Class / Patent application number | Description | Number of patent applications / Date published |
156306300 | By pressure or drying only, without tack; e.g., for easy delamination, etc. | 12 |
20080223516 | PROCESS FOR PRODUCING MEMBRANE/ELECTRODE ASSEMBLY FOR POLYMER ELECTROLYTE FUEL CELL - To provide a membrane/electrode assembly for polymer electrolyte fuel cells capable of obtaining a high output voltage even in a high current density region, by providing electrodes having good gas diffusion properties, conductivity, water repellency and durability. | 09-18-2008 |
20100078127 | MANUFACTURING METHOD OF ABSORBENT ARTICLE AND MANUFACTURING APPARATUS OF ABSORBENT ARTICLE - The present invention provides a method includes the steps of: conveying in a conveyance direction MD a second web in which components forming one part of an absorbent article are sequentially arranged; swinging an elastic member in a cross direction CD at a predetermined cycle by using a swing guide mechanism for guiding the elastic member; and pressing, between one pair of press rollers, the second web on which the elastic member is arranged. The swing guide mechanism has a motor with a rotational shaft, an arm member for guiding the elastic member to a predetermined position on the second web in the cross direction, and a speed reducer provided between the rotational shaft and a base of the arm member to make a rotational speed of the arm member slower than a rotational speed of the rotational shaft. | 04-01-2010 |
20120186741 | APPARATUS FOR WAFER-TO-WAFER BONDING - An apparatus for bonding semiconductor wafers together including a moveable upper bond head and a resilient member positioned on a surface of the bond head for contacting a first wafer that is positioned at an elevation below the upper bond head. The resilient member is configured to apply a force onto a top side surface of the first wafer thereby compressing the first wafer against a second wafer that is positioned at an elevation below the first wafer. A method of wafer to wafer bonding includes the steps of positioning at least two wafers beneath the moveable upper bond head, positioning the resilient member in physical contact with one of the at least two wafers, and resiliently deforming the resilient member as it is moved into contact with the wafer to facilitate bonding of the wafers. | 07-26-2012 |
20120222810 | REVERSING FIBER PLACEMENT HEAD - A reversing fiber placement head that is capable of bidirectional fiber placement on an application surface includes a feed mechanism for delivering fiber along two feed paths that are in a V-shaped orientation relative to one another. A pressure tip assembly including a compaction roller receives fiber from the two feed paths and applies the fiber to an application surface. A shifting mechanism shifts the pressure tip assembly from a first position on the fiber placement head to a second position on the fiber placement head to move the compaction roller along a linear path relative to the fiber placement head, allowing the compaction roller to change its direction of rotation in order to apply fiber to the application surface in opposite directions. | 09-06-2012 |
20130075035 | CUSHION MATERIAL FOR HOT-PRESS AND USE OF THE SAME - A cushion material for a hot-press is provided. The cushion material comprises: a substrate; and a fiber material, the thermal conductivity coefficient of which is lower than about 0.15 W/m·K at about 20° C. and increases with increasing temperature, for example, the thermal conductivity coefficient may be higher than about 0.20 W/m·K at about 160° C., wherein the fiber material is needle-punched on the substrate. | 03-28-2013 |
20130240141 | HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE - The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. | 09-19-2013 |
20130276975 | APPARATUS FOR MANUFACTURING JOINED LAMINATED MEDIA AND METHOD OF MANUFACTURING JOINED LAMINATED MEDIA - The present invention is to provide an apparatus to manufacture joined laminated media and a method therefor. The joined laminated media that are manufactured from the membrane materials and that are joined by being pressed have no displacement, deformation of the membrane materials, or any defect in joining the boundary faces of the laminated materials, and are efficiently manufactured in a good yield. The apparatus can manufacture a joined laminated-media where the laminated media are placed in the housing space (S) that is formed by a pair of endless belts ( | 10-24-2013 |
20130312909 | ERGONOMIC HAND TOOL AND METHOD OF USE - A hand tool for press sealing roofing membranes by a roller mounted on one end of a bracket connected at a second hand to a handle. The handle and roller mounting bracket extend along first and second axes respectively, which axes form an included angle in the range of 50 degrees and 70 degrees. This angular relationship enables a user's wrist to be the natural wrist position when moving the roller along the membrane. The second axis of the roller mounting bracket preferably maintains an angle of between 20 degrees and 40 degrees with the roofing membranes as the roller is moved along the membrane. | 11-28-2013 |
20140014265 | REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES - A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer. | 01-16-2014 |
20140196846 | METHOD AND DEVICE FOR BONDING TWO WAFERS - A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers ( | 07-17-2014 |
20140283990 | PLACENTAL TISSUE GRAFTS AND IMPROVED METHODS OF PREPARING AND USING THE SAME - A method for preparing placenta membrane tissue grafts for medical use, includes obtaining a placenta from a subject, cleaning the placenta, separating the chorion tissue from the amniotic membrane, mounting a selected layer of either the chorion tissue or the amniotic membrane onto a drying fixture, dehydrating the selected layer on the drying fixture, and cutting the selected layer into a plurality of tissue grafts. Preferably, the drying fixture includes grooves or raised edges that define the outer contours of each desired tissue graft, after they are cut, and further includes raised or indented logos that emboss the middle area of the tissue grafts during dehydration and that enables an end user to distinguish the top from the bottom side of the graft. The grafts are comprised of single layers of amnion or chorion, multiple layers of amnion or chorion, or multiple layers of a combination of amnion and chorion. | 09-25-2014 |
20160009064 | METHOD FOR ACTIVATING ADHESIVES ON COMPLEX SURFACES | 01-14-2016 |