Class / Patent application number | Description | Number of patent applications / Date published |
148553000 | Copper(Cu) or copper base alloy | 52 |
20080277033 | COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME - Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C. | 11-13-2008 |
20090260727 | Sn-CONTAINING COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME - A Sn-containing copper alloy, contains Sn: 0.01 to 16 mass %, Zr: 0.001 to 0.049 mass %, P: 0.01 to 0.25 mass %, and Cu: remainder; satisfying f0=[Cu]−0.5[Sn]−3[P]=61 to 97, f1=[P]/[Zr] 0.5 to 100, f2=3[Sn]/[Zr]=30 to 15000 and f3=3[Sn]/[P]=3 to 2500 (the content of element ‘a’ is represented as [a] mass %). α and γ-phases and/or δ-phase are included and the total content of the α and γ-phases and/or δ-phase reaches 90% or more by area ratio, and the mean grain size of the macrostructure during melt-solidification is 300 μm or less. | 10-22-2009 |
20100276039 | COPPER ALLOY, METHOD OF PRODUCING THE SAME, AND COPPER TUBE - Copper alloys, methods for producing copper alloys, and copper tubes are provided. The copper alloys include an alpha solid solution formed from phosphorous deoxidized copper and at least one trace element comprising tin. The content of tin ranges from about 0.1% to about 2.0% by weight of the copper alloy. The trace element can further include zinc in an amount from about 0.05% to about 1.0% by weight of the copper alloy. The copper alloys have an increased tensile strength due to the strengthening effect by the alpha solid solution formed by phosphorous deoxidized copper and tin as the trace element, and accordingly a copper tube made from the copper alloy has a significantly improved pressure resistance. | 11-04-2010 |
20110061774 | DEZINCIFICATION-RESISTANT COPPER ALLOY AND METHOD FOR PRODUCING PRODUCT COMPRISING THE SAME - A dezincification-resistant copper alloy and a method for producing a product comprising the same are proposed by the present invention. The dezincification-resistant alloy of the present invention comprises 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces thereof. | 03-17-2011 |
20160068940 | ALLOY WITH SELECTED ELECTRICAL CONDUCTIVITY AND ATOMIC DISORDER, PROCESS FOR MAKING AND USING SAME - A primary alloy includes: nickel; copper; zinc; an electrical conductivity from 5.2% International Annealed Copper Standard (IACS) to 5.6% IACS measured in accordance with ASTM E1004-09 (2009); and a disordered crystalline phase wherein atoms of the nickel, cooper, and zinc are randomly arranged in the disordered crystalline phase at room temperature in a post-annealed state. A process for making the primary alloy includes heating a secondary alloy to a first temperature that is greater than or equal to an annealing temperature to form an annealing alloy, the secondary alloy including a secondary phase; and quenching, by cooling the annealing alloy from the first temperature to a second temperature that is less than the annealing temperature, under a condition effective to form the primary alloy including the disordered crystalline phase, wherein the disordered crystalline phase is different than the secondary phase of the secondary alloy. | 03-10-2016 |
20160102392 | METHODS OF MAKING AND TREATING COPPER-BASED ALLOY COMPOSITIONS AND PRODUCTS FORMED THEREFROM - A ternary alloy wherein copper, manganese, and a ternary element are melted together and cast into an article and the article is subjected to an age-hardening treatment. A process for producing an age-hardened copper-manganese-nickel alloy, the process including melting a composition comprising copper, manganese and nickel; pouring the molten composition comprising copper, manganese, and nickel to form a casting with a composition comprising copper, manganese, and nickel, and aging the casting so produced. An article containing copper, manganese, and a ternary element, in a cast form and the cast form has subsequently undergone age-hardening treatment. A ternary alloy comprising copper, manganese, and a ternary element melted together and solidified into a casting, wherein the microstructure of the casting produced shows substantially low microporosity attributable to dendritic solidification. | 04-14-2016 |
148554000 | With working | 46 |
20080202648 | Superfine copper alloy wire and method for manufacturing same - A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine copper alloy wire is 3% or more and 20% or less. | 08-28-2008 |
20080283159 | Soft copper alloy, and soft copper wire or plate material - A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy. | 11-20-2008 |
20090084473 | COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET - The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability. | 04-02-2009 |
20090107589 | Method and Production Line for Manufacturing Metal Strips Made of Copper or Copper Alloys - Disclosed are a method and a production line for manufacturing metal strips made of copper or copper alloys by means of casting and rolling. In order to lower the investment cost and operating expenses therefor, the melt ( | 04-30-2009 |
20090165902 | METHOD OF PRODUCING A COPPER ALLOY WIRE ROD AND COPPER ALLOY WIRE ROD - A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched. | 07-02-2009 |
20090183803 | COPPER-NICKEL-SILICON ALLOYS - A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137 ksi, and an electrical conductivity of at least about 25% IACS. | 07-23-2009 |
20090301614 | CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING SAME - The invention provides Cu—Ni—Si—Co alloys having excellent strength, electrical conductivity, and press-punching properties. In one aspect, the invention is a copper alloy for electronic materials, containing 1.0 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, and 0.30 to 1.2 mass % of Si, the balance being Cu and unavoidable impurities, wherein the copper alloy for electronic material has a [Ni+Co+Si] content in which the median value ρ (mass %) satisfies the formula 20 (mass %)≦ρ≦60 (mass %), the standard deviation σ (Ni+Co+Si) satisfies the formula σ (Ni+Co+Si)≦30 (mass %), and the surface area ratio S (%) satisfies the formula 1%≦S≦10%, in relation to the compositional variation and the surface area ratio of second-phase particles size of 0.1 μm or greater and 1 μm or less when observed in a cross section parallel to a rolling direction. | 12-10-2009 |
20100132851 | COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME - A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I | 06-03-2010 |
20100163139 | Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR - A method of manufacturing a Cu alloy conductor comprises the steps of:
| 07-01-2010 |
20100170595 | COPPER ALLOY MATERIAL, AND METHOD FOR PRODUCTION THEREOF - A copper alloy material according to the present invention is characterized in that the copper alloy material includes: an element X between 0.1% and 4% by mass, in which the element X represents one transition element or not less than two elements selected from Ni, Fe, Co and Cr; an element Y between 0.01% and 3% by mass, in which the element Y represents one element or not less than two elements selected from Ti, Si, Zr and Hf; and a remaining portion to be comprised of copper and an unavoidable impurity, wherein the copper alloy material has an electrical conductivity of not less than 50% IACS, an yield strength of not less than 600 MPa, and a stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength. | 07-08-2010 |
20100269959 | COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME - A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I | 10-28-2010 |
20100319818 | Method for fabricating a copper alloy and copper alloy fabricated by the same - A method for fabricating a copper alloy. Cu and Cr, Zr, and Sn to be doped to the Cu are melt to cast a copper alloy material. Hot working is carried out on the copper alloy material to form a plate material having a rolled texture. Heat treatment is carried out on the plate material. Cold rolling with workability of 80% or more and less than 90% is carried out on the plate material after the heat treatment to form an intermediate plate material. Aging treatment is carried out on the intermediate plate material. Another cold rolling with workability of 20% to 40% is carried out as finish rolling on the intermediate plate material after the aging treatment step. The intermediate plate material after the finish rolling step is heated as stress relief annealing. | 12-23-2010 |
20110073221 | COPPER ALLOY SHEET MATERIAL AND METHOD OF PRODUCING THE SAME - A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement. | 03-31-2011 |
20110094635 | COPPER ALLOY - A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that comprises (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 μm, and the precipitate Y has a grain size of 0.01 to 1 μm. | 04-28-2011 |
20110186187 | COPPER ALLOY - A method of producing a copper alloy containing: Ni and/or Si and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, the copper alloy having a precipitate X composed of Ni and Si, and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 μm. | 08-04-2011 |
20110192505 | COPPER ALLOY MATERIAL, ELECTRICAL OR ELECTRONIC PARTS, AND METHOD OF PRODUCING A COPPER ALLOY MATERIAL - A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60% or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material. | 08-11-2011 |
20110240180 | Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component - There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface. | 10-06-2011 |
20120031533 | Cu-Co-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING SAME - The present invention provides Cu—Co—Si system alloys that have desirable mechanical and electrical characteristics as a copper alloy for electronic materials, and have uniform mechanical characteristics. The copper alloys for electronic materials contain 0.5 to 4.0 mass % Co, 0.1 to 1.2 mass % Si, and the balance being Cu and unavoidable impurities. An average grain size is 15 to 30 μm and an average difference between maximum grain size and minimum grain size in every observation field of 0.5 mm | 02-09-2012 |
20120073712 | MACHINABLE COPPER-BASED ALLOY AND METHOD FOR PRODUCING THE SAME - Alloy containing between 1% and 20% by weight of Ni, between 1% and 20% by weight of Sn, between 0.5%, 3% by weight of Pb in Cu which represents at least 50% by weight of the alloy; characterized in that the alloy further contains between 0.01% and 5% by weight of P or B alone or in combination. The invention also pertains to a metallic product having enhanced mechanical resistance at intermediate temperatures (300° C. to 700° C.) and excellent machinability. The metallic product of the invention can be advantageously used for the fabrication of connectors, electromechanical, or micromechanical pieces. | 03-29-2012 |
20120175026 | COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET - The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability. | 07-12-2012 |
20120241056 | COPPER ALLOY SHEET MATERIAL HAVING A LOW YOUNG'S MODULUS AND METHOD OF PRODUCING THE SAME - {Problems} To provide a copper alloy material, having a low Young's modulus that is required of electrical or electronic parts, such as connectors. | 09-27-2012 |
20120267013 | COPPER ALLOY SHEET MATERIAL AND METHOD OF PRODUCING THE SAME - A copper alloy sheet material, having an R value of 1 or greater, which is defined by: | 10-25-2012 |
20120279618 | COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME - A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I | 11-08-2012 |
20120312430 | COPPER ALLOY HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY, AND METHOD FOR PREPARING THE SAME - The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt %, Si 0.01˜0.25 wt % Mg, and the balance of Cu and minor impurities. The method of making the copper alloy includes: forming the molten alloy, casting to obtain an ingot, hot rolling the ingot at 850˜1,000° C., cooling, cold rolling the hot rolled product (after cooling the same), annealing the cold rolled product at 400˜600° C. for 1˜10 hours, intermediate rolling the annealed product with a reduction ratio of 30˜70%, heat treating the intermediate rolled product at 500˜800° C. for 30˜600 seconds, and finishing rolling the heat treated product with a reduction ratio of 20˜40%. | 12-13-2012 |
20120312431 | COPPER ALLOY WITH HIGH STRENGTH AND HIGH CONDUCTIBILITY, AND METHOD FOR MANUFACTURING SAME - A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability without negatively affecting the tensile strength. The copper alloy consists of 0.2 to 0.4 wt % of Cr, 0.05 to 0.15 wt % of Sn, 0.05 to 0.15 wt % of Zn, 0.01 to 0.30 wt % of Mg, 0.03 to 0.07 wt % of Si, with the remainder being Cu and inevitable impurities. A method for manufacturing the copper alloy includes obtaining a molten metal having the described composition; obtaining an ingot; heating the ingot at a temperature of 900-1000° C. to perform a hot rolling process; cold rolling; performing a first aging process at a temperature of 400-500° C. for 2 to 8 hours; cold rolling; and performing a second aging process at a temperature of 370-450° C. for 2 to 8 hours. | 12-13-2012 |
20130014861 | CU-NI-SI ALLOY FOR ELECTRONIC MATERIALAANM Ookubo; MitsuhiroAACI Hitachi-shiAACO JPAAGP Ookubo; Mitsuhiro Hitachi-shi JP - The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. | 01-17-2013 |
20130087255 | Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME - Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains 0.5 to 3.0% by mass of Co, 0.1 to 1.0% by mass of Si, and the balance of Cu and inevitable impurities; wherein out of second phase particles precipitated in the matrix a number density of the particles having particle size of 5 nm or larger and 50 nm or smaller is 1×10 | 04-11-2013 |
20130092297 | Cu-Co-Si System Alloy Sheet and Method for Manufacturing Same - The present invention provides a Cu—Co—Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for plate. | 04-18-2013 |
20130098511 | CU-SI-CO ALLOY FOR ELECTRONIC MATERIALS, AND METHOD FOR PRODUCING SAME - A Cu—Co—Si alloy having an improved balance between electrical conductivity and strength is provided. Disclosed is a copper alloy for electronic materials, which contains 0.5% to 4.0% by mass of Co and 0.1% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, and in which the mass % ratio of Co and Si (Co/Si) is 3.5≦Co/Si≦5.5, an area ratio of discontinuous precipitation (DP) cells is 5% or less, and an average value of a maximum width of discontinuous precipitation (DP) cells is 2 μm or less. | 04-25-2013 |
20130180630 | Cu-Co-Si-BASED ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THE SAME - A Cu—Co—Si-based alloy that has even mechanical properties and that is provided with favorable mechanical and electrical properties as a copper alloy for an electronic material is provided. The copper alloy for an electronic material comprises 0.5% by mass to 3.0% by mass of Co, 0.1% by mass to 1.0% by mass of Si, and the balance Cu with inevitable impurities. An average grain size is in the range of 3 μm to 15 μm and an average difference between a maximum grain size and a minimum grain size in every observation field of 0.05 mm | 07-18-2013 |
20130263978 | Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREOF - Cu—Ni—Si—Co copper alloy strip having excellent balance between strength and electrical conductivity which can prevent the drooping curl is provided. The copper alloy strip for an electronic materials contains 1.0-2.5% by mass of Ni, 0.5-2.5% by mass of Co, 0.3-1.2% by mass of Si, and the remainder comprising Cu and unavoidable impurities, wherein the copper alloy strip satisfies both of the following (a) and (b) as determined by means of X-ray diffraction pole figure measurement based on a rolled surface: (a) among a diffraction peak intensities obtained by β scanning at α=20° in a {200} pole figure, a peak height at β angle 145° is not more than 5.2 times that of standard copper powder; (b) among a diffraction peak intensities obtained by β scanning at α=75° in a {111} pole figure, a peak height at β angle 185° is not less than 3.4 times that of standard copper powder. | 10-10-2013 |
20130284323 | Cu-Co-Si-Zr ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF - The present invention relates to a Cu—Co—Si—Zr alloy material which contains 1.0-2.5 wt % of Co, 0.2-0.7 wt % of Si and 0.001-0.5 wt % of Zr with the elemental ratio Co/Si being 3.5-5.0. The Cu—Co—Si—Zr alloy material contains second phase particles having a diameter of 0.20 μm or more but less than 1.00 μm at a density of 3,000-500,000 particles/mm | 10-31-2013 |
20130333812 | COPPER ALLOY AND PROCESS FOR PRODUCING COPPER ALLOY - To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities, wherein the copper alloy is of the high strength, but is excellent in workability, and has high electrical conductivity, and can control property thereof, by precipitating a γ′ phase of the L1 | 12-19-2013 |
20140014239 | COPPER ALLOY CONTAINING COBALT, NICKEL AND SILICON - A process for manufacturing copper-nickel-silicon alloys includes the sequential steps of casting the copper alloy; hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature. | 01-16-2014 |
20140014240 | Cu-Si-Co-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR PRODUCING THE SAME - A Cu—Si—Co-based alloy having an enhanced spring limit is provided. The copper alloy comprises 0.5-2.5 mass % of Co, 0.1-0.7 mass % of Si, the balance Cu and inevitable impurities, wherein, from a result obtained from measurement of an X ray diffraction pole figure, using a rolled surface as a reference plane, a peak height at β angle of 90° among diffraction peaks in {111} Cu plane with respect to {200} Cu plane by β scanning at α=35° is at least 2.5 times that of a standard copper powder. | 01-16-2014 |
20140014241 | STRIP OF Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND THE METHOD FOR PRODUCING THE SAME - Cu—Co—Si-based alloy strip, which has not only an excellent balance between strength and electrical conductivity but also suppressed hanging curl, is provided. The copper alloy strip for electronic materials comprises 0.5-2.5 mass % of Co, 0.1-0.7 mass % of Si, the balance Cu and inevitable impurities, wherein, from a result obtained from measurement of an X ray diffraction pole figure, using a rolled surface as a reference plane, the following (a) is satisfied.
| 01-16-2014 |
20140190596 | COPPER ALLOY AND METHOD OF MANUFACTURING COPPER ALLOY - Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5≦a≦4.0, 0.1 | 07-10-2014 |
20140305551 | COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME - A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity, and high thermal stability as a material for information transmission and electrical contact of connectors or the like for home appliances and automobiles, including semiconductor lead frames and a method of preparing the same are disclosed. | 10-16-2014 |
20140311633 | COPPER-NICKEL-TIN ALLOY WITH HIGH TOUGHNESS - A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry. | 10-23-2014 |
20140318673 | COPPER ALLOY MATERIAL, ELECTRICAL OR ELECTRONIC PARTS, AND METHOD OF PRODUCING A COPPER ALLOY MATERIAL - A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1} <3 4 6> is within 30° is 60% or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material. | 10-30-2014 |
20150053314 | MANUFACTURING METHOD OF COPPER ALLOY SHEET - Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower. | 02-26-2015 |
20150376755 | COPPER ALLOY MATERIAL FOR CONTINUOUS CASTING MOLD AND PROCESS FOR PRODUCING SAME - The present invention relates to a copper alloy material for continuous casting mold and a process for producing the same. In more detail, the present invention relates to a copper alloy material for continuous casting mold, which consists of 0.05 wt % to 0.6 wt % of Cr, 0.01 wt % to 0.5 wt % of Ag, 0.005 wt % to 0.10 wt % of P, and a balance of Cu and unavoidable impurities; and a process for producing the same. The copper alloy material can further include less than 0.1 wt % of at least one of elements selected from a group consisting of Sn, Ti, Mg, Mn, Fe, Co, Al, Si, Mo, Zr and W. | 12-31-2015 |
20160186295 | COPPER ALLOY AND COPPER ALLOY SHEET - Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 14≦f2=[Zn]−0.5×[Sn]−3×[Ni]≦26, 8≦f3={f1×(32−f1)} | 06-30-2016 |
20160194749 | MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET MATERIAL | 07-07-2016 |
20160201179 | COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT | 07-14-2016 |
20190144974 | COPPER ALLOY, COPPER ALLOY INGOT, SOLID SOLUTION MATERIAL OF COPPER ALLOY, AND COPPER ALLOY TROLLEY WIRE, METHOD OF MANUFACTURING COPPER ALLOY TROLLEY WIRE | 05-16-2019 |