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With stripping of adhered lamina

Subclass of:

156 - Adhesive bonding and miscellaneous chemical manufacture

156001000 - METHODS

156060000 - Surface bonding and/or assembly therefor

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
156249000 And assembly with different lamina 96
156248000 With cutting of one lamina only while adhered 20
Entries
DocumentTitleDate
20130025777METHOD OF REUSABLY SEPARATING TWO ADHERED PLATES AND APPARATUS USED FOR THE METHOD - Provided is a method of reusably separating two adhered plates, including step 1 for firmly adhering two plates adhered to each other via a pressure-sensitive adhesive sheet or a curable resin layer to a first jig and a second jig, respectively, step 2 for detaching the two plates by moving at least one of the first jig and the second jig to produce a shear stress causing breakage of the pressure-sensitive adhesive sheet or the curable resin layer, and step 3 for removing the two plates after detachment from the jigs, wherein, in the aforementioned step 1, one or both of the plates is(are) firmly adhered to the jig(s) via a silicone pressure-sensitive adhesive sheet or porous pressure-sensitive is adhesive sheet. Using the method, two plates adhered to each other via a pressure-sensitive adhesive sheet or a curable resin layer can be stably and reusably detached by certainly fixing them by using jig fixtures.01-31-2013
20130025776LABEL DISPENSING DEVICE AND METHOD - A label dispensing device is disclosed for dispensing labels from a web that has a web path extending through the label dispensing device. The label dispensing device includes a dispensing member and a transition member. The dispensing member is shaped to effectuate a flexure of the web and includes a peel edge disposed along a portion of the web path. The transition member has a web control surface disposed along a portion of the web path. The web control surface is downstream of the peel edge and is configured to engage the first side of the web, thereby reducing the flexure of the web effectuated by the dispensing member.01-31-2013
20120168066PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE - To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.07-05-2012
20100122765Method for the multi-track tailoring of transdermal therapeutic patches - A method for the multi-track tailoring of transdermal therapeutic patches having at least a one-layer, adhesive reservoir foil containing an active ingredient, which is disposed between an adhesive back foil and a removable protective foil. The reservoir foils are applied per track with their adhesive layers on a transport element moving discontinuously in the longitudinal direction of the reservoir foils. After separating sections of the size of a patch or band aid the same are transferred to a further transport element that is moved continuously for depositing the same thereon in spaced relationship. The present invention provides a method for multi-track tailoring, wherein web-shaped reservoir foils, which can be unwound from rolls, may be utilized without producing any waste containing the active ingredient.05-20-2010
20100147452PHOTO PORTRAIT MEDIA FOR DIGITAL PRINTERS - A photo quality multi-layered sheet suitable for digital printing includes a first sheet patterned in pre-determined dimensions for rendering a photographic image thereupon and a second sheet married to said first sheet by an adhesive, wherein said adhesive only remains upon said second sheet when said second sheet is removed from said first sheet. The adhesive also allows for the first sheet to be repositioned on the second sheet. The first sheet lays flat once removed from the second sheet, and the pre-determined dimensions are of a conventional size, which are created by die-cutting or die-perforating in order to maintain clean edges when the pre-determined dimensioned areas are separated from one another.06-17-2010
20130037205METHOD AND SYSTEM FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE - A method for manufacturing a liquid crystal display device by feeding carrier films from continuous rolls, respectively, and by bonding optical films, which are being peeled off or have been peeled off from the carrier films, respectively, to first and second panel surfaces of a liquid crystal panel, respectively, with a pressure-sensitive adhesive interposed therebetween so that the liquid crystal display device is obtained. The method includes: a first bonding step including bonding a first optical film to the first panel surface; a rotation step including rotating the liquid crystal panel; a second bonding step including bonding a second optical film to the first optical film; and a third bonding step including bonding a third optical film to the second panel surface of the liquid crystal panel.02-14-2013
20100032085METHOD FOR PRODUCING SELF-SUPPORTING MEMBRANES - The disclosure relates to methods and systems for separating a membrane from a substrate. In accordance with a preferred embodiment, the method includes applying at least one member to the membrane by way of an adhesive, wherein the adhesive is applied to substantially less than the entirety of the surface of said membrane which is not facing the substrate. The method further includes separating at least a part of the membrane from the substrate by applying a force to the at least one member.02-11-2010
20130032283Systems and Methods for Forming Laminates with Patterned Microwave Energy Interactive Material - Portions of microwave energy interactive material may be cut and removed during intermediate steps in a lamination processes, so that remaining microwave energy interactive material in a resultant laminate is arranged in a pattern. Regarding the removal of the portions of the microwave energy interactive material, a compound laminate may be delaminated into parts, and one of the parts may be a sacrificial laminate that includes the removed portions of the microwave energy interactive material.02-07-2013
20130032282APPARATUS AND METHOD FOR MANUFACTURING A FLEXIBLE DISPLAY DEVICE - An apparatus and method for manufacturing a flexible display device by a roll-to-roll method, are discussed. According to an embodiment, the apparatus includes a substrate transferring part for transferring a lower substrate attached onto a carrier substrate; a substrate separating part for separating the carrier substrate from the lower substrate transferred by the substrate transferring part; an upper bonding part for bonding an upper substrate to an upper surface of the lower substrate from which the carrier substrate is separated; and a lower bonding part for bonding a rear substrate to a lower surface of the lower substrate from which the carrier substrate is separated.02-07-2013
20100108247Method and Apparatus for a Retro-reflective Material - A process of making a micro glass beaded retro-reflective material comprising micro glass beads lenses, which are partially embedded in graphic matrixes of binding material. The pre-fixed rotating axes of the micro glass beads lenses lie at varying angles to the general plane of the graphic matrix to achieve uniform visibility in broad range of entrance and observation angles. The gaps between the graphic matrixes allow the permeability, flexibility, softness and color of the base material to be maintained.05-06-2010
20100108248METHOD FOR PRODUCING PIEZOELECTRIC COMPOSITE SUBSTRATE - A method for producing a piezoelectric composite substrate having a single-crystal thin film of a piezoelectric material includes an ion-implantation step and a separation step. In the ion-implantation step, He05-06-2010
20130068379METHOD FOR FABRICATING DISPLAY DEVICE - A method for fabricating a display device 1 includes a first step of attaching a display panel and a first substrate member to each other with a first adhesive sandwiched between the display panel and the first substrate member, and a second step of attaching a second substrate member to the first substrate member on a surface of the first substrate member opposite to the display panel with a second adhesive sandwiched between the first and second substrate members, where the second step is carried out subsequently to the first step. The second adhesive used in the second step has a glass transition point higher than a glass transition point of the first adhesive.03-21-2013
20090044902Method Of Masking A Surface - A method of applying a flexible, biodegradable sheet of starch-based material to mask a surface to be coated is described. The sheet is a solid, flexible, expanded, close-celled foam. The sheet is dispersible in water.02-19-2009
20090044901Heat conducting glue and a method for joining metallic plate materials together with the glue - A kind of heat conducting glue comprises heat conducting resin, and release films on two sides of the heat conducting resin; the heat conducting glue is made by means of applying conducting resin to a first release film, baking the heat conducting resin to a certain degree, heating and pressing the heat conducting resin so as stick the heat conducting resin on a second release film, and making the heat conducting glue become a roll; two metallic plate materials are joined together by means of detaching the first release film from the heat conducting resin, sticking the heat conducting resin on one of the metallic plate materials, detaching the second release film, and pressing the other metallic plate material and the heat conducting resin against each other to join them together.02-19-2009
20090321003PROCESS AND ASSEMBLY FOR PRODUCING A PLANAR APPLIQUE PATTERN FROM A TACKY SURFACED VINYL SHEET SUCH AS FOR APPLICATION AS A DECORATIVE WINDOW GRID PATTERN - A kit for creating a decorative overlay for applying to a surface, including a sheet of a flexible material constructed from a first layer with an adhesive underside and a second backing layer. A plurality of score lines are formed in the first layer and, upon removal of a plurality of subset portions from the surface layer which are bounded by score lines, reveals a decorative pattern. A temporary covering is applied over a finished (front) surface of the first layer and, subsequently, the adhesive backing layer is removed exposing the adhesive underside. The adhesive pattern, supported by the temporary covering, is then applied over the desired surface and the temporary sheet is removed leaving in place the adhesively applied decorative pattern.12-31-2009
20130087273STIFFENING COMPONENT AND METHOD AS WELL AS COMBING TOOL - The invention relates to a stiffening component (04-11-2013
20130087274Method for Manufacturing an Adhesive Tape, Particularly Suited for Longitudinal Wrapping of Elongated Goods, and Device for Performing the Method - An apparatus for producing adhesive tape for sheathing of extended products, having two tape plies, having a carrier material with an adhesive coating. The carrier material being unwound from a feeding roll, the one tape ply with its adhesive coating being laminated against the other tape ply with a lateral projection (Ü04-11-2013
20100101716APPARATUS FOR FIXING A RADIATION-CURABLE GEL-INK IMAGE ON A SUBSTRATE - An apparatus fixes ink on a substrate, such as in ink-jet printing. A leveling member is positioned to contact an ink-bearing side of the substrate at a nip. A radiation source is positioned to direct radiation to the ink-bearing side of the substrate at the nip, the radiation suitable for curing the ink on the substrate.04-29-2010
20120216950EXTERIOR FILM FOR HOME APPLIANCE AND METHOD OF ADHERING THE EXTERIOR FILM - Provided are an exterior film for a home appliance and a method of adhering the exterior film. The exterior film is formed by performing a half cutting process on a portion of a through part disposed on an exterior part of the home appliance, so that the portion of the through part can be removed while a support protective film is removed, and the rest thereof is cut out after the removing of the support protective film.08-30-2012
20120216949DRY ADHESIVE - A selective adhesive mechanism comprises an engineered surface structure or substrate and a compliant member. The compliant member is able to be a dry and non-tacky substance. The compliant member is selectively adhesive to the engineered surface when the compliant member is in contact with the engineered surface. The compliant member shows adhesion to the engineered surface when the compliant member is within a pre-selected range of hardness. In some embodiments, the compliant member comprises a polymeric member, a thermoplastic elastomer, silicone, polyurethane, or a combination thereof.08-30-2012
20130056140POLYSILOXANES WITH AMINO FUNCTIONALITIES HAVING REVERSIBLE THICKENING AND ADHESION PROPERTIES AND SYSTEMS AND METHODS FOR CRUDE OIL, PETROLEUM PRODUCT OR CHEMICAL SPILL CONTAINMENT AND REMEDIATION - Reversibly and irreversibly-linking amino-polysiloxanes, methods of making such amino-polysiloxanes, and systems and methods of using such amino-polysiloxanes for the containment and/or remediation of a release and/or spill of a crude oil, a petroleum product and/or a chemical is described. Gels and/or emulsions formed from the combination and/or contacting of such an amino-polysiloxane with these materials can be used to recover these oils or chemicals while allowing the amino-polysiloxane to be recovered and reused to clean up or contain additional materials. Such amino-polysiloxanes can be used as well for the selective uptake of one component of liquid mixtures when such mixtures contain more and less lipophilic components. Methods of making and using adhesive and sealants containing such amino-polysiloxanes are described. The adhesive and sealants can be used in a variety of applications to adhere and/or seal various materials including plastics, metals, glass, ceramics, paper, paper products, wood, and wood products.03-07-2013
20130056141DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized03-07-2013
20110056620THERMOPLASTIC FLASHING LAMINATE - A flashing laminate includes a non-reinforced thermoplastic sheet having a bottom surface, a first longitudinal edge, and a second longitudinal edge. The flashing laminate also includes an adhesive layer on a longitudinally extending portion of the bottom surface adjacent to one of the longitudinal edges. In one or more embodiments, the laminate also includes a release liner positioned over the adhesive tape.03-10-2011
20120305177IDENTI-MEDS SYSTEM - An identi-meds system comprising: a medication bottle assembly and a supplementary removeably-coupleable tag for accurately identifying contents contained in bottle(s). The medication bottle assembly includes a cap having an outer surface and an inner surface, a bottle having a body, and a prescription label. The supplementary removeably-coupleable tag includes an adhesive backing comprising an adhesive; and a peel-away sheet. The cap, the bottle, and the prescription label comprise the medication bottle assembly to contain and identify at least one medication in Layman's terms. The inner surface of the cap is removably-coupleable to the body of the bottle to contain and access the medication.12-06-2012
20090056865ADHESIVE AND PROCESS FOR ATTACHING AND DETACHING ARTICLES - The present invention relates to using an adhesive and process for heating, curing, joining, attaching and detaching a part article from a body substrate structure. Described are polymeric adhesive compositions and methods of curing using a radiation apparatus for rapid adhesive bonding and attaching a fastener part to a structure surface. The adhesive composition contains additives that directly or indirectly absorb projected radiation from a radiation apparatus to rapidly and uniformly melt the adhesive and bond the surface of the part material onto the surface of the substrate material. A process is also described to reverse the adhesive bonding and detach the fastener part from the substrate.03-05-2009
20090266479TRANSFER SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENT ELEMENT - A transfer substrate includes a base layer, a light-reflecting layer pattern, a light-to-heat conversion layer and a transfer layer. The transfer layer is formed on the light-to-heat conversion layer. A line shaped laser beam may be scanned over the entire area of the transfer substrate to transfer designated portions of the transfer layer onto designated electrodes on an array substrate to make an organic electroluminescent display. Thus, processing time may be reduced, and an organic electroluminescent element may be efficiently formed on a large-size substrate.10-29-2009
20110011529Removable adhesive for adhering an image to a surface and a method for removing the image - A removable adhesive of a combination of acrylic and urethane polymers is provided for securing, among other things, a transfer image to a hard surface. A removable top coat is provided. A top coat comprising a cellulose acetate butyrate alcohol and a diacetone alcohol is provided. A remover for removing the transferred image is provided which is a combination of tetrahydrofuryl alcohol and a dibasic ester and a surfactant.01-20-2011
20110011528METHOD AND SYSTEM FOR FABRICATING A CONDUCTIVE PLATE - A method for fabricating a conductive plate includes providing a base substrate and a conductive material that includes a plurality of nanounits. The conductive material is placed on the base substrate, where a portion of the conductive material placed on the base substrate is removed.01-20-2011
20110011526Preparing A Pass-Through For An Occupant Compartment - Engine Compartment Ground Block - A special patch is adhered to the bare metal of a dash panel in covering relation to one or more pass-through holes and their margins before a truck cab is primed and painted. After painting, a cover of the patch is peeled off to expose an electrically conductive medium that remains adhered to the bare metal. A ground block is mounted on the dash panel with a stud passing through a pass-through hole. The electrically conductive medium establishes conductivity of the body of the ground block to the dash panel.01-20-2011
20090236036HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PROCESS FOR CIRCUIT BOARD USING THE HEAT CURABLE COMPOSITION - A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.09-24-2009
20090014117Method for Producing a Releasable Seal With a Sealing Compound and Use of Adhesive Strips for Carrying Out the Method - Disclosed is a method for producing a releasable seal with a sealing compound between two fairing parts, in particular between two fairing parts for the wing-fuselage fillet of aircraft, including the steps of applying adhesive strips to respectively opposite edges, of the fairing parts and outer surfaces adjacent to them of the fairing parts; filling a sealing joint extending between the opposite edges with the sealing compound; and removing the adhesive strips after the curing of the sealing compound. This makes it possible to provide a re-releasable seal with a sealing compound which is curable or cures on its own in air between two fairing parts without the use of release agents. Also disclosed is the use of adhesive strips for carrying out this method.01-15-2009
20090145539REMOVABLE ADHESIVE TAPE - A removable adhesive tape comprising a highly extensible and substantially inelastic backing and a layer of pressure-sensitive adhesive. The backing has a high tensile strength, has a lengthwise elongation at break of at least about 150% with less than about 50% elastic recovery after stretching. The adhesive can be a normally tacky and pressure-sensitive adhesive and is coated on at least one surface of the film backing. The adhesive is preferably highly extensible, does not separate from the backing during stretching, and has higher cohesion than adhesion to any suitable substrate. After being applied to a substrate, the adhesive tape of the present invention becomes firmly bonded, but can be easily removed without damaging the substrate by simply stretching it in a direction substantially parallel, i.e., less than about 35°, to the surface of the substrate.06-11-2009
20080308221Method And System For Removing Tape From Substrates - A method for removing tape from a substrate includes the step of detecting an actual distance between a peel head and the tape on the substrate, and a location of an edge of the substrate. The method also includes the steps of moving the peel head in a first direction by an amount equal to the distance to press the peel tape onto the tape on the substrate, moving the peel head in a second direction to the edge of the substrate, and then moving the peel head in an opposite second direction to peel the tape from the substrate. The detecting step can be performed using a sensor such as a capacitance probe sensor or an optical sensor. Alternately, rather than detecting the distance, a pressure sensing system can be used to press the peel head against the tape, and to maintain a predetermined pressure range during the peeling process. A system for performing the method includes sensors configured to detect the distance and the edge of the substrate, and a control system configured to control the movement of the peel head responsive to signals from the sensors. A pressure sensing system includes a compression spring and a load cell for sensing pressure, and a stepper motor configured to control movement of the peel head responsive to pressure signals.12-18-2008
20120234480METHOD FOR FIXING GLASS SUBSTRATES AND METHOD FOR PREPARING FLEXIBLE DISPLAY DEVICE - Embodiments of the disclosed technology disclose a method for fixing glass substrates and a method for preparing a flexible display device. The method for fixing glass substrates comprises coating an edge portion of a first glass substrate corresponding to a second glass substrate with epoxy resin and screeding the coated epoxy resin layer, adhering the second glass substrate to the first glass substrate, and annealing the two glass substrates. With the technical solution of this disclosed technology, the time period for fixing the adhered glass substrates can be reduced with an improved productivity.09-20-2012
20130160940MOUNTING DEVICE AND METHOD FOR MOUNTING A COMPONENT ON A COMPONENT CARRIER USING AN ADHESIVE - A mounting device and method for mounting a component is disclosed. The mounting device includes a component carrier and an adapter. The adapter is insertable into a guide of the component carrier. The method uses the mounting device to mount a component on the mounting device.06-27-2013
20110277928METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - A method for manufacturing a composite substrate that prevents undesirable effects of etching a thin film includes a pattern forming step, an ion implanting step, a bonding step, and a separation step. In the pattern forming step, a pattern region and a reverse pattern region are formed on a principal surface of a functional material substrate. In the ion implanting step, by implanting ions into the functional material substrate, a separation layer is formed inside at a certain distance from the surface of each of the pattern region and the reverse pattern region. In the bonding step, the functional material substrate at the pattern region is bonded to a supporting substrate. In the separation step, the pattern region is separated from the functional material substrate, and the reverse pattern region is made to fall off.11-17-2011
20110272090GLASS SUBSTRATE WITH PROTECTIVE GLASS, PROCESS FOR PRODUCING DISPLAY DEVICE USING GLASS SUBSTRATE WITH PROTECTIVE GLASS, AND SILICONE FOR RELEASE PAPER - To provide a glass substrate with protective glass which suppresses formation of microscopic scratches on the back surface of the glass substrate in the production process for a display device, and which prevents a strength decrease in the process or formation of etch pits after a chemical etching treatment; a process for producing a display device by using the glass substrate with protective glass; and silicone for release paper for the glass substrate with protective glass. A glass substrate with protective glass, which comprises a glass substrate and a protective glass substrate laminated on each other, and which is characterized in that the glass substrate and the protective glass substrate are laminated by a resin layer having removability.11-10-2011
20110290415APPARATUS AND METHOD FOR DETAPING AN ADHESIVE LAYER FROM THE SURFACE OF ULTRA THIN WAFERS - An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck is configured to support and hold a wafer that comprises an adhesive layer on its top surface. The contact roller comprises an elongated cylindrical body extending along a first axis passing through its center and is configured to rotate around the first axis and to move linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller comprises an elongated cylindrical body extending along a second axis passing through its center and is configured to rotate around the second axis. The second axis is parallel to the first axis and the pick-up roller is arranged at a first distance from the contact roller. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller comprises a 360° degrees circular surface layer rolled around and attached to its outer cylindrical surface. The contact roller further includes means for attaching the detaping tape onto the adhesive layer by rotating clock-wise around its axis and linearly moving along a first direction over the wafer and means for contacting the adhesive layer with the 360° degrees circular surface layer.12-01-2011
20110290414METHOD FOR MANUFACTURING COLOR ELECTROPHORETIC DISPLAY DEVICE - A method for manufacturing a color electrophoretic display device includes the following steps. First, a substrate having a displaying region and a circuit region around the displaying region is provided. Next, a driving array is formed in the displaying region. Subsequently, an electrophoretic display layer is formed on the driving array. Afterwards, a thermal transfer process is performed so that a color filter layer is formed on the electrophoretic display layer. The method can increase the production eligibility rate of the color electrophoretic display device, thereby improving the display quality of the color electrophoretic display device.12-01-2011
20110290413Laser Ablation of Adhesive for Integrated Circuit Fabrication - A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.12-01-2011
20080257485REVERSIBLE DRY ADHESIVES - One embodiment of the invention includes product comprising an elastomeric epoxy dry adhesive with a pull-off strength of 1-200 N/cm10-23-2008
20130160939FILM, METHOD FOR MANUFACTURING THE FILM AND MASKING METHOD USING THE FILM - A film includes base and a photosensitive layer formed on the base. The photosensitive layer substantially includes a first photosensitive agent, a second photosensitive agent, and a thermosol. The first photosensitive agent is water-soluble. The second photosensitive agent is an aromatic ketone compound or a benzoin ether compound. The method for manufacturing the film and the masking method using the film is also provided.06-27-2013
20110079349Method of manufacturing printed circuit board - The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.04-07-2011
20110272088SYSTEMS AND RELATED METHODS FOR TRACTIONAL GRIP FRAMES FOR TABLET DEVICES - Grip frame systems and related methods are provided for tablet devices. The grip frame system can create gripping surfaces on a tablet device. The grip frame system can include one or more traction-creating coverings positionable on a portion of at least one of a border surrounding a screen of the tablet device, sides of the tablet device, or a rear face of the tablet device. The traction-creating coverings can include one or more micro-terrain layers forming an outer surface at selected locations that form a frictional contact surface.11-10-2011
20090288764Process For Manufacturing Free Standing Thermoplastic Polymeric Films - This invention discloses a novel process for manufacturing very thin freestanding polymeric films with the steps of supplying a molten film layer stream and a molten assist layer stream by a first extruder and second extruder; intimately contacting the film layer stream and the assist layer stream in coplanar fashion; extruding the film layer stream and the assist layer stream through a planar coextrusion die lip; stretching the multilayer melt curtain; cooling the multilayer film; delaminating the assist layer or layers from the film layer; and transporting the film layer to downstream processing operations. This process allows manufacturing of very thin freestanding films made from amorphous polymers, highly filled films made from amorphous, semi crystalline, or crystalline polymers, chemically cross linked films, and films with diffused addenda that would normally cause undesirable reactions in an extrusion environment.11-26-2009
20100089529MICROFLUIDIC DEVICES AND PRODUCTION METHODS THEREFOR - A method of producing a microfluidic device having at least one flow path may include providing a base substrate with a first surface and a top substrate with a second surface, hydrophilically treating at least one of the first and the second surfaces to provide a surface layer with a higher surface tension than the surface tension prior to the hydrophilic treatment, partly or totally removing the surface layer with a higher surface tension in a selected pattern of the hydrophilically treated first and/or second surfaces, to thereby provide the selected pattern with a lower surface tension than prior to the partly or totally removal of the surface layer with a higher surface tension in said selected pattern of the hydrophilic treated first and/or second surfaces, and joining said base substrate and top substrate to each other to provide a flow path between said first and second surfaces.04-15-2010
20090090461METHOD OF MINIMIZING RESIDUE ADHESION FOR THERMO-REVERSIBLE DRY ADHESIVES - One embodiment of the invention includes a method of joining two substrates with multilayer thermo-reversible dry adhesives and separating the two bonded substrates by completely thermally reversing the adhesion via heating.04-09-2009
20130098543METHOD OF APPLYING WINDOW FILM - Disclosed herein is a method of applying window film to a window without water. The method includes providing a laminate having an adhesive layer disposed between a window film and a release liner. A portion of the adhesive layer is exposed and contacted with a window pane, and this sequence of steps is repeated until the adhesive layer is completely exposed. The window film is smoothed to the edges of the window pane and trimmed such that a gap between the edges of the window film and the frame is from about 1/32 to about 1/4 inches. Trapped air from between the window film and the window pane by pushing the trapped air out from between the adhesive layer and the window pane using the flat edge of a tool. The adhesive layer may be self-wetting and/or removably repositionable. The window film may be a solar film, an anti-shattering film, a privacy film, a decorative film, a graphic, a radio frequency blocking film, or a combination thereof.04-25-2013
20090277574PATTERN TRANSFER METHOD - According to one embodiment, a pattern transfer method includes spin-coating one surface of a medium substrate with photopolymer having viscosity of 10 cps or less to form an photopolymer layer having a thickness of 200 nm or less, bonding the one surface of the medium substrate and the patterned surface of the first transparent stamper under vacuum with the photopolymer layer sandwiched therebetween, applying an ultraviolet ray to the photopolymer layer through the first transparent stamper to cure the photopolymer layer, and peeling off the first transparent stamper to form the photopolymer layer to which patterns of protrusions and recesses are transferred on the one surface of the medium substrate to control a thickness of the photopolymer layer remaining in recesses to 100 nm or less.11-12-2009
20090008029METHOD OF LAMINATING ARTICLES - A method of laminating a sheet or sheets to a substrate and a method of laminating a plurality of articles. The substrate is inserted into a press. The sheet is inserted into the press over the substrate. Liquid thermoset polymer is injected into the press. Heat and pressure are applied forcing the liquid thermoset polymer against the sheet and forcing the sheet against the substrate. The liquid thermoset polymer is allowed to cure under heat and pressure forming a cured silicone rubber sheet. The cured silicone rubber sheet is removed from the press. A plurality of articles may be laminated by laminating the second of the articles while the first article is cooling.01-08-2009
20120291944METHOD OF PRODUCING ELECTRONIC COMPONENT - There is provided a method of producing an electronic component capable of preventing electrostatic destruction on a circuit or the like formed on the electronic component by eliminating the electrification charge generated on a pressure-sensitive adhesive sheet efficiently in a short period of time upon producing the electronic component using the pressure-sensitive adhesive sheet. The present invention is a method of producing an electronic component using a pressure-sensitive adhesive sheet in which at least a pressure-sensitive adhesive layer and a separator are sequentially stacked on a base material, the pressure-sensitive adhesive sheet having 900 seconds or less of a half-value period of the electrification charge generated on a surface of said pressure-sensitive adhesive layer by the charge decay measuring method based on JIS L1094, at least comprising: a step of peeling said separator off from said pressure-sensitive adhesive layer; a step of eliminating the electrification charge on the surface of said pressure-sensitive adhesive layer; and a step of bonding an electronic component onto said pressure-sensitive adhesive layer after charge elimination.11-22-2012
20110203725COMPOSITE DUCT ASSEMBLY - A method of manufacturing a carbon composite duct assembly includes providing a first carbon composite fabric layer having a first section. The first section is formed into a first portion and a second portion. The first portion is separately moveable relative to the second portion. The first portion overlaps the second portion to define a first corner of the first carbon composite fabric layer. The first carbon composite fabric layer is formed into at least a portion of a duct extending along an axis.08-25-2011
20100096078METHOD OF MANUFACTURING WIRING SUBSTRATE - Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate.04-22-2010
20120037305METHOD OF MANUFACTURING OPTICAL FILM - To provide a method of manufacturing an optical film formed on a plastic substrate. There is provided a method of manufacturing an optical film including the steps of laminating a separation layer and an optical filter on a first substrate, separating the optical filter from the first substrate, attaching the optical filter to a second substrate. Since the optical film manufactured according to the invention has flexibility, it can be provided on a portion or a display device having a curved surface. Further, the optical film is not processed at high temperatures, and hence, an optical film having high yield with high reliability can be formed. Furthermore, an optical film having an excellent impact resistance property can be formed.02-16-2012
20080289749Method for Manufacturing a Diagnostic Test Strip - A method for manufacturing a diagnostic test strip is disclosed according to one embodiment. The method includes the acts of providing an application sheet having a plurality of adhesive dots thereon, providing a first substrate layer having at least one feature located thereon, and providing a second substrate layer. The method further including the acts of transferring at least one of the plurality of adhesive dots located on the application sheet to the first substrate layer, aligning the first substrate layer with the second substrate layer, and attaching the first substrate layer and the second substrate layer using the transferred adhesive dots, wherein the attaching of the first and second substrate layers is performed without any additional alignment.11-27-2008
20090288763Thermally strippable double faced adhesive sheet and method of working work piece - A thermally strippable double faced adhesive sheet comprising a substrate, a thermally strippable pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a pressure-sensitive adhesive layer (B) arranged on the other side of the substrate, in which the substrate comprises a porous substrate. The porous substrate preferably has a density of 0.9 g/cm11-26-2009
20120291943METHOD FOR PREPARING A CATHETER ASSEMBLY INCLUDING A SENSING ELEMENT HAVING AN ADHESIVE BACKING - The present invention is directed to a sensing element that comprises a flexible substrate having first and second opposite surfaces; at least one sensor disposed on the first surface of the flexible substrate; an adhesive layer substantially covering the second surface of the flexible substrate; and a release liner releasably adhered to the adhesive layer so that upon removal of the release liner the adhesive layer is exposed for securing the sensing element to the catheter. The release liner permits the sensing element to be positioned at a desired location within the catheter after which the release liner can be removed to expose the adhesive layer. The adhesive layer can then be used to attach and secure the sensing element at a desired location on the catheter. As a result, the need for additional adhesives can be reduced or eliminated.11-22-2012
20120267044METHOD FOR MANUFACTURING TWIST BALL TYPE ELECTRONIC PAPER - A method for manufacturing a twist ball type electronic paper capable of preferably displaying an image and enabling easily taking out of a wiring, and a manufacturing method for a twist ball type electronic paper for manufacturing a reusable twist ball type electronic paper.10-25-2012
20120267043Decorating Accessory and Method of its Manufacture - A method for manufacturing a decorating accessory includes the steps of: (a) preparing a base, a first film and a second film; (b) attaching the first film to the base; (c) cutting the first film; (d) removing a remaining portion of the first film; (e) attaching the second film to the first film; (f) cutting the second film; (g) removing a remaining portion of the second film to form a stacked array; (h) hot pressing the stacked array to get a finished decorating accessory; (i) collecting the finished decorating accessory.10-25-2012
20090032179PROCESS FOR PRODUCING MEMBRANE-ELECTRODE ASSEMBLY FOR POLYMER ELECTROLYTE FUEL CELLS - To provide a process for producing a membrane-electrode assembly for polymer electrolyte fuel cells, which has a high output voltage in a wide range of current densities and is excellent in durability against a humidity change.02-05-2009
20100139854ATHLETIC INFORMATION DISPLAY - A product and method for displaying athletic data and certain information on skin is described. Said information being, but not limited to, an athlete's pacing goals for an athletic event, a course map, or other event information helpful to an athlete while competing in an athletic event. Said information preferably being displayed in the form of a temporary tattoo that can be applied to an athlete's skin so that the information is readily available and convenient to use during the event.06-10-2010
20110005667MULTIPLE SEGMENT VACUUM RELEASE HANDLING DEVICE - A vacuum release device is provided for temporarily immobilizing objects, the device comprising: a substrate; a plurality of vacuum release subunits which can be operated independent of each other, each vacuum release subunit comprising an adhesive layer over a surface of the substrate; and a spacing material positioned between the substrate and the adhesive layer so as to form a chamber within which a vacuum may be formed, application of the vacuum causing the adhesive layer to recess toward the chamber.01-13-2011
20090199962Delamination tool with enhanced force response - The present invention is directed to a tool for de-laminating two or more bonded material layers wherein two simultaneous force vectors are applied to the tool so as to control the resulting effect of the tool. In particular, the tool is comprised of a handle, a shaft having a proximal and a distal end, a working face, and a strike plate. The handle is connected to the proximal end of the shaft wherein the shaft has a finite length. At the distal end of the shaft is a working face which may be either integral to the shaft or is a separate element which is durably attached to the shaft. At a point on the shaft between the proximal or handle end, and the distal or working face end, a strike plate is durably attached to the shaft. The strike plate is configured to receiving repeated impact by a drive source.08-13-2009
20090020222ADHESION DEVICE FOR APPLYING AND RELEASING BIOMIMETIC MICROSTRUCTURE ADHESIVE FROM A CONTACT SURFACE - An adhesion device is configured as a BMA “applicator” made up of three parts: an anchor portion; a peeler layer; and a “biomimetic microstructure adhesive” (BMA) portion. The anchor portion has one side affixed to a part of an object to be releasably adhered to a surface. The peeler layer has an inwardly facing side thereof affixed to the other side of the anchor portion. The BMA portion is affixed to an outward side of the peeler layer with its setae facing outwardly towards the surface to be adhered to. The anchor portion is affixed to the peeler layer at a position offset from the position at which the BMA portion is affixed, so that the object may be releasably detached from adhesion with the surface by pulling away at an angle to the surface and pulling on only an initial set of setae of the BMA portion proximate to the offset position of the anchor portion.01-22-2009
20090255625DEEP DRAW METHOD OF MAKING IMPACT AND VIBRATION ABSORBING ARTICLES AND THE ARTICLES FORMED THEREBY - The present disclosure relates to cushioning members, methods of making and methods of using, particularly to cushioning members comprising a plurality of spaced apart pillars comprising a polymeric material.10-15-2009
20110220276Radio Frequency (RF) Antenna Containing Element and Methods of Making the Same - A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.09-15-2011
20100175823METHOD FOR PRODUCING ELECTRIC-WAVE-TRANSMISSIBLE TRANSFERRING MEMBER - Provided is a method for producing an electric-wave-transmissible transferring member capable of expressing a metallic luster pattern having a shape outline. A peel layer is formed on a base sheet having peelability and throughout the whole of a surface of the sheet. Next, a water-soluble pattern layer is partially formed thereon. Next, an electric-wave-transmissible metallic luster layer is formed thereon and throughout the whole of the surface thereof. Next, a protective layer is formed thereon and throughout the whole of the surface thereof, or is formed thereon and, partially, in the region where the water-soluble pattern layer is not formed. Next, the workpiece is subjected to a heating treatment and then a water-washing treatment to peel and remove the water-soluble pattern layer, and the electric-wave-transmissible metallic luster layer and the protective layer formed over the layer. Next, an adhesive layer is wholly or partially formed on the workpiece.07-15-2010
20100163169METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE - A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO07-01-2010
20100163168METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT - A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface modification step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface modification step, a surface of the resin layer is modified, after the fixing step but before the insulation layer formation step.07-01-2010
20100186889VACUUM BAGGING METHODS AND SYSTEMS - Vacuum bagging methods and systems are provided for lay-ups of pre-impregnated composite materials. Generally, the methods and systems of the present invention provide for applying a sealing layer of resin over a release layer, which is on a lay-up of pre-impregnated reinforcement composite materials.07-29-2010
20100193117PROCESS FOR MAKING RESILIENT PAD COMPOSITE - The present application discloses a composite pad structure that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure.08-05-2010
20100212821SYSTEM AND METHOD FOR COLD FOIL RELIEF PRODUCTION - Disclosed are methods, systems, machines and products, including a method for producing foil relief. The method includes placing a foil on a curable adhesive deposited on a substrate when the curable adhesive is substantially non-tacky, and applying energy to the adhesive deposited on the substrate while pressing the foil to the adhesive to cause the adhesive to become tacky and to adhere to the foil. The adhesive becomes substantially fully cured prior to completion of the pressing of the foil to the adhesive deposited on the substrate. In some embodiments, the method may further include pre-curing the curable adhesive prior to placing the foil on the adhesive to initiate the curing process of the adhesive and manipulate a viscosity level of the adhesive, with the pre-cured adhesive remaining substantially non-tacky. The curable adhesive includes one or more of, for example, a radical type adhesive and/or a cationic adhesive.08-26-2010
20100236701METHOD AND APPARATUS FOR ADHERING SHEETS TOGETHER WITHOUT TRAPPED BUBBLES AND EASY DETACHMENT OF STACK - Disclosed is a method and apparatus for bonding sheets together without trapping bubbles between two adjacent sheets and a procedure for easy detachment of the completed stack of bonded together sheets from the apparatus that constructed it. The present invention is particularly well suited for use with apparatus for construction of three-dimensional objects from a stack of thin sheets bonded together.09-23-2010
20100122764Surrogate Substrates for Inverted Metamorphic Multijunction Solar Cells - A method of manufacturing a solar cell by providing a first substrate; depositing on a first substrate a sequence of layers of semiconductor material forming a solar cell; mounting and bonding a surrogate second substrate composed of a material having a coefficient of thermal expansion substantially similar to that of the semiconductor layer on top of the sequence of layers; and removing the first substrate.05-20-2010
20100000670ADHESIVE COMPOSITION AND METHOD FOR TEMPORARILY FIXING MEMBER BY USING THE SAME - To provide a method for temporarily fixing an optical member suitable for processing of optical members, and an adhesive composition useful for such a method.01-07-2010
20100186888METHOD OF PRODUCTION OF LOW-PERMEABLE RUBBER LAMINATE USING MULTI-LAYER FILM OF LOW-PERMEABLE RESIN - A method for easily producing a low permeable rubber laminate comprised of a thin film layer of a low permeable resin (B) laminated on a layer of a rubber composition (C) comprising: 07-29-2010
20090038749ADHESIVE FILM AND METHOD OF FABRICATING FLEXIBLE DISPLAY USING THE SAME - Provided is an adhesive film used for manufacturing a flexible display. The adhesive film includes a support body, a first adhesive layer, and a second adhesive layer. The support body has a first surface and a second surface. A flexible substrate is attached on the first surface. A support substrate is attached on the second surface. The second surface is opposite to the first surface. The first adhesive layer is provided on the first surface of the support body, and the second adhesive layer is provided on the second surface of the support body. The first adhesive layer and the second adhesive layer have the same adhesive strength.02-12-2009
20110126973Apparatus And Method For Manufacturing A Honeycomb Article - An apparatus and method for manufacturing a honeycomb article with an after-applied skin, where the edges of the after-applied skin are relieved with respect to the ends of the honeycomb article.06-02-2011
20120031551METHOD FOR TRANSFER PRINTING NANOWIRES - A method for transfer printing nanowires, includes the following steps. First, a first substrate having nanowires formed thereon, is provided. Second, a transfer printing film is provided. The transfer printing film is hydrophobic and is in a soft state. Third, the transfer printing film and the first substrate are combined with the nanowire array in contact with the transfer printing film. Fourth, a roller is applied on the transfer printing film to press the transfer printing film against the first substrate. Fifth, the first substrate is removed, thereby obtaining the nanowires transfer printed on the transfer printing film with the nanowires reoriented along a substantially same direction.02-09-2012
20110030889METHOD FOR TRANSFERRING A THIN LAYER BY PROTON EXCHANGE - A method for transferring a thin layer from a lithium-based first substrate includes proton exchange between the first substrate and a first electrolyte, which is an acid, through a free face of the first substrate so as to replace lithium ions of the first substrate by protons, in a proportion between 10% and 80%, over a first depth e02-10-2011
20110030888METHOD FOR MANUFACTURING A MICROFLUIDIC SENSOR - A method to manufacture microfluidic sensors, typically including componentizing substrate layers One such method includes providing a plurality of layers of material configured to permit their stacking to form at least a first cap layer, a first channel layer, an interrogation layer, and a second channel layer During assembly, ribbon sections of substrate layers are sandwiched to cooperatively align elements through-the-thickness of the sandwich Individual sensors are then removed from the sandwich ribbon A componentizing step includes forming one or more elements for successive sensors spaced along the axial length of a ribbon Certain elements include electrically conductive patterned structures preferably printed onto a substrate using conductive ink and a printing process, sometimes placing material in operable position to conduct electricity through the thickness of at least one nbbon Other elements may include channels, tunnels, and vias that can be machined, stamped, or cut into a ribbon section.02-10-2011
20090288762METHOD FOR THE CONTINUOUS LAYING OF A CONDUCTOR ON A PRINTED CIRCUIT BOARD AND DEVICE FOR CARRYING OUT SAID METHOD - The invention relates to a method for welding a conductor to a conductive film, which is preferably intended for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.11-26-2009
20100243145BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.09-30-2010
20100012263CURABLE COMPOSITION AND METHOD FOR TEMPORAL FIXATION OF STRUCTURAL MEMBER USING THE SAME - To provide a method for temporarily fixing an optical member for processing, and a curable composition useful for such a method.01-21-2010
20100038023Pressure Sensitive Adhesive Composition for Transporting Flexible Substrate - Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same.02-18-2010
20090038750HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS - New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.02-12-2009
20110100543MANUFACTURING METHOD OF CIRCUIT STRUCTURE - A manufacturing method of circuit structure is described as follows. Firstly, a composite dielectric layer, a circuit board and an insulating layer disposed therebetween are provided. The composite dielectric layer includes a non-platable dielectric layer and a platable dielectric layer between the non-platable dielectric layer and the insulating layer wherein the non-platable dielectric layer includes a chemical non-platable material and the platable dielectric layer includes a chemical platable material. Then, the composite dielectric layer, the circuit board and the insulating layer are compressed. Subsequently, a through hole passing through the composite dielectric layer and the insulating layer is formed and a conductive via connecting a circuit layer of the circuit board is formed therein. Then, a trench pattern passing through the non-platable dielectric layer is formed on the composite dielectric layer. Subsequently, a chemical plating process is performed to form a conductive pattern in the trench pattern.05-05-2011
20110061801MANUFACTURING SYSTEM OF OPTICAL DISPLAY DEVICE AND MANUFACTURING METHOD OF OPTICAL DISPLAY DEVICE - A manufacturing system of an optical display device in which the following can be attained in the case of bonding optical members to optical display units, respectively: an optical member to be excluded, which is, for example, an optical member judged as a defective member, can be appropriately excluded so that the optical member is not bonded onto any optical display unit and a manufacturing method of an optical display device. The manufacturing system includes a cutting device 03-17-2011
20110061800ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.03-17-2011
20110017390Method and Article - A method of making an article 01-27-2011
20100276077Mesoscale and Microscale Device Fabrication Methods Using Split Structures and Alignment Elements - Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.11-04-2010
20100276076METHOD AND DEVICE FOR PRODUCING REGISTERED HOLOGRAPHIC MICROSTRUCTURE REFRACTIVE AND REFLECTIVE EFFECTS - An apparatus and method for preparing a flexible substrate with uniformly spaced images and corresponding physical or virtual registration marks at regular intervals, applying an energy curable coating to the flexible substrate either uniformly or in selected spots, and providing a master web carrying uniformly spaced impressing images and corresponding registration marks at regular intervals, where accurate alignment of the registration marks of the flexible substrate and the master web is achieved by stretching the master web to align the registration marks. One embodiment of the apparatus comprises scanners which sense the location of the registration marks on the flexible substrate and the master web; an electronic register control system programmed to monitor error signals representing the on-the-fly deviation in the alignment of the master and flexible substrate registration marks and makes determinations of the amount of stretching that must be applied to the master web in order to bring the registration marks into alignment; and means for achieving the appropriate stretching of the master web to produce the desired alignment.11-04-2010
20110146899SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE - A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.06-23-2011
20100276078METHOD AND SYSTEM FOR MANUFACTURING OPTICAL DISPLAY DEVICE - It is provided that a method and a system for manufacturing an optical display device, which make it possible to bond an optical member and an optical display unit together with a certain degree of cleanliness maintained. The method for manufacturing an optical display device including an optical display unit (W) and an optical member (11-04-2010
20110253300METHOD FOR MAKING TRANSMISSION ELECTRON MICROSCOPE MICRO-GRID - A method for making a TEM micro-grid is provided. The method includes the following steps. A carrier, a carbon nanotube structure, and a protector are provided. The carrier defines a first through opening. The protector defines a second through opening. The protector, the carbon nanotube structure and the carrier are stacked such that the carbon nanotube structure is located between the carrier and the protector. The second through opening at least partly overlaps with the first through opening. The carrier and the protector are welded with each other.10-20-2011
20120199281METHOD FOR MANUFACTURING A MULTI-AXIAL LAMINATE OF WEBS PRODUCED FROM CABLES BROKEN INTO STRIPS, AND MANUFACTURING FACILITY - A method of manufacturing a multi-axial laminate of webs produced from cables stretch broken into strips includes arranging, at an entry of a conveyor table, a first layer of pre-wound pre-cut strips along the longitudinal axis of the table, the strips being partially superimposed; arranging along the table at least two cross lappers transferring and depositing in an oblique and/or divergent position at predetermined angles a stretch broken strip; and arranging the strips in successive superimpositions on the first layer of pre-cut strips in different planes, to form a multi-axial web of stretch broken strips. The web then being treated by a fixing device. Movement of the support belt of the table taking place in steps to ensure the superimposition of the different layers of pre-broken strips deposited by the cross lappers. Implementation of the method taking place without any prior cohesion treatment of each strip.08-09-2012
20120199280Probe Cards Including Nanotube Probes and Methods of Fabricating - Methods of fabricating a plurality of carbon nanotube-bundle probes on a substrate are disclosed. In some embodiments, the method includes the following: providing a substrate having a top surface and a bottom surface; forming an array of electrically conductive pads on the top surface, the array of electrically conductive pads being formed to minor an array of pads on an integrated circuit that is to be tested; applying a catalyst for promoting growth of carbon nanotubes on each of the array of electrically conductive pads; heating the substrate in a carbon-rich environment thereby growing nanotubes extending upwardly from each of the array of electrically conductive pads and above the top surface of the substrate thereby forming a plurality of carbon nanotube-bundle probes extending upwardly above the top surface of the substrate; and capping each of the plurality of carbon nanotube-bundle probes with an electrically conductive material.08-09-2012
20110162790SHEET PEELING APPARATUS AND PEELING METHOD - A sheet peeling apparatus 07-07-2011
20110253301Stretch Releasable Adhesive Tape - Adhesive tapes, articles containing the adhesive tapes, methods of making the adhesive tapes, and uses of the adhesive tapes are described. The adhesive tape is stretch releasable and can be used to couple two substrates together. The adhesive tape can be removed easily to separate the two substrates for any reason. The adhesive tape includes a backing layer and at least one pressure-sensitive adhesive layer adjacent to the backing layer. The backing layer contains a first acrylic copolymer. Each pressure-sensitive adhesive layer contains a second acrylic copolymer plus inorganic particles that are dispersed or suspended in the second acrylic copolymer.10-20-2011
20100294423PROTECTIVE FILM FOR LASER PROCESSING AND PROCESSING METHOD USING THE SAME - Disclosed is a protective film for laser processing, which has high adhesiveness and is capable of protecting an object to be processed with a uniform thickness, while being prevented from carbonization/adhesion due to thickness variations. In addition, this protective film for laser processing is free from the problem of waste water contamination when it is removed. Also disclosed is a laser processing method using such a protective film. Specifically disclosed is a protective film for laser processing, which contains a (meth)acrylate copolymer and a radiation-polymerizable (meth)acrylate having an unsaturated bond.11-25-2010
20110011527WRAPPING AN OBJECT WITH A FILM USING A TAPE FOR CUTTING THE FILM - A vehicle is wrapped by a printed adhesive film where the film is also applied over doors and other areas intended not to be covered. The film is cut at the door edge and over the area by adhesively attaching a tape having a release coating on the front surface and carrying a filament along a center of the front side. The printed film is applied over the door, the area not to be covered and the tapes and is cut along the door edge and around the area by pulling the filament from the tape so that a strip of the film at the door edge and the film over the area can be removed. The film can be stretched and pulled away from the tape for reapplying for proper fit.01-20-2011
20100181019WAFER TABLE, SURFACE PROTECTIVE FILM PEELING APPARATUS AND SURFACE PROTECTIVE FILM PEELING METHOD - The wafer table (07-22-2010
20080257486MULTILAYER THERMO-REVERSIBLE DRY ADHESIVES - One embodiment includes a multilayer thermo-reversible dry adhesive system comprising of at least one layer of soft dry adhesive and one layer of shape memory polymer.10-23-2008
20090308527Method For Fabricating Circuit Trace On Core Board Having Buried Hole - A method for fabricating a circuit trace on a core board having a buried hole is provided. The method includes: providing a carrier plate having a detachable metal layer, an etching barrier layer, and a metal layer sequentially stacked thereon; roughening the metal layer which can be completely roughened; laminating the bonded metal layer, the etching barrier layer, the detachable metal layer and the carrier plate onto a dielectric, wherein the metal layer faces and contacts with the dielectric; and then removing the carrier plate therefrom. As such, even if the dielectric is difficult to be completely roughened, the roughened metal layer can enhance the bondability between the metal layer and the dielectric. The metal layer is processed to become the circuit trace later.12-17-2009
20110146898METHOD OF MANUFACTURING ABSORPTIVE ARTICLE AND DEVICE FOR MANUFACTURING ABSORPTIVE ARTICLE - A method of manufacturing an absorptive article has a step of arranging latch members in a region forming each flap of a succession of flaps composing a flap continuum, the latch members being arranged so as to be located on opposite sides of a centerline, which extends in a CD-direction of a flap line, of the region and being engageable with predetermined regions; a step of forming a cut line along the centerline; a step of joining together a rear waistline member continuum composed of a succession of rear waist members and the flap continuum composed of the succession of flaps, the continuum being joined together such that the centerlines are perpendicular to a MD-direction of a body line; and a step of breaking the cut line on the body line.06-23-2011
20100252185REMOVABLE PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PROCESSING ADHEREND USING THE SAME - The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer.10-07-2010
20110132532METHOD AND APPARATUS FOR PRODUCING COMBINED OPTICAL FILM, COMBINED OPTICAL FILM, IMAGE DISPLAY, AND METHODS FOR PRODUCING LIQUID CRYSTAL PANEL AND LAMINATED OPTICAL FILM - It is an object of the invention to provide a method for producing a combined optical film that includes opposing the end faces of a plurality of optical films to one another and can narrow the gap between the opposed end faces. A method for producing a combined optical film comprising a plurality of optical films each having at least one end face at which the optical films are opposed to one another, comprising the steps of: (06-09-2011
20090173435Method and device for the production of photopolymerisable cylindrical jointless flexographic printing elements - Processes comprising providing a layer composite comprising a layer of photopolymerizable material and a removable substrate film disposed on one side of the layer of photopolymerizable material, wherein the photopolymerizable material comprises an elastomeric binder, an ethylenically unsaturated monomer and a photoinitiator; and (a) miter-cutting two edges of the layer composite to be joined, to form two miter-cut ends; (b) providing a hollow cylinder on a rotatably mounted support cylinder, wherein the hollow cylinder has an outer surface and is in a temporarily locked position relative to the support cylinder; (c) applying an adhesion-promoting layer to the outer surface of the hollow cylinder; (d) applying the layer composite to the hollow cylinder bearing the adhesive-promoting layer, wherein the layer composite is disposed on the hollow cylinder such that the removable substrate film faces away from the hollow cylinder and the two miter-cut ends lie substantially one on top of the other, but not overlapping; (e) removing the substrate film from the layer of photopolymerizable material to provide an exposed surface of the layer of photopolymerizable material; (f) contacting the exposed surface of the layer of photopolymerizable material with a rotating calender roll with heating to join the two miter-cut edges and form a processed hollow cylinder, wherein heating comprises a locally-acting heat source moved in an axial direction relative to the hollow cylinder along the entire width of the layer of photopolymerizable material such that the exposed surface is heated; and (g) removing the processed hollow cylinder from the support cylinder.07-09-2009
20120037304RETAIL SHELF EDGE LABEL MEDIA SHEET - A multi-layer construct is provided for simultaneously displaying old and new product information. The construct includes a liner that has removable and permanent portions. A removable adhesive is an ultraviolet-resistant adhesive that is applied to a front surface of the first portion of the liner and a permanent adhesive is applied to a front surface of the second portion of the liner. A transparent film is secured to the removable adhesive and a printable label is secured to the permanent adhesive. The first portion of the liner can be separated from remainder of the construct so that the transparent film can be applied removably over the old product information. The new product information can be printed on the printable label.02-16-2012
20110067807Method of forming polymer dispersed liquid crystal layer including dichroic dye - Example embodiments relate to a method of forming a polymer dispersed liquid crystal (PDLC) layer including a dichroic dye. A first PDLC layer including the dichroic dye and a second PDLC layer having no dichroic dye may be bonded to each other so as to form the desired PDLC layer.03-24-2011
20110155311LAMINATED PAPER FOR XEROGRAPHY TO REDUCE COST AND RECYCLING WASTE - An imageable medium includes a reusable substrate and a removable surface layer semi-permanently bonded to a major surface of the substrate, the reusable substrate comprising an opaque backing to the removable surface layer and the removable surface layer comprising an imageable surface. A use indicator can be incorporated into the imageable medium, and correspond to at least one of the reusable substrate and removable surface layer. The use indicator can be an RFID chip. A method of imaging includes preparing an imageable medium by semi-permanently bonding an imageable layer to a reusable substrate, the reusable substrate providing an opaque backing to the imageable layer; imaging the imageable layer of the imageable medium; removing an imaged layer upon completion of use of the imaged medium; and repeatedly imaging a revealed imageable layer and removing the imaged layer.06-30-2011
20120205039METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method for manufacturing a reliable multilayer wiring substrate at a relatively low cost having little or no warpage or distortion is provided. In certain embodiments an insulation core made of an insulation material that is more rigid than that of resin insulation layers is prepared. A through hole is formed through core upper and lower surfaces of the insulation core, and a through hole conductor is formed therein. A plate-like substrate is prepared, and resin insulation layers and at least one conductor layer are laminated on the substrate to form a first buildup layer. The insulation core is laminated on the first buildup layer so as to electrically connect the conductor layer and the through hole conductor. Resin insulation layers and at least one conductor layer are then laminated on the insulation core. Lastly, the substrate is separated from the first buildup layer to yield a multilayer wiring substrate.08-16-2012
20120111492Disposable Bond Gap Control Structures - In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.05-10-2012
20120043015METHOD AND APPARATUS FOR PROTECTING AN ELECTRONIC DEVICE - A method and apparatus for protecting an electronic device is disclosed and described. The apparatus can include a protective film having an adhesive disposed thereon. The protective film can be applied to the electronic device and secured with the adhesive. The adhesive can permit removing and repositioning of the protective film on the electronic device without leaving an adhesive residue on the device. Both the protective film and adhesive can be optically clear to allow visibility through the protective film to the underlying electronic device. When removed and/or repositioned on the electronic device, the protective film and adhesive can maintain optical clarity. Furthermore, the protective film can be removable from the electronic device without deforming, which can serve to maintain optical clarity.02-23-2012
20120012246ENCAPSULATION METHOD OF ENVIRONMENTALLY SENSITIVE ELECTRONIC ELEMENT - An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.01-19-2012
20120055625PROCESS FOR MAKING LIGHTWEIGHT LAMINATED PANEL MATERIAL FOR CONSTRUCTION OF CARGO CONTAINERS - A process for making a lightweight laminated panel material for construction of cargo containers includes providing a high performance fabric layer, placing film adhesive layers over both sides of the high performance fabric layer, placing protective surface film layers over the film adhesive layers to form a pre-lamination stack, and placing release layers over the protective surface film layers. The pre-lamination stack is heated, compressed, and maintained at the temperature and under pressure to form a lamination stack. The lamination stack is cooled to an intermediate temperature and released from pressure, cooled further, and the release layers are removed.03-08-2012
20120111494Pressure-sensitive adhesive and detachable strip formed from it - Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.05-10-2012
20120111493METHOD FOR APPLYING OPTICAL FILTER STRUCTURES ONTO A CARRIER SUBSTRATE - A method by which optical filter structures may be applied onto a substrate that is transparent to light at least in the visible wavelength range suitable for a barrier filter.05-10-2012
20120111490WET LAMINATION PROCESS FOR REDUCING MUD CRACKING IN FUEL CELL COMPONENTS - Methods of making a substantially crack-free electrode layer are described. The methods include depositing an electrode ink on a substrate; placing a solid polymer film on a surface of the wet electrode ink; drying the electrode ink; and removing the solid polymer film from the surface of the dry electrode ink to form the substantially crack-free electrode layer on the substrate.05-10-2012
20110094667Method for producing strip laminates - The invention relates to a method for producing a strip laminate comprising a strip carrier material (04-28-2011
20110061799Miniaturized Lens Assembly and Method for Making the Same - A miniaturized lens assembly includes an image-capturing unit, a lens unit, and a binding layer. The image-capturing unit includes an image-capturing member. The lens unit includes an image-projecting portion for projecting an image along an optical axis to the image-capturing member. The binding layer extends around the optical axis, and binds the image-capturing unit to the lens unit. The binding layer includes a photosensitive polymeric material and spaces apart the lens unit and the image-capturing unit. A method for making the miniaturized lens assembly is also disclosed.03-17-2011
20120211151DEVICE FOR FASTENING AND DETACHING A COMPONENT, AND METHOD THEREFOR08-23-2012
20120111491CURVED TOUCH SENSOR - A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.05-10-2012
20110067808PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET - To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend.03-24-2011
20090133820SEPARATING METHOD OF BONDED BODY - A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.05-28-2009
20090133819DEFORMATION MODERATION METHOD - A method of transferring a layer of a first material onto a second substrate of a second material includes, 05-28-2009
20120118495SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.05-17-2012
20120125529Fabricating Method of Flexible Display - A fabricating method of a flexible display device includes forming first and second jig substrates that have a first groove and a second groove formed in a lower part of an edge of the first groove; spreading an adhesive over the second groove; fixing first and second flexible substrates to the first groove and the adhesive; fabricating an upper array substrate on the first flexible substrate and a lower array substrate on the second flexible substrate; bonding the upper array substrate to the lower array substrate and injecting a liquid crystal; and peeling the first and second flexible substrates from the first and second jig substrates.05-24-2012
20100206471PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD - A production method of a multi-layer printed wiring board containing the following steps (1)-(5): 08-19-2010
20100206472PEELING PROCESS FOR MAKING RESILIENT PAD COMPOSITE - The present application discloses a composite pad structure that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure.08-19-2010
20120132352OPTO-ELECTRICAL HYBRID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - An opto-electrical hybrid wiring board is formed with a flexible wiring board; a first rigid wiring board and second rigid wiring board connected to each other by the flexible wiring board; a light-emitting element and a light-receiving element, one of which is arranged on the first rigid wiring board and the other on the second rigid wiring board; and a flexible optical waveguide for optically connecting the light-emitting element and the light-receiving element. One end of the flexible wiring board is inserted in and supported by the first rigid wiring board, and the other end is inserted in and supported by the second rigid wiring board; the rigid wiring boards and flexible wiring board are electrically connected to each other by using vias to connect the wiring of the first and second rigid wiring boards and the wiring of the flexible wiring board at the inserted portions.05-31-2012
20120160405METHOD FOR PRODUCING ORGANIC EL DEVICE AND SUBSTRATE FOR PRODUCING ORGANIC EL DEVICE - A method for producing an organic EL device includes the steps of: preparing an adhesive sheet on which a resin substrate is laminated; allowing the resin substrate to adhere onto a hard substrate with the adhesive sheet interposed therebetween; forming an organic EL element on the resin substrate, thereby producing an organic EL device including the resin substrate and the organic EL element; and peeling the organic EL device from the hard substrate. The adhesive sheet includes a first adhesive layer for being bonded to the hard substrate, and a second adhesive layer formed on the first adhesive layer and bonded to the resin substrate. The adhesive strength of the first adhesive layer is different from the adhesive strength of the second adhesive layer.06-28-2012
20120160404METHOD OF APPLYING A DECORATIVE FILM TO A SUPPORT AND METHODS OF PREPARING ARTICLES FOR SAID PURPOSE - A method for preparing a decorative film and a method for applying the decorative film to a support. The method includes: (a) obtaining a first support that can receive a material to be painted having limited adhesion strength; (b) applying the material to be painted such as to form a film; (c) drying the film; (d) applying a water-deactivatable adhesive to the film; (e) applying a second partially-absorbent, deformable support against the film such that it is contact with same; (f) peeling the assembly formed by the second support and the film affixed thereto; (g) applying another adhesive to a definitive support and/or the free face of the film; (h) applying the second film-equipped support against the definitive support; and (i) peeling the temporary second support such as to leave the film on the definitive support, the first adhesive being sufficiently weak for same.06-28-2012
20110180205CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities.07-28-2011
20110180204APPARATUS AND METHOD FOR APPLYING A LABEL TO AN OBJECT - Apparatus and method for applying a label to an object. The apparatus includes a label assembly retaining device, a first object alignment element, and a second object alignment element movable with respect to the first object alignment element. The object alignment elements are movable to size the apparatus to the object, and desirably to form a chute through which the object can be lowered or dropped onto exposed adhesive of the label below.07-28-2011
20110180203Laser induced thermal imaging apparatus and method of manufacturing organic light emitting display device using the same - A laser induced thermal imaging (LITI) apparatus includes a stage configured to support an acceptor substrate and a supporting portion configured to support a donor film and to move the donor film up and down relative to the stage so as to adjust a distance between the acceptor substrate and the donor film. The donor film includes a thin film to be disposed on the acceptor substrate. The stage includes a discharging outlet through which gas between the acceptor substrate and the donor film is discharged to the outside. The LITI apparatus may be used to laminate a film on an acceptor substrate including an organic light emitting display device.07-28-2011
20120312464METHOD FOR MAKING PATTERNED CONDUCTIVE ELEMENT - A method for making a patterned conductive element includes following steps. A substrate is provided. A patterned adhesive layer is applied on a surface of the substrate. A carbon nanotube layer is placed on a surface of the patterned adhesive layer. The patterned adhesive layer is solidified to obtain a fixed part of the carbon nanotube layer and a non-fixed part of carbon nanotube layer. The non-fixed part of carbon nanotube layer is removed.12-13-2012
20080289750Curable Resin Composition, Surface Protection Method, Temporary Fixation Method, and Separation Method - To provide an environmentally-friendly curable resin composition for surface protection, having a high adhesive strength and being capable of forming a protective film which will readily be removed in the film form without adhesive residue in water on a member to be processed, a photocurable adhesive using it, a method for temporarily fixing a member, and a method for removing a protective film.11-27-2008
20100051189Method of manufacturing wiring board - Provided is a method of manufacturing a wiring board, in which; a composite adhesive sheet 03-04-2010
20120073741ADHESIVE COMPOSITION - An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).03-29-2012
20120073740Method for Making an Electrowetting Device - A method for making an electrowetting device includes: (a) forming a surrounding wall on an upper surface of a substrate to surround a microchamber, the surrounding wall having an inner surface surrounding the microchamber and a top surface above the inner surface, the upper surface of the substrate being non-hydrophobic; (b) coating the surrounding wall and the upper surface of the substrate with a hydrophobic coating material; (c) removing a portion of the hydrophobic coating material formed on the top surface of the surrounding wall, thereby exposing the top surface of the surrounding wall; and (d) disposing a liquid into the microchamber.03-29-2012
20120255674Clamping tape for furniture and related repairs - A silicone tape having inherent elasticity and flexibility to allow for its significant stretching, which when unrolled from its tape roll, and its laminar film removed, can be stretched around the furniture or other componentry to hold it in position until any applied adhesive hardens, during furniture repair or manufacture.10-11-2012
20120261064THERMALLY REVERSIBLE CROSSLINKED POLYMER MODIFIED PARTICLES AND METHODS FOR MAKING THE SAME - Thermal insulating materials and methods of making the thermal insulating material generally include a plurality of thermally reversible crosslinked polymer modified particles. The thermally reversible crosslinked polymer modified particles include a polymer containing a plurality of a first functional group; and a modified particle having a plurality of pendent cross-linking agents containing a second functional group, wherein the first functional group and the second functional group are complementary reactants to a reversible cross-linking reaction.10-18-2012
20130180651METHOD OF MANUFACTURING A PACKAGE SUBSTRATE - A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.07-18-2013
20080302473METHOD OF IMAGE TRANSFER ON A COLORED BASE - The present invention includes an image transfer sheet. The image transfer sheet comprises a release layer and a polymer layer. One or more of the release layer and the polymer layer comprise titanium oxide or other white pigment.12-11-2008
20110214806INGOT FORMED FROM BASIC INGOTS, WAFER MADE FROM SAID INGOT AND ASSOCIATED METHOD - A method for manufacturing a heterostructure for use in applications in the electronics, optical and optoelectronics fields, by implanting atomic species inside a first substrate called “donor” substrate, so as to form an embrittlement area therein, assembling a second substrate, called “recipient” substrate, on the donor substrate, detaching the rear portion of the donor substrate along the embrittlement area, so as to customize a thin layer of interest on the recipient substrate, wherein the donor substrate is an ingot or an ingot section formed from at least two basic ingots assembled together along two of their respective complementary longitudinal surfaces.09-08-2011
20120318447METHOD OF MANUFACTURING DISPLAY UNIT - A laminated structure formed by placing a cover substrate over a device substrate with a projection structure in between in the vacuum atmosphere. Next, the laminated structure is taken out into the air in a state that a space between the device substrate and the cover substrate is maintained in the vacuum atmosphere. Subsequently, the portion of the organic layer formed on the conductive electrode is removed by irradiating laser light to the laminated structure. Since the space between the device substrate and the cover substrate is maintained in the vacuum atmosphere, even if the laser light is emitted to the laminated structure taken out into the air, the laser light is emitted to the portion of the organic layer formed on the conductive electrode in the vacuum atmosphere.12-20-2012
20120298293LABEL ASSEMBLY AND METHOD OF USING THE SAME TO LABEL ARTICLES DURABLY YET REMOVABLY - A label assembly and method of using the same to label articles durably, yet removably. In one embodiment, the method includes providing an image removing laminate. The image removing laminate includes (i) a remover support, and (ii) a remover layer secured to the remover support, the remover layer, upon being activated by at least one of heat and light, being bondable to an ink image on a garment in such a way that the bonding between the remover layer and the ink image is stronger than the bonding between the ink image and the garment. The method then includes bonding the remover layer of the image removing laminate to the ink image on the garment and, then, detaching the ink image from the garment by separating the image removing laminate away from the garment.11-29-2012
20120298292Aircraft Grounding System - Liquid dispensing assemblies including adhesive anchoring assemblies configured to adhere to a support surface external to a device such as a vehicle. An air vehicle includes (a) a fluid adhesive container assembly detachably attached to the air vehicle, wherein the fluid adhesive container assembly comprises: (i) an adhesive container comprising fluid adhesive; and (ii) one or more fibers, wherein the one or more fibers are configured, or a brush of fibers, or a fabric of fibers, is configured to conduct the fluid adhesive and to structurally support an adhesive bond between the one or more fibers and a surface; and (b) means for dispensing the fluid adhesive from the fluid adhesive container, to the one or more fibers.11-29-2012
20120080144MULTI-LAYER INTUMESCENT FIRE PROTECTION BARRIER WITH ADHESIVE SURFACE - An intumescent fire protection barrier in the form of an adhesive sheet or continuous roll of tape. The barrier comprises laminated layers of an intumescent material, a reinforcing matrix, a pressure sensitive adhesive and a release liner. The intumescent material is adhesively applied to a structural steel substrate and expands by at least 10 times its original thickness during a fire to provide fire protection to the substrate. Multiple layers of the fire protection barrier may be installed on top of one another. This application method dramatically reduces installation time as compared with sprayed on fire protection coatings.04-05-2012
20120325401HEAT TRANSFER METHODS AND SHEETS FOR APPLYING AN IMAGE TO A SUBSTRATE - Methods are generally provided of transferring an image to a substrate using a colorless fusible polymer material printed onto a printable surface of a printable transfer sheet to form an imaged area. The printable transfer sheet can be positioned adjacent to a coating transfer sheet such that the imaged area is adjacent to a meltable coating layer of the coating transfer sheet. The meltable coating layer and the imaged area can then be fused together, and the sheets separated to form an intermediate coated imaged sheet, such that the imaged area is coated with the meltable coating layer. The intermediate coated imaged sheet can be positioned adjacent to the substrate such that the imaged area coated with the meltable coating layer is adjacent to substrate, and heat and pressure can be applied. The intermediate coated imaged sheet can be separated from the substrate to leave the imaged area on the substrate.12-27-2012
20130014888MASTERLESS LAYUP MANDREL TOOL - A mandrel tool for layup of composite material comprises a composite face sheet for providing a layup surface for the composite material, and a cellular header board structure for supporting the face sheet.01-17-2013
20130008593ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2): 01-10-2013
20130008592ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): 01-10-2013
20130020021ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3):01-24-2013
20130020020Adhering Jig and Adhering Method for Screen Protector Plastic Sheet - An adhering jig and an adhering method for screen protector plastic sheets are provided for encapsulating and packing, by means of the adhering jig capable of safe coverage, screen protector plastic sheets intended to protect the surfaces of panel cell phones against scratches inflicted by foreign bodies, in the course of delivery or sales after being manufactured by a manufacturer, so as to preclude contact with and prevent dents, bends, or damage from occurring to the screen protector plastic sheets and covering the surfaces of the panel cell phones with the screen protector plastic sheets by means of the packing-oriented adhering jig to achieve precise smoothness and flawless attachment.01-24-2013
20130133822COMPONENT PLACEMENT ON FLEXIBLE AND/OR STRETCHABLE SUBSTRATES - According to one aspect, the invention provides a method of placement of a component on a stretchable substrate, comprising the steps of providing a base substrate having a stretchable substrate layer, providing a flexible foil comprising an integral arrangement (05-30-2013
20080251192Method for manufacturing pyrolytic boron nitride composite substrate - Wettability of a PBN material surface with respect to a metal is improved to expand use applications. Hydrogen ions are implanted into a surface of a silicon substrate 10-16-2008
20130139961DUAL-SKIN STRUCTURES - A dual-skin structure (06-06-2013
20130174976MASKING MATERIAL, METHOD FOR PRODUCING MASKING MATERIAL, AND MASKING METHOD - A masking material for use in a heating process includes: a base material comprising a resin as a main resin component and containing a magnetic substance, the resin having a higher melting point than a temperature of the heating process, the magnetic substance having a higher Curie temperature than the temperature of the heating process; and a releasable protective layer formed on one surface of the base material, the releasable protective layer comprising a releasable protective material. The masking material has excellent heat resistance property and can be repeatedly used.07-11-2013
20130168012METHOD FOR MAKING LITHIUM ION BATTERY ELECTRODE - A method for making a lithium ion battery electrode is provided. An electrode material layer including a plurality of electrode active material particles is provided. The electrode material layer includes a surface. A carbon nanotube layer is formed on the surface of the electrode material layer. The carbon nanotube layer consists of carbon nanotubes07-04-2013
20130168013METHOD FOR MAKING THIN FILM LITHIUM ION BATTERY - A method for making a thin film lithium ion battery is provided. A cathode material layer and an anode material layer are provided. A first carbon nanotube layer is formed on a surface of the cathode material layer to obtain a cathode electrode. A second carbon nanotube layer is formed on a surface of the anode material layer to obtain an anode electrode. A solid electrolyte layer is applied between the cathode electrode and the anode electrode to form a battery cell. At least one battery cell is then encapsulated in an external encapsulating shell.07-04-2013
20080216950ADHESIVE WITH DIFFERENTIAL OPTICAL PROPERTIES AND ITS APPLICATION FOR SUBSTRATE PROCESSING - An adhesive adapted with particular optical properties, and its use to couple a substrate to a substrate holder during substrate processing are disclosed. After processing the substrate, the optical properties of the adhesive may be exploited to locate and/or remove adhesive residue that may be present on the substrate.09-11-2008
20080216949Heat-Peelable Double-Faced Pressure-Sensitive Adhesive Sheet, Method Of Processing Adherend, and Electronic Part - A heat-peelable double-faced pressure-sensitive adhesive sheet which comprises a substrate (a), a heat-peelable pressure-sensitive adhesive layer (b) formed on one side of the substrate (a) and containing heat-expandable microspheres, and a pressure-sensitive adhesive layer (c) formed on the other side of the substrate (a), wherein the heat-peelable pressure-sensitive adhesive layer (b) and the substrate (a) are peelable from each other by heating.09-11-2008
20130098542METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE - A method of peeling a protective tape, includes the steps of mounting a wafer on a stage, the wafer having the protective tape adhered thereto so that the protective tape overlaps only a portion of a notch of the wafer, attaching a peeling adhesive tape to the protective tape, projecting a lift pin from the stage so that the portion of the protective tape which overlaps the notch is raised by a top surface of the lift pin, and with the protective tape raised by the lift pin, pulling the peeling adhesive tape so as to peel the protective tape from the wafer. The top surface of the lift pin has a shape that allows the top surface to raise the portion of the protective tape which overlaps the notch.04-25-2013
20110265945METHOD FOR ENHANCING FOOD SAFETY - The present invention relates to adhesive labels for use in food safety labeling systems and methods of using the adhesive labels to enhance food safety and food rotation.11-03-2011
20130118680METHOD FOR FABRICATING A PACKAGING SUBSTRATE - A method for fabricating a packaging substrate includes: stacking two metal layers;05-16-2013
20110214805Epitaxial Lift Off Systems and Methods - Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.09-08-2011
20080202676METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - In one embodiment, an inner layer pattern formation step of patterning a conductor layer of an inner layer base material to form an inner layer circuit pattern of an inner layer circuit pattern portion and a lead pattern of a lead pattern portion, a resin film affixing step of affixing a resin film to the lead pattern portion, an outer layer base material layering step of layering/fastening to the inner layer base material an outer layer adhesive layer disposed corresponding to the inner layer circuit pattern portion and an outer layer conductor layer disposed corresponding to the inner layer base material, an outer layer pattern formation step of patterning the outer layer conductor layer to form an outer layer circuit pattern portion corresponding to the inner layer circuit pattern portion, and a resin film peeling step of peeling away the resin film from the lead pattern portion, are provided.08-28-2008
20130146219Cosmetic Restoration of Stainless Steel Surfaces - A method for cosmetically restoring a stainless steel surface. The stainless steel surface is cleaned and a multi-layered material is applied over the stainless steel surface. The multi-layer material includes a first layer having the appearance of the stainless steel surface, and at least one clear protective layer over the first layer. The first layer has a peel strength of two to four times the peel strength of the clear protective layer and as a result, the clear protective layer is peelable and replaceable while leaving the first layer in place. In one embodiment, the first layer has a peel strength of at least two times the peel strength of the clear protective layer, for example, the first layer may have a peel strength of eleven to fifteen pounds per square inch and the clear protective layer may have a peel strength of four to five pounds per square inch.06-13-2013
20130146220METHOD OF MANUFACTURING WIRING SUBSTRATE - Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate.06-13-2013
20110220277Eliminating Joint Lines In Furniture - A method of manufacturing a furniture body is provided. A release sheet, for example, a silicone rubber sheet, deposited with an uncured artificial stone mix is placed on a surface. A central core comprising, for example, paper honeycomb, is placed on the release sheet deposited with uncured artificial stone mix. Decorative materials, for example, ornamental glass, semiprecious stones, etc. may be included on the release sheet. Pressure may be applied to compact the artificial stone mix deposited with a backing of glass fiber and resin. The central core is wrapped with the release sheet deposited with the uncured artificial stone mix. The release sheet is removed after the deposited artificial stone mix is partially or fully cured over the central core. The wrapping provides a continuous surface of the artificial stone mix over the sides, edges, corners, and curved surfaces of the central core, thereby eliminating joint lines.09-15-2011
20110220275METHOD FOR PRODUCING PIEZOELECTRIC COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING PIEZOELECTRIC ELEMENT - A method for producing a piezoelectric composite substrate with satisfactory productivity controls the inclination of the crystal axis and the polar axis of a single-crystal thin film and prevents an adverse effect due to pyroelectricity in a production process. The method for producing a piezoelectric composite substrate provided with a plurality of piezoelectric materials includes an ion-implantation step, a bonding step, and a separation step. In the ion-implantation step, H09-15-2011
20100288431AN ADHESIVE TAPE - The present invention relates to an adhesive tape, a method of manufacturing thereof and to uses thereof. More specifically, the present invention relates to an adhesive tape that can be used as such in order to join two entities with their respective surfaces together and/or to attach an entity on the surface of a substrate, whilst the peel adhesion is reduced, i.e. the tape can be removed easily, if desired. The adhesive tape comprising: a layer of a thermally shrinkable polymer, said layer having two surfaces opposite each other, a layer of a pressure sensitive adhesive composition on one of said two surfaces, said pressure sensitive adhesive composition comprising an amorphous polymer, thermally expandable particles and/or at least one blocked isocyanate compound.11-18-2010
20100307672Tape Dispenser Apparatus - An apparatus and method for a tape dispenser apparatus includes a first housing and tape rotational hub, a tape aperture feeding into a tape channel for a tape guide, also a cutter aperture disposed within the channel, and a cutter slidably engaged to the first housing, wherein the cutter extends therethrough the cutter aperture in a cutting state and the cutter retracts from the cutter aperture being urged into a retracted state. A roller rotatably attached to the first housing, the roller is positioned adjacent to a non-adhesive side of the tape, wherein the roller routes the strip of tape around the cutter to feed the strip of tape into the tape aperture and tape channel. Operationally the tape channel is positioned adjacent to a surface and the apparatus is pulled to lay the strip of tape upon the surface, wherein the tape is selectively cut by the cutter.12-09-2010
20100307671METAL ORNAMENTATION METHOD - A method of creating jewelry and other metallic objects with hard, durable, colored surfaces decorated with relatively soft precious metal surfaces and shapes.12-09-2010
20130153138METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING REUSE PASTE - A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.06-20-2013
20130153139METHOD FOR PRODUCING SPECTROSCOPIC SENSOR - A method of manufacturing a spectroscopic sensor 06-20-2013
20130153137ADHESIVE FILM AND METHOD OF MAKING A GRAPHIC - The invention relates to an adhesive film comprising a polyvinyl chloride film having opposite first and second major sides. The first major side has an adhesive layer protected by a release liner and a primer layer arranged between the polyvinyl chloride film and the adhesive layer. The primer layer comprises an aminoplast and a polyester and/or a curing product thereof.06-20-2013
20110272089SKI HAVING A MOUNTING AID FOR A BINDING, PROCESS FOR THE MANUFACTURE OF SUCH A SKI, AND CORRESPONDING MOUNTING AID - Ski or similar device for sliding on snow having a mounting aid for a binding (11-10-2011
20110272087METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - Upon arranging a base portion and first and second silicon carbide layers such that each of a first backside surface of the first silicon carbide layer and a second backside surface of the second silicon carbide layer faces a first main surface of the base portion, at least one of the first and second silicon carbide layers is partially projected as a projection to outside the first main surface when viewed in a planar view. Each of the first and second backside surfaces and the first main surface are connected to each other by heating. This heating carbonizes at least a part of the projection, thereby forming a carbonized portion. When removing the projection, the carbonized portion is processed. In this way, the planar shape of a silicon carbide substrate can be readily adjusted.11-10-2011
20130126079ACRYLATE BASED ADHESIVE COMPOSITION FOR OPTICAL USE, ACRYLATE BASED ADHESIVE SHEET FOR OPTICAL USE, AND METHOD FOR SEPARATING OPTICAL COMPONENT USING THE SAME - Disclosed is an acrylate based adhesive composition for optical use that includes: a copolymer prepared by polymerizing an alkyl(meth)acrylate (wherein the alkyl is a C16 to C22 linear alkyl group) in an amount of about 1 to about 10 parts by weight, an alkyl(meth)acrylate (wherein the alkyl is a C1 to C12 alkyl group) in an amount of about 70 to about 98 parts by weight, and a polar monomer in an amount of about 1 to about 20 parts by weight; and a cross-linking agent. The cross-linking agent is included in an amount of about 0.5 to 5 parts by weight based on 100 parts by weight of the copolymer.05-23-2013
20110308715METHOD FOR PRODUCING LIQUID-EJECTING HEAD - Provided is a method for producing a liquid-ejecting head at reduced production costs with a lower possibility of a continuity failure between leads and a wiring substrate. A through-hole into which a chip-on-film (COF) substrate is to be inserted is closed off by a lid before a protective film is formed by chemical vapor deposition (CVD). The lid prevents the source gas used for CVD from intruding into the through-hole to avoid formation of the protective film on leads extended into the through-hole. This reduces the possibility of a continuity failure between the leads and the COF substrate, thus providing a method for producing an ink-jet recording head at reduced production costs.12-22-2011
20130192750"MEMBRANE-ELECTRODE ASSEMBLY PRODUCING APPARATUS AND MEMBRANE-ELECTRODE ASSEMBLY PRODUCING METHOD" - A membrane-electrode assembly producing apparatus and membrane-electrode assembly producing method are provided which can increase the bonding strength between a polymer electrolyte film and a catalyst layer and which can produce a high-quality membrane-electrode assembly without a formation of wrinkle through a hot roll technique. An apparatus includes pre-heating unit for pre-heating a catalyst-layer supporting base material 08-01-2013
20120037303METHOD FOR ATTACHING A TEMPORARY MATERIAL TO A PIPING MODULE AND METHOD FOR CONVEYING A PIPING MODULE - To ensure required adhesion even when a pipe of a piping module collides with a temporary material during transport and achieve easier dismantling, the following measure is taken: the temporary material is fixed on a support rack to prevent the piping module placed on the support rack from largely displaced during conveyance and after the conveyance of the piping module, the temporary material is removed from the support rack. In this method, the following measures are taken: at the step of fixing the temporary material to the support rack, the temporary material is bonded to the support rack with the piping module set therein using adhesive; and at the step of removing the temporary material from the support rack after the conveyance of the piping module, the temporary material bonded to the support rack with the adhesive is peeled off from the support rack with heat applied thereto.02-16-2012
20130199712Method of Fabricating an Armor Panel - A fabricating method for an armor panel uses a template to position tiles on an adhesive surface. The template includes an L-shaped frame and cells having precise wall thickness. Tiles are fitted in the cells against the surface. The template is repeatedly repositioned so new tiles can be fitted into unoccupied cells to form a desired tile array. A border is placed around the array, forming a cavity. Resin is poured into the cavity. A back plate placed over the array presses against the resin. Excess resin exits the cavity through an interface between the border and the adhesive surface and through a gap between the back plate and border. After the resin cures the border is removed.08-08-2013
20130199713METHOD FOR PRODUCING A MEDICAL DEVICE - A method for producing a medical device with a lattice structure, connected at least in some areas to a cover. The lattice structure is arranged on a substrate via the side to be connected to the cover, the lattice structure has the side arranged on the substrate pressed at least partially into the substrate, the lattice structure is coated with a first layer of a sacrificial material. At least some of the interstices of the lattice structure are covered by the first layer, and the first layer with the lattice structure on the side to be connected to the cover forms a substantially closed surface, the substrate is removed, making the side of the lattice structure accessible for connection to the cover. A second layer for forming the cover is applied to the side of the lattice structure previously pressed into the substrate, and the sacrificial material is removed.08-08-2013
20130206331EDGE SEPARATION EQUIPMENT AND OPERATING METHOD THEREOF - An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.08-15-2013

Patent applications in class With stripping of adhered lamina

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