Class / Patent application number | Description | Number of patent applications / Date published |
174500540 | With mounting means for a device within envelope | 8 |
20090266573 | Assembly Method for Implantable Medical Device - An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case. | 10-29-2009 |
20100206602 | Bump Structure With Multiple Layers And Method Of Manufacture - A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process. | 08-19-2010 |
20100258331 | EXPLOSION-PROOF ENCLOSURE - A system for enclosing an instrument, module or other assembly in an explosion-proof housing. The system includes an upper housing portion that includes a first threaded portion and, optionally, a transparent window portion; a lower housing portion that has a second threaded portion that is structured and arranged to cooperate with the first threaded portion to provide a tight, air- and water-tight fit; and an inner mounting assembly for supporting an instrument, module, electrical circuit, electrical device, display device, or other assembly. In pertinent part, the lower housing portion includes integrated bosses that provide horizontal surfaces for supporting the inner mounting assembly and for releasably attaching the inner mounting assembly to the lower housing portion. The number of positioning of the bosses and the number and positioning of mounting studs on the inner mounting assembly are designed to mount the inner mounting assembly within the lower housing portion in a manner that is independent of the mounting orientation of the lower housing portion. | 10-14-2010 |
20110240327 | ELECTRONIC APPARATUS STORING CONTAINER AND METHOD FOR ASSEMBLING ELECTRONIC APPARATUS STORING CONTAINER - The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container. | 10-06-2011 |
20120067611 | SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material. | 03-22-2012 |
20130043055 | Junction Box - A junction box for a photovoltaic module is provided. The junction includes a housing and a base. The housing is prepared from a first material. The base is provided in the housing and configured to mount an electronic device. The base is prepared from a second material. With the housing and the base being separated from each other and made of different materials, the junction box meets the design requirements regarding a system voltage range of 600-1,000V according to UL. | 02-21-2013 |
20130264088 | BLADE-EDGE VAPOR-TIGHT ELECTRICAL BOX - An electrical box includes one or more sides joined to form a front opening to receive an electrical device. The electrical box also includes a flange extending laterally from the one or more sides. The flange includes a blade edge configured to have an initial engagement with a surface of a wallboard when the electrical box is installed in an opening of the wallboard. When the electrical box is installed in the opening of the wallboard, the blade edge forms a vapor-tight barrier between the electrical box and the surface of the wallboard. | 10-10-2013 |
20130299209 | ELECTRONIC DEVICE WITH A DUSTPROOF SHIELD - An electronic device includes a housing, an electronic component mounted to the housing, and a first dustproof component. The electronic component includes a first part received in the housing. The first dustproof component is secured to the housing and is provided around the first part, for closing the first part. | 11-14-2013 |