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Particular adhesive

Subclass of:

156 - Adhesive bonding and miscellaneous chemical manufacture

156001000 - METHODS

156060000 - Surface bonding and/or assembly therefor

Patent class list (only not empty are listed)

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Class / Patent application numberDescriptionNumber of patent applications / Date published
156326000 Organic containing 258
Entries
DocumentTitleDate
20130048214METHOD FOR THE SILICEOUS BONDING OF COATED AND UNCOATED OPTICAL BODIES - The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces (02-28-2013
20100101724ACRYLIC ADHESIVES - The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.04-29-2010
20120103515BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD - In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.05-03-2012
20090014122Heat Resistant Laminated Conveyor Belt and Manufacturing Method Thereof - Provided are a heat resistant laminated conveyor belt and manufacturing method thereof by which a belt surface pressure when a liner and corrugated core paper are pressed and bonded together can be increased to thereby enhance a bonding performance. The heat resistant laminated conveyor belt comprises a belt core layer 01-15-2009
20080295959Thermally Conductive Adhesive Composition and Adhesion Method - A thermally conductive adhesive composition contains a polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer, an organic peroxide (B), a thermally conductive filler (C) and a vanadium compound (D). The volume ratio α of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65. 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.12-04-2008
20110005678CORRUGATED BOARD USING ACID TREATED ZEOLITES - A method of manufacturing corrugated board uses acid treated zeolite to maintain the freshness of various natural food products for an extended period of time. The method of manufacturing corrugated board using acid treated zeolite comprises a zeolite acid treating process, an adhesive making process, an adhesive applying process, and a board assembling process wherein a corrugated sheet is layered between an upper liner sheet and a lower liner sheet which is then bonded to form a corrugated board. A significant advantage of this invention is that removing the filth or dirt by pre-processing the zeolite with acid treatment maximizes the freshness of food products stored in the corrugated box.01-13-2011
20110198029HIGH-TEMPERATURE GLASS SOLDER AND ITS USES - The amorphous and/or partially crystalline glass solders are particularly suitable for high-temperature applications, e.g. in fuel cells or sensors in the exhaust gas stream of internal combustion engines. The glass solder is characterized by a linear coefficient of thermal expansion in the temperature range from 20° C. to 300° C. of 8.0×1008-18-2011
20090277580Simulated Brush Stroke System - A laminated assembly (11-12-2009
20090294055Laminated Microfluidic Structures and Method for Making - A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.12-03-2009
20090242121LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT - In some embodiments, a low stress, low-temperature metal-metal composite flip chip interconnect is presented. In this regard, a method is introduced consisting of combining a powder of substantially pure tin with a powder of tin alloy having a lower melting point than pure tin and depositing the combination of metals between an integrated circuit device and a package substrate. Other embodiments are also disclosed and claimed.10-01-2009
20100193126METHOD OF CEMENTING ALUMINIUM OBJECTS - This invention provides a method of securing to a substrate a metal object having an uncoated surface, which method comprises contacting said substrate and said surface with an unset hydraulic cement composition and allowing said composition to set, characterized in that said surface is an aluminum surface and in that said composition comprises pulverulent aplite.08-05-2010
20100212829MEDICAL DEVICES INCORPORATING FUNCTIONAL ADHESIVES - A method for bonding a polymeric medical device to tissue is provided which includes providing a polymeric medical device having a plurality of reactive members of a specific binding pair attached on a surface of the medical device, and providing tissue with a plurality of complementary reactive members of the specific binding pair, wherein upon contact of the reactive members on the surface of the medical device with the complimentary reactive members on the tissue, covalent bonds are formed between the reactive members and the complementary reactive members, thus adhering the device to the tissue. A kit is provided including a polymeric medical device such as a patch or mesh having a plurality of reactive members of a specific binding pair attached to a surface of the device and an applicator containing a solution or suspension of complementary reactive members of the specific binding pair, the complementary reactive members having a functionality that will adhere them to biological tissue upon contact, said applicator adapted to deliver the solution or suspension to biological tissue.08-26-2010
20100032092ZEOLITE STARCH ADHESIVE FOR CORRUGATED CARDBOARDS AND METHOD FOR MAKING THE SAME - The present invention relates to a starch adhesive mixed with zeolite powder to provide suitable absorption function for corrugated cardboards, and a method for making the adhesive. The adhesive comprises: corn starch as main ingredient, zeolite powder suitably mixed with said corn starch, water, and additives like caustic soda and borax. The corn starch is mixed with zeolite powder in an amount of zeolite powder being 20˜33% of the total weight of corn starch and the zeolite powder, and said adhesive is prepared and adjusted to have a lower gelation temperature. The present invention solves the problem that the initial adhesive strength of adhesive would decrease because of addition of the zeolite powder to the adhesive and would make the drying time longer and then deteriorating the initial adhesive strength. The present invention will make it more efficient and predictable for the mass production of the zeolite starch corrugated cardboards.02-11-2010
20100200160ANISOTROPIC CONDUCTIVE ADHESIVE - An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %. This anisotropic conductive adhesive is supplied to a connection terminal of a wiring board, and a connection terminal of an electronic component is preliminarily connected to a connection terminal of a substrate while arranging the anisotropic conductive adhesive therebetween. Then, the electronic component is heated without applying a pressure or while applying a low pressure to the electronic component to connect the substrate with the electronic component.08-12-2010
20110042003Method of making a floor panel - A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.02-24-2011
20100319849METHOD AND SYSTEM FOR FAST FABRICATING GLUED LAMINATED TIMBER - A method for fast fabricating a glued laminated timber is provided. The method includes the following steps: preparing a plurality of prelaminating pieces, each of the prelaminating pieces having at least two laminating surfaces, arranging the prelaminating pieces to position the laminating surfaces substantially perpendicular with a horizontal plane, and uniformly distributing glue onto the laminating surfaces of the prelaminating pieces; drying the prelaminating pieces having glue distributed thereon to precuring the glue distributed on the laminating surfaces; sequentially stacking the prelaminating pieces one on another to obtain a stack, wherein each of the prelaminating pieces is stacked to another with its laminating surfaces only; conducting a compression treatment to the stack and maintaining the compression treatment for a certain time to obtain a glued laminated timber preform; and conducting a drying treatment to the glued laminated timber preform to obtain the glued laminated timber.12-23-2010
20110088844THERMALLY ACTIVATED ADHESIVE AND FIXTURE FOR IMPROVING REGISTRATION ACCURACY BETWEEN ASSEMBLED PARTS - This is directed to a method for assembling components using a thermally activated adhesive. Two components of an electronic device housing can be coupled as part of the electronic device assembly. At least one of the two components can be thermally conductive. To use a thermally conductive adhesive to couple the components, the components can be placed in a fixture, and the adhesive between the components. The fixture can then be heated such that heat from the fixture is conducted through the thermally conductive component and into the adhesive. The adhesive can flow and propagate between the components. When the adhesive layer has flowed into an adequate layer, the fixture can be cooled such that heat can be removed from the adhesive through the thermally conductive component. The adhesive can harden and secure the components to each other.04-21-2011
20110308729ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape 12-22-2011
20110308728ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape 12-22-2011
20130199723REMOVABLE TATTOO - The removable tattoo is constructed to cover unsightly scars existing as a result of surgeries, such as tummy tucks, C-sections and the like. The removable tattoo is preferably fabricated from silicon or other durable, flexible material, and is provided with an adhesive on its rear face that permits multiple uses. The front face of the tattoo is designed to simulate a decorative, aesthetically pleasing piece of apparel, such as a stylish belt. The removable tattoo may be furnished as a kit that includes a case and a plastic tray that serves as backing for the tattoo in order to provide for storage of the tattoo when not in use.08-08-2013

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