| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 134004000 | Including forming a solidified or hardened coating for cleaning | 22 |
| 20080271753 | METHOD OF CLEANINIG STANNANE DISTRIBUTION SYSTEM - Methods for cleaning a stannane distributions system. A stannane distribution system connecting a stannane supply source and a semiconductor manufacturing tool is provided. Stannane is flown through the system, and a tin layer is formed on the components of the distribution system. This tin layer is then cleaned from the distribution system without the use of liquid cleaning chemicals. | 11-06-2008 |
| 20120174945 | Liquid Chemical for Forming Protecting Film - Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1]. | 07-12-2012 |
| 20130037048 | POLYMER COMPOSITION - This invention relates to a polymer composition, comprising: water; a water-soluble polymer; and solid particulates of a sequestering agent. The composition may be used for decontaminating, cleaning and/or washing substrates contaminated with contaminants and/or contaminated materials. | 02-14-2013 |
| 20090250079 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - The present invention relates to a substrate cleaning method for cleaning a substrate whose static contact angle with respect to water is 85 degrees or more. The substrate cleaning method includes a step in which the substrate is held horizontally by a substrate holder in such a manner that a central part of the substrate and a central part in rotation correspond to each other; a step in which, while the substrate holder is being rotated about a vertical axis, a cleaning liquid is discharged from a cleaning-liquid nozzle to the central part of the substrate and is spread over all the surface of the substrate by a centrifugal force; a step in which, while the substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a distance between an interface on a side of a to-be-discharged position of the gas in the to-be-discharged position of the cleaning liquid and an interface on a side of the to-be-discharged position of the cleaning liquid in the to-be-discharged position of the gas is set between 9 mm and 15 mm; and a step in which, while the substrate holder is being continuously rotated, the to-be-discharged position of the cleaning liquid is moved toward a periphery of the substrate at a speed lower than a speed at which the dried area is spread outward. | 10-08-2009 |
| 20080257381 | Use of Polyvinyl Acetate Dispersions for Cleaning Purposes - The invention relates to the use of dispersions containing polyvinyl acetate for cleaning purposes, for example for cleaning plaster floors, ceramic wall and floor linings, steps, window sills, gravestones, sculptures, and jointing materials. According to the invention, the dispersion containing polyvinyl acetate is applied to part or all of the surface to be cleaned. Once said layer has dried through, it can be removed from the surface to be cleaned in the form of a film. The dispersion forms a solid composite with the impurities, such that the impurities can also be removed with the film. | 10-23-2008 |
| 20090107523 | METHOD AND TOOL FOR CLEANING CAVITIES - A method for cleaning cavities in workpieces, a cleaning device for this purpose and a device for the supply of media to a cleaning device of this type. Supercritical carbon dioxide is introduced into the cavity and the cavity is rinsed. The supercritical carbon dioxide located in the cavity is relieved of pressure after rinsing of the cavity, so that carbon dioxide gas and carbon dioxide snow are formed in the cavity and subsequently driven out of the cavity. | 04-30-2009 |
| 20090288680 | METHOD FOR PRODUCING ORGANIC LIGHT-EMITTING DEVICE - A method for producing an organic light-emitting device is provided for an organic light-emitting device having a substrate provided with external connection terminals, organic light-emitting elements provided on the substrate, and a protective film that covers the organic light-emitting elements. The method includes, sequentially, providing a protective film removal layer on the external connection terminals, forming the protective film on the substrate, dividing the substrate on which the protective film has been formed, and cleaning the substrate with water, an aqueous solution, or a solvent. The protective film removal layer and the protective film are removed from the external connection terminals as a result of cleaning the substrate. | 11-26-2009 |
| 20080251101 | Substrate Cleaning Method, Substrate Cleaning Equipment, Computer Program, and Program Recording Medium - In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W. | 10-16-2008 |
| 20090145457 | Method For The Wet-Chemical Treatment Of A Semiconductor Wafer - A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer. | 06-11-2009 |
| 20090250078 | METHODS FOR REMOVING RESIDUAL PARTICLES FROM A SUBSTRATE - Methods for removing residual particles from a substrate are presented including: receiving the substrate including the residual particles; and functionalizing the residual particles with functionalizing molecules, wherein the functionalizing molecules selectively attach with a surface the residual particles, where the functionalizing molecules impart a changed chemical characteristic to the residual particles, and where the changed chemical characteristic facilitates removal of the residual particles from the substrate. In some embodiments, methods further include: before functionalizing, cleaning the substrate, where the cleaning leaves residual particles adhered with a surface of the substrate, and where the residual particles are hydrophilic; and if the surface of the substrate is hydrophobic, performing the functionalizing. In some embodiments, methods further include removing the residual particles from the surface of the substrate where removing the residual particles includes removing the functionalizing molecules. | 10-08-2009 |
| 20100037913 | CLEANING APPARATUS AND METHOD FOR CLEANING GLUE - A cleaning apparatus includes a heating device, a freezing device, and a conveying belt. The heating device includes a hot water source and a hot water container. The hot water container includes an exit shutter and defines a water inlet and a water outlet. The hot water source being communicated to the hot water container via the water inlet. The freezing device includes an aerosol spray system and a freezing container. The spray system includes a spray head. The freezing container includes an entrance shutter. The spray head is received in the freezing container. The conveying belt extends into the hot water container via the exit shutter and into the freezing container via the entrance shutter and thereby bridges the hot water container and the freezing container. | 02-18-2010 |
| 20080196744 | In-chamber member, a cleaning method therefor and a plasma processing apparatus - An in-chamber member to use in the chamber of a plasma processing vessel has a coating film formed by a coating agent. The in-chamber member having deposits formed on the coating film is separated from the chamber and is immersed into a peeling solvent, e.g., acetone. Since the coating agent is made of a resist formed of a main component of, e.g., cyclized rubber-bisazide and a photosensitive component, the deposits can be separated from the in-chamber member together with the coating film being separated. | 08-21-2008 |
| 20080216866 | Surface Treatment Process and Applicator - A packaged cleaning composition and process for cleaning a surface involves the simultaneous application of two liquids to the surface, such that a self-supporting gel is formed, acting on soil while delaying it from drying out. The gel and entrained soil are subsequently removed. | 09-11-2008 |
| 20090293909 | ARRANGEMENT AND METHOD FOR REMOVING ALKALI- OR ALKALINE EARTH-METALS FROM A VACUUM COATING CHAMBER - The invention relates to a cleaning method in which from a vacuum coating chamber ( | 12-03-2009 |
| 20120145188 | SOIL RESISTANT FLOOR TREATMENT - A soil resistant floor surface treatment composition is provided. In particular, a composition comprises a maleic/olefin copolymer and an optional cleaning agent. Methods for treating a porous floor surface with a soil resistant agent and kits comprising a floor treatment composition, an applicator, a removal agent for removing a plurality of soils from a treated surface, and instructions for use are further provided by the present invention. | 06-14-2012 |
| 20090032058 | Biodegradable detergent concentrate for medical instruments and equipment - An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface. | 02-05-2009 |
| 20090165816 | HIGHLY DOPED III-NITRIDE SEMICONDUCTORS - A method of forming a highly doped layer of AlGaN, is practiced by first removing contaminants from a MBE machine. Wafers are then outgassed in the machine at very low pressures. A nitride is then formed on the wafer and an AlN layer is grown. The highly doped GaAlN layer is then formed having electron densities beyond 1×10 | 07-02-2009 |
| 20120247506 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a liquid droplet nozzle which generates droplets of a treatment liquid which are sprayed on a spouting region on an upper surface of the substrate held by the substrate holding unit; and a protective liquid nozzle which spouts a protective liquid obliquely onto the upper surface of the substrate held by the substrate holding unit for protection of the substrate to cause the protective liquid to flow toward the spouting region on the upper surface of the substrate, whereby the spouting region is covered with a film of the protective liquid and, in this state, the treatment liquid droplets are caused to impinge on the spouting region. | 10-04-2012 |
| 20120073599 | APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE - A rinsing liquid adheres to a substrate subjected to a cleaning process. The rinsing liquid on the substrate is first replaced with IPA liquid. While the substrate covered with the IPA liquid is held in a dryer chamber, liquid carbon dioxide is supplied to the surface of the substrate. Liquid nitrogen is supplied to cool down the interior of the dryer chamber. This solidifies the liquid carbon dioxide on the substrate into solid carbon dioxide. Thereafter, the pressure in the dryer chamber is returned to atmospheric pressure, and gaseous nitrogen is supplied into the dryer chamber. Thus, the temperature in the dryer chamber increases. The solid carbon dioxide on the surface of the substrate is sublimated, and is hence removed from the substrate. All of the steps are performed while carbon dioxide is not in a supercritical state but in a non-supercritical state. | 03-29-2012 |
| 20120272999 | Liquid Chemical for Forming Water Repellent Protecting Film, and Process for Cleaning Wafers Using the Same - A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %. | 11-01-2012 |
| 20120273000 | SULFONATE-FUNCTIONAL COATINGS AND METHODS - A coated article having a substrate coated with a layer of a sulfonate-functional coating, and methods of making and using. | 11-01-2012 |
| 20100229890 | Method of Particle Contaminant Removal - Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface. The viscoelastic material along with at least some of the particle contaminants is removed from the first area of the surface while the viscoelastic material is exhibiting solid-like characteristics. | 09-16-2010 |
