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Utilizing capillary attraction

Subclass of:

165 - Heat exchange

165104110 - INTERMEDIATE FLUENT HEAT EXCHANGE MATERIAL RECEIVING AND DISCHARGING HEAT

165104190 - Liquid fluent heat exchange material

165104210 - Utilizing change of state

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Entries
DocumentTitleDate
20130025829VAPOR CHAMBER HAVING HEATED PROTRUSION - A vapor chamber is configured to conduct heat generated by a heat-generating element and includes a bottom plate, a first wick structure, a second wick structure, a cover plate and a working fluid filled between the cover plate and the bottom plate. One side of the bottom plate has a heated protrusion in thermal contact with the heat-generating element, and the other side is formed with an accommodating trough corresponding to the heated protrusion. The first wick structure is provided in the accommodating trough. The second wick structure is disposed on the bottom plate and provided with an opening and a plurality of airflow channels in communication with the opening. The cover plate tightly covers the bottom plate. The supporting posts are sandwiched between the cover plate and the first wick structure. By this arrangement, the mounting and heat-conducting of the heat-generating element can be achieved.01-31-2013
20130025828MOTOR WITH COOLED ROTOR - A fan includes an air movement implement including a blade and a motor that drives the air movement implement. The motor includes a rotor that includes an internal diameter heat exchanger and a heat pipe having a first end and a second end, the first end in thermal contact with the internal diameter heat exchanger and the second end in thermal contact with the blade.01-31-2013
20130025830HEAT SINK ASSEMBLY OF FIN MODULE AND HEAT PIPES - A heat sink assembly includes a fin module, heat pipes, and a pair of side plates. The fin module is composed of a plurality of fins and has a flat side formed with a trough and two recesses. Each of the heat pipes has an evaporation section. The evaporation sections are parallelly accommodated in the trough and in contact with each other. The side plates are separately fixed in the recesses and protrude from the flat side. The evaporation sections are formed with a flat surface coplanar with the side plates. By this arrangement, the thermal contact area between the heat pipes and a heat source is increased to thereby improve the heat-dissipating efficiency of the heat sink assembly.01-31-2013
20130043007CONDENSER WITH CAPILLARY COOLING DEVICE - A condenser with capillarity cooling devices provides a condenser that has a plurality of cooling fins with a wick structure and a plurality of capillary water absorption layers of which the lower section is submerged in the water of a water reservoir provided underneath. Through capillarity and the characteristic of the capillary water absorption layers, water will be brought upward to moisturize the fins. When the water evaporates, a great amount of heat will be extracted from the fins, so as to increase the thermal efficiency of the condenser. Further, a pre-wetting water pipe is included, so that when an air conditioner is switched on and the condenser is started, the pre-wetting water pipe moisturizes the capillary water absorption layers immediately, and such moisture extends to the overall wick structures of fins. This will make evaporation take place instantly and thermal efficiency of condenser is increased.02-21-2013
20130043006HEAT DISSPATION DEVICE - A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.02-21-2013
20130043005HEAT DISSIPATION ELEMENT WITH MOUNTING STRUCTURE - A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage.02-21-2013
20100132925Partable Thermal Heat Pipe - A heat pipe for conducting heat away from an electronic device attached to a removable electronic module includes two self-aligning sections. A source section is attached to the removable electronic module and a target section passes through and is retained by a fixed member. One end of the source section is in thermal contact with a heat source and the other end includes a self aligning female thermal interface. One end of the target section includes a self aligning male thermal interface and the other end includes a heat sink. The female end of the source section and the male end of the target section are moved into contact with each other to form a thermal connection that permits heat from the heat source to be transferred to the heat sink.06-03-2010
20100018678Vapor Chamber with Boiling-Enhanced Multi-Wick Structure - A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.01-28-2010
20090194259VAPOR CHAMBER AND SUPPORTING STRUCTURE THEREOF - In a vapor chamber and a supporting structure thereof, the vapor chamber includes a casing, in which a capillary wick and a supporting structure are accommodated. The supporting structure includes a plate, on which a plurality of channels are disposed at equal intervals and arranged by corresponding to each other. A corrugated piece is formed in each channel and upper and lower sides of the corrugated piece are respectively abutted against the capillary wick, making the capillary wick and inner wall faces of the casing tightly contacted to each other. In addition, a vapor chamber having this kind of supporting structure is provided. Thereby, it is possible to increase the phase-changing amount of the vapor chamber, accelerate the heat-transferring speed, and enhance the heat-conducting performance further.08-06-2009
20110192576VAPOR CHAMBER AND EDGE-SEALING STRUCTURE THEREOF - A vapor chamber includes a first cover and a second cover covering on the first cover. The first cover has its periphery bent to form a first folded edge, and the second cover has its periphery bent to form a second folded edge. The second folded edge is superposed on the first folded edge. The first folded edge is bent to cover the second folded edge. A wick structure is arranged inside the first cover and the second cover. A working fluid is filled between the first cover and the second cover. By this structure, the tightness of the sealing edges of the vapor chamber is enhanced. The production yield of the vapor chamber is increased and the production cost is reduced.08-11-2011
20110192575Passive Device with Micro Capillary Pumped Fluid Loop - Each loop of the device includes an evaporator and a condenser connected by an outer tube in a portion of which extends a thermally insulating sleeve having one end that can lead into the condenser and another end that surrounds a first portion (08-11-2011
20090211735Mixing in Wicking Structures and the Use of Enhanced Mixing Within Wicks in Microchannel Devices - Advanced wicking structures and methods utilizing these structures are described. The use of advanced wicking structures can promote rapid mass transfer while maintaining high capillary pressure through the use of small pores. Particularly improved results in fluid contacting processes can be achieved by enhanced mixing within a wicking layer within a microchannel.08-27-2009
20100078152Display Device - A display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a ventilation part defined outside the accommodation room and leading to outside of the housing, a display panel arranged inside the accommodation room and including a display screen viewable from a front surface side of the housing, and one or a plurality of heat pipes arranged on a rear surface side of the display panel. The heat pipe passes through a side surface wall forming the accommodation room and extends from inside of the accommodation room to inside of the ventilation part.04-01-2010
20100071880EVAPORATOR FOR LOOPED HEAT PIPE SYSTEM - An evaporator for a looped heat pipe (LHP) system, the evaporator including a plurality of wicks having pores formed therein; a plurality of heat transferring fins respectively having a wick coupler to be coupled to one of the plurality of wicks; a plurality of unit assemblies formed by respectively coupling each of the wicks and each of the heat transferring fins; an assembly structure formed by horizontally disposing the unit assemblies to enable a bottom surface of each of the unit assemblies to be located on a planar surface; a heat transferring plate coupled to a bottom part of the assembly structure; and a covering member coupled to the heat transferring plate.03-25-2010
20100071879METHOD FOR MANUFACTURING A PLATE-TYPE HEAT PIPE AND A PLATE-TYPE HEAT PIPE OBTAINED THEREBY - A method for manufacturing a plate-type heat pipe includes providing an elongated engaging plate and a base plate. A plurality of supporting members is secured on a top surface of the base plate. A second and third metal powders are filled onto the base plate, surrounding lower ends of the supporting members. The second and third metal powders are heated to obtain a first wick structure and a second wick structure. The first wick structure adheres to the top surface of the base plate and the second wick structure adheres to the top surface of the first wick structure. The base plate and the supporting members are secured to a bottom surface of the engaging plate to obtain a workpiece. A working fluid is injected into the workpiece and the workpiece is vacuumed to obtain the plate-type heat pipe.03-25-2010
20130037242THIN-TYPE HEAT PIPE STRUCTURE - A thin-type heat pipe structure includes a flat pipe, a second capillary structure, a third capillary structure, and a working fluid. The flat pipe has two boards and a containing chamber. A first capillary structure is set on the inner surface of the boards. The second capillary structure is contained in the containing chamber and covers a part of the first capillary structure. The third capillary structure is a stripe, contained in the containing chamber and clipped between the second capillary structure and another part of the first capillary structure. The working fluid is filled in the containing chamber. The overall design speeds up inner air's outflow and inner liquid's backflow.02-14-2013
20130037244FLAT HEAT PIPE - A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.02-14-2013
20130037243Thermodynamic Device For Refrigeration And Air Conditioning - A thermodynamic capillary device for use in refrigeration and air conditioning systems has a tube (02-14-2013
20130037241HEAT PIPE WITH UNEQUAL CROSS-SECTIONS - The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections.02-14-2013
20130081788HEAT EXCHANGE APPARATUS - A heat exchange apparatus comprising a heat pipe (04-04-2013
20120175087Evaporators for Heat Transfer Systems - A heat transfer system includes an evaporator having a heated wall, a liquid barrier wall containing working fluid, a primary wick positioned between the heated wall and an inner side of the liquid barrier wall, a vapor removal channel located at an interface between the primary wick and the heated wall, and a liquid flow channel located between the liquid barrier wall and the primary wick. Methods of transferring heat include applying heat energy to a vapor barrier wall, flowing liquid through a liquid flow channel, pumping the liquid from the liquid flow channel through a primary wick, and evaporating at least some of the liquid at a vapor removal channel.07-12-2012
20120175086HEAT TRANSFER DEVICE AND METHOD OF MAKING SAME - A heat pipe is provided having an enclosed vapor chamber and a wick disposed within the vapor chamber. The wick comprises a plurality of lands having a thickness and a plurality of vents formed between the lands, wherein each vent includes a layer of wick having a thickness that is less than the thickness of the lands.07-12-2012
20120175085Enhanced Surface Area Heat Pipe - A sealed thermal cycle heat transferring device having areas of gross surface modification enabling efficiency enhancement through increased working fluid capacity and reduced conduction resistance while still retaining the net surface footprint. Certain embodiments of the present invention facilitate surface enhancement affecting condensing portions as well as evaporating portions. Thermal transfer performance remains adjustable well beyond conventional heat pipe apparatus by allowance of careful selection of surface enhancing parameters including diameter, depth, shape, amount, area and location of surface enhancement. Additional advantages may include the enhancement of mounting, attachment and enablement of thermally generating, dissipating or regulating components, devices, assemblies and any uses where the present invention may benefit thermal addition, subtraction, regulation and transfer.07-12-2012
20120175084HEAT PIPE WITH A RADIAL FLOW SHUNT DESIGN - A heat pipe includes a pipe body filled up with a working fluid and having opposing evaporation segment and condensing segment, a first wick structure having ribs axially extending through the evaporation segment and the condensing segment, a channel defined between each two adjacent ribs and grooves transversely cut through the ribs, and a second wick structure sintered and joined to a predetermined part of the first wick structure in the evaporation segment to fill in the channels and the spiral grooves and to cover the ribs.07-12-2012
20100163211Heat exchanger assembly - An improved heat exchanger assembly and method. First and second plates made of a predetermined thermally conductive material are configured when mated to form a hermetically sealed vapor chamber. A wick made of the same predetermined thermally conductive material resides in the vapor chamber forming a gas chamber.07-01-2010
20100044014Flat-plate loop heat conduction device and manufacturing method thereof - A flat-plate loop heat conduction device and a manufacturing method thereof. The flat-plate loop heat conduction device includes an upper flat plate and a lower flat plate overlapping and mating with each other. Complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes are disposed on the upper and lower flat plates. After the upper and lower flat plates are mated with each other, a complete evaporation section, a complete condensing section, a complete vapor transfer pipe and a complete condensing transfer pipe are formed in communication with each other to achieve a heat conduction loop structure for a working fluid to circulate therein. The flat-plate loop heat conduction device is easier to manufacture. Moreover, the flat-plate loop heat conduction device has reinforced structure and is not subject to damage.02-25-2010
20090071632FLEXIBLE HEAT PIPE - A heat pipe for cooling a heat-generating component has a generally planar, sealed flexible body having an evaporator section, a condenser section, and a flexible bellows section. The bellows section is located between the evaporator section and the condenser section along a longitudinal length of the body. A chamber extends from the evaporator section to the condenser section inside the body and contains a working fluid. The bellows section includes internal supports to keep the chamber open during repeated bending of the heat pipe at the bellows section.03-19-2009
20120205074COOLING DEVICE FOR COOLING MEDIUM-VOLTAGE APPARATUS USING INSULATED HEAT PIPES - The cooling device is suitable for fitting to existing installations, without redesigning them. It consists in using heat pipes (08-16-2012
20100101762HEAT TRANSFER SYSTEM - A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator including a wall configured to be coupled to a portion of the cyclical heat exchange system and a primary wick coupled to the wall and a condenser coupled to the evaporator to form a closed loop that houses a working fluid.04-29-2010
20090159242HEAT PIPE SYSTEM - For cooling electronics with high heat fluxes, a lattice wick system is disclosed that has a plurality of granular wicking walls configured to transport liquid through capillary action in a first direction, each set of the plurality of granular wicking walls forming respective vapor vents between them to transport vapor. Granular interconnect wicks are embedded between respective pairs of the granular wicking walls to transport liquid through capillary action in a second direction substantially perpendicular to the first direction. The granular interconnect wicks have substantially the same height as said granular wicking wall so that the plurality of granular wicking walls and granular interconnect wicks enable transport of liquid through capillary action in two directions and the plurality of vapor vents transport vapor in a direction orthogonal to the first and second directions.06-25-2009
20100108298HEAT PIPE WITH PLANISHED END SURFACE - The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.05-06-2010
20100108296THIN COOLING DEVICE - Provided is a vapor-liquid phase change cooling device, which may be manufactured with no limitation of thickness.05-06-2010
20100108297Heat Pipe and Making Method Thereof - A heat pipe and the method thereof are provided. The heat pipe (05-06-2010
20130032312VAPOR CHAMBER CAPILLARY FORMATION METHOD AND STRUCTURE THEREOF - A vapor chamber capillary formation method includes providing a base plate and a corresponding cover plate; forming a plurality of support protrusions on the base plate or any internal wall of the cover plate directly; coating a capillary structure onto a surface of the support protrusions, an internal wall of the base plate, and an internal wall of the cover plate; stacking and sealing the base plate and the cover plate with one another to form a cavity; and filling a working fluid into the cavity, and vacuuming and sealing the cavity. In addition, a vapor chamber capillary structure is further disclosed, and the structure can be formed on an internal wall of a casing of the vapor chamber directly, and the support strength and the yield rate of the vapor chamber can be enhanced.02-07-2013
20130032311System for Using Active and Passive Cooling for High Power Thermal Management - A cooling system is disclosed that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.02-07-2013
20130032313HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost.02-07-2013
20120180995THIN HEAT PIPE STRUCTURE AND METHOD OF MANUFACTURING SAME - A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.07-19-2012
20120180994HEAT PIPE STRUCTURE - A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to enable increased supporting strength of the heat pipe structure as well as enhanced vapor-liquid circulation efficiency of the working fluid in the heat pipe structure.07-19-2012
20100006268VAPOR CHAMBER AND SUPPORTING STRUCTURE OF THE SAME - A vapor chamber includes a casing, the working fluid, a wick structure and a supporting structure. The casing has a hollow room for allowing the working fluid to be filled therein. The wick structure is distributed in the hollow room. The supporting structure abuts against an inside surface of the wick structure. The supporting structure includes side plates and a plurality of wavelike pieces connected between the side plates. Each of the wavelike pieces is constituted of a plurality of crests and troughs. The crests of any two neighboring wavelike pieces are arranged in an alternating manner. A penetrating hole is provided at the crests and the troughs respectively. The working fluid flows through the separated passages and the penetrating holes. Via the above arrangement, the heat-conducting efficiency of the vapor chamber can be enhanced.01-14-2010
20100006266HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - A heat pipe includes an evaporation section, a condensation section and a connecting section connecting with the evaporation section and the condensation section. The evaporation section defines a plurality of dents at an outer wall thereof to increase rough degree of the outer wall of the evaporation section. The dents are provided to prevent solder from separation from the evaporation section during soldering process soldering the evaporation section to a heat sink.01-14-2010
20100006267COVERED PLATE-TYPE HEAT PIPE - A compact plate-type heat pipe having a large strength includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-like sleeve. The plate-like sleeve is covered outside the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside. The surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the heat-generating electronic element can be dissipated quickly.01-14-2010
20130048252VAPOR CHAMBER STRUCTURE AND METHOD OF MANUFACTURING SAME - A vapor chamber structure and a method of manufacturing thereof are disclosed. The vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed each other to define a chamber therebetween; the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.02-28-2013
20130048251HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.02-28-2013
20130048250HEAT PIPE MADE OF COMPOSITE MATERIAL AND METHOD OF MANUFACTURING THE SAME - The heat pipe made of composite material is a sealed hollow tube being a multilayer structure made of a composite material including copper and aluminum, is filled with water and has an inner surface, an evaporator end, a condenser end and a wick. The wick is attached to the inner surface of the tube. The invention provides a cost effective and lightweight heat pipe as it uses aluminum, which is cheap and light in weight. Also, the invention provides a high performance heat pipe system as it uses copper, which is highly thermally conductive. Therefore, the heat pipe is desirable for thermal management applications in a variety of products.02-28-2013
20130048248HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.02-28-2013
20130048247HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section and the condensing sections. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.02-28-2013
20130048249HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.02-28-2013
20100326631PLATE-TYPE HEAT PIPE - An exemplary plate-type heat pipe includes a top plate, a bowl-shaped base plate, a wick structure arranged on inner surfaces of the top and base plates and a working liquid filled therein. The base plate engages and cooperates with the base plate to defining a sealed chamber between the base plate and top plate. The working liquid is contained in the sealed chamber. The base plate defines a heat absorbing portion at a central part thereof for contacting a heat generating component. Pits are defined in the inner surface of the heat absorbing portion.12-30-2010
20110000648Heat dissipation module - A heat dissipation module adapted for dissipating heat generated by a heat source includes at least a heat pipe and a heat dissipation fin assembly. The heat pipe has a heat-absorbing section and a heat-dissipating section. The heat dissipation fin assembly includes a plurality of graphite fins and a plurality of spacers and the graphite fins and the spacers are connected to the heat-dissipating section alternatively. Each of the spacers has a first baffle board and a first convex part, the first baffle board is adapted to be against the graphite fin, and the first convex part is adapted to project from the first baffle board along an extending direction of the heat-dissipating section.01-06-2011
20110000645HEAT DISSIPATING BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating board structure includes a heat dissipating board body having a first face with at least one groove; and at least one heat pipe correspondingly received in the at least one groove to flush with the first face. To manufacture the heat dissipating board structure, first provide at least one heat pipe and a heat dissipating board body; then, form at least one groove on a first face of the board body, place the heat pipe in the groove, and press the board body with a press machine to associate the heat pipe with the groove while flatten a top of the heat pipe; and finally, flush the heat pipe with the first face by removing extra material of the heat pipe that is protruded from the first face. The completed heat dissipating board structure provides upgraded heat dissipation efficiency and eliminates the problem of thermal resistance.01-06-2011
20130056179THERMAL MODULE STRUCTURE - A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost.03-07-2013
20110005729COOLANT DISTRIBUTION FOR TOOL COOLING - The invention relates to a cooling system for cooling a tool via cooling sites (01-13-2011
20130160977PLATE TYPE HEAT PIPE WITH MESH WICK STRUCTURE HAVING OPENING - A plate type heat pipe includes a sealed tube, a chamber defined in the tube, and working medium received in the chamber. A mesh wick structure is attached to an inner wall of the tube. In one version of the plate type heat pipe, the wick structure defines a single opening. The opening communicates the chamber and thereby provides additional space for flow of vaporized working medium inside the tube. In other versions of the plate type heat pipe, the wick structure defines two or more openings.06-27-2013
20090056917NANOSTRUCTURED MICRO HEAT PIPES - A heat pipe comprising a chamber; a wick in the chamber, and a heat sink, which is adjacent to a first portion of the wick. A heat source adjacent to a second portion of the wick, wherein the wick is configured such that a gas condenses at the first portion of the wick and a liquid evaporates at the second portion of the wick. The fluid moves from the first portion of the wick to the second portion of the wick, and wherein the wick comprises nanostructures having a differentially-spaced apart gradient along the length of the wick so as to promote capillary fluid flow therealong.03-05-2009
20120222840HEAT PIPE MOUNTING METHOD AND HEAT PIPE ASSEMBLY THEREOF - A heat pipe mounting method and a heat pipe assembly thereof are disclosed. The method includes the step of providing a heat-transfer block and a plurality of heat pipes. A plurality of heat pipe grooves is formed on the heat-transfer block. The heat pipes are then press-fitted to respective heat pipe grooves. During the press-fitting step, the heat pipes are flattened to force the flattened part of one heat pipe into abutment against the flattened part of another heat pipe in a flushed manner. Thereby, the heat pipes are abutted to each other with no separation therebetween. Hence, the heat transfer performance is increased.09-06-2012
20120222839HEAT PIPE ASSEMBLY - A heat pipe assembly includes a heat-transfer block and at least one heat pipe press-fitted thereon. The heat-transfer block has a surface. A heat pipe groove is formed concavedly on the surface. A fixing rib is protruded from the heat pipe groove. The heat pipe is press-fitted to the heat pipe groove, and the fixing rib impresses into the heat pipe in forming an impression thereon. Thus, the heat pipe is tightly secured onto the heat-transfer block.09-06-2012
20090242175Thermal energy transfer device - Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane.10-01-2009
20130133864HEAT DISTRIBUTION STRUCTURE, MANUFACTURING METHOD FOR THE SAME AND HEAT-DISSIPATION MODULE INCORPORATING THE SAME - A heat distribution structure, a method for manufacturing the same and a heat-dissipation module incorporating the same are disclosed. The heat distribution structure includes a first cap with a first grove and a second cap with a second groove and a support body interposed between the first cap and the second cap, wherein microstructures are formed at the bottoms of the first groove and the second groove and through holes are formed in the support body. The support body is interposed between the first and second caps, such that a cavity is formed by the first cap, the support body and the second cap. A working fluid is contained in the cavity that flows therein through capillary action provided by the microstructures of the first and second grooves and the through holes in the support body, thus evenly distributing heat in the heat distribution structure.05-30-2013
20090236081DEVICE FOR PREHEATING A COMPONENT COOLED BY CONDUCTION AND/OR BY CONVECTION - The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The component is in contact with a heat conductor and the device includes a heater to heat the part, the device further including at least one heat pipe having fluid within, to connect a heat dissipater with the heat conductor, the dissipater and the part furthermore being thermally insulated from one another. Freezing of fluid in the heat pipe facilitates preheating of the component at low temperature. The invention applies notably to the starting of components subjected to low temperatures, for example, components installed in systems on board aircraft.09-24-2009
20090236080HEAT DISSIPATION MODULE AND HEAT PIPE THEREOF - A heat dissipation module includes a plurality of fins and a heat pipe connected with the fins. The heat pipe includes a body, which forms an enclosed space, and an inner ring. A wick structure is disposed on the inner surface of the body, and the inner ring is disposed in the enclosed space for increasing a structural strength of the heat pipe. The inner ring is pressed against the top and bottom of the body or in contact with the wick structure located at the top and the bottom of the body, respectively. The inner ring includes at least one opening located close to the top of the body for communicating inside and outside of the inner ring.09-24-2009
20120227937HEAT DISSIPATION STRUCTURE FOR PHOTOVOLTAIC INVERTER - A heat dissipation structure for photovoltaic inverter includes a photovoltaic inverter, a thermal module and at least one heat pipe. The thermal module has a heat dissipation backboard formed with at least one groove. The heat pipe is inlaid in the groove. The heat pipe has a plane face and an arcuate face. The plane face of the heat pipe is flush with the heat dissipation backboard and attached to the photovoltaic inverter. The arcuate face of the heat pipe is snugly attached to a wall of the groove. The processing cost and material cost of the heat dissipation structure are lowered and the heat dissipation efficiency of the heat dissipation structure is enhanced.09-13-2012
20120227936HEAT-DISSIPATING UNIT HAVING A HYDROPHILIC COMPOUND FILM AND METHOD FOR DEPOSITING A HYDROPHILIC COMPOUND FILM - A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.09-13-2012
20090008063System and Method for Passive Cooling Using a Non-Metallic Wick - According to an embodiment of the invention, a cooling system for a heat-generating device comprises a base plate, a fluid transfer chamber, a non-metallic wicking material, and a coolant. The base plate is in thermal communication with a heat generating structure and is operable to communicate thermal energy from the heat-generating device. The non-metallic wicking material and the coolant are disposed within the fluid transfer chamber. The non-metallic wicking material wicks a portion of the coolant towards a portion of the base plate communicating the thermal energy. The portion of the coolant absorb at least a portion of the thermal energy communicated from the heat-generating device. The coolant comprising at least an alcohol and at least one additional fluid.01-08-2009
20130160976HEAT PIPE WITH COMPOSITE WICK STRUCTURE - An exemplary heat pipe includes an elongated casing, a first wick structure, a second wick structure, and working medium filled in the casing. The heat pipe has an evaporating section and a condensing section. The first wick structure is located within an inner wall of the casing and defines a window at the evaporating section of the heat pipe. The first wick structure has a first pore size. The second wick structure is received in the window of the first wick structure. The second wick structure is in direct physical contact with the inner wall of the evaporating section of the casing and the first wick structure. The second wick structure has a second pore size smaller than the first pore size of the first wick structure. The working medium saturates the first wick structure and the second wick structure.06-27-2013
20100089554Drum-based vapor chamber with an insertable wick system - A vapor chamber with an insertable wick system comprises two Coverskins and a Frame, where the insertable wick system provides at least a portion of a condensate flow path from the condensing surface to an evaporation region. The Coverskins are joined to the frame to form a “drum” enclosure whereby, similar to membranes on a drum, the two Coverskins resist deformation mainly through tensile forces along the plane of the skins, and thus much thinner materials could be used. The frame operates similar to the cylindrical body of a drum in providing the necessary bending resistance so as to keep the Coverskins in a state of relative tension when it is subject to external loading. The net result of this arrangement is that each component would largely be responsible for only one type of force (i.e., tension or bending), and thus a state of maximum efficiency could be achieved. Consequently, the strength of the Coverskins (to resist collapse) is less dependent on its thickness, and a state of minimum thickness is achieved.04-15-2010
20120267078HEAT DISSIPATION MECHANISM - A heat dissipation mechanism includes at least one fixing member and at least one heat pipe. The heat pipe has a heat-dissipation section and a heat-absorption section bearing on one face of the fixing member. The fixing member includes a plurality of clamp sections protruded from two axially opposite edges of the fixing member. The clamp sections respectively define a receiving space, and the heat-absorption section has a plurality of connecting segments received in the receiving spaces, so that the heat pipe is connected to the fixing member via the clamp sections to form an integral unit. With these arrangements, the heat dissipation mechanism can have effectively increased heat transfer efficiency and be manufactured at reduced cost.10-25-2012
20090101314MODIFIED HEAT PIPE FOR ACTIVATION OF A PRESSURE RELIEF DEVICE - A heat pipe is disclosed, the heat pipe capable of transferring heat to actuate a pressure relief device by heat transfer through either capillary action involving a wicking material and a working fluid, or by a fuse in the case of leakage of the working fluid from the heat pipe.04-23-2009
20110000649HEAT SINK DEVICE - A heat sink is provided. The heat sink contains a first vapor chamber section having a top surface and a bottom surface that is in thermal contact with a heat source, a second vapor chamber section that extends vertically from the top surface of the first vapor chamber section, and heat-dissipating fins that are attached to the second vapor chamber section. The first and second vapor sections are connected to each other forming a continuous vapor chamber space.01-06-2011
20100032138HEAT PIPE WITH FLAT END AND METHOD OF MANUFACTURING THE SAME - The invention is to provide a method for making a heat pipe with a flat end. The method comprises the steps of (a) providing a first tube, including a first open end and a second open end; (b) providing a second tube, including a third open end and a flat closed end; (c) seal jointing the second open end of the first tube and the third open end of the second tube to form a third tube; (d) forming a porous capillary diversion layer on the inner wall of the third tube; (e) injecting a working fluid into the third tube; (f) vacuuming the third tube, and (g) sealing the first open end.02-11-2010
20120097372HEAT SINK - Provided is a heat sink capable of improving heat dissipating characteristics and saving space with a reduced fin size. The heat sink is provided with: a base plate which has one surface thermally connected to a heat generating component and which has thermally connected thereto a first heat dissipating fin section composed of a thin plate fin; an upper plate which has a second heat dissipating fin section thermally connected on one surface, the second heat dissipating fin section being composed of two kinds of thin plate fins having different heights; and a plurality of heat pipes which are disposed between the other surface of the base plate and the other surface of the upper plate by being thermally connected to the surfaces and which include a heat pipe that has at least a part thereof inserted into a part of the second heat dissipating fin section.04-26-2012
20110277965FIN AND HEAT SINK HAVING THE SAME - The present invention provides a fin and a heat sink. The fin includes a body having at least one first through-hole and at least one first protrusion. The first protrusion extends from the first through-hole toward one side of the body to form a first protruding end. At least one first notch is provided on the body in communication with the first through-hole. The fins are stacked up to form a fin set. A first heat pipe penetrates the fin set to constitute the heat sink. The first heat pipe penetrates the first through-hole while the first notch is expanded, so that the first protruding end tightly abuts against the first heat pipe. In this way, the structural strength of the fin is improved, the first heat pipe is protected from wearing due to the rubbing of fins against the heat pipe, and the heat-conducting efficiency is increased.11-17-2011
20110277966HEAT-DISSIPATING DEVICE - The present invention provides a heat-dissipating device including a heat sink and a heat pipe. The heat sink has an end surface provided with a trough. The trough has an open side and a closed side. The heat pipe has a heat-absorbing surface and a heat-conducting surface corresponding to the open side and the closed side respectively. The heat-conducting surface and the heat-absorbing surface are not brought into contact with the heat sink. The heat is directly absorbed by the heat pipe and then conducted to the heat sink for dissipation. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.11-17-2011
20110277963THERMAL MODULE AND METHOD OF MANUFACTURING THE SAME - A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.11-17-2011
20110277964FLAT HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.11-17-2011
20100175856VAPOR CHAMBER WITH WICK STRUCTURE OF DIFFERENT THICKNESS AND DIE FOR FORMING THE SAME - A vapor chamber with a wick structure of different thickness includes a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure has a first wick section and a second wick section extending from the first wick structure. The thickness of the first wick section is larger than that of the second wick section. The supporting body is received within the wick structure. The working fluid is filled within the chamber. Via the above arrangement, the heat-conducting efficiency can be increased while the cost can be reduced.07-15-2010
20100006269ENHANCED HEAT PIPE COOLING WITH MHD FLUID FLOW - A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat. In a method for cooling a heat sink connected to a plurality of heat pipes and containing a plurality of MHD fluid pipes, the method includes generating a plurality of magnetic fields using an array of magnets; creating an electric potential from a top surface to a bottom surface of each MHD fluid pipe using a plurality of metal films; and inducing electrically-conductive MHD fluid to circulate in the plurality of MHD fluid pipes by the plurality of magnetic fields and the electric potential.01-14-2010
20120186787HEAT PIPE SYSTEM HAVING COMMON VAPOR RAIL - A heat pipe has a plurality of conduits. Each conduit has an evaporator section extending laterally from a first open end of the conduit, a condenser section extending laterally from a second open end of the conduit, and a liquid return section connected to the evaporator section at a position away from the first open end and connected to the condenser section at a position away from the second open end. The liquid return section of at least one conduit is distinct from the liquid return section of another of the conduits. A common vapor manifold extends between the first and second open ends of each of said plurality of conduits so vapors produced in the evaporator sections can flow from the first open ends through the common vapor manifold to the second open ends without flowing through the conduits.07-26-2012
20090205812ISOTHERMAL VAPOR CHAMBER AND SUPPORT STRUCTURE THEREOF - In an isothermal vapor chamber and its support structure, the isothermal vapor chamber includes a casing, a capillary wick, a support structure and a working fluid. The capillary wick is disposed in the casing. The support structure is contained in the capillary wick for supporting the capillary wick and the support structure includes two side panels and a plurality of wavy plates are connected between the two side panels. The wavy plate is formed by a plurality of wave peak sections and a plurality of wave valley sections, and the wave peak sections of any two adjacent wavy plates are installed alternately with each other, and any two adjacent wavy plates are partitioned to form a partition channel. The working fluid is filled into the casing and flowed through the partition channel for improving the heat conducting efficiency of the isothermal vapor chamber.08-20-2009
20110284189REUSABLE HIGH TEMPERATURE THERMAL PROTECTION SYSTEM - A reusable phase change material (PCM) heat shield is disclosed. The heat shield comprises: a thermally conductive casing, PCM, thermally conductive open cell foam, and heat pipes. The heat flows through the casing and open cell foam into the PCM, heating it up. The PCM changes phase twice, from solid to liquid. During the solid liquid phase change, heat pipes begin to draw heat away from the PCM to a secondary location that re-radiates the heat away. The open cell foam serves to help channel hear into the PCM. In one embodiment, the PCM heat shield can be used for thermal protection of an atmospheric entry vehicle (ARV). In another, the PCM heat shield may be applied to an aircraft engine to transfer extracted heat to preheat incoming air. In another, the PCM heat shield is integrated into the structure of a spacecraft, and used to both carry loads and protect against high temperatures.11-24-2011
20100170660HEAT EXCHANGERS AND RELATED METHODS - Heat exchangers and related methods, e.g., methods of reducing heat from a load, are disclosed. In some embodiments, a device includes a stationary element defining a cavity, a movable element, and a first heat pipe in fluid communication with the cavity defined by the stationary element.07-08-2010
20110284188HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY - A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.11-24-2011
20110297356HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.12-08-2011
20110297355HEAT-CONDUCTING MODULE AND HEAT-DISSIPATING DEVICE HAVING THE SAME - A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.12-08-2011
20110290451HEAT COOLER - Provided is a heat cooler configured to rapidly cool a heat-generating device by transferring heat generated from the heat-generating device to an outside area. The heat cooler includes a heat conductive body having a predetermined volume and sealing members. The body includes a plurality of penetration holes formed through top and bottom surfaces of the body. The sealing members are hermetically coupled to the top and bottom surfaces of the body. The bores are sealed with the sealing members to form independent accommodation portions, and a plurality of heat conductive beads and a refrigerant are filled in the accommodation portions in a state where the refrigerant permeates between the heat conductive beads.12-01-2011
20110290449COOLER DEVICE - A cooler device includes a metal base panel, radiation fins fastened to the metal base panel at the top, and heat pipes fastened to the metal base panel and respective top notches of the radiation fins. Each top notch of each radiation fin has a narrow notch portion disposed at the top side for a stamping die to pass and an expanded bottom notch portion disposed at the bottom side for the cold end of one of the heat pipes to insert through for enabling the inserted cold ends of the heat pipes to be deformed and forced into engagement with the radiation fins by a stamping machine by means of stamping dies.12-01-2011
20110290454Air Cooling And Air Dehumidifying Module Comprising Capillary Tube Mats And Method of Using It - The invention relates to a method of operating the air cooling and air dehumidifying module in combination with cooling ceilings or suspended cooling panels. Such solution serves for the decentralized cooling of rooms and for dehumidifying the air in a room.12-01-2011
20110290453Air Cooling And Air Dehumidifying Module Comprising Capillary Tube Mats And Method of Using It - The invention relates to an air cooling and air dehumidifying module comprising plastic capillary tube mats, which are formed by folding and/or winding into a compact assembly with a virtually cuboidal outer shape, which cools and dehumidifies the air stream passed through the mat assembly when cold water is conducted through the capillary tubes. Such solution serves for the decentralized cooling of rooms and for dehumidifying the air in a room.12-01-2011
20110290452FOLDED FIN HEAT TRANSFER DEVICE - A system for cooling a heat producing device is provided. The system can include an air mover (12-01-2011
20110290450Heat Dissipation Module - A heat dissipation module includes a cooling base, a heat dissipating component, and at least one heat pipe. The cooling base includes a heating surface and a conducting surface. On the heating surface is disposed at least one joining part to hold and connect the heat pipe. The heat pipe includes a heat absorbing end and a heat dissipating end. The heat absorbing end is disposed on the joining part of the cooling base. A flat surface parallel to the heating surface of the cooling base is formed on the heat absorbing end. The heat dissipating end is attached to the heat dissipating component. The design of the present invention effectively reduces the weight and thickness of the cooling base and provides better heat dissipation.12-01-2011
20090250197HEAT PIPE BEARING COOLER SYSTEMS AND METHODS - A method of cooling shaft bearings of a high speed rotating machine is provided. In various embodiments, the method includes utilizing a primary cooling circuit of the machine that is structured and operable to cool a drive package of the machine to cool condenser ends of each of a plurality of heat pipes absent an auxiliary cooling system structured for cooling the heat pipe condenser ends. Each heat pipe including a respective evaporator end disposed proximate the shaft bearings to absorb heat generated by the bearings during operation of the machine.10-08-2009
20100263834HEAT DISSIPATION DEVICE - A heat dissipation device includes a chamber, a tube, a wick structure and a plurality of fins arranged around the tube. The chamber includes a base and a cover hermetically connected to the base. An evaporation room is defined between the base and the cover of the chamber. The tube extends upwardly from the cover of the chamber, and defines a condensation room communicating with the evaporation room. The wick structure is immerged with working fluid, and includes a main portion disposed in the evaporation room and a projection extending from the main portion into the condensation room.10-21-2010
20110214842HEAT SINK - A heat sink has a fin set and at least one heat pipe. The fin set has multiple stacked fins and at least one tapered tube. Each fin has at least one protrusion. The at least one protrusion protrudes from each fin and each protrusion has an internal surface. The at least one tapered tube is defined through corresponding protrusions of the fins. The at least one heat pipe has at least one tapered arm and a pipe wall. The tapered arm corresponds to and is mounted through a corresponding tapered tube of the fin set. The pipe wall of the heat pipe abuts the internal surfaces of corresponding protrusions of the fins tightly so heat can be dissipated efficiently during use.09-08-2011
20120097371SERIALLY-CONNECTED HEAT-DISSIPATING FIN ASSEMBLY - A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.04-26-2012
20100101761METHOD FOR MANUFACTURING A PLATE-TYPE HEAT PIPE - A method for manufacturing a plate-type heat pipe including providing a mold including a first cavity and a plurality of second cavities located above and communicating with the first cavity and depositing cores into the first cavity. First and second metal powder are injected into the mold by using a double-mode injection molder. The first metal powder securely adheres to the cores, and the second metal powder fills up the first and second cavities except the first metal powder located, thereby forming a green piece. The cores are removed from the green piece to define chambers in the green piece. The green piece is heated to obtain a sintered product with an outer wall, fins extending from the outer wall and a wick structure adhering inner surfaces of the outer wall.04-29-2010
20120186786HEAT DISSIPATING APPARATUS AND METHOD FOR MANUFACTURING SAME - An exemplary heat dissipation apparatus includes a stack of fins, a heat pipe extending through the fins, and a resilient plate fixed between the fins and the heat pipe. The fins are spaced from each other. Each of the fins defines a through hole therein for extending of the heat pipe therethrough. The heat pipe is mounted in the through hole. The resilient plate is fixed in the through hole and located between an edge of the through hole of the fin and the heat pipe, pushing the heat pipe into abutting engagement against the fin.07-26-2012
20090314472Evaporator For Loop Heat Pipe System - Provided is an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to an evaporator having an increased contact area between a sintered wick and a heating plate.12-24-2009
20090314471HEAT PIPE TYPE HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat pipe type heat sink (12-24-2009
20090151906HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.06-18-2009
20090151905HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein.06-18-2009
20090133855HEAT DISSIPATION DEVICE AND ASSEMBLY METHOD THEREOF - A heat dissipation device includes a heat pipe having a condenser section and a layer of solid-state solder film on an exterior surface of the condenser section, a heat sink having a plurality of spaced fins, each of which has an aperture. The condenser section of the heat pipe fits into the apertures of the fins. The heat sink with the condensing section received therein is heated and the solid-state solder film melts, filling gaps between the heat pipe and the fins. A method of assembling the device is also provided.05-28-2009
20100122800FERRITIC STAINLESS STEEL AND STEEL SHEET FOR HEAT PIPES, AND HEAT PIPE AND HIGH-TEMPERATURE EXHAUST HEAT RECOVERY SYSTEM - Provided is a ferritic stainless steel for heat pipes of high-temperature exhaust heat recovery systems, which comprises, in terms of % by mass, from 16 to 32% of Cr, at most 0.03% of C, at most 0.03% of N, at most 3% of Si, at most 2% of Mn, at most 0.008% of S, from 0 to 0.3% of Al, and at least one of at most 0.7% of Nb, at most 0.3% of Ti, at most 0.5% of Zr and at most 1% of V, and optionally at least one of at most 3% of Mo, at most 3% of W, at most 3% of Cu, at most 0.1% of Y, at most 0.1% of REM (rare earth metal) and at most 0.01% of Ca, with a balance of Fe and inevitable impurities, and which satisfies at least the following formula (1), formula (2) and formula (5):05-20-2010
20080277099EVAPORATOR AND CIRCULATION TYPE COOLING EQUIPMENT USING THE EVAPORATOR - An evaporator includes a hermetically sealed vessel 11-13-2008
20110146957System And Method For Cooling A Device Subjected To Heat In A Vehicle, Particularly An Aircraft - A cooling system (06-23-2011
20100018677HEAT PIPE STRUCTURE AND THERMAL DISSIPATION SYSTEM APPLYING THE SAME - A heat pipe structure and a thermal dissipation system applying the same are described. The heat pipe structure includes a pipe component and a magnetic means, the pipe component has a working fluid, and the magnetic means is disposed on an external part of the pipe component to magnetize the working fluid, thus accelerating a backflow speed of the working fluid. The magnetic means is controlled by a sensing element, such that the magnetic means is driven to function according to a working temperature of the heat source, thereby improving the thermal transfer efficiency.01-28-2010
20110192577Heat Sink For Dissipating A Thermal Load - A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink.08-11-2011
20110017431FLEXIBLE THERMAL GROUND PLANE AND MANUFACTURING THE SAME - Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.01-27-2011
20100307721LOOP HEAT PIPE AND MANUFACTURING METHOD THEREOF - A loop heat pipe for dissipating heat generated by a heat source includes a pipe, a first capillary structure, a second capillary structure, and a working fluid in the pipe. The pipe has a condensing section, an evaporating section adapted to contact the heat source thermally, and an obstructing section adjacent to the evaporating section. The first capillary structure on an inner surface of the pipe is disposed between the condensing section and the obstructing section. The second capillary structure has a first and a second parts connected with each other. The first part on the inner surface of the pipe is extended from the evaporating section to the obstructing section. The second part passing through the obstructing section is extended from the obstructing section to the condensing section. A space between the first capillary structure and the second part of the second capillary structure defines a compensation room.12-09-2010
20110168357HEAT-DISSIPATING SYSTEM FOR LED SIGNBOARD - A heat-dissipating system for LED signboard includes a frame and at least one first heat-dissipating module. The frame has at least one heat-dissipating part and a LED module. The heat-dissipating part is connected to the LED module. The first heat-dissipating module has at least one heat pipe assembly connected to the heat-dissipating part and the frame for conducting the heat absorbed by the heat-dissipating part to the frame for heat dissipation. With the design of the first heat-dissipating module, the heat can be rapidly conducted to the frame for heat dissipation, thereby increasing the heat-dissipating area and improving the thermal-conducting efficiency. Thus, an excellent heat-dissipating effect can be achieved.07-14-2011
20110079372HEAT TRANSFER DEVICE WITH FUNCTIONS OF POWER GENERATION - Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside.04-07-2011
20100078151CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK - A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric.04-01-2010
20100078153Vapor Augmented Heatsink with Multi-Wick Structure - A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.04-01-2010
20100122799METHOD FOR COMBINING HEAT PIPES WITH A FIXING BASE AND STRUCTURE OF THE SAME - In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is provided. Adhesive medium is coated on the contacting surface between the heat pipe and the accommodating trough. The plurality of heat pipes is pressed into the accommodating trough. Finally, the heat pipes juxtaposed in the accommodating trough are pressed coplanarly the surface of the fixing base while a portion of the adhesive medium is received in the recess.05-20-2010
20090090487Heat pipe - A heat pipe includes a pipe body having two enclosed ends and defining a heat absorbing section and a condensing section, a wick structure formed on the inside wall of the pipe body and having a thickness relatively thicker at the heat absorbing section and relatively thinner at the condensing section, and a working fluid filled in the pipe body. By means of the design that the diameter of the space surrounded by the wick structure in the condensing section is greater than that in the heat absorbing section, the heat pipe eliminates fluid accumulation and maintains excellent temperature uniformity.04-09-2009
20100139895THERMAL MODULE - A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a base, a cover, a sidewall between the base and the cover, and an impeller arranged among the base, the cover and the sidewall. An air outlet is defined in the sidewall of the blower. The fin unit is arranged at the air outlet. The heat pipe has a contacting plate integrally formed with one of the base and the cover of the blower. The contacting plate of the heat pipe includes a dissipating surface attaching to the fin unit, and an absorbing surface with different portions adapted for contacting with electronic components, wherein the different portions of the absorbing plate being at different levels.06-10-2010
20080210407Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick - Provided is a flat panel type heat transfer device for effectively dissipating heat generated from a heat source in contact with a casing, comprising the casing sealed and having a certain shape, a coolant loaded in the casing and undergoing phase transition, one or more flat panel type hydrophilic wick structures in contact with at least a portion of an inner surface of the casing, manufactured by aggregating fibers capable of absorbing the coolant, and providing a coolant passage leading the coolant to flow in a direction parallel to the inner surface of the casing, and one or more support structures, each having a plurality of through holes which provide coolant passages through which coolant in a vapor phase or a liquid phase flows, while supporting the hydrophilic wick structure such that the hydrophilic wick structure is in close contact with the inner surface of the casing, wherein the coolant fills a portion of a space in the casing and circulates in the space in a manner such that the coolant flows through the hydrophilic wick structure by means of capillary force generated in fine passages formed in the hydrophilic wick structure toward a relatively hot point, is evaporated by heat from a heat source, flows in a vapor phase toward a relatively low temperature point, condenses at the relatively low temperature point, flows back in a liquid phase to the relatively hot point, and repeats the cycle of evaporation and condensation.09-04-2008
20110198058HEAT EXHAUSTION STRUCTURE FOR HEAT DISSIPATING DEVICE - A heat exhaustion structure for a heat dissipating device is provided. The present invention relates to a heat exhaustion structure for a heat dissipating device, and more particularly, to a heat exhaustion structure that may effectively exhaust an internal heat generated by heat dissipating devices included in a semiconductor package and in a large number of electronic products.08-18-2011
20110198057HEAT DISSIPATION APPARATUS FOR DATA CENTER - The present invention discloses a heat dissipation apparatus that comprises a heat transfer means and an air channel. The heat transfer means is filled with a first fluid, and it has an evaporation portion and a condenser portion where the evaporation portion receives heat from at least one server and the heat is transmitted to the condenser portion through the first fluid. The air channel receives a second fluid to transfer the heat from the condenser portion into a predetermined space. The first fluid is different than the second fluid.08-18-2011
20090277614HEAT DISSIPATING DEVICE AND HEAT CONDUCTION STRUCTURE THEREOF - The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The walls connect to a bottom surface of the first heat conduction plate. A receiving space is defined between the first heat conduction plate and the second heat conduction plate. At least one heat pipe is arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. Each heat pipe has a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section. A plurality of heat dissipating passages is defined between the at least one heat pipe and the walls. The heat emitting sections are partially positioned in the heat dissipating passages. The heat conduction structure can combine with a heat dissipating body and a fan to a heat dissipating device.11-12-2009
20090283247Evaporator unit - An evaporator unit includes an evaporator configured to evaporate a refrigerant, and a capillary tube configured to decompress the refrigerant. The capillary tube has two longitudinal ends bonded to the evaporator. At least one position of a middle portion between the two longitudinal ends of the capillary tube is fixed to the evaporator by press-contacting the evaporator. Therefore, it can prevent a crack from being caused at the bonding portions of the two longitudinal ends of the capillary tube.11-19-2009
20090283246Cooling fin structure and heat-dissipating module thereof - A cooling fin structure and a heat-dissipating module thereof are provided. The cooling fin structure includes a plate. The plate extends bilaterally to form a first guiding portion and a second guiding portion with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate. The plate and the first and second guiding portions together define a trough. The cooling fins are stacked up and coupled to a heat pipe, a base, and a fan so as to form a heat-dissipating module. The first guiding portion and the second guiding portion of the cooling fin structure guide a heat-dissipating fluid generated by the fan to the plate and concentrate the fluid so as to enhance heat dissipation greatly.11-19-2009
20090294104VAPOR CHAMBER - A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure comprises a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. Therefore, the amount of working fluid attached to the second wick portion is smaller than of the first wick portion. As a result, after heated, the working fluid attached to the second wick portion will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect.12-03-2009
20110203777HEAT PIPE WITH MICRO-PORE TUBES ARRAY AND MAKING METHOD THEREOF AND HEAT EXCHANGING SYSTEM - A heat pipe with micro tubes (08-25-2011
20110203776THERMAL TRANSFER DEVICE AND ASSOCIATED SYSTEMS AND METHODS - Embodiments of thermal transfer devices and associated systems and methods are disclosed herein. In one embodiment, a thermal transfer system can include a conduit that has an input portion, an output portion, and a sidewall between the input and output portions. Heat can enter the conduit at the input portion and exit the conduit at the output portion. The thermal transfer system can further include an end cap proximate to a terminus of the conduit. A working fluid can circulate through the conduit utilizing a vaporization-condensation cycle. The thermal transfer device can also include an architectural construct having a plurality of parallel layers of a synthetic matrix characterization of a crystal.08-25-2011
20100294465ENERGY TRANSDUCING APPARATUS AND ENERGY TRANSDUCING EQUIPMENT - The invention discloses an energy transducing apparatus and an energy transducing equipment grouping a plurality of the energy transducing apparatuses. The energy transducing apparatus includes a heat pipe, a first heat-dissipating member, a second heat-dissipating member, and an energy transducing member. The heat pipe includes a contact portion and a flat portion. The first heat-dissipating member includes a plurality of fins. The second heat-dissipating member is connected to the first heat-dissipating member to form an accommodating space. The contact portion is accommodated in the accommodating space and contacts both the first heat-dissipating member and the second heat-dissipating member. The energy transducing member contacts the flat portion. Thereby, heat generated in operation by the energy transducing member is conducted through the flat portion to the heat pipe and then is dissipated through the first heat-dissipating member, the second heat-dissipating member, and the fins.11-25-2010
20110024088HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA, HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS, AND METHOD FOR MANUFACTURING THE SAME - A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The present invention further provides a heat sink having such heat-dissipating fins, which includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.02-03-2011
20130213609HEAT PIPE STRUCTURE - A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.08-22-2013
20110198059HEAT EXCHANGE STRUCTURE AND COOLING DEVICE COMPRISING SUCH A STRUCTURE - A heat exchange structure including a primary face including non-through holes formed in the face. The inner surface of the holes and the surface of the primary face outside the holes are covered with nanoparticles. The inside of the holes have a non-wettability property relative to a given liquid and the surface of the face between the holes have a wettability property relative to the liquid.08-18-2011
20090166005VAPOR CHAMBER - A vapor chamber includes a base (07-02-2009
20090166004HEAT PIPE - A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.07-02-2009
20080283223Heat Dissipation System With A Plate Evaporator - A heat dissipation system is provided. The heat dissipation system includes: an evaporator having a plate chamber with the wick structures which has a plurality of pore sizes arranged in the plate chamber, a condenser, a vapor line, and a liquid line. The two-phase circulation of the vapor-condensate in the heat dissipation system, especially in the heat dissipation system with a plate evaporator, can effectively increase the heat conductivity of the plate heat source such as electronic chip. The design and composition of the wick structures are enormously decreased the turning-on temperature of the heat dissipation system and maintained the heat dissipation system in the balancing state under the low heat source power.11-20-2008
20080283222HEAT SPREADER WITH VAPOR CHAMBER AND HEAT DISSIPATION APPARATUS USING THE SAME - A heat dissipation apparatus includes a heat sink (11-20-2008
20090314470PASSIVE HEAT RADIATOR AND STREETLIGHT HEAT RADIATING DEVICE - The present invention relates to a passive heat radiator and a streetlight heat radiating device. The passive heat radiator includes: a heat radiating base plate; a slablike upstanding plate connected to the heat radiating base plate by soldering, and perpendicular to a horizontal plane when the heat radiating base plate is under a mounting status; a heat absorbing ending face disposed at one side of the heat radiating base plate deviated from the upstanding plate, and adapted to mount a heat generating element; and heat radiating fins connected to a surface of the upstanding plate by soldering, and perpendicular to the horizontal plane when the heat radiating base plate is under the mounting status. The heat radiating device includes a mounting seat and connecting seats. The heat absorbing ending face is provided with a bulb holder, or a circuit board is layout in the heat absorbing ending face, and connected with the streetlight bulb by soldering; the mounting seats are connected to the sides of the heat radiating base plate respectively; and the connecting seats are fixed and connected to the sides of the mounting seats. The present invention adopts an upstanding plate and heat radiating fins substantially perpendicular to a horizontal plane to form a heat radiating channel with a direction consistent with that of hot air flowing, which improves heat radiating effect.12-24-2009
20080216994Vapor-Augmented Heat Spreader Device - A vapor-augmented heat spreader device includes a lower sheet in communication with an upper sheet. The lower sheet includes condensate grooves formed into the upper surface and the upper sheet includes a series of vapor grooves formed therein. The dimensions of the condensate grooves differ from the dimensions of the vapor grooves. For example, the condensate grooves may have dimensions smaller than those of the vapor grooves. The lower sheet may further include a multi-wick structure in communication with the condensate grooves. The lower sheet may be coupled to the upper sheet utilizing one or more of a crest joint or an edge joint.09-11-2008
20130118717HEAT-DISSIPATING DEVICE AND METHOD FOR FABRICATING THE SAME - A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board.05-16-2013
20130118718HEAT PIPE ASSEMBLY - A heat pipe assembly used to transfer heat generated by an electronic component to a heat sink includes a first heat pipe, a second heat pipe, and a heat conducting member. A first end of the first heat pipe is connected to the electronic component. A second end of the first heat pipe is connected to the heat conducting member by welding. A first end of the second heat pipe is connected to the second heat sink. A second end of the second heat pipe is connected to the heat conducting member by welding.05-16-2013
20100126701PLATE-TYPE HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - A plate-type heat pipe includes a base plate having a first wick structure secured thereon and a covering plate mounted on the base plate. The base plate includes a central heat-absorbing plate and a pair of extending plates angling upwardly from opposite ends of the heat absorbing plate. The first wick structure includes a first adhering portion securely fixed to a top surface of a central portion of the heat absorbing plate, two second adhering portions angling upwardly from opposite ends of the first adhering portion and securely fixed to the top surface of lateral portions of the heat absorbing plate and top surfaces of the extending plates. The first adhering portion is thinner than the second adhering portion, and the second adhering portion thins from a central portion to opposite ends thereof.05-27-2010
20100126700HEAT-RADIATING BASE PLATE AND HEAT SINK USING THE SAME - A heat-radiating base plate includes an aluminum-made upper base plate, a copper-made lower base plate, and a heat pipe unit. The upper base plate has a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a thickness equal to a depth of the slotted pattern. The heat pipe unit has a first and a second heat-conducting flat face flush with the first and the second face of the upper base plate, respectively. The second face and the second heat-conducting face are attached to the lower base plate, which has another flat face in contact with a heat-producing unit. A radiating fin assembly can be mounted to a top of the heat-radiating base plate to provide a heat sink.05-27-2010
20090032226EVAPORATOR, LOOP HEAT PIPE MODULE AND HEAT GENERATING APPARATUS - An evaporator suitable for absorbing heat from a heat source is provided. The evaporator includes a top board, a bottom board, a side frame, and at least one porous member. The side frame connects the top board and the bottom board. The porous member is disposed between the top board and the bottom board and within the side frame. The part of the top board covering the porous member is a heat conducting portion near the heat source. The evaporator has at least one first channel, at least one second channel, a fluid inlet, and a fluid outlet. The first channel is adjacent to the bottom board and the porous member for containing a working fluid. The second channel is adjacent to the top board and the porous member for containing the working fluid. The fluid inlet communicates with the first channel. The fluid outlet communicates with the second channel.02-05-2009
20100263833Sintered heat pipe - A sintered heat pipe comprises: a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. With this structure, the liquid medium in the capillary grooves which moves toward a hot segment can be prevented from being blown by vapor moving toward the cold segment while the liquid medium condensed from the vapor at the cold segment can enter the capillary grooves without difficulty.10-21-2010
20100139894HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a heat spreader for absorbing heat from a heat-generating source, a tank covering on the heat spreader and hermetically engaging with the heat spreader, a first wick layer formed on an inner face of the tank, a second wick layer formed on an inner face of the heat spreader, and a supporting member located between the tank and the heat spreader. A chamber is defined between the tank and the heat spreader and contains working fluid therein. The supporting member is arranged in a wave shape and supports the first wick layer and the second wick layer.06-10-2010
20100139892HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.06-10-2010
20110005726HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.01-13-2011
20110005727THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.01-13-2011
20130213611HEAT PIPE HEAT DISSIPATION STRUCTURE - A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section. The heat pipe heat dissipation structure is able to greatly increase heat transfer efficiency.08-22-2013
20130213610HEAT PIPE STRUCTURE - A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a radial extension range larger than or equal to one half of a circumference of inner wall face of the chamber and larger than a radial extension range of the second capillary structure. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.08-22-2013
20100032137THERMALLY CONDUCTIVE MODULE - A thermally conductive module includes a base seat, a thermally conductive copper block and a heat pipe. A side face of the base seat is arranged an accommodation slot, a lateral side of which is arranged a fixing slot. The thermally conductive copper seat is inset into the fixing slot and combined therewith. The heat pipe has a heated section, on which a plane is configured and flush with the side face of the base seat, and which is accommodated by being clamped between the accommodation slot and the thermally conductive copper block. Thus, it is possible to effectively boost the thermally conductive speed and thermally conductive performance entirely.02-11-2010
20090277613GEOMETRICALLY REORIENTED LOW-PROFILE PHASE PLANE HEAT PIPES - A cooling system for removing heat from at least one heat generating component with a first low-profile phase plane heat pipe having a geometrically reoriented surface adapted for receiving heat from the at least one heat generating component along a first section of the geometrically reoriented surface, and having a plurality of micro-tubes disposed therein. A heat transfer fluid is contained with the plurality of micro-tubes and a second section of the geometrically reoriented heat pipe surface is disposed in a position geometrically offset from the first section. 11-12-2009
20090025909COOLER MODULE - A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves of the base block with a respective flat wall portion thereof kept in flush with the bottom wall of the base block, and a thermal pad affixed to the bottom wall of the base block to hold down the heat pipes in the bottom open grooves of the base block for transferring heat energy from an external electronic chip to the heat pipes and the heat sink for quick dissipation.01-29-2009
20090025910Vapor chamber structure with improved wick and method for manufacturing the same - A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.01-29-2009
20090139697HEAT TRANSFER DEVICE AND METHOD OF MAKING SAME - A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.06-04-2009
20090139696FLAT HEAT PIPE WITH MULTI-PASSAGE SINTERED CAPILLARY STRUCTURE - The flat heat pipe with multi-passage sintered capillary structure includes a flat pipe, which is a hollow pipe with a flat cross section and two sealed ends. Two flat surfaces and two lateral parts are defined. The flat pipe forms a heating section and a cooling section. A hollow chase is formed within the flat pipe. The sintered capillary structure is prefabricated into the hollow chase and is provided with at least two coupling sides for mating with two flat surfaces of the flat pipe. At least two flow passages are formed at intervals onto a preset location of the sintered capillary structure and arranged along the extension direction of the flat pipe.06-04-2009
20090199999Electric Component with Two-Phase Cooling Device and Method for Manufacturing - At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component.08-13-2009
20090321055LOOP HEAT PIPE - A loop heat pipe for heat dissipating to a heat source including a first pipe, a first capillary structure, a second capillary structure, a second pipe, and a working fluid is provided. The first pipe has an evaporating portion adjacent to the heat source and a condensing portion. The first capillary structure is disposed on an inner surface of the first pipe and extends from the evaporating portion to the condensing portion. The second capillary structure is disposed on the inner surface and located within the evaporating portion. The second pipe is connected between the evaporating portion and the condensing portion. The working fluid disposed in the first pipe and the second pipe is capable of being transferred from the evaporating portion to the condensing portion via the second pipe, and is capable of being transferred from the condensing portion to the evaporating portion in the first.12-31-2009
20090321053Enhanced Two Phase Flow in Heat Transfer Systems - A family of structures and designs for use in devices such as heat exchangers so as to allow for enhanced performance in heat exchangers smaller and lighter weight than other existing devices. These structures provide separate flow paths for liquid and vapor and are generally open. In some embodiments of the invention, these structures can also provide secondary heat transfer as well. In an evaporative heat exchanger, the inclusion of these structures and devices enhance the heat transfer coefficient of the evaporation phase change process with comparable or lower pressure drop.12-31-2009
20090084526HEAT PIPE WITH COMPOSITE WICK STRUCTURE - A heat pipe includes an elongated casing (04-02-2009
20100263837CHEMICALLY COMPATIBLE, LIGHTWEIGHT HEAT PIPE - The present invention discloses an apparatus including a magnesium alloy vessel substantially free of aluminum and zinc, with the vessel having a hollow interior cavity containing a working fluid, wherein the improvement includes the formation of a stable, protective layer on the inside wall of the vessel, the layer establishing compatibility with the working fluid and preventing base metal corrosion by the working fluid, the vessel including magnesium in combination with a gettering metal.10-21-2010
20100263836Thermal Regulation Passive Device with Micro Capillary Pumped Fluid Loop - The device includes an evaporator and a condenser connected by an outer tube in which extends at least one inner tube having one end leading into the condenser and another end connected to an end of a central duct for collecting the vapours of a heat-carrier fluid, in a microporous mass provided in the outer tube and pumping by capillarity the liquid-phase fluid flowing in at least one outer duct between the outer and inner tubes from the condenser to the evaporator, while the vapour-phase fluid flows from the evaporator to the condenser in at least one inner duct inside said at least one inner tube. The invention can be used for the thermal energy transfer from an electronic component or circuit in relation with the evaporator to a cold source in relation with the condenser.10-21-2010
20090314469Condensing Heat Exchanger with Hydrophilic Antimicrobial Coating - A multi-layer antimicrobial hydrophilic coating is applied to a substrate of anodized aluminum, although other materials may form the substrate. A silver layer is sputtered onto a thoroughly clean anodized surface of the aluminum to about 400 nm thickness. A layer of crosslinked, silicon-based macromolecular structure about 10 nm thickness overlies the silver layer, and the outermost surface of the layer of crosslinked, silicon-based macromolecular structure is hydroxide terminated to produce a hydrophilic surface with a water drop contact angle of less than 10°. The coated substrate may be one of multiple fins in a condensing heat exchanger for use in the microgravity of space, which has narrow channels defined between angled fins such that the surface tension of condensed water moves water by capillary flow to a central location where it is pumped to storage. The antimicrobial coating prevents obstruction of the capillary passages.12-24-2009
20100012300HEAT UNIFORMING DEVICE FOR ELECTRONIC APPARATUS - Provided is a heat uniforming device for an electronic apparatus, which improves the flow and circulation of operating fluid through evaporation and condensation using capillary attraction. The heat uniforming device for the electronic apparatus includes: an evaporation unit comprised of a planar first plate including a first multi-channel capillary region for evaporating an externally injected operating fluid due to heat transmitted from a heating source; and a condensation unit comprised of a planar second plate including a second multi-channel capillary region for condensing vapor supplied from the evaporation unit and a return region having a fluid path that communicates with all channels of the second multi-channel capillary region.01-21-2010
20100147493Heat-dissipating fin - A heat-dissipating fin includes a sheety main body. The main body is provided with a high-temperature area located at each of two sides thereof, an airflow area located at a midsection thereof for an external airflow to pass through, at least one guide wall formed at the airflow area and having a front end facing the main body, and two inclined guide portions each extending rearward toward one side thereof from a front end thereof. In this way, the external airflow can be guided to the high-temperature areas of the fin to reach greater heat-dissipating efficiency.06-17-2010
20100155032HEAT PIPE AND METHOD OF MAKING THE SAME - A heat pipe includes a longitudinal casing, a main wick structure, at least one auxiliary wick structure and a working fluid contained in the casing and saturating the main wick structure and the at least one auxiliary wick structure. The main wick structure is received in the casing and attached to an inner surface of the casing. The at least one auxiliary wick structure is received in the main wick structure. An inner peripheral surface of the main wick structure and an outer peripheral surface of the at least one auxiliary wick structure cooperatively define a vapor channel therebetween. At least one end of the at least one auxiliary wick structure is fixed on a corresponding end of the casing.06-24-2010
20100155030THERMAL MODULE - A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet perpendicular to the air inlet. The fin unit is arranged at the air outlet of the blower. The heat pipe includes a tube defining a chamber, and a wick structure disposed in the chamber. The heat pipe forms an evaporation section and a condensation section attaching to the fin unit. At least one contacting member is depressed inwardly from the evaporation section of the heat pipe for accommodating an electronic component therein. A depth of the chamber at the at least one contacting member is less than that at other portion of the evaporation section of the heat pipe without the at least one contacting member.06-24-2010
20120103573HEAT DISSIPATING APPARATUS WITH VORTEX GENERATOR - A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a pair of vortex generators installed with an interval apart and disposed adjacent to a side of the heat pipe, and each vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin, and the two guiding oblique surfaces protrude in a tapered form. A through hole is formed at a wide position of the tapered form and penetrates through the heat dissipating fin, such that the vortex generators of each heat dissipating fin induce a stack effect at corresponding upper and lower part of the heat dissipating fin to improve the heat dissipating efficiency.05-03-2012
20120103572HEAT DISSIPATING APPARATUS WITH VORTEX GENERATOR - A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a vortex generator installed thereon and disposed adjacent to a side of the heat pipe. The vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin. The two guiding oblique surfaces are disposed with an included angle there between. A through hole is formed at a position opposite to a side of the heat dissipating fin, such that the vortex generator of each heat dissipating fin induces a stack effect at corresponding upper and lower parts of the heat dissipating fin to improve the heat dissipating efficiency.05-03-2012
20120103571HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE - A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.05-03-2012
20100163212Flat loop Heat pipe - A flat loop heat pipe is formed of a first capillary core, a second capillary core, a first support member, and a second support member. The first capillary core and the first support member constitute an evaporation room. The second capillary core and the second support member constitute a compensation room. In light of this structure, it is not difficult to activate circulation of thermal dissipation under low-watt heat source and the first capillary core can avoid dry-out phenomenon.07-01-2010
20100181049HEAT DISSIPATION MODULE - A heat dissipation module includes a first substrate, a second substrate spaced from the first substrate, a heat pipe and three resilient flakes, i.e., a first resilient flake, a second resilient flake and a third resilient flake. The heat pipe connects with the first and second substrates. The first resilient flake forms a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate. The second resilient flake forms a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate. The third resilient flake includes a locking portion located at a middle and two securing portion at two opposite ends thereof. The two securing portions of the third resilient flake connect with the first and second substrates, respectively.07-22-2010
20100163213ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE - A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.07-01-2010
20100170661HEAT PIPE WITH AXIAL AND LATERAL FLEXIBILITY - A flexible heat pipe is disclosed for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe comprises a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.07-08-2010
20110174467HEAT EXCHANGER, METHOD FOR OPERATING THE HEAT EXCHANGER AND USE OF THE HEAT EXCHANGER IN AN AIR-CONDITIONING SYSTEM - In a heat exchanger having a bank of capillary tubes, in which a fluid to be cooled and/or heated is conducted through capillary tubes and in which the capillary tubes are wetted, in concurrent flow with the fluid, by water or by a hygroscopic sorption solution, and in which air flows around said capillary tubes in countercurrent flow in relation to the fluid, the bank of capillary tubes is composed of at least one tube mat, the capillary tubes of which have a hydrophilic or water-dispersing surface with a contact angle of less than 20°.07-21-2011
20110174466FLAT HEAT PIPE - An exemplary flat heat pipe with an evaporator section and a condenser section includes a casing, and a first wick structure and a second wick structure in the casing. The casing defines a first vapor channel within the evaporator section. The first wick structure contacts an inner surface of the casing at the condenser section. The first wick structure includes a contact portion in contact with the inner surface of the casing, and an isolated portion from the inner surface of the casing. The isolated portion and the inner surface of the casing cooperatively define therebetween a second vapor channel in communication with the first vapor channel. The second wick structure contacts the inner surface of the casing at the evaporator section. The second wick structure joins the first wick structure at a joint between the evaporator section and the condenser section.07-21-2011
20110174465FLAT HEAT PIPE WITH VAPOR CHANNEL - An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.07-21-2011
20110174464FLAT HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary flat heat pipe with an evaporator section and a condenser section at opposite ends thereof includes a hollow flat casing, a first wick structure and a solid and sintered second wick structure. The first wick structure includes a top plate and a bottom plate opposite to the top plate. The first wick structure is received in the casing, and extends from the evaporator section to the condenser section. The second wick structure is disposed in the casing at the evaporator section. The second wick structure contacts the top and bottom plates and joins the first wick structure. A method for manufacturing the heat pipe is also provided.07-21-2011
20130213612HEAT PIPE HEAT DISSIPATION STRUCTURE - A heat pipe heat dissipation structure includes a main body and at least one first capillary structure. The main body has a first inner side, a second inner side, a third inner side, a fourth inner side and at least one chamber filled with a working fluid. The first capillary structure is disposed in the chamber. The first capillary structure includes a first section disposed on the first inner side and a second section extending from two sides of the first section along the adjacent third and fourth inner sides. The first section has a thickness larger than that of the second section. The heat pipe heat dissipation structure has better heat transfer efficiency.08-22-2013
20100186930Thermal module - A thermal module includes a radiating fin assembly having first heat conducting sections located at a lower middle portion thereof, second heat conducting sections located adjacent to outer sides of the first heat conducting sections, first heat dissipating sections located closer to upper outer portions of the radiating fin assembly, and second heat dissipating sections located adjacent to inner sides of the first heat dissipating sections; first heat pipes each having two ends separately inserted into the first heat conducting and dissipating sections; and second heat pipes each having two ends separately inserted into the second heat conducting and dissipating sections. Therefore, heat source can be transmitted by the first heat pipes from the high-temperature lower middle portion of the radiating fin assembly to the low-temperature upper outer portions of the radiating fin assembly and quickly dissipated into ambient air without stagnating in the middle of the radiating fin assembly.07-29-2010
20100212868Assembled configuration of cooling fins and heat pipes - An assembled configuration of cooling fins and heat pipes facilitates filling of a thermal interface material between contact surfaces of the cooling fins and the heat pipes and enhances stability of the cooling fins. The configuration is characterized in that each of the juxtaposed cooling fins is formed at an end thereof contacting the heat pipes with a bent portion having at least two sections so as to define an accommodating space for the thermal interface material and an extending section, wherein the accommodating space can be sufficiently filled with the thermal interface material and the extending section can be nestingly overlapped by an adjacent cooling fin, so as to effectively prevent the thermal interface material from leaking out and enhance stability of the assembled cooling fins.08-26-2010
20100155033THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS - A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.06-24-2010
20100258277HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.10-14-2010
20100258278FLAT PLATE TYPE MICRO HEAT SPREADING DEVICE - A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.10-14-2010
20100175855Heat dissipating structure and method of manufacturing same - A heat dissipating structure and a method of manufacturing same is disclosed. The heat dissipating structure includes a base being formed on one face with lower pipe-receiving grooves, a cover being formed on one face facing to the base with upper pipe-receiving grooves, and heat pipes disposed between the base and the cover. A heat-conducting substance is applied in the lower and upper pipe-receiving grooves, whereby when the cover is tightly pushed against the base, the heat pipes are tightly fitted in and between the lower and the upper pipe-receiving grooves. Radiating fins can be provided on the cover. When the base is attached at another face to an electronic device, heat produced by the electronic device can be effectively transferred to and dissipated from the heat dissipating structure, which has tightly connected base, heat pipes, and cover to ensure high heat dissipating effect without the need of tin soldering.07-15-2010
20120031589RADIATING FIN, THERMAL MODULE FORMED WITH THE SAME, AND METHOD OF MANUFACTURING THE SAME - A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe.02-09-2012
20100193161Heat Pipe Body Assembly Having Wick Structure - A wick structure of a heat pipe is constituted of woven meshes and fibers. The wick structure is constituted of two stacked layers of woven meshes and a plurality of fibers. The two woven meshes are adhered to the inner wall face of the heat pipe body, and each fiber is sandwiched between the two woven meshes and located on an axial stripe-like region within the heat pipe body. With a pulling rod, the woven meshes and the fibers can be driven to penetrate through the heat pipe body, so that the wick structure can be smoothly disposed into the heat pipe body.08-05-2010
20100193160COOLING SYSTEM FOR A VARIABLE VACUUM CAPACITOR - In a cooling system for a variable vacuum capacitor, a liquid is arranged inside a cooling reservoir, a first part of the reservoir is designed to absorb heat energy from first bellows of the variable vacuum capacitor, the first bellows being responsible for transporting electrical energy to a second electrode of the variable vacuum capacitor, a second part of the reservoir is designed to dissipate heat energy towards a cooling circuit, and heat pipes are arranged between the first part of the reservoir and the second part of the reservoir.08-05-2010
20100155031HEAT PIPE AND METHOD OF MAKING THE SAME - A heat pipe includes a casing, a main wick structure received in the casing and attached to an inner surface of the casing, a multi-layered auxiliary wick structure received in the main wick structure and a working fluid contained in the casing and saturating the main wick structure and the auxiliary wick structure. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel therebetween. The auxiliary wick structure extends along a longitudinal direction of the casing and defines a liquid channel therein. The auxiliary wick structure is formed by a plurality of layers radially stacked on each other, such that each outer layer is attached around an adjacent inner layer.06-24-2010
20100212871HEAT PIPE AND MANUFACTURING METHOD THEREOF - A heat pipe includes a sealed hollow casing, a wick structure lining an inner surface of the casing and a working medium contained in an interior of the casing. The casing includes an elongated main body having an elongated opening extending axially in the main body and a transparent cover fixed onto the main body and sealing the opening of the main body. The wick structure is provided by only lining an inner surface of the main body of the casing.08-26-2010
20100212870FLAT HEAT PIPE - A flat heat pipe includes a casing and a wick structure received in the casing. The casing has a first lateral portion and a second lateral portion. Each of the first lateral portion and the second lateral portion has a C-shape configuration, and the second lateral portion has an opening facing an opening of the first lateral portion. The wick structure is attached to an inner surface of only one of the first and lateral portions of the casing. The inner surface of the other of the first and second lateral portions without the wick structure attached thereto defines a first vapor channel, and an inner surface of the wick structure defines a second vapor channel. The first vapor channel has a height greater than the second vapor channel.08-26-2010
20100276118COOLING DEVICE FOR ILLUMINATION SOURCE - An exemplary cooling device includes a hollow cylinder and a number of fins. The hollow cylinder has a top end and an opposite bottom end. The fins are evenly distributed on an outer circumferentila surface of the hollow cylinder along radial directions. Each of the fins includes a first portion, a middle portion, and a second portion. A radial width of each fin measured along a direction perpendicular to a center axis of the hollow cylinder gradually decreases along each of the first and second portions toward the middle portion.11-04-2010
20130126133HEAT PIPE STRUCTURE - A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber.05-23-2013
20100243210CAPILLARY ASSISTED LOOP THERMOSIPHON APPARATUS - A capillary assisted loop thermosiphon apparatus (09-30-2010
20100243212NON-FLAT VAPOR CHAMBER WITH STIFFENING PLATE - A non-flat vapor chamber includes a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid. The casing includes a lower case plate and an upper case plate sealed with the lower case plate. The lower case plate has a partial area protruded downward to form a chamber and a retaining portion formed within the chamber. A capillary tissue is installed on internal walls of the upper and lower case plates. The stiffening plate with a through hole is installed onto the retaining portion, and the casing contains a support structure. Upper and lower ends of the support structure abut the capillary tissue and the stiffening plate. A working fluid is filled into the casing, such that a support action is provided by pressing the stiffening plate at the retaining portion for stiffening the upper case plate of a vacuumed vapor chamber.09-30-2010
20100252239HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.10-07-2010
20100139893HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader includes a base with a cavity defined therein and a cover mounted on the base to thereby hermetically seal the cavity of the base. A predetermined quantity of working liquid is contained in the cavity. The heat spreader further includes a first wick structure formed on an inner surface of the base, a second wick structure formed on an inner surface of the cover and a third wick structure embedded in the first wick structure. The first and second wick structures are made of metal mesh, carbon nanotube array or bundle of fibers and the third wick structure is made of sintered metal powder. In use, the third wick structure is positioned corresponding to a heat generating electronic component.06-10-2010
20100200200HEAT-TRANSPORT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE - A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.08-12-2010
20080264611Heat plate - A heat plate mainly includes a hollow body and a plurality of caps. The hollow body is fabricated integrally by aluminum extrusion and has a hollow chamber inside. The hollow chamber has an inner side with a plurality of angular strips formed thereon to enhance heat dissipation efficiency and a plurality of spacing ribs to divide the hollow chamber into a plurality of housing space to hold a liquid to increase the heat dissipation efficiency. The hollow body has one surface with a plurality of sliding tracks formed thereon, a latch flute on the left side and right side to wedge in the sliding tracks of another heat plate to enhance the heat dissipation efficiency. The hollow body has another surface with a PCB circuit formed thereon. Electronic elements may be soldered on the PCB circuit to achieve optimal heat dissipation efficiency.10-30-2008
20110056659Heat Dissipating Module - A heat dissipating module includes a housing having a bottom wall and a peripheral wall interconnected to a periphery of the bottom wall. The peripheral wall defines a compartment and includes an air inlet in communication with the compartment and an air outlet in communication with the compartment. A stator is received in the compartment of the housing. An impeller is coupled to the stator. A lid can be mounted to the air inlet side of the housing. A plurality of rows of fins is formed on at least one heat conducting section of at least one of the peripheral wall, the bottom wall, and the lid and is located in the compartment.03-10-2011
20110056658HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat has an integral structure and combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.03-10-2011
20110056657FIXING ASSEMBLY FOR HEAT-ABSORBING SURFACES OF JUXTAPOSED HEAT PIPES AND HEAT SINK HAVING THE SAME - A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.03-10-2011
20110100610Heat Dissipating Device And Heat Dissipating Fin - A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.05-05-2011
20110100606HEAT DISSIPATING CAVITY - A heat dissipating cavity includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and temperature equalizing elements including heat pipes and heat expansion plates, which can be used individually or collectively. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the temperature equalizing elements, wherefrom effectively and evenly conducted to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of temperature equalizing elements increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.05-05-2011
20090277615HEAT DISSIPATION DEVICE - A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a third fin unit. The third fin unit is located on the substrate, the second fin unit is located on the third fin unit, and the first fin unit is located on the first fin unit. A receiving space is defined in the second and third fin unit. The fan is received in the receiving space and spaced apart from the fin assembly.11-12-2009
20090250196RELIEVED-CHANNEL, BONDED HEAT EXCHANGER - A panel assembly for exchanging heat with an ambient environment maintains minimal temperature differential by virtue of operation as a heat pipe apparatus. Panels of a composite material having excellent structural strength and structural stiffness but comparatively modest thermal conductivity are machined as mirror images of one another. Two orthogonal arrays of parallel channels are machined in the faces of two panels, each intersection of channels forming and bounded by pedestals having a lower, broader base with a narrower upper portion extending from a shoulder of the base portion of the pedestals. The pedestals, in turn, form the bounds of the channels, each having a deeper and a narrower aspect extending along the bases of all the pedestals. Channels have a broader aspect extending along near the tops of the pedestals.10-08-2009
20090166003HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.07-02-2009
20080245511Flat heat pipe - A flat heat pipe including: a tubular member having two sealed ends, a capillary wick being disposed at the internal sidewall of said tubular member and a liquid contained in said tubular member. Said tubular member defines a flat section and a thicker section at least. By the way, the present invention can solve the problem of the accumulated water inside the heat pipe of prior art and keeps a good efficiency of uniform temperature, and the radiation efficiency is better then the heat pipe of prior art.10-09-2008
20090071635Thermal spreader for simultaneously enhancing capillary effect and structural strength - A thermal spreader comprises: a casing having a first side contacted with a heat source and a second side secured with a heat sink, and having a vapor chamber defined in an interior in the casing; and a crosslinking capillary lattice retained in the casing and occupying the vapor chamber in the casing, whereby upon evacuation to form vacuum in the vapor chamber and filling of a vaporizable working fluid in the vapor chamber, the working fluid will be repeatedly vaporized and condensed through the crosslinking capillary lattice to absorb and remove heat from the first side of the casing and to dissipate heat outwardly from the second side of the casing.03-19-2009
20090071633HEAT PIPE STRUCTURE - The heat pipe structure includes a pipe body, hollow groove and capillary tissue. The pipe body contains a heat-conducting end and a radiating end. The capillary tissue of a predefined thickness is adapted to an inner wall of the pipe body. The inner surface of capillary tissue is located correspondingly to the section of the heat-conducting end, where a portion with greater thickness is shaped from another section of the capillary tissue. The portion is of single side, a plurality of sides or annular structure. Thus, the heat conduction efficiency of the heat-conducting end greatly improves. The non heat-conducting sections of the capillary tissue remain still with respect to thickness, and the guide space expands to facilitate guiding of gaseous working fluid to the radiating end, thus achieving an optimum heat radiation effect.03-19-2009
20100307720HEAT PIPE - A heat pipe includes a casing and a supporting member. The casing is made of titanium and has a first end and a second end at two opposite sides thereof. The first end defines a receiving space therein. The supporting member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The supporting member is received in the receiving space of the first end of the casing. The first end of the casing and the supporting member are integrally cramped and sealed.12-09-2010
20130133863Co-Extruded Microchannel Heat Pipes - A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.05-30-2013
20100300655HEAT PIPE - A heat pipe includes a tube body and a sealing member. The tube body is made of titanium and has a sealed end and an open end at two opposite ends of the tube body. The sealing member is attached to the open end and seals the open end of the tube body. The sealing member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The sealing member seals the open end.12-02-2010
20100300656 HEAT TRANSFER DEVICE COMBINED A FLATTEN LOOP HEAT PIPE AND A VAPOR CHAMBER - This invention declares a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe evaporator. Metal mesh is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. Working fluid is filled into the vapor chamber. Besides the advanced heat transfer characteristics of the flatten loop heat pipe, this invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage of higher density of integration and higher running speed. Based on the combination of the loop heat pipe and the vapor chamber, changing the cooling method, using both the temperature control fins and the condenser fins, this new device could increase the temperature control accuracy and the flexibility.12-02-2010
20110127012HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a heat pipe extending through the heat sink. The heat sink includes a plurality of fins overlapped with each other. An air passage channel is defined between every two adjacent fins for an airflow flowing therethrough. Each of the fins defines a through hole therein for extension of the heat pipe. Each of the fins includes a main plate and an air guiding member formed on the main plate. The air guiding member includes a curved bar. The curved bar extends slantwise on the main plate to a back side of the heat pipe for guiding the airflow to the back side of the heat pipe.06-02-2011
20110127013HEAT-RADIATING COMPONENT AND METHOD OF MANUFACTURING THE SAME - A heat-radiating component includes a wick layer formed on an inner wall of a hermetically sealed container made of metal and a working fluid encapsulated in the hermetically sealed container. In the wick layer, micro carbon fiber is mixed into metal powder. In one aspect, the wick layer is a structure combined by a first wick and a second wick, the first wick being formed of sintered metal powder, and the second wick being a plating layer into which micro carbon fiber is mixed so as to partially fill air space inside the first wick while covering a surface of the first wick. The first wick is preferably a body sintered copper powder, and the second wick is preferably made of a copper plating layer into which carbon nanotube or carbon nanofiber is mixed.06-02-2011
20100319881HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - The heat spreader includes a flattened casing which defines a vapor chamber therein, a wick structure formed on an inner face of the casing and a supporting frame received in the vapor chamber. The supporting frame includes a plurality of supporting wires. Each of the supporting wires has a column-spiral configuration.12-23-2010
20100212869HEAT DISSIPATION DEVICE - A heat dissipation device for removing heat from a heat-generating component, includes a base and a fin group arranged on a top of the base. The base includes a conducting plate, a retaining bracket attached to a bottom surface of the conducting plate, a plurality of heat pipes located between the conducting plate and the retaining bracket and a heat absorbing block embedded in the retraining bracket. The heat pipes have first portions arranged side by side closely and sandwiched between the conducting plate and the retaining bracket and second portions bent from the first portions away from the retaining bracket in a divergent manner. The heat absorbing block has a top surface in contact with the heat pipes and a bottom surface for contacting with the heat generating component.08-26-2010
20110011565PLATE-TYPE HEAT PIPE - A plate-type heat pipe includes a container, a wick structure and a plurality of supporting plates. The wick structure is adhered to an inner surface of the container. The supporting plates are received in the container and abut against opposite sidewalls of the container. Each of the supporting plates includes a connecting plate and a plurality of protruded portions extending from the connecting portion. A number of through holes are defined in the protruded portion. The supporting plates are arranged in tiers in a manner such that the protrude portions of a lower supporting plate abut against the connecting portion of an upper supporting plate, and the through holes of the supporting plates communicate with each other.01-20-2011
20110005725PLATE TYPE HEAT PIPE AND HEAT SINK USING THE SAME - A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.01-13-2011
20120031588Structure of heat plate - A structure of heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a plurality of capillary layers arranged in the accommodation chamber in such a way that the capillary layers are set on a common horizontal plane and the capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved.02-09-2012
20110024090HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.02-03-2011
20110024085HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - A heat pipe includes a metallic pipe, a wick structure and a working fluid. The interior of the metallic pipe has a sealing chamber, and is formed into an evaporating section, an adiabatic section and a condensing section along its lengthwise direction. The wick structure comprises a first wick structure and two elongate second wick structures connected to the first wick structure. The first wick structure is adhered to the inner wall of the evaporating section. The two second wick structures are separated from each other and adhered to the inner walls of the evaporating section, the adiabatic section and the condensing section. A gas channel is formed between the two second wick structures, and has a smooth surface. The working fluid is filled in the sealed chamber. By this arrangement, the space for the gas channel can be enlarged, thereby accelerating the flowing speed of the internal gas and enhancing the heat-conducting efficiency of the heat pipe.02-03-2011
20110024086Diffusion Bonding Circuit Submount Directly To Vapor Chamber - A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber, or other type of heat spreader, is provided that has a substantially flat top copper surface and a substantially flat bottom copper surface. A ceramic submount is also provided, where the submount has a top copper metallization layer patterned for connection to electrodes of a heat-producing die, and where the submount has a bottom copper metallization layer. Prior to a working fluid being introduced into the vapor chamber, and prior to a die being mounted on the submount, the top copper surface of the vapor chamber is diffusion bonded to the bottom copper metallization layer of the ceramic submount under heat and pressure. The working fluid is then introduced into the vapor chamber, and the chamber is sealed. Dies are then mounted on the submount. The bottom of the vapor chamber is then affixed over a heat sink.02-03-2011
20110024089HEAT SINK HAVING HEAT-DISSIPATING FINS OF LARGE AREA AND METHOD FOR MANUFACTURING THE SAME - A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.02-03-2011
20110024087HEAT-DISSIPATING FINS, LARGE-AREA HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.02-03-2011
20110030922BOARD-SHAPED HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.02-10-2011
20110030923THERMAL MODULE - A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.02-10-2011
20110030925APPARATUS AND METHOD FOR THERMAL MANAGEMENT USING VAPOR CHAMBER - An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the cantilevers and the islands. Heat from the islands vaporizes the fluid filling the spaces between the cantilevers and the islands to transfer the heat away from the islands while driving the cantilevers into oscillation. The apparatus may also include a casing configured to surround the islands and the fluidic network to create a vapor chamber, where the vapor chamber is configured to retain the vaporized fluid. The islands and the fluidic network could be formed in a single substrate, or the islands could be separate and attached together by a binder located within the channels of the fluidic network.02-10-2011
20110030924HEAT SINK WITH HEAT PIPES AND METHOD FOR MANUFACTURING THE SAME - A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.02-10-2011
20120145358THINNED FLAT PLATE HEAT PIPE FABRICATED BY EXTRUSION - Disclosed is a thinned flat plate heat pipe fabricated by extrusion and provides a thinned flat plate heat pipe including: a body part having a flat plate shape; a through-hole formed in the longitudinal direction of the body part; and one or more grooves formed on at least one side of an inner wall of the through-hole and allowing a working fluid to flow. According to exemplary embodiments of the present disclosure, a relative wide steam flowing space can be ensured and an interface friction flowing resistance between gas and liquid can be further reduced through portions without the groove and the thickness of the thinned flat plate heat pipe can be maximally reduced, a thin-film type cooling element having a simple structure and a low manufacturing cost can be fabricated.06-14-2012
20120241134HEAT DISSIPATION DEVICE WITH GUIDING LINE AND SOLDERED HEAT PIPE - A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.09-27-2012
20100155034HEAT PIPE AND COOLING DEVICE USED IN CRYOTECHNOLOGY - The invention relates to a heat pipe or cold pipe for cryotechnology, with a casing pipe and with a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with a heat transfer medium suitable for cryogenics. So that superconductive elements or components can be cooled to the required transition temperature with high operating reliability and efficiency in a short cooling time, in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide condensed and/or liquid heat transfer medium to the surface area. The invention also relates to a cooling device having a plurality of cold pipes.06-24-2010
20100132924COOLING DEVICE FOR ELECTRONIC COMPONENTS - A cooling device (06-03-2010
20110017430THERMAL MODULE - A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.01-27-2011
20110083829HEAT-DISSIPATING STRUCTURE WITH HIGH HEAT-DISSIPATING EFFICIENCY AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a heat-dissipating structure with high heat-dissipating efficiency, includes the following steps: providing a heat-dissipating casing having a hollow heat-dissipating body that has at least two ends; closing one end of the hollow heat-dissipating body; pouring work liquid from other end of the hollow heat-dissipating body into an inner portion of the hollow heat-dissipating body; cooling the work liquid from the liquid state to the solid state by an external cooling medium; extracting air from the hollow heat-dissipating body; and then closing the other end of the hollow heat-dissipating body to form an evacuated hollow heat-dissipating body.04-14-2011
20090032227Flexible Graphite Thermal Management Devices - The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure inside a shell. In certain preferred embodiments, the wick structure is composed of a mass of expanded graphite. In a another embodiment, the shell of the device includes flexible graphite and an optional wick structure. In certain preferred embodiments, the flexible graphite shell is fluid impermeable. The invention further includes methods of making the aforementioned thermal management devices.02-05-2009
20110240263Enhanced Electronic Cooling by an Inner Fin Structure in a Vapor Chamber - A vapor chamber cooling apparatus to cool an electronic component includes a sealed, hollow metal chamber; a working fluid disposed within the metal chamber; a wick structure disposed along an inner surface of the metal chamber; and an inner fin structure disposed within with the metal chamber. An area of the metal chamber is in thermal contact with the electronic component. The inner fin structure is in thermal contact with the metal chamber. A method of manufacturing a vapor chamber cooling apparatus to cool an electronic component includes providing a metal chamber, wherein an area of the metal chamber thermally contacts the electronic component; disposing a wick structure along an inner surface of the metal chamber; disposing a working fluid within the metal chamber; and disposing an inner fin structure within the metal chamber and in thermal contact with the metal chamber.10-06-2011
20110240264PLATE-TYPE HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a spherical supporting. The evaporating plate engages with the condensing plate to define a hermetic container. Working fluid is contained in the container. The supporting portion in the container is sandwiched between the condensing plate and the evaporating plate and abuts against the condensing plate and the evaporating plate.10-06-2011
20110083830HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.04-14-2011
20090218077Air-Conditioning System And Controlling Method Thereof - The present invention discloses an air conditioning system comprises a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part, wherein a volume of a first cylinder of the first compressing part is different from a volume of a second cylinder of the second compressing part.09-03-2009
20100059207FIN, THERMAL MODULE, AND METHOD FOR ASSEMBLING THE SAME - This invention provides a method for assembling the thermal module. According to the invention, the fin can be combined with a heat pipe and a joint material to form the thermal module. The fin includes a main body having a through hole and an feeding hole communicating with each other. The heat pipe passes through the through hole. The joint material is injected into the feeding hole to fill a clearance between the heat pipe and the inner wall of the through hole. In addition, when the fin is combined with the heat pipe, the feeding hole is above the through hole, the joint material flows downward along the clearance, and the clearance gradually narrows along a flowing direction of the joint material.03-11-2010
20110146954HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a fan having fixing cylinders, a heat sink having a supporting board, and fasteners fixing the fan to the heat sink. Each fastener includes a screwing pole, a first elastic member and a second elastic member encircling the screwing pole, and a fastening cylinder engaging with the screwing pole. Each screwing pole includes a head, a shaft extending coaxially downwardly from the head, and a post extending coaxially downwardly from the shaft. For each fastener, the screwing pole extends through a corresponding fixing cylinder of the fan, the first elastic member is compressed between the head and the corresponding fixing cylinder, the second elastic member is compressed between the corresponding fixing cylinder and the fastening cylinder, and the post protrudes from the fastening cylinder and is engaged with the supporting board.06-23-2011
20110100609HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a centrifugal fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second channel includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe.05-05-2011
20110100608FLAT HEAT PIPE WITH HOOK CAPILLARY TISSUE - A flat heat pipe with hook capillary tissue includes a metal pipe, a capillary tissue and working fluid. The metal pipe is in a flat shape and formed by enclosing two opposite panels and two opposite sidewalls, and a hollow chamber is formed in the metal pipe. The capillary tissue is in the shape of a long strip, and includes having a hook formed at an end of the capillary tissue, and the capillary tissue is contained in the hollow chamber and attached onto one of the sidewalls and abutted between two sidewalls, and a working fluid is filled into the hollow chamber and adhered to the capillary tissue, so that the stability of fixing the capillary tissue into the metal pipe can be improved, and the retention quantity of the working fluid at an end of the pipe can be maintained.05-05-2011
20110100605Cooling device and system - A novel heat pipe and a cooling system that employs the heat pipe are disclosed. The heat pipe has a configuration in the form of a nail that includes a flattened upper section and an elongated lower, section. The heat pipe may be in the form of nail shape or a continuous bar that includes a flattened upper section and an elongated section. The heat pipe may be employed together with a thermoelectric cooling module and a heat sink to provide a cooling device. The cooling device may be employed with a container to provide a cooling system.05-05-2011
20110100607HEAT DISSIPATING CAVITY OF LOOPED HEAT PIPE - A heat dissipating cavity of looped heat pipe structure includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and looped heat pipes. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the looped heat pipes, wherefrom to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of looped heat pipes increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.05-05-2011
20110067843Heat exchange device made of polymeric material - The invention refers to a heat exchange pipe comprising a capillary pulsating heat pipe (03-24-2011
20110048682HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat pipe and a heat sink. The heat sink defines a through hole with a diameter slightly smaller then an outer diameter of the heat pipe. The heat pipe is fixedly engaging in the through hole of the heat sink via interference fit. The heat pipe includes a tube defining an interspace therein, a first wick formed on an inner surface of the tube, working fluid received in the interspace of the tube, and a retaining structure. The retaining structure is received in the interspace of the tube and abuts the first wick of the tube to enhance a rigidity of the tube. A second wick is formed on an outer surface of the retaining structure and connects with the first wick of the tube.03-03-2011
20110048680HEAT DISSIPATION MODULE - A heat dissipation module includes a centrifugal fan, a fin assembly and a heat pipe. The centrifugal fan defines an air outlet and a cutout at the air outlet of the centrifugal fan. The fin assembly includes a plurality of fins arranged together and is located at the air outlet of the centrifugal fan. The fin assembly defines a first air inlet communicating with the air outlet of the centrifugal fan. The fin assembly forms a protruding portion being located at the cutout of the centrifugal fan. The protruding portion defines a second air inlet communicating with the air outlet of the centrifugal fan. The heat pipe is thermally attached to the fin assembly.03-03-2011
20110048679HEAT DISSIPATION DEVICE - A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together.03-03-2011
20110048678HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.03-03-2011
20110000646LOOP HEAT PIPE - A loop heat pipe includes an evaporator and a tube hermetically connecting with the evaporator. The evaporator includes a metallic container and a wick structure disposed in an inner surface of the container. The wick structure includes a first wick portion thermally contacting the whole inner surface of the container and a second wick portion enclosed by the first wick structure and contacting with the first wick portion. A number of channels are defined between the first and second wick portions for receiving vaporized working medium. The tube communicates with the channels of the evaporator so that the vaporized working medium can flow from the channels into the tube.01-06-2011
20100263835Heat pipe - A heat pipe includes a tube, a capillary structure, and a working fluid. The tube seals a space and has an evaporating portion, a condensing portion, and a heat insulation portion connected between the evaporating portion and the condensing portion. An opening area defined by one of the condensing portion and the evaporating portion is larger than an opening area defined by the heat insulation portion. The capillary structure is disposed on an inner surface of the tube. The working fluid is disposed in the tube.10-21-2010
20100258276HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.10-14-2010
20100252240HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group on the base, a plurality of heat pipes and a covering fin mounted on a top of the fin group. The base includes a frame and a conducting plate engaging with a bottom of a central portion of the frame. The fin group includes a plurality of fins spaced from each other and horizontally stacked on the base. The heat pipes have evaporating sections sandwiched between the conducting plate and the base and condensing sections extending upwardly from the frame and through the fin group. The condensing sections have top ends located above a top fin of the fin group. The covering fin covers the upper ends of the condensing sections and has a plurality of latching legs extending downwardly therefrom to engage with the top fin.10-07-2010
20100243214FLAT PLATE TYPE MICRO HEAT TRANSPORT DEVICE - There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of which includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transportring heat generated by a heat source.09-30-2010
20110209855COOLING SYSTEM FOR COMPUTER COMPONENTS - A component cooling system comprising a heat spreader 09-01-2011
20110146956HIGH PERFORMANCE WICK - A wicking apparatus includes a composite condenser membrane comprising a substrate layer, a vapor inlet end, a liquid discharge end, a plurality of cavities disposed in the substrate layer fluidly coupling the vapor inlet end to the liquid discharge end, and a nanoporous filler material disposed within the plurality of cavities. The nanoporous filler material has a first plurality of open pores with a maximum diameter in the range of 0.2 to 200 nanometers. The first end of the liquid conduit is fluidly coupled to the liquid discharge end of the composite condenser membrane. The wicking apparatus further includes a wick composite evaporator membrane comprising a substrate layer, a liquid inlet end, a vapor discharge end, a plurality of cavities disposed in the substrate layer fluidly coupling the liquid inlet end to the second end of the liquid conduit, and a nanoporous filler material disposed within the plurality of cavities.06-23-2011
20110146953HEAT SINK - A heat sink comprises a fin of the heat sink and a cooling set located on the fin of the heat sink. The fin of the heat sink includes a heat conduction portion and a plurality of cooling sheets extended integrally from the heat conduction portion. The heat conduction portion is hollow to form a housing space with at least one opening. The cooling set includes a butting member and a bracing member that are held in the housing space through the opening. The bracing member supports the butting member in the housing space to butt the heat conduction portion. The housing space also holds a cooling liquid and is sealed by a lid on the opening. The integrated cooling sheets and heat conduction portion can improve cooling efficiency and rapidly conduct a greater amount of heat to perform cooling.06-23-2011
20110209853GEOMETRICALLY REORIENTED LOW-PROFILE PHASE PLANE HEAT PIPES - A cooling system for removing heat from at least one heat generating component with a first low-profile phase plane heat pipe having a geometrically reoriented surface adapted for receiving heat from the at least one heat generating component along a first section of the geometrically reoriented surface, and having a plurality of micro-tubes disposed therein. A heat transfer fluid is contained with the plurality of micro-tubes and a second section of the geometrically reoriented heat pipe surface is disposed in a position geometrically offset from the first section.09-01-2011
20130168052HEAT PIPE AND COMPOSITION OF CAPILLARY WICK THEREOF - The present invention provides a heat pipe and a composition of a capillary wick thereof. The heat pipe includes a main body, a capillary wick and a working fluid. The main body has an inner wall surface. The capillary wick is combined on the inner wall surface. The capillary wick includes a first capillary powder of 30 weight percent and a second capillary powder of 70 weight percent. The size of particles of the first capillary powder is smaller than that of the second capillary powder. The working fluid is filled in the main body of the heat pipe. The first capillary powder and the second capillary powder are mixed to each other uniformly to be sintered on the inner wall surface of the heat pipe. By this arrangement, the heat pipe can achieve the maximum performance to remove the heat generated by an electronic element rapidly.07-04-2013
20130168056HEAT-DISSIPATING DEVICE - A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly.07-04-2013
20110042046INTEGRATED COOLANT CIRCUIT ARRANGEMENT, OPERATING METHOD AND PRODUCTION METHOD - An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is arranged at a main area of a substrate. The component is arranged in the substrate or is isolated from the substrate by an electrically insulating region. Main channels are formed in the substrate and arranged along the main area. Each main channel is completely surrounded by the substrate transversely with respect to a longitudinal axis. Transverse channels are arranged transversely with respect to the main channels. Each transverse channel opens into at least one main channel. More than about ten transverse channels open into a main channel.02-24-2011
20110042045CAPILLARY ASSISTED LOOP THERMOSIPHON APPARATUS - A capillary assisted loop thermosiphon apparatus (02-24-2011
20110042044PLATE-TYPE HEAT PIPE - A plate-type heat pipe includes a top cover, a bottom cover, a first wick structure and a second wick structure. The bottom cover hermetically contacts with the top cover to form a container. A plurality of working fluid is contained in the container. The bottom cover has a heat absorbing plate. The first wick structure is adhered to inner surfaces of the top and bottom covers. The second wick structure is sandwiched between the top and bottom covers. Top and bottom ends of the second wick structure abut against the inner surface of the top cover and a central portion of the heat absorbing plate of the bottom cover. An area of the bottom end is smaller than that of the heat absorbing plate.02-24-2011
20110042043HEAT DISSIPATION MODULE - A heat dissipation module includes a heat pipe having a condensing section, a centrifugal fan defining an air outlet and a fin assembly. The fin assembly includes a plurality of fins stacked together and is thermally attached to the condensing section of the heat pipe. The fin assembly is located at the air outlet of the centrifugal fan. At least some fins of the fin assembly have a height decreasing along the condensing section of the heat pipe. The fin assembly defines a spared space at a bottom side of the fin assembly corresponding to the at least some fins.02-24-2011
20110042042RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT - Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.02-24-2011
20110277967Liquid cooled condensers for loop heat pipe like enclosure cooling - A cooling device includes an enclosure, an external heat rejection device, a primary cooling system including a loop heat pipe like device. The LHPL device includes, an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, a compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway. The secondary cooling system including a secondary coolant, the secondary cooling system cooling a secondary heat rejecting component, wherein the secondary heat rejecting component is one of the plurality of other components.11-17-2011
20110036545HIGH-PERFORMANCE HEAT SINK - A high-performance heat sink includes a set of first radiation fins each having an abutment portion, two radiation fins extending from two lateral sides of the abutment portion, and upright pins extending from each radiation fin portion; a fastener that fastens the abutment portions of the first radiation fins together such that the radiation fins are radially extended out; second radiation fins fastened to the upright pins of the first radiation fins and arranged at different elevations; and thermal pipes fastened to the bottom side of the abutment portions of the first radiation fins, each thermal pipe having two distal ends respectively fastened to the two distal ends of each second radiation fin.02-17-2011
20120241132NON-BASE BLOCK HEAT SINK - A non-bottom block heat sink includes a radiation module formed of a rack of radiation fins, each radiation fin having a plurality of locating notches located on one peripheral edge thereof and a supporting rib disposed between each two adjacent locating notches, and a plurality of heat pipes each having heat receiving end press-fitted into the locating notches of the radiation fins and engaged with the supporting ribs and peripherally abutted against one another in flush the associating peripheral edge of each radiation fin and a heat discharging end extended from the heat receiving end and fastenable to the radiation fins or an external radiation fin module.09-27-2012
20110253345HEAT TRANSPORTATION DEVICE PRODUCTION METHOD AND HEAT TRANSPORTATION DEVICE - [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible.10-20-2011
20110005728HEAT DISSIPATION MODULE - A heat dissipation module comprises a heat pipe forming a condensing section, and a first fin unit and a second fin unit contacting with the condensing section of the heat pipe. The first and second fin units are located neighboring to each other and have different heights. The first and second fin units each comprise a plurality of fins stacked together. A protruding member protrudes from one of the fins of one of the first and second fin units to abut a corresponding neighboring one of the fins of the other one of the first and second fin units, to thereby separate the first fin unit and the second fin unit to limit relative movement of the first fin unit and the second fin unit in a protruding direction of the protruding member.01-13-2011
20110259555MICRO VAPOR CHAMBER - A micro vapor chamber includes: a first plate body having a first side and a second side, the second side having at least one condensation section; a second plate body having a third side and a fourth side, the third side being provided with at least one evaporation section and multiple flow collection sections, the third side being correspondingly mated with the second side of the first plate body, the fourth side contacting with at least one heat source; and a mesh structure body disposed between the first plate body and the second plate body. The mesh structure body is a capillary structure having multiple meshes and a first face and a second face. The first and second faces of the mesh structure body are mated with the condensation section and the evaporation section and the flow collection sections respectively to together define multiple flow ways.10-27-2011
20100319884SELF-EXCITED OSCILLATING FLOW HEAT PIPE - A self-excited oscillating flow heat pipe includes a heating unit having a wick therein; a cooling unit filled with a working fluid; a connection channel which rectilinearly connects the heating unit with the cooling unit, and has a smaller channel cross-sectional area than the channel cross-sectional area of the heating unit; a liquid plug protruding into the connection channel from the cooling unit and containing the working fluid; and a vapor plug in the heating unit containing the vaporized working fluid. The liquid plug oscillates self-excitedly in the connection channel.12-23-2010
20100319880HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe, a base and a heat sink. The heat pipe includes an evaporating section and a condensing section. The evaporating section includes a flat outside surface at one side thereof. The base includes a top surface and an opposite bottom surface. The base defines a groove at the bottom surface thereof. The evaporating section is received in the groove with the flat outside surface spaced a distance from the bottom surface of the base. A solidified soldering layer is formed between the flat outside surface of the evaporating section and the bottom surface of the base. A bottom of the solidified soldering layer is coplanar to the bottom surface of the base. The heat sink is arranged on the top surface of the base with the condensing section of the heat pipe extending therethrough.12-23-2010
20120145357THIN PLATE HEAT PIPE - Disclosed is a thin film heat pipe suitable for removal of hot spots in displays such as an LCD, an LED, and a PDP. An exemplary embodiment of the present disclosure provides a thin plate heat pipe including: a body part having a flat plate shape; a through-hole formed in the body part in a longitudinal direction; a plurality of grooves formed on the inner wall of the through-hole and in which a working fluid flows; and a wick formed in at least a part of the through-hole.06-14-2012
20120031587Capillary structure of heat plate - A heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a capillary structure of at least one first capillary layer and at least one second capillary layer arranged in the accommodation chamber in such a way that the first and second capillary layers are stacked over each other. With the arrangement of the first and second capillary layers, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is enhanced, so that the efficiency of temperature reduction is improved.02-09-2012
20100282445HEAT PIPE, EXHAUST HEAT RECOVERER PROVIDED THEREWITH - A heat pipe 11-11-2010
20100282444HEAT-DISSIPATING FIN ASSEMBLY WITH HEAT-CONDUCTING STRUCTURE - The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.11-11-2010
20100282443HEAT DISSIPATION DEVICE - A heat dissipation device includes a fan (11-11-2010
20110108243PLATE-TYPE HEAT PIPE - An exemplary plate-type heat pipe includes a hermetic container, working fluid contained in the container, a first wick portion and two second wick portions formed on inner surfaces of the container. The container includes an evaporating plate and a condensing plate facing each other. The evaporating plate includes a heat absorbing portion, two transition portions extending outwardly and upwardly from opposite ends of the heat absorbing portion, respectively, and two extending portions extending outwardly from outer ends of the transition portions, respectively. The first wick portion is formed on an inner surface of the heat absorbing portion. The second wick portions are formed on inner surfaces of the transition portions, respectively. The third wick portions are formed on inner surfaces of the extending portions, respectively. The third wick portions define capillary pores and a plurality of holes therein.05-12-2011
20110114294HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS - A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.05-19-2011
20110114293MANUFACTURING METHOD, FINISHED PRODUCT AND FIXTURE OF COPLANAR EVAPORATORS OF MULTIPLE HEAT PIPES - In a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes, the method is first to provide a plurality of heat pipes, each of which has an evaporator formed a heated face thereon; then, the evaporators are moved closely to one another in a manner, such that their heated faces are disposed onto a flat face; next, the evaporators are limited from multiple directions; afterward, pressing the evaporators toward the flat face makes their heated faces flush therewith; finally, injecting a bonding media into the gaps among the heat faces of the evaporators bonds the heat faces together to form a fixedly coplanar configuration.05-19-2011
20110048683HEAT PIPE WITH COMPOSITE WICK STRUCTURE - An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.03-03-2011
20100236760HEAT PIPE - A heat pipe includes a casing having an inner wall. A plurality of protrusions are radially formed on the inner wall of the casing. The plurality of protrusions are spaced from each other and extend longitudinally from one end of the casing to the other end of the casing. A main groove is defined between every two adjacent protrusions. The protrusions each define a plurality of first auxiliary grooves and a plurality of second auxiliary grooves being alternatively arranged with respect to each other along a longitudinal direction of the casing. The first auxiliary and the second auxiliary grooves each communicate two adjacent main grooves. The first auxiliary grooves each are inclined at an angle with respect to a longitudinal axis of the casing, and the second auxiliary grooves each are inclined at another different angle with respect to the longitudinal axis of the casing.09-23-2010
20100181048HEAT PIPE - A heat pipe includes a casing and a three-dimensional cross-linkage wick structure received in the casing. The three-dimensional cross-linkage wick structure has a plurality of pores therein for providing a capillary action and includes a bottom layer being attached to the casing and a plurality of protrusions extending from the bottom layer and spaced from each other. A groove is defined between two adjacent protrusions. The bottom layer has a connecting portion under the groove. The connection portion is formed between and connects with the two adjacent protrusions. The connection portions have a smaller pore size than the protrusions.07-22-2010
20100181047FINS-TYPE HEAT SINK AND METHOD FOR ASSEMBLING THE SAME - In a heat sink and a method for assembling the same, the heat sink includes a base, a heat pipe, fins, a presser and caps. The presser is provided with through-holes. The periphery of the through-hole is provided with an annular neck, so that the distal end of the heat pipe can penetrate the through-hole. The periphery of each annular neck is provided with notches on the presser. Each cap covers on the annular neck, and it extends downwards to form protruding flaps. The flap penetrates the notch and is folded outwards to abut the bottom surface of the presser. According to the assembling method, via the presser and the caps, the fins can be assembled with the heat pipe tightly.07-22-2010
20110253344Protective structure - A protective structure, comprising a first material region having a surface facing the exterior and an inner boundary surface, wherein channels for conducting fluid are disposed between the outer surface and the inner boundary surface, and a second material region, which is thermally connected at least in sub-regions to the inner boundary surface of the first material region and which is porous, wherein in pores a reaction medium and/or cooling medium is stored and channels for conducting fluid extend as far as the inner boundary surface of the first material region.10-20-2011
20110146955HEAT-DISSIPATION UNIT WITH HEAT-DISSIPATION MICROSTRUCTURE AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body internally defining a chamber; a wick structure formed on an inner surface of the chamber; and at least a SiO06-23-2011
20110168358LAP-JOINED HEAT PIPE STRUCTURE AND THERMAL MODULE USING SAME - A lap-joined heat pipe structure includes at least one first heat pipe having at least a first heat absorbing section in contact with a heat source and at least a first heat transfer section; and at least one second heat pipe having at least a second heat absorbing section in contact with and connected to the first heat transfer section and at least a second heat transfer section. The second heat transfer section is connected to a heat dissipation unit, so that a thermal module using the lap-joined heat pipe structure is formed. The first and the second heat pipe are connected to each other at the first heat transfer section and the second heat absorbing section, which are lap-joined to each other. With the lap-joined heat pipe structure, heat transfer efficiency can be largely increased and only a reduced heat dissipation space is needed.07-14-2011
20110168359HEAT-DISSIPATING PLATE - A heat-dissipating plate includes a casing and partition insert. The casing has surrounding walls with wick structures therein, and the inner surface of the walls defines a receiving compartment. The partition is disposed in the receiving compartment. The partition has a plurality of hole, a plurality of flanges protruding from an edge of the holes respectively. Each of flanges has a plurality of arc-shaped flange-rim extending outward to support the inner surface of the surrounding wall.07-14-2011
20110048677HEAT-CONDUCTING ASSEMBLY FOR HEAT PIPES OF DIFFERENT DIAMETERS AND HEAT SINK HAVING THE SAME - In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.03-03-2011
20120145356Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication - A hybrid pin-fin micro heat pipe heat sink comprises a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes comprises passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.06-14-2012
20110094712PLATE-TYPE HEAT PIPE - An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a first wick portion. The evaporating plate cooperates with the condensing plate to define a hermetic container. Working fluid is contained in the container. The first wick portion is formed on an inner surface of the evaporating plate. The first wick portion defines through holes therein.04-28-2011
20110094711HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.04-28-2011
20110259556DEVICE FOR GENERATING COMBUSTIBLE PRODUCT GAS FROM CARBONACEOUS FEEDSTOCKS - A device is provided for generating combustible product gas from carbonaceous feedstocks through allothermal steam gasification in a pressurized gasification vessel. The pressurized allothermal steam gasification of carbonaceous fuels requires that heat be supplied to the gasification chamber at a temperature level of approximately 800-900° C. In a heat pipe reformer, as is known from EP 1 187 892 B1, combustible gas is generated from the carbonaceous feedstocks to be gasified through allothermal steam gasification in a pressurized fluidized bed gasification chamber. The heat needed for this is fed to the gasifier or reformer from a fluidized bed combustion system through a heat pipe arrangement. Due to the straight and tubular construction of heat pipes, the combustion chamber and reformer/gasification chamber are disposed one above the other in the known heat pipe reformer from EP 1 187 892 B1. The pressure vessel base is under particular stresses due to the high temperatures in the combustion chamber. In addition, the base is weakened by a plurality of heat pipe feedthroughs. The sealing of the feedthroughs also presents a problem. In conventional tubular heat pipes, the line for liquid heat transfer medium and for gaseous heat transfer medium are both disposed in the common tubular shell. The fact that the present invention uses loop heat pipes in which the liquid heat transfer medium is conveyed spatially separated from the gaseous heat transfer medium allows the number of feedthroughs to be reduced to two, namely a liquid line and a vapor line. When a plurality of such loop heat pipes is used, the separate vapor and fluid lines thereof can be combined in the10-27-2011
20100065255Vapor Chamber - A vapor chamber includes a chamber, a working fluid, a lower wick structure, and a plurality of supporting elements. The chamber includes an upper cover and a bottom plate and contains the working fluid. The lower wick structure is located at the bottom plate. The supporting elements are disposed in the chamber and connect the upper cover and the bottom plate to support the upper cover. Each of the supporting elements and the upper cover form a first inclined angle. The working fluid in the vapor phase flows from the upper cover back to the bottom plate through the supporting elements after condensed.03-18-2010
20090308576HEAT PIPE WITH A DUAL CAPILLARY STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.12-17-2009
20100200199Heat Pipe with Nanostructured Wick - A heat pipe with a nanostructured wick is disclosed, with the method of forming the nanostructured wick on a metal substrate. The wicking material is a pattern of metallic nanostructures in the form of bristles or nanowires attached to a substrate, where the bristles are substantially freestanding.08-12-2010
20110186269THERMAL MODULE - An exemplary thermal module includes a heat absorbing member, a heat sink, a heat conducting member connecting the heat absorbing member with the heat sink, and centrifugal fan. The heat absorbing member has four fixing portions for fixing the thermal module. The heat sink includes a base and a fin assembly disposed on the base. The centrifugal fan includes a housing defining a lateral air outlet therein and an impeller rotatably received in the housing. The housing engages with the engaging portion and is detachably mounted to the heat absorbing member, with the air outlet facing the fin assembly. One of the fixing portions of heat absorbing member is shaded by the housing. The housing and the engaging portion cooperatively provide a sliding mechanism therebetween to allow the centrifugal blower to be slidable relative to the base after the lateral side of the housing detached from the heat absorbing member.08-04-2011
20110259554FLAT PLATE HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.10-27-2011
20110186268FLAT TYPE HEAT PIPE DEVICE - A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit.08-04-2011
20100186931LOOP HEAT PIPE TYPE HEAT TRANSFER DEVICE - It is an object of the invention to provide a loop heat pipe type heat transfer device that has reduced size, thickness and weight and exhibits high heat transfer performance. The loop heat pipe type heat transfer device is provided with an evaporator, a steam pipe that conducts a gas phase working fluid from the evaporator, a condenser connected to the steam pipe and a fluid pipe that circulates the liquid phase working fluid from the condenser to the evaporator, and is characterized in that a wick composed of a fiber structure laminate comprising a laminated nonwoven fabric is set inside the evaporator.07-29-2010
20120037344FLAT HEAT PIPE HAVING SWIRL CORE - A flat heat pipe having a swirl core includes a flat sealed casing having smooth inner walls, a working fluid filled within the flat sealed casing, and a swirl core disposed along a central axis of the flat sealed casing to support upper and lower inner walls of the flat sealed casing. Two airflow channels are formed between the swirl core and left and right inner walls of the flat sealed casing for allowing vapors of the working fluid to flow through. The swirl core is made by winding a metallic woven mesh in at least two circles for allowing the working fluid to flow through. A center of the swirl core is formed with a reflow channel. By this arrangement, the swirl core is used as a wick structure for allowing the working fluid to flow through, thereby saving the cost and time for manufacturing the wick structure.02-16-2012
20110000647LOOP HEAT PIPE - A loop heat pipe includes an evaporator and a tube hermetically connecting with the evaporator. The evaporator includes a metallic container and a first wick structure disposed on an inner surface of the container. The container defines a vapor outlet and a liquid inlet. The tube includes a vapor line connecting with the vapor outlet and a liquid line connecting with the liquid inlet of the evaporator. The vapor line and the liquid line of the tube communicate with each other. A second wick structure is adhered on a part of an inner surface of a wall of the tube and connects and communicates with the first wick structure at two opposite ends of the evaporator.01-06-2011
20100319882ULTRA-THIN HEAT PIPE AND MANUFACTURING METHOD THEREOF - An ultra-thin heat pipe and a manufacturing method thereof are provided. The ultra-thin heat pipe includes a flat pipe body and a powder-sintered portion. The flat pipe body has an internal wall, a first groove set and a second groove set, wherein the first groove set and the second groove set are disposed on the internal wall and spaced apart from each other, and each groove of the first groove set and the second groove set is extended along an extension direction of the flat pipe body. The powder-sintered portion is disposed within the flat pipe body and connects both the first groove set and the second groove set for forming at least one vapor channel with the internal wall.12-23-2010
20090173474HEAT DISSIPATING APPARATUS EXTENDED LATERALLY FROM HEAT PIPE - A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.07-09-2009
20100319883PASSIVE COOLING ENCLOSURE SYSTEM AND METHOD FOR ELECTRONICS DEVICES - An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.12-23-2010
20110114295HEAT DISSIPATION MODULE - An exemplary heat dissipation module includes a base defining four through apertures and four fasteners. The base forms four sleeves surrounding the four through apertures, respectively. The sleeve has a through slot defined therein along an axial direction thereof thereby separating the sleeve into two clamping portions spaced from each other. The fastener is pushed downwardly into the through aperture, an annular flange of the fastener is driven to enter the small hole such that the two clamping portions elastically expand outwardly away from each other. After the annular flange passed through the small hole, the clamping portions rebound back to their original states and the annular flange abuts against a bottom of the sleeve, with the coil spring is located between the head portion of the fastener and the step of the sleeve.05-19-2011
20120305222HEAT SPREADER STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.12-06-2012
20120305221HEAT PIPE-ATTACHED HEAT SINK - A heat pipe-attached heat sink includes a bottom block having an opening and locating grooves arranged on the flat bottom wall thereof, a radiation fin module consisting of first radiation fins and second radiation fins, each first radiation fin having extension abutment strip that has a flat bottom abutment edge and locating grooves located on the flat bottom abutment edge and dividing the flat bottom abutment edge into a plurality of spacer ribs, the extension abutment strips of the first radiation being tightly plugged into the opening of the bottom block, and heat pipes respectively press-fitted into the locating grooves of the bottom block and the locating grooves of the first radiation fins of the radiation fin module, each heat pipe having a planar peripheral side exposed outside the radiation fin module and the bottom block and kept in flush with the flat bottom abutment edge of the extension abutment strips for direct contact with an external heat source.12-06-2012
20120305223THIN HEAT PIPE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost.12-06-2012
20110108245Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber - A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber is formed of a bottom metal shell and a top plate which are diffusion bonded together at their edges. The top plate is itself a circuit board that may be a metal core type, a ceramic type, or any bondable composite material. The metal core circuit board is preferably aluminum, and the dielectric regions on its top surface are aluminum oxide regions. A metal circuit layer is formed on the dielectric regions for interconnecting electronic devices mounted on the circuit board. Since the back surface of the circuit board is directly in contact with the working fluid in the vapor chamber, there is the ultimate in thermal coupling between the circuit board and a heat sink connected to the back of the vapor chamber.05-12-2011
20110108244HEAT SINK - A heat sink includes a base board, a fin group, heat pipes, and a radiation plate. The fin group includes a plurality of fins arranged on the base board at right angles to the base board. Each of the heat pipes has the shape of the letter “U,” is arranged, on the whole, in parallel with each fin, and conducts heat from the base board to the radiation plate placed on the fin group. The base board and the radiation plate are thermally connected to each fin.05-12-2011
20110315352THERMAL MODULE - A thermal module includes at least one heat pipe and a heat sink. The heat pipe has a heat absorption end and a heat-spreading end extending in a direction away from the heat absorption end. The heat sink has a heat-spreading face on which multiple radiating fins are disposed and a heat conduction face opposite to the heat-spreading face. The heat conduction face is formed with a reception channel. The heat-spreading end of the heat pipe is press-fitted in the reception channel to integrally connect the heat pipe and the heat sink with each other. The heat-spreading end is flush with the heat conduction face. The heat pipe and the heat sink are connected by means of press fit connection. Therefore, the thermal module can be easily assembled to save working time and lower manufacturing cost. Moreover, the thermal module is able to provide excellent heat dissipation effect.12-29-2011
20110315351VAPOR CHAMBER HAVING COMPOSITE SUPPORTING STRUCTURE - A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof.12-29-2011
20120043059LOOP HEAT PIPE - A loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A predetermined quantity of bi-phase working medium is contained in the closed loop. A separator connects the liquid line. A cross section of the separator is larger than a cross section of the liquid line. The separator separates the liquid state working medium from the vapor state working medium when the working medium flows therethrough.02-23-2012
20110155350Structure of heat plate - A structure of heat plate includes a hollow portion formed adjacent to a side edge of a plate body or in a corner of the plate body. A seal tube is received in the hollow portion so that the plate body provides complete protection to the seal tube against deformation or damage of the seal tube caused by external impact or hit and offers the advantages of simple structure, excellent durability, being easy to practice, and flexibility of arrangement.06-30-2011
20110155352HEAT SINK - A heat sink includes a base, a first fin provided on the base and including a first cutout portion, a first heat pipe including a first linear portion and a first curved portion, the first curved portion being provided in the first cutout portion, and a second heat pipe including a second linear portion connected to the first fin with an adhesive having a heat conductivity.06-30-2011
20110155351HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.06-30-2011
20110067844PLANAR HEAT PIPE - The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure.03-24-2011
20120111542COILED HEAT PIPES AND METHODS THEREOF - A coiled heat pipe and methods of making a coiled heat pipe are provided. The coiled heat pipe includes a sealed-exterior coil and a plurality of interior-perforated coils. The exterior coil and the plurality of interior-perforated coils are be formed from a single aluminum sheet. The exterior coil is sealed and houses, or otherwise contains, a partial vacuum and a working fluid.05-10-2012
20120012281HEAT SINK WITH MULTIPLE VAPOR CHAMBERS - A heat sink is disclosed. The heat sink comprises a base (01-19-2012
20120111540FLAT TYPE HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary flat type heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure includes a plurality of spaced protruding portions and grooves between every two adjacent protruding portions. The second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.05-10-2012
20120111541PLATE TYPE HEAT PIPE AND HEAT SINK USING THE SAME - A plate-type heat pipe includes a sealed shell containing working liquid therein, and elongated wick structures arranged in the shell in a spaced manner. Channels are formed between the wick structures. The heat pipe has an evaporating section and a condensing section. Two ends of each wick structure are respectively located at the evaporating section and the condensing section. Top and bottom faces of each wick structure respectively contact top and bottom inner faces of the shell.05-10-2012
20120111539FLAT HEAT PIPE AND METHOD FOR MANUFACTURING FLAT HEAT PIPE - An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is folded by a steel sheet with a plurality of pores, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.05-10-2012
20120152496HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING SAME - An exemplary heat dissipation device includes a first fin unit, a second fin unit, a heat pipe, a first base and a second base. The heat pipe includes a condensing section extended through the first fin unit and the second fin unit and an evaporating section extending from the condensing section. The evaporating section includes a first heat absorbing portion extended through the first fin unit and a second heat absorbing portion spaced from the second fin unit. The first base is located at one side of the second fin unit and supports the second heat absorbing portion thereon. The second base is covered on the first base. The first and second bases sandwich the second heat absorbing portion therebetween.06-21-2012
20100243213HEAT PIPE TYPE HEAT TRANSFER DEVICE - An object of the present invention is to provide a heat transfer device succeeded in satisfying both the reduction in size and weight and the high heat transfer performance by incorporating an organic fine particle into a working fluid and optimizing its size, mixing ratio, composition, surface properties and the like.09-30-2010
20110073284EVAPORATOR FOR LOOP HEAT PIPE SYSTEM - An evaporator for a loop heat pipe (LHP) system. The evaporator an evaporator body for accommodating a sintered wick formed by sintering metal powders, a discharging hole for discharging a working fluid filled into voids formed between particles of the sintered wick and changed into a vapor due to being heated, and an inlet hole for introducing the working fluid changed into a liquid; a first chamber portion coupled to a side of the inlet hole, and including an inlet for introducing the working fluid in a liquid phase, and an accommodation space portion for accommodating the working fluid in a liquid phase; and a capillary structure that is porous and that is inserted into the accommodating space portion, wherein the working fluid in a liquid phase introduced through the inlet is introduced to the evaporator body through the capillary structure.03-31-2011
20110073283HEAT DISSIPATION DEVICE - A heat dissipation device comprises a substrate, a fin assembly located above the substrate and at least one heat pipe connecting the substrate with the fin assembly together. The fin assembly comprises a plurality of fins stacked one above another along a bottom to top direction and space from each other with a gap defined between two neighboring fins. Each of the fins defines a plurality of ventilating holes therein. The ventilating holes of the fins are aligned with each other and form a plurality of vertical air channels in the fin assembly along the bottom to the top direction for ambient air in the gaps flowing therethrough upwardly to escape the fin assembly.03-31-2011
20120211203Heat Dissipating Apparatus and Method for Improving the Same - A heat dissipating apparatus and a method for improving the same are provided. The heat dissipating apparatus includes a heat pipe including a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting a heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.08-23-2012
20110088877HEAT TRANSPORT DEVICE, METHOD OF MANUFACTURING A HEAT TRANSPORT DEVICE, AND ELECTRONIC APPARATUS - A heat transport device includes a working fluid, a capillary member, and a container. The working fluid transports heat by performing a phase change. The capillary member applies a capillary force to the working fluid. The capillary member includes a first mesh member having a mesh of a first size and a second mesh member having a mesh of a second size different from the first size. The second mesh member is folded so that the first mesh member is sandwiched. The container contains the working fluid and the capillary member.04-21-2011
20110088876PLATE-TYPE HEAT PIPE - A plate-type heat pipe includes a condensing plate, an evaporating plate and a first wick member. The evaporating plate cooperates with the condensing plate to define a hermetic container. Working fluid is contained in the container. The first wick member is formed on an inner surface of the condensing plate. The first wick member defines a plurality of through holes therein.04-21-2011
20110088875LOOP HEAT PIPE - An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.04-21-2011
20110088874HEAT PIPE WITH A FLEXIBLE STRUCTURE - A heat pipe includes a metal pipe, a flexible structure, a woven mesh, a working fluid, and a support element. The flexible structure is formed on the metal pipe, and the woven mesh is disposed inside the metal pipe, and the working fluid is filled into the metal pipe and attached onto the woven mesh, and the support element is passed into the woven mesh, such that the heat pipe can be bent into a desired shape manually by an easy way according to actual using requirements.04-21-2011
20110088873SUPPORT STRUCTURE FOR FLAT-PLATE HEAT PIPE - A support structure for flat-plate heat pipe, including a main body and a fitting body. The fitting body has at least one open side and a first side section connected with the open side. The first side section has a capillary structure formed on a periphery of the first side section. The first side section and the open side together define a space for fixedly fitting the main body therein. By means of the capillary structure of the first side section of the fitting body, the circulating rate of a working fluid flowing within the flat-plate heat pipe is increased to achieve better heat dissipation effect and better thermal uniformity.04-21-2011
20120118537FLATTENED HEAT PIPE AND MANUFACTURING METHOD THEREOF - The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.05-17-2012
20120118536RADIAL HEAT SINK WITH HEAT PIPE SET THEREIN - A radial heat sink includes a hollow core base with mounting grooves axially located on the inside wall thereof and a locating groove located on an end wall at one end thereof, radiation fins arranged around the periphery of the hollow core base, and heat pipes inserted through the end wall of the hollow core base and press-fitted into the mounting grooves and the locating groove and kept in flush with the end wall of the hollow core base.05-17-2012
20120125572COOLING DEVICE - This disclosure relates to a low-profile cooling device (05-24-2012
20090065180PLANAR HEAT PIPE FOR COOLING - There is disclosed an apparatus of planar heat pipe for cooling, which may be embedded in a printed circuit board for cooling of heat-dissipating components.03-12-2009
20120160458COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT - A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.06-28-2012
20120160457COMPOUND HEAT PIPE, METHOD OF MANUFACTURING THE SAME, HEAT EXCHANGER AND HEAT EXCHANGER SYSTEM USING THE SAME - The compound heat pipe according to the present invention may overcome physical limits, which a single metal pipe might have, by integrally joining different metal pipes having different physical properties, forming ridges on an inner surface thereof the pipe and protrusions on an outer surface thereof and may first increase heat transfer capability by increasing the heat transfer area between the pipe and fluid. Further, the compound heat pipe according to the present invention may secondly increase the heat transfer capability by setting the noncontact rate to be 30% or less so that the heat transfer rate of the compound heat pipe in the radial direction may be optimized.06-28-2012
20120160456COOLING APPARATUS AND ELECTRONIC APPARATUS - The cooling apparatus includes a heat receiving portion to receive heat from the heating element, a radiator, a first heat pipe having one end portion to receive heat from the heat receiving portion and anther end portion inserted in the radiator, and a second heat pipe to receive the heat from the heat receiving portion via the first heat pipe, the second heat pipe including one end portion arranged on the first pipe and another end portion arranged around the radiator, wherein the second heat pipe overlaps with a region of the first heat pipe extending from the heat receiving portion to the radiator in a plan view of the cooling apparatus.06-28-2012
20120160455HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING SAME - An exemplary heat dissipation device includes a base plate and heat pipes. The base plate defines recesses at one side surface and locating holes communicating with the recesses. The heat pipes each include an evaporating section received in a corresponding recess and a condensing section extending from the evaporating section. The evaporating section includes a bulge protruding outward from an outer surface thereof. The evaporating sections of the heat pipes are interference fitted in the recesses with the bulges protruding into the locating holes.06-28-2012
20120160454HEAT EXCHANGER - A heat exchanger includes an enclosure internally providing at least a first space and at least a second space; a first forced convection element and a cooling unit arranged in the first space; a second forced convection element and a vaporization unit arranged in the second space; and a heat transfer unit serially connecting the cooling unit and the vaporization unit to form a loop. The first and the second forced convection element work to enable forced convection of airflow, and the vaporization unit and the cooling unit together with the heat transfer unit form a convection unit. As a result, the heat exchanger has largely upgraded heat exchange efficiency.06-28-2012
20120211202LOW-PROFILE HEAT TRANSFER DEVICE - A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency.08-23-2012
20100206522HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.08-19-2010
20100206521Heat dissipating fin and heat sink - A heat dissipating fin has a skirt having distal and proximal edges formed on at least one edge of the heat dissipating fin and multiple fastening components. Each fastening component is formed on the skirt and abuts the fringe of an adjacent the heat dissipating fin and has a hook and a hook mount. The hook is formed on and protrudes from the distal edge of the skirt. The hook mount is formed in the proximal edge of the skirt and corresponds to the hook. Since the hook is easily mounted through the hook mount the heat dissipating fins can be fabricated to form a heat sink easily to reduce manufacturing costs.08-19-2010
20100065254Heat Dissipation Device and Method - A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.03-18-2010
20120247736LOOP HEAT PIPE STRUCTURE - A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.10-04-2012
20110180237WELDING A METAL PRODUCT - A method of forming a welded metal product from a workpiece, comprising a sheet and a counterpart to which the sheet is to be welded, consisting in the steps of: 07-28-2011
20120312507THIN HEAT PIPE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased.12-13-2012
20120312509HEAT DISSIPATION DEVICE - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base; and a heat pipe including an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.12-13-2012
20100051240VARIABLE CONDUCTANCE HEAT PIPE - A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container extending in an axial direction. The sealed container includes one end to be connected to a heating source and a part to be connected to a heat sink. On a cross section of the sealed container along a direction orthogonal to the axial direction, a portion having water conveying property better than other portions is provided. The portion having the better water conveying property extends in the axial direction.03-04-2010
20100051239DISSIPATION MODULE,FLAT HEAT COLUMN THEREOF AND MANUFACTURING METHOD FOR FLAT HEAT COLUMN - A manufacturing method for a flat heat column includes the steps of: providing a flat hollow tube, of which a first wick structure is disposed on the inner surface; providing at least one guiding device disposed within the flat heat tube for supporting the flat heat tube, wherein a second wick structure is disposed on the surface of the guiding device; connecting the first wick structure and the second wick structure for forming a continuous wick structure; and filling a working fluid and sealing both two ends of the flat hollow tube so as to form the flat heat column. A heat dissipation module and its flat heat column are also disclosed for applying to a heat element. The flat heat column can provide flowing path with optimum thermal conductive efficiency for the fluid therein.03-04-2010
20120312508GAPLESS HEAT PIPE COMBINATION STRUCTURE AND COMBINATION METHOD THEREOF - A gapless heat pipe combination structure and a combination method thereof are provided. An open slot being open is formed on a bottom surface of a heat dissipation device, an adhesive layer is disposed on a surface of grooves in the open slot, and a plurality of heat pipes is provided, which are adhered to the surface of the grooves closely through the adhesive layer respectively. A jig is used to press heating segments of the heat pipes at least once, so that the heating segments exposed from the open slot form a plane heating surface, and the heating surface of the heat pipes completely contact with an area of a heat source, thereby improving overall thermal conduction performance.12-13-2012
20090321054HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.12-31-2009
20090020269HEAT PIPE WITH COMPOSITE WICK STRUCTURE - A heat pipe (01-22-2009
20090020268GROOVED HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - A heat pipe (01-22-2009
20120261096RADIATING FIN STRUCTUREAND THERMAL MODULE USING SAME - A radiating fin structure includes a main body being angularly upward extended from a first surface to form at least a first and a second ascending airflow-guiding section, so that a first and a second exterior angle are respectively contained between a line extended from an opposite second surface of the main body and the first and the second ascending airflow-guiding section. A thermal module using the radiating fin structure is also disclosed. The thermal module includes at least one heat pipe, a plurality of the above-described radiating fins sequentially extended through by an end of the heat pipe, and a base receiving another end of the heat pipe therein. An ascending airflow passage is defined between any two vertically adjacent first ascending airflow-guiding sections and any two vertically adjacent second ascending airflow-guiding sections to enhance natural convection and accordingly largely upgrades the natural cooling efficiency of the thermal module.10-18-2012
20120261095THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module includes a plastic layer and at least one heat pipe. The plastic layer has at least one channel and multiple locking sections. The heat pipe is disposed in the channel. The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost.10-18-2012
20120227935INTERCONNECTED HEAT PIPE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an interconnected heat pipe assembly and a method for manufacturing the same. The interconnected heat pipe assembly includes a first heat pipe and a second heat pipe. The first heat pipe comprises a first pipe, a first wick structure and a first working fluid. The first pipe has a hollow chamber and an opening. The first wick structure is arranged on inner walls of the hollow chamber. The first working fluid is filled in the hollow chamber. The second heat pipe is disposed through the opening in the first pipe with a portion of the second heat pipe being received in the hollow chamber. An air channel is formed between outer walls of the second heat pipe and inner walls of the first pipe. The present invention can conduct heat to a long distance and has an increased heat-conducting efficiency.09-13-2012
20120227934HEAT PIPE HAVING A COMPOSITE WICK STRUCTURE AND METHOD FOR MAKING THE SAME - A heat pipe having a composite wick structure includes a first pipe, a second pipe, a third wick structure, a working fluid, an evaporating section, a condensing section and a transferring section. The inner wall of the first pipe is provided with a first wick structure. The evaporating section is formed on one side of the first pipe. The condensing section is formed on the other side of the first pipe. The transferring section is formed in the first pipe between the evaporating section and the condensing section. The second pipe is received in the first pipe and located in the transferring section. The outer wall of the second pipe is provided with a second wick structure. The third wick structure is provided between the first wick structure and the second wick structure. The working fluid is filled in the first pipe. By this structure, the condensed working fluid in the first pipe can quickly flow from the condensing section through the transferring section back to the evaporating section. The present invention also provides a method for making such a heat pipe.09-13-2012
20120227938HEAT SINK APPARATUS - A heat sink apparatus includes a fin module, a base, a first heat pipe, and a second heat pipe. The base includes an upper surface and a lower surface. The first heat pipe includes a first connection portion having a first end and a second end. The first end is connected to a first receiving portion. The second end is connected to a first body. The first receiving portion is in contact with the upper surface. The first body extends through the fin module in a first direction. The second heat pipe includes a second connection portion having a first end connected to a second receiving portion and a second end connected to a second body. The second receiving portion is in contact with the upper surface. The second body extends through the fin module in a second direction substantially opposite to the first direction.09-13-2012
20100326632PHASE-CHANGE-TYPE HEAT SPREADER, FLOW-PATH STRUCTURE, ELECTRONIC APPARATUS,AND METHOD OF PRODUCING A PHASE-CHANGE-TYPE HEAT SPREADER - [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance.12-30-2010
20100326630HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a heat spreader includes steps of: providing an elongated and flat sectional material with a through hole defined therein; cutting the sectional material into a plurality of parts each in a predetermined length to form a plurality of casings, wherein each of the casings defines a vapor chamber therein and has at least an opening in a side thereof; forming a wick structure on an inner face of the casing; providing a plurality of supporting members; placing and fixing the supporting members into the vapor chamber of the casing; and injecting working liquid into the vapor chamber and sealing the casing.12-30-2010
20100326629VAPOR CHAMBER WITH SEPARATOR - A vapor chamber with separator includes shell, capillary tissue, separator, supporting structure and working fluid. The shell includes inter-sealed lower and upper shell plates. Partial section of the lower shell plate projects downwardly and forms accommodating room therein. The capillary tissue is arranged by distributing over inner wall of the lower shell plate. The separator overlapped the capillary tissue is arranged penetrating trough corresponding to the accommodating room. Liquid passage is formed between the lower shell plate and the separator. The supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator. Vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage. The working fluid is filled into the shell. Since the vapor and liquid working fluids are separated by the separator to avoid interference, the cooling performance is thus boosted.12-30-2010
20110120674TITANIUM-BASED THERMAL GROUND PLANE - Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.05-26-2011
20120267079STRIPPING ABSORPTION MODULE - In a process, a portion of a liquid mixture flow is vaporized to produce a vapor and a depleted flow of liquid. The vapor is introduced to a brine which is adapted to exothermically absorb one or more components from the vapor, and heat is withdrawn, to produce at least a flow of heat and a flow of brine which is enriched in the one or more components. The heat previously withdrawn is transferred, to drive the vaporization. This heat transfer is associated with the change of a working fluid from a gaseous into a liquid state. The heat withdrawal involves the change of the working fluid from the liquid to the gaseous state. In the liquid state, the working fluid flows only by one or more of gravity, convection and wicking. In the gaseous state, the working fluid flows only by one or more of diffusion and convection.10-25-2012
20120325440COOLING DEVICE - There is provided a cooling device not affected by gravity by exerting a strong capillary attraction to be hard to deteriorate in transportation function. Unidirectionally-aligned copper fiber assembly 12-27-2012
20100243211HEAT DISSIPATING STRUCTURE OF HIGH POWER LED PROJECTOR LAMP - A heat dissipating structure is capable of dissipating heat quickly in a high power LED projector lamp to improve the heat dissipating efficiency. The structure includes a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate provides a plurality of grooves for mounting one end of the plate type heat pipe, wherein those two are perpendicular to each other. Furthermore, the heat dissipating fins having a plurality of slots are stacked and arranged at intervals for disposing the plate type heat pipe with an inclined angle. Hence, the heat generated from the high power LED will be conducted quickly and the heat dissipating efficiency will be improved.09-30-2010
20120080171HEAT RELAY MECHANISM AND HEAT-DISSIPATING FIN UNIT - A heat relay mechanism includes a heat-dissipating member for dissipating heat, a buffer member contacted with the heat-dissipating member at a first surface, a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature, a heat pipe connected to the thermally deformable member at one end, and a device connected to another end of the heat pipe.04-05-2012
20120080170PLATE-TYPE HEAT PIPE SEALING STRUCTURE AND MANUFACTURING METHOD THEREOF - A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit.04-05-2012
20120080169HEAT SINK - A heat sink includes a fin set, a heat pipe and a fastener. The heat pipe has a heat-dissipating end and a heat-absorbing end. The heat-dissipating end is disposed through the fin set. The heat-absorbing end has a connecting side and a heat-absorbing side. The fastener has a body and a plurality of fixing ends. The body is assembled with the fin set. The center of the body is provided with at least one groove in such a manner that the heat-absorbing side protrudes from the groove directly to be brought into contact with a heat-generating element for thermal conduction. By this structure, thermal resistance is reduced while the thermal-conducting efficiency is increased.04-05-2012
20120318482HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device includes a heat pipe and a fin assembly. The heat pipe includes a main body and an end portion. The end portion has a width smaller than that of the main body. The fin assembly includes a first fin and a second fin adjoining to the first fin. The first fin forms a flange from a side of thereof. The second fin forms a flange from a side of thereof. The flange of the first fin has an extending portion overlapping and soldering to the flange of the second fin. The extending portion defines a number of through holes corresponding to the flange of the second fin. The end portion of the heat pipe is soldered to the extending portion of the first fin and soldered to the flange of the second fin by the through holes of the extending portion.12-20-2012
20110265976HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device for a heat-generating component includes a heat sink, a heat pipe and a heat conductive member. The heat sink includes a plurality of stacked first fins and second fins. Each of the first fins defines an accommodating groove therein. The heat pipe includes an evaporator section, a condenser section and a connecting section interconnecting the evaporator section and the condenser section. The evaporator section thermally connects the heat-generating component. The connecting section extends obliquely from the evaporator section to the first fins. The condenser section is attached to the second fins. The connecting section is accommodated in the accommodating grooves of the first fins, and makes no thermal contact with the first fins. The heat conductive member thermally connects the first fins with the heat-generating component.11-03-2011
20120318480HEAT SINK HAVING JUXTAPOSED HEAT PIPES AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat sink having juxtaposed heat pipes and a method for manufacturing the same. The heat sink includes a base, a plurality of heat pipes and a pair of side strips. The base has a surface on which an open trough and an insertion trough on both sides of the open trough are provided. Each heat pipe has an evaporating section. The evaporating sections are juxtaposed in the open trough and adhered to each other. Each evaporating section has a planar surface. The side strips are fixed into the insertion troughs and protrude from the surface of the base. The planar surface of each evaporating section and the outer surface of each side strip are coplanar. By this structure, the thermal contact surface between the heat pipes and electronic heat-generating sources is increased, so that the heat-dissipating efficiency of the heat sink is improved.12-20-2012
20120318481HEAT DISSIPATION DEVICE - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.12-20-2012
20100230076HEAT DISSIPATION DEVICE AND CENTRIFUGAL FAN THEREOF - A centrifugal fan includes a plurality of blades, a housing for receiving the blades therein and an air guiding mechanism. The housing includes a top wall and a sidewall around the top wall. The sidewall defines a first air outlet and a second air outlet adjacent and perpendicular to the first air outlet. The air guiding mechanism is located between the first air outlet and the second air outlet. The air guiding mechanism includes an air guiding wall parallel to the second air outlet and an air partition wall extending inwardly from the air guiding wall towards the blades. The first air outlet is defined between the air partition wall and the sidewall. The second air outlet is defined between the air guiding wall and the sidewall of the housing.09-16-2010
20120325438HEAT PIPE WITH FLEXIBLE SUPPORT STRUCTURE - A heat pipe with a flexible support structure includes a pipe body and a support, and the support is installed in the pipe body and includes a first row of side plates and a second row of side plates extended along the lengthwise direction of the pipe body and a plurality of support elements coupled between the first and second rows of side plates, and each support element abuts the internal side of a capillary tissue of the pipe body. Plate elements of the first and second rows of side plates are arranged with an interval apart from each other and in sections along the lengthwise direction of the pipe body, and the plate elements of the first row of side plates and the plate elements of the second row of side plates are aligned alternately with each other. The support is flexible to facilitate users to bend the heat pipe.12-27-2012
20120325437FLAT HEAT PIPE WITH CAPILLLARY STRUCTURE - A flat heat pipe with a capillary structure includes a pipe body and a capillary tissue. The pipe body is substantially hollow and flat and includes a bottom wall and a top wall opposite to the bottom wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body. The capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue includes a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. The protrusions formed by the capillary tissue can provide sufficient capillary forces and also produce the gap to form the air passage.12-27-2012
20120279687FLAT-TYPE HEAT PIPE AND WICK STRUCTURE THEREOF - The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact.11-08-2012
20120325439METHOD AND APPARATUS FOR HEAT SPREADERS HAVING A VAPOR CHAMBER WITH A WICK STRUCTURE TO PROMOTE INCIPIENT BOILING - Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.12-27-2012
20120285663CONDENSING DEVICE AND THERMAL MODULE USING SAME - A condensing device and a thermal module using same are disclosed. The condensing device includes a hollow main body having a first inlet, a first outlet, and a flow-guiding zone. In the flow-guiding zone, there is provided a plurality of spaced flow-guiding members to define at least one flow passage therebetween. The at least one flow passage is communicable at two opposite ends with the first inlet and the first outlet. The thermal module is formed by connecting the first inlet and the first outlet of the condensing device to a second outlet and a second inlet of a heat-absorption unit, respectively, via two separate heat-transfer units. With the flow-guiding zone provided in the condensing device, it is able to accelerate the vapor-liquid circulation in the condensing device to thereby provide upgraded heat transfer efficiency.11-15-2012
20120285662VAPOR CHAMBER WITH IMPROVED SEALED OPENING - The vapor chamber includes a casing, wick structure, working fluid and filling/degassing tube. The casing is composed of two plates and has a chamber therein. The wick structure and working fluid are disposed in the chamber. The filling/degassing tube is connected with the casing to form a passage communicating with the chamber. A portion of the plates which overlaps the filling/degassing tube is pressed to deform for making the passage closed. And the outer end of the filling/degassing tube is flush with the side of the casing.11-15-2012
20120138273HEAT SINK WITH THERMALLY CONDUCTIVE COVER - A heat sink includes a base, two heat pipes, a fin assembly, and two thermally conductive cover. The heat pipes are thermally connected to the base. Each of the heat pipes includes a cylindrical body and an ineffective end portion distal from the base. The ineffective end portion is connected to the cylindrical body. A diameter of the ineffective end portion is smaller than that of the body. The fin assembly is thermally coupled to the two heat pipes. Each of the thermally conductive covers envelops the ineffective end portion and is in thermal contact with the ineffective end portion and the fin assembly.06-07-2012
20130008631LNG (LIQUEFIED NATURAL GAS) AND LIN (LIQUID NITROGEN) IN TRANSIT REFRIGERATION HEAT EXCHANGE SYSTEM - A heat exchanger includes a housing disposed in a first atmosphere and having an upstream end, a downstream end and a chamber within the housing; a metallic block disposed in the chamber and having a passageway therethrough and through which a cryogen can flow; and a heat pipe assembly in contact with the metallic block and extending to a second atmosphere which is separate from the first atmosphere for providing heat transfer at the second atmosphere.01-10-2013
20100132923Minimal-Temperature-Differential, Omni-Directional-Reflux, Heat Exchanger - A substrate formed of a suitable conductive-heat-transfer material is formed with small channels of a size selected to provide surface tension forces dominating a motion of a liquid-phase working fluid. A space above the channels of the substrate provides comparatively unobstructed space for the transport motion of a vapor phase of the working fluid effecting a heat-pipe effect in a multi-dimensional device. Channels may typically be formed in an orthogonal grid providing capillary return of liquids from a comparatively cooler condensation region to a comparatively warmer evaporation region, without any wicks other that the adhesion of the liquid phase working fluid to the vertices of the channels. Interference between the boundary layers of the liquid phase and the vapor phase of the working fluid are minimized by the depth of the channels, and the pedestals formed by the channel walls. Extremely small temperature differentials are thereby achieved between an outer surface of the substrate and an inner surface of the substrate when the liquid phase floods the substrate.06-03-2010
20130014918HEAT DISSIPATION DEVICEAANM LIN; CHIH-HSUNAACI Tu-ChengAACO TWAAGP LIN; CHIH-HSUN Tu-Cheng TW - A heat dissipation device includes a plurality of fins connected to each other and two heat pipes extending through the fins. Each fin includes a plate, an upper flange extending from a top side of the plate, a lower flange extending from a bottom side of the plate and an inner flange extending from an inner periphery of a groove defined in the plate. The fins include first fins and second fins having lengths larger than that of the first fins. The two heat pipes include a wide heat pipe and a narrow heat pipe. The wide heat pipe extends through the grooves and contacts the inner flanges of the first fins and the second fins. The narrow heat pipe extends through the grooves and contacts the inner flanges of the second fins.01-17-2013
20130014919HEAT PIPEAANM DAI; SHENG-LIANGAACI KunShan CityAACO CNAAGP DAI; SHENG-LIANG KunShan City CNAANM LIU; YUEAACI KunShan CityAACO CNAAGP LIU; YUE KunShan City CNAANM SHEN; HAI-PINGAACI KunShan CityAACO CNAAGP SHEN; HAI-PING KunShan City CNAANM CHEN; WEN-HUAACI KunShan CityAACO CNAAGP CHEN; WEN-HU KunShan City CNAANM WU; JIA-HONGAACI Tu-ChengAACO TWAAGP WU; JIA-HONG Tu-Cheng TWAANM LO; YU-LIANGAACI Tu-ChengAACO TWAAGP LO; YU-LIANG Tu-Cheng TW - A heat pipe includes a casing and a plurality of wick layers. The casing has an inner wall. The wick layers stack at an inner surface of the casing in turn. The wick layers respectively define a plurality of pores therein. Diameters of the pores of each of the wick layers gradually decrease from the inner wall to center of the casing.01-17-2013
20130014917HEAT PIPE-ATTACHED HEAT SINK WITH BOTTOM RADIATION FINSAANM Huang; Tsung-HsienAACI I-Lan HsienAACO TWAAGP Huang; Tsung-Hsien I-Lan Hsien TW - A heat pipe-attached heat sink includes a radiation fin module having a plurality of radiation fins arranged in parallel, each radiation fin having an extension abutment strip, each extension abutment strip having a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on the flat abutment edge, heat pipes respectively press-fitted into the locating grooves of the extension abutment strips each having a flat heat-absorbing face kept in flush with the flat abutment edges of the radiation fins, a bonding agent applied to the locating grooves of the radiation fins to bond the heat pipes to the radiation fins, and stop blocks fastened to the radiation fins and stopped against the flat abutment edges of the radiation fins at one side to reinforce the structural strength.01-17-2013
20130014920HEAT SINK ASSEMBLYAANM CHAO; CHIH-HANGAACI Tu-ChengAACO TWAAGP CHAO; CHIH-HANG Tu-Cheng TWAANM CHENG; WEI-CHENGAACI Tu-ChengAACO TWAAGP CHENG; WEI-CHENG Tu-Cheng TWAANM CHIANG; CHIH-HSIANGAACI Tu-ChengAACO TWAAGP CHIANG; CHIH-HSIANG Tu-Cheng TW - A heat sink assembly includes a heat sink, a first fan, and a second fan. The heat sink includes a first base contacting a first heat generating element, a first heat pipe connected to the first base, and a fin assembly. The first heat pipe is located in the fin assembly. The first fan defines a first input opening and a first output opening substantially perpendicular to the first input opening. The second fan defines a second input opening and a second output opening substantially parallel to the second input opening. The first and second input openings correspond to the fin assembly.01-17-2013
20110132578HEAT-DISSIPATING PLATE - A heat-dissipating plate has a casing and a supporting structure, where the casing has surrounding walls to define a receiving compartment therein confined by an inner wall. The inner wall is integrated with a capillary structure. Disposed inside the receiving compartment, the supporting structure includes a meshed partition and a plurality of columns. The meshed partition has a plurality of holes and joined-openings. The columns are fixed in the joined-openings and abut against the inner surface of the walls. The associated manufacturing process for the heat-dissipating plate is easily to accomplish.06-09-2011
20130020056HEAT DISSIPATION DEVICE - A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.01-24-2013
20130020055THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered.01-24-2013
20120241133VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.09-27-2012
20090159243NANO TUBE LATTICE WICK SYSTEM - For cooling electronics with high heat fluxes, a lattice wick system is disclosed that has a plurality of nano tube wicking walls configured to transport liquid through capillary action in a first direction, each set of the plurality of granular wicking walls forming respective vapor vents between them to transport vapor. A plurality of nano tube interconnect wicks embedded between respective pairs of the plurality of nano tube wicking walls transport liquid through capillary action in a second direction substantially perpendicular to the first direction. The nano tube interconnect wicks have substantially the same height as the nano tube wicking walls so that the plurality of nano tube wicking walls and the plurality of nano tube interconnect wicks enable transport of liquid through capillary action in two directions and the plurality of vapor vents transport vapor in a direction orthogonal to the first and second directions.06-25-2009
20090071634HEAT EXCHANGER AND ASSOCIATED METHODS - A heat exchanger and associated methods for sublimating solid particles therein, for conveying fluids therethrough, or both. The heat exchanger includes a chamber, and a porous member having a porous wall having pores in communication with the chamber and an interior of the porous member. A first fluid is conveyed into the porous member while a second fluid is conveyed into the porous member through the porous wall. The second fluid may form a positive flow boundary layer along the porous wall to reduce or eliminate substantial contact between the first fluid and the interior of the porous wall. The combined first and second fluids are conveyed out of the porous member. Additionally, the first fluid and the second fluid may each be conveyed into the porous member at different temperatures and may exit the porous member at substantially the same temperature.03-19-2009
20130168053THIN HEAT PIPE STRUCTURE AND METHOD OF FORMING SAME - A thin heat pipe structure includes a pipe body and at least one wick structure. The pipe body has a vaporizing end internally defining a first chamber, and a condensing end internally defining a second chamber communicating with the first chamber. A space in the first chamber is smaller than that in the second chamber. The wick structure is provided in the first and the second chamber, such that at least one channel is defined in the pipe body by the wick structure and the first and second chambers. With the above arrangements, the pressure resistance in the pipe body at the condensing end is reduced to thereby enable upgraded vapor-liquid circulation efficiency of the working fluid in the pipe body and accordingly upgraded heat dissipation effect of the thin heat pipe structure. A method of forming the thin heat pipe structure is also disclosed.07-04-2013
20130168058System, Apparatus and Method for Cooling Electronic Components - Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation. The system can operate in a passive mode only in temperatures less than 25 degrees Celsius, can switch operation between a passive mode and an active mode without throttling in temperatures less than 60 degrees Celsius, can switch operation between a passive mode and an active mode in temperatures greater than 60 degrees Celsius while maintaining about 85% or greater maximum processing speed, and can operate in a passive only mode with minimal throttling.07-04-2013
20130168057MODULAR HEAT SHIELD AND HEAT SPREADER - A modular heat shield and heat spreader (“MHS”) includes top and bottom panels, and a plurality of thermally conductive pillars located between the panels and which support the top panel. A continuous pool of liquid between the panels surrounds some portion of the pillars. Heat to which the top panel is exposed is conducted through the top panel and at least some of the pillars. The heat changes the phase of some of the liquid to a vapor, which spreads the heat to an area larger than that of the heat source and thereby dissipates the heat away from the source at a lower heat flux than that associated with the flux from the source. The MHS preferably includes wicking material on some of the pillars and on the underside of the top panel, such that the wicking material is saturated with the liquid and heated by the conducted heat.07-04-2013
20130175007HEAT-CONDUCTING MODULE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat-conducting module and a method for manufacturing the same. A hollow aluminum tube (07-11-2013
20130168054HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a heat pipe and a method for manufacturing the same. The heat pipe includes a main body having a chamber. The chamber has at least one wick region and at least one flowing channel region. The wick region is positioned adjacent to the flowing channel region and both of them axially extend in the chamber. The wick region is provided on an inner wall of the chamber. An area occupied by the wick region is smaller than a half of the circumference of the inner wall of the chamber. A wick structure in the heat pipe can be prevented from suffering damage during its production and the yield of production is increased.07-04-2013
20130168055THERMAL MODULE - A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.07-04-2013
20130175008THIN HEAT PIPE - A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process.07-11-2013
20130112375EVAPORATOR FOR LOOPED HEAT PIPE SYSTEM AND METHOD OF MANUFACTURING THE SAME - An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.05-09-2013
20130112374HEAT TRANSFER DEVICES - Heat transfer devices are described. In one example, a heat transfer device for installation in a system having a heat generating element within the system away from which heat is to be transferred is described. The heat transfer device includes a heat pipe having a first portion, a second portion, and a working fluid contained within the heat pipe for transferring heat from the first portion to the second portion. The first portion is disposed in proximity with the heat generating element. The second portion is coupled to the first portion. At least part of the second portion is disposed outside the system to dissipate heat from the heat generating element and the second portion may be variably extended outside the system.05-09-2013
20130092353VAPOR CHAMBER STRUCTURE AND METHOD OF MANUFACTURING SAME - A vapor chamber structure includes a main body formed from a first plate and a second plate, which are correspondingly closed to each other to define at least one open area on the main body and a chamber in the main body. The chamber is internally provided with at least one wick structure, a supporting structure, and a working fluid. The open area correspondingly extends through the first plate, the second plate and the chamber. When the main body is positioned on a substrate to contact with a heat source, the at least one open area allows other electronic elements higher than the heat source to extend therethrough without interfering with the direct contact of the main body with the heat source. A method of manufacturing the above-described vapor chamber structure is also disclosed.04-18-2013
20130092354HEAT PIPE HAVING A WICK WITH A HYBRID PROFILE - A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.04-18-2013
20130098582Method using heat pipes with multiple evaporator/condenser zones and heat exchangers using same - Elongated, smaller-diameter tube heat pipes have an airflow arrangement that allows for short distances between evaporating and condensing sections of the heat pipe. The heat pipe is exposed to multiple alternate hot and cold zones adjacent to each other. Each evaporator zone accepts input heat to cause evaporation of the working fluid in the wick of the immediate vicinity. The vapor produced moves to either side by local pressure differences to condense in the two adjacent condenser zones where it is absorbed by the wick as a liquid and flows in the wick back to adjacent evaporator zones at each side. Each evaporator zone creates two fluid loops whereby evaporated working fluid splits up left and right, condenses in adjacent condenser zones and flows back to the evaporator zone as a liquid within the wick. Therefore, the overall tube length can be increased indefinitely, without traditional degradation of performance.04-25-2013
20130098584HEAT CONDUCTING STRUCTURE WITH COPLANAR HEATED PORTION, MANUFACTURING METHOD THEREOF, AND HEAT SINK THEREWITH - A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (04-25-2013
20130098583HEAT PIPE DISSIPATING SYSTEM AND METHOD - In one embodiment of the disclosure, a heat pipe device for dissipating heat from a heat source includes a porous wick structure having a first porous wick portion disposed adjacent to a second porous wick portion. The first porous wick portion is defined by a first set of microgrooves. The second porous wick portion is defined by a second set of microgrooves disposed in non-parallel adjacent alignment to the first set of microgrooves. The heat pipe device may be disposed within a closed chamber enclosure to which the heat source is attached. In further embodiments, methods are disclosed for manufacturing devices for dissipating heat from a heat source, and for using devices to dissipate heat from a heat source.04-25-2013
20110048681HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.03-03-2011
20110214841FLAT HEAT PIPE STRUCTURE - A flat heat pipe structure includes a flat pipe, a radial capillary structure and an axial capillary structure. The pipe has a containing space for sealing and storing a working fluid, and the pipe is formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls, and the pipe further has an evaporation portion, and the radial capillary structure is situated in the evaporation portion and radially surrounded and attached onto the two bottom walls and two sidewalls, and the axial capillary structure is extended in a lengthwise direction of the pipe, disposed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure is extended to the evaporation portion of the pipe and coupled to the radial capillary structure.09-08-2011
20110209854Heat Sink - The heat sink includes a fin set and a heat pipe. The fin set is composed of a plurality of fins and has an exposed area formed on one side thereof. The heat pipe penetrates through the fin set and the exposed area. A portion of the heat pipe is exposed and flattened in the exposed area. The exposed and flattened portion is used for connecting a heat generating device as a thermal junction surface.09-01-2011
20110220328FLEXIBLE HEAT PIPE AND MANUFACTURING METHOD THEREOF - In a flexible heat pipe and a manufacturing method thereof, the flexible heat pipe includes a first tube body, a second tube body arranged apart from the first tube body, a flexible section, a wick structure, and a working fluid. The flexible section includes an annular elastomer and a soft encapsulating layer. The annular elastomer connects the first tube body and the second tube body. The soft encapsulating layer is set around the annular elastomer. The capillary structure is settled inside the first tube body, the second tube body, and the annular elastomer. The working fluid is filled inside the first tube body, the second tube body, and the soft encapsulating layer. Then, the flexible heat pipe can be bent to any angle or in any direction according to practical demands.09-15-2011
20100300654MODIFIED HEAT PIPE FOR PHASE CHANGE COOLING OF ELECTRONIC DEVICES - Exemplary embodiments provide a heat pipe including a flexible chamber that is capable of expanding, compressing and/or restoring. In one embodiment, the heat pipe can include a hollow metal casing including a pipe structure connected to an expandable chamber at one end of the pipe structure. The other end of the pipe structure can include an evaporating section for receiving heat and the expandable chamber can include a condensing section for releasing the heat. The expandable chamber can be configured to change in volume to control one or both of a temperature and a pressure in the hollow metal casing. The heat pipe can also include a capillary system arranged at an inner surface of the hollow metal casing that includes the pipe structure and the expandable chamber.12-02-2010
20100307722HEAT TRANSPORT DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method of manufacturing a heat transport device including the steps of stacking a first plate, a capillary member, and a second plate by interposing the capillary member between the first plate and the second plate, the first plate and the second plate constituting a container of a heat transport device configured to transport heat using phase change in a working fluid; and diffusion-bonding the first plate and the second plate while deforming the second plate to create an internal space in the container for storing the capillary member.12-09-2010
20100307719HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipation device includes a heat sink, a heat-absorbing plate with two slots defined in two lateral sides thereof, a heat pipe connecting the heat-absorbing plate and the heat sink, and a clip having an abutting portion and two locking portions extending from two ends of the abutting portion. The abutting portion presses on the heat pipe, and the locking portions insert through the slots of the heat-absorbing plate and are then bent to lock on the heat-absorbing plate to thereby secure the heat pipe on the heat-absorbing plate.12-09-2010
20100307718HEAT SINK - A heat sink includes a first fin assembly including a number of first fins, and a second fin assembly including a number of second fins. The second fin assembly can be retracted into the first fin assembly to reduce volume of the heat sink when packing the heat sink, and the second fin assembly can be extend out of the first fin assembly to increase volume of the heat sink when using the first fin assembly for heat dissipation.12-09-2010
20120273169PIPE HAVING VARIABLE CROSS SECTION - A pipe having variable cross section and including a working core pipe, capillary pipes or sheets, an outer pipe, a connection support, and a cavity. The capillary pipes or sheets are attached to an external surface of the working core pipe. The connection support connects the working core pipe and the outer pipe. The cavity is formed between the working core pipe and the outer pipe and has variable cross section.11-01-2012
20120273168HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.11-01-2012
20120273167LOOP HEAT PIPE STRUCTURE WITH LOW-PROFILE EVAPORATOR - A loop heat pipe structure includes an evaporator and a first pipe. The evaporator has a first chamber, a first wick layer, and a bottom. The first wick layer is provided in the first chamber. The first pipe includes a first inlet and a first outlet communicably connected to the evaporator. The first inlet internally defines a second chamber communicable with the first wick layer. By providing the second chamber outside the evaporator, the evaporator can have a reduced overall height without creating very high vapor pressure in the evaporator, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.11-01-2012
20130153175HEAT SINK HAVING HEAT PIPE PROTECTION MECHANISM - A heat sink having a heat pipe protection mechanism includes a heat pipe, a metallic sleeve and a plurality of heat-dissipating fins. The heat pipe has an evaporating section and a condensing section. The evaporating section is combined with a heat-dissipating base. The metallic sleeve has a closed end and an open end opposite to the closed end. The condensing section is disposed through the open end of the metallic sleeve. Each of the heat-dissipating fins has a through-hole corresponding to the heat pipe. The metallic sleeve having the condensing section disposed therein is fitted in the through-hole. By this arrangement, the condensing section is completely separated from the outside, so that the heat pipe can be protected from suffering damage due to external impacts or getting rusty. Thus, the lifetime of the heat pipe is maintained, and the frequency of repairing the heat sink is reduced.06-20-2013
20130153176FLAT TYPE HEAT PIPE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a flat type heat pipe, having an inside of which partitioned into a plurality of cells, that is capable of flexibly setting a concentration of working fluid in each cell is provided. The method includes processes of preparing a flat container, pouring, and closing. In the preparing, the flat container having the inside of which two-dimensionally partitioned into the plurality of cells is prepared. The flat container has connecting holes through which adjacent cells communicate and an inlet hole for the working fluid to be poured from outside. In the pouring, the working fluid is poured into respective cells through the inlet hole and the connecting holes. In the closing, the inlet hole and the connecting holes are closed. In one method, after sealing a specified cell, following processes of heating, removing air, pouring, evaporating, and closing are repeated for other cells.06-20-2013
20100314079HEAT DISSIPATION DEVICE - A heat dissipation device includes a housing internally divided by a partition plate into an upper and a lower space; at least one heat pipe bank having a condensing section and a vaporizing section located above and below the partition plate, respectively; and a blower fan assembly located in the housing corresponding to the vaporizing section. The housing has a first air inlet and a first air outlet located above the partition plate, and outdoor air entering into the housing via the first air inlet to flow through and exchange heat with the condensing section before exiting the housing via the first air outlet; and a second air inlet and a second air outlet located below the partition plate, and indoor air entering into the housing via the second air inlet to flow through and exchange heat with the vaporizing section before exiting the housing via the second air outlet.12-16-2010
20100314078COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF - A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.12-16-2010
20110232878HEAT PIPE, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A heat pipe to maintain an object at a substantially uniform temperature is disclosed. The heat pipe includes a chamber containing a liquid reservoir and a vapor space, part of the chamber being defined by a condensing surface, and a liquid transporter to apply a force additional to gravity to liquid to transport liquid away from the condensing surface towards the reservoir, wherein the condensing surface is shaped such that condensed liquid moves along it towards the liquid transporter.09-29-2011
20110232877COMPACT VAPOR CHAMBER AND HEAT-DISSIPATING MODULE HAVING THE SAME - A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporating section formed on a portion of the vapor chamber. An outer surface of the flat sealed casing on the evaporating section has a recess for covering the electronic heat-generating element. The recess is brought into thermal contact with the electronic heat-generating element. With this arrangement, when the compact vapor chamber is brought into thermal contact the electronic heat-generating element for heat dissipation, the distance of the electronic heat-generating element protruding from the compact vapor chamber is reduced, thereby facilitating the compact design of an electronic product. Further, the present invention provides a heat-dissipating module having such a compact vapor chamber.09-29-2011
20110232876Superconducting and isothermal heat-dissipation module - The present invention provides a superconducting and isothermal heat-dissipation module meeting the heat-dissipation demand for different heating elements. The superconducting and isothermal heat-dissipation module of the present invention includes a heat-conducting isothermal plate and a frame made according to the contour of the heating element. The heat-conducting isothermal plate has an upper and a lower covers, and plural pillar partition pieces served as support bodies, which are uprightly provided between the upper and the lower covers and is closely contacted with the inner faces of the upper and a lower covers. A cavity for filling a heat transfer medium is formed by sealing the upper, lower covers and the pillar partition pieces. The frame is provided with one or several insertion hole(s) for the insertion of said heat-conducting isothermal plate therein for mutual integration.09-29-2011
20130180688HEAT-DISSIPATING MODULE AND METHOD FOR MANUFACTURING THE SAME - In a heat-dissipating module and a method for manufacturing the same, a hollow aluminum tube is put on a corresponding heat pipe to form an aluminum-skinned heat pipe. Then, one or more aluminum-skinned heat pipes are disposed in a casting space of a die casting mold. Fins are disposed into the die casting mold. Molten aluminum materials are filled in the casting space of the die casting mold to form a heat-dissipating module. By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe and connect with the fins, thereby finishing the heat-dissipating module.07-18-2013
20130126131HEAT PIPE STRUCTURE - A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first chamber and a working fluid. A first capillary structure is disposed on outer circumference of the second tubular body. The second tubular body is disposed in the first chamber and has a second chamber. In the heat pipe structure, the vapor-phase working fluid flows within the first chamber, while the liquid-phase working fluid flows within the second chamber in separation from the vapor-phase working fluid. Accordingly, the impedance against the vapor is greatly reduced and the heat transfer efficiency is greatly enhanced to achieve excellent heat dissipation effect.05-23-2013
20130126132VAPOR CHAMBER WITH INTEGRALLY FORMED WICK STRUCTURE AND METHOD OF MANUFACTURING SAME - A vapor chamber includes a main body and a wick structure. The main body includes a first and a second plate, which are closed to each other to define a chamber therein between. A working fluid is filled in the chamber. The wick structure is integrally formed on two facing inner surfaces of the first and the second plate by way of mechanical processing, and is projected from the first and second plates toward a central space in the chamber. By integrally forming the wick structure on the first and second plates, the vapor chamber can be manufactured at reduced time and labor to obtain increased yield. A method of manufacturing vapor chamber with integrally formed wick structure is also disclosed.05-23-2013
20110303392FLAT HEAT PIPE - A thin flat heat pipe capable of transporting heat even if it is bent is provided. The flat heat pipe comprises: a working fluid to be evaporated when heated and to be condensed when the heat dissipates; and a wick, which is formed by bundling a plurality of thin wires while twisting along a center axis thereof, and which is adapted to create a capillary pressure for returning the liquid phase working fluid to a portion where evaporation takes place. The wick is arranged over the entire length of the flat container while being in contact with both upper and lower inner faces of the container or with an inner side face of the container in a manner such that an inner space of the container for letting through an evaporated working fluid is not closed, and a contact portion between the wick and the container is fixed by sintering over the entire length of the wick.12-15-2011
20110308772Heat Pipe And Electronic Device - The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (12-22-2011
20130186602HEAT TRANSFER SYSTEM - The invention relates to a heat transfer system comprising one main capillary pumped diphasic fluid loop and a secondary capillary pumped diphasic fluid loop suitable for cooling at least one hot source. The main fluid loop and the secondary fluid loop comprising one evaporator, a vapour pipe capable of conveying the cooling fluid in the vapour state from the evaporator to a condenser, a condenser and a liquid pipe capable of conveying the cooling fluid in the liquid state from the condenser to the evaporator so that the cooling fluid of the main fluid loop is in heat exchange with the cooling fluid of the secondary fluid loop.07-25-2013
20130186600FLAT HEAT PIPE AND METHOD OF MANUFACTURING THE SAME - A flat heat pipe includes a flat hollow pipe and a capillary structure. The flat hollow pipe has a first flat portion, a second flat portion and two arc portions, wherein the two arc portions are connected to both sides of the first and second flat portions. The capillary structure is formed in the flat hollow pipe. The capillary structure has a central portion and two edge portions, wherein the central portion is located on an inner wall of the first flat portion, the two edge portions are located on inner walls of the two arc portions respectively, and a thickness of the central portion is smaller than a thickness of each of the two edge portions.07-25-2013
20130186601WICKLESS HEAT PIPE AND THERMAL GROUND PLANE - A wickless heat pipe including a first tube and a second tube. The first tube may form a first shape extending longitudinally in a first direction. The second tube may form a second shape extending longitudinally in a second direction different from the first direction. The first tube and the second tube intersect at at least one location. The two tubes may intersect at a right angle or an oblique angle. The first and second tube may intersect at a plurality of locations. The tubes may be formed from a metal plate used as a thermal ground plane.07-25-2013
20120043060LOOP HEAT PIPE - An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.02-23-2012
20120043058HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a centrifugal fan comprising an air outlet, a fin assembly arranged at the air outlet, and a heat pipe comprising an evaporating section and a condensing section. The fin assembly comprises fins. The fins are stacked together with one above another along a central axis of the centrifugal fan. Each of the fins has at least a flange bent at a lateral side thereof. The flanges of the fins abut against each other and form a side face parallel to the central axis of the centrifugal fan. The condensing section is attached to and thermally contacts the side face of the fin assembly.02-23-2012
20120043057HEAT-DISSIPATING MODULE - A heat-dissipating module includes a base and at least one heat pipe. The base has a heat-absorbing surface and a heat-conducting surface opposite to the heat-absorbing surface. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion has a non-planar surface and a planar surface abutting against the heat-conducting surface to be integrally connected therewith. With the integral connection of the base and the heat pipe, the manufacturing procedure is simplified with fewer working steps. Further, the production cost of the heat-dissipating module is saved.02-23-2012
20130199757HEAT-DISSIPATING MODULE HAVING LOOP-TYPE VAPOR CHAMBER - A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.08-08-2013
20120298337METHOD AND APPARATUS FOR RADIATIVE HEAT TRANSFER AUGMENTATION FOR AVIATION ELECTRONIC EQUIPMENTS COOLED BY CONVECTION - A method and apparatus for radiative heat transfer augmentation for aviation electronic equipments cooled by forced and/or natural convection are disclosed. In one embodiment, the apparatus includes a first heat dissipation device to dissipate heat from the aviation electronic equipments housed in an aviation electronic equipment rack using forced convection. Further, the apparatus includes a second heat dissipation device to enhance heat dissipation from the aviation electronic equipments by radiation and natural convection. Furthermore, the second heat dissipation device is strategically disposed with respect to aircraft skin and configured to maximize radiative view factor.11-29-2012
20120085520HEAT SPREADER WITH FLEXIBLY SUPPORTED HEAT PIPE - A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device which, apart from an improved heat coupling between a chip and a heat sink, also comprise a flexible coupling assembly which can compensate for tolerances in the components and in the assembling process. The heat spreader has a base plate (04-12-2012
20120085519HEAT-DISSIPATING STRUCTURE FOR MOTOR STATOR - A heat-dissipating structure for a motor stator is applied to a heat-dissipating fan and includes a silicon steel set and at least one heat pipe. The silicon steel set has a plurality of silicon steel pieces stacked up each other. Magnetic poles of the respective silicon steel pieces are stacked up to form at least one magnetic post. At least one coil set is wound on the magnetic poles. The heat pipe is connected to the silicon steel pieces for thermally conducting the heat of the silicon steel set and the coil set. With this arrangement, the temperature of the silicon steel set and the coil set is lowered, and the performance of the heat-dissipating fan is improved.04-12-2012
20120085518METHOD AND APPARATUS FOR COOLING A FIBER LASER OR AMPLIFIER - A system and method for cooling an optical fiber includes a flexible heat sink member, a heat pipe evaporator, and a thermal storage medium. The flexible heat sink member is in thermal contact with the optical fiber. The heat pipe evaporator is configured to dissipate heat from the optical fiber. The thermal storage medium is in thermal contact with the flexible heat sink member and the heat pipe evaporator. The flexible heat sink member is configured to compensate for any mismatch in coefficient of thermal expansion between material of the optical fiber and material of the flexible heat sink member so as to provide radial compliance and to maintain direct thermal contact between the optical fiber and the flexible heat sink member.04-12-2012
20130206369HEAT DISSIPATING DEVICE - A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.08-15-2013
20130206370ELECTRONIC APPARATUS - An electronic apparatus includes an extruded metallic frame with walls which are integrated parts of the extruded metallic frame, at least one extruded flow channel in at least one of the walls for passing a cooling fluid within the respective wall, an inlet arranged outside the electronic apparatus and an outlet arranged outside the electronic apparatus for providing a flow path via the at least one extruded flow channel, and detachable covers which are attached to the walls for sealing off at least one electric component space from an outside of the electronic apparatus.08-15-2013

Patent applications in class Utilizing capillary attraction