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Utilizing change of state

Subclass of:

165 - Heat exchange

165104110 - INTERMEDIATE FLUENT HEAT EXCHANGE MATERIAL RECEIVING AND DISCHARGING HEAT

165104190 - Liquid fluent heat exchange material

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
165104260 Utilizing capillary attraction 444
165104220 Including means to move heat exchange material in liquid state 22
165104270 With pressurizing means or degassifying means 8
Entries
DocumentTitleDate
20130025826PHASE CHANGE COOLER AND ELECTRONIC EQUIPMENT PROVIDED WITH SAME - A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.01-31-2013
20130043004LIGHTWEIGHT HEAT PIPE AND METHOD OF MAKING THE SAME - In a lightweight heat pipe and a method for making the lightweight heat pipe, a first hollow pipe and a second hollow pipe making of two different materials are provided. The first hollow pipe is disposed into the second hollow pipe along an axial direction of the second hollow pipe. An inner wall surface of the second hollow pipe is attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe. An inner space of the first hollow pipe is then vacuumed, and the pipe body is sealed after the working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.02-21-2013
20130075064Heat Exchanger - A heat exchanger is disclosed for condensing a vapour to a condensate. The exchanger comprises a first heat exchanging chamber, a second heat exchanging chamber and an array of heat pipes which are arranged to extend from within the first heat exchanging chamber to within the second heat exchanging chamber. The first heat exchanging chamber comprises an inlet for receiving a coolant into the chamber and an outlet through which the coolant can exit the first chamber, the coolant being arranged to pass over the portion of the heat pipes which extend within the first chamber. The second heat exchanging chamber comprises an inlet for receiving the vapour into the chamber and an outlet through which the condensate can exit the second chamber, the vapour being arranged to pass over the portion of the heat pipes which extend within the second chamber. The heat exchanger further comprises a fm arranged in contact with the portion of at least one of the heat pipes within the first heat exchanging chamber, which is arranged to increase thermal transfer between said portion of the heat pipe and the coolant.03-28-2013
20130037240REFRIGERATOR - Disclosed herein is a refrigerator. The refrigerator includes a main body including inner liners defining a freezer compartment and refrigerator compartment, doors rotatably coupled to the main body, gaskets installed at rears of the doors, each of the gaskets having a magnet provided therein, an intermediate partition wall formed by filling a space between the inner liners with an insulation material, an intermediate front plate disposed at a front of the intermediate partition wall to fix the inner liners, and a heat pipe installed at the front of the intermediate partition wall in a line to prevent dew from being formed on the intermediate front plate, wherein the intermediate front plate is formed in an asymmetric fashion so that the heat pipe installed at the front of the intermediate partition wall is fixed to a middle portion of the intermediate front plate in a tight contact fashion.02-14-2013
20100012299HEAT EXCHANGER UNIT - According to the present invention, there is provided a heat exchanger unit having, over a base, a surface-modified portion composed of a metal, the surface-modified portion being brought into contact with a flow path provided for a liquid refrigerant, wherein the liquid refrigerant is a liquid having a surface tension smaller than that of water, and the surface-modified portion has a porous structure, in which a plurality of recesses are provided on the flow path side thereof, each recess has an introduction path having a cross-section area gradually reduced from the inlet of the recess, and a cavity communicated with the introduction path while placing an inflection portion in between, and the shortest distance between the inflection portion and the flow path is larger than the shortest distance between the cavity and the flow path.01-21-2010
20130081787HEAT PIPE WITH SEALED VESICLE - A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section.04-04-2013
20120175083HEAT TRANSFER DEVICE - A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.07-12-2012
20120175082SOLAR HEAT PIPE HEAT EXCHANGER - This invention relates to the process of collecting heat and removing heat from a heat pipe for solar energy applications. More specifically, this invention is a solar energy system that elegantly couples a heat pipe and a single header heat transfer assembly that has the capability of interchangeable operational designs using solar collector panel, solar vacuum tube, or integrated solar thermal and photovoltaic array configurations. The header assembly is structurally and thermally connected to the heat pipe by a heat pipe receiver which surrounds the condenser end of the heat pipe and plugs into the interior of the header assembly.07-12-2012
20090120618COOLING APPARATUS FOR A COMPUTER SYSTEM - The invention relates to a cooling apparatus for a computer system and a method for cooling at least one heat producing component of a computer system.05-14-2009
20100044013Radiator of Automobile - Disclosed is a radiator which can simplify the structure, cut down weight and costs, and reduce assembly process by coupling a plurality of core portions to a single header and a single tank portion. Furthermore, by arranging the plurality of core portions in a front-rear direction, the structure is simplified and it becomes easier to secure an installation space, thus allowing the radiator according to the present invention to be applied to more cars. Furthermore, by configuring the tank portion so as to be partitioned by a pocket or the like, heat transfer between the cooling water cooling the internal combustion engine and the cooling water cooling the electric field system is blocked, thereby improving cooling efficiency much more.02-25-2010
20120211201COOLING DEVICE FOR A HEAT SOURCE - A cooling element for a heat source, especially LED modules with many components, includes a base body in thermal and mechanical contact with a body of the heat source, at least one heat pipe having an end section inserted into the base body in a form-fitting and thermoconducting manner, and at least one cooling body having cooling body lamellae on the other end section of the heat pipe. The heat pipes extend over the entire length of the base body such that a hot zone of the heat source lies on a contact surface of the base body, the heat pipes extend parallel to each other and to the contact surface of the heat source. The base body is fixed to the body of the heat source, base body lamellae being provided on the outer side of the base body, formed as a single component thereon or connected thereto.08-23-2012
20120180993HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE - A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section.07-19-2012
20120180992AXIAL FLOW HEAT EXCHANGER DEVICES AND METHODS FOR HEAT TRANSFER USING AXIAL FLOW DEVICES - Systems and methods described herein are directed to rotary heat exchangers configured to transfer heat to a heat transfer medium flowing in substantially axial direction within the heat exchangers. Exemplary heat exchangers include a heat conducting structure which is configured to be in thermal contact with a thermal load or a thermal sink, and a heat transfer structure rotatably coupled to the heat conducting structure to form a gap region between the heat conducting structure and the heat transfer structure, the heat transfer structure being configured to rotate during operation of the device. In example devices heat may be transferred across the gap region from a heated axial flow of the heat transfer medium to a cool stationary heat conducting structure, or from a heated stationary conducting structure to a cool axial flow of the heat transfer medium.07-19-2012
20100006265COOLING SYSTEM - A cooling system to cool an electronic component is disclosed. The cooling system includes a first connection to receive refrigerant, a region to transfer heat from an electronic component to the refrigerant from the first connection, at least one of a cooling coil, a cooling tube, or a cooling block positioned in the region and in fluid communication with the first connection, and a second connection to return refrigerant from the region to an evaporator.01-14-2010
20120216991METHOD FOR ASSEMBLING HEAT PIPE AND THERMO-CONDUCTIVE BODY AND STRUCTURE THEREOF - A heat pipe and thermo-conductive body assembling structure and a method for manufacturing the same are disclosed. The thermo-conductive body is provided a trough with two pressing arms at the opening thereof. The heat pipe is accommodated in the trough and pressed by the pressing arms. An exposed portion of the heat pipe and outer surfaces of the pressing arms are coplanar.08-30-2012
20130056178EBULLIENT COOLING DEVICE - An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink.03-07-2013
20110005724HEAT TRANSPORT DEVICE MANUFACTURING METHOD AND HEAT TRANSPORT DEVICE - [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding.01-13-2011
20090056916HEAT EXCHANGER - The present disclosure provides a heat exchanger for removing heat energy from a heat generator, comprising at least one conduit for a working fluid, which is arranged in an upright position of at least 45°, each conduit having an exterior wall and at least one interior wall for forming at least one evaporator channel and at least one condenser channel within the conduit. Furthermore, the heat exchanger comprises a first heat transfer element for transferring heat into the evaporator channel and a second heat transfer element for transferring heat out of the condenser channel.03-05-2009
20090266520PHASE CONVERSION COOLER AND MOBILE EQUIPMENT - A small and lightweight phase conversion cooler having high cooling efficiency and mobile equipment. The phase conversion cooler has a cooling head having a first side in contact with a cooled object, a first circular port provided in a second side, a second circular port provided in a third side, a first pipe connected to the first circular port, a condenser part placed in a heat dissipation environment and a second pipe connected to the second circular port. The cooling head is formed by resin molding. The first side of the cooling head is provided with a metal plate.10-29-2009
20120193076COOLING STRUCTURE FOR AN ELECTRONIC COMPONENT AND ELECTRONIC INSTRUMENT - A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the ehoofuocmmionnductordcnncni. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.08-02-2012
20130160974LOOP HEAT PIPE AND ELECTRONIC APPARATUS - An evaporator of a loop heat pipe includes a case having a liquid flow inlet and a vapor flow outlet, and at least one porous body disposed inside the case and configured to guide liquid-phase working fluid inward of the case. The evaporator further includes a liquid supply duct disposed inside the case and configured to guide the working fluid into the porous body from the liquid flow inlet. The liquid supply duct is made of a material having lower heat conductivity than a material of the case. The working fluid having flowed into the evaporator is prevented from evaporating before reaching the porous body.06-27-2013
20120234517INTERMEDIATE HEAT EXCHANGER - An intermediate heat exchanger 09-20-2012
20130014916MULTIFUNCTIONAL THERMAL MANAGEMENT SYSTEM AND RELATED METHOD - A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces.01-17-2013
20090114374HEAT REMOVAL METHOD AND HEAT REMOVAL APPARATUS - A heat removal apparatus able to remove heat with a high heat flux from a large area is provided. A heat removal apparatus 05-07-2009
20130020053LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING - Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.01-24-2013
20130020052HEAT DISSIPATION DEVICE WITH HEAT PIPE WITHIN BASE - A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously.01-24-2013
20120186784MICRO VAPOR CHAMBER - A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly.07-26-2012
20120097369HEAT EXCHANGER - The disclosure relates to a heat exchanger including at least a first group and a second group of channels arranged to provide fluid paths between a first end and a second end of the heat exchanger. Connecting parts are arranged at the first end and at the second end of the heat exchanger. A first heat transfer element transfers a heat load to fluid, and a second heat transfer element transfers a heat load from the fluid. The channels have capillary dimensions. The connecting parts include fluid distribution elements, and the first and second heat transfer element contact all channels04-26-2012
20110214840BOILING HEAT TRANSFER DEVICE - A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.09-08-2011
20090188650LIQUID DISTRIBUTION IN AN EVAPORATIVE HEAT REJECTION SYSTEM - A liquid distribution system for an evaporative heat rejection system that includes a heat transfer surface is disclosed. The liquid distribution system includes a plurality of liquid conduits adapted to transport liquid for distribution over the heat transfer surface, and each liquid conduit having at least one orifice. At least a first orifice in a first conduit and a second orifice in a second conduit are positioned such that when the liquid is transported under a predetermined pressure thought the conduits, the liquid is emitted from the first and second orifices in first and second streams, respectively, that collide at a collision site, thus causing liquid to be scattered from the collision site and distributed over the heat transfer surface.07-30-2009
20090151904HEATING DEVICE - A heating device includes a heat-conductive tube unit adapted for passage of a heated fluid therethrough and having two opposite end portions and a middle portion extending between the end portions, a phase-change material enclosing the middle portion of the heat-conductive tube unit and that is capable of storing heat through phase changing, and an enclosure enclosing the phase-change material for preventing leakage of the phase-change material.06-18-2009
20090145582Heat dissipation device - A heat dissipation device includes a base adapted for absorbing heat from an electronic device, a heat spreader located above the base, a first fin assembly including a plurality of fins arranged between the base and the heat spreader, and a heat pipe thermally contacting with the base and the heat spreader. A channel is defined between every two adjacent fins. Each of the fins extends along a front-to-rear direction. The heat pipe includes an evaporating portion thermally contacting with the base, a condensing portion thermally contacting with the heat spreader, and a connecting portion interconnecting the evaporating portion and the condensing portion. The evaporating portion and condensing portion of the heat pipe are parallel to the fins, and the connecting portion of the heat pipe is located at a rear side of the first fin assembly.06-11-2009
20110108241METHOD FOR MAKING PHASE CHANGE PRODUCTS FROM AN ENCAPSULATED PHASE CHANGE MATERIAL - The present invention provides methods of producing manufactured aggregates and other compositions from an encapsulated PCM slurry, suspension or emulsion by combining a cementitious binder and an adsorbent and/or absorbent with the PCM slurry. The encapsulated PCM can be introduced as damp cake or dry form as alternatives to the liquid forms. Fire resistant aggregates can be produced in an agglomeration process. The ingredients can also be mixed to form a viscous mass which can be extruded or otherwise formed to produce useful products.05-12-2011
20120186785HEAT PIPE SYSTEM HAVING COMMON VAPOR RAIL FOR USE IN A VENTILATION SYSTEM - A heat transfer system is adapted for transferring heat between two different ducts in a ventilation system. The system has a heat pipe having a plurality of conduits. Each conduit including an evaporator section extending laterally from a first open end of the respective conduit, a condenser section extending laterally from a second open end of the respective conduit, and a liquid return section. The liquid return section of at least one conduit being distinct from the liquid return section of another of the conduits. A common vapor manifold is in fluid communication with and extends between the first and second open ends of each of said plurality of conduits so vapors produced in the evaporator sections can flow from the first open ends through the common vapor manifold to the second open ends without flowing through the conduits.07-26-2012
20080236796Vapor Augmented Heatsink with Multi-Wick Structure - A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.10-02-2008
20090277612UNDERWATER COOLING ASSEMBLY - A lightweight underwater cooling assembly with a high cooling capacity comprises: an assembly of heat exchanger tubes (11-12-2009
20090294103PROCESS TO REDUCE THE TEMPERATURE OF A HYDROGEN AND CARBON MONOXIDE CONTAINING GAS AND HEAT EXCHANGER FOR USE IN SAID PROCESS - Process to reduce the temperature of a hydrogen and carbon monoxide containing gas by contacting the gas with a metal alloy surface having a lower temperature than the temperature of the gas, wherein the metal alloy surface comprises between 0 and 20 wt % iron, between 0 and 5 wt % aluminium, between 0 and 5 wt % silicon, between 20 and 50 wt % chromium and at least 35 wt % nickel, wherein the metal alloy surface maintains it lower temperature than the temperature of the gas by making use of coolant water.12-03-2009
20110203775System in a Network Node for Regulating Temperature of Electronic Equipment - A system in a radio network node for regulating temperature of electronic equipment comprises the electronic equipment and a heat exchanger unit (08-25-2011
20080245510HEAT DISSIPATION APPARATUS, TWO-PHASE HEAT EXCHANGE DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation apparatus includes a plurality of fins and a two-phase heat exchange device connected to the fins. The two-phase heat exchange device includes a main body and a continuous wick structure. The main body forms a closed space therein, and the continuous wick structure is disposed on the entire inner surface of the main body. Methods for manufacturing a two-phase heat exchange device and a heat dissipation apparatus are also introduced.10-09-2008
20080314563Method for Controlling the Temperature of Exothermic Chemical Reactions - A method for controlling the temperature of an exothermic reaction with simultaneous production of steam is based on the use of heat exchangers (12-25-2008
20080308259MULTIPLE TEMPERATURE SENSITIVE DEVICES USING TWO HEAT PIPES - A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.12-18-2008
20130118715Heat transfer system applying boundary later penetration - A heat transfer system is disclosed incorporating a passive pump utilizing bubble technology to cycle a coolant through associated channels. The system includes a housing and channels containing a slurry consisting of liquid having a low boiling point and microspheres formed of metallic foam introduced into said liquid. The microspheres are caused to flow onto a heat source and penetrate the coolant boundary layer and thereby provide an efficient and fast transfer of heat from the source onto the microspheres and the coolant. The microspheres further provide and efficient and fast transfer of heat through the slurry to a heat dissipating component.05-16-2013
20130118716HEAT SINK HAVING HEAT-DISSIPATING FINS CAPABLE OF INCREASING HEAT-DISSIPATING AREA - A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.05-16-2013
20090020266System and Method of Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements - According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.01-22-2009
20110005723IONIC LIQUID STABILIZER COMPOSITIONS - The present invention relates to compositions comprising at least one ionic liquid and CF01-13-2011
20110220327EBULLIENT COOLING DEVICE - Provided is an ebullient cooling device that can prevent the freezing of liquid cooling medium, and which can inhibit the occurrence of burnout. An ebullient cooling device includes an accommodating unit in which a liquid cooling medium is accommodated, the liquid cooling medium receiving heat that results from a heating element and is an ebullient cooling device to be installed in vehicle, wherein the liquid cooling medium is a mixed liquid of water and ethanol, and the mixed liquid has an ethanol concentration of 40% by mass or more.09-15-2011
20110220326ENERGY RECOVERY UNIT - Aspects relate to an energy recovery unit comprising a vessel having a condensate inlet and a condensate outlet and a fluid feed line defining a fluid path. First and second heat exchangers are located within the vessel and are arranged to transfer heat from flash vapor and condensate respectively, to fluid in the fluid feed line. The energy recovery unit can be used to recover waste energy from condensate and flash steam and use it to pre-heat process water, such as boiler feed water.09-15-2011
20120067551THERMAL ENERGY STORAGE USING SUPERCRITICAL FLUIDS - A thermal energy storage system is described employing latent heat storage of a supercritical fluid instead of typical phase change materials. Two fundamental thermodynamic concepts are invoked. First, by using the latent heat of liquid/vapor phase change, high energy density storage is feasible. Second, by operating the thermal energy storage system at a higher pressure, the saturation temperature is increased to operate at molten salt temperatures and above. Beyond the two-phase regime, supercritical operation permits capturing and utilizing heat taking advantage of latent and sensible heat, both in the two-phase regime as well as in supercritical regime while at the same time, reducing the required volume by taking advantage of the high compressibilities.03-22-2012
20090084525HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME - A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.04-02-2009
20090084524Evaporator and vapor production method - An evaporator includes a double pipe provided between an outer cylindrical member and an inner cylindrical member. The double pipe includes an inner pipe as a passage of water and an outer pipe as a passage of raw fuel. The inner pipe has a plurality of small holes connected to the outer pipe for maintaining the pressurized state of the water in the inner pipe. When the water gushes out of the small holes of the inner pipe in the outer pipe, phase transition of the water from the liquid phase to the gas phase occurs, and the water vapor is mixed with the raw fuel in the gas phase in the outer pipe.04-02-2009
20090211733METHOD FOR EVAPORATION AND/OR CONDENSATION IN A HEAT EXCHANGER - The invention concerns a method for evaporation and/or condensation of at least one fluid in a heat exchanger consisting of a stack of at least one tube (08-27-2009
20090211734CLOSED CYCLE HEAT TRANSFER DEVICE AND METHOD - A closed cycle heat transfer device comprising a boiler (08-27-2009
20090260782Heat sink base plate with heat pipe - A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.10-22-2009
20120267077COOLING APPARATUSES AND POWER ELECTRONICS MODULES COMPRISING THE SAME - Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.10-25-2012
20100155027COOLING DEVICE - A cooling device includes a case including a mount surface having a power transistor mounted thereon, a coolant accommodating chamber formed in the case located above the mount surface, for accommodating a coolant capable of evaporating by heat from the power transistor, a cooling pipe provided in the case and being capable of cooling the coolant in a gaseous state, and a defining member provided in the coolant accommodating chamber and being capable of defining in the coolant accommodating chamber a first region capable of guiding the coolant in a gaseous state evaporated by the heat from the power transistor toward the cooling pipe, and a second region located downstream in a flow direction of the coolant with respect to the first region and being capable of guiding the coolant cooled by the cooling pipe toward a bottom of the coolant accommodating chamber.06-24-2010
20120103570Natural Draft Condenser - A system for condensing steam includes a steam supply duct, a supply riser, a supply manifold, a pair of condensing panels, a return manifold, and a condensate return. The steam supply duct is configured to convey steam from a steam generator. The supply riser is configured to convey steam from the steam supply duct. The supply manifold is configured to convey steam from the supply riser. The pair of condensing panels is configured to receive steam from the supply manifold. The supply manifold bifurcates with each bifurcation being configured to supply a respective condensing panel of the pair of condensing panels. The return manifold is configured to receive condensate from the pair of condensing panels. The condensate return duct is configured to convey condensate from the return manifold to the steam generator.05-03-2012
20100186929METHOD AND APPARATUS FOR COOLING A HYDROCARBON STREAM - A mixed refrigerant stream (07-29-2010
20090078395TEMPERATURE REGULATING MEMBER - A temperature regulating member for avoiding a deterioration in heat radiating output efficiency and deterioration in buffering occurring due to a non-uniform heat distribution within the heat storage material. Heat non-uniformities within the heat storage material are eliminated by inserting one or multiple agitating tools inside the heat storage material by generating an agitating current occurring due to use of agitator tools whose relative positions change within the heat storage material during shipping.03-26-2009
20120031586Condenser - Each tube and a corresponding fin satisfy all of the following relationships: Lp−t≧0.03Tr+0.22; Lp−t≦0.115Tr02-09-2012
20100252238TWO-PHASE-FLOW, PANEL-COOLED, BATTERY APPARATUS AND METHOD - Two-phase, boiling heat transfer in confined channels close to a source of heat, such as an electrical component or device, carries the latent heat of vapors away to remote locations where “real estate” demands of air convection are tolerable operationally, economically, and technologically. Liquid-to-vapor, phase-change, heat transfer in a narrow channel (e.g., typically less than 0.200 inches total thickness, and often less than 0.150 in the channel itself) improves by several hundred percent the heat extraction from modest temperature (e.g., about 120 degree F.) devices, when compared to heat fluxes in pool boiling. Saturated working fluids provide nearly isothermal conditions in the working fluid. Minimal conduction paths provide minimal temperature gradients, and capillary action may maintain nearly constant temperature conditions about a surface of a heat source, while carrying heat of vaporization away to a condensation location.10-07-2010
20090236079NANOPARTICLE-ENHANCED PHASE CHANGE MATERIALS (NEPCM) WITH GREAT POTENTIAL FOR IMPROVED THERMAL ENERGY STORAGE - Improved functionality of phase change materials (PCM) through dispersion of nanoparticles is described. The resulting nanoparticle-enhanced phase change materials (NEPCM) exhibit enhanced thermal conductivity in comparison to the base material. Starting with steady state natural convection within a differentially-heated square cavity that contains a nanofluid (water plus copper nanoparticles), the nanofluid is allowed to undergo solidification. Partly due to increase of thermal conductivity and also lowering of the latent heat of fusion, higher heat release rate of the NEPCM in relation to the conventional PCM is observed. The predicted increase of the heat release rate of the NEPCM is a clear indicator of its great potential for diverse thermal energy storage applications.09-24-2009
20090071630Cooling System for High Power Vacuum Tubes - According to one embodiment, a two-phase cooling system includes a condensing heat exchanger fluidly coupled to an evaporator assembly and a pressure controller. The condensing heat exchanger condenses a coolant from a vapor phase to a liquid phase by removing heat from the coolant. The evaporator assembly is thermally coupled to a vacuum tube and operable to receive liquid coolant from the condensing heat exchanger, cool the vacuum tube by evaporating the coolant from the liquid phase to the vapor phase, and transporting the evaporated coolant to the condensing heat exchanger. The pressure controller maintains the pressure of the coolant in the evaporator assembly at a sub-ambient pressure to lower the boiling point of the coolant for reducing the operating temperature of the vacuum tube.03-19-2009
20090071629Apparatus for cooling components in spacecraft - The invention relates to an apparatus for cooling components in spacecraft, comprising a heat radiator (03-19-2009
20090071628HEAT-RADIATING DEVICE WITH COMPOSITE RADIATION EFFICIENCY - The heat-radiating device with composite heat radiation efficiency includes a foundation with a heating surface and a radiating surface. The foundation has an inner space for inserting phase-changing materials. A heat pipe includes a heat-absorbing end placed into the foundation and a radiating end protruded out of the foundation. A radiating fin set is arranged onto the radiating end of the heat pipe. The heat-radiating device enables the heat absorbed by the foundation to be quickly guided out of the foundation through the heat pipe. The radiation area is increased by the radiating fin set for improved heat radiation efficiency. The phase-changing material assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device has a composite heat radiation effect with improved applicability.03-19-2009
20110127010MULTI-PASSAGE THERMAL SHEET AND HEAT EXCHANGER EQUIPPED THEREWITH - The present invention concerns a novel thermal sheet, which is divided into at least two passages by means of rolling or welding seams, and thermal sheet modules constructed thereof, wherein the passages are connected through common feed and discharge lines for a cooling or heating agent supply. Such thermal sheets are referred to as multi-passage thermal sheets.06-02-2011
20110127011HEAT EXCHANGER - An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel.06-02-2011
20110108242Method and Apparatus for Cooling a Temperature-Sensitive Assembly of a Motor Vehicle - A cooling arrangement for cooling a temperature-sensitive assembly, (such as an electrical assembly) of a motor vehicle includes a condenser for liquefying at least a partial volume of a cooling medium in a cooling circuit, and an evaporator disposed downstream of the condenser on which the cooling medium can impinge and to which heat from the electrical assembly (12) can be applied. The cooling arrangement comprises a pump device by which the evaporator can be charged by at least the liquefied partial volume of the cooling medium. A method for cooling a temperature-sensitive assembly, such an electrical assembly, of a motor vehicle is also provided.05-12-2011
20110024083HEAT EXCHANGER - A heat exchanger including a heat exchange fluid inlet, tubing coupled to the heat exchange fluid inlet, the tubing being configured to direct a flow of heat exchange fluid through the heat exchanger, the flow of fluid having a main fluid flow direction, and an air inlet configured to direct a flow of air in a generally collinear relationship with the main fluid flow direction.02-03-2011
20110024084DIRECT CONTACT HEAT EXCHANGER AND METHODS FOR MAKING AND USING SAME - A direct heat exchange method and apparatus for recovering heat from a liquid heat source is disclosed, where the method includes contacting a liquid heat source stream with a multi-component hydrocarbon fluid, where the hydrocarbon fluid compositions has a linear or substantially linear temperature versus enthalpy relationship over the temperature range of the direct heat exchange apparatus.02-03-2011
20110030921VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.02-10-2011
20100155028Combined Device Comprising An Internal Heat Exchanger And An Accumulator That Make Up An Air-Conditioning Loop - The invention relates to a combined device (06-24-2010
20100252237HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT MANUFACTURING METHOD - A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.10-07-2010
20100065253Condenser - A condenser having improved condensation performance is provided. The condenser includes a plurality of cooling pipes, being disposed in a chassis to which the steam is introduced, through the interior of which cooling water used for heat exchange with steam flows; an inner channel that extends in a top-bottom direction and that is surrounded by the plurality of cooling pipes; a plurality of pipe-supporting plates disposed at a distance from one another in a direction in which the plurality of cooling pipes extend to support the plurality of cooling pipes; and a water receiving portion disposed between the plurality of pipe-supporting plates and being inclined downward from one pipe-supporting plate to the other pipe-supporting plate.03-18-2010
20130186598Heat Transfer Device - A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.07-25-2013
20110100604HEAT RADIATING DEVICE AND MANUFACTURING METHOD OF HEAT RADIATING DEVICE - A heat radiating device for radiating heat of a circuit, includes a heat pipe which has a first straight portion and a second straight portion parallel with the first straight portion, and a curved portion connected to the first and second straight portions, a first base which is in contact with the circuit and is joined at a first surface thereof opposite to a surface thereof facing the circuit, to the first straight portion; a plurality of first fins which are provided on the first surface, have flat surfaces perpendicular to the first straight portion, and cross the second straight portion; a second base which has a second surface perpendicular to the first base and the first straight portion and is joined to the first heat pipe; and a plurality of second fins which are provided on the second surface and extend to a direction perpendicular to the second surface.05-05-2011
20110067842FLUID ENCAPSULATED HEAT TRANSFER VESSEL AND METHOD - A heat transfer vessel is provided which facilitates heating of a substance when disposed therein. The vessel is a partially hollow structure which includes a chamber formed between an outer shell and an inner shell, in base and sidewall portions of the vessel. A heat transfer fluid is disposed within the chamber to facilitate transfer of heat from the outer shell to the inner shell, and therefore, to a substance when disposed within the vessel. The heat transfer fluid is a two-phase encapsulated fluid with a liquid state which undergoes boiling with the application of heat to the outer shell and a vapor state which condenses with contact to the inner shell, thereby facilitating transfer of heat from the outer shell to the inner shell, and hence to the substance when disposed within the vessel.03-24-2011
20110048676COOLING SYSTEM AND ELECTRONIC APPARATUS APPLYING THE SAME THEREIN - A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 03-03-2011
20090000772CONTROL SCHEME FOR AN EVAPORATOR OPERATING AT CONDITIONS APPROACHING THERMODYNAMIC LIMITS - A heat exchanger assembly includes a plurality of evaporative heat exchangers that are selectively feed evaporant to tailor operation to current heat load in order to maintain operation in thermodynamically extreme operating conditions.01-01-2009
20110277962PRODUCTION OF PROCESS GAS BY HEAT RECOVERY FROM LOW-TEMPERATURE WASTE HEAT - Process for heat utilization in steam reforming, having a high-temperature conversion unit, a first heat exchanger, boiler feed water preheater, product condensate heat exchanger, and low-pressure evaporator, a cooling section, in which the process gas is further cooled and a condensate stream is generated and the resultant process gas is passed through at least one unit for further processing. Wherein a first part of the boiler feed water stream is passed into the low-pressure evaporator, and the low-pressure steam generated is divided and a first substream of the low-pressure steam is conducted into the water treatment unit for heat transfer and a second substream of the low-pressure steam is passed to at least one consumer. A second part of the boiler feed water stream is passed via a heat exchanger and one or more boiler feed water preheaters and finally passed for steam generation.11-17-2011
20120199322COOLING METHOD AND DEVICE FOR COOLING A MEDIUM-VOLTAGE ELECTRICAL INSTALLATION IN A PROTECTIVE SHEATH - A device including a phase-change heat-transfer fluid cooling mechanism to cool a sheath in which is placed switchgear such as a circuit breaker. An evaporator is thus created which is connected to condensers that are placed on a roof of the sheath. The device can be for application to a medium-voltage high-current electrical installation. The device requires little maintenance and only consumes a reduced amount of energy, or even no energy.08-09-2012
20100319879MULTI-PRESSURE CONDENSER AND CONDENSATE REHEATING METHOD - A multi-pressure condenser has first and second condensers with vacuum pressures. The second condenser has a higher pressure. The first condenser has a first cooling water tube bundle, and a pressure barrier which extends below the first cooling water tube bundle. A heat-transfer tube introduces fluid from outside the first condenser into the first hot well below the barrier. Liquid is dropped into the first hot well through the through holes of the pressure barrier. The second condenser has a second cooling water tube bundle. Condensate generated in the high-pressure chamber is accumulated below the second cooling water tube bundle. The multi-pressure condenser further has a steam duct to connect the gas phase parts of the first hot well and the second condenser, and a pipe to communicate the liquid phase parts of the first hot well and the second condenser.12-23-2010
20100122798HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT DEVICE MANUFACTURING METHOD - According to an embodiment of the present invention, there is provided a heat transport device including an evaporation portion, a flow path, a condenser portion, and a working fluid. The evaporation portion is made of nanomaterial, and has V-shaped grooves formed on a surface. The flow path communicates with the evaporation portion. The condenser portion communicates with the evaporation portion through the flow path. The working fluid evaporates from a liquid phase to a vapor phase in the evaporation portion and condenses from the vapor phase to the liquid phase in the condenser portion.05-20-2010
20110259553MODULAR HEAT EXCHANGER AND CONVERSION SYSTEM - Various embodiments of a waste heat recovery and conversion system are disclosed. The system may include a modular heat exchanger whose energy source is provided by waste heat energy transporting fluids transferring their energy to a working fluid. The working fluid may be in a liquid state contained in a reservoir hydraulically connected to a high-pressure heat transfer chamber. The high-pressure heat transfer chamber may be configured to receive thermal energy utilized to convert the working fluid into a superheated vapor. The system may also include a waste heat conversion system hydraulically connected to the heat transfer chamber to receive the superheated vaporized working fluid from the heat transfer chamber. The waste heat conversion system may be configured to expand the superheated working fluid through an expander for the conversion of waste heat energy into useful energy. For applications involving internal combustion engines, the system may be configured such that the conversion of waste heat energy into useful energy may drive an air compressor to enhance combustion engine performance and decrease pollutant emissions.10-27-2011
20110297354SYSTEM AND METHOD THAT DISSIPATE HEAT FROM AN ELECTRONIC DEVICE - The electronic system includes an electronic device and a liquid holding section that is thermally coupled to the electronic device. The electronic system further includes an impermeable section that engages the liquid holding section. The impermeable section includes a channel and a plurality of passages that provide fluid communication between the liquid holding section and the channel. The electronic system further includes (i) a first fluid that flows through the channel in the impermeable section to facilitate heat transfer from the electronic device to the first fluid; and (ii) a second fluid that flows from the liquid holding section through the plurality of passages into the channel when the second fluid boils within the liquid holding section due to heat transfer from the electronic device to the second fluid. In some embodiments, the first and second fluids are different types of substances.12-08-2011
20090260781THERMAL BUFFER SYSTEM - A thermal buffer for an intermittent thermal load, e.g., a directed energy weapon (DEW) system, includes a phase change heat exchanger (PCHEX), an apparatus for circulating a first working fluid of the thermal load through first conduits of the PCHEX cell in a first direction such that heat is transferred between the first fluid and a phase change material (PCM) of the PCHEX in a second direction and causes a first phase change in the PCM, and an apparatus for circulating a second working fluid of, e.g., a heat pump through second conduits of the PCHEX in a third direction opposite to the first direction such that heat is transferred between the second fluid and the PCM in a fourth direction opposite to the second direction and results in a second phase change in the PCM opposite to the first phase change therein.10-22-2009
20100326627Microelectronics cooling system - In one general aspect, a microelectronics cooling device can include a microchannel heat exchanger within an enclosure that houses the device at a heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at a heat sink end outside the enclosure. One or more pipes flowably connect the two ends for transporting liquid working fluid to the heat absorber and vaporized working fluid to the heat sink. The heat pipes may also be used to transfer heat outside a room that contains the electronic devices.12-30-2010
20120097370 FLOW BALANCING SCHEME FOR TWO-PHASE REFRIGERANT COOLED RACK - A cooling system distributes fluid to a plurality of docking bays within a server rack. The server rack includes docking bays for housing electronics devices. A two-phase fluid-based heat exchanging system is coupled to each docking bay, which functions to remove heat from the electronics server. The docking bays are conceptually divided into one or more sections, and a dynamic fluid flow regulator is included within a section input line that supplies a liquid-phase fluid to each section. The section input line branches into a plurality of parallel fluid paths, one parallel fluid path coupled to each docking bay in the section. A fixed fluid flow regulator is included within each branching fluid pathway. The combination of the dynamic and fixed fluid flow regulators provides balanced fluid flow to each two-phase heat exchanging system.04-26-2012
20120097368HEATING EXCHANGE CHAMBER FOR LIQUID STATE COOLING FLUID - A heat exchange chamber for liquid state cooling fluid is provided, which comprises a casing and a thermal dissipation device, the casing has a cavity and the thermal dissipation device is sited in the cavity. A cooling fluid flows through the cavity along a flow direction. The cross-sectional area of the cavity whose direction is perpendicular to the flow direction shows linear increase or non-linear increase gradually along the flow direction, and a part of the cooling fluid vaporizes after flowing through the thermal dissipation device. The chamber along the flow direction shows different pressures, and two phase fluid flows automatically due to the pressure difference. The heat exchange chamber for liquid state cooling fluid could lighten the loading of the pump which is for circulating the cooling fluid, and it also achieve the efficacy of saving energy and raising efficiency.04-26-2012
20120037343DEVICE AND METHOD FOR CONDENSING WATER - A device for condensing water includes a container with a plurality of openings and a heat transfer zone arranged in an interior of the container. The heat transfer zone includes a bulk material layer and/or a fiber layer and/or a textile layer and/or a grid layer and/or a lattice layer and/or a perforated plate. The interior of the container is subdivided by the heat transfer zone into a first zone and a second zone. Further, the heat transfer zone has at least in sections an open porosity and/or channels through which process gas can flow from the first zone to the second zone and through which a further process gas in the form of cooling gas can flow in a reverse direction. A permeable region of the heat transfer zone partially includes materials which have a thermal conductivity of more than 20 W(mK)02-16-2012
20110315350DIRECT FORCED DRAFT FLUID COOLER/COOLING TOWER AND LIQUID COLLECTOR THEREFOR - Direct forced draft fluid cooler/closed loop cooling towers and cooling towers are provided with fans at the bottom of the unit, and a plurality of layers of water collection troughs or channels above the fans to capture water droplets sprayed downwardly from the top of the device through a heat exchanger or fill media above the collection troughs. In one embodiment the collection troughs supply the collected water to one or more gutters inside the housing which lead the water to an external collection tank from which the water is recirculated through the system.12-29-2011
20110315349APPARATUS AND PROCESS FOR THERMAL DECOMPOSITION OF ANY KIND OF ORGANIC MATERIAL - The present invention refers to a Low Temperature Conversion apparatus composed of tri-tubes which simultaneously carries out the functions of vessel and heat exchanger. This apparatus is capable of thermally decomposing any kind of organic material to obtain coal, oil, water and non-condensable gases, and also decontaminating soils and residues contaminated with organochlorides and dioxins.12-29-2011
20120000630Cooling Of An Electronic Device In An Aircraft By Case-By-Case Single-Phase Or Two-Phase Cooling - Cooling of an electronic device in an aircraft by case-by-case single-phase or two-phase cooling01-05-2012
20110155348LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM - Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.06-30-2011
20110155349METHOD AND SYSTEM FOR COOLING HOT GASES BY WATER INJECTION - Hot gas, produced in a thermal reactor (06-30-2011
20120111537FLEXIBLE HEAT DISSIPATION MODULE - A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.05-10-2012
20120012280DEVICE AND METHOD FOR GENERATING STEAM WITH A HIGH LEVEL OF EFFICIENCY - Steam is produced from a working medium of a steam generator, e.g., a waste heat steam generator, a Kalina steam generator or an ORC steam generator, using a thermal generator mounted upstream from the steam generator. To evaporate the working medium, the steam generator uses a hot heat transmitting medium that is heated in the thermal generator before being supplied to the steam generator, thereby increasing the efficiency of the steam generator. The residual or waste heat of an industrial plant or a geothermal plant using geothermal energy is used, for example, as a heat source for the thermal generator01-19-2012
20120111538HEAT DISSIPATION STRUCTURE - A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat.05-10-2012
20120205073Method and device for recovering heat from intermittently and briefly released blow-off steam charge - The invention relates to a method for recovering heat from intermittently and instantaneously released blow-off steam charges. The method is carried out using a container (08-16-2012
20120312505Cryogenic Cooling Method Using a Gas-Solid Diphasic Flow of CO2 - The invention relates to a method implementing liquid CO12-13-2012
20120125570HEAT DISSIPATING DEVICE - A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.05-24-2012
20120125571Heat-Dissipating Device for Space-Based Equipment, Notably for a Satellite - A device for dissipating heat, for a space-based satellite, includes at least one dissipating panel, the dissipating panel having at least one skin formed from a composite structure comprising an organic resin and carbon fibers, wherein the organic resin is filled with carbon nanotubes. The heat-dissipating device may also comprise a network of heat pipes. The heat pipes may be made from an aluminum alloy incorporating elements having low coefficients of thermal expansion. The present invention is notably applicable to fixed dissipating panels or those that may be used in telecommunications, observation or scientific satellites, or else on racks assembled to dissipating panels.05-24-2012
20120132401MULTI-COOLING MODULE FOR VEHICLE - The present invention relates to a multi-cooling module for a vehicle, and more particularly to a multi-cooling module adapted to simultaneously cool an engine, electric parts, and a condenser through one or more heat pipes. In the multi-cooling module for a vehicle, one or more heat pipes are mounted to pass through two or more refrigerant passage pipes which go through with the same cooling system core unit.05-31-2012
20120132402LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME - A loop heat pipe includes: a first evaporator and a second evaporator each of which vaporizes a liquid-phase working fluid and converts the liquid-phase working fluid to a vapor-phase working fluid; a first condenser and a second condenser each of which condenses the vapor-phase working fluid and converts the vapor-phase working fluid back to the liquid-phase working fluid; a first vapor line through which the working fluid converted to the vapor phase is transported to the first condenser; a first liquid line through which the working fluid converted to the liquid phase is transported to the second evaporator; a second vapor line through which the working fluid converted to the vapor phase is transported to the second condenser; and a second liquid line through which the working fluid converted to the liquid phase is transported to the first evaporator.05-31-2012
20120312506LOOP HEAT PIPE - A loop heat pipe includes an evaporator to vaporize a working fluid due to heat supplied from an external heat source; a condenser to cause the vaporized working fluid to condense; and connecting lines to connect the evaporator and the condenser in a loop, wherein the evaporator includes a first space defined by a set of walls including a contact wall that comes into contact with the external heat source, a second space provided adjacent to at least one of the walls other than the contact wall, and a through-hole formed in a dividing wall separating the first space and the second space to allow the first space and the second space to communicate with each other.12-13-2012
20120247734Low Cost Long Exhaust Heat Exchanger - A design and manufacturing technique for a “Long Heat Exchanger”, a counter-flow heat exchanger sizeable to transfer up to 100% of heat and temperature between two fluids (gas or liquid). Inner “Core” capable of manufacture in continuous lengths, may be coiled, cut and formed to shape multiple applications, ranging from engine exhaust, to recycling steam turbine, to building furnaces. Core costs are comparable to metal tubing costs, and outer or “Main” channel housing may be existing exhaust channels being retrofitted or new housing injection molded in sections.10-04-2012
20120168130HEAT SINK - A heat sink includes a first plate having a first surface with a heat source contact region, and a second surface has a looped peripheral groove, and first to n07-05-2012
20120168129ADAPTIVE HEAT DISSIPATING DEVICE - An adaptive heat dissipating device includes a heat-transfer element and a heat-dissipation element. An end of the heat-transfer element is a spherical body, and an end of the heat-dissipation element is a semispherical socket for correspondingly receiving the spherical body therein, such that the spherical body is rotatably connected to the semispherical socket. Therefore, the heat-transfer element has enough degrees of freedom to rotate in different directions and pitch at different angles relative to the heat-dissipation element. With these arrangements, the adaptive heat dissipating device can have largely upgraded heat dissipation efficiency and increased flexibility in application.07-05-2012
20110192574COOLING STRUCTURE, ELECTRONIC DEVICE USING SAME, AND COOLING METHOD - A maintenance-free cooling structure is provided which, by removing bubbles produced on a boiling surface utilizing an action other than buoyancy, heat change (heat transfer) is effectively brought about on the boiling surface, thus enabling efficient cooling and its miniaturization and low power consumption. The cooling structure has an evaporation chamber 08-11-2011
20100051237COOLING SYSTEM AND METHOD FOR COOLING AN AIRCRAFT ENGINE - A cooling system (03-04-2010
20100051236PROCESS AND ASSEMBLY FOR FLUSH CONNECTING EVAPORATOR SECTIONS OF JUXTAPOSED HEAT PIPES TO A FIXING BASE - A process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane includes the steps of: providing a fixing base with its bottom surface having an accommodating trough; providing at least two heat pipes each having an evaporator section and a condenser section; disposing the evaporator sections of the heat pipes in the accommodating trough; and machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe. Via the above process, the evaporator sections of the heat pipes can be juxtaposed in and flush connected to the fixing base, thereby increasing the contact area between the evaporator sections of the heat pipes and a heat-generating element. It further provides an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane.03-04-2010
20120312504BOILING REFRIGERANT TYPE COOLING SYSTEM - A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.12-13-2012
20120073787COOLING FOR SUPERCONDUCTING MACHINES - A device for cooling superconducting machines has a closed thermal siphon system which can be filled with a liquid coolant and has an evaporator for evaporating the liquid coolant. In order to improve the cooling performance of the device, the surface area of the evaporator which can be wetted with the liquid coolant is increased.03-29-2012
20090020267WORKING LIQUID FOR LATENT HEAT TRANSPORT APPARATUS AND METHOD FOR OPERATING LATENT HEAT TRANSPORT APPARATUS - To provide a working liquid for a latent heat transport apparatus which is free from environmental problems such as destruction of an ozone layer and global warming and which shows a high performance constantly at an operation temperature of from −50 to 200° C.01-22-2009
20120261093HEAT PIPE - A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing.10-18-2012
20120227933FLAT HEAT PIPE WITH SECTIONAL DIFFERENCES AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a flat heat pipe with sectional differences and a method for manufacturing the same. The heat pipe has a flat hollow pipe body. A working fluid is sealed in the pipe body. The pipe body is provided along its length with a plurality of flat sectional difference portions having different widths. A connecting portion is formed between the sectional difference portions. The inner wall of the pipe body is formed with a plurality of grooves. The pitch between the grooves in the sectional difference portion of a relatively large width is larger than the pitch between the grooves in the sectional difference portion of a relatively small width.09-13-2012
20100326628CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation.12-30-2010
20100230075Thermal Storage System - An apparatus for storing and retrieving thermal energy from a phase change material including a plurality of heat exchangers. Each one of the plurality of heat exchangers provides the means for transferring energy between the phase change material on a primary side of the heat exchanger and a fluid on a secondary side of the heat exchanger. The phase change material is a mixture of two or more inorganic salts.09-16-2010
20120325436HIGH EFFICIENCY THERMAL MANAGEMENT SYSTEM - Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred methods include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaining pressure in the chamber to permit at least a portion of coolant contacting the surface to boil. Preferred apparatuses include a chamber comprising the surface and tubular nozzles configured to project a stream of coolant against the surface, a pump for forcing coolant through the tubular nozzles, a pressurizer for maintaining an appropriate pressure in the chamber, and a heat exchanger for cooling the coolant exiting the chamber. The apparatuses may further include a pressure regulator for detecting changes in temperature of the coolant exiting the chamber and communicating with the pressurizer to adjust the maintained pressure accordingly. The methods and apparatuses disclosed herein provide for effective and efficient cooling of work piece surfaces.12-27-2012
20120279686COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.11-08-2012
20120279685PHASE-CHANGE TURBO-DISSIPATION COOLER - A phase-change turbo-dissipation cooler comprises a heat extracting apparatus and a heat dissipating apparatus. The heat extracting apparatus includes a closed container having an outlet nozzle and an inlet, the closed container being filled with a liquid of low boiling point. The heat dissipating apparatus includes a chambered body, an air supply tube, a vapor tube, and a condensing tube. The chambered body is provided with a common shaft, a turbine, and a blower. The condensing tube is provided with multiple fins and an expansion valve and connected between the vapor tube and the closed container. The liquid can be vaporized in the closed container by a heat source to blow into the chambered body to rotate the turbine together with the blower and then flow back to the closed container. The blower can suck in ambient air to blow through the fins on the condensing tube to dissipate heat.11-08-2012
20130008630Cooling Assembly for Cooling Heat Generating Component - A cooling assembly for cooling of a heat generating component (01-10-2013
20130008629THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module includes a base and at least one heat pipe. The base has at least one groove formed on one face thereof and a recess formed on another opposite face thereof, and the recess is communicable with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove with one surface of the heat pipe flushing with a bottom of the groove to direct contact with a heat source, so as to avoid thermal resistance and more securely locate the heat pipe in the groove, allowing the thermal module to provide largely increased heat dissipation performance. A method of manufacturing the above thermal module is also disclosed.01-10-2013
20130020054PROCESS FOR INCREASING THE EFFICIENCY OF HEAT REMOVAL FROM A FISCHER-TROPSCH SLURRY REACTOR - The present invention is directed to a cooling system for removing heat from a Fischer-Tropsch (F-T) slurry reactor. The cooling system including a downcomer disposed within the F-T reactor to deliver a coolant downward through the F-T reactor at a predetermined velocity. The downcomer and the pressure of the introduced coolant cooperate to increase the coolant velocity, thereby maintaining the coolant in the substantially liquid phase in the downcomer. The cooling system further includes a plenum connected to the downcomer, wherein the coolant remains in the substantially liquid phase. Additionally, the cooling system includes at least one riser extending upward from the plenum, wherein a portion of the coolant vaporizes to provide a boiling heat transfer surface on the at least one riser.01-24-2013
20080236795LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING - Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.10-02-2008
20130168050HEAT EXCHANGE ASSEMBLY AND METHODS OF ASSEMBLING SAME - A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.07-04-2013
20130168051HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, a first heat pipe, and a second heat pipe. The first fin assembly and the second fin assembly are disposed on the top surface of the base. The first fin assembly defines a first through hole. The second fin assembly defines a second through hole. The second fin assembly is a structural mirror image of the first fin assembly. The first heat pipe includes a first contacting portion in contact with the base and a second contacting portion received in the first through hole of the first fin assembly. The second heat pipe includes a third contacting portion in contact with the base and a fourth contacting portion received in the second through hole of the second fin assembly.07-04-2013
20120247735HEAT SINK - The heat sink has a first heat transfer plate member that has one surface thermally connected to a heat generating component and is thermally connected to a first heat dissipating fin section having thin plate fins; a second heat transfer plate member that has one surface thermally connected to a second heat dissipating fin section having thin plate fins; a heat pipe section that is provided between an opposite surface of the first heat transfer plate member and an opposite surface of the second heat transfer plate member to be thermally connected thereto; and a heat transfer block that is thermally connected to a side surface and an upper surface of the heat pipe section and arranged to sandwich the heat pipe section between the heat transfer block and the second heat transfer plate member.10-04-2012
20130112373COOLING DEVICE WITH A PLURALITY OF FIN PITCHES - It is an object to provide a cooling device with an increased leeward cooling capacity without increasing the number of heat radiation fins to be installed and the amount of cooling air.05-09-2013
20130112372FLAT HEAT PIPE AND FABRICATION METHOD THEREOF - Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.05-09-2013
20130126128HEAT PIPE AND METHOD OF MANUFACTURING HEAT PIPE - The method of manufacturing heat pipe is disclosed to insert a center bar into a metal tube such that the center bar contacts a clearance area of the inner sidewall of the metal tube. Then, the method is to fill the interval between the center bar and the metal tube with powder for sintering. At last, the method is to perform a sintering, extract the center bar, inject working fluid, and close the metal tube. A heat pipe is therefore formed. Because of no sintered powder on the clearance area, the heat pipe can be bent at the clearance area without damaging the capillary structure formed by the sintered powder. The flow path of the working fluid is not interrupted or influenced, so the heat transfer efficiency can be maintained, which overcomes the decrement of the heat transfer efficiency of a bent heat pipe in the prior art.05-23-2013
20130133862HEAT DISSIPATION DEVICE WITH FIXING MEMBER FOR HEAT PIPE THEREOF - An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body.05-30-2013
20130140005Condensation Chamber Cooling System - A condensation chamber cooling system of a condensation chamber for a boiling water reactor has a heat exchanger outside the condensation chamber. An elongate cooling module is provided in the condensation chamber with an evaporation space in its upper region. The cooling module is configured such that the evaporation space is located above a maximum filling level of the condensation chamber. The cooling module includes at least one riser pipe and one downpipe that issue with their upper ends into the evaporation space and with their lower ends in the condensation chamber. A first pressure line leads from the evaporation space to the heat exchanger and, from there, a second pressure line which issues in the condensation chamber below the minimum filling level. Thus, the condensation chamber, the pressure lines, the cooling module and the heat exchanger form a passive closed cooling circuit.06-06-2013
20080196865Exhaust heat recovery apparatus - An exhaust heat recovery apparatus includes an evaporation unit and a condensation unit communicated with the evaporation unit such that an operation fluid circulates therein. The evaporation unit is disposed in a first fluid passage through which a first fluid flows, and performs heat exchange between the first fluid and the operation fluid, thereby evaporating the operation fluid. The condensation unit is disposed in a second fluid passage through which a second fluid flows, and performs heat exchange between the second fluid and the operation fluid. The exhaust heat recovery apparatus further includes a wet area increasing member in a tube of the evaporation unit for increasing a wet area of the operation fluid due to surface tension of the operation fluid. The wet area increasing member is disposed adjacent to an inner surface of the tube and has extension surfaces extending in directions intersecting with the inner surface.08-21-2008
20130146257CONDENSER FOR VEHICLE - A condenser for a vehicle is used in an air conditioning having an expansion valve, an evaporator, and a compressor, is provided between the compressor and the expansion valve, and circulates coolant supplied from a radiator so as to condense refrigerant supplied from the compressor through heat-exchange with the coolant and the refrigerant.06-13-2013
20100314077COOLING SYSTEM FOR A COMPUTER DEVICE - A cooling system for cooling a heat source includes: a base unit configured with a fluid containing passage therein; a heat-conductive fluid container mounted on a mounting side of the base unit, formed with a fluid-receiving space therein in spatial communication with the fluid containing passage in the base unit, and having an outer contacting side adapted to be placed in thermal contact with the heat source; and a heat exchanging fluid contained in the fluid-receiving space in the fluid container and the fluid containing passage in the base unit, the heat exchanging fluid being capable of changing into fluid vapor when absorbing heat generated by the heat source, the fluid vapor being capable of changing into fluid condensate when cooled.12-16-2010
20110232874HEAT DISSIPATION APPARATUS WITH HEAT PIPE - A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber.09-29-2011
20110232873COOLING DEVICE - A cooling device is made compact without impairing the desired cooling efficiency. A secondary cooling device (09-29-2011
20130180687CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation.07-18-2013
20130126130HEAT SINK OF A LARGE AREA - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.05-23-2013
20130126129HEAT-DISSIPATING FINS - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.05-23-2013
20130186599HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating device includes a base, a heat pipe and a fixing member. The base includes an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.07-25-2013
20120018133THERMOSIPHON EVAPORATOR - The invention relates to an evaporator (01-26-2012
20120018132HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. An air outlet is defined in the centrifugal fan. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a first fin unit and two second fin units. The first fin unit includes a plurality of first fins made of a first material. Each of the second fin units includes a plurality of second fins made of a second material. A heat conductive efficiency of the first material exceeds that of the second material.01-26-2012
20120018131PRESSURE DIFFERENCE DRIVEN HEAT SPREADER - A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid.01-26-2012
20120018130THERMAL SIPHON STRUCTURE - A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure.01-26-2012
20120067550HEAT SINK STRUCTURE EMBEDDED WITH HEAT PIPES - A heat sink structure embedded with a heat pipe includes a heat dissipation seat, at least one heat pipe, a metal-filling adhesive and at least one covering sheet. The heat dissipation seat has a heat absorption surface and a heat dissipation surface. The heat absorption surface has at least one groove to hold the heat pipe and a bonding medium. The groove is covered by the covering sheet. The metal-filling adhesive is filled with the groove to bond the heat pipe and covering sheet through the bonding medium that can increase adhesion force. The covering sheet covers the heat pipe from being damaged during polishing the heat absorption surface to maintain sealing characteristic of the heat pipe. Therefore, the heat pipe can provide rapid heat conduction effect to meet use requirement.03-22-2012
20130206368COOLING DEVICE AND METHOD FOR PRODUCING THE SAME - In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections.08-15-2013

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