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With direct application of electrical, magnetic, or radiant energy to work

Subclass of:

156 - Adhesive bonding and miscellaneous chemical manufacture

156001000 - METHODS

156060000 - Surface bonding and/or assembly therefor

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
156275500 To polymerize or cure material in work 84
156272800 Exposure of work to laser 65
156273300 Before final assembly; e.g., to cure lamina, etc. 30
156272600 Exposure of work to corona or glow discharge 22
156275700 With application of adhesive 18
156273700 Applying pressure before electrical, magnetic, or radiant energy 11
156275100 Only part of containing lamina surfaces bonded; e.g., seaming, etc. 11
156272400 Involving magnetically susceptible lamina or incorporating into the work a particulate susceptor material having magnetic properties 10
156273900 Work constitutes conductor of electrical circuit 9
156273100 Developing electrostatic charge 6
156274400 Exposure of work to electrode 5
20120227901METHOD OF LAMINATION USING RADIO FREQUENCY HEATING AND PRESSURE - A method for producing laminated materials is taught, wherein materials are bonded by heating using radio frequency (RF) energy while simultaneously applying pressure. The process for laminating a single piece is generally completed in a matter of seconds, as opposed to the hour(s) required to produce a glass laminate using the current state-of-the-art technology.09-13-2012
20080196828Electrically Disbonding Adhesive Compositions and Related Methods - Adhesive compositions and methods of bonding and disbanding involve materials that include a polymer and an electrolyte, wherein the electrolyte provides sufficient ionic conductivity to enable a faradaic reaction at a bond formed between the composition and an electrically conductive surface, allowing the composition to disbond from the surface at room temperature. In some embodiments, the polymer component comprises or consists essentially of a thermoplastic polymer.08-21-2008
20100236706METHOD OF FASTENING LAMELLAE OF A LAMELLAR MATERIAL ON A SUITABLE SUBSTRATE - The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (09-23-2010
20110048633ANODIC BONDING METHOD AND PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD - Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded. There is provided an anodic bonding method of anodically bonding a base wafer 03-03-2011
20100206475ANODE BONDING METHOD AND PRODUCING METHOD OD LIQUID DROPLET DISCHARGING HEAD - Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.08-19-2010
20130042971METHOD FOR MANUFACTURING COMPOSITE SYSTEMS MADE OF METAL AND POLYMER SHAPED PARTS - A method for manufacturing composite systems including metal and polymer shaped parts in the form of stabilizers, bushings, axle bearings, especially in the chassis area, stops, buffers, especially for supporting arms for aggregate bearings, or sleeve bearings, especially torsion-bar shoulder bearings, is provided. With the method, at least one completely vulcanized or partially vulcanized elastomer shaped part, especially a rubber shaped part, as the polymer shaped part and at least one metal part are first prepared. The metal part and the polymer shaped part are then brought into abutment against one another, at least in parts. And, finally the metal part or at least one region of the surface on which the metal part and the polymer shaped part abut against one another, is at least temporarily exposed to at least one induction field or at least one inductive heating unit.02-21-2013
20120160407APPARATUS FOR MAKING BAG ASSEMBLY - A method of forming a bag assembly by RF welding includes generating from a single source of RF energy a high frequency electric field having a first strength between tube-welding electrodes of opposing die members and a second strength less than said first strength between perimeter-welding electrodes of the opposing die members. Subjecting a tube assembly and corresponding portions of sheets surrounding the tube assembly to the high frequency electric field of said first strength for a predetermined amount of time to weld the sheets to a tube along a tube-weld. Corresponding portions of the sheets between the perimeter-welding electrodes are subjected to the high frequency electric field of said second strength for said predetermined amount of time to weld the sheets together along a bladder perimeter-weld. The subjecting steps are performed simultaneously so that the bag assembly is formed in one welding operation.06-28-2012
20120168069METHOD FOR FORMING TRANSFER SHEET - A transfer sheet includes a supporting substrate, a photothermal conversion layer disposed on the supporting substrate, and a passive layer disposed on the photothermal conversion layer.07-05-2012
20110192536JOINING METHOD AND REFLOW APPARATUS - A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.08-11-2011
20100147456SYSTEM AND METHOD FOR HOLOGRAPHIC OPTICAL TRAP BONDING - A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).06-17-2010
20100038025INTRINSICALLY HEATABLE HOT MELT ADHESIVE SHEET MATERIALS - The invention relates to sheet materials, having at least one layer of an adhesive mass, within which heat can be produced, wherein the adhesive mass is a hot melt adhesive mass and a PTC resistor.02-18-2010
20120175053METHOD FOR ATTACHING LABELS TO ITEMS - A method for attaching a label to a surface of an item. The label includes a carrier layer and a bonding layer. The method includes heating the bonding layer using infrared light such that the infrared light has a maximum spectral irradiance at a peak wavelength. The bonding layer has an absorbing spectral region that spectrally matches with the peak wavelength.07-12-2012
20100101718COMPENSATION ELEMENT FOR JOINING COMPONENTS - The invention relates to a compensation element for joining components made of fusible plastics, designed as a hollow cylinder, at least some sections of which are conical and having at least one heating element which when supplied with energy heats at least some regions of the inner surface or the outer surface of the compensation element or of both surfaces to produce a welded connection between the components. Said compensation element is characterised in that cuts are provided, starting from each outer edge of the hollow body, at least one section of the cuts extending up to or beyond a plane of the compensation element that guarantees flexibility. The invention also relates to methods in which a sleeve consisting of an outer sheath and at least one compensation element is used.04-29-2010
20130056145METHOD OF BONDING CARBON NANOTUBES - A method to bond carbon nanotubes to a surface. The mechanism of this bonding is studied, and shows that intercalation of alkali ions is possibly the central mechanism. Bonding pull-off forces of 4-5 N/cm03-07-2013
20110011530Method to Heat a Thermoplastic Boards by Means of Heat Conduction - A method of heating a thermoplastic board by heat conduction in a heating system which has at least a first surface contacting tool and a second surface containing tool spaced from the first tool, at least one of which is heatable. The thermoplastic board is placed into the heating system between the two surface contacting tools, with an auxiliary sheet being placed between the contact surface of the respective heatable surface contacting tool and the surface of the thermoplastic board facing it. The space between the two surface contacting tools is then reduced to a predefined gap measurement, and the heatable surface contacting tool or tools is heated.01-20-2011
20080308222NANOPARTICULATE PREPARATION - The invention relates to nanoparticulate preparations containing at least one mixed metal oxide in the form of supramagnetic, nanoscale particles, methods for heating such a preparation, and methods for producing and dissolving adhesive compounds on the basis of said preparations.12-18-2008
20110048630PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS - A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.03-03-2011
20080210370MACROSCOPIC ORDERED ASSEMBLY OF CARBON NANOTUBES - The present invention is directed to the creation of macroscopic materials and objects comprising aligned nanotube segments. The invention entails aligning single-wall carbon nanotube (SWNT) segments that are suspended in a fluid medium and then removing the aligned segments from suspension in a way that macroscopic, ordered assemblies of SWNT are formed. The invention is further directed to controlling the natural proclivity or nanotube segments to self assemble into or ordered structures by modifying the environment of the nanotubes and the history of that environment prior to and during the process. The materials and objects are “macroscopic” in that they are large enough to be seen without the aid of a microscope or of the dimensions of such objects. These macroscopic ordered SWNT materials and objects have the remarkable physical, electrical, and chemical properties that SWNT exhibit on the microscopic scale because they are comprised of nanotubes, each of which is aligned in the same direction and in contact with its nearest neighbors. An ordered assembly of closest SWNT also serves as a template for growth of more and larger ordered assemblies. An ordered assembly further serves as a foundation for post processing treatments that modify the assembly internally to specifically enhance selected material properties such as shear strength, tensile strength, compressive strength, toughness, electrical conductivity, and thermal conductivity.09-04-2008
20090277576APPARATUS AND DIE FOR WELDING PLASTIC AND A METHOD OF USE THEREOF - An apparatus for welding a first plastic sheet to a second plastic sheet is provided. The apparatus includes an elongate die including a channel extending longitudinally along the die's welding face. In combination with a plate and a high frequency alternating current generator, the die and the plate are operable to compress the first and second plastic sheets in an overlapping arrangement and generate a high frequency alternating electromagnetic field between the die and the plate and weld the first and second plastic sheets to one another. The depth of the die channel prevents the formation of an electromagnetic field that is strong enough to weld the first and second plastic sheets in an area between the die channel and the plate. A die for use in such an apparatus and a method of use thereof are further provided.11-12-2009
20080251193Method of Manufacturing Multi-Layer Circuit Board - A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.10-16-2008
20080277055Manufacturing Process of a Composite Bamboo Board - Manufacturing process of a composite bamboo board, comprising assembling and hot-pressing adhesive-coated bamboo fiber bundles, wherein the said adhesive is a composition comprising of adhesive base material, coupling agent and impregnating wetting agent, the said adhesive base material is one or more selected from a group consisting of urea-formaldehyde resin, melamine, phenolic resin, and water based isocyanate; the said coupling agent is agent which can couple the interfaces of bamboo fiber bundles and the adhesive base material; the impregnating wetting agent is one or more surfactant; and the said hot-pressing includes heating by using high-frequency electromagnetic field with frequency being of 1 KHz or higher and compressing the adhesive-coated bamboo fiber bundles.11-13-2008
20080289754Method for manufacturing organic EL element - A substrate mark is formed on a transparent substrate as an alignment mark. The substrate mark is formed at the same time as transparent electrodes are formed on the transparent substrate. The substrate mark is formed of the same material as the transparent electrodes. A center wavelength of a transmission wavelength of a plurality of optical filters is different from each other. An optical filter corresponding to a thickness of the substrate mark is selected from a plurality of optical filters. Light is irradiated from a white light source to the substrate mark via the selected optical filter. Accordingly, the substrate mark is recognized and a shadow mask is aligned with the transparent substrate.11-27-2008
20100139855POLYMERS HAVING A HIGH INFRARED ABSORPTION CAPACITY - The present invention relates to polymers comprising absorption pigments, which are distinguished by the fact that they have high absorption in the near IR region, and to the use thereof, in particular in thermoforming and in IR light welding.06-10-2010
20090139645Method for maintaining vacuum-tight inside a panel module and structure for the same - This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.06-04-2009
20090107624MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING THE SAME - A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at lest one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.04-30-2009
20090250161METHOD FOR CONNECTING A TUBULAR PART MADE OF PLASTIC TO A NECK OF A FUEL TANK ALSO MADE OF PLASTIC - A method for connecting a tubular part made of plastic to a neck of a fuel tank also made of plastic, by welding using a resistive element heated by a resistive effect. The shape and dimensions of the two parts to be connected are chosen such that one surface of each part is up against a corresponding surface of the other part. The resistive element is incorporated into one of the two surfaces, the two surfaces are brought into contact, and an electric current is passed through the resistive element at an intensity to allow the resistive element to be heated to a temperature high enough to melt the plastic of the two surfaces to weld them together. The tubular part and neck each include a barrier layer and are welded such that the two contact surfaces are coaxial and the barrier layers in the weld region are parallel.10-08-2009
20090250162High Resolution Inkjet Printer - A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate.10-08-2009
20120103510METHOD FOR MAKING CARBON NANOTUBE COMPOSITE STRUCTURE - A method for making a carbon nanotube composite structure is provided. First, a matrix having a surface and a carbon nanotube structure are provided. The carbon nanotube structure is placed on the surface of the matrix. The carbon nanotube structure includes a plurality of carbon nanotubes. The carbon nanotube structure and the matrix are exposed to electromagnetic waves.05-03-2012
20120103509METHOD FOR BONDING MEMBERS - A method for bonding members is provided. First, a first member having a first surface and a second member having a second surface are provided. A carbon nanotube structure is formed and is located between the first member and the second member, and the carbon nanotube structure contacting the first surface and the second surface. Then the carbon nanotube structure is exposed to electromagnetic waves.05-03-2012
20100193119HANDLE APPLICATION APPARATUS AND METHOD - An apparatus for attaching a handle to a container includes a handle supply mechanism configured to supply one or more handles in an open configuration; a container conveyance mechanism configured to provide a container to a handle application location; and a handle applicator configured to attach or connect a handle that supplied initially in an open configuration to a portion of a container. In an embodiment, a heater is included that is configured to provide energy/heat to at least a portion of the one or more handles prior to application. In other embodiments, handles are supplied for application at an elevated temperature. Methods for attaching a handle to containers are also disclosed.08-05-2010
20110056622Method of Forming Temperature Regulating Article - Methods and apparatus for regulating temperature are described. An apparatus for regulating temperature can include a phase change material and a pliable membrane. The phase change material is derived from one or more agricultural products and is therefore renewable. The phase change material transitions between a solid state and a liquid state between about −10° C. and about 65° C. The pliable membrane is configured to enclose the phase change material.03-10-2011
20090065136FOAMING METHODS FOR MAKING CELLULAR THERMOPLASTIC MATERIALS - Methods for reducing the density of thermoplastic materials and the articles made therefrom having similar or improved mechanical properties to the solid or noncellular material. Also disclosed are improvements to foaming methods and the cellular structures of the foams made therefrom, and methods for altering the impact strength of solid or noncellular thermoplastic materials and the shaping of the materials into useful articles.03-12-2009
20110240218HEATING METHOD FOR A COMPOSITE LAMINATOR - A method of fabricating a composite item may include dispensing a composite material comprising a reinforcement and a resin. The method may further include energizing an infrared heat source. The infrared heat source may tend to generate a wavelength of electromagnetic radiation that is preferentially absorbed by the reinforcement. The method may additionally include controlling power to the infrared heat source to cause the infrared heat source to emit a wavelength of electromagnetic radiation that is absorbed by the resin to a relatively greater extent than the wavelength of electromagnetic radiation that is absorbed by the reinforcement.10-06-2011
20110100545Method and solder for form-fitted joining of two surfaces - A method for form-fitted joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in form-fitted manner.05-05-2011
20110094671METHOD FOR BONDING MEMBERS - A method for bonding members is provided. A first member, a second member and a carbon nanotube structure are provided. The carbon nanotube structure is placed between the first member and the second member. The carbon nanotube structure is energized to a temperature equal to or higher than a melting temperature of the first member or the second member.04-28-2011
20110061803MANUFACTURING METHOD OF IMAGE DISPLAY APPARATUS, AND BONDING METHOD OF BASE MATERIAL - An image display apparatus manufacturing method comprises: arranging a bonding material between a pair of base materials acting as a first or second substrate and a frame member, wherein the bonding material includes a main portion extending along the frame member in a closed shape, and a thinner additional portion branching from the main portion as an elongation of a side constituting the main portion; and bonding, as mutually pressing to each other the base materials, the pair of the base materials by the bonding material, by irradiating an electromagnetic wave to the main portion while moving an irradiation position along the bonding material to melt the main portion, and then hardening the melted main portion. Thus, a crack having a possibility of occurrence and widening from the corners of the bonding material can be easily suppressed.03-17-2011
20100319846APPARATUS FOR MAKING BAG ASSEMBLY AND METHOD THEREOF - A method of and apparatus for forming a bag assembly by RF welding. A single source of RF energy is used to generate a high frequency electric field having a first strength between tube-welding electrodes of opposing die members and a second strength less than the first strength between perimeter-welding electrodes of the opposing die members. Respective portions of the bag assembly are subjected to this variable-strength field simultaneously so that the bag assembly is formed in one welding operation. Stand-offs are used in some embodiments to limit penetration of the electrodes into the weld areas.12-23-2010
20110061804BONDING METHOD OF BASE MATERIALS, AND MANUFACTURING METHOD OF IMAGE DISPLAY APPARATUS - It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×1003-17-2011
20120031553THERMAL INTERFACE STRUCTURE AND THE MANUFACTURING METHOD THEREOF - A method for making a thermal interface structure which includes a carbon nanotube layer, in which the carbon nanotubes are oriented parallel to the direction of thermal transmission and metal layers provided on two edge surfaces of the carbon nanotube layer, the edge surfaces being perpendicular to the direction of the thermal transmission and located substantially parallel to the orientation direction at which edges of the carbon nanotubes are oriented.02-09-2012
20110132533FORM-LINER HAVING IMPROVED IDENTIFICATION CAPABILITY - The invention relates to a form-liner, especially for producing concrete and reinforced concrete structures, comprising a panel-shaped core and a lining skin having integrated identification elements. The invention further relates to a method for producing such form-liners.06-09-2011
20100181022CURVATURE REDUCTION FOR SWITCHABLE LIQUID CRYSTAL LENS ARRAY - A method for fabricating lenticulars includes applying (07-22-2010
20090236037METHOD OF BONDING CARBON NANOTUBES - A method to bond carbon nanotubes to a surface. The mechanism of this bonding is studied, and shows that intercalation of alkali ions is possibly the central mechanism. Bonding pull-off forces of 4-5 N/cm09-24-2009
20110186217METHOD FOR INSTALLING A FLOOR COVERING AND AGENT FOR TREATING AN UNDERLYING SURFACE, WHICH CAN BE APPLIED IN SUCH METHOD - Method for installing a floor covering, wherein this floor covering is connected to an underlying surface and wherein this method includes at least the steps (S08-04-2011
20090173437Methods of Joining Ceramics and Ceramic Joined Articles - [Problem] It is an object to provide a joining method, whereby even ceramics having an extremely small dielectric loss factor such as aluminum nitride can be joined efficiently and tightly.07-09-2009
20110315313MANUFACTURING METHOD OF HERMETIC CONTAINER, AND MANUFACTURING METHOD OF IMAGE DISPLAYING APPARATUS - A manufacturing method of a highly-reliable hermetic container having both joining strength and airtightness is provided. Sealants of which a viscosity has a negative temperature coefficient and of which softening point is lower than that of each of first and second glass substrates are formed in a frame shape having a discontinuous portion on the first glass substrate, and the second glass substrate is disposed to face the first glass substrate so as to press the sealants formed thereon by contacting them. Local heating light is irradiated to form the discontinuous portion at a boundary between a region irradiated by the local heating light and a region not irradiated by the local heating light, and a portion adjacent to the discontinuous portion is heated and melted to close the discontinuous portion, whereby a continuous sealed portion between the first and second glass substrates is formed.12-29-2011
20120205040METHOD AND DEVICE FOR THERMOCOMPRESSION BONDING - There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.08-16-2012
20110030891Lamination process improvement - A method of laminating a photovoltaic module may include placing an interlayer in contact with a substrate, heating the interlayer with a source of infrared radiation and pressing the interlayer and the substrate together in a vacuum laminator.02-10-2011
20120118498METHOD AND APPARATUS FOR FORMING A CONTINUOUS ORIENTED STRUCTURE OF A POLYMER - A method and an apparatus for easily making a continuous oriented structure of a polymer are provided. In making a polymer assembly, single crystals are bonded to each other, an external force, such as an electrical field or a magnetic field, is applied to the single crystals, or a solution of the polymer is applied on a substrate such that the applied solution is linear in shape.05-17-2012
20090126868Method for Connecting the Ends of Profiled Sealing Elements, and Device for Carrying Out Said Method - The invention relates to a method for process automation, for connecting the edge of two correspondingly profiled ends of at least one profiled sealing element, said profiled sealing element being already applied to a surface of a vehicle or a vehicle component. The invention also relates to a device for carrying out said method.05-21-2009
20130199719DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus which performs drawing on a substrate with a plurality of charged particle beams includes: a blanking device configured to individually blank the plurality of charged particle beams; a scanning deflector configured to deflect the plurality of charged particle beams to scan the plurality of charged particle beams on the substrate; and a controller configured to generate a periodic signal to control a periodic deflection operation of the plurality of charged particle beams by the scanning deflector. The controller is configured to adjust an amount of deflection of the plurality of charged particle beams by the scanning deflector in a period of the periodic signal so that a scanning speed of the plurality of charged particle beams becomes a target speed.08-08-2013
20120298295FABRICATION TECHNIQUES TO ENHANCE PRESSURE UNIFORMITY IN ANODICALLY BONDED VAPOR CELLS - A method of fabricating vapor cells comprises forming a plurality of vapor cell dies in a first wafer having an interior surface region and a perimeter, and forming a plurality of interconnected vent channels in the first wafer. The vent channels provide at least one pathway for gas from each vapor cell die to travel outside of the perimeter of the first wafer. The method further comprises anodically bonding a second wafer to one side of the first wafer, and anodically bonding a third wafer to an opposing side of the first wafer. The vent channels allow gas toward the interior surface region of the first wafer to be in substantially continuous pressure-equilibrium with gas outside of the perimeter of the first wafer during the anodic bonding of the second and third wafers to the first wafer.11-29-2012
20120279647METHOD FOR GLUING HEAT-ACTIVATED GLUEABLE SURFACE ELEMENTS - A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.11-08-2012
20120138220SYSTEMS AND METHODS FOR BONDING USING MICROWAVE ENERGY - Disclosed are systems and methods for bonding wafers by use of microwave energy. Various components that facilitate relatively quick and efficient bonding provided by microwave energy are disclosed. In certain embodiments, devices and methods for applying desirable compression to the wafers can be implemented. In certain embodiments, devices and methods for providing a controlled gas environment such as vacuum can be implemented. In certain embodiments, devices and methods for maintaining the integrity of microwave mode of operation during the bonding process can be implemented. In certain embodiments, devices and methods for increasing throughput of the bonding process can be implemented.06-07-2012
20130020022INDUCTIVELY HEATABLE ADHESIVE TAPE HAVING DIFFERENTIAL DETACHMENT PROPERTIES - A heat-activatedly bondable sheetlike element having at least one electrically conductive sheetlike structure and at least two layers of different heat-activable adhesives. A first heat-activatable adhesive layer is located substantially on a first side of the electrically conductive sheetlike structure and the second heat-activatable adhesive layer is located substantially on a second side of the electrically conductive sheetlike structure. Activation temperatures for achieving the adhesive properties of the heat-activatable adhesive layers differ from one another less than the melting temperatures of the two heat-activatable adhesive layers.01-24-2013
20080216952Adhesive Method Of Optical Components - An adhesive method of adhering a first optical component to a second optical component includes applying a resin on a first predetermined area of the first optical component and a second predetermined area of the second optical component, and then arranging the first and second predetermined areas to correspond to each other, and then shortening the distance between the first and the second predetermined areas until a resin bridge being formed between the first and second optical components, and then lightly shortening the distance between the first and second predetermined areas for the resin being spread over the first and second predetermined areas, and then the resin being spread to be fully filled between the first and second optical components through the second optical component being released and pressing the resin, finally illuminating the resin through ultraviolet ray for engaging with the first and second optical components.09-11-2008
20130112347PLASMA SURFACE ACTIVATION METHOD AND RESULTING OBJECT - The invention relates to a method for depositing functional groups on a surface of an object, and to the object treated as such, by generating and maintaining a plasma, bringing the object surface close to or in a space between the plasma electrodes, an atmosphere being present between the two electrodes, and depositing a plurality of functional groups on at least part of the surface of the object, whereby the atmosphere between the two electrodes comprises a multi-functional hyperbranched compound which is a polymer based on AB05-09-2013
20110265947METHOD OF CREATING A POSITIVE SUBSTANCE JOINT BETWEEN COMPONENTS - A method of creating a positive substance joint between components (11-03-2011
20130133825PATTERN FORMATION METHOD AND POLYMER ALLOY BASE MATERIAL - According to one embodiment, a pattern formation method is provided, the pattern formation includes: laminating a self-assembled monolayer and a polymer film on a substrate; causing chemical bonding between the polymer film and the self-assembled monolayer by irradiation with an energy beam to form a polymer surface layer on the self-assembled monolayer; and forming on the polymer surface layer a polymer alloy having a pattern of phase-separated structures.05-30-2013
20090183824BISTABLE WATERMARK - A watermark formed of a bistable material, and a method of forming the watermark, are described.07-23-2009
20100307675METHOD FOR PRODUCING A LAMINATE - The invention relates to a method for producing a decorated laminate having a plate-shaped core made of wood or wood material, a decorative layer on at least one side of the core, and a cover layer made of aminoplast on the decorative layer, comprising the following steps: attaching the decorative layer, applying a layer made of an aqueous solution of an aminoplast precursor to form a cover layer on the decorative layer, at least partially drying the cover layer, curing the aminoplast under pressure and heat, wherein a part of said solution of said aminoplast precursor is initially applied and the partial layer thus generated is dried and said step is repeated at least twice, in order to form the final cover layer.12-09-2010
20120273125METHOD FOR COHESIVELY BONDING METAL TO A NON-METALLIC SUBSTRATE - A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.11-01-2012

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