Class / Patent application number | Description | Number of patent applications / Date published |
165800400 | Liquid cooled | 75 |
20080223552 | LIQUID COOLING SYSTEM - A liquid cooling system includes a heat-radiating sheet having a pair of heat-conductive metal plates that are superimposed on each other, and having a circulating flow passage between the pair of heat-conductive metal plates; a plurality of heat-receiving areas partitioned on the heat-radiating sheet; a plurality of heat-generating elements installed on each of the heat-receiving areas via a heat spreader made of a heat-conductive material; an inlet hole and an outlet hole opened to the surface of the heat-radiating sheet and located at both ends of the circulating flow passage; a pump having a discharge port and a suction port that communicate with the inlet hole and the outlet hole, and installed on the heat-radiating sheet; and a radiator continuous with the circulating flow passage of the heat-radiating sheet. | 09-18-2008 |
20080230208 | Liquid Cooling System Cold Plate Assembly - A cold plate assembly ( | 09-25-2008 |
20080236792 | Heat exchanger and method - A heat exchanger and a method of manufacturing a heat exchanger for transferring heat energy between first and second working fluids. The heat exchanger can include a housing, a plurality of tubes extending through the housing, and a baffle integrally formed with the housing. The baffle can include one or more fingers that can extend between at least two of the plurality of tubes. The method can include forming a baffle integrally from a side of a housing and positioning the baffle such that it extends into the interior space defined by the housing. | 10-02-2008 |
20080236793 | WATER BLOCK - A water block is used to be adhered to a heat-generating element and includes a cavity. The cavity has a chamber therein. One side or both sides of the chamber is provided with an inlet pipeline and an outlet pipeline respectively, thereby communicating with the chamber. Further, the chamber is provided therein with a heat-exchanging means for performing a heat-exchanging action with a working fluid. Finally, the top face of the cavity is provided with a membrane. An activating element is adhered on the membrane for driving the membrane to swing up and down, thereby forcing the working fluid within the chamber to circulate in single direction. The activating element is used as a power source, and in addition, the water block can be made much thinner. | 10-02-2008 |
20080245506 | COOLING APPARTUSES WITH DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED - Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface. | 10-09-2008 |
20080264604 | COOLING APPARTAUS, COOLED ELECTRONIC MODULE AND METHODS OF FABRICATION EMPLOYING A MANIFOLD STRUCTURE WITH INTERLEAVED COOLANT INLET AND OUTLET PASSAGEWAYS - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge. | 10-30-2008 |
20080277095 | Heat exchanger assembly - A heat exchanger, includes a plurality of MCC microchannel tubes, each microchannel tube of the plurality of microchannel tubes having at least one microchannel fluid passage defined therein and having a chord, the chord being the orthogonal distance from a leading edge to a trailing edge, each microchannel tube of the plurality of microchannel tubes being disposed such that the chord is less than orthogonally disposed relative to a heat exchanger plane. A method of forming such a heat exchanger is further included. | 11-13-2008 |
20080283218 | LIQUID COOLING SYSTEM - In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed. | 11-20-2008 |
20080283219 | METHODS AND APPARATUS FOR MULTIPLE TEMPERATURE LEVELS - Methods and apparatus for thermal management according to various aspects of the present invention comprise a heat exchanger and one or more controllable thermal transfer elements. In one embodiment, the thermal transfer elements comprise thermoelectric coolers. The thermal transfer elements are thermally coupled to the heat exchanger. Components on a surface near the thermal transfer elements may be selectively cooled by controlling the thermal transfer elements. | 11-20-2008 |
20080295996 | STABLE CAVITY-INDUCED TWO-PHASE HEAT TRANSFER IN SILICON MICROCHANNELS - The stable cavity-induced two-phase heat transfer in silicon microchannels mitigates the flow of instabilities associated with two-phase (liquid/vapor) flow in microchannels. This is accomplished by etching microscopic cavities in the base of each microchannel using photolithography techniques. Each cavity is used to promote controlled nucleation activity. The microchannels with cavities are able to be used in heat sinks to cool a variety of electronic components. | 12-04-2008 |
20080314559 | HEAT EXCHANGE STRUCTURE AND HEAT DISSIPATING APPARATUS HAVING THE SAME - A heat exchange structure is connected to a dual water cooling system and a heat dissipating apparatus has the heat exchange structure. The heat exchange structure includes a box as a main body, and the box includes a first cavity and a second cavity. The first cavity and the second cavity are interconnected with separate water cooling systems, wherein the first cavity includes a first chamber, and the first cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to the first chamber. The second cavity includes a second chamber, and the second cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to a second chamber. A heat conducting plate is disposed at a position that connects the first cavity and the second cavity for providing a heat conducting path of the first cavity and the second cavity. | 12-25-2008 |
20090000769 | Temperature Controlled Loadlock Chamber - A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjustable fluid pump provides fluid having a predetermined temperature to a temperature-controlled plate. The mass flow controller provides gas flow into the chamber that may also aid in maintaining a desired temperature. Additionally, one or more temperature sensors may be combined with the adjustable fluid pump and/or the mass flow controller to provide feedback and to provide a greater control over the temperature. A controller may be added to control the adjustable fluid pump and the mass flow controller based upon temperature readings from the one or more temperature sensors. | 01-01-2009 |
20090008061 | Easily assembled cooler - A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts | 01-08-2009 |
20090056911 | ELECTRONIC APPARATUS - An electronic apparatus includes: a circuit board that is mounted with a first heat generating component and a second heat generating component that generate heat; and a circulation-type heat pipe that circulates a coolant, the heat pipe including: a first heat reception part that receives heat from the first heat generating component, the first heat reception part being provided with a wick for evaporating the coolant to serve as an evaporation part; a second heat reception part that receives heat from the second heat generating component and circulates the coolant to the first heat reception part; and a condensation part that condenses the coolant circulated from the first heat reception part, the condensation part being provided between the first heat reception part and the second heat reception part. | 03-05-2009 |
20090065177 | Cooling with microwave excited micro-plasma and ions - One embodiment of the present invention uses an actuator, which is actuated by electromagnetic microwave. The actuator is used to generate the micro-plasma and ions. The configurations of actuators may be microstrip lines structure, stripline structure, piping structure, multiplayer traces and electrodes structure, waveguide structure, and cavity structure. The generated micro-plasma and ions will induce a local turbulent gas flow and the flow is to carry the heat away from the surfaces of the heat sink fins. The actuators may be coupled to heat sink fins, heat transferring pipes, cooling fans, and heat sources in varied configurations. | 03-12-2009 |
20090101308 | MICRO-CHANNEL PULSATING HEAT PUMP - A heat pump device and method in which micro-channel embedded pulsating heat pumps are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporation (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configuration, including as a stacked set of micro-channel embedded substrates. | 04-23-2009 |
20090139693 | TWO PHASE MICRO-CHANNEL HEAT SINK - A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel. The plurality of flow micro-channels are defined by a plurality of channels walls, connect the inlet(s) with the outlet(s) and accommodate a flow of coolant between the at least one inlet and the at least one outlet. The at least one cross-connect channel is configured to connect at least a portion of the plurality of flow micro-channels. The cross-connect channel(s) also at least partially equilibrate a pressure field for boiling of the coolant across the portion of the plurality of flow micro-channels. | 06-04-2009 |
20090183856 | HEAT TRANSFER APPARATUS AND METHODS INCLUDING HYDROFLUOROCARBONATES - Provided is an apparatus for heat transfer that includes a device and a mechanism for transferring heat to or from the device, comprising using a heat transfer fluid, wherein the heat transfer fluid includes a hydrofluorocarbonate. Also provided is a method for transferring heat that includes providing a device and using the heat transfer fluid that includes a hydrofluorocarbonate to transfer heat to or from the device. | 07-23-2009 |
20090205808 | LIQUID COOLING DEVICE FOR MULTIPLE ELECTRONIC COMPONENTS - A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components. | 08-20-2009 |
20090205809 | LIQUID COOLING DEVICE - A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. The reservoir and the heat-absorbing chamber communicate with and other via a through hole on the partition. Since the heat-absorbing chamber is mounted to be adjacent to an electronic component that generates heat, the fluid in the heat-absorbing chamber absorbs the heat. When the fluid in the heat-absorbing chamber vaporizes and decreases the fluid in the reservoir has a higher level and thus flows to the heat-absorbing chamber via the through hole. Therefore, the heat-dissipating ability of the liquid cooling device is increased. | 08-20-2009 |
20090205810 | LIQUID COOLING DEVICE - A liquid cooling device includes a liquid block, a heat-dissipating plate, a thermal-conductive pipe, a pump and a heat sink. The liquid block, the pump, and the heat sink are connected by ducts. The pump drives a coolant to circulate among them. The thermal-conductive pipe is mounted on the heat-dissipating plate. Both ends of the thermal-conductive pipe are connected to the liquid block for the coolant to flow through. The liquid block and the heat sink are respectively mounted on the corresponding electronic devices to absorb heat using the circulating coolant. The heat sink is used to dissipate heat from another heat-generating electronic device. Therefore, one less liquid block is required, and the production cost becomes lower. | 08-20-2009 |
20090266515 | ELECTRONIC DEVICE COOLING APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME - As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, which receives heat from the heat generating portion of the electronic device, and which releases the heat to the refrigerant liquid through a fin portion so as to cool the heat generating portion includes independently therein a first flow channel through which the refrigerant liquid discharged from a discharging port of the pump is drawn in to be guided to the outside of the heat generating portion cooling unit through the fin portion, and a second flow channel through which the refrigerant liquid cooled at the outside is drawn in to be guided towards a sucking port of the pump. | 10-29-2009 |
20090272512 | Liquid cooling heat dissipating device - The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area of surface of the base, and the liquid cooling module is removably installed on the first area of surface of the base. By this way, the users can optionally install the liquid cooling module according to the degrees of the generated heat. Computer suppliers can also reduce the cost effectively. | 11-05-2009 |
20090283244 | Stacked and Redundant Chip Coolers - A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet. | 11-19-2009 |
20090314467 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH JET IMPINGEMENT STRUCTURE INTEGRALLY FORMED ON THERMALLY CONDUCTIVE PIN FINS - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins. | 12-24-2009 |
20100012294 | Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels - A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion. | 01-21-2010 |
20100038058 | HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES - A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink. | 02-18-2010 |
20100071876 | COLD PLATE APPARATUS WITH A CONTROLLED HEAT TRANSFER CHARACTERISTIC BETWEEN A METALLURGICALLY BONDED TUBE AND HEAT SINK FOR FACILITATING COOLING OF AN ELECTRONICS COMPONENT - A cold plate apparatus is provided which includes a tube formed of a first metal, a casted heat sink member formed of a second metal surrounding a heat transfer region of the tube, and an alloy layer disposed between the tube and the heat sink member. The tube has its first and second ends, with the heat transfer region being disposed between its ends. The first and second ends of the tube extend from the heat sink member, and a metallurgical bond exists between the tube and heat sink member in the heat transfer region of the tube. The alloy layer formed during casting of the heat sink member by the first metal and second metal reacting peritectically, and with the thickness of the alloy layer minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond. | 03-25-2010 |
20100084117 | PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING - A system and method for altering and maintaining the temperature of a workpiece, especially at cryogenic temperatures, is disclosed. The platen on which the workpiece is located contains at least one inner conduit through which fluid can flow. An apparatus, in communication with a fluid source, is brought into contact with the platen. For example, an inlet and outlet on the platen and the ports of the apparatus may mate. Once the platen and the apparatus are successfully mated, fluid is passed through the apparatus and into the platen. Once the platen (and therefore the attached workpiece) has reached the desired temperature, the apparatus stops the flow of fluid through the platen. The apparatus and the platen then disengage. The platen is then free to move and rotated as required by the ion implantation process. When the platen temperature deviates from the desired temperature, the above process is repeated. | 04-08-2010 |
20100101759 | APPARATUS AND METHOD FOR FACILITATING IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM - Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant. | 04-29-2010 |
20100155024 | Liquid cooling system - In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed. | 06-24-2010 |
20100300652 | Heat Dissipating System - A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the heat. The refrigeration device is capable of refrigerating a coolant. The thermal connector is in contact with the cold plate. The pipe connects the thermal connector to the refrigeration device so that the coolant is capable of flowing out of the refrigeration device to the thermal connector and back to the refrigeration device. | 12-02-2010 |
20100326626 | Heat Sink Assembly - A heat sink assembly including a first member having a heat transfer surface adapted to directly contact a device to be cooled; a second member including coolant channels and a separate fluid channel; and a connection which at least partially mechanically connects the first member to the second member. The connection includes three bellows forming three conduits between the channels in the second member and the first member. A second one of the bellows and a third one of the bellows are located inside a first one of the bellows. | 12-30-2010 |
20110114289 | Cold chassis for electronic modules and method of making same - A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member. | 05-19-2011 |
20110127007 | COOLING DEVICE AND METHOD FOR THE MANUFACTURING THEREOF - A cooling device comprises a main body ( | 06-02-2011 |
20110232863 | INTEGRAL COLD PLATE AND STRUCTURAL MEMBER - A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A structural member provides attaching features that are configured to secure the cold plate assembly to a support. The cold plate is secured to the structural member by a braze material. In one example, the cold plate assembly is manufactured by arranging multiple sheets with a first braze material provided between the sheets. The multiple sheets comprise a cold plate. The braze material is heated to mechanically join the multiple sheets to one another and the cold plate to the structural member. | 09-29-2011 |
20110232864 | COMPACT TWO SIDED COLD PLATE WITH THREADED INSERTS - A structural cold plate assembly includes a support structure including first and second opposite sides supporting corresponding cold plates and an insert. The insert defines a portion of a fluid passage through the support structure and secures the cold plate to the support structure. | 09-29-2011 |
20110315344 | INTERLEAVED, IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK - Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components. | 12-29-2011 |
20130105116 | COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S) | 05-02-2013 |
20130146253 | THERMAL MANAGEMENT OF PHOTONICS ASSEMBLIES - A photonics assembly ( | 06-13-2013 |
20130213604 | DATA CENTER CONTAINER WITH COOLING SYSTEM - A data center container includes a chassis, a cover, a cooling system, a water outlet, a water tray, and a connecting pipe. The cover is secured to the chassis. The cooling system is located in the chassis and includes a water inflow portion, a water outflow portion, and a drainer tray. The water outlet is located in the chassis. The water outlet communicates with the drainer tray and extends out of the chassis. The drainer tray is secured to the chassis. The water inflow portion and the water outflow portion are located between the cover and the water tray. The connecting pipe connects the water tray with the drainer tray. The water tray receives condensation dripping from the water inflow portion and the water outflow portion. | 08-22-2013 |
20130264030 | STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure. | 10-10-2013 |
20130312933 | Coldplate for Use in an Electric Vehicle (EV) or a Hybrid-Electric Vehicle (HEV) - A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a first portion configured for attachment to a printed circuit board having a plurality of electronic components thereon, and a second portion configured for attachment to the first portion. The first and second portions are further configured to together define a manifold therebetween. The manifold has an inlet, an outlet and a substantially constant height to facilitate a substantially uniform flow of a coolant therethrough for use in dissipating heat generated by the electronic components. | 11-28-2013 |
20140027094 | WATER DISPENSER - A water dispenser including a heat-exchanger, a heater, a water-storage tank, and a faucet is provided mainly. The heat-exchanger has a first/second guiding-channel, a first inlet/outlet communicated with two ends of the first guiding-channel, and a second inlet/outlet communicated with two ends of the second guiding-channel. The water flows into the heat-exchanger through the first inlet, and flows out of the heat-exchanger through the first outlet. Two ends of the heater are communicated with the first outlet and the second inlet, and the water flowed out of the first outlet is heated by the heater. The heated water flows into the heat-exchanger through the second inlet, and flows out of the heat-exchanger through the second outlet. The water-storage tank is used to storage the water flowed out of the second outlet. The faucet is communicated with the water-storage tank and the heater respectively. | 01-30-2014 |
20140202658 | Temperature Equalization Apparatus Jetting Fluid for Thermal Conduction Used in Electrical Equipment - The present invention discloses an external thermal conduction interface structure of electrical equipment wherein a fluid jetting device is utilized to jet a thermal conductive fluid for exchanging heat with the external thermal conduction interface structure of electrical equipment via the thermal energy of the jetted thermal conductive fluid, the heat exchange means includes the external thermal conduction interface structure of electrical equipment having relative high temperature being cooled by a fluid have relative lower temperature, and external thermal conduction interface structure of electrical equipment having relative lower temperature being heated by a fluid having relative higher temperature. | 07-24-2014 |
20140238642 | HEAT EXCHANGE DEVICE AND METHOD - A heat exchange device comprising a fluid flow passage having a plurality of successive segments in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and thereby improve heat transfer. | 08-28-2014 |
20140290909 | THERMAL GROUND PLANE FOR COOLING A COMPUTER - A method for cooling a computer uses thermal coupling for conveying heat from powered components of an electronic system. A fluid heat-exchanger is attached to the surface of the electronic system and filled with fluid coolant. A vacuum is applied between the heat-exchanger and the surface to seal the heat-exchanger to the electronic system. The fluid coolant is circulated through the heat-exchanger to convey heat from the fluid to an external cooling apparatus. | 10-02-2014 |
20140318741 | Cooling With Liquid Coolant And Bubble Heat Removal - An apparatus includes a reservoir to hold a volume of liquid, a port to inject a flow of gas into a lower portion of the reservoir, and a structure to transform the flow of gas into one or more streams of bubbles in said liquid. The reservoir has a port for injecting the gas into a lower region of the volume of liquid and has a top opening to release the injected gas therefrom. The apparatus includes one or more active electronic or optical devices located in the reservoir or located physically adjacent and in thermal contact with the reservoir such that the volume of the liquid is able to absorb part of heat produced by the one of more electronic or optical devices. | 10-30-2014 |
20140318742 | Cooling Device with Bypass Channel - A cooling device to which an electric circuit may be mounted includes a cooling body and a cover both defining a fluid cooling path. Inner and outer seals are provided between the body and the cover and a leak bypass channels leaking fluid away from the electric circuit is provided between the inner and outer seals. | 10-30-2014 |
20140338863 | Supply Module for Supplying an Effector System and Effector System with a Supply Module - A supply module for supplying a weapon system includes an electric storage device and a thermal storage device that stores coolant. The supply module also includes at least one electrical connection via which power can be transferred from the electric storage device to the effector system, and at least one thermal connection via which the coolant can be transferred from the thermal storage device to the effector system. | 11-20-2014 |
20150013940 | COMMONLY SUBMERSED, VERTICALLY REMOVABLE SERVERS IN RACK - Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank. | 01-15-2015 |
20150020997 | CYCLING HEAT DISSIPATION MODULE - A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment. | 01-22-2015 |
20150096719 | Apparatus for Dissipating Heat - An apparatus for dissipating heat includes a plate or pipe made of a planar thermal conductive material, such as pyrolytic graphite. The apparatus may include fins attached to the plate or pipe, and the fins can be made of the same or different material as the plate or pipe. | 04-09-2015 |
20150296660 | Device for Cooling Power Electronics by Means of a Cooling Medium and Method for Producing the Device - A device for cooling power electronics by means of a cooling medium. The power electronics are arranged in a housing. | 10-15-2015 |
20150351283 | HEATSINK AND BOARD UNIT - A heatsink includes, a fin base that receives heat from a heat generating part; a cover that cooperates with the fin base to form a flow path of coolant along which the coolant flows; a plurality of fins formed on the fin base and partitioning the flow path into a plurality of small flow paths; and an adjustment plate vertically disposed between the fin base and the cover, and perpendicularly disposed with respect to the plurality of fins, wherein the adjustment plate including different height potions. | 12-03-2015 |
20160021784 | Cooling Module for Electrical Components - A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern. | 01-21-2016 |
20160029514 | A LIQUID COOLED DEVICE ENCLOSURE - The present invention essentially relates to a liquid cooled device enclosure ( | 01-28-2016 |
20160064303 | COOLING APPARATUS FOR A HEAT-GENERATING ELEMENT - A cooling apparatus for a heat-generating element includes: a heat sink on which the heat-generating element is mounted; a cooling component having a recess, the cooling component and the heat sink being faced and joined to each other so that the recess forms a coolant passage; and a sealing member provided between the heat sink and the cooling component so as to seal the coolant passage and separate an interior and exterior of the coolant passage. A first distance is longer than a second distance with regard to a distance between facing surfaces of the heat sink and the cooling component near the sealing member, the first distance being between the facing surfaces at an interior side of the coolant passage separated by the sealing member, and the second distance is a distance between the facing surfaces at an exterior side of the coolant passage separated by the sealing member. | 03-03-2016 |
20160064306 | LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD - A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink. | 03-03-2016 |
20160093554 | METHOD AND APPARATUS FOR COOLING A SEMICONDUCTOR DEVICE - A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements. | 03-31-2016 |
20160106001 | GANGED SHIELDING CAGE WITH THERMAL PASSAGES - A ganged shielding cage with improved heat transfer capabilities is disclosed. The cage has a plurality of module-receiving openings, or bays arranged in serial, widthwise order. Each such opening is separated from an adjacent opening by an intervening wall that defines, at least partially, a continuous passage, extending lengthwise and communicating with the front and rear portions of the cage. This passage permits air flow to occur between adjacent openings of the cages and between adjacent modules held thereby. | 04-14-2016 |
20160111350 | Methods of Cooling Packaged Semiconductor Devices - Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions. | 04-21-2016 |
20160113152 | COOLING DEVICE FOR ELECTRONIC COMPONENTS USING LIQUID COOLANT - Device used for cooling a component, comprising a support to receive a component to be cooled, the support comprising a fluid network in which a liquid will circulate, the network comprising a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively, the device further comprising means of actuation of the first membrane and of the second membrane and a thermal conducting element close to the channel or in contact with the channel, the means of actuation comprising a fixed electrode located on one or several protuberances of the support ( | 04-21-2016 |
20160120063 | LIQUID COOLING SYSTEM HAVING HEAT DISSIPATION FINS THEREIN - A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid circulation channel is defined in the liquid cooling radiator. A plurality of heat dissipation fins are arranged in the liquid circulation channel. The circulation device drives a liquid coolant through the liquid cooling radiator via the liquid circulation channel to make a heat exchange circulation. | 04-28-2016 |
20160120074 | SYSTEM TO INCREASE SERVER'S DENSITY IN DATACENTER - A system and method of forming the system. Rack containers include rack units stacked in a first direction that is parallel to a floor. Each rack unit has wheels positioned on a supporting structure on the floor which enables adjacent rack containers to move closer to or further from each other. The supporting structure is on the floor and is oriented in the second direction. The second direction is parallel to the floor and perpendicular to the first direction. A cooling conduit is secured on a top surface of each rack container to allow a cooling fluid to flow through a flexible tube into each rack container via the cooling conduit that encapsulates the flexible tube. | 04-28-2016 |
20160165757 | HEAT SINK - A heat sink assembly is provided herein. The heat sink assembly includes at least two heat sinks, a mechanical support member, and a flexible heat pipe. Each of the at least two heat sinks are formed to mate with one of at least two processors. The mechanical support member are formed to mechanically engage with the at least two heat sinks. The flexible heat pipe connects to the at least two heat sinks to provide a thermal link therebetween | 06-09-2016 |
20160190037 | HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY - A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks. | 06-30-2016 |
20160198590 | ARRANGEMENT FOR COOLING CHANNELS IN AN ELECTRODE SYSTEM | 07-07-2016 |
20160204009 | METHODS AND SYSTEMS TO IMPROVE PEDESTAL TEMPERATURE CONTROL | 07-14-2016 |
20160205807 | Liquid Cooling Apparatus | 07-14-2016 |
20160205808 | DEVICE FOR COOLING A COMPUTER WITH A CLASP ELEMENT | 07-14-2016 |
20160377356 | FLEXIBLE AND TRANSFORMABLE WATER-COOLING DEVICE - A flexible and transformable water-cooling device includes a liquid reservoir case and a heat exchange unit. The liquid reservoir case is for a cooling liquid to pass therethrough. The liquid reservoir case has a flexible section, which can be flexed. The flexible section has a first end and a second end opposite to each other. A first region outward extends from the first end. The heat exchange unit is disposed in the first region and has multiple radiating fins in contact with the cooling liquid passing through the first region. Due to the flexibility of the flexible section of the water-cooling device, the water-cooling device can be freely flexed and transformed in accordance with an existent space in an electronic device. Therefore, the water-cooling device can be adaptively disposed in the electronic device. | 12-29-2016 |
20160381830 | ACTIVE PERFORATION FOR ADVANCED SERVER COOLING - Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization. | 12-29-2016 |
20170235350 | COOLING APPARATUS | 08-17-2017 |
20180027698 | COOLANT DISTRIBUTION UNIT | 01-25-2018 |