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HEAT TRANSMITTER

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165 - Heat exchange

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DocumentTitleDate
20110174474VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.07-21-2011
20110174473Methods of forming enhanced-surface walls for use in apparatae for performing a process, enhanced-surface walls, and apparatae incorporating same - This invention relates generally to: (1) methods of forming enhanced-surface walls (07-21-2011
20130025839THERMAL SUBSTRATE - An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure.01-31-2013
20130043016STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE - Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.02-21-2013
20130043015MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT - A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.02-21-2013
20130043017HEAT SINKING PLATE - Provided is a heat sinking plate, the plate formed with a square-shaped opening of a predetermined length when viewed from the other direction of a rectangular metal plate by erecting four triangles obtained by diagonally and crossly cutting a square of a predetermined length to one direction of the metal plate at a predetermined first angle relative to the metal plate.02-21-2013
20120160466SURFACE COOLER HAVING CHANNELED FINS - A surface cooler includes a base plate, and at least one fin element extending from the base plate. The at least one fin element includes an outer surface portion that is configured and disposed to be in direct contact with a first fluid and an inner surface portion that is configured and disposed to be in direct contact with a second fluid. The at least one fin element defines a primary heat exchange member that is configured and disposed to facilitate an exchange of heat between the first and second fluids.06-28-2012
20090139705HOTPLATE WITH LIFTING ELEMENTS - The hotplate for a workpiece comprises a heatable plate which on a first side comprises a support surface for the workpiece, several lifting elements for the lifting of the workpiece relative to the support surface, wherein each lifting element is moveably arranged in such a manner that the respective lifting element can be retracted with respect to the support surface and/or extended with respect to the support surface and means for heating the plate. The means for heating comprise at least one heating channel which extends on a second side of the plate located opposite the support surface and is filled with a heating fluid. The heating fluid is in contact with the plate. The lifting elements are loaded with the heating fluid in such a manner that the lifting elements are extendable through a predetermined change of the hydrostatic pressure of the heating fluid.06-04-2009
20130075073HEAT-DISSIPATING FIN AND HEAT-DISSIPATING FIN ASSEMBLY - A heat-dissipating fin comprises a first longitudinal section, a second longitudinal section, a first contacting section extending transversely from the first longitudinal section, a second contacting section extending transversely from the second longitudinal section, and a third contacting section connected between the first longitudinal section and the second longitudinal section and extending transversely. When a plurality of heat-dissipating fins are assembled, contact among the first contacting sections, among the second contacting sections, and among the third contacting sections of the heat-dissipating fins are established.03-28-2013
20110192588HEAT CONDUCTING SHEET, MANUFACTURING METHOD THEREOF, AND HEAT RADIATOR THAT UTILIZES THE SAME - A heat conducting sheet including a composition, wherein the composition contains plate-form boron nitride particles (A) having an average particle diameter of more than 10 μm and 60 μm or less, and an organic polymer compound (B) having a glass transition temperature (Tg) of 50° C. or lower, the plate-form boron nitride particles (A) are contained in the composition in an amount ranging from 45 to 75% by volume thereof, and are oriented to direct the major axis direction thereof along the thickness direction of the sheet. Thus, there is provided an electrically insulating and heat conducting sheet which can keep a high thermal conductivity while the sheet has additional properties such as flexibility.08-11-2011
20110192587THERMAL MANAGEMENT OF ELECTRONIC DEVICES - Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.08-11-2011
20110192585Water Spread Limiting System for Pre-Insulated Piping - A section of pipe is used in a pre-insulated piping system where the system is made up of lengths of insulated and jacketed pre-insulated piping. Each length of piping is made up of an inner carrier pipe having an interior surface and an exterior surface. An envelope of foamed insulation surrounds the inner pipe exterior surface and an outer protective jacket surrounds the envelope of foamed insulation. The length of piping has a joining end for joining to an adjacent length of piping, whereby the adjacent lengths of piping provide a continuous length of fluid conduit for conveying high temperature fluids. A heat dissipating element surrounds the inner carrier pipe for at least a portion of the length thereof. The heat dissipating element is itself insulated, whereby any water which penetrates the outer protective jacket contacts the heat dissipating element and is cooled below boiling before traveling any significant distance along the length of the section of piping.08-11-2011
20130032324THERMAL SOLUTION WITH SPRING-LOADED INTERFACE - Thermal solution systems including a heat sink and a spreader plate mounted to the heat sink via one or more springs. Thermal gap filler provides a thermal interface between the heat sink and the spreader plate. The one or more springs provide contact force between the heat spreader plate and a component to be cooled, while accommodating dimensional variation, such as manufacturing tolerance or assembly tolerance related variation.02-07-2013
20130075074Thermal Dissipation Device - A thermal dissipation device for an electronic device includes a heat sink having predetermined shape and form for placing over the electronic device, wherein the heat sink includes fins for increase surface area; and carbon nanotubes formed on a surface of the heat sink and the fins to increase the thermal dissipation surface, thereby enhancing thermal dissipation. The carbon nanotubes comprises multi-walled carbon nanotubes (MWNTs), single-walled carbon nanotubes (SWNTs), graphenated carbon nanotubes.03-28-2013
20130037248FABRIC AND METHOD OF MAKING THE SAME - A fabric for thermal management including the cooling of an object, such as a person's skin. The fabric is formed of a plurality of functional zones arranged to extend the period of cooling without the use of artificial cooling chemicals. The functional zones include one or more of three different functional zone types. The first type diverts moisture. The second type retains and stores moisture. The third type absorbs moisture. One of the functional zones may be punched to create perforations to provide fabric flexibility and to assist in liquid diversion from within the fabric. An anchor system facilitates retention of the fabric on the object.02-14-2013
20130075072APPARATUSES AND METHODS FOR CONTROLLING HEAT FOR RAPID THERMAL PROCESSING OF CARBONACEOUS MATERIAL - Embodiments of apparatuses and methods for controlling heat for rapid thermal processing of carbonaceous material are provided herein. The apparatus comprises a reheater for containing a fluidized bubbling bed comprising an oxygen-containing gas, inorganic heat carrier particles, and char and for burning the char into ash to form heated inorganic particles. An inorganic particle cooler is in fluid communication with the reheater to receive a first portion of the heated inorganic particles. The inorganic particle cooler is configured to receive a cooling medium for indirect heat exchange with the first portion of the heated inorganic particles to form first partially-cooled heated inorganic particles that are fluidly communicated to the reheater and combined with a second portion of the heated inorganic particles to form second partially-cooled heated inorganic particles. A reactor is in fluid communication with the reheater to receive the second partially-cooled heated inorganic particles.03-28-2013
20130081797HEAT EXCHANGER HAVING POWDER COATED ELEMENTS - Powder coated heat exchange elements for a heat exchanger. Powder coating provides improved protective coating on surfaces of heat exchange elements. In many applications, the heat exchange elements are subjected to harsh operating conditions that promote corrosion. Traditional enamel coating tends to fracture when subjected to mechanical stresses thereby allowing corrosion inducing agents to penetrate and corrode the underlying surfaces. Powder coating reduces breaches in the protective layer. Powder coating may be adapted to withstand high temperatures so as to make them suitable for use in harsh operating environments. One such environment can be found in the processing of flue gas from fossil burning power generators, where the flue gas has a relatively high temperature and high sulfur content.04-04-2013
20130081796THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERFACE MATERIAL, AND JOINING STRUCTURE USING THERMAL INTERFACE MATERIAL - A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.04-04-2013
20130081798HEAT SINK, AND METHOD FOR PRODUCING SAME - A heat sink including a base section, connection fins, and parallel fins. The base section includes: a first base plate configured to be mounted with a heat generating component on its outer surface; a second base plate disposed to face the first base plate in a parallel manner, configured to be mounted with a heat generating component on its outer surface; and a third base plate disposed perpendicular to the first base plate and the second base plate, which secures the first base plate and the second base plate along a junction line. The base section includes first and second regions arranged in the direction of the junction line. The connection fins are disposed on the first region to connect inner surfaces of the first and second base plates and to be parallel to the third base plate, and the parallel fins are disposed on the second region from an inner surface of the third base plate to be parallel to the first base plate.04-04-2013
20100044024APPARATUS AND METHOD FOR CONTROLLED COOLING - An apparatus for controlled cooling and a control method related to controlled cooling of hot plate or strip shaped metal. The apparatus comprises a header fitted with a first valve which allows air to escape from the header and prevents cooling fluid escaping from the header when being filled and prevents air from getting back into the header. During operation due to the apparatus an improved operation even at low flow rates is possible.02-25-2010
20100096116Heat Diffuser with Silicone Handle - A heat diffuser for use with a cooking implement is disclosed. The heat diffuser may be positioned using its handle between a heat source and a cooking container to counteract high temperature zones within the cooking container. The diffuser thus aids in even heat distribution throughout a cookware container for more even cooking and provides the user with more control over the heat applied to the cookware container.04-22-2010
20090159255FOOD PREPARATION AND STORAGE DEVICE - A food storage and preparation device (06-25-2009
20090159254HEAT SINK ASSEMBLY AND METHOD OF FABRICATING - A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the heat sink assembly. The heat sink assembly can be mounted onto a mounting clip or threaded directly onto a device having mating threads. The device can be a printed circuit board or components of a printed circuit board adapted to have threads or other electrical or electronic component that is adapted to have threads to receive the heat sink assembly. The fin disks are interference fit onto the cylindrical core to form a fin disk assembly to provide thermo-mechanical contact between the fin disks and the cylindrical core. The base is then interference fit onto the fin disk assembly to provide thermo-mechanical contact between the fin disk assembly and the base to form a heat sink assembly. The device can then be assembled to the electrical or electronic component requiring cooling.06-25-2009
20130133871Multiple Thermal Circuit Heat Spreader - A heat spreader has more than one thermal circuit to give better performance over a wider range of heat input regimes. Different working fluids may be used in the different thermal circuits. The thermal circuits may extend in three dimensions to improve the density of the channels in limited space.05-30-2013
20090321060Cooling Fin - A cooling fin is integrally formed and comprises a board body, a passage penetrating the board body, and plural heat dissipating portions located outside the board body in the direction along the passage. Between each two neighboring portions is defined a heat dissipating space. By such arrangements, the cooling fin has the advantages such as better heat dissipation effect, easy to assemble and simple structure without any assembling operations and procedures.12-31-2009
20130032323HEAT SINK STRUCTURE - A heat sink structure includes a base and heat dissipating fins, which are arranged into at least two heat dissipating groups and integrally formed with the base. Lines connecting apexes of the heat dissipating fins in the heat dissipating group form a convex arc shape. In addition, The heat dissipating fins of the neighboring heat dissipating groups are arranged in the same pattern, or are arranged at different levels and in a gradually rising or gradually falling manner. Thus, the heat dissipation efficiency of the heat sink structure is enhanced.02-07-2013
20130032322EXTERNAL CELLULAR HEAT SINK STRUCTURE - An external cellular heat sink structure includes a base and a heat dissipating body integrally formed on the base. The heat dissipating body includes a plurality of hollow cellular units, wherein the neighboring cellular units are connected together, and each cellular unit has at least two openings for communicating the connected cellular units with each other. Thus, the cellular unit can provide the larger dissipation area, and each opening can let the gas pass and disperse the gas so that the time and possibility for the gas to contact the heat dissipating surface are lengthened and increased, respectively, and the heat dissipation efficiency is increased.02-07-2013
20130068439Heat Sink Assembly - A heat sink assembly (03-21-2013
20120181008HEAT SINK CLIP DEVICE - A heat sink clip device, configured to secure a heat sink to a heat generating unit, the heat sink clip comprises a thermal conductive board and a plurality of locking members. The thermal conductive board is attached to the heat generating unit. The thermal conductive board may include a plurality of connecting apertures. Each connecting aperture may include a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion. A plurality of locking members may be engaged with the corresponding connecting aperture. Each locking members may include a threaded member and an elastic unit sheathed on the threaded member. The threaded member may include a bar portion, a head portion and a blocking ring. The head portion and the blocking ring are respectively on both sides of the bar portion. The diameter of the bar portion may be a little bit smaller than the size of the smaller diameter portion. The outside diameter of the blocking ring may be a little bit smaller than the size of the bigger diameter portion. The inside diameter of the elastic unit may be a little bit bigger than the outside diameter of the blocking ring. The bar portion and the blocking ring may go through the bigger diameter portion and then may be secured to the smaller diameter portion. The elastic unit may be suppressed between the threaded member head and the thermal conductive board. This creates a heat sink clip device.07-19-2012
20100006278HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device for a heat generating element includes a fastening layer and a plurality of carbon nanotubes. The fastening layer is formed on the heat generating element. The carbon nanotubes are arranged in an array structure. The carbon nanotubes are arranged in a predetermined pattern. Ends of the carbon nanotubes are connected to the fastening layer.01-14-2010
20100006277ALUMINUM ALLOY MATERIAL AND PLATE HEAT EXCHANGER WITH SUPERIOR CORROSION RESISTANCE - Disclosed are an aluminum alloy material and a plate heat exchanger using the aluminum alloy material, both of which have superior corrosion resistance. Specifically, the aluminum alloy material includes an aluminum alloy base material having an anodic oxide layer with an average thickness of 1 to 20 μm as its surface layer, an organic phosphonic acid primer coating arranged on the surface of the aluminum alloy base material, and a fluorocarbon resin coating arranged on the surface of the organic phosphonic acid primer coating and having an average thickness of to 100 μm after drying.01-14-2010
20090314483HEAT EXCHANGER WITH A FLOW CONNECTOR - The invention relates to a heat exchanger (e.g., a charge air cooler) having a cooling body composed of flat tubes arranged at intervals and having corrugated fins positioned in the intervals. The charge air in the flat tubes can be cooled by cooling air flowing through the corrugated fins. The heat exchanger can include a flow connector and an integrated pre-cooler in which a medium, for example charge air, is cooled by means of a coolant. The pre-cooler/post cooler can be integrated into a section of the cooling body. A flow connector composed of at least two tubular parts which can be plugged one into the other, locked and sealed, can include a partitioning wall extending in one of the parts. At least one inlet connection and/or at least one outlet connection can be arranged on one or the other of the parts.12-24-2009
20130056193HEAT TRANSFER INTERFACE - Embodiments of the invention provide systems and methods for heat management systems at temperatures in the range of 120° C. to 1,300° C. The systems consist of various heat transfer chambers configured such that they contain heat transfer devices that are spherical, cylindrical or have other shapes, and that absorb heat within a broad range of temperatures, and return such heat at constant temperature over long periods of time.03-07-2013
20130056192HEAT DISSIPATION DEVICE WITH FASTENER - An exemplary heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and a spring coiled around the fastening element. The fastening element includes a pole portion, a head portion, and an engaging portion. The conductive plate has a through hole defined therein. An inner face defining the through hole includes a first face and a second face which have different curvatures. A flange protrudes from a circumference of the pole portion adjacent to the engaging portion. The structure of the flange matches the configuration of the through hole. After the flange extends through the through hole from a side of the conductive plate, the flange is rotated an angle and buckled at another opposite side of the conductive plate. The spring is compressed between the head portion and the conductive plate.03-07-2013
20120216997COMPOSITE PLATING LIQUID - In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.08-30-2012
20120216996THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module and a method of manufacturing same are disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module.08-30-2012
20110056670HEAT SINK - A heat sink includes a frame, a vapor chamber fixed to the frame, and a heat-dissipating plate adhered to one surface of the vapor chamber. The heat-dissipating plate has a first heat-dissipating fins region and a second heat-dissipating fins region. The first heat-dissipating fins region and the second heat-dissipating fins region are composed of a plurality of first heat-dissipating fins and a plurality of second heat-dissipating fins that are arranged at intervals, respectively. The pitch of the first heat-dissipating fins in the first heat-dissipating fins region is smaller than that of the second heat-dissipating fins in the second heat-dissipating fins region. By this arrangement, airflow can flow freely among the respective heat-dissipating fins. The first heat-dissipating fins region is used to dissipate a great amount of heat, while the second heat-dissipating fins region is used to exhaust the air rapidly. Thus, the heat-dissipating efficiency can be increased.03-10-2011
20100018690Thermal conduction principle and device for intercrossed structure having different thermal characteristics - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is thermal conductively coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between relay thermal conductor and second thermal body.01-28-2010
20090266531Heat Sink and Method of Manufacturing the Same - The invention seeks to provide a heat sink capable of sufficiently lessening the mounting dimensions of coil-shaped heat exchanging fin to offer a wide versatility and a suitable method for manufacturing the heat sink.10-29-2009
20130062046THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF - A thermal conductive sheet is obtained by preparing a resin layer, laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer, localizing the thermal conductive particle at one side by allowing the monomer to be absorbed in the resin layer, and thereafter, reacting the monomer to be cured.03-14-2013
20130062045HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.03-14-2013
20120222850HEAT EXCHANGER END CAP - A heat exchanger assembly, such as a condenser, may employ a portion of a heat exchanger end tank to define a slot with a second portion of the end tank. The first and second portions define an interior volume of the end tank. A flared end of a side plate may reside within the slot and may have a straight portion having a first width, a first step portion having a second width that is wider than the first width, and a second step portion that has a third width that is wider than the second width. The flared end may have a tab that protrudes from the second step portion and that is symmetrical about a longitudinal axis of the side plate. The end tank may define a second slot where the tab resides when the flared end resides over an entire cross-sectional portion of a volume defined by end tank.09-06-2012
20130213629COMPOSITE HEAT-DISSIPATION SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.08-22-2013
20110011573SIDE MATERIAL AND METHOD FOR PRODUCING THE SAME AND METHOD FOR PRODUCING CLAD MEMBER FOR HEAT EXCHANGER - Provided are a side member from which a clad member for heat exchanger exhibiting excellent productivity and corrosion resistance while preventing poor adhesion can be produced in production of a clad member for heat exchanger by controlling the surface state and flatness, a method for producing the side member, and a method for producing a clad member for a heat exchanger by using the side member. A side member (A) consists of a core material and one or more layers of side member (A) applied onto one side or both sides thereof and being used in a clad member for a heat exchanger, wherein a plurality of periodic forms (B) of fine groove which become arcuate toward one direction of the side member (A) is formed on the surface of the side member (A). The periodic form (B) of fine groove extends up to the outer circumferential edge of the side member (A) with a radius of curvature of 800-1500 ram and has a period (D) of 1-8 mm in the above-mentioned direction of the side member (A) and surface roughness of the side member (A) in the above-mentioned direction of 1-15 μm 10-point average roughness (Rz).01-20-2011
20100282459HEAT SINK AND METHOD FOR MANUFACTURING A HEAT SINK - A heat sink of a composite material having a first material and a second material is described, the first material including an electrical insulator, and the second material including an electrical conductor, the heat sink having a first side parallel to a main plane of extent of the heat sink, and the heat sink having a second side essentially parallel to the first side and opposite the first side perpendicularly to the main direction of extent, and furthermore the proportion of the first material in the area of the first side being greater than the proportion of the first material in the area of the second side.11-11-2010
20090236087HEAT EXCHANGE DEVICE - A heat exchange device includes a heat exchanger disposed in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, between which a plurality of thermoelectric elements is connected in series, via an insulating resin layer, which is composed of an epoxy resin or polyimide resin doped with fillers having high thermal conductivity, without intervention of a substrate. The heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining with one of the heat-dissipation electrode and heat-absorption electrode and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, wherein the joint regions and non-joint regions are alternately aligned. Thus, it is possible to achieve high reliability by reducing thermal resistance and thermal stress while increasing the maximum heat absorption coefficient (Qmax).09-24-2009
20120234525HEAT SPREADER FOR PLASMA DISPLAY PANEL - The invention presented is a method for applying heat spreaders to a plurality of plasma display panels, including (a) providing a plurality of heat spreader composites, each of which comprises a heat spreader material having an adhesive thereon and a release material positioned such that the adhesive is sandwiched between the heat spreader material and the release material; (b) removing the release material from a plurality of the composites; and (c) applying at least one of the composites to each of the plurality of plasma display panels each such that the adhesive adheres the heat spreader material to the plasma display panel.09-20-2012
20120234524HIGH THERMAL CONDUCTIVITY/LOW COEFFICIENT OF THERMAL EXPANSION COMPOSITES - A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.09-20-2012
20130160982HEAT SINK AND A METHOD FOR MAKING THE SAME - A heat sink and a method for making the same include steps of drawing-extrusion, cutting, ripping, inserting, and punching. By the step of drawing-extrusion, an extruded body is extruded and on an upper end thereof forms at least one set of elongated strips. The extruded body is cut into sub rippled bodies, and the elongated strips are ripped at intervals for forming separate sets of holding members. A fin set forms bent flakes with gaps at a bottom end of each fin unit thereof for combining with a radiating seat. Punched by punching molds, the holding members deform for firmly holding the bent flakes on each fin unit of the fin set, thereby achieving a complete combination of the radiating seat and the fin set. Accordingly, the radiating seat is lighter, which saves more materials and reduces manufacturing costs.06-27-2013
20130160983HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME - A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal interface material layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper, and the density of the first carbon nanotube paper ranges from about 0.3 g/cm06-27-2013
20090145592Windshield washer fluid heating system - The invention provides a system for capturing waste heat from a heat source via an air cooled radiator to heat a container of windshield washer fluid in a motor vehicle. The system's components include a radiator, means to induce air flow through the radiator, and a shroud assembly for mounting a windshield washer fluid container downdraft of the radiator. The shroud assembly includes a radiator shroud that is adapted to mount onto the radiator to define a plenum for receiving heated air and a windshield washer fluid container. The windshield washer fluid container may be formed with the radiator shroud as a single integral unit. On the container surface is a heat conductive element that is in direct contact with both the heated air flow and windshield washer fluid.06-11-2009
20100243229HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.09-30-2010
20100326645THERMAL PYROLYTIC GRAPHITE LAMINATES WITH VIAS - A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer.12-30-2010
20110277979Heat Exchanger - A radiator as a heat exchanger of the invention includes: an upper tank into which a cooling water flows; a core in which fluid from the upper tank is heat-exchanged; and a lower tank that collects the fluid from the core. A baffle plate is provided inside the upper tank, the baffle plate dividing an inner space into a lower space and an upper space and provided with a communication opening that communicates between the lower space and the upper space. A bent portion bent toward the lower space is provided at each longitudinal end of the baffle plate.11-17-2011
20110277980MICROFINS FOR COOLING AN ULTRAMOBILE DEVICE - The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.11-17-2011
20110277978SNAP-FIT TYPE HEAT SINK MODULE - A snap-fit type heat sink module includes a heat sink having at least one receiving slot, the receiving slot each including a first slot section sunken from one side surface of the heat sink and a second slot section extended from one side of the first slot section into the heat sink; and a snap-fit coupling member including a main body having a first surface and an opposite second surface, and at least one cantilever arm including a first arm section projected from the first surface for snap-fitting in the first slot section, and a second arm section extended from an end of the first arm section distant from the first surface for engaging with the second slot section. The heat sink and the coupling member can be quickly connected to each other at reduced cost by snap-fitting the cantilever arm in the receiving slot without the need of welding.11-17-2011
20090194268METHOD FOR MANUFACTURING A HEAT EXCHANGER - The method for manufacturing a heat exchanger from a plastic material comprises feeding of at least two sheet elements, and, by means of shaping means, shaping of said sheet elements to form heat exchanger plates. The shaping means are adapted to also undertake joining the sheet elements partly along edges so that a fluid inlet and outlet are created, whereby the sheet elements are pressed together. The heat exchanger plates are stacked and joined to a heat exchanger. The stack of heat exchanger plates is welded so that the fluid inlets are fluid outlets of the respective heat exchanger plates are combined to form a common fluid inlet and a common fluid outlet, and the sides of the heat exchanger plates are welded together, so that a fully functional heat exchanger is manufactured with plastic sheets as the only raw material.08-06-2009
20110061851COOLING ARRANGEMENT FOR AN ELECTRICAL CONNECTOR FOR A SUPERCONDUCTOR - A cooling arrangement for an electrical connector for a superconductor including at least one superconductor arranged in a container and the container is arranged in a vacuum chamber. A cryocooler is thermally connected to the container to cool the container and the contents of the container including the superconductor. The electrical connector extends through the vacuum chamber and the container to the at least one superconductor. The electrical connector has a thermally conducting and electrically insulating arrangement. The thermally conducting and electrically insulating arrangement comprises an electrically insulating member contacting the electrical connector. A thermally conducting member contacts the electrically insulating member and the thermally conducting member is thermally connected to the to cool the electrical connector.03-17-2011
20120186799Laminating Heat Sink Having Enhanced Heat Dissipation Capacity - A laminating heat sink includes a first heatsink plate, at least one second heatsink plate overlapping the first heatsink plate, and a plurality of fixing bars each extended through the first heatsink plate and the second heatsink plate to combine and fix the first heatsink plate and the second heatsink plate. The first heatsink plate has a first side combining a heat source and a second side abutting the second heatsink plate. Thus, each of the fixing bars is extended through the first heatsink plate and the second heatsink plate so that the heat produced by the heat source is directly introduced by the fixing bars and is transferred through the first heatsink plate and the second heatsink plate easily and quickly so as to achieve a quick heat dissipation effect.07-26-2012
20090095461Layered Heat Spreader and Method of Making the Same - A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are each oriented 90 degrees such that the thickness direction of the original sheet becomes the width or length of the cut strip. A side of a first strip adjoins a side of a second strip in each layer. Because of the greater thermal conductivity in the xy plane of the strips as compared to the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips in each layer. The first layer strips are oriented about 90 degrees from the orientation of the second layer strips.04-16-2009
20120186800HEAT SINK FOR ELECTRONIC DEVICE AND PROCESS FOR PRODUCTION THEREOF - A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.07-26-2012
20110048690Article for Magnetic Heat Exchange and Method for Manufacturing an Article for Magnetic Heat Exchange - An article (03-03-2011
20110272127COMPACT PLATE-FIN HEAT EXCHANGER UTILIZING AN INTEGRAL HEAT TRANSFER LAYER - A heat exchanger includes a housing which maintains a first section that has a first inlet and a first outlet, and a second section that has a second inlet and a second outlet. At least one conductive plate extends between the first section and the second section, wherein the conductive plate transfers heat from a fluid flowing in one of the sections to another fluid flowing in the other of the sections. The sections may be positioned side-by-side such that the fluids' flow is coplanar, or co-curvilinear, and non-intersecting.11-10-2011
20110272130HEAT EXCHANGER WITH RECEIVER TANK - In a heat exchanger 11-10-2011
20110272128RADIATOR AND ELECTRONIC DEVICE HAVING THE SAME - A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.11-10-2011
20120006523HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME - A heat exchanger having a fin member which can be easily formed by extrusion molding and warps (bends) less and configured such that an occurrence of voids at a weld portion between the fin member and a frame is suppressed. A method of manufacturing the heat exchanger is also provided. A heat exchanger has, mounted inside a frame forming an outer frame, a fin member having fins for forming flow channels for a refrigerant. The fin member is an integrally formed fin member formed by extrusion molding and is provided with a base formed in a rectangular flat plate-like shape, front side fins projecting from the front side of the base, and back side fins projecting from the back side of the base. In the fin member, the front side and the back side are not welded to the frame but the front ends of at least either the front side fins or the back side fins are welded to the frame.01-12-2012
20120006522IRON-BASED BRAZING FOIL AND METHOD FOR BRAZING - Disclosed are amorphous, ductile brazing foils with a composition consisting essentially of Fe01-12-2012
20100170670Advanced Cooling Method and Device for LED Lighting - A light emitting diode cooling device and method are disclosed for passively removing heat from the LED using liquid convection to cool the LED. The liquid convection cooling device operates to cool the LED by circulating a liquid cooling medium without consuming external power to move the medium.07-08-2010
20110297359SYSTEM AND METHOD FOR ATTACHING STAINLESS STEEL SIDE PLATES TO THE COPPER/BRASS TUBES OF A HEAT EXCHANGER CORE - A system and method for attaching very thin stainless steel plates to a radiator or heat exchanger core using the CuproBraze® brazing technique. The use of thin stainless steel side plates produces the structural strength needed in the radiator or heat exchanger core assembly without adding an excessive amount of weight. Heretofore, the CuproBraze® brazing technique has not been used with stainless steel. The stainless steel radiator or heat exchanger core side plates need only be about half as thick as a copper/brass side plate to provide the strength needed for support of the radiator or heat exchanger core.12-08-2011
20120012294HEAT SINK - A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base).01-19-2012
20110290468HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET - An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less.12-01-2011
20110297360HEAT TRANSFER BETWEEN TRACER AND PIPE - A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer.12-08-2011
20100263851HEAT-TRANSFER MECHANISM AND INFORMATION DEVICE - A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.10-21-2010
20100218931HEAT EXCHANGE AND HEAT EXCHANGE PROCESS - Heat exchange process comprising sequential cooling a first fluid by indirect heat exchange with a second fluid and comprising the following steps: 09-02-2010
20100263850HEAT SINK - A heat sink includes a base panel having parallel channels located on the top wall, first ribs protruding from the top wall and respectively extending along one side of each channel and second ribs protruding from the top wall and respectively extending along the other side of each channel, and radiation fins respectively mounted in the channels of the base panel and supported on the second ribs in vertical positions, each radiation fin having an angled foot portion, which is inserted into one channel and secured thereto by the associated first rib upon deformation of the associated first rib by an external force.10-21-2010
20110214849LAMP HOLDER - A lamp holder includes a heat dissipating seat having a compartment. A substrate is mounted in the compartment of the heat dissipating seat. The substrate includes a control circuit and at least one slot. At least one lighting element is mounted in the at least one slot and in electrical connection with the control circuit. The substrate further includes two flexible terminals in electrical connection with the control circuit and the at least one slot. When mounting the lamp holder into a space of a base, the flexible terminals are inserted into two coupling holes in a conductive portion of an inner periphery of the space. The heat dissipating seat is then pressed downward so that the resiliency of the flexible terminals urges the heat dissipating seat into the space of the base, providing easy assembly.09-08-2011
20110259569THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.10-27-2011
20110214852HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.09-08-2011
20110214851USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER - The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.09-08-2011
20120097382HEATING EXCHANGE CHAMBER FOR LIQUID STATE COOLING FLUID - A heat exchange chamber for liquid state cooling fluid is provided, which comprises a thermal dissipation device, and the thermal dissipation device sites in a cavity of the heat exchange chamber for liquid state cooling fluid. The thermal dissipation device comprises a plate and a plurality of heat dissipating fins formed on the plate, and the thermal dissipation device comprises at least one groove. After flowing through the heat dissipating fins, partial cooling fluid absorbs the heat of the heat dissipating fins and gasifies to bubbles. The design of the groove could discharge the bubbles trapped between heat dissipating fins helpfully and improve the efficiency of heat dissipation.04-26-2012
20100139907PASSIVE THERMAL INSERT FOR TEMPERATURE-CONTROLLED TRAYS AND FOOD SERVICE COUNTERS - Temperature control is provided to food dispensing vessels like condiment dispensers that are too tall to be stored in a shallow, temperature-controlled tray or basin by using inclined or tilted, thermally-conductive tubes placed inside a temperature-controlled tray. Thermal insulating covers improve the thermal efficiency of the tubes.06-10-2010
20090294113Heat exchanger - Disclosed is a heat exchanger. The heat exchanger includes a plurality of plates superimposed on one another, and a plurality of heat transfer fins formed on the plurality of plates, and shaped into an airfoil, wherein a channel of a fluid between the superimposed plates is formed to perform a heat exchange.12-03-2009
20090314482METAL POLYMER COMPOSITE WITH ENHANCED VISCOELASTIC AND THERMAL PROPERTIES - The invention relates to a metal polymer composite having properties that are enhanced or increased in the composite. Such properties include viscoelastic character, color, magnetism, thermal conductivity, electrical conductivity, density, improved malleability and ductility and thermoplastic or injection molding properties.12-24-2009
20090101324HEAT CONDUCTING APPARATUS - A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure.04-23-2009
20090151922Heat pipe and method for forming the same - A heat pipe and a method for forming the same are provided. The method includes: defining a closed end, a closed portion, and a contact section in sequence along a heat pipe to be processed; closing the opening of the closed end and the passage of the closed portion so as to finalize the heat pipe; and cutting axially the contact section into a plurality of equal parts, bending the equal parts outward to assume a divergent shape, thereby providing the contact section with an area for contact with a heat-generating source. Heat is directly transferred from the heat-generating source to the heat pipe via the contact section, thereby enhancing heat dissipation.06-18-2009
20090151920HEAT PIPES AND USE OF HEAT PIPES IN FURNACE EXHAUST - An array of a plurality of heat pipe are mounted in spaced relationship to one another with the hot end of the heat pipes in a heated environment, e.g. the exhaust flue of a furnace, and the cold end outside the furnace. Heat conversion equipment is connected to the cold end of the heat pipes.06-18-2009
20100319900COMPOSITE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY ND PROCESS OF FABRICATING SAME - The invention relates to high thermal conductivity (TC) materials, in particular, to copper-diamond composite materials, which can be used as heat exchangers, heat sinks, heat spreaders for electronic and other devices and a method of production thereof. A high TC diamond-metal composite according to the invention has a TC above 500 W/(m*K) and comprises coated diamond particles in a metal or metal alloy matrix having a TC of not less than 300 W/(m*K), wherein the particles are coated with a single-layered continuous high surface area coating comprising a metal and/or carbide of a carbide-forming element selected from IV-VI Groups of the Periodic Table, the coating having a thickness of less than 500 nm and a certain surface texture to provide high TC of composite.12-23-2010
20120024513COOLING STRUCTURE, HEATSINK AND COOLING METHOD OF HEAT GENERATOR - A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility. A fluid flow path is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Further, a fine recess is disposed on a surface of the heatsink that directly comes into contact with the cooling fluid.02-02-2012
20120024512HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE - A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.02-02-2012
20110192586HEAT-DISSIPATION STRUCTURE OF LED LAMP - A heat-dissipation structure of an LED lamp is disclosed. The LED lamp includes a metal profile, a lampshade attached to the metal profile from bottom, a lamp head mounted around the combined lampshade and metal profile, a printed circuit board set in receiving recesses bilaterally formed below the metal profile, and LEDs provided on a surface of the printed circuit board facing the lampshade. The heat-dissipation structure is characterized in a downward-bending accurate profile of the metal profile being formed between the receiving recesses, and two pads being each positioned between the flanges and the printed circuit board, the two pads serving to prop two lateral sides of the printed circuit board upward such that the printed circuit board fits the accurate profile and closely contacts the metal profile with increased contacting area. Thereby, the printed circuit board can have heat accumulated in operation rapidly dissipated from the metal profile.08-11-2011
20100122807Cooler / Heater Arrangement - The present invention relates to a device for heating and cooling an object in a controlled manner permitting a good thermal contact between the thermal block, the element for heating and cooling and the heat sink without the need for using a thermal interface material, an instrument comprising such a device and a method for conducting a thermal profile using the device.05-20-2010
20110079379MOLD POWDER SUPPLY APPARATUS USING THE WASTE HEAT OF A TUNDISH - The present invention relates to a mold powder supply apparatus using the waste heat of a tundish, which can collect waste heat from molten steel in the tundish, and preheat and dry mold powder. The mold powder supply apparatus using the waste heat of a tundish according to an embodiment of the present invention includes: a powder hopper that is mounted to a frame close to a tundish to absorb heat radiated from the top of the tundish, through one side; an agitator that agitates mold powder filled in the powder hopper; and a supply pipe that is connected to the bottom of the powder hopper to supply the powder hopper into a mold.04-07-2011
20110079378METHOD FOR MANUFACTURING A HEAT EXCHANGER AND EXCHANGER OBTAINED BY THE METHOD - The present invention relates to a method for manufacturing an air/fluid heat exchanger (04-07-2011
20110079377HEATING PAD - The heating pad has a case, a plug and heating liquid. The case is hollow, made by injection molding, and has a space, an opening and a loading surface. The space is formed in the case. The opening is formed in the case, and communicates with the space. The loading surface is flat, and formed on the case. The plug is detachable mounted tightly on the opening of the case. The case is filled with the heating liquid in the space, and the heating liquid can be heated to provide a warming effect.04-07-2011
20100084122RADIATOR APPARATUS - A radiator apparatus for concentrating or dispersing energy. In one embodiment, the radiator includes a thermal conductive layer, a radiation layer, and a thermal insulation layer. The radiation layer is powered by an energy source and includes at least one radiation element embedded in at least a portion of the thermal conductive layer. The thermal insulation layer faces the thermal conductive layer. In another embodiment, the radiator includes a generally helical dome-shaped radiation member powered by an energy source and a generally dome-shaped reflection member including a reflective surface facing the radiation member. In yet another embodiment, the radiator includes a radiation member powered by an energy source and a reflection member having an at least partially ring-shaped concave reflective surface facing the radiation member for distributing energy to an at least partially hat-shaped or ring-shaped area or zone.04-08-2010
20110168376HEAT CONDUCTION COMPOSITION - A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m07-14-2011
20130098592HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.04-25-2013
20090044934VERSATILE FLEXIBLE MAT AND METHOD OF IMPLEMENTING AND USING SAME - A flexible heating mat is provided. The mat comprises a plurality of sections, connected to each other by arch ribs. The arch ribs form a flexible, preferably raised, ceiling and a closed space above the precipitation-covered surface. Each section comprises a tube, capable of conducting a melting substance therethrough and dissipating it through at least one jet for melting of ice and/or drying of moisture. In other embodiments, the mat comprises at least one snow-mashing member. The mat may further comprise a pump for pumping out the melt and/or recycling the melting medium. Other embodiments are provided, and each of the embodiments described herein can be used alone or in combination with one another. The method of using the mat is also described and claimed.02-19-2009
20110198068Heat dissipation structure having combined cooling fins - The present invention relates to a heat dissipation structure comprising a metal base and a plurality of cooling fins, wherein the metal base is formed with a receiving space therein for receiving a heat generating object, an outer surface of the metal base is equidistantly formed with a plurality of recesses, each of the cooling fins is formed by a U-shaped metal plate including two heat dissipation portions and an elastic engagement portion, the elastic engagement portion is in U-shape and has two ends connected to one end of each of the two heat dissipation portions respectively, and an outer surface of the elastic engagement portion can be engaged with an inner surface of each of the recesses by the resilience thereof, so as to efficiently increase the amount and heat dissipation area of the cooling fins and greatly enhance the heat dissipation efficiency of the heat dissipation structure.08-18-2011
20110198067SHEET HAVING HIGH THERMAL CONDUCTIVITY AND FLEXIBILITY - [Problem] To reduce thermal resistance between a heating body and a radiating body.08-18-2011
20110198069ARTICLE FOR MAGNETIC HEAT EXCHANGE AND METHOD OF FABRICATING AN ARTICLE FOR MAGNETIC HEAT EXCHANGE - An article for magnetic heat exchange comprising a magnetocalorically active phase with a NaZn08-18-2011
20110168375Expandable fluid cooling structure - A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.07-14-2011
20090288815Heat-dissipating device without injection pipe and method of making the same - A heat-dissipating device without any injection pipe, which includes an upper cover plate and a lower cover plate. The upper cover plate is combined with the lower cover plate, wherein a crevice and an internal space are formed between the upper and lower cover plates. The crevice is sealed by where the upper and lower cover plates are close to the crevice by high-temperature autogenous welding to become a flat sealed surface flush with the surfaces of the upper and lower cover plates. Accordingly, the heat-dissipating device is provided with enhanced reliability and heat-dissipating efficiency. A method of making the heat-dissipating device includes the steps of putting the upper and lower cover plates together by welding; injecting a liquid working medium through the crevice into the internal space; and sealing the crevice by high-speed welding under a vacuum environment.11-26-2009
20090277621COOLING ELEMENT - Cooling element, with multiple cooling disks (11-12-2009
20100126709Heat Dissipating Module - A heat dissipating module is provided. The heat dissipating module includes a first heat dissipating unit and a second heat dissipating unit. The first heat dissipating unit has a first connecting portion. The second heat dissipating unit has a second connecting portion corresponding to the first connecting portion. The second connecting portion and the first connecting portion are connected to each other tightly.05-27-2010
20090288814Mixed Carbon Foam/Metallic Heat Exchanger - A heat exchanger includes a thermally-conductive fluid barrier having first and second surfaces, at least one first type of foam element placed in thermally-conductive contact with the first surface of the thermally-conductive fluid barrier and having a first coefficient of thermal expansion and at least one second type of foam element placed in thermally-conductive contact with the second surface of the thermally-conductive fluid barrier and having a second coefficient of thermal expansion. The first coefficient of thermal expansion of the first type of foam element and the second coefficient of thermal expansion of the second type of foam element are substantially different.11-26-2009
20110203784HEAT EXCHANGE DEVICE FOR POWDER AND GRANULAR MATERIAL, AND METHOD FOR MANUFACTURING THE SAME - An object of the present invention is to provide a heat exchange device for a powder and granular material, which is capable of suppressing an object to be processed from adhering/accumulating, and reducing the number of manufacturing processes (time), while keeping high heat efficiency, piston flowability and other advantages of a conventional device that uses wedge-shaped hollow rotating bodies. In order to achieve this object, a heat exchange device for a powder and granular material according to the present invention is configured such that at least one of a plurality of heat exchangers 08-25-2011
20080314576THERMAL MODULE WITH POROUS TYPE HEAT DISSIPATER - A thermal module (12-25-2008
20120031604SYSTEM AND METHOD FOR FABRICATING THIN-FILM PHOTOVOLTAIC DEVICES - Described is a vapor trap that enables the capture of material from the condensate of a vapor. The vapor trap includes an inner module, outer module and cooling system. The inner module has a transport channel to pass a web substrate or discrete substrate, and to limit conductance of the vapor. Plenums extend from the transport channel to an outer surface of the inner module. The inner module is configured to be at a temperature that is greater than a condensation temperature of the vapor. The outer module includes collection surfaces disposed across from the outer ends of the plenums. The temperature of the collection surfaces is less that a condensation temperature of the vapor. In various embodiments, the vapor trap is a selenium trap that can be used, for example, in a copper indium gallium diselenide (CIGS) deposition system for fabrication of thin film solar cells and modules.02-09-2012
20120292005THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME - A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles.11-22-2012
20120193083HEAT EXCHANGER ASSEMBLY WITH FIN LOCATING STRUCTURE - A heat exchanger includes a core with layers and a closure bar. The layers are arranged in a stack and include a first layer that is separated from abutting layers by a first parting sheet and a second parting sheet. Fins are disposed between the first and second parting sheets and form one or more tabs. The closure bar interfaces with the fins and receives the one or more tabs in one or more slots.08-02-2012
20080289810Thermal Diffusion Sheet and Method for Positioning Thermal Diffusion Sheet - A thermal diffusion sheet is provided with a graphite sheet for diffusing heat generated by a heat emitting body and a polymer film provided on the graphite sheet. The thermal diffusion sheet is provided with a positioning portion for carrying out positioning relative to the heat emitting body.11-27-2008
20110203783HOLOGRAPHIC PATTERNED HEAT MANAGEMENT MATERIAL - Embodiments of the present disclosure relate generally to body gear having designed performance characteristics, and in particular to methods and apparatuses that utilize an array of holographic heat managing elements coupled to a base material to direct body heat while also maintaining the desired transfer properties of the base material. In some embodiments, the heat managing material elements include heat-directing elements that reflect heat or conduct heat, and may be directed towards the body of a user or away from the body of the user.08-25-2011
20130213630Composite Heat Spreader - A composite heat spreader (08-22-2013
20100126708HEAT DISSIPATING STRUCTURE AND PORTABLE PHONE - A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.05-27-2010
20100200209METHODS AND DEVICES FOR DIRECTIONAL RADIATIVE COOLING THERMAL COMPENSATION - A radiative thermal compensation system is described. An imaging arrangement located in an optical path between a surface to be thermally compensated (e.g., cooled) and one or more thermal sinks. The imaging arrangement is oriented with respect to the surface and the sinks so that solid angles are defined, along which the sinks are imaged onto the surface and control heat flow from the surface.08-12-2010
20100139905Combination Heat Sink Formed of a Stack of Heat Spreader Sheet Members - A combination heat sink formed of a stack of heat spreader sheet members is disclosed. Each heat spreader sheet member has a flat base panel two side flanges respectively perpendicularly extending along two opposite lateral sides of the flat base panel in a parallel manner, a plurality of narrow elongated notches respectively symmetrically formed on the two opposite lateral sides of the flat base panel, and a plurality of protruding positioning portions respectively formed of the side flanges in such a manner that when two heat spreader sheet members are attached together the protruding positioning portions of one heat spreader sheet member are inserted through the narrow elongated notches of the other heat spreader sheet member bent sideways and secured to the side flanges of the other heat spreader sheet member, and therefore the two stacked heat spreader sheet members are firmed secured together.06-10-2010
20100139904HEAT SINK AND METHOD OF PRODUCING THE SAME - A heat sink (06-10-2010
20100139906DROP-IN PASSIVE THERMAL INSERT FOR FOOD SERVICE COUNTERS - Passive temperature control is provided to vessels too tall to be stored in a shallow, temperature-controlled tray or basin by a vertically oriented thermally-conductive tube. In one embodiment, an insulative collar covers the tray and insulates portions of the tube that extend above the top of the tray. Optional heat sinking fins and air convection holes increase heat transfer between the tube and the tray.06-10-2010
20090178796BASE PLATE FOR A DUAL BASE PLATE HEATSINK - A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.07-16-2009
20090139706COOLING PLATE STRUCTURE OF COOLING APPARATUS AND TRANSMITTER WITH THE COOLING APPARATUS - A cooling plate structure of a cooling apparatus includes a cooling plate and at least one refrigerant circulating conduit disposed in the cooling plate. The conduit includes refrigerant introducing and discharging ports disposed side by side on an outer surface of the cooling plate in an exposed state, a flow-in part extending from the introducing port to an intermediate position between the introducing port and the discharging port in the cooling plate, and a flow-out part extending along the flow-in part from the intermediate position to the discharging port such that flow-out part is separated from the flow-in part. Heat generating elements are disposed along the circulating conduit at an intermediate portion between a flow-in part corresponding portion and a flow-out part corresponding portion, both corresponding to the flow-in part and flow-out part of the circulating conduit, on the outer surface of the cooling plate.06-04-2009
20090139704HEAT SINK DEVICE - A heat radiator 06-04-2009
20090020279Jointing structure of a heat dissipating fin - A jointing structure of a heat dissipating fin, disposed on an upper level edge and a lower level edge of each fin body of the heat dissipating fin, comprises at least one hole or more on each of the level edges, at least one lock tab or more on the fin body of the heat dissipating fin corresponding to the hole, and the lock tab is formed by directly folding the fin body instead of extendingly disposed from the upper and lower level edges. More than one protrusion is disposed on each of the lock tabs. The protrusions on the lock tabs of the upper and lower level edges in a previous fin body are coupled into the corresponding holes of the upper and lower level edges in a next fin body, so as to join multiple heat dissipating fins integrally and stably.01-22-2009
20120067558THERMAL EXCHANGE DEVICE WITH INCREASED THERMAL EXCHANGE COEFFICIENT AND METHOD FOR PRODUCTION OF SUCH A DEVICE - A heat exchange device including a first surface configured to be in contact with a source of heat to be discharged and a second surface configured to be in contact with a coolant. The device includes a plurality of recesses fluidically insulated from one another, each recess leading onto the second surface via at least one channel, each channel having a length and a transverse size that prevents the coolant from entering the recess. The second surface has better wettability properties with respect to the coolant and the inner surfaces of the channels and the recesses have wettability properties less than or equal to those of the second surface.03-22-2012
20110220338LED HEAT SINK AND METHOD OF MANUFACTURING SAME - A LED heat sink and a method of manufacturing same are disclosed. The LED heat sink includes a holding zone bordered by one or more anchor portion of a higher elevation. The anchor zone has an upper side formed a compact stamping zone. The compact stamping zone is stamped forcefully through a mold in a diagonal direction towards the holding zone such that the material of the anchor zone is squeezed above the holding zone to form a latch hook to latch and press a LED lamp onto the holding zone so that the LED lamp is tightly in contact with the heat sink. Thus a forced transfer effect can be achieved to rapidly reduce the temperature of the LED lamp.09-15-2011
20110220340HEAT EXCHANGER ELEMENT - The invention relates to an heat exchanger element of a plate type, with one internal flow passage, comprising two plates defining an inlet, an outlet and an internal passage extending between said inlet and said outlet, whereas said passage is between two generally parallel plates of self supporting polymer material. The present invention also relates to the use of such an exchanger element as collector in a solar energy arrangement, as chilled beam, as hear distributing element, as subterranean collector, as exchange element in industrial processes and as heat absorber in arrangements for cooling electrical components that are negatively affected by being close to elements having electrical conductivity.09-15-2011
20090050308Base Structure for a Heat Sink - A base structure for a heat sink comprises: a heat conducting plate, a positioning piece, a plurality of legs and fasteners. The heat conducting plate is assembled together with the heat conducting plate to form two opposite guiding channels. The legs are positioned in the guiding channel by the fasteners. The fasteners are movable along the guiding channel along with the legs, and the legs are rotatable around the corresponding fastener, so that the positions of the legs are adjustable. Furthermore, the guiding channels is formed by the concave portion of the heat conducting plate and the groove of the positioning piece, and the heat conducting plate and the positioning piece can be produced separately, thus making it easier to produce the guiding channel.02-26-2009
20090065187ADJUSTABLE COOLING UNIT FOR SEMICONDUCTOR MODULE - A cooling unit for a semiconductor module includes a plate shaped first cooling body, a plate shaped second cooling body opposing the first cooling body and an adjustable cooling member placed between the first and second cooling bodies so that a distance between the first and second cooling bodies may be adjusted. Shapes of the cooling body include a honeycomb structure, cylinders, a hemicylindrical shape, a zigzag shape, and a bellows structure shape. By forming the cooling unit with an adjustable cooling member, the cooling unit can fit electronic devices of various sizes.03-12-2009
20110139429SHAPED HEAT SINKS TO OPTIMIZE FLOW - A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.06-16-2011
20090101325METHOD AND APPARATUS FOR COOLING SUPERCONDUCTIVE JOINTS - In a method and apparatus for joining a number of superconductive cables to establish electrical connection therebetween, a cup-like member having a base, a sidewall, and an opening to receive electrically conductive ends of said cables is provided. The base of the cup-like member is attached to a holder device. The holder device is attached to a cryogenically cooled surface. The ends of the superconductive cables are connected together within the cup-like member.04-23-2009
20110226459MATERIAL FOR JOINING AND PRODUCT PRODUCED THEREWITH - The invention relates to an iron-based brazing material comprising a brazing alloy, which alloy comprises: from about 9 wt % to about 30 wt % Cr, from about 5 wt % to about 25 wt % Ni, from about 0 wt % to about 9 wt % Mo, from about 0 wt % to about 5 wt % Mn, from about 0 wt % to about 1 wt % N, from about 6 wt % to about 20 wt % Si. Within the alloy is at least one of the B and the P are present as a melting point lowering supplement to Si, and wherein B is from about 0.1 wt % to about 1.5 wt %, or wherein P is from about 0.1 to about 15 wt % P. The brazing alloy may comprise contaminating elements as at least one of C, O, and S, and optionally the brazing alloy also comprises at least one micro-alloying element as V, Ti, W, Nb, or Ta, and the micro-alloying element is less than 1.5 wt % in the brazing alloy. All values are stated in weight percent, and wherein Si, B and P lower the liquidus temperature, that is the temperature when the brazing material is completely melted.09-22-2011
20110226458MODULAR HEAT SINK AND METHOD FOR FABRICATING SAME - There is described a method for fabricating a modular heat sink, the method comprising: extruding N individual integral heat sink segments using an extrusion process, each one of the N segments corresponding to 1/N of the modular heat sink, N being an integer greater than one; and assembling the N individual integral heat sink segments together in order to obtain the modular heat sink.09-22-2011
20110220339METHOD AND APPARATUS FOR REDUCING ACOUSTIC NOISE IN A SYNTHETIC JET - A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity.09-15-2011
20130213628Convective Airflow Using a Passive Radiator - Systems and methods to remove heat from an acoustic enclosure are provided. An apparatus for reproducing acoustic signals includes an acoustic enclosure comprising an acoustic volume. A heat producing element is coupled to the acoustic enclosure, and a thermally conductive structure is thermally coupled to the heat producing element. The thermally conductive structure includes a first surface. A first passive radiator includes a first diaphragm. The first diaphragm extends over at least a portion of the first surface and moves in response to pressure variations within the acoustic volume. Movement of the first diaphragm causes air to flow over the first surface, to facilitate heat removal from the thermally conductive structure.08-22-2013
20110139430HEAT DISSIPATION SYSTEM - A system for dissipating heat generated by an electronic system, for example an electronic device in an aircraft. The system includes a housing including an external lid covering the electronic system and configured to be in contact with a first cold source, and a second cold source located inside the external lid. The housing includes an internal lid located inside the external lid and covering the electronic system, the second cold source being located between the internal and external lids.06-16-2011
20090229809DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING - The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.09-17-2009
20090229808HEAT-CONDUCTING ASSEMBLY - A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.09-17-2009
20100263849SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH A HEAT SINK - A heat sink (10-21-2010
20090255658HEAT DISSIPATION MODULE - A heat dissipation module comprises an aluminum cooling block and a copper base. The cooling block has a plurality of fins extending outward radially from the periphery of the cooling block. The base fits with the cooling block. A central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block. The base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole. The heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively.10-15-2009
20120193084PURE TITANIUM SHEET EXCELLENT IN BALANCE BETWEEN STAMPING FORMABILITY AND STRENGTH - Disclosed is a pure titanium sheet having a strength corresponding to JIS Grade 2 level (215 MPa in terms of 0.2% yield strength) or more and having satisfactory stamping formability. The pure titanium sheet includes titanium and inevitable impurities, has a 0.2% yield strength of 215 MPa or more, has an average grain size d of its structure of 25 μm or more and 75 μm or less, and has a hexagonal crystal structure, in which respective grains in the hexagonal crystal structure have an average of Schmidt factors (SF) of (11-22) twins with a rolling direction as axes, and the average Schmidt factor (SF) and the average grain size d satisfy following Expression (1):08-02-2012
20100147503METHOD FOR PRODUCING HEATING PANEL AND HEATING PANEL RESULTING THEREFROM - Method for producing a heating panel, and heating panel resulting therefrom. In a first platform, a stack of a sound-proof and moisture-proof material and a thermal insulating material, through which shock-absorbing poles having protecting caps are inserted by a predetermined interval, is prepared. A lower thermal energy storage plate is attached to the thermal insulating material in a second platform, a heat conduction steel plate is attached to the lower thermal energy storage plate in a third platform, and an upper thermal energy storage plate is attached to the heat conduction steel plate in a fourth platform. Rivet holes are perforated through the thermal energy storage plates, heat conduction steel plate, and protecting caps in a fifth platform, and rivets are into the holes in a sixth platform. The rivets are riveted in a seventh platform, completing the complex heating panel. The completed panel is transported in an eighth platform.06-17-2010
20120103589HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE - Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.05-03-2012
20120103588HEAT-DISSIPATING SUBSTRATE - Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components.05-03-2012
20100155042TEMPERATURE-STABLE CAST IRON ALLOY AND USE OF SAID ALLOY - A description is given of a temperature-stable cast-iron alloy having high wear resistance at temperatures between 500 and 900° C. The alloy is characterized in that it has the following composition expressed in weight percentages: chromium: 15.0-20.0%, carbon: 1.0-2.0%, manganese: 0.8-1.2%, silicon: 1.2-1.5%, nickel: 1.5-2.5%, balance iron and unavoidable metallic and non-metallic contaminants where the non-metallic contaminants comprise nitrogen, oxygen, phosphorous and sulphur. Hereby is obtained a cast-iron alloy which has a higher wear resistance and a reduced tendency to form the undesirable sigma phase when heated to temperatures between 500 and 900° C. as compared to the known allows.06-24-2010
20100155043ELEMENT FOR EMISSION OF THERMAL RADIATION - The present disclosure provides an element for emission of thermal radiation. The element comprises particles arranged for receiving thermal energy and emitting at least a portion of the received thermal energy in the form of the thermal radiation. The thermal radiation predominantly has a wavelength or wavelength range within an atmospheric window wavelength range in which the atmosphere of the Earth has a reduced average absorption and emission compared with an average absorption and emission in an adjacent wavelength range whereby absorption by the element of radiation from the atmosphere is reduced.06-24-2010
20100163219Split Bearing Assemblies, Air-Cooled Heat Exchangers and Related Methods - Bearing assemblies are provided that include a bearing having a split bearing body that includes a material such as a composite or a thermoplastic; and at least one recess configured for receiving a rotary seal assembly; and at least one rotary seal assembly comprising an energizing component. The bearing assemblies may further include at least two recesses and/or an energizing component that is an o-ring.07-01-2010
20090294115Thermal Interconnect System and Production Thereof - A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.12-03-2009
20090294114HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes an evaporator section and a rectangular condenser section extending from one end of the evaporator section and surrounding the evaporator section. The heat sink includes a main body and a plurality of fins extending outwardly from four lateral sides of the main body. The main body defines a groove on an end surface thereof for receiving the evaporator section therein. Each of the fins includes a plate-shaped body and a flange extending perpendicularly from an end of the plate-shaped body. The top flanges cooperatively form a rectangular supporting surface for supporting the condenser section thereon. The supporting surface is lower than the end surface of the main body.12-03-2009
20100258288Heat Exchanger - A plate for the use in a heat exchanger cassette, where the plate comprises a corrugated pattern having a plurality of ridges (10-14-2010
20100181060HEAT RADIATOR OF SEMICONDUCTOR PACKAGE - A heat radiator of a semiconductor package, the heat radiator being provided on the semiconductor package, the heat radiator contacting a thermal interface material, the heat radiator includes a line state high thermal interface material standing, in a thermally conductive direction, on a surface of the heat radiator facing the thermal interface material. Head end parts of the line state high thermal interface material are adhered to a surface of the thermal interface material.07-22-2010
20100181059Stress equalized heat sink unit - A stress equalized heat sink unit includes a radiating fin assembly consisting of a plurality of radiating fans and a stress equalizing element. A part of the radiating fins are correspondingly cut at a predetermined position to form a receiving hole vertically downward extended from a top of the radiating fin assembly by a predetermined depth. The stress equalizing element is positioned on a bottom in the receiving hole to thereby locate the radiating fins in place. One side of the stress equalizing element facing away from the bottom of the receiving hole serves as a pressure receiving face. When a tightening device tightly fitted on the radiating fin assembly applies a downward pressure on the pressure receiving face of the stress equalizing element, the applied pressure is uniformly dispersed via the pressure receiving face and the radiating fins to avoid deformation of the radiating fins due to stress concentration.07-22-2010
20100186938HEAT TRANSFER SHEET AND HEAT DISSIPATION STRUCTURE - A heat transfer sheet of the present invention includes a heat transfer layer having a first portion and a second portion provided in a position different from the first portion in a planar view of the heat transfer layer, the second portion being capable of expanding and contracting in a thickness direction of the heat transfer layer at an expansion ratio larger than that of the first portion depending on temperature changes in an object from which heat is to be dissipated. In a state that the heat transfer sheet is used, in the case where a temperature of the heat transfer layer is a predetermined temperature or lower, thermal conductivity between the object and a dissipation member is lowered due to creation of a gap between the second portion and the object and/or the dissipation member, whereas in the case where the temperature of the heat transfer layer is a predetermined temperature or higher, the thermal conductivity between the object and the dissipation member is increased due to substantial elimination of the gap.07-29-2010
20100186937Heat dissipating device for LED light-emitting module - A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base;07-29-2010
20100186940Method, Device and System for the Heat Treatment of a Moving Metal Strip - The invention relates to a method for the heat treatment of a running metal strip, which comprises: a heating step for heating the strip; a step for cooling the heated strip; and conductive heat transfer from at least one segment of the strip which is being cooled to at least one segment of the strip which is being heated, so that at least part of each of said cooling and heating steps is carried out on the strip. The invention also relates to a heat transmission device for implementing said method and having at least one thermally conductive solid element, such as for example a roll, and to a system for the heat treatment of a running metal strip that incorporates such a device.07-29-2010
20100186939ATTACHING STRUCTURE OF COMPONENT FOR MOUNTING HEATING ELEMENT - The invention improves the heat radiation efficiency by improving the heat conduction efficiency after ensuring downsizing. A plurality of projections 07-29-2010
20100258287HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover.10-14-2010
20100193173HEAT SINKS AND METHOD OF FORMATION - A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.08-05-2010
20100193172FIN FOR A HEAT EXCHANGER - A fin for a heat exchanger is provided that includes a fin element which extends in a flow direction of a first fluid and has a wall face around which the first fluid flows on both sides, wherein at least one flap is provided in the wall face, which flap forms a cutout, through which the first fluid can flow, in the wall face, wherein a first straight edge of the flap extends substantially perpendicularly to the flow direction and is arranged at a distance from the wall face in order to form the cutout, wherein the flap has an inclined, smooth tab face which terminates at the first straight edge, and wherein the tab face is connected to the wall face via two side walls of the tab, which side walls have a curved profile mirror-symmetrically with respect to each other and, starting from the first edge, have a height which decreases in a manner corresponding to the inclination of the tab face.08-05-2010
20100018691FIN FOR HEAT EXCHANGER, GUIDE, AND METHOD OF USING THE GUIDE - A heat exchanger-use fin includes a fin body, collars and erect portions. The fin body has a plurality of holes. The collars surround the holes. The collars are disposed between two straight lines on a surface of the fin body. Outer peripheries of the collars contact the straight lines. The erect portions are positioned outside the two straight lines. Distal ends of the erect portions are in higher positions than distal ends of the collars relative to the surface of the fin body. A guide used with the fin includes first and second alternately arranged grooves. The second grooves are deeper than the first grooves. A method of using the guide includes slidably fitting the collars into one of the first grooves, and fitting the erect portions into the second groove adjacent to the first groove having the collars fitted therein.01-28-2010
20100212878Heat exchanger for bathirg shower - A manufacturing method and structure of a heat exchanger for a bathing shower involves two plates welded together to form a passage for cold water. Hot water from the shower drips onto the upper plate and transfer heat to cold water flowing through the passage between the plates. The upper plate may be spot welded to the lower plate at bottoms of frustoconical indentations in the lower plate, the plates may sandwich an adiabatic layer, and/or the passage between the plates may be formed by pipes situated between the plates.08-26-2010
20100276135COOLING FIN AND MANUFACTURING METHOD OF THE COOLING FIN - A cooling fin includes fin parts integrally extending from a base part. Each fin part is partially formed at a slant so that a proximal end portion is straight and a distal end portion is wavy (corrugated). Each fin part is partially slanted to make each fin part wavier as coming closer to the distal end portion from the proximal end portion. In a manufacturing process of the cooling fin, firstly, a straight cooling fin is produced by extrusion molding (an extruding step). Subsequently, the distal end portion of each fin is partially bent in a direction intersecting an extruding direction into a wave shape (a bending step).11-04-2010
20100276134Heat Sink for a RAM - A heat sink for a RAM includes a first and a second heat dissipating plate, on each of which a retaining tongue, a pair of locating tabs, and a catch tab are provided. The retaining tongue includes an expanded head portion and a narrowed root portion, and the head portion is a tab having a specific shape. The catch tab is provided with an expanded through retaining hole and a narrowed through root hole, which are configured to match the shape of the heat portion and the root portion of the retaining tongue, respectively. When the two heat dissipating plates are connected to each other, once the head portions and root portions of the retaining tongues are extended through the corresponding retaining holes and root holes of the catch tabs, the retaining tongues will not unexpectedly separate from the catch tabs.11-04-2010
20100212877AIRFLOW GUIDING AND HEAT DISSIPATING ASSEMBLY FOR ELECTRONIC DEVICE - An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.08-26-2010
20100218930SYSTEM AND METHOD FOR CONSTRUCTING HEAT EXCHANGER - The present invention generally relates to various types and/or structures of heat exchangers and to methods of making and/or using such heat exchangers. In one embodiment, the present invention relates to a system and method for constructing a microchannel gas-to-working fluid heat exchanger. In another embodiment, there is disclosed a power generation cycle that employs a heat exchanger that serves as a regenerative heat exchanger.09-02-2010
20100224354Depositing carbon nanotubes onto substrate - To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.09-09-2010
20100224353METHODS AND APPARATUS INVOLVING COOLING FINS - A fin apparatus including a corrugated strip of material having, a first lower planar surface, a second lower planar surface, a first upper planar surface corresponding to the first lower planar surface and the second lower planar surface, wherein the first lower planar surface and the second lower planar surface are operative to be attached to a surface of a component, and a first fin portion connecting the first lower planar surface to the first upper planar surface.09-09-2010
20100218927Heat exchange surface - A heating surface element with a zig zag arrangement of longitudinal undulations which serve to minimize the skew flow of the gas. The angle of the undulations is preferably 15° to 35° to the primary flow direction of the gas. When used in combination with a notched heat surface element, the undulation preferably crosses no more than one opposing notch before changing direction.09-02-2010
20100230085TURBULIZERS AND METHOD FOR FORMING SAME - Disclosed is a method of forming a heat exchanger turbulizer apparatus including a member having a longitudinal axis, a lateral width and a plurality of strips including first strips and second strips, each strip extending widthwise and being corrugated longitudinally so as to form a plurality of laterally spaced-apart sections connected to one another by bridges projecting from the sections in a common direction, the bridges of the first and second strips extending in the same direction and the corrugations of the second strips being offset laterally from the corrugations of the first strips. The method comprises: crimping longitudinally-corrugated strip material between first and second forming dies to form said apparatus, said dies being adapted such that substantially all lateral movement of strip material in crimping results from strip material being drawn laterally by material that has been displaced in a direction parallel to the direction of die movement.09-16-2010
20100236768LUBRICANT OIL COOLING APPARATUS FOR POWER TRANSMISSION APPARATUS - A lubricant oil cooling apparatus 09-23-2010
20120193085HEATSINK FOR LED ARRAY LIGHT - A heatsink that includes a plurality of thermally conductive plates coupled to each other in a stacked configuration. Each plate includes a core section and a plurality of protrusions extending radially outwardly from the core section in a direction substantially parallel to the core section. The core section of each plate is in direct contact with the core section of an adjacent plate.08-02-2012
20100243228Method and Apparatus to Effect Heat Transfer - The disclosed methods and apparatus seek to effect heat transfer through the use of one or more conductive fin devices. In addition, the disclosed devices seek to reduce the discharge of pollutants from primary combustion processes using carbonaceous fuel sources by implementing secondary combustion features and other apparatus. With more effective heat capture and utilization, the disclosed heat exchange technologies provide methods and apparatus to reduce heat dissipation to atmosphere. The methods and apparatus have application in the areas of industrial incineration, power boilers, water heaters, residential and commercial solid fuel waste heat recovery appliances, and electric power generation. In addition, the technology could have application in the areas of solar systems, desalination systems, aircraft and vehicular engines, electric motors, turbines, oil pans on internal combustion engines, transmission cooling pans, cooling navigational and electronic systems, and computer cooling and power supply.09-30-2010
20100252248HEAT EXCHANGER HEAT-UTILIZATION DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat exchanger heat-utilization device is obtained that can efficiently store heat and dissipate heat in or from a chemical thermal storage medium, and a manufacturing method of the heat exchanger heat-utilization device. A heat exchanger heat-utilization device includes: chemical thermal storage medium composite molded formed by organizing chemical thermal storage medium particles into a porous structural body having flow channels; and a heat exchanger body. The heat exchanger body has thermal storage medium containing portions in which the chemical thermal storage medium composite molded bodies are accommodated, and fluid flow channels that are partitioned from the thermal storage medium containing portions by partition walls and through which a heat exchange medium flows for heat exchange with the chemical thermal storage medium composite molded bodies.10-07-2010
20100294475HIGH PERFORMANCE HEAT TRANSFER DEVICE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME - Disclosed herein is an heat transfer device comprising a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous layer having a thickness effective to enclose a region between opposing faces; the region providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 1011-25-2010
20110056672Heat Spreader Having Single Layer of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders.03-10-2011
20110056671SOLID TYPE HEAT DISSIPATION DEVICE - Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.03-10-2011
20110056669Heat Transfer Device - According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, in which the length of the minor width is less than the major width. The cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.03-10-2011
20100200206Heat Sink Assembly - Apparatus and method for making a heat sink assembly. The apparatus includes a first clip configured to be urgingly attached to a heat producing device, the first clip having a first edge, a second edge, a third edge, and a fourth edge. The apparatus further includes a heat sink configured to be attached to the first clip, and a second clip configured to be attached to the first clip, the second clip being sized to accommodate a portion of the heat sink, and the second clip urging the heat sink towards the heat producing device. Methods to make the foregoing apparatus are also described.08-12-2010
20090283250HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY HEAT TRANSFER APPARATUS - A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.11-19-2009
20090321061METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEATURE DEVICES - Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.12-31-2009
20090178795Manufacturing method for a radiator and a structure thereof - A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred.07-16-2009
20100218928Method and apparatus for rapidly cooling a gem - A cooling apparatus includes a container configured to contain a coolant within a space. The apparatus further includes a cooling block positioned substantially within the space and having a high heat capacity such that the space not occupied by the cooling block is filled with a coolant to a level at or below the top of the cooling block, and a placement structure having high thermal conductivity positioned on top of the cooling block and outside of the space. A method for cooling an object is also provided, which includes inserting a coolant into a container configured to contain the coolant within a space, and placing the object on a placement structure outside the space. For this method, the placement structure has a high thermal conductivity and is coupled to a cooling block, the cooling block having a high heat capacity and positioned substantially within the space.09-02-2010
20110240280ALUMINUM ALLOY BRAZING SHEET AND HEAT EXCHANGER - The present invention provides an aluminum alloy brazing sheet that is applied particularly to a tube material of a heat exchanger and is excellent in brazability and erosion resistance.10-06-2011
20110000658HYDROPHILIC MEMBER - A hydrophilic member is provided which comprises a substrate of every kind having formed thereon a surface having excellent antifouling properties, quick-drying properties of water or the like, and wear resistance and being flexible.01-06-2011
20100243227Thermal interface material and method for manufacturing same - One embodiment of a thermal interface material includes a plurality of carbon nanotubes each having a first end and an opposite second end, a heat current collector covering one of the first ends and the second ends of the carbon nanotubes, and a macromolecular material filled in spaces between the carbon nanotubes and heat current collector. A method for manufacturing a thermal interface material is also provided.09-30-2010
20110108262HYDROPHILIC MEMBER, FIN STOCK, ALUMINUM-MADE FIN STOCK, HEAT EXCHANGER AND AIR CONDITIONER - A hydrophilic member endowed with sufficient hydrophilicity and excellent in the water resistance, antifouling property and scratch resistance can be provided, which is a hydrophilic member comprising a base material having provided thereon a hydrophilic film formed from a hydrophilic composition containing (A-1) a hydrophilic polymer having at least one hydrolyzable alkoxysilyl group on the polymer side chain and (B) a metal complex catalyst, wherein the water swelling degree of the hydrophilic film is 1.5 times or less.05-12-2011
20110024099CONTAINMENT FOR A PATTERNED METAL THERMAL INTERFACE - A system and method to improve long term reliability of an integrated circuit package containing a patterned metal thermal interface (PMTI), the method including: coupling a heat sink to a heat source; providing a PMTI material between the heat source and the heat sink; providing a partial containment of a compressed malleable metal to impede the PMTI from being inched-out of its location under a bearing load.02-03-2011
20110114302HEAT EXCHANGER - The invention describes a method for producing a plate heat exchanger 05-19-2011
20110017441Heat Sink Using Latent Heat of LED Street Light - There is provided a heat sink using latent heat of an LED street light, wherein a phase change material (PCM) is used in the heat sink to quickly and efficiently dissipate high-temperature heat which generated by LED elements when the street light using LEDs as a light source is turned on.01-27-2011
20110024101THERMAL CONDUCTIVE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer including thermal conductors formed to contact the lower heat sink layer, and an insulating adhesive portion filled between the thermal conductors, and an upper layer formed on the thermal conductor, wherein the upper layer contacts the thermal conductor so as to dissipate heat to the lower heat sink layer.02-03-2011
20110024100HEAT RADIATING UNIT STRUCTURE AND HEAT SINK THEREOF - A heat radiating unit is provided on a front face with at least one raised strip having a curved head portion and a neck portion, the neck portion being located at a joint of the raised strip and the heat radiating unit and having a width smaller than that of the curved head portion; and on a reverse face with at least one receiving groove opposite to the raised strip, the receiving groove having a curved recess portion and an engaging shoulder portion, and the engaging shoulder portion being located at a joint of the receiving groove and the heat radiating unit. A plurality of the heat radiating units can be assembled to provide a heat sink by engaging the curved head portion and the neck portion of one heat radiating unit with the curved recess portion and the engaging shoulder portion, respectively, of another heat radiating unit.02-03-2011
20110030939HEAT EXCHANGER BEDS COMPOSED OF THERMOMAGNETIC MATERIAL - What are described are a packed heat exchanger bed composed of thermomagnetic material particles which have a mean diameter in the range from 50 μm to 1 mm and give rise to a porosity in the packed bed of 30 to 45%, and a heat exchanger bed composed of a thermomagnetic material monolith which has continuous channels with a cross-sectional area of the individual channels in the range from 0.001 to 0.2 mm02-10-2011
20110030938HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM ADOPTING THE SAME - A heat dissipation structure includes a thermal interface material and a transition layer. The thermal interface material includes a matrix and a plurality of carbon nanotubes dispersed in the matrix. The thermal interface material has a first surface and a second surface opposite to the first surface. The transition layer is positioned on one of the first surface or the second surface of the thermal interface material. A thickness of the transition layer is in a range from about 1 nanometer to about 100 nanometers. The transition layer is in contact with the carbon nanotubes of the thermal interface material. An interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source. The present application also relates to a heat dissipation system adopting the heat dissipation structure.02-10-2011
20100132932METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION - Components having ceramic bases provided with a metalized structure on at least two opposite and/or juxtaposed faces at the same time, wherein metal in the form of pastes, films or sheets is provided for metallization and is applied to the surfaces of the ceramic base to be provided with a metalized structure.06-03-2010
20100132931THERMAL MODULE FOR LIGHT SOURCE - The present invention discloses a thermal module for light source, which comprises a heat-conducting part and a heat-dissipating part engaged therewith. The heat-conducting part is provided with a heat-receiving portion to receive the heat generated by a light source, a joint portion to join with the heat-dissipating part. The heat-dissipating part is provided with a plurality of fin-shaped heat-dissipating sheets for heat dissipation and to join with the joint portion of the heat-conducting part.06-03-2010
20100218929Heat sink - A heat sink includes a radiator fin for dissipating heat of an electronic device provided on a printed board; a plurality of radiator fins included in the heat sink is formed in an arbitrary diameter size; and the radiator fins are connected to each other by inserting a pair of fastening screws through a through hole provided on each of the radiator fins, and a tip end of the fastening screws is screwed and fastened to a screw hole of a base heat sink fixed on the upper surface of an electronic device.09-02-2010
20090032234APPARATUS FOR TRANSFERRING HEAT IN A FIN OF A HEAT SINK - An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included.02-05-2009
20110240279HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE - The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.10-06-2011
20100200208METHODS FOR ATTACHING CARBON NANOTUBES TO A CARBON SUBSTRATE - Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of various types of foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of foil, including substrates fabricated from carbon (CNT woven arrays, exfoliated graphite sheets, bucky paper, and the like) is disclosed.08-12-2010
20110083835Heat-dissipating structure and method for fabricating the same - Provided are a heat-dissipating structure and a method for fabricating the same so as for the heat-dissipating structure thus fabricated to dissipate heat from the heat-generating portion of an electronic device. The heat-dissipating structure includes a metal base and a carbon composite layer. The carbon composite layer is formed on the metal base and includes metal particles and carbon particles sintered together. The heat-dissipating structure is more effective in dissipating heat than a conventional vapor chamber or heat spreader. The heat-dissipating structure further includes a carbon composite layer and a metal plate with high thermal conductivity. The heat-dissipating structure is attachable to a heat-generating electronic component to facilitate heat exchange therebetween and thereby enhance heat dissipation.04-14-2011
20100038065Thermal conducting principle and device for prestressed clamping type multi-layered structure - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor having higher specific heat capacity is the heat transfer carrier between relay thermal conductor and second thermal body.02-18-2010
20090218087Thermal conduction structure, composite material, and method of producing the material - A thermal conduction structure includes a heat receiving portion, a heat releasing portion, and actuators disposed between the heat receiving portion and the heat releasing portion. A path is defined from the heat receiving portion to the heat releasing portion through the actuator. The actuator is movable between a first position and a second position to correspond to an energy supplied from outside, and is contact with the heat receiving portion and the heat releasing portion, when the actuator is in the first position. The path has a non-contact part between the heat receiving portion and the heat releasing portion, when the actuator is in the second position.09-03-2009
20120199337Heat Sink for Dissipating a Thermal Load - A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink.08-09-2012
20110247795SLIM TYPE HEAT DISSIPATION DEVICE - A heat dissipation device for transferring heat generated by a heat-producing element to a heat-dissipating element, includes a graphene plate, a main casing and a supporting plate. The graphene plate, in the form of relatively thin structure, has a first dissipation portion and a second dissipation portion extending from the first dissipation portion. The main casing, generally a planar structure, encloses the graphene plate therein, and has a first dissipation opening exposing the first dissipation portion of the graphene plate. The supporting plate extends integrally from the main casing in order to support the second dissipation portion of the graphene plate. The heat-producing element is inserted through the first dissipation opening in order to mount the same on the first dissipation portion of the graphene plate while the heat-dissipating element is mounted on the second dissipation portion of the graphene plate.10-13-2011
20100319898THERMAL INTERCONNECT AND INTEGRATED INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF - Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material.12-23-2010
20110100616Heat radiating structure and method for manufacturing the same - The present invention provides a heat radiating structure including: a metal substrate having a front surface facing a light emitting device, a rear surface opposite to the front surface, and side surfaces connecting the front surface and the rear surface; an oxide film pattern covering the front surface of the metal substrate; an adhesive film covering the oxide film pattern; and a metal pattern formed on the adhesive film and having a heat transmission via bonded to the oxide film pattern through the adhesive film.05-05-2011
20110073294SYSTEM, METHOD AND APPARATUS OF COOL TOUCH HOUSINGS - A system, apparatus and method for cool touch housings are described. The apparatus may include a housing arranged to at least partially enclose at least one internal component of a mobile device. A portion of the housing may include an exterior surface spreader, a thin active heat pump with a first side and a second side, wherein the first side of the thin active heat pump is thermally coupled to the exterior surface spreader, and an interior surface spreader thermally coupled to the second side of the thin active heat pump. Other embodiments are described and claimed.03-31-2011
20110073293Thermal Wick Cooling For Vibroacoustic Transducers - A soft thermally-conductive wick is provided to be connected between the metallic components on a transducer and onto a thermal sink. Beryllia ceramic is provided to improve heat flux within the transducer while maintaining electrical insulation. The wick provides adequate heat flux and such that the mass and stiffness of the wick do not adversely affect the vibroacoustic properties of the transducer in the frequency band of interest. The mass of the wick attachment is considered in the transducer design with the location and direction of the wick attachment designed so as to not introduce rocking modes or other adverse affects in the frequency band of interest. The wick may be strung, coiled, folded or configured in many ways between the transducer and the thermal sink to ensure that no acoustic or vibrational energy is transmitted down the length of the wick.03-31-2011
20110067850Buckling Device with Cooling Function - A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale.03-24-2011
20110061848Heat Dissipation Module and the Manufacturing Method Thereof - The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.03-17-2011
20110061847HEAT DISSIPATION DEVICE - A heat dissipation apparatus includes a heat conductive plate, a heat-dissipating fin set and a fastener. The heat-dissipating fin set has a bottom surface attached to a top surface of the heat conductive plate. The fastener includes a curled section and two legs joined to opposite ends of the curled section. Basically, the curled section is elastically deformable and has a trough pressing against a top surface of the heat-dissipating fin set and a crest spaced apart from the top surface of the heat-dissipating fin set. Each of the legs of the fastener has a clasping member to be fastened on heat conductive plate. When the clasping members of the legs are fastened on the heat conductive plate, the curled section is tightened by the legs.03-17-2011
20110061852HEAT RADIATION SHEET AND HEAT RADIATION DEVICE - A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.03-17-2011
20110061850SOLDERING WORK PIECE, SOLDERING METHOD AND HEAT EXCHANGER - The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer.03-17-2011
20110061849DEVICE FOR COOLING SEMI-CONDUCTORS - The device serves for cooling electronic structural elements and has a cooling body and a metal base plate constructed as a part of the support of the structural element. The cooling body is arranged adjacent the base plate. A connecting element is arranged at least over areas between the base plate and the cooling body. The connecting element is at least partially constructed of a metal which has a melting temperature of at least 60° C. The connecting element is provided with a frame-like seal.03-17-2011
20110030940CARBON FIBER CARBON COMPOSITE MOLDED BODY, CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND MANUFACTURING METHOD THEREOF - To obtain a carbon fiber-reinforced carbon composite material exhibiting excellent thermal conductivity in every direction in the plane containing the X and Y axes. A carbon fiber-carbon composite formed body in which a number of sheet-like dispersions containing pitch-based carbon fibers dispersed therein randomly in the plane containing the X and Y axes are laminated into a carbon fiber laminate, and pyrolytic carbon is deposited on the surfaces of the carbon fibers of the carbon fiber laminate to coat around the carbon fibers, whereby the carbon fiber laminate is filled with the pyrolytic carbon, and a carbon fiber-reinforced carbon composite material obtained using the carbon fiber-carbon composite formed body.02-10-2011
20120118549Heat Conducting Composite Materials, Systems and Methods For Manufacturing The Same - In one embodiment, a heat conducting composite material may include a bulk material, a conduit, and a conduit material. The bulk material forms a shaped body having a heat introduction portion and a heat dissipation portion. The conduit is disposed in the bulk material and connects the heat introduction portion to the heat dissipation portion. The conduit material is disposed within and fills the conduit. The bulk material thermal conductivity of the bulk material is about equal to a conduit material thermal conductivity of the conduit material at an activation temperature. The bulk material thermal conductivity is less than or equal to the conduit material thermal conductivity throughout an activation temperature range. The bulk material thermal conductivity is greater than or equal to the conduit material thermal conductivity throughout a deactivation temperature range.05-17-2012
20110253358LAMP ASSEMBLY - A lamp assembly is provided, including a light source, a thermal module, a connecting member, and an adapter electrically connected to the light source. The thermal module includes a first thermal member and a second thermal member. The first and second thermal members respectively have a plurality of first and second fins which are arranged in a staggered manner. The second thermal member forms a plurality of through holes for heat dissipation. The light source is disposed on the second thermal member, and the connecting member connects the thermal module with the adapter.10-20-2011
20100300669METHODS AND APPARATUS FOR A MICRO-TRUSS BASED STRUCTURAL INSULATION LAYER - An apparatus for maintaining a temperature differential between a component and a source of heat is described. The apparatus includes a micro-truss structure having a plurality of nodes and members which define a first surface and a second surface. The second surface is operable for attachment to the component. The apparatus further includes a skin material attached to the first surface of the micro-truss structure such that the skin material is operable for placement between the heat source and the micro-truss structure. The skin material defines at least a portion of a fluid flow path through the micro-truss structure. A skin material is not utilized with certain configurations of the micro-truss structure.12-02-2010
20100300670FIXING APPARATUS FOR HEAT SINK - A heat sink assembly includes a heat sink, and a fixing apparatus for fixing the heat sink. The fixing apparatus includes two fasteners to fix opposite ends of the heat sink, and a connecting piece connecting tops of the fasteners to abutting a top of the heat sink. A middle of the connecting piece is bent upwardly to depart from the top of the heat sink, to transfer pressing force to two portions of the connecting piece adjacent to the protruding portion, to allow the connecting piece to press a middle of the heat sink.12-02-2010
20100243230HEAT-DISSIPATING DEVICE INCLUDING A PLATING METAL LAYER - A heat-dissipating device includes: a planar body made of a graphite laminate and extending along an x-y plane of the graphite laminate; and a plating metal layer formed on the planar body. The heat-dissipating device further includes a metal panel. The planar body is connected substantially perpendicularly to the metal panel. A method of making the heat-dissipating device is also disclosed.09-30-2010
20110247797Plate Heat Exchanger - The invention relates to a plate heat exchanger for treatment of a medium, comprising a number of compression-molded heat exchanger plates, which are successively provided in a plate package and which form first plate interspaces and second plate interspaces, wherein the first plate interspaces and the second plate interspaces are provided in an alternating order in the plate package, where the inlet and outlets of the heat exchanger plate located in a centre portion of the plate heat exchanger, and where the plate package is arranged between end plates on each side of the plate package, where at least one of the end plates are provided with connections in a centre portion of the at least one end plate and that the location of the connections on the at least one end plate correspond to the location of the inlet and outlets of the heat exchanger plate. To be published together with 10-13-2011
20100038066Thermal conducting principle and device for prestressed clamping type multi-layered structure - The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof, wherein the interface thermal conductor having higher specific heat capacity is the heat transfer carrier between relay thermal conductor and second thermal body.02-18-2010
20120199334HEAT EXCHANGER WITH FOAM FINS - Heat exchangers are described that employ fins made of a heat conducting foam material to enhance heat transfer. The foam fins can be used in any type of heat exchanger including, but not limited to, a plate-fin heat exchanger, a plate-frame heat exchanger or a shell-and-tube heat exchanger. The heat exchangers employing foam fins described herein are highly efficient, inexpensive to build, and corrosion resistant. The described heat exchangers can be used in a variety of applications, including but not limited to, low thermal driving force applications, power generation applications, and non-power generation applications such as refrigeration and cryogenics. The fins can be made from any thermally conductive foam material including, but not limited to, graphite foam or metal foam.08-09-2012
20090255660High Thermal Conductivity Heat Sinks With Z-Axis Inserts - A heat sink including a composite material base plate that defines at least one through hole. At least one composite material insert is position into the at least one through hole prior to pressure infiltration. The composite material insert is oriented to increase thermal conductivity in the through-plan direction.10-15-2009
20090255659PROTECTIVE CAP FOR THERMAL GREASE OF HEAT SINK - A protective cap for use with a heat sink, includes a cover plate for enclosing thermal grease on the heat sink, and a plurality of strengthening ribs positioned on the cover plate. The strengthening ribs resist the heat sink to prevent the thermal grease from being pressed against the cover plate.10-15-2009
20090151921HEAT SINK HAVING LOCKING DEVICE - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.06-18-2009
20120199335RADIAL-FLOW HEAT EXCHANGER WITH FOAM HEAT EXCHANGE FINS - A radial flow plate-fin heat exchanger includes a plurality of heat exchange units connected together to form an annular shaped core. The core has a plurality of first fluid passageways that are circumferentially spaced from one another and that extend generally axially from a first end of the core to a second end. Each of the first fluid passageways is defined at least in part by a plurality of fins that include graphite foam. The core also has a plurality of second fluid passageways that are circumferentially spaced from one another and that extend generally radially from the central fluid passageway through an exterior wall of the core. The second fluid passageways are separated from the first fluid passageways so that a first fluid that flows through the first fluid passageways does not mix with a second fluid that flows through the second fluid passageways.08-09-2012
20090126922Heat transfer device - The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electronics, light-emitting diodes for solid-state lighting, semiconductor laser diodes, photo-voltaic cells, anodes for x-ray tubes, and solids-state laser crystals. Liquid coolant is flowed in one or more closed channels having a substantially constant radius of curvature. Suitable coolants include electrically conductive liquids (including liquid metals) and ferrofluids. The former may be flowed by magneto-hydrodynamic effect or by electromagnetic induction. The latter may be flowed by magnetic forces. Alternatively, an arbitrary liquid coolant may be used and flowed by an impeller operated by electromagnetic induction or by magnetic forces. The coolant may be flowed at very high velocity to produce very high heat transfer rates and allow for heat removal at very high flux.05-21-2009
20110042053SANDWICH MATERIAL FOR BRAZING WITH HIGH STRENGTH AT HIGH TEMPERATURE - The invention relates to a sandwich material for brazing comprising a core layer of a first aluminum alloy and a barrier layer of a second aluminum alloy characterized by that: the first alloy, constituting the core layer contains (in weight %): 0.8-2% Mn, ≦1.0% Mg, 0.3-1.5% Si, ≦0.3% Ti, ≦0.3% Cr, ≦0.3% Zr, ≦1.3% Cu, ≦0.5% Zn, ≦0.2% In, ≦0.1% Sn and ≦0.7% (Fe+Ni), the balance consisting of Al and ≦0.05% of each of the unavoidable impurities, and that the second alloy, constituting the barrier layer contains (in weight %): ≦0.2% Mn+Cr, ≦1.0% Mg, ≦1.5% Si, ≦0.3% Ti, ≦0.2% Zr, ≦0.3% Cu, ≦0.5% Zn, ≦0.2% In, ≦0.1% Sn and ≦1.5% (Fe+Ni), the balance consisting of Al and ≦0.05% of each of the unavoidable impurities, The invention also concerns a method for the manufacture of the sandwich material, a brazed product, such as a heat exchanger comprising the sandwich material and the use of the brazed product at high and low temperatures.02-24-2011
20110042052 COOLING MATERIAL - The present disclosure provides a cooling material which comprises a first spectrally selective component that comprises particles. The particles are arranged for emission of radiation predominantly having a wavelength or wavelength range within an atmospheric window wavelength range in which the atmosphere of the earth has a reduced average absorption and emission compared with an average absorption and emission in an adjacent wavelength range. Consequently, the cooling material is arranged for emission of thermal radiation and absorption of radiation from the atmosphere within that wavelength range is reduced. The cooling material further comprises a second spectrally selective component having a property that distinguishes the second spectrally selective component from the first spectrally selective component and facilitates at least one desired function of the cooling material.02-24-2011
20110042051TEMPERATURE STABLE CAST-IRON ALLOY AND ITS USE - A description is given of a temperature-stable cast-iron alloy having high wear resistance at temperatures between 500 and 900° C. The alloy is characterized in that it has the following composition expressed in weight percentages: chromium: 15.0-20.0%, carbon: 1.0-2.0%, manganese: 1.5-2.0%, silicon: 0.8-1.2%, nickel: 8.0-10.0%, molybdenum: 0.8-1.2% balance iron and unavoidable metallic and non-metallic contaminants where the non-metallic contaminants comprise nitrogen, oxygen, phosphorous and sulphur. Hereby is obtained a cast-iron alloy which has a higher wear resistance and a reduced tendency to form the undesirable sigma phase when heated to temperatures between 500 and 900 ° C. as compared to the known allows.02-24-2011
20110036553INTEGRAL EVAPORATOR AND DEFROST HEATER SYSTEM - A heat exchanger system having a fluid passage operable to fluidly communicate a first fluid and a heat transfer surface extending from the fluid passage for transferring heat between the first fluid and a second fluid. The system can further include a heating element operably coupled to and selectively applying thermal energy to at least one of the fluid passage and the heat transfer surface.02-17-2011
20110036552HEATSINK HAVING ONE OR MORE OZONE CATALYZING FINS - Ion wind fans produce ozone. In one embodiment, a heat sink used in conjunction with an ion wind fan includes at least one ozone catalyst fin coated with an ozone catalyst, to destroy at least some of the ozone produced by the ion wind fan. In one embodiment, the ozone catalyst fan protrudes from the downstream side of the heat sink towards the ion wind fan.02-17-2011
20120199336HEAT SINK WITH COLUMNAR HEAT DISSIPATING STRUCTURE - A heat sink includes a base and a heat dissipating structure composed of columnar heat dissipating units integrally formed on the base. Air stream gaps communicating with the dissipating units, each having opposite first and second sides, are formed. The first side is an arced surface structure, and the second side has a flow-guide projection. Furthermore, the dissipating units facing the same direction are arranged in an array. Alternatively, first sides of the outermost layer of the dissipating units face directions away from the inner layer of the dissipating units, and the corresponding directions of the first sides of the dissipating units from the outer to inner layers gradually deflect. The air streams flowing in various directions have the higher possibility of entering the dissipating structure and are dispersed. Thus, the time and possibility for the air to contact the dissipating units are increased, and the dissipation efficiency is increased.08-09-2012
20110253355LED LAMP RADIATOR - An LED lamp radiator comprising a generally ring-shaped upper base member; a generally ring-shaped lower base member; a plurality of fins fixedly attached to the upper base member and the lower base member, forming a generally cylindrical shape. Each of the plurality of fins having an upper portion, a middle portion and a lower portion, the upper portion being fixedly attached to a periphery of the upper base member, the lower portion being fixedly attached to a periphery of the lower base member, and the middle portion being configured for physically separating the upper base member and the lower base member. The LED lamp radiator further comprising a support plate removably secured to the upper base member, the support plate configured for supporting an LED lamp within the generally cylindrical shape formed by the upper base member, the lower base member and the plurality of fins.10-20-2011
20110253356Replacement Fitting and Method of Installing Same - A replacement fitting assembly for a pipe is disclosed including a split connector with a first wall portion having a first externally threaded portion and a first support portion, and a second wall portion having a second externally threaded portion and a second support portion, the first and second outer wall portions being configured to be aligned with one another to form a tubular opening, and a fastener having a side wall defining a central longitudinal opening, the side wall including an internally threaded nut portion configured to engage the first and second externally threaded portions of the connector, and an extension portion adjacent the nut portion, the side wall having a gap configured to permit lateral entry of a pipe into the longitudinal opening. A method of replacing a fitting assembly also is described.10-20-2011
20110253357HEAT SINK PROVIDING REDISTRIBUTED AIRFLOW THERETHROUGH - An exemplary heat sink includes elongated fins stacked together. Each of the fins includes a first dissipating portion and a second dissipating portion arranged in turn along a longitudinal axis of the fin. The first dissipating portion and the second dissipating portion of each fin are offset from each other along a stacked axis of the fins. An opening is defined in each fin between the first dissipating portion and the second dissipating portion thereof.10-20-2011
20080236804ELECTROTHERMAL INTERFACE MATERIAL ENHANCER - Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of aluminum foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of metallic foil is economical and may prove favorable in manufacturing due to its wide use.10-02-2008
20110005740COMBINATION HEAT SINK - A combination heat sink including a first radiating element having a first plane section and a second radiating element having a second plane section. Multiple first radiating fins integrally upward extend from the first plane section. Each two adjacent first radiating fins define therebetween a first connection section. Multiple second radiating fins integrally upward extend from the second plane section. Each two adjacent second radiating fins define therebetween a second connection section. The first and second radiating elements are connected with each other in an alternating manner with the first radiating fins attaching to and contacting with the second radiating fins to form the heat sink.01-13-2011
20110162828THERMAL PLUG FOR USE WITH A HEAT SINK AND METHOD OF ASSEMBLING SAME - A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.07-07-2011
20110259567THERMAL CONDUCTIVE SHEET - A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.10-27-2011
20100319899HEAT SINK AND METHOD OF MANUFACTURE THEREOF - In a first process of this method of manufacturing a heat sink, into a groove, formed in a base and both of whose side surfaces are provided with projections or concave portions and whose upper portion is open, from the groove open portion, there is fitted a pipe that has a diameter smaller than the gap between the edge portions of the open portion of the groove. Next, the pipe is pressed from above the open portion of the groove and the upper portion of the pipe is deformed so that it follows the plane of the open portion of the groove, and moreover both side portions of the pipe are deformed so that they follow along the inner surfaces of both side portions of the groove. By this second process, both side portions of the pipe are engaged with the projections or concave portions.12-23-2010
20100319897High-performance heat dissipation substrate with monoparticle layer - A high-performance heat dissipation substrate with monoparticle layer, including a surface plate having a first face connected to a heat source and a second face on which a heat dissipation substrate is disposed. The heat dissipation substrate is connectable to an external heat dissipation device. A thermal particle layer is disposed between the surface plate and the heat dissipation substrate in the form of a monoparticle layer. The thermal particle layer includes multiple thermal particles (ceramic materials as diamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacent to each other and partially inlaid in the surface plate and the heat dissipation substrate. The heat of the heat source can be transferred from the surface plate through the thermal particle layer to the heat dissipation substrate and dissipated outward.12-23-2010
20100319896THERMAL BLOCK AND THERMAL RAIL - The innovation relates to systems and methodologies for facilitating and/or enhancing heat transfer in a stage machine employed in an industrial or manufacturing environment. A thermal block and thermal rail combination and/or a thermal block and bearing rail combination draw accumulated heat away from a source of heat generated within the stage machine, and such combinations conduct the heat to a base of the stage machine. Each type of combination is conductively coupled such that the conductive coupling facilitates the translation or movement of the stage while maintaining contact to facilitate the conduction through the thermal block and thermal rail of the stage machine. The removal of the heat from the source of the heat or the accumulation of the heat within the stage machine system prevents distortion of the machine or products being manufactured or measured by the machine from the heat.12-23-2010
20100319895HEAT SPREADER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A heat spreader structure includes at least one carbonaceous matter-metal composite layer having a plurality of carbonaceous particles and at least one metal-mesh layer having a plurality of meshes. The carbonaceous particles are either separately firmly held inside the meshes of the metal-mesh layer or covered and held in place by the metal-mesh layer. The carbonaceous matter-metal composite layer can be coated on a metal-made body through sintering to ensure good bonding of the carbonaceous particles to the metal-made body and accordingly enhance the heat spreading efficiency of the metal-made body. A method for manufacturing the heat spreader structure is also disclosed.12-23-2010
20120031603IN-PLANE SILICON HEAT SPREADER AND METHOD THEREFOR - A method of dissipating heat from a heat source includes providing a plurality of heat flux paths in a plane of the heat source to remove heat from the heat source.02-09-2012
20100282458CARBON FIBER HEATING SOURCE AND HEATING SYSTEM USING THE SAME - A carbon fiber heating source includes a bundle of carbon fibers combined with glass fibers. The bundle is surrounded with a silicone coating layer and has high tensile strength responsive to bending and tension while emitting heat at high temperature. The carbon fiber heat emitting source includes heat emitting fibers formed by combining carbon fibers with glass fibers. Connection terminals are formed at both ends of the heat emitting fibers so that electricity can be applied thereto. A coating member coats the surfaces of the heat emitting fibers and the connection terminals. The coating member may be a silicone coating layer formed on the heat emitting fibers and the connection terminals. The coating member may be a quartz pipe that is filled with LPG and hydrogen and receives and seals the heat emitting fibers such that only a portion of the connection terminals is exposed from the both ends.11-11-2010
20100282457ENERGY-SAVING PLAN - An energy-saving pan which is characterized in a bottom with a plurality of lattices, a plurality of radial fins, a plurality of spiral fins, a plurality of L-shaped protuberances, or a plurality of cylindrical pins thereby increasing heat absorbing area of said bottom and reducing reflection of heat energy.11-11-2010
20110108261THREE-LAYERED COLD/HOT CONTROLLER - A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.05-12-2011
20110114303ULTRASONIC PROBE HAVING HEAT SINK - The present invention provides an ultrasonic probe which includes a heat sink (05-19-2011
20110114301HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.05-19-2011
20120199333CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THERMAL CONDUCTIVITY CHARACTERISTICS - A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.08-09-2012
20110132591HEAT EXCHANGER AND METHOD OF MANUFACTURING SAME - Provided are a heat exchanger having a novel structure and efficiently cooling a heat generating body, and a method of manufacturing the heat exchanger. A heat exchanger has flow paths formed by being closed by an upper plate and a lower plate which have rectilinearly formed upstanding fins parallelly arranged at specific intervals, and gaps extend between adjacent fins in the top-bottom direction along the direction in which the fins extend. Either of or both the upper plate and the lower plate are provided with projections arranged in the longitudinal direction of the flow path and projecting inward of the flow path.06-09-2011
20110168374CORRUGATED-FIN TYPE RADIATOR - Disclosed is a corrugated-fin type radiator (07-14-2011
20110094723COMBINATION OF FASTENER AND THERMAL-CONDUCTING MEMBER - A combination of a fastener and a thermal-conducting member is mounted on an electronic heat-generating member. The fastener includes a plate provided with an opening for allowing the electronic heat-generating element to be disposed therein; posts connected to the plate and formed around the opening; and clamping arms extending from the plate opposite to the posts. The thermal-conducting member is disposed on the plate to span the opening. The clamping arms are bent to press in the thermal-conducting member, thereby forming on the surface of the thermal-conducting member with a plurality of positioning notches for allowing the clamping arms to be inserted therein. With this arrangement, the fastener can be combined with the thermal-conducting member tightly. Thus, the heat generated by the electronic heat-generating element can be continuously conducted to the outside, so that the temperature of the electronic heat-generating element can be kept in a normal range.04-28-2011
20110180247HEAT EXCHANGER - The invention relates to a plate heat exchanger (07-28-2011
20110259571HYDROPHILIC COMPOSITION AND HYDROPHILIC MEMBER HAVING ANTIFUNGAL PROPERTY - The invention can provide a hydrophilic composition and a hydrophilic member having high hydrophilic property and excellent durability and high antifungal effect.10-27-2011
20110259570HEAT RADIATOR COMPOSED OF A COMBINATION OF A GRAPHITE-METAL COMPLEX AND AN ALUMINUM EXTRUDED MATERIAL - To provide a heat radiator that is useful for an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and falls at high temperatures.10-27-2011
20110259566THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test (10-27-2011
20100163218Split Bearing Assemblies, Air-Cooled Heat Exchangers and Related Methods - Bearing assemblies are provided that include a bearing having a split bearing body that includes a material such as a composite or a thermoplastic; and at least one recess configured for receiving a rotary seal assembly; and at least one rotary seal assembly comprising an energizing component. The bearing assemblies may further include at least two recesses and/or an energizing component that is an o-ring.07-01-2010
20110186281COOLING TOWER HAVING REDUCED MICROBIAL CONTAMINATION - The invention relates to a cooling tower in which contamination with and proliferation of microorganisms can be prevented by incorporating composite materials and/or material combinations and an antimicrobial substance containing tungsten and/or molybdenum into the cooling tower.08-04-2011
20110186282METHOD AND DEVICE FOR ADJUSTING THE COOLING AND ENERGY RECOVERY OF A STEEL STRIP IN AN ANNEALING OR GALVANIZATION PHASE - A method and a device adjust the cooling of a steel strip in an annealing or galvanization phase. The device is suitable for the forced cooling of a steel strip continuously running in a plant adapted for the continuous annealing or the continuous tempering galvanization. The device has at least one exchange member for transferring the heat of the steel strip to cooling water and includes an outlet for the cooling water thus heated up. At least one cooling unit is provided and has a sealed enclosure connected to the outlet of the exchange member and includes at least one outlet to a Venturi effect device such as a vapor outlet ejector and in which the cooling water itself is subjected to a vacuum-vaporization cooling. An auxiliary outlet of the sealed enclosure is connected to an inlet of the exchange member.08-04-2011
20110186280Radiator fin and radiator fin component thereof - One or more radiator fins each includes two heat conducting vanes which are joined end to end and top to top. There are multiple strength vanes next to inner walls of the heat conducting vanes in the space between two heat conducting vanes. The radiator fins are made into porous structure and bear high pressure. The two heat conducting vanes have corresponding allowing ventilation region and the radiator fins have multiple heat conducting paths and can achieve a very good cooling effect. A radiator fin component includes multiple radiator fins and a base, wherein multiple track grooves are provided in the base. The radiator fins possess rivet joints corresponding to rivet joints of groove regions of the base. After the rivet joints are pushed into the corresponding grooves, downward pressure can be applied to the top of the radiator fins fixing the radiator fins in the base.08-04-2011
20110259565HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.10-27-2011
20100025030HEAT CONDUCTIVE PLATE STRUCTURE - A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to define a clearance therebetween; a coupling film disposed above the electric conduction layer and the seating portion to define an inner clearance in communication with the clearance of the electric conduction layer and an outer clearance surrounding the inner clearance; a non-weldable material for inserting into the inner clearance and the outer clearance in the coupling film; a heat conduction member disposed on a central portion of the coupling film; an electric conduction member disposed above the coupling film to surround the heat conduction member from an exterior thereof; and a high power element mounted above so as to be in direct contact with the heat conduction member and the electric conduction member simultaneously.02-04-2010
20110297361Low Stress-Inducing Heat Sink - A low stress-inducing heat sink may reduce thermally induced stress and strain in the heat source. The low stress-inducing heat sink may be made of materials with low thermal conductivity. The heat sink may have in-plane flexibility and hence reduce thermally induced stress and strain generated in the heat source and at the interface of the heat sink and the heat source.12-08-2011
20110297362MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING - A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.12-08-2011
20120037351METHOD FOR MANUFACTURING HEAT SINK HAVING HEAT-DISSIPATING FINS AND STRUCTURE OF THE SAME - A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.02-16-2012
20100218932THERMALLY CONDUCTING FOAM INTERFACE MATERIALS - In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.09-02-2010
20120145374HEAT SINK - An exemplary heat sink includes a base plate and a fin unit including a plurality of fins arranged on the base plate. One of the base plate and fin unit includes a protruding member, and the other one of the base plate and the fin unit defines a groove corresponding to the protruding member. The protruding member is interferingly fitted in the groove thereby connecting the fin unit and the base plate together.06-14-2012
20120305230DEVICE FOR HOLDING A SOURCE OF LIGHT - An assembly includes a light source holding component sized and arranged to securely receive a source of light. The light source holding component may include a displaceable protective device that functions to generally protect against an accidental touching of electrical terminals of the light source holding component. An accessory mounting feature may also be provided to the light source holding component, The accessory mounting feature is adapted to cooperate with an accessory to provide a seal against a surface to which the light source holding component is attached. The light source holding component may have wire ports that are formed within an overall general outer diameter of the light source holding component. By way of example, the wire ports may include wire contacts having wires pre-attached thereto or the wire ports may include electrical connectors of the push-in type for receiving and thereupon holding wires inserted therein.12-06-2012
20090151923THERMAL GROUND PLANES, THERMAL GROUND PLANE STRUCTURES, AND METHODS OF HEAT MANAGEMENT - Thermal ground planes, thermal ground plane structures, and methods of thermal energy management, are disclosed.06-18-2009
20110315365HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - A heat sink composed of a fin set and a seat and a method for manufacturing the same are disclosed. One side of the seat is provided with a plurality of rail rods whose cross sections are of a hook shape. One side of the fin set is formed with a plurality of slots corresponding to the rail rods. Thus the fin set and the seat can be assembled by engagement of the rail rods and slots. A press mold is employed to press the rail rods, thus the rail rods are deformed to make the fin set and seat tightly engage with each other.12-29-2011
20110083836HEAT RADIATING COMPONENT - A heat radiating component provided on a semiconductor package, the heat radiating component coming in contact with a semiconductor element, the heat radiating component includes a heat radiating plate having a concave part; linear high thermal conductivity materials formed on a bottom surface of the concave part so as to stand in a thermal conductive direction; first and second resin layers configured to fill space parts formed by the neighboring linear high thermal conductivity materials, the first and the second resin layers being stacked on the bottom surface of the concave part in order to expose head end parts of the linear high thermal conductivity materials; and a metal layer formed on an upper surface of the second resin layer and at least a portion of a surface of the heat radiating plate where the concave part is formed.04-14-2011
20110079376COLD PLATE WITH PINS - A cold plate includes an enclosure with an inlet, an outlet, a base and a lid. The inlet and outlet are in fluid communication, so fluid can flow from the inlet though the enclosure to the outlet. The base is formed from a base plate, and the base plate includes an island facing into the enclosure. A plurality of pins extends from the island toward the lid. The pins can have a spiral shape, where the cross sectional profile of the pins change along the length of the pin.04-07-2011
20110315367FLUID COOLED ASSEMBLY AND METHOD OF MAKING THE SAME - A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.12-29-2011
20110315366HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - A heat sink composed of a fin set and a seat and a method for manufacturing the same are disclosed. One side of the fin set is provided with a plurality of rail rods whose cross sections are of a hook shape. One side of the seat is formed with a plurality of slots corresponding to the rail rods. Thus the fin set and the seat can be assembled by engagement of the rail rods and slots. A press mold is employed to press the rail rods and the slots, thus the rail rods and slots are deformed to make the fin set and seat tightly engage with each other.12-29-2011
20090308585Method for Manufacturing Tube and Fin Heat Exchanger with Reduced Tube Diameter and Optimized Fin Produced Thereby - An improved method for manufacturing tube and fin heat exchangers that, according to a preferred embodiment, includes a process for increasing the stiffness and rigidity of heat exchanger fins. Stiffer fins have a greater tendency to maintain proper alignment within a stack of fins, which aids in lacing long stacks of fins with small (e.g., 5 mm) diameter tubing. Preferably, fin stiffness is increased by forming a plurality of longitudinal ribs within the fin during the fin stamping process. More preferably still, two ribs for each longitudinal row of collared holes are provided. The preferred embodiment also includes a slotted heat exchanger fin that is dimensioned and arranged for optimized thermodynamic performance when used with small diameter tubing, thus reducing the space required for a given heat exchanger system.12-17-2009
20120061067Heat sink - A heat sink includes a pillar member, to which a device that generates heat is to be mounted, and a plurality of heat-dissipating fins arranged on a side surface of the pillar member to dissipate the heat generated by the device. The heat sink further includes a ring-shaped holding member that has a plurality of grooves formed therein. The holding member is mounted to a longitudinal end of the pillar member and has each of the heat-dissipating fins inserted in a corresponding one of the grooves of the holding member, thereby holding the heat-dissipating fins to the pillar member. Each of the heat-dissipating fins has a detachment prevention portion that prevents the heat-dissipating fin from being detached from the pillar member in a direction perpendicular to the longitudinal direction of the pillar member.03-15-2012
20120000636CHIP COOLING DEVICE HAVING WEDGE ELEMENT - The present invention relates to a cooling device improving the heat transfer between a chip (01-05-2012
20120000637PLATE, HEAT EXCHANGER AND METHOD OF MANUFACTURING A HEAT EXCHANGER01-05-2012
20120000638CONFINEMENT GROUP FOR A PLATE HEAT EXCHANGER, A METHOD OF OBTAINING SUCH AN EXCHANGER, AND A METHOD OF ABSORBING STRESS IN A CONFINEMENT GROUP FOR PACK-TYPE PLATE HEAT EXCHANGERS - The present disclosure relates to a confinement group for a pack-type plate heat exchanger including at least one pair of end heads (01-05-2012
20110155364SMART PASSIVE THERMAL DEVICES AND METHODS - Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film.06-30-2011
20110155363MEMORY MODULE ASSEMBLY AND HEAT SINK THEREOF - A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly cling to the respective heat source.06-30-2011
20110155362METHOD AND APPARATUS FOR HEATING COUPLING MEDIUM - An ultrasound diagnostic apparatus includes an apparatus for heating a coupling medium, wherein the apparatus includes an external heat conductive unit, including a base for positioning a container storing the coupling medium, and an internal heat sink unit for absorbing heat from the heat generating unit of the ultrasound diagnostic apparatus. The external heat conductive unit and the internal heat sink unit are configured as separate assembly structures such that, in the state of assembly, the heat of the heat generating unit is transferred to the container through them.06-30-2011
20110155361Heat dissipation module and portable device having the heat dissipation module - A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element.06-30-2011
20110155360Surface mount heat sink apparatus - A surface mountable heat sink apparatus for use with surface mount electronic components comprises a heat dissipating body and a plurality of solderable feet complying with Surface Mounting Technology (SMT). The heat dissipating body and the solderable feet are made of different materials and of unitary construction. The solderable feet project partially beyond one edge of the heat dissipating body. The surface mount heat sink apparatus and surface mount electronic component are touchlessly sandwiched and simultaneously soldered onto the solder drain pads on the printed circuit board. Heat dissipated from the surface mount electronic component is conductively transferred to the heat sink body through the solder drain pad, printed circuit board and solderable feet, and finally rejected to surroundings thereafter. Like all the SMT electronic components, the surface mount heat sink apparatus can be placed onto the printed circuit board manually or automatically by a pick-&-place automation equipment.06-30-2011
20120006521Heat sink for an electronic component - Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the direction toward one of the cooling fins and are oriented at an angle to the orientation of the associated cooling fin.01-12-2012
20120006520COOLING APPARATUS FOR A WEB DEPOSITION SYSTEM - Described are an apparatus and a method for cooling a web. The apparatus includes an inner cylinder having a void therein and configured for coupling to a gas source. The apparatus also includes an outer cylinder having an inner surface, an outer surface to support a web and apertures between the inner and outer surfaces. The outer cylinder rotates about the inner cylinder so that gas provided to the void of the inner cylinder flows through the apertures that are adjacent to the void and passes to the outer surface of the outer cylinder to increase the heat transfer between the web and the outer cylinder. The volume of gas introduced into the vacuum deposition chamber during a process run is thereby limited. Advantageously, the apparatus enables higher deposition rates and increased productivity.01-12-2012
20100200207HYDROPHILIC COMPOSITION - A hydrophilic composition containing a hydrophilic polymer (A) having two or more hydrolyzable silyl groups per molecule and a catalyst (B), with the surface zeta potential of a coating film obtained by coating and drying the hydrophilic composition being from −15 mV to 10 mV, is provided for the purpose of providing a hydrophilic composition capable of forming a hydrophilic coating film having excellent scratch resistance and antifouling properties without hybridizing with sol-gel.08-12-2010
20120012295HEAT EXCHANGER AND METHOD OF MANUFACTURING THE SAME - A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.01-19-2012
20120055662Hot-Runner System having Non-Structurally Supportive Heat Insulator Including Visible Material - Hot-runner system (03-08-2012
20120111553HEAT SPREADING DEVICE AND METHOD THEREFORE - A heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits, the second at least two conduits providing interconnection of the first and second chamber portions is disclosed. Integral parts/portions are provided, such as cavities, barrier and fins.05-10-2012
20120061066ARTICLE FOR MAGNETIC HEAT EXCHANGE AND METHOD OF FABRICATING AN ARTICLE FOR MAGNETIC HEAT EXCHANGE - An article for magnetic heat exchange comprising a magnetocalorically active phase with a NaZn03-15-2012
20120061065HEAT-ABSORBING STRUCTURAL MATERIAL - A heat-absorbing structural material has a sealed outside shell or container, and an internal structure in the interior space enclosed by the container. In addition the structural material has a phase-change material in the interior space, interspersed between elements of the internal structure. The internal structure provides increased strength to the structural material, allowing it to better withstand external forces placed on it. The phase change material may change from a solid to a liquid during operation of the structural material as a heat absorber, such as a heat sink. The internal structure may be made as an integral part of the structural material, formed with at least part of the container by a three-dimensional printing process, or by casting. The phase change material, such as a suitable wax, may improve heat-absorbing performance of the structural material by changing phase during heating.03-15-2012
20120152509HEAT SINK - A heat sink includes a substrate, a first heat dissipation body, and a second heat dissipation. The first heat dissipation body includes a first base plate attached to the substrate, and a number of first cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to tops of first cooling fins and a number of second cooling fins extending from the second base plate.06-21-2012
20120152510BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND COOLING UNIT USING THE SAME - A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.06-21-2012
20120125590TEMPERATURE CONTROL MEDIUM AND TEMPERATURE CONTROL METHOD - A temperature control medium is formed of a liquid and solid particles, the solid particles containing carbon particles. The amount of carbon in the temperature control medium is preferably less than 20% by weight. The carbon particles may contain synthetic graphite, natural graphite, soot, carbon fibers, graphite fibers or expanded graphite or a mixture of at least two of these elements.05-24-2012
20100096117RADIATOR PLATE, PERFORATED PLATE AND METHODS OF MAKING THE SAME - A radiator plate includes a core having core surfaces and holes whose hole axes are directed in a direction along a normal direction of the core surface, and heat transfer plates joined to the core surfaces and filled in the holes. A multilayer radiator plate includes a first radiator plate including a first core having first core surfaces and first holes whose hole axes are directed in a direction along a normal direction of the first core surface and first heat transfer plates joined to the first core surfaces and filled in the first holes, a second radiator plate including a second core having second core surfaces and second holes whose hole axes are directed in a direction along a normal direction of the second core surface and second heat transfer plates joined to the second core surfaces and filled in the second holes, and the first radiator plate and the second radiator plate are joined to each other.04-22-2010
20120118552SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS - The device for extracting heat from carbon nanotubes wires or cables used under high power applications is provided. The device can include a thermally conductive member for placement against a heat source and for directing heat away from the heat source to a heat dissipating medium. The device can further include an electrically conductive member positioned on the thermally conductive member and made from a layer of carbon nanotubes, to reduce electrical resistance along the electrically conductive member. A geometric pattern can be imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member and the heat source.05-17-2012
20120118550HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURE THEREOF - A heat dissipating device and a method of fabricating thereof, the device comprising a first base adapted to be placed in contact with a heat emitter and first heat-dissipating fins extending from the first base on at least part of a periphery of the first base. The method comprises providing a first sheet of heat conductive and mechanically resistant material; cutting, out of the first sheet of material, a first piece comprising a first central part and first tabs extending radially from the first central part; and erecting the first tabs up from the first central part.05-17-2012
20120118551Heat Transfer Interface And Method Of Improving Heat Transfer - An embodiment of a heat transfer interface includes a solid material having first and second surfaces, and a nanotube forest covering at least a portion of the first surface, In operation in a heat exchanger, the heat transfer interface transmits heat from a first side to a second side of the heat transfer interface. An embodiment of a method of improving heat transfer in a heat exchanger includes applying a nanotube forest to a heat transfer surface of a heat transfer interface and installing the heat transfer interface in the heat exchanger.05-17-2012
20120125591HEAT RADIATING FIN - A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked.05-24-2012
20120125589HEAT SINK - A heat sink allowing circuit elements to be simply coupled thereto and allowing a size and a thickness thereof to be adjusted according to the number and capacity of circuit elements. The heat sink includes: a support plate; a plurality of heat radiation pins vertically protruded from one surface of the support plate; an element insertion groove formed to be depressed in a longitudinal direction from the other surface of the support plate; and element support parts formed to be protruded from the element insertion groove and supporting a circuit element. The circuit element slides and is coupled thereto. In addition, the circuit element is freely moved, thereby making it possible to simply correct mounting position.05-24-2012
20120125588HEAT DISSIPATION PLATE FOR PROJECTION-TYPE IC PACKAGE - The present invention relates to a heat dissipation plate for a projection-type integration circuit (IC) package, which is installed to be adhered and fixed to a projection-type IC package in which an integration circuit in a board is formed to project, so as to dissipate heat generated by the integrated circuit, including: a fixed plate adhered and fixed to the projection-type IC package; and heat dissipation fins (cooling fins) formed to be inclined upward from both opposing sides of the fixed plate, wherein an accommodation groove that accommodates the integrated circuit is formed in a rear surface of the fixed plate, and the accommodation groove is formed to have a shape to be joined to the integrated circuit, and the integrated circuit comes into close contact with the accommodation groove. Therefore, there are advantages in that the heat dissipation plate can enhance not only heat dissipation efficiency but also adhesion performance by increasing the contact area with the projection-type IC package, and simultaneously can be simply produced, thereby reducing production costs.05-24-2012
20120160468Local Thermal Management - An apparatus and a method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein a thermally conducting heat shield encloses the interconnector from a position within the first region in close proximity to the component to the second region, and that at least one heat unit is thermally connected to the interconnector within the second region. The heat units may be heat sources and/or heat sinks, and the invention may manage the component at a higher or lower temperature than the surrounding first region. When heat enters the heat shield from a hot surrounding first region, e.g. hot gas, the heat shield conducts heat more efficiently than the medium encapsulated by the heat shield. Thus, the heat tends to follow the path provided by the heat shield. Areas of use include providing efficient particle deposition by thermophoresis or heat a component in a cold environment.06-28-2012
20100224352THERMAL CONTROLLER FOR ELECTRONIC DEVICES - An apparatus controls a temperature of a device by circulating a fluid through a heat sink in thermal contact with the device. The apparatus includes an adjustable cold input, which inputs a cold portion of the fluid having a first temperature, and an adjustable hot input, which inputs a hot portion of the fluid having a second temperature higher than the first temperature. The apparatus further includes a chamber, connected to the cold input and hot input, in which the cold and hot portions of the fluid mix in a combined fluid portion that impinges on the heat sink. The combined fluid portion has a combined temperature that directly affects a temperature of the heat sink. The cold input and hot input are adjusted to dynamically control the combined temperature, enabling the heat sink temperature to compensate for changes in the device temperature, substantially maintaining a set point temperature of the device.09-09-2010
20100206537HEAT SPREADER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (08-19-2010
20100206536METHOD FOR PRODUCING A COMPOSITE INCLUDING AT LEAST ONE NON-FLAT COMPONENT - A method for producing a composite from at least two metal components that have perforations or openings, especially for producing a cooler or cooling elements or heat sinks that have at least one composite. The components are joined to each other to yield the composite by heating them to a process temperature while using a joining agent or joining surfaces defined by surface faces of the components. To produce components having complicated geometric shapes, thereby increasing their cooling capacity, at least a first component is not flat, and is joined to at least one flat or non-flat component to yield the composite.08-19-2010
20120132409HEAT-DISSIPATING DEVICE - An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.05-31-2012
20120160467HEAT SINK AND ASSEMBLY METHOD THEREOF - An exemplary heat sink includes a base plate and a fin unit including fins stacked together and arranged on the base plate. The base plate includes two fixing portions extending upward from a top surface thereof. Each of the fixing portions defines a groove therein. Each of the fins includes a main body and two fixing strips extending from two opposite sides of the main body. The fixing strips of the fins contact each other to cooperatively form two protruding members of the fin unit, the protruding members correspond to the grooves of the fixing portions of the base plate, respectively, and the protruding portions are interference fitted in the grooves, whereby the fin unit and the base plate are connected together.06-28-2012
20120132408Heat Dissipating Chassis for Handheld Battery Operated Device - A heat sink for a handheld device is found as a one piece chassis for supporting heat-producing circuits inside the device while having heat radiating surfaces outside the device. In another embodiment a battery pack control circuit under microprocessor control allows battery packs having different battery chemistries and characteristics to be interchanged in the same device without switches or adapters. Control of operating modes of the device despite changes in the battery pack including battery chemistry, state of charge, available voltage, or desired operating mode are automatic. The microprocessor measures the battery pack characteristics, using look up tables in a suitable program to adjust the circuit operating modes. The microprocessor also responds to sequential switch contact closures in setting operating modes.05-31-2012
20120132410HEAT SINK FIN FORMING PROCESS - Some example embodiments relate to a heat sink fin that has a first substrate. The first substrate includes a first angular dimple and a first micro air channel in fluid communication with the first angular dimple. The first angular dimple includes a first surface that forms an angle relative to a first plane of the first substrate. The first angular dimple includes a first micro diameter hole in fluid communication with the first angular dimple. The heat sink fin also has a second substrate folded against the first substrate. The second substrate includes a second angular dimple and a second micro air channel in fluid communication with the second angular dimple. The second angular dimple includes a second surface that forms an angle relative to a second plane of the second substrate. The second angular dimple includes a second micro diameter hole in fluid communication with the second angular dimple.05-31-2012
20110180249METHOD FOR SURFACE TREATING A HEAT EXCHANGER, SURFACE TREATMENT AGENT, AND ALUMINUM HEAT EXCHANGER - A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount.07-28-2011
20110180248Method for Surface Treating a Heat Exchanger, Hydrophilizing Treatment Agent, and Aluminum Heat Exchanger - A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin.07-28-2011
20110180246HEAT-DISSIPATING DEVICE HAVING A LAYERED FUNCTIONAL UNIT - A heat-dissipating device comprises a metallic layer to contact a heat source, and a layered functional unit formed on the metallic layer and including a semiconductor material and a far infrared material. Preferably, the functional unit further includes a carbon material having a large specific surface area. The heat from the metallic layer excites the electrons in the semiconductor material to jump across band gap and then release heat energy, and excites the far infrared material to radiate far infrared rays. A rapid heat dissipation rate can be achieved by increasing heat transfer area and by converting heat into far infrared rays that can be radiated away rapidly.07-28-2011
20120211215VAPOR COOLING HEAT EXCHANGER - A vapor cooling heat exchanger is provided with: a partition wall for partitioning path for a fluid to be cooled through which a fluid to be cooled flows, and path for a refrigerant through which a refrigerant for cooling the fluid to be cooled flows; and fins which are disposed within path for a fluid to be cooled, and which is thermally connected to the partition wall. The fins constitute a first fin and a second fin, the local heat flux of which on the partition wall is smaller than the first fin. The first fin and the second fin are arranged on the basis of the relationship between the local heat flux on the partition wall and the heat flux limit of the refrigerant. As a consequence, the occurrence of local burn-out on the vapor cooling heat exchanger is suppressed.08-23-2012
20120211214Heatsink Device and Method - A heatsink device and methods for manufacturing and using same. The heatsink device includes a plurality of heatsink fins that extend from a heatsink base. Each heatsink fin has a distal end region and a proximal end region disposed adjacent to the heatsink base. A fin width of each heatsink fin progressively decreases from the proximal end region to the distal end region in accordance with a parabolic profile such that opposing fin profiles of adjacent heatsink fins define an air space that is parabolic. The parabolic chamfer advantageously promotes full heat flow from the heatsink base to the heatsink fins and removes more heat than conventional heatsink devices. When applied in conjunction with a heat-generating component, the heatsink can enable the heat-generating component to operate at a lower stabilized component temperature. Accordingly, the performance, reliability, safety, and operational lifetime of the heat-generating component can be increased.08-23-2012
20120211212HEAT SINK AND MANUFACTURING METHOD OF POROUS GRAPHITE - A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam. Also, a manufacturing method of porous graphite is provided.08-23-2012
20120211211HEAT SINK EQUIPPED WITH A VAPOR CHAMBER - A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside.08-23-2012
20120168137COMPRESSED NATURAL GAS (CNG) SUB-COOLING SYSTEM FOR CNG-FILLING STATIONS - The present invention is referred to a compressed natural gas (CNG) sub-cooling system for CNG-filling stations, comprising a CNG inlet pipeline coming from the CNG compressor, a set of coils connected to an expansion heat exchanger capable of creating a Joule-Thomson cooling effect on the gas, both coils are immersed in a heat exchange facilitator solution and are also connected to outlet valves which in turn are connected to feeding hoses of a charging station.07-05-2012
20120211213HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a laminated body disposed in a flow path for circulating a refrigerant. The laminated body includes a metallic tube body enclosing the flow path therein, an insulation layer formed on a periphery of the tube body, and a conductor that is formed on a periphery of the insulation layer and includes a bonding surface bonded to an electrode of a semiconductor device to be cooled.08-23-2012
20090107662EVAPORATOR FOR FUEL CELL SYSTEM - An evaporator for a fuel cell system generating steam used for a steam reforming reaction provides an evaporator including a body having an inner space formed by a hollow for allowing a flow of a fluid, and a plurality of cell barrier members dividing the inner space into a plurality of spaces and having heat conductivity. The spaces include at least one first space for allowing a flow of a flue gas and at least one second space for allowing a flow of water.04-30-2009
20100012309Enthalpy Exchanger - The invention relates to an enthalpy exchanger, comprising at least one enthalpy-exchanging unit, which enthalpy-exchanging unit: comprises at least one plate, along at least one contact side of which a first liquid medium and a second medium can be displaced while exchanging enthalpy, and comprises at least one hygroscopic material layer which connects to at least one contact side of the plate in contact with the first liquid medium, wherein the mutual orientation of the plate and the material layer is such that a liquid film of the first medium can form between the plate and the material layer, wherein the liquid film is in enthalpy-exchanging contact with both the plate and the material layer, whereby the material layer is attached to the plate at a plurality of point locations lying a distance from each other such that the liquid film can extend substantially unobstructed over substantially the whole contact side of the separating wall.01-21-2010
20120312519Partially composite plate - A partially composite plate includes an area of metal matrix composite and a margin of metal, of the same metal as used to infiltrate the composite, along at least one edge of the composite. In a preferred embodiment of the invention, the margin surrounds the composite, the metal is aluminum, and the metal matrix composite is AlSiC.12-13-2012
20120073796ALUMINUM ALLOY FOR DIE CASTINGS AND PRODUCTION PROCESS OF ALUMINUM ALLOY CASTINGS - The present invention provides an aluminum alloy for die castings that has superior castability and corrosion resistance. The amounts of Mn, Fe and Cu contained in the aluminum alloy components for die castings were determined to have a considerable effect on the corrosion resistance of the aluminum alloy. Therefore, the aluminum alloy for die castings of the present invention contains 9.0 to 12.0% by weight of Si, 0.20 to 0.80% by weight of Mg, and 0.7 to 1.1% by weight of Mn+Fe, the Mn/Fe ratio is 1.5 or more, the amount of Cu as impurity is controlled to 0.5% by weight or less, and the remainder is composed of aluminum and unavoidable impurities.03-29-2012
20120255719CERAMIC HEAT SINK MODULE AND MANUFACTURING METHOD THEREOF - A ceramic heat sink module for lowering a temperature of a heating element is disclosed. The ceramic heat sink module includes a ceramic heat sink module body, wherein a composition of the ceramic heat sink module body includes at least 70% by weight aluminium oxide.10-11-2012
20120073795THIN FILM COMPOSITE HEAT EXCHANGERS - The invention generally relates to thin film composite heat exchangers and methods of making thin film composite heat exchangers. The heat exchangers can be made with polymers or other materials including, but not limited to, inorganic materials such as silicon, clay, ceramic, brick, or metal. Heat exchangers in accordance with the invention may be made of a material that is non-corrosive, durable, and that may be applied in a thin coating so as to minimize resistance to heat transfer and material costs.03-29-2012
20120255717LED HEAT-DISSIPATION STRUCTURE FOR MATRIX LED LAMP - An improved heat-dissipation structure for a matrix LED lamp is disclosed. The heat-dissipation structure is a plate-shaped metal hood configured to hold an LED matrix module for heat dissipation so as to maintain the entire matrix LED lamp cool. The heat-dissipation structure is a plate-shaped metal shell having a plurality of threaded holes allowing the LED matrix module to be fixed thereto. In virtue of the tight contact between the bottom of the LED matrix module and the plate-shaped metal hood, heat generated by the LED matrix module can be quickly absorbed and dissipated by the plate-shaped metal hood, so as to prevent the LED matrix module from premature aging, thereby enlightening the service life of the LED matrix module.10-11-2012
20120255718METHOD OF MACHINING CARBON AND GRAPHITE FOAMS - A method for fabricating a solid foam article from a solid foam blank includes the steps of forming a pilot hole in the solid foam blank; positioning a chisel in the pilot hole, the chisel having a cutting portion and a shaft; and directing the cutting portion into the pilot hole in a reciprocating motion to remove solid foam material surrounding the pilot hole. A system for forming articles from solid foam blanks and a heat exchange device are also disclosed.10-11-2012
20120261108COUPLING SYSTEM BETWEEN A WASTE-HEAT GENERATOR AND A WASTE-HEAT RECEIVER - A coupling system as a thermal interface between a waste-heat generator and a waste-heat receiver includes a first body having a first contact area, and a second body having a second contact area, with the first and second contact areas abutting one another for heat exchange. A tongue and groove connection having at least one tongue and at least one groove extends in a longitudinal direction for connecting and tensioning the first and second contact areas.10-18-2012
20120261105LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.10-18-2012
20120227949AERODYNAMIC HEAT EXCHANGE STRUCTURE - The present invention relates to heat exchangers, and more particularly to a heat exchange structure configured to operate in an air stream. In one embodiment, a heat exchange structure configured to operate in an air stream includes coolant flow portions, each of the coolant flow portions having at least one substantially closed surface directed into the air stream; and air flow portions disposed between adjacent coolant flow portions for receiving air from the air stream, the air flow portions having air passages directed into the air stream; the substantially closed surface of the coolant flow portions having an aerodynamic shape.09-13-2012
20120227950FREE AIR STREAM HEAT EXCHANGER DESIGN - The present invention relates to heat exchangers, and more particularly to a heat exchange apparatus configured to operate in a free air stream. In an embodiment, a heat exchange apparatus configured to operate in a free air stream includes a heat exchange structure having a shape configured to conform to a body of a vehicle when in a stowed condition; and a deployment mechanism for moving the heat exchange structure to a deployed condition external to the vehicle. The heat exchange structure has a curved surface that is concave into the air stream when the heat exchange structure is in the deployed condition.09-13-2012
20120227952RADIATOR AND METHOD OF MANUFACTURING RADIATOR - A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.09-13-2012
20120227951HEAT TRANSFER BETWEEN TRACER AND PIPE - A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer.09-13-2012
20120227948HEAT SINK FIN STRUCTURE - A heat sink fin structure includes a fin assembly and a protection unit. The fin assembly includes multiple radiating fins and an outside radiating fin. The outside radiating fin has a first main body. The protection unit has a second main body.09-13-2012
20120261106Non-Isotropic Structures for Heat Exchangers and Reactors - A Non-Isotropic Structure for a Heat Exchanger (NISHEX) that forms fins from nested woven wire meshes. The wire meshes are shaped into channels that are stacked on top of each other to produce a non-isotropic fin structure having multiple fin layers. The fin structure exhibits a high heat coefficient while maintaining relatively high fin efficiency through the selection of fin lengths in proportion to the wire diameter in the mesh fins.10-18-2012
20100326644Plane-type heat-dissipating structure with high heat-dissipating effect and method formanufacturing the same - A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.12-30-2010
20110120692RADIATION TRANSMITTER - Radiation transmitter, also called radiation semiconductor, is a structure that can rectify and gather the random radiation from a single heat source. It is known from the Fermat's principle that light in a medium with graded index usually deflects from an area with high refractive index to an area with low refractive index, and light in the area with low refractive index always can reach the area with high refractive index, but part of the light traveling from the area with high refractive index to the area with low refractive index will return to the area with high refractive index within an inflexion effective distance. As a result, the radiation heat exchange between the surface with low refractive index and the isothermal surface with high refractive index is unbalanced, radiation is automatically and directionally transferred by wave-guide, and the heat of an object is automatically and directionally transferred to the isothermal and high-temperature objects by radiation. The radiation transmitter, which is a basic structure for developing atom energy, can gather, store and transfer solar radiation energy and spontaneous radiation energy of other objects, and can be used for refrigeration, heating, air conditioning, cooking, heat engine driving, power generation, etc.05-26-2011
20110120691AIR COOLING EQUIPMENT FOR HEAT TREATMENT PROCESS FOR MARTENSITIC STAINLESS STEEL PIPE OR TUBE - An object of the present invention is to provide air cooling equipment for a heat treatment process for a martensitic stainless steel pipe, which is capable of shortening the time required for the heat treatment process by enhancing the cooling efficiency at the time when the inner surface of steel pipe is air cooled in the heat treatment ent process.05-26-2011
20110120690METHOD OF FORMING A HEAT EXCHANGER HAVING A BRAZED CORE ASSEMBLY - A method of manufacturing a heat exchanger having a brazed core with parallel tubes separated by and contacting centers that extend parallel to the tubes. The method utilizes a brazing fixture that enables the core to expand during brazing due to thermal expansion of the tubes and centers and maintains tube to center contact as the core shrinks due to melting of the braze alloy. The resulting brazed core has a post-brazed tube spacing pattern that facilitates assembly of the brazed core with headers of the heat exchanger.05-26-2011
20110120689HEAT EXCHANGER RADIATING FIN STRUCTURE AND HEAT EXCHANGER THEREOF - A heat exchanger radiating fin structure and a heat exchanger thereof. The radiating fin includes a main body and at least one rib. The main body has a first plane face and at least one lateral side. Multiple depressions are formed on the first plane face. The rib is disposed on a portion of the first plane face, which portion is free from any of the depressions. The rib obliquely extends in a direction neither normal nor parallel to any lateral side of the first plane face. The heat exchanger includes a radiating fin assembly composed of multiple piled up radiating fins. Each two adjacent radiating fins define therebetween a flow way having at least one inlet and at least one outlet. With the depressions and the rib, the structural strength of the radiating fin is increased and the heat exchange performance of the heat exchanger is enhanced.05-26-2011
20120261107DEVICE FOR COOLING BATTERIES - A device for cooling batteries includes a cooling plate for receiving at least one battery thereon and at least one heat transfer element in heat transfer relationship with the cooling plate. A mechanical stress produced by a contact force causes the at least one heat transfer element to thermally abut the cooling plate.10-18-2012
20120325452HEAT SINK - A heat sink includes a plurality of fins arranged parallel to each other. The fins include a first fin, a second fin, a third fin, a fourth fin, and a plurality of middle fins sandwiched between the third fin and the fourth fin. The first fin is at an outmost side of the heat sink. The first fin has a protrusion. The second fin is located at an opposite outmost side of the heat sink. The third fin is adjacent to the first fin. The protrusion of the first fin abuts against the third fin. The fourth fin is adjacent to the second fin and has a protrusion to abut against the second fin. The middle fins being flat with no protrusions.12-27-2012
20120325453Monolithic Fin-type Heat Sink - A fin-type heat sink applied to a electronic device includes a flake structured contact section adhered to an electronic component via an adhesive material, and a fin section including a plurality of pleats extending horizontally from the contact section, so as to substantially increase a heat-sinking area of the heat sink and effectively reduce heat generated when the electronic component is under operation. The contact section and the fin section are monolithically formed from a heat conductive metal, and since the fin section can be deformed with respect to the contact section to make room for any ambient components around the electronic component such that the fin-type heat sink is applicable to various situations without customization.12-27-2012
20120325451COMPONENTS WITH COOLING CHANNELS AND METHODS OF MANUFACTURE - A manufacturing method includes forming one or more grooves in a component that comprises a substrate with an outer surface. The substrate has at least one interior space, and each groove extends at least partially along the substrate and has a base. The manufacturing method further includes forming one or more access holes through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. The manufacturing method further includes forming at least one connecting groove in the component, such that each connecting groove intersects at least a subset of the one or more grooves. The manufacturing method further includes disposing a coating over at least a portion of the outer surface of the substrate, such that the groove(s) and the coating together define one or more channels for cooling the component. The coating does not completely bridge the connecting groove, such that the connecting groove at least partially defines an exit region for the respective cooling channel(s).12-27-2012
20110214850Nanotube Materials for Thermal Management of Electronic Components - A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a disk having relatively high thermal conductivity and heat spreading characteristics. The heat-conducting medium also includes a first recessed surface and an opposing second recessed surface. Extending from within each recessed surface is an array of heat conducting bristles to provide a plurality of contact points to the heat source and heat sink to aid in the transfer of heat. The recessed surfaces may be defined by a rim positioned circumferentially about the disk. The presence of the rim about each recessed surface acts to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles. A method for manufacturing the heat-conducting medium is also provided.09-08-2011
20120298345HEAT SINK SHEET INCLUDING AN ADHESIVE HAVING GOOD HEAT CONDUCTIVITY - The present invention relates to a heat sink sheet including an adhesive containing a carbon nano-complex and having good heat conductivity. The adhesive having good heat conductivity is coated on a graphite sheet to improve heat conductivity, and an existing adhesive process and adhesive coating process are combined into a single process to manufacture a heat sink sheet, thereby providing a heat sink sheet having improved heat conductivity so as to contribute to cost reduction and increased yield.11-29-2012
20120080177HIGH-POWER FINLESS HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components.04-05-2012
20120080176HIGH-POWER FINNED HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components.04-05-2012
20120080175Manifolding Arrangement for a Modular Heat-Exchange Apparatus - A heat-exchanger module that conveys a fluid through one or more heat exchangers with little or no pressure drop is presented. The heat-exchanger module comprises a first manifold that smoothly channels the fluid from a fluid source to each of the heat exchangers. The heat-exchanger module further comprises a second manifold that smoothly channels the fluid from the heat exchangers to a fluid sink. The manifolds are dimensioned and arranged to mitigate development of pressure drops in the fluid flow.04-05-2012
20110259568THERMAL CONDUCTIVE SHEET - A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tanδ obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more.10-27-2011
20110265979THERMAL INTERFACE MATERIALS WITH GOOD RELIABILITY - A composition for a highly reliable thermal interface materials includes: (A) moisture-resistant polymer with a water permeability coefficient preferably less than 1011-03-2011
20100230086METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER, POWER MODULE, VEHICLE INVERTER, AND VEHICLE - The present invention provides a method for manufacturing a heat transfer member which method allows peel-off and cracking possibly caused by thermal expansion to be inhibited. That is, the present invention provides a method for manufacturing a heat transfer member 09-16-2010
20120325454HEAT DISSIPATING STRUCTURE AND MANUFACTURE THEREOF - A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.12-27-2012
20120279696HEAT DISSIPATION DEVICE - A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a plate and a pair of flanges extending from the plate. Each flange includes a first section extending perpendicularly away from the plate, a third section extending perpendicularly towards the plate and a second section interconnecting the first section and the third section. The first section is parallel to the third section and the second section is parallel to the plate. Three channels are defined by the first flange, the second flange and the plate for allowing airflow to flow through the fins.11-08-2012
20120279697THERMAL INTERFACE MATERIAL WITH PHENYL ESTER - A thermal interface material comprises a phenyl ester and a thermally conductive filler. The material optionally contains an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid.11-08-2012
20110284198METHOD FOR JOINING COMPONENTS MADE OF A HIGH-STRENGTH ALUMINUM MATERIAL AND HEAT EXCHANGER ASSEMBLED ACCORDING TO THE METHOD - The invention relates to a method for joining components made of a high-strength aluminum material, whereby at least two components of high-strength aluminum alloys are joined by soldering, both components separated from each other by at least one aluminum layer with a lower magnesium content compared with the contact surfaces before joining is carried out, and a heat exchanger produced according to this method.11-24-2011
20120090825NANOFIBER COVERED MICRO COMPONENTS AND METHODS FOR MICRO COMPONENT COOLING - A device including a micro component having an external surface and a permeable nanofiber covering on at least a portion of the external surface of the micro component. A cooled micro component system further includes a droplet spray system for spraying liquid droplets onto the nanofiber covering to cool the micro component. In an example method for cooling a micro component, droplet spray is directed onto a nanofiber covering that covers at least a portion of the micro component. The directing is controlled to permit efficient spreading and evaporation of liquid permeating the nanofiber covering. In example embodiments nanofibers of the permeable nanofiber covering are metalized to provide a rougher surface (e.g., a nano-textured metal layer).04-19-2012
20120090824Heat plate with clip - A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.04-19-2012
20120285674THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER - A thermal conductive sheet contains a resin and a plate-like or flake-like filler. The average orientation angle of the filler is 29 degrees or more and the maximum orientation angle thereof is 65 degrees or more with respect to the plane direction of the thermal conductive sheet.11-15-2012
20120138284HEAT DISSIPATING DEVICE - A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.06-07-2012
20120138283FOLDED FIN HEAT SINK - In one embodiment, a heat sink comprising a folded fin is disclosed. The folded fin comprises a base portion, an offset portion extending away from the base portion, the offset portion having a width, a narrowing tapering portion having a maximum width equal to the width of the offset portion, and an extension portion extending away from the narrowing tapering portion, the extension portion having a width smaller than the width of the offset portion.06-07-2012
20130008638PHASE CHANGE MATERIAL HEAT SINK - A phase change material heat sink includes a sealed enclosure containing a phase change material. A fluid passage element is in contact with the sealed enclosure and includes a thermal exchange layer in thermal contact with the top and that directs fluid in a first flow direction and a shunt passage element in thermal contact with at least one of the sides or the bottom and that directs fluid in a second flow direction.01-10-2013
20130014925HEAT SINKING METHODS FOR PERFORMANCE AND SCALABILITY - A technique and apparatus for heat dissipation in electrical devices is described. A bulk body may be configured with a plurality of radiating devices so that the bulk body may be divided into smaller bulk bodies to be used in conjunction with other electrical type assemblies to quickly and efficiently provide for a heat dissipation sub-assembly. In one aspect, the bulk bodies may be configured with internal voids such as a duct or tunnel interconnecting at least one input port and at least one output port for aiding in heat dissipation of an electrical device employing bulk body technique.01-17-2013
20120241138INSULATING DEVICE AND METHOD FOR PRODUCING AN INSULATING DEVICE - An insulating device for an electrochemical energy storage unit is provided, wherein the insulating device includes a cooling plate that comprises at least one opening. A contact rail is provided for dissipating heat and a retaining element for fixing an arrangement between the cooling plate and the contact rail and has a shaft extending through the opening of the cooling plate, and a first intermediate space is defined by a distance between a wall of the opening and the shaft and/or a second intermediate space is defined by a distance between an edge of the contact rail and the shaft. A connecting element having a surface including an electrically insulating material is disposed between a main surface of the cooling plate and a surface of the contact rail, and a partial region thereof protrudes into the first and/or the second intermediate space.09-27-2012
20080236806Laminated Body - A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.10-02-2008
20080236805TEMPERATURE CONTROL DEVICE FOR LIQUID MEDICINES - In a temperature control device for liquid medicines provided with a flow path block having flow paths for liquid medicines at both of front and back surfaces, heat-transmitting plates respectively disposed at both of the front and back surfaces of the flow path block in a manner so as to face the flow paths, and thermo-modules for performing a cooling operation or a heating operation on the liquid medicines that flows through the flow path via the heat-transmitting plates, respectively, at least one ridge of mountain-shaped sealing projection portion surrounding a periphery of the flow path are integrally formed with the flow path block at sealing surfaces respectively surrounding the flow paths at both of the front and back surfaces of the flow path block, and the heat-transmitting plates are fixed to the flow path block in a state of pressure-contacting the sealing projection portion.10-02-2008
20080223567Heat Dissipating Device - A heat dissipating device includes a heat sink having a base with an upper surface and a lower surface, and a plurality of heat dissipating elements disposed on the upper surface of the base; a clip having a frame matching with a contour of the base, wherein the frame has a positioning portion for preventing the base from displacement, at least a first fastener defined at an inner rim of the frame, and at least two second fasteners respectively defined at an outer rim of the frame, each of which has a through hole, such that the heat sink is able to be fixed by engaging the positioning portion with base and fastening the first fastener to the heat dissipating elements.09-18-2008
20110259572Process for producing molded product, and heat-exchange membrane element - A molded product including a film bonded to a resin frame is produced by a method including: 1) reinforcing the film with a solvent-soluble or solvent-disintegrable reinforcing layer; 2) inserting the reinforced film in an injection mold; 3) feeding a resin to the mold to attach a frame body to the reinforced film while injection molding the resin frame; and 4) treating the resulting injection molded product with a solvent to remove the reinforcing layer. This production process can establish a technique capable of bonding (integrally molding) the film solely to the frame body, regardless of the size of the film. The film may preferably be an expanded porous polytetrafluoroethylene film, and the moisture-permeable resin may preferably be combined with the expanded porous polytetrafluoroethylene film.10-27-2011
20110259564THERMAL CONDUCTIVE SHEET - A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more.10-27-2011
20130175019HEAT SINK AND METHOD FOR MANUFACTURING - The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed.07-11-2013
20130175018TILTABLE NOTEBOOK-COMPUTER COOLING PAD WITH TABLET-COMPUTER BRACKET - A tiltable notebook-computer cooling pad with a tablet-computer bracket is disclosed. The notebook-computer cooling pad has its bottom its bottom detachable assembled with a tablet-computer bracket that can provide tiltable and rotatable support. The tablet-computer bracket can work with the notebook-computer cooling pad to allow adjustment of a tilting angle of the notebook-computer cooling pad, or it can work independently as a stand-alone tablet-computer bracket that provides tiltable and rotatable support to a tablet computer. Thereby, the disclosed device can serve to not only maintain an operating notebook computer cool, but also support a tablet computer.07-11-2013
20130175020Heat Spreader Having Single Layer Of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders.07-11-2013
20130175021SERVO AMPLIFIER WITH HEAT SINK HAVING TWO SETS OF HEAT-RELEASING PLATES PERPENDICULAR TO EACH OTHER - A servo amplifier having a heat sink of low (assembly) cost, with high heat-releasing capacity and reliability, capable of being safely used under high temperature. The heat sink has a base plate, a heat-transferring plate thermally connected to the base plate, a plurality of first heat-releasing fins extending from the base plate, and a plurality of second heat-releasing fins extending from the heat-transferring plate. The first heat-releasing fins are arranged so as to extend from a second major surface of the base plate in the Z-direction, and the second heat-releasing fins are arranged on a region of the both surfaces of the heat-transferring plate where is separated from the second major surface by at least the height of the first heat-releasing fins, the second heat-releasing fins extending generally parallel to second major surface.07-11-2013
20130168072HEAT EXCHANGER CONSTRUCTION USING LOW TEMPERATURE SINTER TECHNIQUES - Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.07-04-2013
20080216998Thermostat and testing machine provided with the same - A thermostat includes a plate body, a heat insulator, and an electric heater. The plate body defines a cavity therewithin. The plate body has on its bottom two openings, which communicate with the cavity and function as a cooling medium inlet and a cooling medium outlet, respectively. The outer periphery of the plate body is covered with the heat insulator. That prevents heat intrusion and/or dissipation from the outer periphery of the plate body in transferring heat between the mounting face and a heat transfer medium within the cavity. That reduces the thermal influence on the mounting face, thereby ensuring more uniform temperature distribution on the mounting face.09-11-2008
20080216997Heat plate construction and attachment for dismounting heat plate - A heat plate construction is provided, which is applicable for being fixed on a circuit board and contacting with a chip to perform a heat exchange. The heat plate construction includes a heat plate body and at least one buffer element. The heat plate body has a plurality of fixing points fixed on the circuit board and located outside the contacting region between the heat plate body and the chip. The buffer element is disposed outside the contacting region between the heat plate body and the chip, and the height of the buffer element is equal to a distance between the heat plate body and the circuit board, such that when the heat plate is dismounted, the buffer element relieves a force for the heat plate to press against the chip, so as to protect the chip from being damaged.09-11-2008
20130112389THERMAL CONDUCTIVE SHEET, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET AND HEAT RELEASING DEVICE - The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.05-09-2013
20130112388HEAT SINK - Disclosed herein is a heat sink including: a first region connected to a cooling water introduction part and having a plurality of first pins arranged therein; and a second region connected to a cooling water discharge part and having a plurality of second pins arranged therein.05-09-2013
20130112387HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.05-09-2013
20130112386HEAT DISSIPATING DEVICE AND MANUFACTURE METHOD THEREOF - A heat dissipating device includes a base and a plurality of heat dissipating layers. The base has a first surface and a second surface which are opposite to each other. The heat dissipating layers are formed on the first surface of the base in sequence. Each heat dissipating layer has at least one heat dissipating structure, which includes a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The heat storage/dissipation areas of two adjacent heat dissipating layers contact with each other, while the heat conductive areas of two adjacent heat dissipating layers contact with each other.05-09-2013
20130112385Cooling Structure - An improved cooling structure comprises a cooling means and a base plate. The cooling means is provided with a plurality of connection portions extending outwardly. The connection portions are capable of being affixed to a first frame and a second frame, each frame being provided with a colored region. The base plate is capable of being fixedly assembled to the first and second frames. The base plate is provided with an application zone, which can be formed into a literal, figurative, or mesh-like pattern. The base plate can be made of acrylic, plastic such as PC or ABS, bamboo, ceramic material, non-metal, or metal. In use, a user may choose a base plate having a pattern according to his or her preference, and cut the base plate into a final plate suitable to a notebook. Thereafter, the base place can be assembled or replaced conveniently.05-09-2013
20130092363HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM - The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.04-18-2013
20130092362HEAT DISSIPATING STRUCTURE FOR LIGHT BULB - The present invention provides a heat dissipating structure for a light bulb and enhances the heat dissipating efficiency of the light bulb. The heat dissipating structure comprises a heat dissipating housing and a plurality of fins. The light source is assembled on the plurality of fins. The heat generated by the light source is conducted to the heat dissipating housing via the plurality of fins. In addition, a power driver is disposed at the bottom of the plurality of fins and dissipates heat through the heat dissipating housing. Thereby, the light source and the power driver, which are two heat sources, are disposed separately. Then the heat is transferred to the surrounding environment by means of the heat dissipating housing. Consequently, the overall heat dissipating process is accelerated, thus improving the light emitting efficiency and lifetime of the light bulb.04-18-2013
20110265980GRAPHITE SHEET AND HEAT TRANSFER STRUCTURE USING SAME - A graphite sheet preventing leakage of a heat radiating member when a fluid heat radiating member such as grease is used and improving heat radiation performance is provided. A graphite sheet includes a first main surface and a second main surface opposite to the first main surface and has a large anisotropic thermal conductivity in a main surface direction. The graphite sheet includes a first concave portion provided on the first main surface and having a first bottom surface, a second concave portion provided on the second main surface and having a second bottom surface, a thin film portion formed in a region in which the first bottom surface and the second bottom surface are overlapped with each other, and a connecting hole penetrating the thin film portion and allowing the first concave portion and the second concave portion to communicate with each other.11-03-2011
20130126146PLANAR THERMAL DISSIPATION PATCH M AND THE METHOD OF THE SAME - A planar thermal dissipation patch comprises a polymer substrate; an adhesive layer attached under the polymer substrate; a protection sheet over the adhesive layer, the protection sheet is removed from the adhesive layer before attaching the planar thermal dissipation patch; a thermal dissipation layer formed on the polymer substrate; wherein the thermal dissipation layer is formed of CNT, conductive polymer, graphite or the combination thereof.05-23-2013
20130140013RADIATOR FIN - A radiator fin (06-06-2013
20130140014METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL - Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).06-06-2013
20080202740RESILIENT FASTENER AND THERMAL MODULE INCORPORATING THE SAME - A thermal module (08-28-2008
20110209861METHOD OF MANUFACTURING PLATE HEAT EXCHANGER AND PLATE HEAT EXCHANGER - In a plate heat exchanger, it is aimed to enhance strength, such as the pressure resistance and the internal pressure fatigue resistance, by increasing the joint area of a joint portion joined by brazing in a wave-patterned portion. Before a brazing process of the plate heat exchanger, a plurality of plates are stacked and pressure is applied thereto. By this pressure process, indentations of approximately “0.05 mm to 0.1 mm” are formed at contact points 09-01-2011
20130146269HEAT SINK - A heat sink includes a base and a number of fins perpendicularly extending from the base. The base includes a main body. The fins include a number of parallel first fins and two second fins sandwiching the first fins. Each second fin includes a main piece extending from the main body and a guiding piece extending from one end of the main piece.06-13-2013
20130146270FIXING DEVICE, AND HEAT SINK DEVICE OR SHIELD CASE COMPRISING THE SAME - A fixing device, and a heat sink device or a shield case comprising the same. The fixing device is used to connect the heat sink device or the shield case to a circuit board. The circuit board has a via hole which comprises a first size, a second size, and a first height. The fixing device has a connecting member which comprises successively along its extending direction a first boss part, a clamping part, and a second boss part. The first boss part has a first width; the clamping part engages with the via hole, and has a second width and a second height; the second boss part has a third width. The third width is smaller than the second size, the second width equals to the first size, the second height equals to the first height, and the first and third width are larger than the first size.06-13-2013
20110247796HEAT SINK - A heat sink includes a main body, a base formed on a bottom of the main body, and a conducting member attached to a bottom of the base. The heat exchange coefficient of the conducting member is higher than the heat exchange coefficient of the base.10-13-2011
20090166021HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM - The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.07-02-2009
20100300671HEAT SINK AND METHOD FOR MANUFACTURING SAME - A heat sink capable of permitting heat transfer from an electronic component to the heat sink to be effectively promoted while reducing a manufacturing cost of the heat sink and increasing yields thereof. The heat sink includes a base plate adaptable to be kept in direct contact with an electronic component which requires that heat be dissipated therefrom during operation thereof and radiation fins arranged so as to project from the base plate. The base plate includes a main base plate section made of a main material of which the radiation fins are made and a heat transfer promoting base plate section made of a heat transfer promoting material different from the material of which the main base plate section is made. The heat transfer promoting material is integrated with said main material at a stage at which working of a workpiece. This permits heat generated from the electronic component to be dispersed over the whole heat transfer base plate section and then transferred through the whole main base plate section to the radiation fins, so that the heat sink may be increased in heat dissipation efficiency.12-02-2010
20100307730Liquid-cooled heat dissipating device and method of making the same - A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.12-09-2010
20120273181LOW TEMPERATURE THERMAL CONDUCTOR - A thermal conductor material having excellent heat transfer properties by obtaining high thermal conductivity even at low temperature of, for example, a liquid nitrogen temperature (77 K) or lower is to provide. A thermal conductor to be used at low temperature of 77 K or lower in the magnetic field of a magnetic flux density of 1 T or more, includes aluminum which has a purity of 99.999% by mass or more and also has the content of iron of 1 ppm by mass or less.11-01-2012
20120273180HEAT DISSIPATING DEVICE - A heat dissipating device includes a tubular body having a first open end, and a plurality of heat dissipating fins, each having a fin body and a first engaging portion formed on the fin body for engaging the first open end of the tubular body in a manner that the heat dissipating fins are disposed to radiate from and to surround the tubular body. The first engaging portion includes a first extension section bent from the fin body, and a first hook extending from the first extension section for hooking onto the tubular body at the first open end.11-01-2012
20120273182FIN MEMBER FOR HEAT EXCHANGER - A fin member for a heat exchanger is produced by repeatedly folding a plate over itself into a corrugated shape to form corrugated fins. The folded sections which are formed by the folding are pressed and deformed into a recessed shape to form engagement recesses. A pipe member through which fluid flows is disposed at the engagement recesses. The pressing and deformation of the engagement recesses cause swollen sections to protrude at both sides of each folded section with respect to the folding-over direction of the folded section and form flat butt surfaces at the tips of the swollen sections. Adjacent butt surfaces are caused to be in surface contact with each other with the pipe member disposed at the engagement recesses.11-01-2012
20130153193BIDIRECTIONAL HEAT SINK FOR PACKAGE ELEMENT AND METHOD FOR ASSEMBLING THE SAME - In a bidirectional heat sink for a package element and a method for assembling the same, the bidirectional heat sink includes a first heat-dissipating plate, a second heat-dissipating plate, and a plurality of heat-dissipating pieces. The first heat-dissipating plate is provided with a groove. Both sides of the groove are formed with two separation walls. The package element is inserted into the groove to contact the two separation walls. The second heat-dissipating plate extends from one end of the first heat-dissipating plate. Each of the heat-dissipating pieces extends from the second heat-dissipating plate in a direction away from the first heat-dissipating plat). By this structure, the contact area of the package element is increased to improve the heat-dissipating efficiency. Further, the assembling process is performed quickly to form a firm structure.06-20-2013
20130153194HEAT-CONDUCTING ELEMENT, ASSEMBLY AND USE OF THE SAME - The invention relates to a heat-conducting element (06-20-2013
20130153188ADVANCED SMR REACTOR DESIGN FEATURING HIGH THERMAL EFFICIENCY - An improved reactor process is provided. This process includes providing at least one reactor tube, the reactor tube comprising an exterior and an interior, the interior comprising an inside surface, providing a heat source to the exterior of the at least one reactor tube, providing a reactant gas stream to the interior of the at least one reactor tube, placing at least one heat transfer structure in thermal contact with the inside surface of the at least one reactor tube, and transferring heat from the heat source to at least a portion of the reactant gas stream at least partially through the at least one heat transfer structure, thereby producing a product gas stream. There may be a catalyst on the interior of the at least one reactor tube. The reactant gas stream may comprise methane and steam.06-20-2013
20130153189HEAT DISSIPATING FIN, HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.06-20-2013
20130153187Dual Heat Sinks For Distributing A Thermal Load - Dual heat sinks, apparatuses, and methods for installing a dual heat sink for distributing a thermal load are provided. Embodiments include a top base to couple with a first integrated circuit of a first board and to receive a first thermal load from the first integrated circuit; a bottom base to couple with a second integrated circuit of a second board and to receive a second thermal load from the second integrated circuit; and a thermal dissipating structure coupled between the top base and the bottom base, the thermal dissipating structure to receive and distribute the first thermal load and the second thermal load from the top base and the bottom base; wherein a height of the thermal dissipating structure is adjustable so as to change a distance separating the top base and the bottom base.06-20-2013
20110232888ZONE TEMPERATURE CONTROL STRUCTURE - A zone temperature control structure which has two or more zone of which surface temperatures are controlled to different temperatures, respectively. The structure can maintain a temperature difference by suppressing heat conduction in a direction in which the zones are arrayed, and prevent formation of a hot spot by ensuring smooth heat conduction for heat input in a direction intersecting the direction in which the zones are arrayed. A heat-conducting anisotropic material layer is disposed between the two or more zones. The heat-conducting anisotropic material layer is configured such that heat conductivity is lower in the direction in which the two or more zones are arrayed than in the direction intersecting the direction in which the two or more zones are arrayed.09-29-2011
20110232887COLD PLATE WITH INTEGRAL STRUCTURAL FLUID PORT - A cold plate assembly includes a sheet having an aperture. A fluid port includes a body having a passage. A flange extends from the body and is secured to the sheet with a material. The passage and the aperture is in fluid communication with one another. The cold plate is manufactured, for example, by arranging multiple sheets relative to one another with a first material provided between the sheets. A fluid port is arranged on one of the multiple sheets with the passage in the fluid port in fluid communication with the aperture in at least one of the multiple sheets. A second material is provided between the fluid port and at least one of the multiple sheets. The fluid port and the multiple sheets are secured to one another with the first and second materials by a method, such as brazing.09-29-2011
20110232886Heat dissipation housing for led lamp - The present invention is to provide a heat dissipation housing for an LED lamp, which is made as a one-piece member by metal casting and formed with a receiving channel axially passing therethrough. A plurality of cooling fins axially are formed on an outer surface of the housing, wherein each said cooling fin is radially extended out of the housing and formed therein with a plurality of heat dissipation holes, and has two opposite sides with an included angle defined therebetween. Therefore, when an LED lamp installed on an end of the receiving channel starts to emit light, heat exchange between the LED lamp and the ambient cooling air outside the housing can be carried out through the cooling fins and the heat dissipation holes by both of thermal conduction and thermal convection, so as to effectively enhance the heat dissipation efficiency of the housing for the LED lamp.09-29-2011
20130153190HEAT SINK - A heat sink for dissipating heat of a heat-generating element on a circuit board includes a base, a linear fastener and a heat-dissipating fin set. The linear fastener includes a fixing section disposed on the base and an engaging section extending from the fixing section. The engaging section extends out of the base to be fixed on the circuit board. The heat-dissipation fin set is combined on the base and has stamped fins. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipation fin set and the base. The linear fastener is used to combine the heat-dissipating fin set on the circuit board to increase the heat-dissipating efficiency of the heat sink to the heat-generating element.06-20-2013
20130153191Conduction coil - A device for heating or cooling material, having at least one first conductive portion sized to be inserted into the material; and at least one second conductive portion conductively attached to the first portion. the second portion is sized to absorb and conduct heat or cooling from a source proximate the second portion into the first portion. The first portion heats or cools the interior of the material.06-20-2013
20130153192HEAT DISSIPATING DEVICE - A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.06-20-2013
20090308584Thermal conduction principle and device of the multi-layers structure with different thermal characteristics - The present invention innovatively discloses a relay thermal conductor being made of material with better thermal conducting characteristics, wherein one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having higher specific heat capacity is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body.12-17-2009
20130180697HEAT DISSIPATING MODULE - A heat dissipating module including multiple first heat dissipating fins and multiple second heat dissipating fins combined to the first heat dissipating fins is provided. Each first/second heat dissipating fin has a first/second body and multiple first/second heat dissipating groove assemblies disposed in the first/second body, wherein each first/second heat dissipating groove assembly has multiple first/second heat dissipating groove unit. One end of the first heat dissipating groove unit is overlapped to one end of the second heat dissipating groove unit adjacent thereof. The other end of the first heat dissipating groove unit is overlapped to one end of another second heat dissipating groove unit. The two second heat dissipating groove units are disposed in the second body adjacent to each other.07-18-2013
20130180698CORRUGATED PLATE MANUFACTURING APPARATUS - Flat-plate connecting portions are formed in a band plate by a connecting-portion forming unit. The flat-plate connecting portions are cut off by another connecting-portion forming unit except one flat-plate connecting portion so as to form a corrugated-plate connecting portion. A corrugated-plate portion is formed by a corrugation forming unit, so that the corrugated-plate portion has multiple projections arranged in a width direction of the band plate and each of the projections extends in a plate feeding direction. The corrugated-plate connecting portion corresponding to a predetermined connecting number is cut off so as to form a corrugated fin having a predetermined number of corrugated-plate portions.07-18-2013
20130180699PLATE HEAT EXCHANGER - A plate heat exchanger for exchanging heat between mediacomprises a number of stacked plates (A, B, C, D), the plates being provided with a first, large scale pressed pattern comprising ridges (R) and grooves (G) intended to keep first (A, B) and second (B,C) pairs of stacked plates on a distance from one another, such that flow channels for a first medium is formed in spaces between said plate pairs. Contact points are provided between the plate pairs in points where the large scale pressed pattern of neighboring plate pairs contact one another. The plates of each plate pair (A, B; C, D) are kept on a distance from one another by a small-scale pressed pattern comprising ridges (r) and grooves (g).07-18-2013
20110272129HEAT EXCHANGER - A heat exchanger may include a base plate for fastening to a component and a plurality of supply channels running through the base plate. The heat exchanger may also include at least one sealing element, which may be at least one of injection molded and vulcanized directly onto the base plate generating a tight connection to the component.11-10-2011
20130126145HEAT SINK WITH ORIENTABLE FINS - A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.05-23-2013
20110284197Heat Exchanger - An inner fin is a wave fin having board portions extending in a pipe longitudinal direction and a top portion connecting the board portions located adjacent with each other. The wave fin has a wave-shaped cross-section perpendicularly intersecting a pipe longitudinal direction, and the board portion is bent into a waveform extending in the pipe longitudinal direction when seen from a pipe layering direction. A wave pitch WP[mm], a wave depth WD[mm], and a passage width H[mm] are set to satisfy relationships of 2.2≦WP/WD≦4.28 and 0.5≦WD/H≦1.8.11-24-2011
20130118725Heat Sink and Fins Thereof - The heat sink of the invention includes a cylinder and fins fastened thereto. A hollow in the cylinder is for receiving a heat source. Each the fin includes two parallel wings and a connection plate therebetween. A space is defined by the two wings and the connection plate for air flow.05-16-2013
20110303405THREE PHASE FIN SURFACE COOLER - A surface cooler is provided and includes an oil layer, through which oil flows, a separating plate disposed in heat transfer communication with the oil and fins extending into an air flow pathway and being disposed in heat transfer communication with the separating plate, the fins being arranged with varied configurations at each of two or more sections sequentially defined along a predominant direction of air flow along the air flow pathway.12-15-2011
20110308782THERMAL INTERFACE MATERIAL AND METHOD OF MAKING AND USING THE SAME - A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components. In one exemplary heat transfer material, a coupling agent having the formula:12-22-2011
20110308781THERMALLY CONDUCTIVE GEL PACKS - A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board.12-22-2011
20130186609Heating Pad Applicable to Induction Cooker - The present invention relates to a heating pad which is applicable to an induction cooker and includes a pad body and a metal sheet held in the pad body. A lower portion of the pad body is adapted to be sucked on a furnace surface of the induction cooker, and an upper portion of the pad body is adapted to carry a container.07-25-2013
20130186610RING-SHAPED HEAT DISSIPATING DEVICE AND A MANUFACTURING METHOD THEREOF, AND A HEAT DISSIPATING APPARATUS INCLUDING SAID RING-SHAPED HEAT DISSIPATING DEVICE - A ring-shaped heat dissipating device made of a continuously-bending metal sheet includes a plurality of fins arranged in a radial form to form a central passage communicating from theretop to therebottom. Each of fins has a top plate, a front side plate and a rear side plate extending downwardly from opposite edges of the top plate respectively, and a bottom plate extending from a bottom edge of the rear side plate. The front side plate of one of fins connects with the bottom plate of another fin adjacent thereto. An inner edge of the top plate of one of fins adjacent to the central passage is connected with another two inner edges of two top plate plates of two fins adjacent thereto. And an inner edge of the bottom plate is connected with another two inner edges of two bottom plates of two fins adjacent thereto.07-25-2013
20120285673NANOSTRUCTURED COMPOSITE POLYMER THERMAL/ELECTRICAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME - An exemplary embodiment of the present invention provides a thermal interface material for providing thermal communication between a heat sink and a heat source. The thermal interface material comprises a plurality of polymer nanofibers having first ends and second ends. The first ends can be positioned substantially adjacent to the heat source. The second ends can be positioned substantially adjacent to the heat sink. The plurality of polymer nanofibers can be aligned substantially perpendicular to at least a portion of the heat source and the heat sink.11-15-2012
20120285672Structure of Heat Sink - An improved structure of heat sink, which comprising: a heat conduction layer and cooling fins; the heat conduction layer of an elongated shape is designed in a manner that a heat source is incorporated into the central zone, and convection holes with equidistant arrangement are distributed peripherally; every convection hole is of obround shape and located in parallel with the long side of the heat conduction layer; the cooling fins are arranged into sheets and attached below the heat conduction layer, with the length the same as the long side of the heat conduction layer, namely, the cooling, fins are arranged in parallel with the long side of the heat conduction layer.11-15-2012
20120018138HEAT SINK SYSTEM AND ASSEMBLY - A heat sink system with reduced airborne debris clogging, for cooling power electronics, the heat sink system including a heat sink having a plurality of fins, a housing configured to direct air flow around the side, top, and/or bottom of the heat sink and then through the fins of the heat sink at a back of the heat sink, and an inlet airway passage formed between a wall of the housing and said side, top, and/or bottom of the finned heat sink to allow air to pass within the housing, wherein said side, top, and/or bottom of the heat sink comprises at least one of said plurality of fins disposed directly in contact with the inlet airway passage.01-26-2012
20120018137HEAT-DISSIPATING ASSEMBLY - A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure.01-26-2012
20120018136UNIVERSAL CONDUCTION COOLING PLATFORM - Disclosed is an embodiment of a module for insertion between a first shelf and a second shelf of a rack based processing system. The module includes a first thermal plate substantially parallel to a second thermal plate. An inner surface of the first thermal plate faces an inner surface of the second plate and an outer surface of each of the first and second thermal plates faces opposite to the respective inner surfaces. Each thermal plate is configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates.01-26-2012
20130192813Heat Radiation Sheet - Disclosed is a heat radiation sheet, including a thermoconductive adhesive layer, a thermal diffusion layer, an adiabatic adhesive layer formed on the thermal diffusion layer, and a graphite layer. The thermoconductive adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive, the thermal diffusion layer is formed of metal foil, and the adiabatic adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive. The heat radiation sheet is effective in that high-temperature heat generated from heat sources of various kinds of electronic appliances is rapidly absorbed by a thermoconductive adhesive layer and a thermal diffusion layer, and the absorbed heat rapidly spreads over the entire area of the heat radiation sheet, is stored, and is then slowly discharged to prevent the external temperature of the electronic appliance from rapidly increasing, preventing the deterioration of reliability attributable to the high-temperature heat.08-01-2013
20120024514PLATE COOLING FIN WITH SLOTTED PROJECTIONS - A plate cooling fin with slotted projections comprises a plate member and projection parts on the plate member with slots disposed at the periphery of the respective projection and spacing apart from each other for the cold airflow being guided to pass through the slots and turned into a turbulent flow with eddy currents at the periphery of the cooling fin to extend the stagnation time of the airflow. As a result, more heat can be carried outward the cooling fin to enhance the heat dissipation efficiency.02-02-2012
20120043067HEAT SINK CORE MEMBER AND ITS FABRICATION PROCEDURE - A heat sink core member made by: preparing a predetermined mass of aluminum block, extruding the aluminum block through an extruding machine into a tubular body having one close end wall and then punch-cutting the outside wall of the tubular body to form a plurality of densely distributed and equally spaced vertical retaining grooves. Radiation fins can easily be affixed to the vertical retaining grooves of the tubular body to form a heat sink.02-23-2012
20120043066Article for Magnetic Heat Exchange and Method for Manufacturing an Article for Magnetic Heat Exchange - An article (02-23-2012
20130199769HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a number of protecting members. The heat sink includes a number of parallel fins. The fins form a fin assembly including a number of lengthwise corners at lateral sides of the fin assembly. Each lengthwise corner is covered by one of the protecting members. Each protecting member includes a first stop plate and a second stop plate engaging with two adjacent sides of the fin assembly, and a number of pairs of connecting plates between the first and second stop plates, at opposing ends of the first and second stop plates. A slot is bounded by each pair of connecting plates. The corners of the fins on upper and lower portions of the fin assembly engage and are retained by the slots in upper and lower portions of the protecting members.08-08-2013
20130199771HEAT-DISSIPATING SUBSTRATE FOR LED - The present invention relates to a heat-dissipating substrate for LED, comprising a polyimide film, a copper foil or a copper alloy foil which is laminated on one side of the polyimide film, and an aluminum foil or an aluminum alloy foil which is laminated on the other side of the polyimide film, in which the thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8° C./W or less.08-08-2013
20130199767COMPLIANT PIN FIN HEAT SINK AND METHODS - A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.08-08-2013
20130199768APPARATUS FOR SECURE DEVICE TO EDGE OF PLATE - Apparatuses to secure surface mount heat emitting device with back heat spreader to edge of a heat dissipate plate in order to conduct heat from said heat emitting device to heat dissipate plate directly. Each apparatus comprising of adapter PCB with device mounting pads on surface and opening at location of back heat spreader to expose it for contact access; heat dissipate plate has contact stub to make contact with said back heat spreader and bounding means to bound together said heat dissipate plate and PCB.08-08-2013
20130199770SPRDR- HEAT SPREADER- TAILORABLE, FLEXIBLE, PASSIVE - New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems.08-08-2013
20120298346BENT-TYPE HEAT DISSIPATER - Disclosed is a bent-type dissipater, including one or a plurality of heat sinks which are adapted with cooling apertures; one or a plurality of cooling pins which are bent in structure, and which are integrated to the heat sinks, and a central heat passage for combining heat moving in one direction with ambient air, and discharging the heat in the opposite direction.11-29-2012
20120085527HEAT SPREADER WITH MECHANICALLY SECURED HEAT COUPLING ELEMENT - A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device. Such a heat spreader comprises a base plate (04-12-2012
20120085526HEAT SINK - A heat sink has a stand and a nano-carbon film. The stand is made of a strong and thermally conductive material and includes a lower surface, two sides and two sidewalls. The sidewalls are respectively formed on the sides of the stand. The nano-carbon film can provide excellent heat dissipation effect, is formed on the lower surface of the stand and includes at least one hole. The heat sink is mounted in an electronic device to make the stand contact electronic components through the hole of the nano-carbon film. Therefore, the heat generated by the electronic components can be dissipated by both the stand and the nano-carbon film. Besides, the heat sink is small in size so that it can be applied to small electronic devices. Moreover, the stand can hold the input unit and structurally reinforce the housing of the electronic device.04-12-2012
20120085525HEAT SPREADER FACET PLANE APPARATUS - The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink.04-12-2012
20130206380HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink, a base, and a number of fasteners. The heat sink includes a bottom plate defining a number of holes. The base is mounted to a bottom of the bottom plate. A number of through holes aligning with the holes of the bottom plate are defined in the base. A number of tapered guiding surfaces is formed on a bottom of the base. Each guiding surface bounds a corresponding one of the through holes. A diameter of each guiding surface gradually increases in a downward direction, facilitates the entry of securing screws. The fasteners are mounted to the heat sink. Bottoms of the fasteners are respectively extended through the holes of the heat sink and received in the through holes of the base. An internally-threaded hole is defined in a bottom of each fastener.08-15-2013
20130206381HEAT RADIATOR - A heat radiator includes a base and heat radiating fins. The base has a surface formed with grooves for insertion of the heat radiating fins. Each heat radiating fin has a bent portion at one end thereof. The bent portion has spaced protrusions thereon. The bent portion is inserted and embedded in the groove of the base. Then, a press head is aligned with the bent portion for pressing. The press head has an inclined surface to cover the bent portion and a side wall of the groove. After pressing, the bent portion is deformed and enlarged to engage with the groove. The side wall of the groove is compressed by the inclined surface of the press head to be shifted and deformed. The deformed side wall holds against the bent portion, so that the heat radiating fins and the base are connected.08-15-2013

Patent applications in class HEAT TRANSMITTER