| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 136224000 | Thermopile | 44 |
| 20130032189 | High Temperature Thermoelectrics - In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum. | 02-07-2013 |
| 20130037073 | SYSTEMS AND METHODS FOR REDUCING CURRENT AND INCREASING VOLTAGE IN THERMOELECTRIC SYSTEMS - A thermoelectric assembly and method are provided. The thermoelectric assembly can extend at least partially around a perimeter of a first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another, and a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies. | 02-14-2013 |
| 20130068273 | PIPE-SHAPED THERMOELECTRIC POWER GENERATING DEVICE - A pipe-shaped thermoelectric power generating device includes an internal through-hole along the axis direction of the pipe-shaped thermoelectric power generation device; a plurality of first cup-shaped components each made of metal; a plurality of second cup-shaped components each made of thermoelectric material; a first electrode; a second electrode. The plurality of first cup-shaped components and the plurality of second cup-shaped components are arranged alternately and repeatedly along the axis direction. The first electrode and the second electrode are provided respectively at one end and at the other end of the pipe-shaped thermoelectric power generation device. | 03-21-2013 |
| 20100006132 | Stacked Thermoelectric Modules - An apparatus includes a first thermally conductive body having a plurality of fingers and a second thermally conductive body having a plurality of fingers. The first and second bodies are configured such that the fingers of the first body are interdigitated with the fingers of the second body. Each of a plurality of thermoelectric modules has a first major surface and an opposing second major surface. The first major surface of each thermoelectric module is in thermal contact with one of the fingers of the first body, and the second major surface is in thermal contact with one of the fingers of the second body. | 01-14-2010 |
| 20130098419 | THERMOELECTRIC CONVERTER WITH PROJECTING CELL STACK - A thermoelectric converter is formed by a plenum divided into high and low pressure chambers by a partition and includes a stack of series-coupled alkali-metal thermoelectric cells that projects orthogonally from the partition into one of the chambers. | 04-25-2013 |
| 20120227780 | THERMOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING SAME - A thermoelectric conversion module includes an insulative substrate, a plurality of thermoelectric conversion material films disposed with a gap therebetween on a first surface of the insulative substrate and made of any one of an n-type thermoelectric conversion material and a p-type thermoelectric conversion material, a first electrode and a second electrode, formed away from each other on each of the thermoelectric conversion material films, a first thermal conduction member disposed on a side of the first surface of the insulative substrate and including a protruding portion in contact with the first, electrodes or the insulative substrate between the first electrodes, and a second thermal conduction member disposed on a side of a second surface of the insulative substrate and including a protruding portion in contact with the second surface of the insulative substrate at an area coinciding with the second electrodes. | 09-13-2012 |
| 20130125949 | Packaging for Thermoelectric Subcomponents - A thermoelectric semiconducting assembly. Two parallel plates, a first plate and a second plate, are spaced apart. A plurality of pellets are fitted into said first plate and into said second plate, each said pellet comprising a body, a first cap, and a second cap, said body including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, each pellet in said second plate being connected to a pellet in said first plate. Each pellet includes a doped body, wherein half of said pellets are doped with a p-type dopant to form a p-type pellet and half of said pellets are doped with an n-type dopant to form an n-type pellet. Each plate includes p-type pellets and n-type pellets in an alternating pattern, and each p-type pellet in said first plate connects with an n-type pellet in said second plate, and wherein each n-type pellet in said first plate connects with a p-type pellet in said second plate. | 05-23-2013 |
| 20110271995 | Thermoelectric modules - A thermoelectric module includes: thermoelectric semiconductor elements; printed metal conductors for interconnecting the semiconductor elements; and at least one base support for the printed conductors, the base support including a metal matrix composite. | 11-10-2011 |
| 20110290295 | Thermoelectric/solar cell hybrid coupled via vacuum insulated glazing unit, and method of making the same - Certain example embodiments provide techniques for improving the output of hybrid systems comprising photovoltaic (PV) and thermoelectric (TE) modules in conjunction with super-insulating, yet optically transmissive, vacuum insulated glass (VIG) unit technologies. More particularly, certain example embodiments relate to hybrid systems including hydrogenated microcrystalline silicon (mc-Si), hydrogenated amorphous silicon (a-Si), bulk hetero junction solar cell, and/or the like, that may be used together with a TE generator, that achieves high operational PV and TE efficiencies under ambient conditions. In that regard, certain example embodiments effectively partition the solar spectrum in order to yield an increased conversion efficiency of a PV-TE hybrid system with a solar cell operating at ambient temperature. | 12-01-2011 |
| 20110139206 | THERMOELECTRIC DEVICE AND THERMOELECTRIC MODULE - According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member. | 06-16-2011 |
| 20100078054 | Thermal Difference Engine - Closed system heat engines can be used to deliver useful electrical power by harvesting ambient energy in the environment. The present invention provides a means of harvesting these low temperature differences in to useful energy and provides while providing rectification and regulation features. | 04-01-2010 |
| 20130019917 | THERMOELECTRIC CONVERSION OF WASTE HEAT FROM GENERATOR COOLING SYSTEM - An electrical generator includes a rotor, a stator core disposed axially around the rotor, a stator sleeve assembly disposed axially around the stator core, and a stator housing disposed axially around the stator sleeve assembly. The stator sleeve assembly includes a cylindrical stator sleeve and thermoelectric elements. The cylindrical stator sleeve has a radially inward facing surface and a radially outward facing surface. The thermoelectric elements are affixed to the radially outward facing surface of the cylindrical stator sleeve. The stator housing includes at least one coolant channel. The coolant channel is in thermal contact with the thermoelectric elements. The thermoelectric elements generate power as a function of the temperature difference between the cylindrical stator sleeve and the coolant channel. | 01-24-2013 |
| 20080245398 | HIGH CAPACITY THERMOELECTRIC TEMPERATURE CONTROL SYSTEM - A thermoelectric system includes a first plurality of thermoelectric elements and a second plurality of thermoelectric elements. The thermoelectric system further includes a plurality of heat transfer devices. Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices. The two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements. | 10-09-2008 |
| 20080216883 | Thermopile Infrared Sensor Array - A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements. | 09-11-2008 |
| 20100163090 | THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE - A thermoelectric device including a first substrate, a plurality of conductive vias, a second substrate, a thermoelectric couple module, a first insulation layer, and a second insulation layer is provided. The first substrate has a first surface and a second surface opposite to each other. The conductive vias running through the first substrate respectively connect the first and the second surface. The second substrate faces the second surface of the first substrate. The thermoelectric couple module including a plurality of thermoelectric couples connected with each other in series is disposed between the first and the second substrate and coupled to the conductive vias. The first insulation layer is disposed between the thermoelectric couple module and the first substrate. The second insulation layer is disposed between the thermoelectric couple module and the second substrate. | 07-01-2010 |
| 20120103380 | THERMOELECTRIC MODULE AND PROCESS FOR THE PRODUCTION THEREOF - In a process for the production of a thermoelectric module, thermoelectric legs which are electrically contact-connected in series are coated so as to be covered with an electrically insulating solid material. | 05-03-2012 |
| 20100224226 | THERMOELECTRIC CONVERSION DEVICE - A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers. The second heat-conductive and electrically insulating structure is connected between two adjacent second conductive layers. | 09-09-2010 |
| 20110083712 | Thermoelectric Module - Provided is a thermoelectric module including electrodes and P-type and N-type semiconductors formed on a substrate by a printing method. The thermoelectric module includes upper and lower substrates ( | 04-14-2011 |
| 20110209740 | HIGH CAPACITY THERMOELECTRIC TEMPERATURE CONTROL SYSTEMS - A thermoelectric system includes a first plurality of thermoelectric elements and a second plurality of thermoelectric elements. The thermoelectric system further includes a plurality of heat transfer devices. Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices. The two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements. | 09-01-2011 |
| 20090032080 | THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME - A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate. | 02-05-2009 |
| 20120145214 | THERMOELECTRIC CONVERSION MATERIAL, AND THERMOELECTRIC CONVERSION MODULE USING SAME - A thermoelectric conversion material contains a mixed oxide containing Zn, Ga, and In. The thermoelectric conversion material is one in which the mixed oxide further contains Al. The thermoelectric conversion material is one in which the relative density of the mixed oxide is not less than 80%. The thermoelectric conversion material is one in which at least a part of a surface of the mixed oxide is coated with a film. A thermoelectric conversion module is provided with a plurality of n-type thermoelectric conversion materials, a plurality of p-type thermoelectric conversion materials, and a plurality of electrodes electrically serially connecting the p-type thermoelectric conversion materials with the n-type thermoelectric conversion materials in an alternate arrangement, and at least one material of the plurality of n-type thermoelectric conversion materials is the aforementioned thermoelectric conversion material. | 06-14-2012 |
| 20090025774 | THERMOELECTRIC MEANS AND FABRIC-TYPE STRUCTURE INCORPORATING SUCH A MEANS - The invention relates to a thermoelectric means ( | 01-29-2009 |
| 20110155202 | Miniature Thermoelectric Power Generator - The subject invention pertains to thermoelectric power generation. According to certain embodiments, a stack of silicon-micromachined chips can be connected to form a cylindrical heat exchanger that enables a large, uniform temperature difference across a radially-oriented thermopile. Each layer in the stack can comprise two thermally-isolated concentric silicon rings connected by a polyimide membrane that supports patterned thermoelectric thin films. The polyimide membrane can be formed by selectively etching away the supporting silicon, resulting in thermally-isolated inner and outer rings. In operation, hot gas can flow through a finned central channel, and an external cross flow can enhance heat transfer to ambient to keep the outer surfaces cool. The resulting temperature gradient across the thermopile generates a voltage potential across the open ends due to the Seebeck effect. When connected to a load, current flows, and electrical power is supplied by the generated voltage potential caused by the temperature gradient. | 06-30-2011 |
| 20120060888 | MICROSTRUCTURE FOR A SEEBECK EFFECT THERMOELECTRIC GENERATOR, AND METHOD FOR MAKING SUCH A MICROSTRUCTURE - A method for making a thermoelectric microstructure includes: forming an insulating substrate; forming, on the substrate, a first assembly of conductor or semiconductor elements extending in parallel and in a first direction from first to second connection areas, and having a first Seebeck coefficient; forming, on the substrate, a second assembly of conductor or semiconductor elements electrically insulated from the first assembly and extending in parallel and in a second direction other than the first one, from the first to second connection areas, and having a second Seebeck coefficient other than the first one; providing, in the first and second connection areas, electric connection elements, each of which electrically connects at least one element of first and second assemblies; two conductor or semiconductor elements of a single assembly are separated in a predetermined direction by a predetermined average distance in the connection areas. | 03-15-2012 |
| 20120060887 | ASYMMETRIC THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates. | 03-15-2012 |
| 20120118347 | THERMOELECTRIC CONVERSION MATERIAL - A thermoelectric conversion material includes a complex oxide containing Zn, Al, Ga, and B. The thermoelectric conversion material is one in which a ratio of a molar amount of B to a total molar amount of Zn, Al, Ga, and B is not less than 0.0001 and not more than 0.01. The thermoelectric conversion material is one in which the relative density of the complex oxide is not less than 95% The thermoelectric conversion material is one in which at least a part of a surface of the complex oxide is coated with a film. A thermoelectric conversion module is provided with a plurality of n-type thermoelectric conversion materials, a plurality of p-type thermoelectric conversion materials, and a plurality of electrodes electrically serially connecting the p-type thermoelectric conversion materials and the n-type thermoelectric conversion materials in an alternate arrangement, and at least one material of the plurality of n-type thermoelectric conversion materials is the aforementioned thermoelectric conversion material. | 05-17-2012 |
| 20120132243 | Thermoelectric Module with Improved Efficiency - A thermoelectric module comprising a matrix comprising junctions having two N-type and P-type thermoelectric chips, said junctions being electrically connected to form an electric circuit. Flow of an electric current in the circuit heats one surface of the matrix by Peltier effect. Heating of one surface of the matrix makes an electric current flow by Seebeck effect. The module comprises a first group of junctions of two N-type and P-type thermoelectric chips exposed to a first operating temperature. A second group of junctions of two N-type and P-type thermoelectric chips is exposed to a second operating temperature. The second temperature is lower than the first temperature and the two groups of junctions are separated by a thermal insulator. | 05-31-2012 |
| 20120167937 | THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers. | 07-05-2012 |
| 20120073620 | THERMOELECTRIC POWER GENERATION APPARATUS AND METHOD - A thermoelectric power generation apparatus includes a thermoelectric device having a first surface, an opposed second surface, and a first thermal energy storage unit operatively coupled to the first surface of the thermoelectric device setting the first surface at a first temperature. The thermoelectric power generation apparatus also includes a second thermal energy storage unit having a second temperature, the second thermal energy unit for setting the second surface of the thermoelectric device at an operative temperature in response to a temperature difference between the first temperature of the first surface and the second temperature of the second thermal energy storage unit. The thermoelectric device generates power in response to a temperature differential between the first temperature of the first surface and the operative temperature of the second surface. | 03-29-2012 |
| 20120273020 | DEVICE FOR GENERATING ELECTRIC ENERGY FROM A HEAT-CONDUCTING MATERIAL - A device for generating electric energy includes at least one heated heat-conducting main body, at least one projection and thermoelectric elements laterally attached to the at least one projection. A thermoelectric efficiency of each thermoelectric element and a heat output of the at least one projection are matched to each other. | 11-01-2012 |
| 20110265839 | THERMOELECTRIC CONVERSION MODULE - A thermoelectric conversion module is provided with a p-type thermoelectric conversion element and an n-type thermoelectric conversion element; a support frame having a through hole with the p-type thermoelectric conversion element therein and a through hole with the n-type thermoelectric conversion element therein; and an electrode electrically connecting the p-type thermoelectric conversion element with the n-type thermoelectric conversion element; at least one element of the p-type thermoelectric conversion element and the n-type thermoelectric conversion element has a shape having a vertex and/or an edge; the at least one element has been secured to the support frame by an adhesive adhering to a region of the surface of the at least one element except for the vertex and the edge and to the support frame. | 11-03-2011 |
| 20120279543 | POWER CONVERTER - A power converter is provided and includes a heat collector surface, n- and p-legs formed of n- and p-type thermoelectric materials, respectively, which are each disposed in thermal communication with the heat collector surface, parallel electric busses electrically coupled to the n- and p-legs and a housing, which is electrically decoupled from the busses, to support the heat collector surface at a predefined distance from a heat pipe. | 11-08-2012 |
| 20120279544 | THERMOELECTRIC MODULE - Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes. | 11-08-2012 |
| 136225000 | Having strip, film or plate-type thermocouples | 9 |
| 20110277803 | THERMOCOUPLE DEVICE - In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices. | 11-17-2011 |
| 20110174351 | Module Having A Plurality of Thermoelectric Elements - A module having a plurality of thermoelectric elements electrically connected in series, each being made of at least one n-layer and at least one p-layer made of thermoelectric material with a pn-transition implemented along a boundary layer. A temperature gradient parallel to the boundary layer between a hot and a cold side of each thermoelectric element can be applied or detected. Resistances of the electrical contacts of the individual thermoelectric elements are reduced and the thermal connection to a heat sink or heat source is improved for generating a temperature gradient along the boundary layer. The substrate and the thermoelectric elements are produced in separate processes, and the thermoelectric elements are adhered to previously structured, thermally and electrically conductive regions of the substrate using different adhesives for the cold and hot side of each thermoelectric element. | 07-21-2011 |
| 20090165835 | THERMOELECTRIC DEVICE WITH THIN FILM ELEMENTS, APPARATUS AND STACKS HAVING THE SAME - A thermoelectric device at least includes a ring-shaped insulative substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulative substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulative substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TER When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulative substrate. | 07-02-2009 |
| 20120111387 | THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A thermoelectric device and a method for manufacturing the same are provided. The thermoelectric device includes a middle substrate, electrodes, N-type thermopiles, and P-type thermopiles, in which the N-type thermopile and the P-type thermopile are electrically connected to each other by the electrodes in series. The thermoelectric device includes further includes an upper substrate bonded to an upper surface of the middle substrate and a lower substrate bonded to a lower surface of the substrate, such that a temperature difference is provided between opposite sides of each of the N-type thermopiles and the P-type thermopiles. | 05-10-2012 |
| 20120060889 | Thermoelectric modules and assemblies with stress reducing structure - A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements. | 03-15-2012 |
| 20120247526 | THERMOELECTRIC CONVERSION UNIT AND METHOD OF MANUFACTURING - One aspect of the present invention includes a thermoelectric conversion unit having a case in which a flow path of an open structure is molded, a first substrate covering an open portion of the flow path, a second substrate arranged opposite the first substrate, and a plurality of thermoelectric conversion elements arranged between the first substrate and the second substrate. At a bottom surface of the flow path of the case, an introduction pipe and a discharge pipe are formed integrally with the case, and each of the introduction and discharge pipes extend in a direction perpendicular to the first substrate. | 10-04-2012 |
| 20110220164 | ENHANCED METAL-CORE THERMOELECTRIC COOLING AND POWER GENERATION DEVICE - In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement. | 09-15-2011 |
| 20110226303 | METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT - P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process. | 09-22-2011 |
| 20110226302 | Thermoelectric Coatings for Waste Heat Recovery and Photo-Thermal Power - An energy harvesting system for collecting energy from sources of thermal energy that exist in the environment and convert the energy to electricity. The system has N-P junctions mounted on the outer surface of a conduit, pipe or flue. A hot medium flows through the conduit, pipe or flue. The p-n junctions operate as thermoelectric power generators. Heat absorbed at the p-n junctions increases the kinetic energy of charge carriers causing migration of the charge carriers. This thermally-driven migration of charge carriers is used to drive an electrical current in an external circuit. | 09-22-2011 |
| 136226000 | Having wound wire-type thermocouples | 1 |
| 20100326487 | THERMOELECTRIC ELEMENT AND THERMOELECTRIC DEVICE - The present invention provides thermoelectric elements, each of which can transfer heat efficiently to a heat source with a curved surface, such as a columnar heat source. A thermoelectric element of the present invention includes a laminate with two different types of thermoelectric conversion materials that are layered alternately from one end to the other end as well as a first electrode and a second electrode that are disposed at both ends of the laminate, respectively, wherein the laminate has a shape surrounding a straight line axis from the one end to the other end, when viewed from the direction along the axis, the laminate has an inner circumference with a circular or arc shape and each boundary between respective layers formed of the two different types of thermoelectric conversion materials is disposed in such a manner as to separate from a straight line as the boundary approaches an outer circumference from the inner circumference of the laminate, where the straight line passes an inner circumference-side edge point of the boundary, with the axis being a starting point thereof. | 12-30-2010 |
| 136227000 | Two or more couples of dissimilar composition | 1 |
| 20120247527 | ELECTRODE STRUCTURES FOR ARRAYS OF NANOSTRUCTURES AND METHODS THEREOF - A thermoelectric device and methods thereof. The thermoelectric device includes nanowires, a contact layer, and a shunt. Each of the nanowires includes a first end and a second end. The contact layer electrically couples the nanowires through at least the first end of each of the nanowires. The shunt is electrically coupled to the contact layer. All of the nanowires are substantially parallel to each other. A first contact resistivity between the first end and the contact layer ranges from 10 | 10-04-2012 |
