Class / Patent application number | Description | Number of patent applications / Date published |
156273100 | Developing electrostatic charge | 8 |
20090321008 | SYSTEMS AND METHODS FOR FABRICATING AN OUT-OF-PLANE MEMS STRUCTURE - System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded. | 12-31-2009 |
20100012267 | ROBUST ELECTRODES FOR SHAPE MEMORY FILMS - An apparatus (e.g. a shape memory device) that includes a nano-particle layer, a linking agent layer, and a shape memory layer. An electrode for heating shape memory material during shape transitions of the shape memory layer may include the nano-particle layer and the linking agent layer. The nano-particle layer may include conductive nano-size particles (e.g. gold clusters having a diameter less than 100 nanometers or less than 50 nanometers). The electrode may be substantially resilient to deformation of the shape memory material due to individual bonding of individual particles of the nano-particle layer to the shape memory layer and/or the linking agent layer. | 01-21-2010 |
20100186892 | ELECTROSTATICALLY APPLYING A LABEL TO A MOLD CAVITY - The disclosure describes the use of electrostatics to in-mold labeling wherein a label is secured to a mandrel with an axis-defining body, a first end, a distal end, a set of ionizing electrodes disposed about the body, near the distal end, and in a plane perpendicular to the axis. When the mandrel is positioned in a mold cavity, the label is released and a varying voltage applied to the electrodes to form a substantially uniform and ring-like source of ionizing current. The ionizing current progressively pins the label against the die as the mandrel is withdrawn from the die until substantially the entire label is pinned. The ionizing current may then be ended and the mandrel removed so that an article may then be formed into the label. | 07-29-2010 |
20110226414 | COMPOSITION OF HOT-MELT, SELF-ADHESIVE PARTICLES AND STICKING METHOD USING SAME - A composition of particles referred to as hot-melt, self-adhesive particles ( | 09-22-2011 |
20120118500 | ADHESIVE - An object of the present invention is to improve the fluidity of a thermosetting powder adhesive and clear the blocking with a powder adhesive in a constant amount supplying apparatus or a delivery pathway. The present invention has attained the object by a powder adhesive containing a thermosetting adhesive particle and an inorganic filler present on the surface of the thermosetting adhesive particle. | 05-17-2012 |
20130180655 | ADHESIVE - There is provided a powdery adhesive that is used for adhesion between a metal plate and a porous material. The powdery adhesive includes at least thermosetting adhesive particles and an anti-rust filler. A content of the anti-rust filler is 0.1 to 1.0 part by mass with respect to 100 parts by mass of the thermosetting adhesive particles. The anti-rust filler may be at least one of phosphate and molybdate. | 07-18-2013 |
20150122412 | SYSTEM AND METHOD FOR CLAMPING WAFERS TOGETHER IN ALIGNMENT USING PRESSURE - A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure. | 05-07-2015 |
20160379862 | System and Method for Adhering a Semiconductive Wafer to a Mobile Electrostatic Carrier through a Vacuum - A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive wafer. A layer of patterned material is superimposed across the bonding surface of MESC so that the cavities integrated into the layer of patterned material are able produce micro-vacuums that further adhere the semiconductive wafer to the MESC. | 12-29-2016 |