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Cooling electrical device

Subclass of:

165 - Heat exchange

165104110 - INTERMEDIATE FLUENT HEAT EXCHANGE MATERIAL RECEIVING AND DISCHARGING HEAT

165104190 - Liquid fluent heat exchange material

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DocumentTitleDate
20100032141 COOLING SYSTEM UTILIZING CARBON NANOTUBES FOR COOLING OF ELECTRICAL SYSTEMS - A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module. The CNT heat exchanger module includes a member having a hole defined therethrough and a plurality of carbon nanotubes (CNTs) attached to the member. The coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system.02-11-2010
20100071881COOLING SYSTEM FOR AIRCRAFT ELECTRIC OR ELECTRONIC DEVICES - A cooling system for cooling the electrical or electronic equipment on board an aircraft is equipped with a main closed circuit. A pump circulates a heat transfer medium through the main closed circuit. A main heat exchanger is thermally coupled with the heat transfer medium. A secondary heat exchanger allows direct thermal coupling of the heat transfer medium to air on the outside of the aircraft. A bypass valve located upstream from the secondary heat exchanger allows to block, at least partially, the circulation of the heat transfer medium towards the secondary heat exchanger. A bypass duct connects the bypass valve to a point on the main closed cooling circuit downstream from the secondary heat exchanger to bypass, at least partially, the heat transfer medium towards the main heat exchanger as a function of a setting of the bypass valve.03-25-2010
20130081791LIQUID SUBMERSION COOLED DATA STORAGE OR MEMORY SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.04-04-2013
20130081790LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.04-04-2013
20120175088CONTAINER DATA CENTER AND WASTE HEAT UTILIZING SYSTEM THEREFOR - The disclosure relates to a waste heat utilizing system for a container data center. The waste heat utilizing system includes a first heat exchanger received in and absorbing heat from the container data center, a water inlet pipe communicated with the first heat exchanger for supplying water to the first heat exchanger to exchange heat, a second pipe communicated with the first heat exchanger for removing heated water from the first heat exchanger, a second heat exchanger connected to the second pipe for dissipating heat of the heated water removed from the first heat exchanger, and a heat utilizing device receiving the second heat exchanger therein for absorbing the heat dissipated by the second heat exchanger. A third pipe is dipped into water container and connected to an outlet of the second heat exchanger, and water is flowed back to the water container via the third pipe.07-12-2012
20090120621Method and apparatus for cooling electronic or other devices - A method and apparatus for cooling electronic or other devices by bringing the device to be cooled into contact with one face of a cold plate having high thermal conductivity; and applying a plurality of liquid jets of a liquid coolant to the opposite face of the cold plate perpendicularly thereto and at spaced location thereon. The plurality of liquid jets are applied in pulses as pulsatile jets. The liquid coolant is also circulated in a pulsatile manner as a planar-flow liquid in contact with and parallel to the opposite face of the cold plate, such that the plurality of pulsatile jets of the liquid coolant flow as immersed jet streams through the planar-flow liquid coolant circulated in contact with and parallel to the opposite face of the cold plate.05-14-2009
20100044016MULTISTAGE COOLING OF ELECTRONIC COMPONENTS OF AN AIRCRAFT - The invention discloses the multistage cooling of an aircraft electronic system (02-25-2010
20100044015Heat Sink - A fluid-cooled heat sink (02-25-2010
20100101765LIQUID COOLING APPARATUS AND METHOD FOR COOLING BLADES OF AN ELECTRONIC SYSTEM CHASSIS - Apparatus and method are provided for facilitating liquid cooling of a plurality of blades of an electronic system chassis. The apparatus includes a chassis-level manifold assembly with a first coolant path and a plurality of second coolant paths. The first coolant path is isolated from the plurality of second coolant paths by a heat exchanger. The heat exchanger facilitates transfer of heat from coolant within the second coolant paths to coolant within the first coolant path. Each second coolant path is isolated from the other second coolant paths, and coolant passing therethrough facilitates cooling of a respective blade. When operational, each second coolant path forms a portion of a respective closed loop coolant path extending between the manifold assembly and the electronic system chassis, and in one embodiment, each blade is an immersion-blade, with multiple components thereof immersion-cooled by coolant flowing through the respective second coolant path.04-29-2010
20090159244Water-cooled cold plate with integrated pump - Embodiments of the present invention provide a cooling apparatus for cooling an electronic component to which the cooling apparatus is attached. In one embodiment, an apparatus for cooling an electronic component comprises a pump; a cooling member configured to be disposed adjacent the electronic component, the cooling member including a plurality of protrusions over which a cooling fluid circulates to dissipate heat generated by the electronic component; a coolant flow control housing coupled to the cooling member, the coolant flow control housing including a distributed flow path over the plurality of protrusions for the cooling fluid to enter the cooling member in a distributed manner over the plurality of protrusions, and an exit path for the cooling fluid to exit the cooling member; and a serialization housing connected between the coolant flow control housing and the pump, the serialization housing including a pump inlet to direct the cooling fluid from the exit path of the coolant flow control housing to the pump for pumping the cooling fluid out of the apparatus.06-25-2009
20100108299COOLING MODULE, TECHNICAL DEVICE WITH A COOLING MODULE, AND METHOD FOR INTERNALLY COOLING A TECHNICAL DEVICE - The cooling module (05-06-2010
20100108300SWITCHGEAR CABINET OR RACK WITH A FLUID DISTRIBUTION DEVICE - A switchgear cabinet or a rack with a base, arranged below a usable space, and a fluid distribution device including a coolant line for a cooling medium that flows through a cooling device. In order to achieve simple connection options for other coolant lines, the distribution device is configured as a main distribution unit installed in the region of the base and extends with at least one pipe between two vertical delimitation planes of the base, which are located parallel to each other at a distance, and the pipe has at least one branch part for the connection of the cooling device.05-06-2010
20080283225WATER-COOLING HEAT-DISSIPATING SYSTEM - A water-cooling heat-dissipating system for facilitating a heat-dissipating action with a heat-generating element includes a water block, a membrane pump, a water tank and a heat exchanger. The above-mentioned components are in fluid communication with one another via a plurality of conduits. The water block is attached on the heat-generating element to absorb the heat generated by the heat-generating element. The membrane pump generates a thrust to facilitate the working fluid to perform a cooling action. The water tank is used to store additional working fluid. The heat exchanger performs a heat-conducting action with the flowing working fluid, thereby dissipating the heat absorbed by the working fluid to the outside. In this way, the heat-generating element can be kept in a normal range of working temperature.11-20-2008
20130081792LIQUID SUBMERSION COOLED POWER SUPPLY SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.04-04-2013
20130032314Energy conversion device, in particular for underwater compression and pumping station, with improved cooling means - The energy conversion device (02-07-2013
20090314474HEAT SINK FOR POWER MODULE - A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.12-24-2009
20090126908Heat Pipe With Planished End Surface and Method of Manufacturing the Same - The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted into the pipe body. By use of the male mold, the sealed end of the pipe body with respect to the female mold is stamped to form a planished surface at the sealed end of the pipe body. Whereby after the heat pipe is finished, an electronic device is capable of being mounted on the planished surface at the sealed end of the heat pipe.05-21-2009
20090101317JACKET FOR HEAT DISPERSION DEVICE - An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.04-23-2009
20090301694HEAT DISSIPATION DEVICE - A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a centre of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a centre of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.12-10-2009
20090301693SYSTEM AND METHOD TO REDIRECT AND/OR REDUCE AIRFLOW USING ACTUATORS - The invention generally relates to ventilation systems and methods, and more particularly to selectively configurable climate control systems and methods for use in data centers and the like. A device includes a support element and a plurality of ducts connected to the support element. The device also includes a manifold in fluid communication with each one of the plurality of ducts and a plurality of valves. Each respective one of the plurality of valves is associated with a respective one of the plurality of ducts. Moreover, there is at least one actuator operatively connected to the plurality of valves, which is structured and arranged to individually actuate each one of the plurality of valves.12-10-2009
20090283248Temperature Managing For Electronic Components - A method and arrangement for managing the temperature of an electronic component. A reservoir holds a tempering liquid. A pressurizing device pressurizes the liquid, and provides the liquid to a spraying device, which sprays the liquid onto the electronic component. A heat remover cools the liquid when thermal energy is to be removed from the component, and a heating device heats the liquid when thermal energy is to be provided to the component when powering up the component in low temperatures.11-19-2009
20120216992DEW-CONDENSATION DETECTING APPARATUS, ELECTRONIC EQUIPMENT COOLING SYSTEM, AND DEW-CONDENSATION DETECTING METHOD - A dew-condensation detecting apparatus includes a dew-condensation detector provided in a middle of a cold-liquid supply passage. The cold-liquid supply passage supplies a cooling liquid to electronic equipment. The dew-condensation detector detects dew condensation by detecting water droplets due to the dew condensation. A heating part heats the cooling liquid which has exited from the dew-condensation detector.08-30-2012
20130056181DEIONIZED-WATER COOLING SYSTEM FOR ELECTRICAL EQUIPMENT - Deionized-water cooling system for electrical equipment, connected electrically to a primary power supply, characterized in that it includes: a main circuit to channel and cool the deionized water intended to circulate within the electrical equipment; a main pumping system; a main power source; a deionization circuit connected at two points to the main circuit and including a deionizer; a secondary pumping system to circulate the deionized water in the deionizer, and a secondary power source, which secondary power source has less power than the main power source.03-07-2013
20090095451Method and apparatus for temperature change and control - An apparatus for controlling the temperature of a substrate which includes a substrate table and a thermal assembly arranged in the substrate table and in thermal communication with a thermal surface of the substrate table. The thermal assembly includes a channel that carries a heat-transfer fluid. The apparatus further includes a fluid thermal unit which includes a first fluid unit configured to control the temperature of the heat-transfer fluid to a first temperature, a second fluid unit configured to control the temperature of the heat-transfer fluid to a second temperature, and an outlet flow control unit that is in fluid communication with the channel of the thermal assembly and the first and second fluid units. The outlet flow control unit is configured to supply the channel with a controlled heat transfer fluid, which includes at least one of the heat-transfer fluid having a first temperature, the heat transfer fluid having a second temperature or a combination thereof.04-16-2009
20090095449Cooling Device for Electrical Apparatus Mounted on Vehicle - An ECU executes a program including a step of operating a battery cooling fan motor if a battery temperature is higher than a cooling required temperature, a step of sensing a cooling airflow temperature, a step of sensing solar radiation intensity onto a rear package tray, and a step of operating a motor serving as an actuator which closes a rear sunshade identified as a solar radiation blocking tool if the cooling airflow temperature is greater than a temperature threshold value and the solar radiation intensity is greater than a solar radiation intensity threshold value.04-16-2009
20090095448HEAT DISSIPATION DEVICE FOR LED CHIPS - A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.04-16-2009
20110056660FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION - A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.03-10-2011
20090056918HEAT DISSIPATION DEVICE HAVING A BACK PLATE UNIT - A heat dissipation device for dissipating heat from an electronic component (03-05-2009
20090014158Nano shower for chip-scale cooling - A nano shower cools a chip when a coolant sprays onto the chip package from an array of electro spray nozzles. Ideally, the coolant is not conductive and otherwise not harmful to electronics. As such, perfluorocarbons are ideal coolants. Distilled water also works in certain applications. A voltage difference between the coolant and chip package causes the coolant to spray from the electro spray nozzles onto the chip package. The coolant cools the chip package by evaporating or by absorbing heat and flowing away.01-15-2009
20090014157Cooler - The invention relates to a cooler (01-15-2009
20090008065HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set.01-08-2009
20080296000COOLING DEVICE FOR COMPUTER - A cooling device (12-04-2008
20080295999COOLING MECHANISM - A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.12-04-2008
20090194260Cooling apparatus for graphic cards - A cooling apparatus for graphic cards is used for two graphic cards that are disposed in parallel. There is a receiving space between the two graphic cards. The cooling apparatus for graphic cards includes a first base, a first cooler, a plurality of first heat pipes, a second base, a second cooler, and a plurality of second heat pipes. The first base is located on the first heat-emitting element of the first graphic card. One end of the first cooling pipe extends through the first base, and the second end of the first cooling pipe extends through the first cooler. The second base is located on the second heat-emitting element of the second graphic card. Thereby, the cooling apparatus for graphic cards can be applied to a plurality of graphic cards. The heat is simultaneously exhausted for both cards and the space is reduced.08-06-2009
20080302514Plasma cooling heat sink - One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device comprises heat sink fin assembly, plasma actuator assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. The magnetic circuit assembly provides magnetic field to interact with electrical field and plasma flow, and therefore an induced gas flow is pumped into, or pumped out from, heat sink fin assembly, to cool down heat sink fins.12-11-2008
20120186789NANOFLUIDS FOR USE IN COOLING ELECTRONICS - A fluid composition or nanofluid is described that includes a dielectric base fluid, a chemical dispersant, and nanoparticles dispersed in the dielectric fluid. The chemical dispersant is used to facilitate the nanoparticle dispersing process and also to increase the stability of the nanofluid thus produced. The nanofluid is compatible with electronics and has enhanced thermal conductivity for use in cooling electronics. Techniques are described that can be used to efficiently disperse different forms of nanoparticles into a base fluid and produce a stable nanofluid which is compatible with electronic circuitry and components.07-26-2012
20100170663MODULAR ICE STORAGE FOR UNINTERRUPTIBLE CHILLED WATER - A backup cooling storage system comprising at least one cooling and storage unit configured to cool a liquid supply using a quantity of cooled material when a main chiller of the liquid supply is not operational, and at least one chilling element configured to generate the quantity of cooled material for the at least one cooling and storage unit when the main chiller of the liquid supply is operational. Additional embodiments and methods are further disclosed.07-08-2010
20100170662CONDENSER FOR POWER MODULE AND POWER MODULE - A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.07-08-2010
20090090489Water-cooling heat-dissipating module of electronic apparatus - A water-cooling heat-dissipating module of an electronic apparatus includes a heat-conducting unit, a driving unit and a dissipating unit. The heat-conducting unit has a function of conducting a heat source. The dissipating unit has a function of dissipating the heat of a fluid. The driving unit has a function of driving the fluid. Via the driving unit, the fluid can be rapidly introduced into or drained out of each unit for circulation, thereby achieving the heat-dissipating effect.04-09-2009
20120012283HOT AISLE CONTAINMENT COOLING UNIT AND METHOD FOR COOLING - A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed.01-19-2012
20120012282DIRECT AIR CONTACT LIQUID COOLING SYSTEM HEAT EXCHANGER ASSEMBLY - A heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid flows. An air pump injects air bubbles into the heat exchanger chamber through a porous material. The air bubbles rise up through the thermal transfer liquid and exit at the top of the heat exchanger chamber through a semi-permeable membrane which inhibits loss of the thermal transfer fluid. As the air bubbles pass through the thermal transfer liquid, heat is exchanged directly between the thermal transfer liquid and the contained air. The heat is then removed from the system as the heated air is expelled from the heat exchanger chamber.01-19-2012
20100276120TEMPERATURE ADJUSTING MECHANISM - A temperature adjusting mechanism capable of efficiently performing temperature adjustment of a power source element is provided. A temperature adjusting mechanism adjusting a temperature of a power source element, includes a case member which houses the power source element and a first heat exchange medium in liquid form performing heat exchange with the power source element; and a guide member which is connected to the case member and forms at least a portion of a flow path in which a second heat exchange medium flows. The guide member is formed of a material having a higher thermal conductivity than a thermal conductivity of outside air which is in contact with the case member.11-04-2010
20090078396Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition - The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.03-26-2009
20100032143 MICROHEAT EXCHANGER FOR LASER DIODE COOLING - A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.02-11-2010
20110214843Systems and Methods for Thermal Control of Integrated Circuits During Testing - Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between the heat-conductive pedestal and the block for controlling heat flow between the pedestal and fluid circulation block, and a force distribution block for controllably distributing a z-axis force between different pushers of the TCU. Alternatively, instead of a thermoelectric module, a heater can provide heat to the DUT. Optionally, a swivelable temperature-control fluid inlet and outlet arms may be provided to reduce instability of the thermal control unit due to external forces exerted on the TCU such as by fluid lines attached to the fluid inlet and outlet arms. Also optionally, an integrated means for abating condensation on surfaces of the TCU during cold tests may be provided.09-08-2011
20120097374MAINTAINING THERMAL UNIFORMITY IN MICRO-CHANNEL COLD PLATES WITH TWO-PHASE FLOWS - A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.04-26-2012
20090242176HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.10-01-2009
20120186790IMPLEMENTING A FRONT DOOR AIR TO WATER HEAT EXCHANGER - A system for cooling of electronic equipment enclosures, the system includes: enclosures with front and rear doors for holding assemblages of electronics; front and rear heat exchangers housed within each of the front and rear doors, respectively; a series of separate supply lines configured with control valves and flow control sensors that provide liquid coolant to each of the heat exchangers; a series of separate return lines configured with temperature sensors for exiting coolant from each of the heat exchangers; separate air purging valves for each of the supply and return lines; a series of spray shields for preventing coolant leaks from entering an inlet airflow, and to protect the assemblages of electronics from coolant leaks; wherein the control valves are actuated by a controller in response to readings from the temperature and flow control sensors to separately control coolant flow to each of the front and rear heat exchangers.07-26-2012
20090151908Cooling Module - A cooling module for using in a metal housing of a calculation processing apparatus is disclosed. The cooling module is adapted to cool at least one heat source inside the metal housing. The cooling module comprises a first heat conduction plate, a second heat conduction plate and a heat conduction device, wherein the first heat conduction plate covers the heat source, the second heat conduction plate connects to the metal housing, and the heat conduction device is adapted to connect the first heat conduction plate with the second heat conduction plate. After the heat generated by the heat source is absorbed by the first heat conduction plate, the heat is transmitted to the second heat conduction plate through the heat conduction device, and will be dissipated uniformly throughout the metal housing.06-18-2009
20090151907COMPLIANT THERMAL INTERFACE DESIGN AND ASSEMBLY METHOD - A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.06-18-2009
20120024501THERMOELECTRIC-ENHANCED, LIQUID-COOLING APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT - Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.02-02-2012
20090095450COOLING STRUCTURE FOR ELECTRIC DEVICE - A cooling structure for an electric device includes a plurality of cooling medium paths (04-16-2009
20080264614Cooling components in electronic devices - Various embodiments are directed to cooling heat generating components. In one embodiment, a method cools a heat generating component in an electronic device below an ambient temperature to produce condensation. Heat is transferred from the heat generating component to a thermal dissipation device, and the condensation is dispensed onto a thermal dissipation device to cool the thermal dissipation device.10-30-2008
20080264613STRUCTURE OF MEMORY HEAT SINK - A memory heat sink is mainly used to provide the memory unit with increased heat dissipation and protection. The memory unit, which is sandwiched in between the bilateral heat spreaders gripped by clips, can be free from dust and have increased heat dissipation. The thermal conduction unit, which perches on the bilateral heat spreaders, can be adjusted to any desirable angle by slightly lifting up the clips. Such angle adjustment made in an easy and simple way would assure performance of a plurality of memory heat sinks, which is applicable to a plurality of memory units inserted in sockets on a main board. The angle adjustment would keep the memory heat sinks spaced to each other so as to increase the heat dissipation.10-30-2008
20100084118COOLING SYSTEM FOR AIRCRAFT ELECTRIC OR ELECTRONIC DEVICES - In a cooling system for the electrical or electronic equipment on board an aircraft, a heat transfer medium circulates through a main closed cooling circuit. A liquid coolant circulates through a secondary closed cooling circuit. A first heat exchanger makes it possible to transfer the heat from the heat transfer medium circulating through the main closed cooling circuit to the liquid coolant circulating through the secondary closed cooling circuit, by evaporation of the liquid coolant circulating through the secondary closed cooling circuit. A second heat exchanger makes possible the condensation of the liquid coolant circulating through the secondary closed cooling circuit. The second heat exchanger cools the liquid coolant by thermal coupling to the outside ambient air.04-08-2010
20090120622Heat Exchanger and Method For Cooling Network Cabinets - The invention relates to a heat exchanger for water-cooled network cabinets and to a method for cooling network cabinets, particularly server cabinets. The heat exchanger is constructed as an air-water heat exchanger in redundant form and ensures a leaktight arrangement and cooling in a network cabinet. The heat exchanger has two heat exchanger elements with separate cooling water connections which, accompanied by the formation of a space, are provided for the supply of exhaust air from the cabinet interior. A partition is adjustably placed in the space and in the case of a fault, e.g. if one heat exchanger element or a cooling circuit fails, the corresponding heat exchanger element is aerodynamically blocked with the aid of the partition. The entire exhaust air is cooled in the intact heat exchanger element and supplied to the cabinet interior, so that no interruption of operation is necessary.05-14-2009
20100126703Motor device with heat dissipating capability - A motor device includes a motor body and a set of heat-conducting pipes. The motor body includes a motor casing that defines a chamber, a stator that is disposed in the chamber, and a rotor that is rotatably disposed in the chamber. Each of the heat-conducting pipes has a heat-absorbing end that extends into the motor body, and a heat-dissipating end that is opposite to the heat-absorbing end and that extends outwardly of the motor body.05-27-2010
20090166009HEAT DISSIPATION DEVICE HAVING HEAT PIPES FOR SUPPORTING HEAT SINK THEREON - A heat dissipation device includes a base, a fin group located at a top of the base, a fan mounted on a top of the fin group, a first heat pipe and a second heat pipe. The first and second heat pipes connect with the base and the fin group and each includes a condensing portion and an evaporating portion. The evaporating portions of the first and second heat pipes are received in the base. The condensing portions of the first and the second heat pipes are located at opposite sides of the fin group respectively and extend through and support the fin group along opposite directions.07-02-2009
20090277616METHOD AND APPARATUS OF WATER COOLING SEVERAL PARALLEL CIRCUIT CARDS EACH CONTAINING SEVERAL CHIP PACKAGES - A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating with the heat producing device for transferring heat from the heat producing device to the heat transfer device. A heat conduit is connected to the heat transfer device and thermally communicating with the heat transfer device for transferring heat to the heat conduit from the heat transfer device. A cooling housing is connected to the heat conduit and the cooling housing thermally communicating with the heat conduit for transferring heat to the cooling housing from the heat conduit. The apparatus enables the replacement of circuit cards in the field because it eliminates the need to apply thermal-interface materials.11-12-2009
20080236798HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a base (10-02-2008
20090288808Quick temperature-equlizing heat-dissipating device - A quick temperature-equalizing heat-dissipating device includes a hermetic container, a metallic sheet, and two metallic nets. The hermetic container contains a liquid working medium and has an internal top side and an internal bottom side. The metallic sheet is mounted inside the hermetic container, having a plurality of pores running therethrough and a plurality of support pieces protruding outward from its upper and lower surfaces respectively. The two metallic nets are supported by the support pieces to contact against the internal top and bottom sides of the hermetic container. Accordingly, the heat-dissipating device is based on the aforesaid heat-dissipating structure and the principle of working medium liquid phase transition to quickly equally dissipate the high heat flow density of an electronic component.11-26-2009
20090294106METHOD AND APPARATUS FOR CHIP COOLING - In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.12-03-2009
20090294105Selectively Grooved Cold Plate for Electronics Cooling - An improved heat exchange device adaptable for cooling electronic components mounted over at least one external surface of the device, comprising a base plate; a cover plate; a clad plate interposed between the base plate and the cover plate, the base plate and the cover plate, with the clad sheet being rigidly jointed to form a single integrated plate; at least one inlet port and at least one outlet port atone end and/or at the opposite ends of the formed plate for entry and exit of a cooling medium, wherein the base plate is configured to have a plurality of flow-passages each comprising several machined grooves having varied dimensions predetermined in registration with respective thermal footprint of the electronic components thereby optimizing the heat transfer rate, and in that a plurality of interconnections being designed between the grooves constituting one of a series and parallel flow-paths.12-03-2009
20110198060Heat Dissipation Apparatus for Data Center - The present invention discloses a heat dissipation apparatus that comprises at least a boiling houses, a condenser and an air channel. Each boiling house is provided to receive heat from at least a server, and is connected with a loop pipe filled with a first fluid. Each condenser is connected with the loop pipe so as to remove the heat from each boiling house. The cooling conduit is provided to receive a second fluid for conveying the second fluid to each condenser. The air channel is provided to receive a third fluid for transferring the heat from the condenser into a predetermined space.08-18-2011
20090038782HEAT-CONDUCTING MODULE - In a heat-conducting module and a method for manufacturing the same, the heat-conducting module includes a heat-conducting base and a heat pipe. The surface of the heat-conducting base is formed with a groove. Both sides of the groove protrude upwards to form two side walls respectively. Both of the side walls are provided with hooks respectively that are engaged with each other. The heat pipe is accommodated in the groove of the heat-conducting base and is thus covered and sandwiched by the two side walls. Via this arrangement, the connection between the heat pipe and the heat-conducting base can be firm and steady. In this way, the tight contact between the heat pipe and the heat-conducting base can be increased and the heat-conducting efficiency of the heat-conducting module can be enhanced.02-12-2009
20090038781Heat Exchange System - The invention relates to a heat exchange system for electronic devices, preferably data processing devices, comprising high-performance processors or having a high processor density. The heat exchange system comprises essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor unit(s). The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit02-12-2009
20090266522METHOD OF FLATTING EVAPORATING SECTION OF HEAT PIPE EMBEDDED IN HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE WITH HEAT PIPE - A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.10-29-2009
20090166007HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device includes a base for contacting with a heat-generating electronic component, a fin assembly, a heat pipe connecting with the base and the fin assembly, and a holder connecting with the base and the fin assembly and supporting the heat pipe. The fin assembly includes a plurality of fins far away from the base. The heat pipe includes an evaporation portion thermally engaging with the base, a condensation portion connecting with the fin assembly and a connecting portion connecting with the evaporation portion and the condensation portion. The holder has a profile similar to the connecting portion of the heat pipe.07-02-2009
20090166006HEAT DISSIPATION DEVICE - A heat dissipation device (07-02-2009
20090166008HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.07-02-2009
20080277104Al-AlN composite material, related manufacturing method and heat exchanger using such composite material - An Al—AlN composite material, a heat exchanger and a related manufacturing method are disclosed. The Al—AlN composite material aluminum is manufactured by melting aluminum to allow a layer of melted aluminum to flow in an area over one surface of an AlN plate under an inactive gas atmosphere after which the layer of melted aluminum is solidified to form an Al plate bonded to the AlN plate. The heat exchanger includes the Al—AlN composite material forming at least part of a cooling medium flow passage with the AlN plate held in thermal contact with a heating body. The manufacturing method comprises melting aluminum to allow a layer of melted aluminum to flow in an area over one surface of an AlN plate under inactive gas atmosphere, and solidifying the layer of melted aluminum to form the Al plate bonded to the AlN plate.11-13-2008
20080302513Method and Device for Tempering a Substrate - The invention concerns a device and a method for tempering a substrate (S), as well as a method for making such a device, which comprises the following elements: a first subelements (12-11-2008
20080308260COLD PLATE STABILITY - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.12-18-2008
20080236799PUMP EXPANSION VESSEL - A pump comprising: a housing defining therein an inner chamber of fixed volume; an inlet through the housing providing communication to the inner chamber; an outlet through the housing providing communication to the inner chamber; a pumping mechanism in the inner chamber; and a resiliently, compressible member accommodating a portion of the fixed volume of the inner chamber.10-02-2008
20080210409Liquid Cooling System Fan Assembly - A fan assembly configured for use with a radiator assembly in a cooling system. The fan assembly comprises a plurality of fan blades mounted about a central hub, and an annular ring member circumferentially coupled to the radially outboard end of each fan blade, coaxial with the central hub. The annular ring has an axial dimension equal to or exceeding the axial depth of each fan blade, whereby a radially outward flow of air from a high pressure region on one side of the fan blades is blocked from exiting the fan assembly radially during operation, and from flowing to a low pressure region on the opposite side of the fan blades. Axial air flow, driven by the rotational movement and configuration of the fan blades, is unimpeded by the annular ring member.09-04-2008
20080251239HEAT SINK - A heat sink, wherein a plurality of heat radiation fins are mounted on a base plate to which an electron device is attached in a heat transmittable manner. The heat radiation fins are erected vertically and in parallel with each other on the reverse face of the base plate to which the electron device is contacted, and extended laterally from the base plate. The heat sink of the invention comprises a heat pipe for transporting heat between the extended portion of the heat radiation fins and the base plate.10-16-2008
20080277103PIEZOELECTRIC GAS EJECTING DEVICE - A piezoelectric gas jet generator includes a piezoelectric vibrator and upper and lower volume-varying chambers formed above and below the piezoelectric vibrator. In order to effectively use the movement of air supplied with the vibration of the piezoelectric vibrator, plural upper supply pipes and lower supply pipes communicating with the upper and lower volume-varying chambers and protruding from an upper housing and a lower housing are made to protrude in a direction parallel to the plane of the piezoelectric vibrator so as to be parallel to each other. Here, the upper supply pipes and the lower supply pipes are located at different planar positions.11-13-2008
20090050301ELECTRONIC DEVICE COOLING APPARATUS - A liquid storage tank 02-26-2009
20090126910APPARATUS AND METHOD FOR FACILITATING SERVICING OF A LIQUID-COOLED ELECTRONICS RACK - Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.05-21-2009
20090084529COOLER MODULE - A horizontal cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, and heat pipes each having a first extension arm respectively tightly inserted through the radiation fins and a second extension arm respectively fitted into the bottom open grooves of the base block with a respective flat wall portion of the second extension arm exposed to the outside of the base block and kept in flush with the bottom wall of the base block for direct contact with an external electronic chip to transfer heat energy from the electronic chip to the heat sink for quick dissipation.04-02-2009
20090084528METHOD FOR MANUFACTURING HEAT DISSIPATOR HAVING HEAT PIPES AND PRODUCT OF THE SAME - A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.04-02-2009
20100139896LIQUID COOLED STATOR TERMINAL BLOCK FOR AN ELECTRIC MACHINE - An electric machine including a housing having an outer surface and an inner surface that defines an interior portion. The housing includes a connection zone. A fluid circuit passes, at least in part, through the housing. The fluid circuit includes an inlet portion and an outlet portion. A stator assembly is arranged within the interior portion of the housing. The stator assembly includes at least one connector lead, and a terminal block extending through the housing. The terminal block includes a non-electrically conductive member that is sealed against the housing. The non-electrically conductive member includes a fluid cavity. At least one electrically conductive member is covered, at least in part, by the non-electrically conductive member. The fluid cavity guides a fluid along a portion of the at least one electrically conductive member to absorb heat.06-10-2010
20090050300MINIATURIZED LIQUID COOLING DEVICE - A miniaturized liquid cooling device (02-26-2009
20090065182COOLING DEVICE - There is provided a cooling device which includes a plurality of cooling modules 03-12-2009
20090101318Electrical connector assembly with heat dissipating device - An electrical connector with a heat dissipating device adapted to physically in contact with an electrical package disposed on a socket connector comprises a load plate having a substantially rectangular configuration defining a central opening having a first length and a first width and a heat plate having longitudinal sides and traversal ends. A heat plate has a heat pipe attached thereon and arranged such that the heat plate is disposed under the load plate, while the heat pipe is arranged above the load plate when rotated.04-23-2009
20090101316HEAT DISSIPATING ASSEMBLY WITH REDUCED THERMAL GRADIENT - A device to dissipate thermal energy generated by a heat generating component. The device includes a base plate and a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby. The device also includes a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space and an outlet pipe for exhausting the cooling fluid from the space. The inlet pipe has a flow exit positioned over the fins so that the cooling fluid flows from the top portions of the fins toward the base plate.04-23-2009
20080314565METHOD AND APPARATUS FOR CHIP COOLING - In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of a system for cooling a heat-generating device, such as a semiconductor chip, includes a vaporization chamber for at least partially vaporizing a stream of liquid in a stream of a gas to produce a mixture of gas, vapor and liquid and a heat sink coupled to the vaporization chamber for transferring heat from the heat-generating device to the mixture.12-25-2008
20100147494WATER-COOLING HEAT DISSIPATION SYSTEM - A water-cooling heat dissipation system for dissipating a heat-generating device includes a water pump, a water-cooling apparatus, and a cooling apparatus. The water pump is configured for transferring coolant via a first pipe. The water-cooling apparatus is capable of mounted on the heat-generating device and receiving the coolant from the water pump via the first pipe to cool the heat-generating device, and then outputting heat absorbed coolant heated the heat from the heat-generating device. The cooling apparatus is configured for receiving the heat absorbed coolant from the water-cooling apparatus via a second pipe, and removing heat from the heat absorbed coolant, and then transferring the coolant to the water pump via a third pipe.06-17-2010
20090090490COOLER - A cooler includes a substrate for disposing a semiconductor device thereon, a plate member fixed to a back surface of the substrate, a primary pipe, and a secondary pipe. A space sandwiched between the substrate and the primary pipe defines a first flow path for a coolant. The primary pipe and the secondary pipe configure a second flow path for a coolant. The secondary pipe is positioned to jet a coolant toward a region opposite to that having the semiconductor device disposed therein. The second flow path is separated from the first flow path.04-09-2009
20120103576INTEGRATED LIQUID COOLING SYSTEM - A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.05-03-2012
20090071637HEAT SINK ASSEMBLY - A heat sink assembly in accordance with the present invention increases heat dissipation area, improves heat dissipation efficiency and comprises a base, a core pipe, an outer pipe, a top cover and a working fluid. The base has a top surface. The core pipe is mounted securely on and protrudes from the top surface with an air-tight fit and comprises an inner surface, an outer surface, a wick, multiple holes and a top. The wick is formed on the inner and outer surface. The outer pipe is mounted securely on and protrudes from the base concentrically around the core pipe and comprises an inner surface, an outer surface, a wick and a top. The wick is formed on the inner surface. The holes are formed around the core pipe away from the base. The top cover closes the top of the core pipe and the top of the outer pipe.03-19-2009
20100243216LIQUID-COOLING DEVICE - A liquid-cooling device includes a heat exchanger defining a cavity therein and a liquid-guiding component received in the cavity. The liquid-guiding component includes a body and a fixing portion extending from the body and fixed to the heat exchanger. A first liquid passage is defined through the body and a second liquid passage is formed between the body and an inner sidewall of the heat exchanger surrounding the cavity. The first liquid passage is in fluid communication with the second liquid passage via a bottom of the cavity. An outlet and an inlet are formed at an end of the liquid-guiding component and in fluid communication with the first and second liquid passages. Liquid flows in the cavity of the heat exchanger via the first liquid passage and has a sufficient contact with the inner sidewall of the heat exchanger.09-30-2010
20100000720LIQUID COOLING HEAT DISSIPATING DEVICE WITH HEAT TUBES GATHERING HEAT SOURCES - A liquid cooling heat dissipating device with heat tubes gathering heat sources includes a cold plate being disposed on the heat sources and a or a plurality of heat tubes disposed between the heat sources and the cold plate to contact with the heat sources completely, and an end of the respective heat tube is fixedly attached to the cold plate, respectively. The respective heat tube is sealed with a capillary material and a vapor-liquid working median contained inside. The respective heat tube contacts with the heat sources at different spots to gather the heat for being cooled with the cold plate simply.01-07-2010
20080230209SPOT COOLER FOR HEAT GENERATING ELECTRONIC COMPONENTS - A cooler for heat generating electronic components comprising a heat exchange plate configured for heat exchange communication with one or more heat generating electronic components includes a fin stack having a plurality of heat exchange fins and one or more heat pipes and/or thermosyphon tubes in heat exchange communication with the heat exchange plate and said plurality of fins, and a fan for directing air to and/or from the fins, each of said fins having a centered interior circular opening or hole, the fins stacked with the holes coaxially aligned and substantially centered in the fin stack and defining an elongated cavity having a first open end adjacent to the heat exchange plate and a second open end adjacent to the fan, and an elongated insert centrally positioned lengthwise along the cylindrical cavity and having a exterior surface of revolution smaller than the diameter of the cavity and defining an airflow channel between the insert and the fin openings and wherein the exterior surface of revolution of the insert is shaped, tapered or slanted and/or the interior openings of the fins are of the same or different diameters to provide an airflow channel width increasing from the fist end to the second end.09-25-2008
20090071636LIQUID COOLING CIRCUITS AND METHOD FOR ELECTRICAL CABINETS, DRAWERS, BAYS, MODULES, CIRCUIT BOARDS AND ELECTRICAL COMPONENTS USING QUICK-DISCONNECT FITTINGS FOR INTERFACING TO A HOST COOLING SOURCE - A system and method for cooling heat generating components including an electronics cooling circuit loop having a liquid heat exchanger separable from a main liquid cooling circuit manifold by quick-disconnect fittings. This supports the use of different liquids in the electronics subsystem cooling circuit loop and in the main liquid manifold of the master cooling circuit. Also included are two phase loops and an optional compressor.03-19-2009
20110127014GLOBALLY COOLED COMPUTER SYSTEM - A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.06-02-2011
20110030927COOLING DEVICE - In a cooling device that includes a cooling roller that comprises a hollow tubular member and a cooling medium transport unit for transporting a cooling liquid to the inside of the cooling roller and contacts a sheet-like member to cool down the paper, a turbulence generating unit that generates turbulence in a cooling liquid is disposed near an inner wall of the outer tube.02-10-2011
20110030926Cooling systems using coatings with surface energy gradient - A cooling system comprising a plurality of coolant channels comprising a fluid-impervious surface comprising a base surface, at least one distinct region of the base surface covered by a mixed monolayer, the mixed monolayer comprising a species having a functional group M02-10-2011
20100032140LIQUID COOLED RACK WITH OPTIMIZED LIQUID FLOW PATH DRIVEN BY ELECTRONIC COOLING DEMAND - A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, at least one adjustable valve connected to the liquid cooling line, at least one heat exchanger connected to the at least one adjustable valve, a control module connected to the at least one valve, and a feedback module connected to the control module and including a sensor configured to measure a feedback control signal. The control module is configured to adjust the at least one adjustable valve and a flow rate of liquid through the liquid cooling line based on a feedback control signal measured by the sensor.02-11-2010
20090032229METHODS AND SYSTEMS FOR COOLING INVERTERS FOR VEHICLES - A method for cooling an inverter of a vehicle system includes the steps of providing a flow of cooling fluid to the inverter, determining a value of a variable that is influenced at least in part by the flow of cooling fluid to the inverter, and regulating the flow of cooling fluid to the inverter based at least in part on the value of the variable.02-05-2009
20110209856COOLING APPARATUS HAVING LOW PROFILE EXTRUSION AND METHOD OF MANUFACTURE THEREFOR - A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member. Cooling of the heat transfer fluid within the condenser section is enhanced by the second plurality of low profile extrusion members. The heat transfer fluid is returned to the evaporator section after cooling.09-01-2011
20090218078VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.09-03-2009
20100065257REFRIGERANT COOLING SYSTEM FOR AN ELECTRONIC APPARATUS AND THE METHOD THEREOF - A refrigerant cooling system for an electronic apparatus and the method thereof are provided. An enclosure is set with a fan on one side thereof; the enclosure is set with an opening on one side thereof. The enclosure is set with an electronic substrate inside with other electronic devices. The electronic substrate is set with a middle-temperature evaporator with an input end and an output end, in which the refrigerant is filled into the input end. The input end is set with a throttling device. The output end is set with a throttling device connecting to a low-temperature evaporator. The low-temperature evaporator is set with a condensed water drain-pan at a bottom side thereof and the condensation water drain-pan is connected to a drain pipe. The pipe of the output end of low-temperature evaporator is connected to a receiver or a compressor of a refrigerating system for a compression cycle.03-18-2010
20110247788SYSTEMS AND METHODS OF USING SUBSEA FRAMES AS A HEAT EXCHANGER IN SUBSEA BOOSTING SYSTEMS - Systems and methods of cooling a motor of an electrical submersible pump (ESP) assembly employed in an electrical submersible subsea booster pumping system, are provided. A supporting frame structure such as an ESP mounting skid or top end assembly of a caisson having structural members exposed to environmental seawater, is modified or designed to include fluid conduits within the structural members to establish lubricant pathways for lubricant to flow. A heated/hot lubricant line connects between a supporting structure lubricant inlet port and an ESP motor lubricant outlet port. A cooled lubricant line connects between a supporting structure lubricant outlet port and an ESP motor lubricant inlet port. A pump or other fluid moving device circulates lubricant from the ESP motor to the lubricant pathways within the supporting frame structure, whereby the seawater cools the lubricant contained therein, which is then circulated back into the motor to assisting cooling the motor.10-13-2011
20100032142LIQUID COOLED RACK WITH OPTIMIZED AIR FLOW RATE AND LIQUID COOLANT FLOW - A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, a pump connected to the liquid cooling line, at least one heat exchanger connected to the liquid cooling line, a fan module, a control module connected to the fan module and the pump, a feedback module connected to the control module and comprising a sensor configured to measure a feedback control signal, where the control module is configured to adjust an air flow rate through the fan module or a liquid coolant flow rate through the pump based on the feedback control signal.02-11-2010
20090126909SYSTEM AND METHOD FOR FACILITATING COOLING OF A LIQUID-COOLED ELECTRONICS RACK - Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof.05-21-2009
20080314566Ventilation method and ventilation system for a magnetic resonance imaging system - This invention discloses a ventilation system for an MRI system, including: a hydrodynamic rotating device, a primary coolant water pipe, a secondary coolant water pipe, a fan and air outlet; the water outlet of the primary coolant water pipe is connected to the water inlet of the hydrodynamic rotating device, while the water inlet of the secondary coolant water pipe is connected to the water outlet of the hydrodynamic rotating device; with the impetus provided by the coolant water from the primary coolant water pipe, the hydrodynamic rotating device drives the fan near the air outlet to rotate, discharging the coolant water into the secondary coolant water pipe. Furthermore, the invention discloses a ventilation method for an MRI system. Ventilation efficiency is improved significantly with the system and method provided by this invention.12-25-2008
20080196867Cooling Fluid Flow Regulation Distribution System and Method - The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.08-21-2008
20110108247COOLING APPARATUS FOR SEMICONDUCTOR ELEMENT - A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.05-12-2011
20110132580DEVICE FOR COOLING A VEHICLE BATTERY - A device for cooling a vehicle battery is provided that includes a plurality of electrical storage elements, and a cooling element having ducts for a fluid to flow through, wherein the electrical storage elements are in thermal contact with the cooling elements and heat can be transmitted from the storage elements to the fluid, and wherein the cooling element which comprises the ducts is embodied as at least one extruded profile.06-09-2011
20110132581Temperature Control For An Information Handling System Rack - A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.06-09-2011
20100294466OUTDOOR UNIT - In an outdoor unit having a housing containing a heat exchange chamber and a machine chamber vertically partitioned by a partition plate, an electrical component box includes a main body portion disposed in the machine chamber and having a first electrical component unit, and a protrusion portion protruding from the machine chamber into the heat exchange chamber and having a second electrical component unit. The main body portion and the protrusion portion are joined to form an air flowing path for sucking cooling air from the back surface side of the machine chamber, branching the cooling air into first cooling air directly flowing to the sink tank and second cooling air passing over electrical parts of the first electrical component unit and then converging with the first cooling air at the entrance of the sink tank.11-25-2010
20100116468TEMPERATURE ADJUSTMENT MECHANISM, METHOD FOR CONTROLLING TEMPERATURE ADJUSTMENT MECHANISM, AND VEHICLE - A temperature adjustment mechanism has: a case containing a power source and a first heat transfer medium for cooling the power source and integrated with or contacting a heat transfer portion; and a drive device for delivering the first heat transfer medium between the inside and the outside of the case. The drive device delivers the first heat transfer medium to the outside of the case to establish a first state in which a layer of a second heat transfer medium is created in a region of the case on the heat transfer portion side of the power source, and the drive device delivers the first heat transfer medium to the inside of the case to establish a second state in which at least a portion of the region of the case is filled with the first heat transfer medium.05-13-2010
20100078156System and method for cooling an electrical device in a closed air volume - A method for cooling is disclosed, the method including but not limited to supplying a first portion of a closed volume of air to a first electrical device; discharging the first portion of the closed volume of air from the first motor into a first heat exchanger; discharging the first portion of the closed volume of air from the first heat exchanger into the closed volume of air; supplying a second portion of the closed volume of air to a second electrical device; discharging the second portion of the closed volume of air from the second motor into a second heat exchanger; and discharging the second portion of the closed volume of air from the second heat exchanger into the closed volume of air. A system is provided for performing the method.04-01-2010
20090308578ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY - An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.12-17-2009
20100025019HEAT EXCHANGER FOR COOLING SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME - Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels. Alternatively, the internal pressure of the coolant supplying layer may be maintained lower than that of the microchannel, so that once a vapor bubble emerges the vapor bubble is drawn to the lower pressure side.02-04-2010
20100025018HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a heat pipe and a plurality of fins. Each fin includes a main body and two edges bent from the main body. The edges of a rear fin contact a front adjacent fin. The main body defines a through hole receiving the heat pipe and a flange extends outwardly from a periphery of the through hole. A portion of the flange along a circumferential direction is shorter than the edge. A gap between the portion of the flange of the rear fin and the front adjacent fin receives excess solder forced out between the flanges of the fins and the heat pipe.02-04-2010
20090173476SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS - A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be recirculated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.07-09-2009
20090173475HEAT PIPE STRUCTURE AND FLATTENED HEAT PIPE STRUCTURE - A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.07-09-2009
20120145360LIQUID COOLING SYSTEM - A heat conductive member is connected to a heat-generating electronic component. A liquid tank defines a liquid injection hole. A clip assembly is connected to the liquid tank. When pressed against the clip assembly, the liquid tank is fastened by the clip assembly and retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. The liquid tank includes a tube portion and a rotation wheel. The tube portion includes a hollow tube and a positioning portion formed along a sidewall at a first end of the tube. The rotation wheel is fixed on the positioning portion and adjacent to the sidewall. The blades of the rotation wheel oppose the hollow of the tube. A second end of the tube is connected to the conduits.06-14-2012
20110073286WATER-COOLED HEAT DISSIPATION SYSTEM AND WATER TANK THEREOF - A water tank includes a box, an air valve body, a valve core, a cap, and an elastic element. The box defines an accommodating space and a vent communicating with the accommodating space. The air valve body is extended out from the box and adjacent to the vent. The valve core is mounted to the valve body to airproof the vent, and comprises a first end inserted into the accommodating space through the vent and a second end opposite to the first end. The elastic element is arranged between the cap and the valve core. The valve core will open the vent to deform the elastic member and allow heated air in the accommodating space to leak out of the accommodating space through the vent, in response to an air pressure in the box is greater a reference air pressure.03-31-2011
20110315354MULTIPLE LIQUID LOOP COOLING FOR ELECTRONICS - The present invention relates to liquid cooling systems and more particularly to a liquid cooling system for an electrical system on an air-cooled platform. In one embodiment of the invention, a liquid-cooled system for a platform with air cooling includes an electrical system comprising first and second electrical components; a cooling unit comprising an air flow path, a first heat exchanger in the air flow path, and a second heat exchanger in the air flow path downstream of the first heat exchanger; a first liquid loop passing through the first heat exchanger and the first electrical component; and a second liquid loop passing through the second heat exchanger and the second electrical component. The first liquid loop is substantially thermally isolated from the second liquid loop.12-29-2011
20120205077HVAC System with Multipurpose Cabinet for Auxiliary Heat Transfer Components - An HVAC system having an airflow path, a primary heat exchanger disposed along the airflow path, wherein the airflow path at least partially passes through the primary heat exchanger, and a multipurpose cabinet selectively configurable between at least a first configuration for housing a first type of auxiliary heat transfer component and a second configuration for housing a second type of auxiliary heat transfer component, wherein the airflow path at least partially passes through the multipurpose cabinet.08-16-2012
20090008066HEAT DISSIPATION DEVICE - A heat dissipation device includes a cooling fan (01-08-2009
20120061059COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An apparatus for cooling a stacked die package comprises a first die provided above a substrate; a second die above the first die; a cooling fluid in fluid communication with the first die and the second die, the cooling fluid for absorbing thermal energy from the first and the second die; a housing containing the first and second dies, the housing sealing the first and second dies from an environment, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another; a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit allowing the cooling liquid to circulate from the first opening to the second opening; a first temperature sensor being arranged to provide an output that is dependent on a local temperature at the first opening; and a second temperature sensor being arranged to provide an output that is dependent on a local temperature at the second opening, wherein the outputs of the first and second temperature sensors relative to each other are indicative of a level of the cooling fluid.03-15-2012
20110088879Temperature Control System for Printing Machines Having Several Temperature Levels - An arrangement on a printing machine, includes at least one low-temperature (NT), medium-temperature (MT) and high-temperature (HT) temperature control point, which are arranged in a low-temperature (NT), a medium-temperature (MT), and at least one high-temperature (HT) zone of a printing machine and are designed such that the NT zone can be controlled to a low temperature by the NT temperature control point, the MT zone to a medium temperature by the MT temperature control point, and the HT zone to a high temperature by the HT temperature control point, the low temperature being lower than the medium temperature, and the medium temperature being lower than the high temperature. The arrangement includes a low-temperature (NT) temperature control device and a high-temperature (HT) temperature control device. The temperature at the MT temperature control point can be controlled by both the NT and the HT temperature control device.04-21-2011
20090133857Cooling system for a projector - A cooling system for a projector for dissipating the heat output by a light source and/or optical components or electric and electronic components through which current flows in a projector housing with a lamp housing and a base tray is provided. The cooling system comprising a first cooling device in which a first convection flow is guided through the interior space of the base tray and the lamp housing and around which a second convection flow circulates which circulates around the lamp housing at least partially in the circumferential direction, and a second cooling device for a cooling air flow which is directed substantially perpendicularly to the second convection flow and runs parallel to the optical axis of the projector.05-28-2009
20110100612LIQUID COOLING DEVICE - A liquid cooling device includes a heat-dissipating member, a driving member and a heat-absorbing member connected together to form a heat transfer loop. A coolant is filled in the heat transfer loop. The heat-absorbing member defines therein a receiving chamber. A heat sink and a heat pipe are received in the receiving chamber. The heat pipe thermally connects the heat sink to a heat-absorbing plate of the heat-absorbing member. The heat-absorbing plate is used for contacting with a heat-generating component. The coolant is driven by the driving member to circulate between the heat-absorbing member. Heat generated by the heat-generating component is absorbed by the heat-absorbing plate and transferred to the heat sink via the heat pipe. The heat sink releases the heat to the coolant. The coolant takes the heat from the heat-absorbing member to the heat-dissipating member for dissipating.05-05-2011
20120125573HEAT STORAGE BY PHASE-CHANGE MATERIAL - Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.05-24-2012
20120160461WATER FLOW ADJUSTING MEMBER AND WATER-COOLING SYSYTEM WITH THE SAME - A water-cooling system includes a number of flexible tubes, a heat sink for cooling water, a container, an adjusting member, and a cooling member for dissipating heat. The container includes an inlet and an outlet. The inlet is connected to the heat sink through one of the tubes for receiving the cooled water cooled by the heat sink. The adjusting member is connected to the outlet for adjusting flow of cooled water from the container. The cooling member includes a first end and a second end opposite to the first end. The first end of the cooling member is connected to the adjusting member, and the second end of the cooling member is connected to the heat sink by a corresponding one of the flexible tubes.06-28-2012
20100206523INTERNAL COOLING SYSTEM FOR A RADOME - According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.08-19-2010
20110180239COOLING STRUCTURE FOR STATOR - A cooling structure for a stator configured with a cooling medium distributing member formed with a plurality of discharge openings, and a distributing path, wherein the distributing path has a plurality of chambers separated by a partition wall, and an inter-chamber communication passage that is formed in the partition wall and communicates between the adjacent chambers. The cooling medium distributing member includes at least one cooling medium distributing chamber that divides the distributing path to a plurality of inter-chamber communication passages, and also includes a plurality of discharge chambers. The plurality of inter-chamber communication passages formed in the partition wall are formed with a ratio of an opening width between the different inter-chamber communication passages set according to a ratio of a sum of opening cross-sectional areas of all of the cooling medium discharge openings which are located downstream of each of the inter-chamber communication passages.07-28-2011
20100051243METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING FLOW SENSORS - An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.03-04-2010
20100051242METHOD AND APPARATUS FOR REDUCING ACOUSTIC NOISE IN A SYNTHETIC JET - A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity.03-04-2010
20120312510Automatic In Situ Coolant Flow Control in LFT Heat Exchanger - An embodiment of the invention is directed to coolant flow control apparatus, in association with a liquid flow through heat exchanger situated to cool one or more electronic or other device. The apparatus comprises a first input channel for carrying liquid coolant to a first input of the heat exchanger, and further comprises a flow control device positioned along a flow path that includes the first input channel. The flow control device is provided with a gating element supported for selected movement across the flow path, in order to selectively vary the amount of coolant moving through the flow path. The apparatus further include an actuator located in the flow control device that comprises a metal component which is directly tied to the gating element, wherein the metal component changes its shape in response to specified changes in coolant temperature, and a given change in the shape of the metal component acts to selectively move the gating element with respect to the flow path.12-13-2012
20090020272ELECTRONIC APPARATUS - In one embodiment, an electronic apparatus is provided. The electronic apparatus is equipped with an electronic device and a cooling device for cooling the electronic device. A heat pipe is provided with a wick and an operating liquid. The electronic device is disposed inside the heat pipe, and a heat spreader for thermally connecting the electronic device and the wick is provided inside the heat pipe. The electronic device further has a connector for connecting the electronic device to an outside of the heat pipe.01-22-2009
20090020271APPARATUS AND METHOD FOR THERMAL MANAGEMENT USING VAPOR CHAMBER - An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the cantilevers and the islands. Heat from the islands vaporizes the fluid filling the spaces between the cantilevers and the islands to transfer the heat away from the islands while driving the cantilevers into oscillation. The apparatus may also include a casing configured to surround the islands and the fluidic network to create a vapor chamber, where the vapor chamber is configured to retain the vaporized fluid. The islands and the fluidic network could be formed in a single substrate, or the islands could be separate and attached together by a binder located within the channels of the fluidic network.01-22-2009
20100326636COOLING SYSTEM FOR A COMPUTER SYSTEM - The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.12-30-2010
20120261098HEAT EXCHANGER - A heat exchanger is provided and includes a housing disposed proximate to a heat source, the housing having sidewalls forming an enclosure, a baffle defining in the enclosure a ventilation circuit thermally communicative with the heat source, and central walls defining a main channel bisecting the ventilation circuit along which cooling media flows and a tube extending through a bisected portion of the ventilation circuit and fluidly coupled to the main channel and a housing exterior to direct the cooling media from the main channel, through the bisected portion of the ventilation circuit and to the housing exterior.10-18-2012
20110024091COOLING APPARATUS FOR SEMICONDUCTOR COMPONENT - Disclosed is a cooling apparatus for a semiconductor component having a coolant inlet flow path on a coolant flow path connecting a coolant inlet and a coolant outlet, the coolant inlet flow path having a diffuser shape, in which its cross-sectional area increases from a coolant inlet to a portion where cooling fins start to appear. In the cooling apparatus, the coolant inlet flow path meets the following equation:02-03-2011
20120298339LIQUID COOLING SYSTEM AND ELECTRONIC DEVICE INCLUDING THE SAME - Disclosed is a liquid cooling system mounted on an electronic device. The liquid cooling system includes flow path (11-29-2012
20080230210Thermosiphon boiler plate - A thermosiphon boiler plate assembly (09-25-2008
20080223557LIQUID COOLING SYSTEM OF AN ELECTRIC MACHINE - Disclosed is a liquid cooling system for an electric machine including a frame heat conductively attachable to a stator of an electric machine. The liquid cooling system further includes a cover mechanically attached to the frame and fluidly sealed to the frame, the cover and frame defining a cavity therebetween. The cover includes at least one protrusion extending substantially a distance between the cover and the frame. A method for constructing a liquid is also provided. The method includes forming at least one protrusion in the cover and structurally affixing the cover to the frame. The cover is fluidly sealed to the frame.09-18-2008
20080196870LIQUID SUBMERSION COOLING SYSTEM - A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.08-21-2008
20080196869HIGH CONDUCTIVITY CERAMIC FOAM COLD PLATE - A cold plate and method for cooling using the cold plate are disclosed. The cold plate includes a housing having hyperporous, microchannel ceramic foam strips disposed therewithin. A plurality of plugs formed from a high thermal conductivity material are disposed into the ceramic foam strips. Heat is transferred in an extremely efficient manner by leveraging the high thermal conductivity of the plugs to transfer the energy deep into a high internal surface area ceramic foam, which in turn transfers the heat to a coolant via convection. Channels between the foam strips form coolant inlet and outlet plenums, which results in minimal coolant pressure drop through the cold plate. In one example, an exemplary cold plate may provide cooling to one or two printed circuit boards. In another example, a cold plate may be disposed within a heat exchanger housing to provide cooling to a fluid.08-21-2008
20080196868CASE FOR A LIQUID SUBMERSION COOLED ELECTRONIC DEVICE - A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. A removable lid closes the top of the interior space. The lid forms a liquid-tight seal with the plurality of walls, and the lid includes a sealed electrical connector fixed thereto that is configured to attach to the motherboard disposed in the interior space and to provide electrical connection between the motherboard and an exterior of the case. The case can include a drain valve for draining liquid from the case. Further, the lid can have an opening for introducing liquid into the interior space, and a handle to facilitate lifting of the lid along with the motherboard connected to the lid.08-21-2008
20100307723DEVICE FOR COOLING A HEAT SOURCE OF A MOTOR VEHICLE - The invention relates to a device for cooling a heat source of a motor vehicle, comprising a cooling body (12-09-2010
20120273170ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes an enclosure for receiving a water-cooled heat exchanger and a water collecting device. The water collecting device is received in the enclosure and includes a water collecting member and a guiding pipe attached to the water collecting member. The water collecting member includes a tray, a first guiding portion located in the tray and a second guiding portion adjacent to the first guiding portion. The first guiding portion includes a first slanted edge, and the second guiding portion includes a second slanted edge. The guiding pipe is located between the first slanted edge and the second slanted edge, and the first slanted edge and the second slanted edge are together slanted towards the guiding pipe, for guiding dew generated by the water-cooled heat exchanger to flow into the guiding pipe.11-01-2012
20090266523SCALEABLE PARALLEL FLOW MICRO-CHANNEL HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME - Provided is a heat exchanger, heat sink or coldwall having a machined manifold for receiving a plurality of individual, modular micro-channel heat exchanger elements. The manifold further includes a parallel flow network or flow distribution network for distributing a cooling fluid uniformly to all micro-channel heat exchanger elements. Each micro-channel heat exchanger element is individually manufactured and tested prior to integration with the manifold. The design of the micro-channel heat exchanger elements may include a straight fin, a high density fin, lanced offset fin, and perforated offset layers fin configurations.10-29-2009
20110303394LIQUID COOLING SYSTEM FOR A SERVER - A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.12-15-2011
20110303393THERMAL DISTRIBUTION SYSTEMS AND METHODS - Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portion of an electronic enclosure. A fluid mover having a first inlet can be adapted to draw a first inlet fluid from inside the void.12-15-2011
20090277617Liquid Cooling System with Automatic Pump Speed Control - A system comprising a fan tachometer module, a conversion module, and a pump tachometer module. The fan tachometer module is adapted to measure a speed of a cooling fan. The conversion module is in communication with the fan tachometer module, and is adapted to convert the speed of the cooling fan to a control voltage based on a predetermined ratio between the speed of the cooling fan and a speed of a cooling pump. The pump tachometer module is in communication with the conversion module, and is adapted to control the speed of the cooling pump based on the control voltage.11-12-2009
20110315355IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK - Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.12-29-2011
20130192798COOLED ELECTRIC ASSEMBLY - A cooled electric assembly includes a box that defines an interior space. An electrical conductor is located within the interior space. A cooling tube is attached to the box. A thermal conductor is located at least partially within the interior space and is in thermal contact with the electrical conductor and in thermal contact with the cooling tube.08-01-2013
20120024502ENCLOSED-AISLE DATA CENTER COOLING SYSTEM - An aspect of the disclosure provides a method comprising: providing a first portion of an exhaust gas from racks of computer devices in an enclosed aisle arrangement for cooling in an air cooling device; and diverting a second portion of the exhaust gas from the racks of computer devices to an underfloor plenum for mixing with a cooled gas provided by the air cooling device, forming a mixed cooling gas in the underfloor plenum; and providing the mixed cooling gas to the racks of computer devices.02-02-2012

Patent applications in class Cooling electrical device