Class / Patent application number | Description | Number of patent applications / Date published |
165146000 | GRADATED HEAT TRANSFER STRUCTURE | 7 |
20090078397 | RADIANT COOLERS AND METHODS FOR ASSEMBLING SAME - A method of assembling a radiant cooler includes providing a vessel shell that defines a gas flow passage therein that extends generally axially through the vessel shell, forming a tube cage from coupling a plurality of cooling tubes together to form a tube cage defined by a plurality of chevron-shaped projections that extend circumferentially about a center axis of the tube cage, each chevron-shaped projection includes a first side and a second side coupled together a tip, circumferentially-adjacent pairs of projections coupled together such that a valley is defined between each pair of circumferentially-spaced projections, each of the projection tips is positioned radially outward from each of the valleys, and orienting the tube cage within the vessel shell such that the tube cage is in flow communication with the flow passage. | 03-26-2009 |
20090145586 | COOLER - A cooler is provided with a thermal transmission member having a surface to be sprayed with a cooling fluid. The heat transmission member includes a first groove formed on the surface, and a second groove intersecting with the first groove and being formed on the surface. | 06-11-2009 |
20100084120 | HEAT EXCHANGER AND METHOD OF OPERATING THE SAME - An evaporative heat exchanger including a plurality of parallel flow passages extending through the heat exchanger and together defining a first fluid flow path, and a plurality of substantially parallel stacked plates interleaved with the parallel flow passages. Each plate can have first, second, and third sets of flow channels, a first collection manifold adjacent to an end of the plate and connecting the first and second passes, and a second collection manifold. The second collection manifold can intersect the second set of flow channels and at least some of the third set of flow channels. The plate separates the first set of flow channels from the second collection manifold. | 04-08-2010 |
20130240186 | Multiple Tube Bank Flattened Tube Finned Heat Exchanger - A multiple tube bank heat exchanger includes a first tube bank ( | 09-19-2013 |
20140048237 | SHELL AND TUBE HEAT EXCHANGER - A heat exchanger is provided and includes a shell extending between opposing tube sheets to define an interior, nozzles coupled to the shell by which a first fluid is communicated with the interior and a tubular body extending between the opposing tube sheets to transmit a second fluid through the interior whereby heat transfer occurs between the first and second fluids along a heat transfer portion of the tubular body defined from respective planes of opposing faces of the opposing tube sheets, the heat transfer portion having at least first and second topologies at first and second sections thereof, respectively, which are respectively disposed proximate to the respective planes of the opposing faces of the opposing tube sheets. | 02-20-2014 |
20160069622 | Heat Sink Having a Cooling Structure with Decreasing Structure Density - A heat sink for cooling a heat generating device comprises a body part with a first surface for contacting the heat generating device, and a second surface contacting a cooling part, and the cooling part including a cooling structure. The structure density of the cooling structure decreases with increasing distance to body part. The cooling structure may be a three dimensional structure e.g. a grid or a lattice, but the cooling structure may also be fins projecting or extending from the second surface of the body part. The heat sink can be manufactured using additive manufacturing e.g. selective laser melting process (SLM). The heat sink can be made of metals e.g. aluminum, copper, ceramics e.g. aluminium nitride (AlN), silicon carbide or a composite containing graphite, graphene or carbon nanotubes. | 03-10-2016 |
20160133504 | SUSCEPTOR DESIGN TO REDUCE EDGE THERMAL PEAK - Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region. | 05-12-2016 |