUBSTRATE - Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and open portions are formed on the first plating layer, thus balancing the plating areas of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate due to differing coefficients of thermal expansion.03-24-2011
20110061900Wired-circuit-board assembly sheet and producing method thereof - A wired-circuit-board-assembly sheet includes a plurality of wired circuit boards arranged in parallel in one direction, which are regularly omitted at given intervals, and a plurality of units defined by margin portions where the wired circuit boards are omitted.03-17-2011
20120118614CONDUCTIVE SHEET, METHOD FOR USING CONDUCTIVE SHEET, AND CAPACITIVE TOUCH PANEL - A conductive Sheet, a method for using conductive sheet, and a capacitive touch panel are provided. A first conductive sheet contains two or more conductive first large lattices and a first connection for electrically connecting the adjacent first large lattices on a first transparent substrate. The first large lattices each contain a combination of two or more small lattices, the first connection contains one or more medium lattices (a first medium lattice to a fourth medium lattice), and the pitch of the medium lattices is n times larger than that of the small lattices (in which n is a real number larger than 1).05-17-2012
20120118613Layout method for bridging electrode capable of shielding bright spot and structure of the bridging electrode - A layout method for a bridging electrode capable of shielding a bright spot includes the steps of: providing a substrate; forming a transparent electroconductive layer, having neighboring pattern blocks, on the substrate; forming an alignment film layer, having bridging grooves for crossing between the pattern blocks, over the substrate; forming an electroconductive layer, having wires respectively correspondingly disposed over the bridging grooves, over the substrate; forming an electroconductive correspondence layer on one side of the electroconductive layer to shield the wires; and forming a protection layer over the substrate to enhance optical transmission and protect the substrate, the transparent electroconductive layer, the alignment film layer and the electroconductive layer. Meanwhile, the invention also provides a structure of the bridging electrode capable of shielding the bright spot and corresponding to the layout method.05-17-2012
20110017495METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT - The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step. (b); and (d) depositing by means of an electroless process a layer of a second metal or alloy thereof on the distribution of the particles of the first metal or alloy thereof as obtained in step (c), whereby the inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the particles of the first metal or alloy thereof that are distributed on the pattern obtained in step (b).01-27-2011
20110247860METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING THE MANUFACTURING METHOD - One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated.10-13-2011
20110247858Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate; a first circuit layer formed on the substrate; a first insulation layer formed on the first circuit layer and having a pattern corresponding to that of the first circuit layer; and a second insulation layer formed on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.10-13-2011
20110155421Wired circuit board assembly sheet - A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.06-30-2011
20090255713Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.10-15-2009
20090000807Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same - A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.01-01-2009
20080245551CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME - A semiconductor chip-embedded circuit board and a fabrication method thereof are provided, including: a core board having first and second surfaces with first and second circuit layers thereon respectively, the first surface having a chip-receiving area (CRA); a laminated layer formed on the first and second surfaces and formed with an opening for exposing the CRA; third and fourth circuit layers formed on the laminated layer, the third circuit layer having first and second conductive pads, the fourth circuit layer having third conductive pads; a first insulating protective layer formed on the third circuit layer and formed with a plurality of first openings for exposing the first conductive pads and the CRA and a plurality of second openings for exposing the second conductive pads; and a second insulating protective layer formed on the fourth circuit layer and formed with third openings for exposing the third conductive pads. Mounting a semiconductor chip on the CRA reduces package height.10-09-2008
20110042126CONTACT RESISTANCE MEASUREMENT FOR RESISTANCE LINEARITY IN NANOSTRUCTURE THIN FILMS - The present disclosure is directed to a transparent conductor for use in touch panel devices having a plurality of nanostructures therein that provides reliable output based on user touch or pen input. To determine if a touch panel is reliable, there is disclosed a method of measuring voltages across the transparent conductor when it is touched. These measured voltages are converted into contact resistances, which are statistically analyzed. A median contact resistance is determined based on the converted contact resistances. The remaining set of converted contact resistances are analyzed to determine if they are within acceptable limits. Acceptable limits may include most of the contact resistances falling within a range, none of the contact resistances exceeding an upper limit, and a difference in contact resistances converted for different users or pens does not exceed a maximum variability.02-24-2011
20090126975METHOD FOR FABRICATING MULTILAYER CIRCUIT BOARD, CIRCUIT PLATE, AND METHOD FOR FABRICATING THE CIRCUIT PLATE - A method for fabricating a multilayer circuit board, including: preparing a film 05-21-2009
20080314618Solution, Component for Plating, Insulating Sheet, Laminate, and Printed Circuit Board - It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 μm or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.12-25-2008
20080314620Skew Compensation by Changing Ground Parasitic For Traces - According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or point to a different location or point of the transmission line will also be changed. This concept applies to a single trace. Similarly, this concept may be applied to one trace of a differential pair of traces (e.g., so that the two parts of the differential signal transmitted at one point in time at a location on the pair arrive at the same time at another location of the pair).12-25-2008
20080314619Conductive paste, printed circuit board, and manufacturing method thereof - A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.12-25-2008
20080264675PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.10-30-2008
20080264677Circuit board structure having embedded capacitor and fabrication method thereof - The present invention provides a circuit board structure having an embedded capacitor and a method for fabricating the same. The circuit board structure includes a core layer board with at least one surface having non-penetrating first and second grooves, a circuit layer and a first electrode plate formed in the first and second grooves of the core layer board respectively and being flush with the core layer board; a high dielectric material layer formed on the core layer board, the circuit layer and the first electrode plate; a second electrode plate formed on the high dielectric material layer and corresponding to the first electrode plate, thereby forming a capacitor by the first and second electrode plates and the high dielectric material layer. The high dielectric material layer is formed on a plane surface so as to eliminate poor filling and improve reliability.10-30-2008
20080264676Circuit board and method for manufaturing thereof - A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stacked on a carrier; stacking and pressing together the carrier and an insulator, such that a surface of the carrier having the conductive relievo pattern faces the insulator; transcribing the conductive relievo pattern into the insulator by removing the carrier; forming a conduction pattern, including a third plating layer and a second metal layer stacked sequentially in correspondence with a second circuit pattern, on the surface of the insulator having the conductive relievo pattern transcribed; removing the first plating layer and seed layer; and removing the first and second metal layers, can provide a circuit board that has high-density circuit patterns without an increased amount of insulator.10-30-2008
20080264674ELECTRONIC DEVICE HAVING POWER CONNECTION INTERFACE - An electronic device includes a circuit board and a power connection interface. The power connection interface is formed on an edge region of the circuit board. The power connection interface includes a first trace portion for transmitting a DC voltage and second and third trace portions for transmitting an AC voltage. Plural trace wires of the first trace portion are arranged on first and second surfaces of the edge region. The second and third trace portions are arranged on opposite surfaces of the edge region.10-30-2008
20080202795Method of Improving the Strength of a Spot-Welded Joint Between Fine Enameled Wire and Circuit Board - A method for improving the reliability of the welding spot between thin enameled wires and an electronic board and thus securing the connection therebetween, by pulling the terminals of the enameled wires to the back of the electronic board and thereby creating a bearing point on the structure of the board. The bearing point, positioned between the welding spot and the wire terminal, effectively prevents the external forces of stress from directly acting on the welding spot when the terminals of the wire are pulled, swung up and sown, or subjected to other external pulling forces.08-28-2008
20110162873FORMING CONDUCTIVE FEATURES OF ELECTRONIC DEVICES - Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator including a plurality of ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed which forms droplets of the aerosol. Carrier gas is delivered to different portions of the reservoir by a plurality of gas delivery ports delivering gas from a gas delivery system. The aerosol is pyrolyzed to form particles, which are then cooled and collected. The invention also provides powders made by the method and devices made using the powders.07-07-2011
20100319965ELECTRONIC CARD AND AIRCRAFT INCLUDING SAME - An electronic card that includes at least two superimposed conducting layers with an insulation layer between the two conducting layers, the two conducting layers each including a utility conducting portion and a conducting portion at the periphery of the utility conducting portion with an insulating portion between the conducting portions, the insulating portion of a first of the two layers being offset relative to the insulating portion of the second of the layers. An aircraft includes a housing in which at least one such card is provided.12-23-2010
20110042125CONDUCTIVE INK, METHOD OF PREPARING METAL WIRING USING CONDUCTIVE INK, AND PRINTED CIRCUIT BOARD PREPARED USING METHOD - A conductive ink including metal ions, a functional solvent, and a capping agent, a method of preparing a metal wiring using the conductive ink, and a printed circuit board including the metal wiring.02-24-2011
20120031647CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF - The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.02-09-2012
20110132640PRINTED WIRING BOARD AND METHOD OF SUPRRESSING POWER SUPPLY NOISE THEREOF - Disclosed is a printed wiring board having signal layers each interposed between a power supply layer and a ground layer, wherein the signal layer includes at least one of a wiring region for a ground potential and a wiring region for a power supply potential.06-09-2011
20110000700METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE - A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.01-06-2011
20080217045UNDERLAY SUBSTRATE, SCREEN PRINTING METHOD AND MANUFACTURING METHOD OF PRINTED CIRCUIT SUBSTRATE - A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.09-11-2008
20110132639PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.06-09-2011
20110186333Printed Compatible Designs and Layout Schemes for Printed Electronics - Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.08-04-2011
20100025080PRINTED CIRCUIT BOARD WITH CONDUCTIVE INK/PASTE, HAVING PLATING LAYERS, AND METHOD FOR MANUFACTURING THE SAME - A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.02-04-2010
20090159313CURABLE EPOXY RESIN COMPOSITION AND LAMINATES MADE THEREFROM - A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d) a non-nitrogen containing catalyst adjuvant compound capable of reducing the concentration of the nitrogen-containing catalyst; wherein at least one of the above components (a)-(d) is halogenated or wherein the resin composition includes (e) a halogenated flame retardant compound. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 06-25-2009
20110297422Circuit board and apparatus for processing defect in circuit board - Provided are a circuit board and an apparatus for processing a defect in a circuit board. The circuit board includes at least one non-defective cell including a non-defective circuit pattern, at least one defective cell including a defective circuit pattern, and a short line printed on the circuit pattern of the at least one defective cell.12-08-2011
20110083880Support Member of Circuit Board - A support member of a circuit board includes a columnar portion capable of reducing an outer shape by elastic deformation and capable of passing through an opening provided on the circuit board, and a plurality of projecting portions provided to protrude from an outer circumferential surface of the columnar portion, arranged at a prescribed interval in an axial direction of the columnar portion, and passing through the opening of the circuit board when the columnar portion is elastically deformed to reduce the outer shape. The circuit board is arranged between the projecting portions adjacent in the axial direction of the columnar portion in a state where the columnar portion passes through the opening of the circuit board, so that a plurality of the circuit boards are held at the prescribed interval along the axial direction of the columnar portion.04-14-2011
20080264673Differential signal layout printed circuit board - A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer.10-30-2008
20090008127Epoxy Resin Composition for Prepreg, Prepreg and Multilayered Printed Wiring Board - Problems: To provide an epoxy resin composition for prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, which does not generate toxic substance on combustion and excellent in ignition resistance, solder heat resistance after moisture absorption and high temperature rigidity, prepregs and multilayered printed wiring boards.01-08-2009
20090173520Reduction of jitter in a semiconductor device by controlling printed ciucuit board and package substrate stackup - A model and method are provided for lowering device jitter by controlling the stackup of PCB planes so as to minimize inductance between a FPGA and PCB voltage planes for critical core voltages within the FPGA. Furthermore, a model and method are provided for lowering jitter by controlling the stackup of package substrate planes so as to minimize inductance between a die and substrate voltage planes for critical core voltages within the die.07-09-2009
20120145436PACKAGING BOARD - A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.06-14-2012
20120031648WIRING CIRCUIT BOARD - A wiring circuit board is provided, in which a circuit wiring is substantially free from a softening phenomenon which may otherwise occur due to heat over time, and is highly durable, less brittle and substantially free from cracking. The wiring circuit board includes a substrate comprising an insulative layer, and a circuit wiring provided on the insulative layer of the substrate. The circuit wiring has a layered structure including at least three copper-based metal layers. A lowermost one and an uppermost one of the copper-based metal layers each have a tensile resistance of 100 to 400 MPa at an ordinary temperature, and an intermediate copper-based metal layer present between the lowermost layer and the uppermost layer has a tensile resistance of 700 to 1500 MPa at the ordinary temperature.02-09-2012
20120097428SIGNAL LINE PATH AND MANUFACTURING METHOD THEREFOR - A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.04-26-2012
20120152592METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY SHEET, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD ASSEMBLY SHEET - Base insulating layers are formed on a support substrate having a conductive property. The support substrate is etched, to form support substrate board and a plurality of conductive portions in a suspension board. The holding piece and the conductive portions constitute a shape determination unit. The conductive portions have first to fifth conductive portions. The third and fourth conductive portions are spaced apart from each other, and the fifth conductive portion is formed between the third and fourth conductive portions. The first and second conductive portions are respectively formed integrally with one end and the other end of the fifth conductive portion. It is determined whether the first and second conductive portions in the shape determination unit are connected electrically to each other. And it is determined whether the first and third conductive portions are connected electrically to each other.06-21-2012
20110083881Device and Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces - A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.04-14-2011
20120043113PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a ground layer, a number of conductive mount holes extending through the PCB, and a number of electromagnetic wave absorption elements located on a top surface of the PCB and aligning with corresponding mount holes. Each mount hole is lined with a conductive material to electrically connect to the ground layer. Each electromagnetic wave absorption element includes an absorption layer to absorb high-frequency noise, and a conductive layer sandwiched between the absorption layer and the top surface of the PCB, and electrically connected to a corresponding mount hole. Each conductive layer is electrically connected to the ground layer though the conductive material of the corresponding mount hole. High-frequency noise of the PCB flows into the conductive layers through the ground layer and the conductive material of the mount holes, and is absorbed by the absorption layers.02-23-2012
20120205141PRINTED WIRING BOARD - The printed wiring board has a conductor of signal line 08-16-2012
20110155424PRODUCING ELECTRICAL CIRCUIT PATTERNS USING MULTI-POPULATION TRANSFORMATION - A method for producing an electrical circuit includes providing a substrate having a first pattern of features and defining a second pattern comprising a net of interconnected circuit elements. Different respective transformation rules are specified for different ones of the circuit elements. The second pattern is modified by applying the respective transformation rules to the circuit elements so as to align the circuit elements with the features in the first pattern, and the modified second pattern is applied to the substrate.06-30-2011
20110155423Circuit Board, Image Forming Apparatus, Thermal Head, and Image Sensor - The invention relates to a circuit board, and an image forming apparatus, a thermal head and an image sensor that employ the circuit board. A circuit board includes a substrate, a conductor which is situated on the substrate and has a groove formed on its surface, and a wire connected to the conductor. The groove surrounds a connection area between the wire and the conductor, excluding a part of the connection area defining an opening (X).06-30-2011
20110155422WIRE INSULATING TERMINAL AND CIRCUIT BOARD MODULE EMPLOYING SAME - There is disclosed a wire insulating terminal which includes a wire insulating terminal member having an inner insulating wall and an outer insulating wall, and at least one conducting wire having a bared wire end. The inner insulating wall forms a perforation channel with a first opening and a second opening which are respectively disposed on the two opposite ends of the perforation channel to accommodate the at least one conducting wire with the bared wire end partially protruding out from the second opening. The outer insulating wall includes a first connecting member and a second connecting member which are configured to be corresponsive to and engageable with each other.06-30-2011
20090194319PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD - Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an aminoantraquinone skeleton, a photopolymerization initiator (C), and a compound (D) having two or more ethylenically unsaturated groups within one molecule thereof, the composition being sufficiently colored while controlling absorption in the ultraviolet region using the coloring agent composed of a compound having an aminoantraquinone skeleton, having high sensitivity to ultraviolet and laser exposure, and providing good dry tack in a state of a dry coating film.08-06-2009
20100175912IC PACKAGE HAVING COLORED PATTERN - An IC package having a colored pattern includes a substrate, a chip electrically connected with the substrate, an insulating cover layer covering the chip, and a colored-pattern layer disposed on the insulating cover layer by ink jet printing or an alternative.07-15-2010
20120205140ARTICLES WITH PHOTOCURABLE AND PHOTOCURED COMPOSITIONS - The photocuring efficiency of a photoinitiator is increased by mixing it with an organic phosphite and an aldehyde. This mixture or photoinitiator composition can be used to cure acrylates or other photocurable compounds, particularly in an oxygen-containing environment, and the photocurable compositions can be used to form various articles.08-16-2012
20120012365THERMAL FLEX CONTACT CARRIERS #2 - The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling and thermal fluctuations. The invention more specifically shows certain improvements related to its mother patent application, called Thermal Flex Contact Carrier (TFCC), where the improvements allow the height of the contact elements to be now not restricted anymore by the size of the spaces or distances between the contact pads of the devices to be attached together. Certain improvements to the carrier wafer are also shown.01-19-2012
20120055697Wired circuit board and producing method thereof - A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.03-08-2012
20120152593ANISOTROPIC CONDUCTOR, METHOD OF PRODUCING THE SAME, AND ANISOTROPIC CONDUCTOR-ARRANGED SHEET - To provide a technique by which a material exhibiting high adhesiveness to objects to be fixed can be selected regardless of a material used for an insulating base in an anisotropic conductor having an adhesive section. An intermediate sheet which can be attached to the base is provided between the base and adhesive section. Since the intermediate sheet is provided in this manner, adhesive materials that exhibit high adhesive force to objects to be fixed can be used for the adhesive section without the consideration for adhesive force to the base. Furthermore, adhesive force which cannot be exhibited between the adhesive section and the base in the case of direct contact of the adhesive section with the base can be exhibited.06-21-2012
20120152594REDUCED CIRCUIT TRACE ROUGHNESS FOR IMPROVED SIGNAL PERFORMANCE - Exemplary techniques for improving the performance of signals transmitted by conductive circuit traces are disclosed. The techniques may be realized as a method comprising the step of reducing a surface roughness of at least one surface of a conductive circuit trace. Alternatively, the techniques may be realized as a circuit board for transmitting at least one signal, the circuit board comprising at least one conductive circuit trace for carrying at least one signal, the at least one conductive circuit trace having at least one polished surface. Further, the technique may be realized as a conductive circuit trace for carrying a signal, the conductive circuit trace comprising conductive material having a plurality of surfaces substantially parallel with a direction of propagation of the signal, wherein the plurality of surfaces includes at least one polished surface having a reduced surface roughness.06-21-2012
20090071695BORON NITRIDE AGGLOMERATED POWDER - Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing a feedstock powder including boron nitride agglomerates, and heat treating the feedstock powder to form a heat treated boron nitride agglomerated powder. In one embodiment the feedstock powder has a controlled crystal size. In another, the feedstock powder is derived from a bulk source.03-19-2009
20080277143RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD USING THEM, AND MANUFCTURING METHOD THEREOF - The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.11-13-2008
20120111606ELECTRONIC CIRCUIT COMPRISING A TRANSFER FACE ON WHICH CONTACT PADS ARE LAID OUT - An electronic circuit includes a transfer face and a plurality of contact pads. The pads include a first set of pads of a first type in a central zone at the center of the transfer face; second sets of pads of the first type on an end portion of a diagonal of the transfer face; third sets of pads of a second type on a median portion of a diagonal of the transfer face; fourth sets of pads of a third type in a lateral zone demarcated by the central zone and two semi-diagonals joined by one side of the transfer face. Each pad of the first type has a greater surface area on the transfer face than each pad of the second type, and each pad of the second type has a greater surface area than each pad of the third type.05-10-2012
20090133902Printed circuit board - A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and a sacrificial electrode electrically coupled with the second metal pad to prevent corrosion in the first metal pad, can be utilized to prevent excessive etching that may otherwise occur due to galvanic corrosion between metal pads of different ionization tendencies.05-28-2009
20090133903ELECTRODE AND METHOD FOR FORMING THE SAME - An electrode and a method for forming the electrode. The electrode comprises: a substrate; and a plurality of metal particles adhering to the substrate. The method comprises steps of: providing a substrate; providing a solution including a solvent and a plurality of metal particles on the substrate; removing the solvent; and making the plurality of metal particles adhere to the substrate.05-28-2009
20090133901METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD05-28-2009
20090133900ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.05-28-2009
20120125666MULTI-LAYERED PRINTED CIRCUIT BOARD WITH CONDUCTIVE TEST AREAS AS WELL AS METHOD FOR DETERMINING A MISALIGNMENT OF AN INNER LAYER - A multi-layered printed circuit board (05-24-2012
20120125665HIGH-FREQUENCY DEVICE - A high-frequency device according to one embodiment includes: a plate-like first dielectric substrate; a plurality of surface electrodes for capacitors which are formed on a surface of the first dielectric substrate; a rear face electrode for the capacitors which is formed on a rear face of the first dielectric substrate; a second dielectric substrate which is laminated on the first dielectric substrate and has an opening portion through which a plurality of the surface electrodes are exposed; a transmission line which is formed on a surface of the second dielectric substrate; and a conductive member to connect a plurality of the surface electrodes to the transmission line. The first dielectric substrate is made of dielectric material having a first dielectric constant. The second dielectric substrate is made of dielectric material having a second dielectric constant. The first dielectric constant is higher than the second dielectric constant.05-24-2012
20120125664Printed Wiring Board with Dielectric Material Sections Having Different Dissipation Factors - An apparatus including a first printed wiring board section and a second printed wiring board section. The first printed wiring board section includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section is directly attached with the first printed wiring board section to form a unitary printed wiring board structure. The second printed wiring board section includes a second dielectric material layer and an antenna on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.05-24-2012
20100288534Printable composition with nanostructures of first and second types - A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.11-18-2010
20120160543CIRCUIT BOARD TO BE ATTACHED TO SUPPORT THROUGH THERMOPLASTIC STAKING - A circuit board to be attached to a support such as a case body is provided. The circuit board has formed therein a mounting hole which is so designed as to permit a thermally deformable stud to protrude through the mounting hole and also to be thermoplastically staked to mount the board to the support. A layer is printed on the board by means of silk screen printing at a distance from the mounting hole. In a case where a moisture-proof and insulating material is applied over a surface of the board, the printed layer servers to block a flow of the moisture-proof and insulating material into the mounting hole. This avoids a reduction in strength of fastening the board to the support. The printed layer may also be used in visually inspecting a failure in thermoplastic staking to mount the board to the support.06-28-2012
20120211264CAPACITIVE TOUCH PANELS - A novel method and apparatus for performing the method is disclosed the apparatus comprises a laser (08-23-2012
20120211263WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction.08-23-2012
20100051322PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD - Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes forming a relievo pattern corresponding to a first circuit pattern on a thin-film insulating layer stacked on a carrier; stacking and compressing the carrier with the insulator such that one surface of the carrier on which the relievo pattern is formed faces the insulator; transcribing the thin-film insulating layer and the relievo pattern in the insulator; exposing a part of the relievo pattern by opening a part of the thin-film insulating layer; and forming a second circuit pattern by selectively depositing a conductive metal on the thin-film insulating layer, can manufacture a printed circuit board having high-density circuit patterns by forming a double layer circuit patterns, one circuit pattern buried in the insulator and the other circuit pattern formed on the outer layer, without stacking the insulator for forming a multi-layered printed circuit board.03-04-2010
20120168203INTEGRATED CIRCUIT SYSTEM WITH ULTRA-LOW K DIELECTRIC AND METHOD OF MANUFACTURE THEREOF - A method of manufacturing an integrated circuit system includes: providing a etch stop layer; forming a layer stack over the etch stop layer with the layer stack having an anti-reflective coating layer over a low temperature oxide layer; forming a photoresist layer over the anti-reflective coating layer; forming a first resist line and a second resist line from the photoresist layer with the first resist line and the second resist line separated by a through line pitch on the anti-reflective coating layer; etching the anti-reflective coating layer using a low-pressure polymer burst with a non-oxidizing gas mixture to remove a portion of the anti-reflective coating layer; and forming a first polymer layer over the first resist line.07-05-2012
20100051320CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES - A circuit board includes a substrate, a polar molecular layer pattern and a nonpolar molecular layer pattern, which are disposed on the substrate, a first electrode and a second electrode, which are disposed on the substrate, and one or more channels disposed on the polar molecular layer pattern and including linear nanostructures. The one or more channels facilitate to electrically couple the first electrode to the second electrode.03-04-2010
20120312583METHOD OF MANUFACTURING INTERCONNECTION MEMBER AND ELECTRONIC DEVICE, INTERCONNECTION MEMBER, MULTILAYERED INTERCONNECTIONS, ELECTRONIC DEVICE, ELECTRONIC DEVICE ARRAY AND DISPLAY DEVICE USING THE METHOD - A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.12-13-2012
20100051321PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME - The portion of a board corresponding to the surrounding portion of a hole 03-04-2010
20100051323PRINTED WIRING BOARD AND CONDUCTIVE WIRING LAYER - A printed wiring board with an insulating layer formed of an insulating material and a conductive wiring layer formed on a front surface of the insulating layer. The conductive wiring layer has a conductor and a filler. The filler is embedded in the conductor. The filler has a coefficient of thermal expansion smaller than the conductor.03-04-2010
20090126974Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit Board - A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.05-21-2009
20100012352PHOTOIMAGING METHOD AND APPARATUS - There is herein described a method and apparatus for photoimaging. In particular, there is described a method and apparatus for photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits.01-21-2010
20100270057CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10-28-2010
20120255763CARD-TYPE INFORMATION RECORDING MEDIUM HAVING EMBEDDED ANTENNA FOR NEAR FIELD COMMUNICATION AND MANUFACTURING METHOD THEREOF - A card-type information recording medium having an embedded antenna for NFC communication is provided. The card-type information recording medium includes: a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process; an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB; and a molding material that is formed on the top of the PCB to cover the NFC communication unit and the USIM card unit. Accordingly, it is possible to perform functions of NFC and RFID read/tag by only mounting a USIM device thereon without adding any module or any constituent having an antenna function to a mobile terminal.10-11-2012
20120228004CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF - A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.09-13-2012
20130008695VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.01-10-2013
20110120753CURABLE RESIN COMPOSITION FOR INK JET PRINTER, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD USING THE SAME - A curable resin composition for an ink jet printer including: (A) a bis-allyl-nadi-imide compound defined by the following general formula (1):05-26-2011
20110120752METHOD FOR FABRICATING A SOLAR BATTERY MODULE AND A WIRING SUBSTRATE FOR A SOLAR BATTERY - A method for fabricating a solar battery module includes cell preparing step for preparing a solar battery cell having an electrode wiring, wiring substrate preparing step for preparing a base material and a wiring substrate having a wiring pattern provided above the base material, mounting step for electrically connecting the wiring pattern with the electrode wiring and mounting the solar battery cell on the wiring substrate, and exposing step for removing the base material to expose the wiring pattern.05-26-2011
20110120751ACCURATE IMPEDANCE DESIGNING METHOD FOR CIRCUIT LAYOUT - The present invention relates to an accurate impedance designing method for a circuit layout. On a printed circuit board, opening circuit for a soldering pad of a electric device and a signal wire of the device so as to form a non-electrical connection between the soldering pad and the signal wire, thus, the impedance of the soldering pad is not involved at a detecting point so as to enhance the accuracy of the current signal measuring.05-26-2011
20110036618Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board - Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.02-17-2011
20110036617Compensating Conductive Circuit - A audio, video, and digital signal compensating conductive circuit consisting of one or more main electric conductor(s) and one or more non-terminated compensating conductor(s) to enhance transmission performance of an electrical signal. One embodiment is an electric cable comprising a one or more of said compensating conductive circuits. Another embodiment is a Printed Circuit Board (PCB) that has a plurality of said electric wires embedded in the CB. Said compensating conductive circuit has at least one main electric conductor, having purpose of carrying electric current between the signal source and the load, and at least one non-terminated compensating electric conductor, one end of said non-terminated compensating electric conductor is connected to said main electric conductor, while the other end of said non-terminated compensating electric conductor is unconnected.02-17-2011
20120325522CONDUCTOR STRUCTURE, TRANSPARENT DEVICE, AND ELECTRONIC DEVICE - Disclosed is a conductor structure provided with a transparent conductive film that can reduce a resistance value in a high-frequency band, while ensuring transparency. Also disclosed is an electronic device provided with the conductor structure. On the main surface of a glass substrate (12-27-2012
20120267148CIRCUIT BOARD - A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided.10-25-2012
20120267147Method for Producing an Electronic Component and Electronic Component - A method for producing an electronic component with at least one first electrode zone (10-25-2012
20120318562WORKING PANEL AND WORKING PANEL SET COMPRISING ARRAY BOARD PATTERNS - A working panel includes first array board patterns arranged in a first region and including first and second guide bar patterns facing each other and N first unit board patterns, where N is a natural number greater than or equal to 2, positioned between the first and second guide bar patterns, and second array board patterns including third and fourth guide bar patterns facing each other, and M second unit board patterns, where 1≦M12-20-2012
20110226511INKJET INK, SURFACE METAL FILM MATERIAL AND ITS MANUFACTURING METHOD, AND PATTERNED METAL MATERIAL AND ITS MANUFACTURING METHOD - An inkjet ink includes a polymer which contains a functional group capable of forming an interaction with a plating catalyst or its precursor and a polymerizable functional group; and at least one solvent in which the polymer is dissolved or dispersed. The inkjet ink is capable of forming in a desired pattern a polymer layer having excellent adhesion to a metal film (plated film) and exhibits high stability in continuous discharge.09-22-2011
20110226510LAMINATE MOUNT ASSEMBLY - A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.09-22-2011
20120298405ELECTRODE STRUCTURE OF THE TOUCH PANEL, METHOD THEREOF AND TOUCH PANEL - An electrode structure is provided. The electrode structure comprises a plurality of first conductive cells and second conductive cells separated from each other and disposed on a substrate; a plurality of first conductive lines connecting adjacent said first conductive cells and a plurality of second conductive lines connecting adjacent said second conductive cells; wherein each said second conductive line comprises a conducting element and a pair of second conductive branches disposed at two sides of said conducting elements and connecting said conducting element to adjacent said second conductive cells; said first conductive lines and said second conductive lines are insulated and intersected. The method of forming an electrode structure is also provided.11-29-2012
20110247859METHOD FOR MANUFACTURING A SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID, AND SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID - The manufacture of a submillimetric grid includes the production of a mask having submillimetric openings, referred to as a network mask, on the main face, from a solution of colloidal nanoparticles with a given glass transition temperature T10-13-2011
20100224391Suspension board with circuit and production method thereof - A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.09-09-2010
20100224393Display device - A display device with signal lines formed on a substrate and an organic insulation film which covers the signal lines and is formed over an upper layer side of the substrate, the display device further includes a terminal portion on which a conductive film is formed in a state that the conductive film covers portions of the signal lines which are exposed through openings formed in the organic insulation film, wherein the organic insulation film sets a film thickness thereof at a periphery of the terminal portion smaller than the film thickness at other portions, and a surface of small-film-thickness portion arranged in peripheries of the openings is formed into an uneven surface.09-09-2010
20100224392Line pattern formation method - A line pattern is formed on a substrate by performing a first step and a second step. In the first step, a liquid material containing a pattern formation material dispersed or dissolved therein is dropped onto the substrate and dried. In the second step, the liquid material is dropped onto a dried body that has been obtained by drying the liquid material in the first step. In the second step, the liquid material is dropped at a smaller ejection amount than that of the first step. Further, the pitch of dropping the liquid material onto the substrate in the first step and the pitch of dropping the liquid material onto the dried body in the second step are less than or equal to a jaggy generation limit.09-09-2010
20100230136METHOD FOR PRODUCING RESIST PATTERN - The present invention provides a method for producing a resist pattern sufficiently miniaturized having an excellent shape including: repeating a process of forming a patterned resist film comprising the following step (1):09-16-2010
20120318561PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - According to one embodiment, a pattern formation method includes: providing a first member; providing a second member; forming a third pattern; and removing a convex portion of a second pattern. The first member is provided on a major surface of a substrate and cured in a state of a template having a first pattern being brought into contact to form the second pattern including a convex portion in a first region on the major surface. The second member is provided in a concave portion adjacent to the convex portion of the second pattern. The third pattern is formed in the second member provided on a second region on the major surface. The removing the convex portion includes removing the convex portion of the second pattern to leave the third pattern and a fourth pattern formed by the second member provided in the concave portion on the major surface.12-20-2012
20120279757PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.11-08-2012
20120318563PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A differential transmission path composed of a pair of transmission lines is formed on an upper surface of a base insulating layer. A ground conductor layer is formed on a lower surface of the base insulating layer. The ground conductor layer is opposite to the differential transmission path with the base insulating layer sandwiched therebetween. A spacing between the transmission lines at a part of the differential transmission path is smaller than a spacing between the transmission lines at another part of the differential transmission path. A thickness of a part of the ground conductor layer overlapping the part of the differential transmission path is smaller than the thickness of another part of the ground conductor layer overlapping the another part of the differential transmission path.12-20-2012
20120090878SUBSTRATE FOR SUSPENSION - A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.04-19-2012
20120090877Method of Manufacturing Conductive Structures - The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.04-19-2012
20120138338PRINTED CIRCUIT BOARD HAVING STEPPED CONDUCTION LAYER - A printed circuit board having stepped conduction layer includes at least one conduction layer configured for use as a signal transmission layer, the at least one conduction layer being divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, and the connecting region being stepped to a lower height than those of the base regions. A lower surface of the connecting region lies on a same plane as a lower surface of the base region, or an upper surface of the connecting region lies on a same plane as an upper surface of the base region. A bridge connecting structure between the connecting regions and the base regions is disposed in possible noise transfer paths between a noise source and a noise attenuation target positioned on the printed circuit board.06-07-2012
20120138337PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a bump is formed using solder paste printing, and a heat radiation layer is formed using a metal layer used in the course of forming the bump, thus simplifying the formation of the bump, reliably mounting the bump, and improving heat-radiating properties.06-07-2012
20120138335High Aspect Ratio Microelectrode Arrays Enabled to Have Customizable Lengths and Methods of Making the Same - A method of fabricating an array of micro electrodes enabled to have customizable lengths. A substantially criss-cross pattern of channels on a top surface of the work-piece substrate (06-07-2012
20130008694ENDOSCOPE - Provided is an endoscope in which the work of connecting cables to a circuit board in the distal end of an insertion part can be easily performed. When a bundle-wire cable obtained by bundling a plurality of single-wire cables and a plurality of coaxial cables are connected to a circuit board arranged at the distal end of an insertion part, terminals that connect cores of the single-wire cables, terminals that connect cores of the coaxial cables, terminals that connect shields of the coaxial cables, and terminals that connect the shield of the bundle-wire cable are arranged in tandem at predetermined intervals on the common plane of the circuit board.01-10-2013
20130008697IRREGULAR-SURFACE FORMING METHOD USING PLASMA-ETCHING PROCESS, AND ELECTRODE MEMBER - A method is provided forming a predetermined irregular-surface pattern on a substrate. The method includes carrying out a plasma-etching process using a partly oxidized metal salt film having fine irregular-surface as a resist. In a first step, a metal salt film is formed on the substrate by coating a liquid material containing a metal salt. In a second step, a fine irregular-surface is formed on the metal salt film, and the metal salt film was converted into the resist by the partial oxidization. In a third step, a predetermined irregular-surface is formed on the substrate by carrying out the plasma-etching process to the substrate with the resist.01-10-2013
20130008696CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE - A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.01-10-2013
20100175911High-Speed Two-Layer and Multilayer Circuit Boards - Devices and methods are described for high-speed two layer and multilayer circuit boards. A device comprises a single circuit board or a circuit board made by laminating several two layer circuit boards. The device comprises mounting pads attached to the circuit board. The device comprises trace arrays that electrically couple the mounting pads. The trace arrays include a first trace array attached to a first side of each circuit board layer and a second trace array attached to a second side of each circuit board layer. Each trace array comprises conductive traces, and the conductive traces are arranged so each signal trace is positioned between combinations of ground traces and power traces to control the characteristic impedance of each logic or signal path. The arrays on the layers of the board are interconnected by vias to form a pseudo ground and power plane.07-15-2010
20120241199CONDUCTIVE SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND TOUCH PANEL - One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order from the transparent substrate side. According to the present invention, it becomes possible to provide a conductive substrate, wherein positioning of the transparent conductive layer and the metal wiring is easy, a method of manufacturing thereof, and a touch panel, even in the conductive substrate where the shape of the transparent conductive layer pattern is inconspicuous.09-27-2012
20120241198CONDUCTIVE ELEMENT AND METHOD FOR PRODUCING THE SAME, WIRING ELEMENT, INFORMATION INPUT DEVICE, DISPLAY DEVICE, ELECTRONIC APPARATUS, AND MASTER - A conductive element includes a base having a first wavy surface, a second wavy surface, and a third wavy surface, a first layer provided on the first wavy surface, and a second layer provided on the second wavy surface. The first layer has a multilayer structure including two or more stacked sublayers, the second layer has a single-layer or multilayer structure including part of the sublayers constituting the first layer, and the first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: 0≦(Am09-27-2012
20120241197WIRING BOARD - A wiring board includes: a first wiring; a second wiring being disposed adjacently to the first wiring; a third wiring being disposed adjacently to the first wiring; a fourth wiring being disposed adjacently to the third wiring; and an insulating layer, wherein the second wiring and the fourth wiring are disposed adjacently to each other, the first wiring and the fourth wiring are not overlapped, the second wiring and the third wiring are not overlapped, a crest and a trough are provided on a side face of the first wiring, the crest and the trough are provided on a side face of the second wiring, the trough provided on the side face of the first wiring and the third wiring are overlapped, and the trough provided on the side face of the second wiring and the fourth wiring are overlapped.09-27-2012
20080251278Recycling Printed Circuit Boards - A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the separated material to form a thin layer of substrate material suitable for relaminating with track material to provide a product for use in the manufacture of a further radio frequency printed circuit board. The method may separate the material from the laminate by grinding or use of an etchant.10-16-2008
20080236871Gas Venting Component Mounting Pad - Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.10-02-2008
20130168133PROCESS FOR PRODUCING A CIRCUIT CARRIER - A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive in an amount of at least 1 wt % with respect to the weight of the total composition, the laser direct structuring additive containing tin or copper comprising antimony-doped tin oxide and having a CIELab colour value L* of at least 45 and irradiating areas of the part on which conductive tracks are to be formed with laser radiation, and subsequently metalizing the irradiated areas.07-04-2013
20130168132PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate; a circuit layer including a connection pad having a vertically etched upper portion and formed on the upper portion of the base substrate; a solder resist layer formed on the upper portion of the base substrate and including an opening part exposing the connection pad; and a surface treatment layer formed on the upper portion of the connection pad exposed by the opening part.07-04-2013
20130092418CHIP-ON-FILM PANEL STRUCTURE - The present invention relates to a chip-on-film panel structure, which has a panel body and fan-out leads, first metal sheets, array leads and second metal leads thereon. The array leads are disposed at two sides of the fan-out leads, the second metal sheets are disposed at two sides of the first metal sheets, and the length of each of the second metal sheet is less than the length of each of the first metal sheet to form a lead-out area that the array leads are led out from the second metal sheets via the lead-out area. The chip-on-film panel structure having an arranged fan-out area for array leads can settle the problem of being difficult to narrow the frame of the panel because the array leads occupy available room for fan-out leads and force the fan-out area to expand longitudinally.04-18-2013
20130092419ELECTRONIC COMPONENT INCLUDING MULTILAYER SUBSTRATE - The multilayer substrate includes: a plurality of dielectric layers stacked on one another; a first conductor pattern 04-18-2013
20130098661PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.04-25-2013
20130133926BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer.05-30-2013
20080210456Method For Producing Electrically Conductive Patterns on a Non-Developable Surface of an Insulating Substrate, and Resulting Device - The invention concerns a method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and the resulting device. The invention is characterized in that it consists in: coating the non-developable surface (09-04-2008
20130146333TOUCH PANEL, METHOD FOR FORMING THE SAME, AND DISPLAY SYSTEM - A method for forming a touch panel includes: providing a substrate; forming a transparent conducting layer on the substrate; forming a conducting layer on the transparent conducting layer; forming a photoresist layer on the conducting layer, wherein the photoresist layer has a first portion, a second portion, and an opening partially exposing the conducting layer, and the first portion is thicker than the second portion; using the photoresist layer as a mask to etch and remove the exposed conducting layer and the transparent conducting layer thereunder such that the transparent conducting layer is formed to be a transparent conducting pattern layer; removing the second portion to expose a portion of the conducting layer thereunder; using the photoresist layer as a mask to etch and remove the exposed conducting layer such that the conducting layer is formed to be a wire layer; and removing the photoresist layer.06-13-2013
20130146334Print Compatible Designs and Layout Schemes for Printed Electronics - Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.06-13-2013
20080196927Working panel for multilayer printed circuit board - Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.08-21-2008
20110240343METHOD FOR MANUFACTURING A MASK HAVING SUBMILLIMETRIC APERTURES FOR A SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID, MASK HAVING SUBMILLIMETRIC APERTURES AND SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID - A process for manufacturing a mask having submillimetric openings, in which: for a masking layer, a solution of colloidal nanoparticles that are stabilized and dispersed in a first solvent is deposited, the particles having a given glass transition temperature T10-06-2011
20130126214FIXING APPARATUS FOR HEAT SINK - An apparatus for fixing a heat sink having a bottom plate includes a circuit board, two fasteners, and two blocks. The circuit board defines two through holes. The fasteners respectively extend through the bottom plate of the heat sink for fixing the heat sink to the circuit board. Each of the fasteners includes two spaced feet to extend through a corresponding one of the through holes and engage with a bottom of the circuit board. Each of the blocks is inserted into a space between the feet of a corresponding one of the fasteners after the feet extend through the corresponding through hole, to prevent the feet from deforming and disengaging from the circuit board.05-23-2013
20130146332FORMATION OF ELECTRICALLY CONDUCTIVE PATTERN BY SURFACE ENERGY MODIFICATION - A method for forming a conductive pattern on a substrate surface comprises altering the surface energy of the substrate surface, depositing a catalyst-doped liquid on to said substrate surface; forming a seed layer from said deposited catalyst-doped liquid, and plating the seed layer thereby forming the conductive pattern. In some embodiments, 3-D structures are placed on the substrate to delimit the size and shape of the conductive pattern. In other embodiments, the surface energy of the areas of the substrate in which conductive material is not desired (i.e., inverse pattern) is altered (e.g., lowered) to avoid having conductive liquid adhere thereto.06-13-2013
20100307796Method for Selective Adsorption of Noble Metal Onto Surface of Polymer - The present disclosure relates to a method for the selective adsorption of a noble metal catalyst onto a surface of a polymer. More particularly, the method of the present invention includes a first step of masking with a photo mask, the surface of a polymer adsorbed with a photosensitive metal ion, and radiating light onto the surface of the polymer such that the photosensitive metal ion on the unmasked surface is oxidized, and a second step of permitting the photosensitive metal ion which is not oxidized in the first step to react to a noble metal catalyst such that the noble metal catalyst is adsorbed onto the surface of the polymer.12-09-2010
20100307795CIRCUIT BOARD - A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area.12-09-2010
20120273256TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.11-01-2012
20130153266PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1.06-20-2013
20110232942MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD - A multi-layer wiring board includes a substrate; a land including a first conductive member arranged on the substrate; a second conductive member that is deposited on a surface of the first conductive member, which is a surface distant from the substrate; and a stress relaxation layer arranged between the first conductive member and the second conductive member; and a connection portion that makes contact with the land and that is electrically connected to the land.09-29-2011
20110232941DIFFERENTIAL SIGNAL CABLE, AND CABLE ASSEMBLY AND MULTI-PAIR DIFFERENTIAL SIGNAL CABLE USING THE SAME - A differential signal cable for transmitting high-speed digital differential signals of several Gbit/s or more is provided to minimize characteristic impedance mismatch and to repress increase in the skew, or increase in disturbance due to differential-mode to common-mode conversion. A differential signal cable comprises two insulated wires arranged parallelly in a contact, each of said two insulated wires comprising a conductor and an insulator jacketing the conductor; a fusion layer provided on the surface of each of said two insulated wires; a drain wire placed longitudinally in a recess created in the interstice between said two insulated wires; and a shield tape lapping around said two insulated wires and said drain wire together, wherein a surface of said insulator of each of said two insulated wires is partially deformed so as to have a flat portion and said two insulated wires are fused each other at said flat portions.09-29-2011
20130180760LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.07-18-2013
20130180761Printed Circuit Board Compensation Processing Method, Device, and PCB - The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.07-18-2013
20130153267DEVICE FOR ELECTRIC FIELD CONTROL - A device for controlling an electric field at a high voltage component including a resistive layer for field control, an insulating layer arranged on the resistive layer and a semi-conducting or conducting layer arranged on the insulating layer. The three layers meet at a triple point where the insulating layer ends. An interface between the resistive layer and the insulating layer makes in the triple point an angle to the semi-conducting or conducting layer of 60°-120°.06-20-2013
20110272177METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11-10-2011
20110297424WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME - A wiring board which uses both conductor patterns and reflection members provided at gaps therebetween to suppress unevenness in the reflection rate so as to raise the overall reflection rate and provide a reflection function on the surface of the wiring board at the side where an electronic device is mounted; facilitates shaping of the reflection members, controlling of the thickness of the reflection members, and controlling of the surface shape of the reflection members so as to stabilize the reflection rate; and secures close contact between the reflection members and sealing members so as to improve reliability. The wiring board comprises a plurality of wiring layers provided with conductor patterns disposed on base members, and base members which electrically insulate the plurality of wiring layers. At the outermost wiring layer among the plurality of wiring layers, reflection members are formed on the portions of the base member where there are no conductor patterns, the surface of these reflection members and the surface of the conductor patterns are made level and the surface of the conductor patterns are exposed from the reflection members.12-08-2011
20110308839PRINTED CIRCUIT BOARD MODULE - As a base, a side wall, and a top board are integrated by integral molding in a printed circuit board module, the printed circuit board module is structured in a simple manner. Further, conductive terminals are used for fitting a printed circuit board. The printed circuit board is securely held between the electrically conductive terminals and the top board via an elasticity of the conductive terminals. Here, due to the functioning of the notches, the printed circuit board is positioned in a simple manner. Due to the functioning of the base, a printed circuit board module can stand erect. The printed circuit board establishes a vertical posture. The packaging area is reduced. The packaging density improves. Further, the flat surface of the top board that is formed facing upward with a certain extension is used as, for example, an absorbent face.12-22-2011
20130186673CIRCUIT ELEMENT, MAGNETIC TRAY, CONNECTION AND WEDGING ELEMENTS FOR PEDAGOGIC HYPERFREQUENCY CIRCUIT, CASE CONTAINING SAME - According to the invention, the following are provided: 07-25-2013
20130192877WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.08-01-2013
20130192878FERROELECTRIC FILM, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING FERROELECTRIC FILM - A method for manufacturing a ferroelectric film including the steps of forming a burnable material film containing hydrogen of not less than 1% by weight on a substrate; forming an amorphous thin film including a ferroelectric material on the burnable material film; and oxidizing and crystallizing the amorphous thin film while supplying hydrogen to the amorphous thin film by burning the burnable material film through heating of the burnable material film and the amorphous thin film in an oxygen atmosphere, to thereby form a first ferroelectric film on the substrate.08-01-2013
20130206456CIRCUIT BOARD - There is provided a circuit board including a land provided on a mounting surface for joining a distal end portion of a connection terminal of a lead component by a solder, wherein the land is formed to extend in a predetermined direction such that the predetermined direction is a longitudinal direction and a lateral direction orthogonal to the longitudinal direction is a width direction, wherein the land includes a terminal-facing portion facing the distal end portion of the connection terminal and a distal end side continuous portion continuously extending from the terminal-facing portion in the distal end portion of the connection terminal, and wherein the land includes a narrow portion having a width smaller than a width of the distal end side continuous portion in the terminal-facing portion.08-15-2013
20130206457SURFACE MOUNT CLIP - A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.08-15-2013

Patent applications in class Preformed panel circuit arrangement (e.g., printed circuit)

Patent applications in all subclasses Preformed panel circuit arrangement (e.g., printed circuit)