Class / Patent application number | Description | Number of patent applications / Date published |
156150000 | With electro-deposition | 72 |
20080230171 | METHOD FOR PRODUCING CATALYST-LAYER-SUPPORTING SUBSTRATE, METHOD FOR PRODUCING MEMBRANE-ELECTRODE ASSEMBLY AND METHOD FOR PRODUCING FUEL CELL - A method for producing a catalyst-layer-supporting substrate includes a lamination step of forming a laminate of metal catalyst layers and mixture layers on a substrate by repeating a first step and a second step plural times alternatively; and an acid treatment step of subjecting the laminate to an acid treatment, wherein the first step is a step of sputtering or depositing the metal catalyst layer that comprises a catalyst, and the second step is a step of sputtering or depositing the mixture layer of carbon and metal, the metal of the mixture layer including at least one element M selected from the group consisting of Sn, Al, Cu and Zn. | 09-25-2008 |
20080257480 | Method for Manufacturing Multilayer Printed Wiring Board and Multilayer Printed Wiring Board Obtained by the Same - The object of the present invention is to provide: a method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method. To achieve this object, a method is employed in which a multilayer printed wiring board with an embedded capacitor circuit is manufactured through: a first-conductive-metal-layer laminating step where a dielectric layer and a first conductive metal layer are provided on both sides of a core material having base electrode circuits; an top-electrode forming step where the first conductive metal layer(s) locating as outer layer(s) is(are) processed into top electrodes and the dielectric layer(s) in the area other than those of circuit portions is(are) exposed; a dielectric-layer removing step where the exposed dielectric layer(s), which is(are) in the area other than those of circuit portions, is(are) removed; a second-conductive-metal laminating step where the gaps among the top electrodes are filled in and an insulating layer and a second conductive metal layer are provided on the top electrodes; and an outer layer circuit forming step where the second conductive metal layer(s) is(are) processed into outer layer circuits. | 10-23-2008 |
20080257481 | Sealing of plastic containers - An ampoule contains a solution, e.g. an inhalation or injectable pharmaceutical, and an outer surface of the ampoule is coated with a metal or metal compound so as to reduce moisture egress from the ampoule and reduce contamination of ampoule contents from external sources. Labels are easily applied to the coating. | 10-23-2008 |
20080302468 | Multilayer printed wiring boards with holes requiring copper wrap plate - Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries. | 12-11-2008 |
20080314506 | Biocompatible Electroplated Interconnection Bonding Method and Electronics Package Suitable for Implantation - The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. The present invention is directed to a device comprising a substrate containing at least one contact, a flexible assembly containing at least one pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together. The present invention is directed to a method of bonding for implantation a substrate to a flexible assembly, said method comprising the steps of: aligning said substrate and said flexible assembly, whereby there is a common alignment for a contact on said substrate and contact pads on said flexible assembly, and electroplating bonding between said contacts and said pads, thereby bonding said flexible assembly to said substrate. | 12-25-2008 |
20090044897 | Method of making a heat-treated coated glass article using a polymer dispersion - A temporary protective coating is provided over a coated glass substrate. The temporary protective coating is preferably applied in an aqueous dispersion then solidified on the substrate. In some instances, the temporary protective coating may be removed by treatment with a basic solution. In certain example embodiments, the temporary protective coating is applied after heat treatment before the coated substrate is coupled to another substrate to form a window unit such as an IG window unit or a laminated vehicle windshield. | 02-19-2009 |
20090050258 | DEVELOPMENT OF PEM FUEL CELL ELECTRODES USING PULSE ELECTRODEPOSITION - In one embodiment of the present disclosure a method for forming a PEM fuel cell electrode is provided. The method includes applying a hydrophilic wetting agent on an electrode surface. A catalyst layer is deposited on the wetted electrode surface by pulse electrodeposition, at least a portion of the catalyst penetrating the electrode surface. The electrode surface is heat treated. | 02-26-2009 |
20090159186 | NANOLAMINATE DEFORMABLE MIRRORS - A deformable mirror formed out of two layers of a nanolaminate foil attached to a stiff substrate is introduced. Deformation is provided by an electrostatic force between two of the layers. The internal stiffness of the structure allows for high-spatial-frequency shapes. The nanolaminate foil of the present invention allows for a high-quality mirror surface. The device achieves high precision in the vertical direction by using foils with accurately controlled thicknesses, but does not require high precision in the lateral dimensions, allowing such mirrors to be fabricated using crude lithography techniques. Such techniques allow structures up to about the meter scale to be fabricated. | 06-25-2009 |
20090294027 | CIRCUIT BOARD PROCESS - A circuit board process is provided. In the circuit board process, a first substrate and a second substrate are stacked to form a cavity for accommodating chips. The top of the cavity is covered by a third metal layer that serves as a mask. The first substrate has a base, a first metal layer, a second metal layer, and at least a first conductive structure passing through the base and electrically connected to the first metal layer and the second metal layer. The first metal layer is patterned to form a first circuit layer having a number of first pads. A third circuit layer having a number of third pads is formed on the second substrate. The first pads and the third pads are not on a same plane for wire bonding. | 12-03-2009 |
20090320990 | Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures - Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions. | 12-31-2009 |
20100006209 | PROCESS FOR PROTECTING POROUS STRUCTURE USING NANOPARTICLES DRIVEN BY ELECTROKINETIC PULSE - A process for protecting a porous structure includes providing a treatment fluid including nanoparticles including a sealant material coated with a metal ion to a face of the porous structure, and applying a sequence of DC voltage pulses to the porous structure in a position so as to drive the nanoparticles on the face of the porous structure into the porous structure. The metal ion coating of the nanoparticle separates from the sealant material within the porous structure to close pores within the porous structure. | 01-14-2010 |
20100018633 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom | 01-28-2010 |
20100018634 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a flex-rigid wiring board including disposing a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate and a non-flexible substrate adjacent to each other, covering a boundary between the flexible board and the non-flexible substrate with an insulating layer comprising an inorganic material, providing a conductor pattern on the insulating layer, forming a via hole opening which passes through the insulating layer and reaches the conductor pattern of the flexible board, and plating the via hole opening to form a via connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer. | 01-28-2010 |
20100024962 | COMPOSITE STAMPER FOR IMPRINT LITHOGRAPHY - A stamper having a patterned layer composed of a hard material and a compressible material back plane layer. The back plane layer may be composed of an elastomer. The stamper may be used to imprint an embossable layer disposed above a substrate for the production of a magnetic recording disk. | 02-04-2010 |
20100071840 | Laminate having chromatic color and metallic luster, and process for producing the same - A chromatic dye such as a heterocyclic, perinone or thioindigo dye is contained in an ABS resin, and this dye-containing resin is mixed/kneaded and then pelletized. The pellets are extrusion-molded to form an uncemented first resin layer, to which an uncemented second resin layer having metallic luster and provided with a metallic film formed by depositing a metal is attached, heated and pressed, whereby the uncemented first and second resin layers are cemented together and the dye present in the uncemented first resin layer is caused to migrate into metallic film or metallic film and the second resin layer to color it to such a degree that a color difference ΔE of not less than 0.8 is produced. Thereby a laminate having chromatic metallic luster on the second resin layer side is obtained. | 03-25-2010 |
20100096071 | METHOD FOR MANUFACTURING HYDROGEN SENSORS USING Pd NANO WIRE - Disclosed is a method for manufacturing a hydrogen sensor using Pd nano-wires. The method includes steps of forming an external electrode pattern on a substrate applying a first resin layer to the substrate and forming a resin layer nano-channel pattern; depositing Pd on the substrate having the nano-channel pattern, by sputtering, and removing the first resin layer to form Pd nano-wires; applying a second resin layer to the substrate having the Pd nano-wires, and forming a resin layer pattern on the external electrode pattern, at opposing ends of the Pd nano-wires, and at predetermined positions between the external electrode pattern and the opposing ends of the Pd nano-wires; and depositing conductive metal on the resin layer pattern and removing the resin layer pattern, thereby electrically connecting the external electrode pattern to the Pd nano-wires. | 04-22-2010 |
20100108241 | MEMBRANE STRUCTURE AND METHOD OF MAKING - A membrane structure is provided. The membrane structure includes a first layer having a plurality of pores; and a second layer disposed on the first layer. The second layer has a plurality of unconnected pores. At least a portion of the plurality of unconnected pores of the second layer is at least partially filled with a filler such that the first layer is substantially free of the filler. At least a portion of the plurality of unconnected pores of the second layer is in fluid communication with at least one of the pores of the first layer. A method of making a membrane structure is provided. The method includes the steps of providing a first layer having a plurality of interconnected pores; disposing a second layer on the first layer, and filling at least a portion of the unconnected pores of the second layer with a filler such that the first layer is substantially free of the filler. Disposing a second layer includes depositing a metal layer on the first layer; and anodizing the metal layer to convert the metal layer into porous oxide layer. | 05-06-2010 |
20100126653 | LITHOGRAPHICALLY DEFINED ADHESION MICROSTRUCTURES - A method for adhering two layers of materials is described. An additional layer of material deposited on one of the layers is used. The additional layer of material is perforated and undercut by etching away one of the layers thereby generating anchor shaped holes. The other layer is then deposited on the additional layer filling the anchor shaped holes therefore, providing adhesion. | 05-27-2010 |
20100154975 | Carbon Nanotube heater - A method of making a linear heater is provided. A carbon nanotube structure having a plurality of micropores is provided. The carbon nanotube structure is fixed on a surface of a linear supporter. At least two electrodes are electrically connected to the carbon nanotube structure. A material is supplied into the carbon nanotube structure to achieve a carbon nanotube composite structure. | 06-24-2010 |
20100170626 | METHOD FOR THE PRODUCTION OF POLYMER-COATED METAL FOILS, AND USE THEREOF - The invention relates to a method for producing polymer-coated metal foils, comprising the following steps:
| 07-08-2010 |
20100186877 | METHOD OF MANUFACTURING STAMPER - According to one embodiment, a method of manufacturing a stamper includes forming a first stamper from a master plate having lands and grooves through electroforming, forming a second stamper, a width of which is G | 07-29-2010 |
20100206463 | FABRICATING PROCESS OF THERMAL ENHANCED SUBSTRATE - A fabricating process of a thermal enhanced substrate is provided for fabricating thermal conduction blocks to increase the heat dissipation area. A metallic substrate having a first surface and a second surface opposite to the first surface is provided. A first shallow trench with a first depth is then formed on the first surface. A second shallow trench with a second depth is formed on the second surface, and a deep trench penetrating the first shallow trench and the second shallow trench is formed, where the metallic substrate is separated into many thermal conduction blocks by the deep trench. At least one metallic layer and at least one insulating material are laminated on the thermal conduction blocks, and the insulating material is filled into the deep trench and covers the thermal conduction blocks. | 08-19-2010 |
20100243133 | LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other. | 09-30-2010 |
20100252176 | METHOD FOR FORMING GATE STRUCTURES - A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described. | 10-07-2010 |
20100282397 | LAMINATED STRUCTURE, DONOR SUBSTRATE, AND METHOD FOR FABRICATING LAMINATED STRUCTURE - A laminated structure includes: a plurality of first electroconductive films each having a prescribed hardness; and a plurality of second electroconductive films each having a hardness that is lower than the prescribed hardness. The first and second electroconductive films are laminated alternately. | 11-11-2010 |
20110048614 | Electrochromic devices, assemblies incorporating electrochromic devices, and/or methods of making the same - Certain example embodiments of this invention relate to electrochromic (EC) devices, assemblies incorporating electrochromic devices, and/or methods of making the same. More particularly, certain example embodiments of this invention relate to improved EC materials, EC device stacks, high-volume manufacturing (HVM) compatible process integration schemes, and/or high-throughput low cost deposition sources, equipment, and factories. | 03-03-2011 |
20110056614 | MANUFACTURING METHOD OF CIRCUIT BOARD - A manufacturing method of a circuit board is disclosed. The manufacturing method of a circuit board in accordance with the present invention includes forming a separation layer on a carrier, stacking an adhesion layer which is coupled to the carrier and covers the separation layer, forming a circuit layer on the adhesion layer, forming a circuit board unit by cutting the separation layer, the adhesion layer and the circuit layer such that the separation layer is separated from the carrier, and forming a stiffener by processing the separation layer of the circuit board unit. The manufacturing method of a circuit board in accordance with the present invention can reduce the cost and time for forming the stiffener by forming the stiffener together in the manufacturing process of the circuit board. | 03-10-2011 |
20110100532 | METHOD FOR MANUFACTURING AN ELECTRODE - Disclosed is a method to manufacture an electrode. The metal oxide of different sizes (or metal oxide secondary particle of similar size) is formed on a transparent substrate by electrophoresis deposition. Subsequently, the metal oxide layer is compressed and dipped in dye to complete an electrode applied in a solar cell. Furthermore, the step of dipping the metal oxide in dye can be earlier than the electrophoresis deposition, thereby reducing the dipping period and dipping temperature. | 05-05-2011 |
20110120626 | METHOD OF PRODUCING ULTRA FINE SURFACING BULK SUBSTRATE - A novel method of producing sub-nanometer grade surface finishing substrates comprises the following steps of: producing a mother substrate which has ultra fine finished surface; a sacrificial layer being employed on a top of this layer being used to facilitate the depletion of finished product with this mother substrate; after finishing the sacrificial layer, a vacuum tool being used to deposit a thin layer on the top of sacrificial layer, wherein this sacrificial layer is remained as a surface of a finished product. To further increase a thickness of the thin layer, vacuum tool or an electroplating method are employed. After reaching a predetermined thickness, the fine surface finishing layer will be bonded with a bulk substrate; bonding of these two objects being done by vacuum bonding with elevated temperature and pressure; and therefore, a fixture is used. | 05-26-2011 |
20110120627 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD, AND METHOD OF MANUFACTURING DISCHARGE PORT MEMBER - There is provided a method of manufacturing a liquid discharge head having a substrate including energy generating elements, and a discharge port member which is provided with discharge ports and is joined to the substrate, thereby forming liquid flow paths communicating with the discharge ports. The method performs in this order: preparing a conductive base on which a first insulating resist and a second insulating resist for forming the discharge ports are stacked in this order; performing plating using the first resist and the second resist as masks, and forming a first plated layer; removing the second resist; performing plating on the base using the first resist as a mask, thereby forming a second plated layer so as to cover the first plated layer; removing the base and the first resist, thereby forming the discharge port member; and joining together the substrate and the discharge port member. | 05-26-2011 |
20110146889 | METHOD FOR MANUFACTURING DISPLAY DEVICE WITH OPTICAL/ELECTRONIC STRUCTURES - A disclosed method for manufacturing a display device with optical/electronic structures according to the present invention comprises: a first step for forming the optical/electronic structures on the primary side of a release film onto which an adhesive is applied, a second step for attaching the primary side of the release film to a substrate or a film, and a third step for removing only the release film from the substrate or film while the optical/electronic structures are attached thereto. According to the invention, the optical/electronic structures are transferred and attached to the substrate or film of the display device after firstly being attached to the release film. Therefore, the optical structure, such as a certain shaped micro lens, color filter, polarizing layer, or ITO layer, with optical characteristics or the electronic structure such as a circuit or electrode pattern like a thin film transistor (TFT) and in-cell phase difference film can be formed on the surface of the substrate or film very easily. That is to say, the optical/electronic structures can be formed very easily on the substrate or film of the display device in a desirable shape with uniform shape and size. In addition, the deterioration of an element of the display device can be prevented as a result of attaching the optical/electronic structures to the display device without directly radiating rays of light such as ultraviolet rays onto the display device. | 06-23-2011 |
20110198018 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD - The invention relates to a method for integrating an electronic component into a printed circuit board, said method comprising the following steps: a layer of a printed circuit board is used to support the electronic component ( | 08-18-2011 |
20110277917 | METHOD FOR DISPOSING A MICROSTRUCTURE - A method of the present invention comprises: preparing the first substrate comprising a surface with a first recess and a second recess of which a bottom comprises a first electrode; immersing the first substrate into a electrolyte solution; inserting a second electrode into the electrolyte solution; injecting a bubble into the electrolyte solution with applying a voltage between the first and the second electrodes to dispose the bubble onto only the first recess; dispersing the first microstructure into the electrolyte solution to dispose it onto the first recess; injecting the bubble into the electrolyte solution to dispose the bubble onto the second recess; and dispersing the second microstructure into the electrolyte solution to dispose it onto the second recess. | 11-17-2011 |
20120061009 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 03-15-2012 |
20120080137 | MANUFACTURING METHOD OF CIRCUIT BOARD - A manufacturing method of a circuit board. First, an electrode mold having a conductive circuit pattern is made, and then a conductive circuit metal layer is formed by means of electroplating on the electrode mold. The conductive circuit metal layer is transferred and joined with the dielectric layer to constitute a basic circuit board. After the conductive circuit metal layer is transferred to the dielectric layer, the electrode mold can be reused for electroplating, so that the conductive circuit metal layer may be formed again for the next basic circuit board. The manufacturing method provided herein may significantly reduce the manufacturing time and raising the product yields of the circuit board, and has the advantages of lower cost and environmental friendly. | 04-05-2012 |
20120175044 | MANUFACTURING METHOD OF THERMAL CONDUCTIVITY SUBSTRATE - A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed. | 07-12-2012 |
20120241082 | FABRICATING METHOD OF FLEXIBLE CIRCUIT BOARD - A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching. | 09-27-2012 |
20130042963 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 02-21-2013 |
20130228266 | MANUFACTURING METHOD OF A TEST STRIP - The present invention discloses a manufacturing method of a test strip, which comprises making a first semi-finished product and a second semi-finished product. The manufacturing process of the first semi-finished product comprises: providing a substrate, forming a plurality of electrodes on the substrate, forming a supporting layer with a plurality of channels on the substrate, and providing a reaction material to fill in the channels. The manufacturing process of the second semi-finished product comprises: providing a lid, forming a hydrophilic layer on a first surface of the lid, forming an adhesive layer on the first surface without the hydrophilic layer. Thereafter, a test strip assembly is formed by adhering the channels of the first semi-finished product to the hydrophilic layer of the second semi-finished product. Finally, a plurality of test strips are produced by cutting the test strip assembly along a first axis of the substrate. | 09-05-2013 |
20130233468 | METHOD FOR PRODUCING TOUCH CONTROL DEVICES - The invention discloses a method for producing touch control devices. The method comprises providing a plastic substrate including multiple predetermined regions; forming an icon or artwork layer on the plastic substrate; forming a first sensing layer on the icon or artwork layer; forming a second sensing layer on a flexible transparent film; laminating the flexible transparent film onto the plastic substrate; cutting the predetermined regions from the plastic substrate to become individual touch control devices; and subjecting the touch control devices to bonding, so that the peripheral wires of the respective touch control devices are connected to a flexible printed circuit board. | 09-12-2013 |
20130233469 | METHOD FOR PRODUCING CAPACITIVE TOUCH PANELS - The invention discloses a method for producing capacitive touch panels. The method comprises providing a plastic substrate including multiple predetermined regions; forming an icon or artwork layer on the plastic substrate; forming a first sensing layer on the icon or artwork layer; laminating a flexible transparent film onto the plastic substrate; forming a second sensing layer on the flexible transparent film; cutting the predetermined regions from the plastic substrate to become individual capacitive touch panels; and subjecting the capacitive touch panels to bonding, so that the peripheral wires of the respective capacitive touch panels are connected to a flexible printed circuit board. | 09-12-2013 |
20130255858 | METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD - A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area. | 10-03-2013 |
20130319599 | NON-WOVEN POLYMER FIBER MAT FOR USE IN A LITHIUM ION BATTERY ELECTROCHEMICAL CELL - A method of making a non-woven polymer fiber mat that includes one or more polymer fibers and particles intermingled with the one or more polymer fibers is disclosed. The method, more specifically, includes simultaneously electrospinning the one or more polymer fibers and spraying the particles onto a collection face of a collector substrate. Once formed, the non-woven polymer fiber mat may be incorporated into an electrochemical battery cell of a lithium ion battery. | 12-05-2013 |
20140000792 | METHOD OF FABRICATING MASK ASSEMBLY | 01-02-2014 |
20140069574 | MANUFACTURING METHOD OF CIRCUIT BOARD - A manufacturing method of a circuit board is provided. In the manufacturing method, an electrically insulating layer and at least one electrically insulating material are formed on a plane of a thermally conductive plate, and a metal pattern layer located on the electrically insulating layer is formed. The electrically insulating layer partially covers the plane, and the electrically insulating material covers the plane where is not covered by the electrically insulating layer. The electrically insulating material touches the thermally conductive plate. A thermal conductivity of the electrically insulating material is larger than that of the electrically insulating layer. | 03-13-2014 |
20140102623 | RESIN COMPOSITION FOR INSULATING LAYER FOR MULTI-LAYERED PRINTED BOARD - Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0 | 04-17-2014 |
20140124124 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - This invention discloses a printed circuit board manufacturing method capable of manufacturing circuits with at least two different thicknesses on a same PCB substrate. In the printed circuit board manufacturing method, a circuit trench is formed on a first PCB substrate having a copper clad circuit layer of a smaller thickness and exposed from the bottom of a groove on another side of the copper clad layer, and then a thick copper is filled into the circuit trench by a copper electroplating method, and then a printed circuit board manufacturing flow is adopted to manufacture the printed circuit board having the circuits with at least two different thicknesses on the first PCB substrate, so as to achieve the effect of saving material costs, avoiding a waste of high priced metals, and reducing pollution sources. | 05-08-2014 |
20140283976 | METHOD OF MANUFACTURING OPTICAL DEVICE - A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer. | 09-25-2014 |
20140311656 | METHODS FOR MANUFACTURING AN EMBOSSER DRUM FOR USE IN PRE-FORMATTING OPTICAL TAPE MEDIA - Various embodiments herein include utilities for generating embosser drums that are used to pre-format optical media such as optical tape with a pattern of nanostructures such as wobbled grooves. One utility includes generating a plurality of replicas from an embossing master and bonding the replicas together to form a bonded replica structure having a surface with the nanostructure pattern imprinted therein and a surface area that is approximately the same as an outer embossing surface of the embosser drum to be formed. Advantageously, a single, one-piece metallic shim can subsequently be generated, appropriately shaped and welded at a single seam to form the embosser drum outer embossing surface. | 10-23-2014 |
20140318689 | Dense Barrier-Coating System and Method - A method of making a coated polymer-matrix composite (PMC) having high-temperature oxidation protection includes bonding a first surface of a flexible sublayer that is free of water to a first surface of a dry PMC substrate having a first coefficient of thermal expansion. The flexible sublayer includes an electrically conductive material in an effective amount to enable electrical conductivity of the flexible sublayer, and includes a low-modulus-of-elasticity material. The method includes heating the bonded flexible sublayer and the PMC substrate, and bonding a first surface of an oxygen-impervious, dense barrier-coating layer to a second surface of the flexible sublayer to form the coated PMC having high-temperature oxidation protection. The dense barrier-coating layer includes metallic materials and ceramic materials, each having a respective second coefficient of thermal expansion, and flexibility of the flexible sublayer protects the respective bonds when the first and second coefficients of thermal expansion are unequal. | 10-30-2014 |
20150296632 | METAL-FOIL-ATTACHED ADHESIVE SHEET, METAL-FOIL-ATTACHED LAMINATED BOARD, METAL-FOIL-ATTACHED MULTI-LAYER BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD - A metal-foil-attached adhesive sheet includes a metal foil, a release layer provided on the metal foil, and an adhesive layer provided on the release layer and made of a thermosetting resin composition which is semi-cured. A peeling strength P | 10-15-2015 |
20160004944 | MULTI-METAL LAYERED CARD - A metal transaction card is provided having a metal core layer with metal cladding layers connected thereto on opposing sides thereof. The metal core layer may have a density and/or thickness that is significantly greater than the density and/or thickness of the metal cladding layers. The density of the metal core layer may be at least 2.5 times greater than the density of the metal cladding layers. The density of the metal core layer may be at least 7.5. The outward facing lateral surface of one or both of the metal cladding layers may be anodized, or anodized and colorized. The anodized lateral surface(s) may be coated to increase the performance of a one or more hot-stamped elements attached to the coated surface(s). | 01-07-2016 |
20160096316 | METHODS OF MAKING ARTICLES USING STRUCTURED TAPES - Methods of making articles using structured tapes are disclosed. The structured tapes may include a structured template layer having a structured surface and an opposed second surface and an uncured backfill layer, the uncured backfill layer has a lower refractive index than the structured template layer, and the uncured backfill layer has a structured surface conforming to the structured surface of the structured template layer and an opposed second surface. The structured tapes may include a structured template layer having a structured surface and an opposed second surface and an uncured backfill layer, the uncured backfill layer has a higher refractive index than the structured template layer, and the uncured backfill layer has a structured surface conforming to the structured surface of the structured template layer and an opposed second surface. The structure tapes may be laminated via the uncured backfill layer to a receptor substrate to form an article. | 04-07-2016 |
20160101548 | METHOD FOR COATING FUNCTIONAL COMPONENTS MADE OF PLASTICS MATERIAL - A method for coating functional components made of plastics material and having a symbol or the like by electroplating produces the components from an electroplateable plastics material in the injection molding process and then electroplates or metallizes the components, the coated regions of the components remaining free of electroplating. In this process, a print reflecting the symbol or the like is applied to the component, the print of the symbol is provided on a film of material that is not compatible with the material to be back injection molded, preferably the plastics material to be subsequently electroplated, and the printed image provided on the carrier film is permanently transferred from the film to the component in the injection molding process. | 04-14-2016 |
20160250838 | DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURING METHOD, AND ROOM-TEMPERATURE BONDING APPARATUS | 09-01-2016 |
156151000 | On adherent surface of lamina prior to assembly | 17 |
20090020215 | Optical Coatings With Narrow Conductive Lines - Conductive micro traces ( | 01-22-2009 |
20090133811 | PROCESS FOR TRANSFERRING FILMS - A process of transferring a layer of a first material from a first substrate, having defects in a zone close to the surface, onto a host substrate made of a second material includes a step of thinning the first substrate in order to form a first thinned substrate, an ion or atom implantation in the first substrate in order to form an implantation plane therein, delimiting the layer to be transferred, and a transfer of the layer onto the host substrate by fracturing the substrate along the implantation plane. | 05-28-2009 |
20090320991 | Methods of synthesis of nanotubes and uses thereof - The invention relates to novel methods of incorporating nanotubes for use in micro- or nano-devices. The invention further relates to incorporating nanotubes in micro or nano-devices and particularly synthesizing or growing nanotubes directly in or on components of a micro- or nano-device. In a particular embodiment, the invention relates to methods of synthesizing or growing nanotubes in a gas chromatography column and their use in portable gas chromatography devices. | 12-31-2009 |
20100000663 | ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS - A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding. | 01-07-2010 |
20100132876 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via. | 06-03-2010 |
20100200154 | FABRICATING PROCESS OF CIRCUIT BOARD WITH EMBEDDED PASSIVE COMPONENT - A process for fabricating a circuit board with an embedded passive component is provided. An electrode-patterned layer having electrodes is formed on a surface of a conductive layer. A passive component material is filled in the intervals between the electrodes. The conductive layer and the electrode-patterned layer are laminated to a dielectric layer, wherein the electrode-patterned layer is embedded in the dielectric layer. The conductive layer is patterned to form a circuit layer. | 08-12-2010 |
20110041986 | MICRO-REACTOR AND METHOD OF MANUFACTURING THE SAME - A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body. | 02-24-2011 |
20110079344 | METHOD FOR MAKING A THIN FILM HAVING A METALLIC PATTERN LAYER - A method for making a thin film having a metallic pattern layer includes covering a release layer on the surface of a thin film substrate to leave a blank area of a predetermined pattern in the release layer, covering a metal layer on the release layer and the blank area, covering the metal layer with an adhesive layer, adhering a substrate-based thin film to the adhesive layer, and removing the substrate-based thin film to remove the part of the metal layer outside said blank area and the release layer together with the adhesive layer and the substrate-based thin film from the thin film substrate so that a metallic pattern layer is left on the thin film substrate for RFID (radio frequency identification) system, antennas of wireless transmission system, flexible printed circuit boards or chip on film (chip on flex) applications. | 04-07-2011 |
20120055612 | ELECTRODEPOSITION METHODS OF GALLIUM AND GALLIUM ALLOY FILMS AND RELATED PHOTOVOLTAIC STRUCTURES - Photovoltaic devices and methods for preparing a p-type semiconductor layer for the photovoltaic devices generally include electroplating a layer of gallium or a gallium alloy onto a conductive layer by contacting the conductive layer with a plating bath free of complexing agents including a gallium salt, methane sulfonic acid or sodium sulfate and an organic additive comprising at least one nitrogen atom and/or at least one sulfur atom, and a solvent; adjusting a pH of the solution to be less than 2.6 or greater than 12.6. The photovoltaic device includes an impurity in the p-type semiconductor layer selected from the group consisting of arsenic, antimony, bismuth, and mixtures thereof. Various photovoltaic precursor layers for forming CIS, CGS and CIGS p-type semiconductor structures can be formed by electroplating the gallium or gallium alloys in this manner. Also disclosed are processes for forming a thermal interface of gallium or a gallium alloy with the electroplating process. | 03-08-2012 |
20120067507 | FINE PATTERN MOLD - The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube. | 03-22-2012 |
20120097319 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate of the present invention includes a preparation step of preparing a sheet-like insulation core having a thickness of 100 μm or less; a drilling step of forming through-holes which are open at a front surface and a back surface of the insulation core by subjecting the insulation core to laser drilling; a conductor forming step of forming, through electroless copper plating and subsequent copper electroplating, through-hole conductors which completely fill the corresponding through-holes of the insulation core and a respective conductor layer on each of the front surface and the back surface of the insulation core; and a lamination step of laminating a plurality of resin insulation layers and a plurality of conductor layers alternately in multilayer arrangement on each respective conductor layer on the front surface and the back surface of the insulation core. | 04-26-2012 |
20120145308 | METHODS FOR ANODIC BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS - Methods and apparatus provide for: disposing an intermediate layer formed from at least one of: a metal, a conductive oxide, and combined layers of the metal and the conductive oxide, on one of a first material layer and a second material layer; and coupling the first and second material layers together via an anodic bond between the intermediate layer and the other of the first and second material layers. | 06-14-2012 |
20120273116 | HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-01-2012 |
20120312456 | FLEXIBLE PIEZOELECTRIC STRUCTURES AND METHOD OF MAKING SAME - A flexible piezoelectric structure and a method of making the structure are disclosed. A piezoelectric film having a relatively high piezoelectric coefficient is attached to a flexible substrate. The piezoelectric film is fabricated on a different substrate and transferred to the flexible substrate by contact. | 12-13-2012 |
20130213561 | DEVICE AND DEVICE MANUFACTURE METHOD - A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate. | 08-22-2013 |
20160059534 | Joining via Slender Nanomaterials: Materials, Procedures and Applications Thereof - A method of joining two articles using slender nanomaterials is described. Randomly oriented nanomaterial mats or aligned nanomaterial arrays are introduced at the interface between the two articles followed by their energization via at least one of microwave irradiation and heating. The nanomaterial-to-nanomaterial and nanomaterial-to-surface contacts are enhanced by at least one of fusion, embedment and chemical reaction phenomena upon energization. The fusion, embedment and chemical reaction phenomena enhance at least one of the mechanical, electrical, thermal, durability and functional attributes of these contact points, which translate into improved properties of the joined article. The enhanced contact points enable effective use of the distinct qualities of nanomaterials towards development of joints which offer unique balances of strength, ductility, toughness, transport qualities, thermal stability, weathering resistance and other characteristics. | 03-03-2016 |
20180022038 | JOINING OF THERMOPLASTIC TO METAL WITH ENHANCED INTERFACIAL CHEMICAL BONDING | 01-25-2018 |