Class / Patent application number | Description | Number of patent applications / Date published |
083015000 | By heating or cooling | 31 |
20090007737 | Bottle Label Removal Apparatus and Associated Method - A device is provided for removal of a layer, such as a label, from a cylindrical surface of an object. The device includes a guide, a cutting instrument, and a base connecting the guide and the cutting instrument. The guide and the cutting instrument are separated by a distance defined by the base, and the cutting instrument is positioned to shave along the object's surface to remove the layer, when the surface of the object is rotated against the cutting instrument and against the guide. The method includes, positioning an object in a device having a cutting instrument and a guide, where the cutting instrument and the guide both support the object, and where the cutting instrument is positioned to shave along the surface to remove the layer when the object is rotated; and rotating the object so the cutting instrument shaves under the layer to remove the layer. | 01-08-2009 |
20090056513 | Cleaving Wafers from Silicon Crystals - A method of creating thin wafers of single crystal silicon wherein an ingot of single-crystal silicon with a ( | 03-05-2009 |
20090211415 | Onion chopping devices and methods of use thereof - The present invention generally relates to certain novel methods of chopping onions, while avoiding (or reducing) exposure to syn-propanethial-S-oxide gas emitted from such onions. In certain embodiments, the methods generally comprise placing an onion on a cutting platform, applying heat to the cutting platform or the air surrounding the cutting platform, and applying a vacuum pressure to the air surrounding the cutting platform. In certain specific embodiments, the methods generally comprise (a) placing a cutting platform sufficiently near a heat source and ventilation hood such that air directly above the cutting platform increases in temperature and exhibits a vacuum force towards the ventilation hood when the heat source and ventilation hood are activated, (b) activating the heat source and ventilation hood, and (c) cutting the onion on the cutting platform. | 08-27-2009 |
20090277314 | LAYER TRANSFER OF FILMS UTILIZING CONTROLLED SHEAR REGION - A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence. In one embodiment, the high KII component is achieved by adiabatic heating of silicon through exposure to E-beam radiation, which imparts a highly abrupt thermal gradient and resulting stress at a precisely defined depth in the silicon. | 11-12-2009 |
20100064867 | MICROTOME FOR PRODUCING SECTIONS OF SPECIMENS - The invention relates to a microtome and a method for producing sections of a specimen. The microtome has a knife for sectioning the specimen, and a cooling apparatus for cooling a gaseous coolant. The cooling apparatus generates a coolant flow of the gaseous coolant. The specimen is arranged in the coolant flow. | 03-18-2010 |
20100107834 | SEPARATION APPARATUS AND SEPARATION METHOD - A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base. | 05-06-2010 |
20110023672 | Method and Apparatus for Debonding a Submounted Substrate - The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates ( | 02-03-2011 |
20110048187 | METHOD FOR SLITTING TRANSPARENT POLYMER FILM - A method for slitting a continuously traveling laterally-stretched transparent polymer film, comprising the steps of:
| 03-03-2011 |
20110283851 | Method and hot forming system for producing press-hardened formed components of sheet steel - The invention relates to a method and to a hot forming system for producing press-hardened formed components of sheet steel, comprising a furnace ( | 11-24-2011 |
20120260784 | PRESS WORKING METHOD AND PRESS WORKING APPARATUS - A press working method for processing a heated workpiece includes a punching process of punching the heated workpiece using a working tool in a state of urging the workpiece by a pad, a retreating process of retreating the working tool from the punched workpiece, and a holding process of holding the punched workpiece in a state of being urged by the pad after the retreating process. | 10-18-2012 |
20120297943 | CUTTING OF PREFORMS PRIOR TO RTM INJECTION BY MEANS OF A WATER JET AND CRYONICS - A device for cutting a fibrous preform, for production of a part made of a composite material by injection of resin under vacuum. The device includes a die for receiving the preform, on which a template of outer edges of the part is referenced, a mechanism cutting outer edges of the preform according to the template, and a mechanism for cooling the preform that is suitable for solidifying a liquid forming a substrate for the preform. | 11-29-2012 |
20130125719 | PROCESSES FOR PRODUCING SILICON INGOTS - Methods for producing crucibles for holding molten material that contain a reduced amount of gas pockets are disclosed. The methods may involve use of molten silica that may be outgassed prior to or during formation of the crucible. Crucibles produced from such methods and ingots and wafers that are produced from crucibles with a reduced amount of gas pockets are also disclosed. | 05-23-2013 |
20140053697 | SYSTEM AND METHOD OF CHILLING A FOOD PRODUCT PROXIMATE TO AND IN A FOOD PROCESSING DEVICE - A system and method for chilling a food product in or proximate to a food processing device adapted to dice, slice, shred, chop, or cut the food product is disclosed. The disclosed system and method involves a two or three stage application of a liquid cryogen or carbon dioxide snow to cool the food product. The cooling stages include a first stage of cryogen application upstream of the entrance of the food processing device, a second stage of cryogen application or delivery into one or more zones within the food processing device, and a third stage of cryogen application to the region proximate to and downstream of the exit to the food processing device. | 02-27-2014 |
20140060272 | SYSTEM AND METHOD OF CHILLING A FOOD PRODUCT PROXIMATE TO AND IN A FOOD PROCESSING DEVICE - A system and method for chilling a food product in or proximate to a food processing device adapted to dice, slice, shred, chop, or cut the food product is disclosed. The disclosed system and method involves a two or three stage application of a liquid cryogen or carbon dioxide snow to cool the food product. The cooling stages include a first stage of cryogen application upstream of the entrance of the food processing device, a second stage of cryogen application or delivery into one or more zones within the food processing device, and a third stage of cryogen application to the region proximate to and downstream of the exit to the food processing device. | 03-06-2014 |
20140137713 | APPARATUS AND METHOD FOR CUTTING BIOSPECIMEN AND CELL OBSERVATION METHOD - An apparatus for cutting a workpiece as biospecimen into a section while maintaining living state of cells includes a board on which the workpiece is placed, a device for freezing and fixing the workpiece on the board, and a blade for cutting the frozen workpiece fixed on the board into a section by means of rotary movement in a predetermined rotational direction. A profile of a cutting edge of the blade is a curve showing monotonic increase in distances of a rotational axis to points starting at a nearest point that is the shortest from the axis and ending at a farthest point that is the longest from the axis. The farthest point is behind the nearest point in the rotational direction and the curve is convex opposite to the rotational axis with respect to a straight line connecting the nearest point and the farthest point. | 05-22-2014 |
20140290452 | Male Dry Shaver - An electrically driven shaver comprises a housing and at least one hair cutting element that is driven by an electromotor. A thermoelectric skin cooling element and the electromotor are electrically operable by a microcontroller and an on/off switch which is electrically connected with the microcontroller. The microcontroller is adapted to activate and deactivate operation of both the electromotor and the skin cooling element. The skin cooling element is located adjacent to the hair cutting element. The microcontroller is adapted to immediately deactivate operation of the electromotor and relative to that to deactivate operation of the skin cooling element at later point of time, both in response to the “off” actuation of the same on/off switch. | 10-02-2014 |
20160016323 | Apparatus and Process for Cutting Adhesive Labels - A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner. | 01-21-2016 |
20160031106 | APPARATUS AND METHOD FOR SEPARATING TOUCH SCREEN AND DISPLAY SCREEN - Disclosed are an apparatus and a method for separating a touch screen and a display screen, the apparatus comprises: a working base station configured to hold the touch screen and the display screen jointed together by a sealant; a heater mounted inside of the working base station and configured to heat and soften the sealant between the touch screen and the display screen; a saw wire arranged to contact a contact boundary between the touch screen and the display screen and to reciprocate at least in a tangent direction of the contact boundary so as to preliminarily separate the touch screen and the display screen; a first adsorption device configured to adsorb the display screen and remove the display screen from the touch screen; and a mutual moving mechanism configured to enable the saw wire to contact the contact boundary between the touch screen and the display screen and to move relative to the touch screen and display screen in a normal direction of the contact boundary. The saw wire is reciprocated between the touch screen and the display screen so as to complete a preliminary separation between the display screen and the touch screen, and then the display screen and the touch screen are separated by the adsorption device, thus the display screen and touch screen are not likely to be damaged and can be separated from each other successfully. | 02-04-2016 |
20160059432 | Method for Producing Cut Bodies and Method for Cutting Fiber-Reinforced Resin - According to an aspect of the present invention, there is provided a method for producing cut bodies including: cutting a fiber-reinforced resin material including reinforcing fibers having a tensile strength of 1,000 MPa to 6,000 MPa and a thermoplastic resin, wherein a flexural modulus of the fiber-reinforced resin material is decreased to 80% to 15% at the cutting. | 03-03-2016 |
20160084741 | DISPOSABLE MICROTOME METHOD AND APPARATUS FOR FASTER PATHOLOGY - A disposable microtome system and method for faster pathology is provided. | 03-24-2016 |
083016000 | At localized area (e.g., line of separation) | 11 |
20080314214 | COMPOSITE DIAMOND COMPACTS - A composite diamond compact is provided which has a diamond compact ( | 12-25-2008 |
20100031790 | CONTROL OF WHITE-ETCHED LAYER DURING MACHINING - A machining system includes a support configured to retain an article, such as a rotor disk, having an area, such as a surface of a slot in the disk. A cutting tool, for example, a broach, is movable relative to the support to cut the area. A heating member, such as a laser, is configured to locally heat the area of the article. In one example, the cutting tool includes a body having a cutting edge. The heating member is supported by the body and is configured to provide heat adjacent to the cutting edge. The cutting edge cuts the locally heated area while the area is still heated. | 02-11-2010 |
20100199818 | CUTTING APPARATUS - A cutting apparatus for separating two plate devices is provided, wherein the two plate devices are connected to each other by an adhesive layer. The cutting apparatus includes a base, a carrier movably disposed on the base to hold the plate devices, a wire, and a reel mechanism disposed on the base for moving the wire. The wire cuts through the adhesive layer while the carrier moves with respect to the base, so that the plate devices are separated from each other. | 08-12-2010 |
20120111161 | PIERCING APPARATUS AND PIERCING METHOD - The present invention relates to a piercing apparatus and a piercing method which drive a punch. The piercing apparatus includes a local heating device for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a punch driving device for driving the punch toward the part of the workpiece which was heated by the local heating device. The piercing method includes a local heating step for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a stamping step for driving the punch toward the part of the workpiece which was heated in the local heating step. | 05-10-2012 |
20130014622 | CUTTING AND SEALING APPARATUSES AND METHODS - A cutting apparatus configured to hold an elongate element, such as a ribbon, in a desired orientation as the elongate element is cut into two sections. A cutting element of such a cutting apparatus may be confined to a single orientation relative to that of the elongate element, reducing or eliminating the likelihood of misalignment between the cutting element and the elongate element immediately before the elongate element is cut. In some embodiments, the cutting apparatus, or even its cutting element, may be configured to seal the newly cut ends of the elongate element. Methods for cutting and or sealing elongate elements, such as ribbons, are also disclosed. | 01-17-2013 |
20130032015 | CUTTING APPARATUS AND METHOD - A cutting device | 02-07-2013 |
20130340583 | Liquid Crystal Substrate Cutting Device and Cutting Method for Liquid Crystal Substrate - The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced. | 12-26-2013 |
20140165804 | PRECISION WIRE SAW INCLUDING SURFACE MODIFIED DIAMOND - A wire having a surface and diamond particles bonded to said surface by a bond matrix, wherein each diamond particle has surface roughness of about 0.60 to about 0.80 and a sphericity of about 0.25 to about 0.50. | 06-19-2014 |
20150027283 | METHOD AND APPARATUS FOR CUTTING A PIPE MADE FROM THERMOPLASTIC MATERIAL - Described is a method for cutting a pipe ( | 01-29-2015 |
20150290695 | DEVICE FOR PUNCHING AN OPENING INTO A LIGHTWEIGHT METAL SHEET AND A METHOD FOR PERFORMING THE SAME - The present invention proposes a device, robot with such a device, punch for such a device and method for punching an opening into a lightweight metal sheet that has at least two metallic outer layers and at least one non-metallic core layer arranged between the metallic outer layers, the device having means for carrying out a relative movement of a punch with respect to the lightweight metal sheet and a quill with an integrated heat source, the punch being able to be heated up by the heat source. | 10-15-2015 |
20160193981 | BELT-CUTTING MECHANISM | 07-07-2016 |