| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 073753000 | Electrical | 58 |
| 20110174079 | CARBON NANOTUBE VACUUM GAUGES WITH WIDE-DYNAMIC RANGE AND PROCESSES THEREOF - A miniature thermal conductivity gauge employs a carbon single-walled-nanotube. The gauge operates on the principle of thermal exchange between the voltage-biased nanotube and the surrounding gas at low levels of power and low temperatures to measure vacuum across a wide dynamic range. The gauge includes two terminals, a source of constant voltage to the terminals, a single-walled carbon nanotube between the terminals, a calibration of measured conductance of the nanotube to magnitudes of surrounding vacuum and a current meter in electrical communication with the source of constant voltage. Employment of the nanotube for measuring vacuum includes calibrating the electrical conductance of the nanotube to magnitudes of vacuum, exposing the nanotube to a vacuum, applying a constant voltage across the nanotube, measuring the electrical conductance of the nanotube in the vacuum with the constant voltage applied and converting the measured electrical conductance to the corresponding calibrated magnitude of vacuum using the calibration. The nanotube may be suspended to minimize heat dissipation through the substrate, increasing sensitivity at even tower pressures. | 07-21-2011 |
| 20130042695 | ELECTROSTATICALLY COUPLED PRESSURE SENSOR - A disclosed pressure-responsive sensor includes a flexible element contained within an enclosure and a membrane configured to exert an electrostatic force on the flexible element to cause the flexible element to respond to pressure variations on the membrane. A disclosed pressure-sensing method includes electrostatically coupling a membrane to a flexible element contained within an enclosure to transfer a pressure response of the membrane to the flexible element. Motion of the flexible element is converted into a pressure signal. | 02-21-2013 |
| 20130074604 | PROCESS FLUID PRESSURE TRANSMITTER WITH SEPARATED SENSOR AND SENSOR ELECTRONICS - A process fluid pressure transmitter has a remote pressure sensor. The transmitter includes an electronics housing and a loop communicator disposed in the electronics housing and being configured to communicate in accordance with a process communication protocol. A controller is disposed within the electronics housing and is coupled to the loop communicator. Sensor measurement circuitry is disposed within the electronics housing and is coupled to the controller. A remote pressure sensor housing is configured to couple directly to a process and is spaced from the electronics housing. A pressure sensor is disposed within the remote pressure sensor housing. The pressure sensor forms at least one electrical component having an electrical characteristic that varies with process fluid pressure. Portions of the electrical component are coupled directly to a multiconductor cable that operably connects the pressure sensor to the sensor measurement circuitry. | 03-28-2013 |
| 20130031985 | PRESSURE SENSOR ASSEMBLY - The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In some instances, the sensor unit may include pressure signal output terminals electrically connected to electrical terminals of the electrical connector. | 02-07-2013 |
| 20130036827 | MULTILAYERED NONON MEMBRANE IN A MEMS SENSOR - Various embodiments relate to a MEMS pressure sensor including: a lower electrode; a first insulating layer over the lower electrode; a second insulating layer over the first insulating layer that forms a cavity between the first and second insulating layers; an upper electrode over the second insulating layer, wherein a portion of the cavity is between the upper and lower electrodes; and a NONON pressure membrane over the upper electrode. | 02-14-2013 |
| 20080295603 | Time to Digital Converting Circuit and Pressure Sensing Device Using the Same - A time-to-digital converting circuit and a pressure sensing device using the same are provided. The circuit includes: a delay time-varying unit generating a reference signal having a fixed delay time, and a sensing signal having a variable delay time in response to an impedance of an externally applied signal; and a delay time calculation and data generation unit calculating a delay time difference between the reference signal and the sensing signal, and generating digital data having a value corresponding to the calculated delay time difference. Accordingly, the digital data are generated using the delay time varied in response to the externally applied signal, so that the size of the time-to-digital circuit is significantly reduced. In addition, an affect due to external noises is minimized. | 12-04-2008 |
| 20100206086 | NEGATIVE PRESSURE GAUGE WITH A MULTI-STAGE POSITIONING MEANS - A negative pressure gauge includes a body and a multi-stage positioning means. The body is provided with an airflow passage. The multi-stage positioning means includes a rotary piece and a cover plate. The rotary piece is pivotally connected to the body and is provided with positioning recesses and venting troughs. The cover plate covers the rotary piece and is fixedly connected to the body. The cover plate extends to form a positioning protrusion corresponding to the positioning recesses. When the rotary piece rotates with respect to the cover plate, the positioning recesses allow the positioning protrusion to be selectively positioned therein and control the communication or obstruction between the venting troughs and the airflow passage. | 08-19-2010 |
| 20100192695 | REMOTE FIRE EXTINGUISHER STATION INSPECTION - An apparatus for remote inspection of fire extinguishers at one or a system of fire extinguisher stations includes, e.g., at each fire extinguisher station: a detector for lack of presence of a fire extinguisher in its installed position at the fire extinguisher station; a detector for out-of-range pressure of contents of the fire extinguisher at the fire extinguisher station; a detector for an obstruction to viewing of or access to the fire extinguisher at the fire extinguisher station; and a device for transmission of inspection report information from the fire extinguisher station to a remote central station. | 08-05-2010 |
| 20110290033 | MEASURING APPARATUS AND METHOD FOR MANUFACTURING THE MEASURING APPARATUS - An apparatus for determining and/or monitoring a physical and/or chemical, measured variable of a medium, including a housing, especially an elongated housing, and a sensor arranged in the housing. The sensor serves for registering the measured variable, wherein the housing has at least one opening, through which the sensor comes in contact with the medium. The housing has a first housing section, in which the sensor and a sensor electronics are arranged. The sensor electronics is arranged on a first carrier element. The sensor electronics serves for changing the measured variable into an analog electrical signal. An insert is applied in the first housing section, in which the sensor electronics is arranged. The insert is tubular. | 12-01-2011 |
| 20090205435 | Circuit Module - A circuit module, in particular a tire sensor module, which at least includes: a substrate, on or in which at least one component is mounted, a piezoelement, which has at least one clamping region and at least one oscillatory region, the piezoelement being clamped in its clamping region on the substrate or on an arrangement secured to the substrate, and its oscillatory region being accommodated in a manner that permits oscillation, contacts provided on the piezoelement for tapping off a piezoelectric voltage, and a current-supply circuit, which receives the piezoelectric voltage generated by the piezoelement, being used as a voltage source for supplying power to the circuit module. The piezoelement is preferably clamped between at least two substrate elements, at least one cavity being formed within which the at least one oscillatory region of the piezoelement is accommodated in a manner that permits deflection, and is limited in its oscillation displacement. | 08-20-2009 |
| 20110167919 | Vacuum measuring device with interchangeable sensors - An interoperable vacuum measuring device is presented, which automatically adjusts to one of two or more vacuum sensors having different electrical characteristics. The interoperable vacuum measuring device in a first step detects which type of vacuum sensor it is connected to. In a second step it controls and evaluates the vacuum sensor, using control parameters determined in response to the detection of the first step. | 07-14-2011 |
| 20120137785 | Method And Apparatus For A Pressure Measuring Cell - The invention is for a method and apparatus for a pressure measuring cell for measuring a metered pressure, with a base body having at least one base body electrode and with a membrane body connected to the base body to form a sensor chamber, which has at least one membrane electrode and can be subjected to the pressure of a medium that is below the measurement pressure, wherein both the wall of the sensor chamber that is formed by the base body and the wall of the sensor chamber that is formed by the membrane body is covered with a protective layer; according to the invention, the protective layer is fashioned as a glass layer. | 06-07-2012 |
| 20120067133 | Pressure Sensor Configuration for Pressurized Tank - In at least some embodiments, a pressure sensor configuration includes a pressure sensor and a switchable valve coupled to the pressure sensor. The switchable valve enables the pressure sensor to measure pressure at multiple ports of a pressurized tank. | 03-22-2012 |
| 20120103103 | Pressure Testing Device - A pressure testing device includes: a vacuum pump having positive and negative pressure terminals; a first solenoid valve having a first intake terminal and a first exhaust terminal connected to the negative pressure terminal; a second solenoid valve having a second exhaust terminal and a second intake terminal connected to the positive pressure terminal; a pressure sensor having one end connected to the first intake terminal and the second exhaust terminal and the other end connected to a pressure testing terminal of an object; an operation module for displaying an operation interface to input pressure testing parameters; and a control unit for performing an air-extracting process through the vacuum pump and first solenoid valve or an air-exhausting process through the vacuum pump and second solenoid valve to the object according to the inputted parameters and displaying the state of the object sensed by the pressure sensor through the operation module. | 05-03-2012 |
| 20110016981 | PRESSURE MEASUREMENT MODULE - A pressure measuring module for recording an absolute pressure or a relative pressure. Pressure measuring module includes a housing produced preferably as a premold, in which a pressure measuring chip is accommodated. The latter is contacted electrically either to a lead frame or to at least one printed circuit trace, at least one electronic component being provided, which is connected to a section of the lead frame or of the at least one printed circuit trace, exiting laterally from the housing that is produced as a premold, and is covered by a partition of a cover. | 01-27-2011 |
| 20110247425 | Cartridge Fluid Transducer - There is provided a fluid transducer. The transducer housing includes a nose section, a middle section, and a rear section, with the nose section defining a through bore. A sensor is disposed in the nose section and is in fluid communication with the through bore. An electronic module is disposed in the middle section and is in electrical communication with the sensor. A cap is coupled to the real section of the transducer housing, with the cap configured to seal the rear section of the transducer housing. A conductor-insulator assembly is coupled to an outer surface of the transducer housing and the conductor of the conductor-insulator assembly is coupled to the electronic module. In one embodiment the conductor-insulator assembly is annular in shape, with an inside diameter corresponding to the outer surface of the transducer housing. | 10-13-2011 |
| 20090301213 | Pressure Gauge - A pressure gauge comprises a pressure gauge assembly and a connecting assembly. The pressure gauge assembly includes a measuring pressure port for the pressure to be measured and the connecting assembly includes a pressure measuring port. The pressure gauge assembly is adapted to be connected to the connecting assembly. In order to permit a relative rotation between the pressure gauge assembly and the connecting assembly, the pressure gauge assembly and/or the connecting assembly supports at least one annular passage section connecting the measuring pressure port to the pressure measuring port. | 12-10-2009 |
| 20110185819 | PRESSURE SENSITIVE SENSOR AND MANUFACTURING METHOD THEREOF - A molten dielectric resin material is filled in a section of an inside of a hollow dielectric body, in which electrode wires are installed. The molten dielectric resin material is solidified to form filler resin, so that the hollow dielectric body has a sensor portion, in which the filler resin is not filled in the inside of the hollow dielectric body, and a non-sensor portion, in which the filler resin is filled in the inside of the hollow dielectric body. A power supply connector is installed to one end part of the hollow dielectric body located at the non-sensor portion side and includes a plurality of electrically conductive terminals that are electrically connected to the plurality of electrode wires. | 08-04-2011 |
| 20120036938 | METHOD AND DEVICE FOR DETERMINING A PRESSURE IN A HIGH-PRESSURE ACCUMULATOR - An injection valve is hydraulically coupled to a high-pressure accumulator in order to supply a fluid. The injection valve has a longitudinal axis, an injection needle, and an actuator. The actuator is designed to act on the injection needle. A pre-defined amount of electrical energy is supplied to the actuator in order to modify an axial length of the actuator in such a way that the injection needle moves out of the closed position. Once the pre-defined amount of electrical energy has been supplied, a first voltage value and a second voltage value are detected and/or determined by the actuator at respectively different pre-defined moments. On the basis of the first and second voltage values, a differential voltage value is determined, on the basis of which a first pressure is determined, which represents a pressure in the high-pressure accumulator. | 02-16-2012 |
| 20120031190 | CAPACITIVE PRESSURE SENSOR - An improved capacitive manometer, the manometer comprises: a diaphragm including (a) a common electrode and (b) an electrode structure including a center electrode and ring electrode, wherein the diaphragm is movable between (i) a zero position when the pressure on each side of the diaphragm is the same and (ii) a maximum differential position when the maximum measurable differential pressure is applied to the diaphragm, and a support structure arranged so as to support the diaphragm so that the diaphragm is constrained relative to the electrode structure, and the common electrode is spaced from and axially aligned with the center and ring electrodes relative to an alignment axis of the manometer: wherein the electrode structure is secured relative to the diaphragm at at least three clamping locations angularly spaced around the alignment axis; and wherein the angle defined within each right plane containing a point of constraint of the diaphragm and the point of each clamping location relative to the plane of the diaphragm in the zero position is between 60° and 90° so as to reduce changes in electrode disk support height, enable smaller gaps and improved stability between the diaphragm and electrode structure. An additional improvement is provided by including a spacer ring including a plurality of tabs; and a clamp arranged to clamp the electrode structure to the spacer ring at the location of each of the tabs so as to define a plurality of equiangularly spaced, clamped locations around the alignment axis, so as to eliminate the possibility of an occasional spacer induced radial shear force and subsequent potential stick slip condition that could impact repeatability and stability. | 02-09-2012 |
| 20120055256 | Ceramic component having at least one electrical feedthrough, method for its manufacture and pressure sensor with such a component - A ceramic component having at least one electrical feedthrough, comprising: a ceramic body, through which a bore extends; and a metal conductor, which is arranged at least sectionally in the bore and which is secured in the bore by means of an active hard solder, or braze, whereby the bore is sealed. The active hard solder fills an annular gap between the metal conductor and the ceramic body, characterized in that the active hard solder has a radially variable, chemical composition. | 03-08-2012 |
| 20120017693 | MEMS DYNAMIC PRESSURE SENSOR, IN PARTICULAR FOR APPLICATIONS TO MICROPHONE PRODUCTION - A pressure sensor of the MEMS and/or NEMS type is disclosed, including:
| 01-26-2012 |
| 20120017692 | Pressure sensor and method for manufacturing a pressure sensor - A peripheral pressure sensor for a motor vehicle has a sensor chip and a gasket sealing a sensing unit of the sensor chip from the surroundings, which gasket has a pressure channel through which pressure information is transmitted to the sensing unit of the sensor chip. The peripheral pressure sensor is made by an injection molding method in which an opening in the gasket is placed on the sensing unit of the sensor chip, and subsequently an assembly of the sensor chip and the gasket is surrounded by extrusion coating such that an outer edge opposite the sensing unit and/or an outer opening in the gasket remains at least partially free. | 01-26-2012 |
| 20120111121 | PRESSURE MONITORING SYSTEM INCLUDING MULTIPLE PRESSURE SWITCHES - A pressure monitoring system ( | 05-10-2012 |
| 20120152028 | POWER SUPPLIER USING FLEXIBLE PCB BASED ON SELF-POWERING AND SENSOR NODE USING THE SAME - Disclosed are a slim self-powering power supplier using a flexible PCB for a wireless sensor network and a sensor node using the same, and a fabrication method thereof. An exemplary embodiment of the present disclosure provides a self-powering power supplier including: a flexible PCB; a lower electrode positioned on the flexible PCB; a piezoelectric body having a cantilever structure deposited on the lower electrode; and an upper electrode formed on the piezoelectric body. | 06-21-2012 |
| 20110088480 | PRESSURE SENSOR AND USE THEREOF IN A FLUID TANK - A pressure sensor in contact with an aggressive fluid for a pressure measurement has a board with a pressure passage. The pressure passage is closed on one side by a sensor chip as a pressure sensing element. The board also mounts an integrated circuit and electrical contacts for electrical contacting of the pressure sensor. At least the on board arranged pressure sensing element as well as the integrated circuit are tightly enclosed by a capper made of a fluid resistant material in connection with the board, and are arranged in an encasing cavity formed by the capper and the board for fluid resistant protection. | 04-21-2011 |
| 20120160030 | FLEXIBLE MICROSPHERE COATED PIEZOELECTRIC ACOUSTIC SENSOR APPARATUS AND METHOD OF USE THEREFOR - Sensors used in mapping strata beneath a marine body are described, such as in a towed array. A first acoustic sensor uses a piezoelectric sensor mounted with a thin film separation layer of flexible microspheres on a rigid substrate. Additional non-acoustic sensors are optionally mounted on the rigid substrate for generation of output used to reduce noise observed by the acoustic sensors. A second sensor is a motion sensor including a conductive liquid in a chamber between a rigid tube and a piezoelectric motion film circumferentially wrapped about the tube. Combinations of acoustic, non-acoustic, and motion sensors co-located in rigid streamer housing sections are provided, which reduce noise associated with different sensor locations. | 06-28-2012 |
| 20110179879 | MULTI RANGE PRESSURE SENSOR APPARATUS AND METHOD UTILIZING A SINGLE SENSE DIE AND MULTIPLE SIGNAL PATHS - A multi-range pressure sensor apparatus and method that provide multiple signal paths for detecting a broad range of pressures with a high accuracy. A pressure transducer can be configured to include the use of a pressure sense die with piezoresistive elements integrated into the sensor die and in a Wheatstone bridge configuration. A sensed output signal from the sense die can be transferred to one or more amplifier circuits. A programmable compensation circuit can be utilized to multiplex different amplified output signals from each of the amplifier circuits and to provide a digital output. A memory associated with the programmable compensation circuit provides separate compensations, which are stored for each of the different signal paths and removes errors due to amplifier gain and offset. | 07-28-2011 |
| 20120073381 | PRESSURE SENSOR PACKAGE - An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet. | 03-29-2012 |
| 20120255364 | Method for employing titania nanotube sensors as vacuum gauges - A method by which titania, or other composition, nanotube arrays, grown anodically or otherwise, can be made to meter vacuum pressure through hydrogen absorption has been discovered. The nanotube array ( | 10-11-2012 |
| 20120297887 | PRESSURE SENSOR - The present invention relates to a pressure sensor employed in a stability control apparatus for a vehicle. According to an aspect, there is provided a pressure sensor installed to a hydraulic unit and being in contact with a circuit board of an electronic control unit to sense brake oil pressure. The pressure sensor comprises a connecting terminal formed on the circuit board of the electronic control board and comprising a press-fit terminal; a press-fit being in slidable and movable contact with the press-fit terminal; and a spring connecting the press-fit and the press-fit terminal. | 11-29-2012 |
| 20120079885 | ELECTRODE DEVICE, PRESSURE SENSOR AND PRESSURE METER - Provided are an electrode device, a pressure sensor and an electronic pressure meter. The electrode device may comprise: an electrode portion; and an elastically deformable portion arranged on a radial peripheral of the electrode portion. The electrode portion is integrated with the elastically deformable portion such that when a force is applied to the electrode device, the elastically deformable portion can be deformed correspondingly and the electrode portion can be displaced axially. | 04-05-2012 |
| 20130098162 | PRESSURE MEASUREMENT MEMBER - A pressure measurement member includes an insulation bottom layer, a flexible insulation top layer and at least one spacer. The insulation bottom layer has a bottom conductive element on the surface thereof. The flexible insulation top layer has a top conductive element on the surface thereof adjacent to the insulation bottom layer and opposite to the bottom conductive element. The spacer is located between the insulation bottom layer and flexible insulation top layer to separate the insulation bottom layer and flexible insulation top layer. As different pressures could result in different impedance variations on the contact area between the top conductive element and bottom conductive element, the pressure being applied can be derived from the impedance variation. The invention can measure pressure without using piezoresistive material to reduce cost. | 04-25-2013 |
| 20130118266 | SUBMERSIBLE ELECTRONIC SENSOR - The invention provides a submersible, electrically-powered sensor assembly that incorporates a flexible seal assembly having operative and non-operative electrical traces of a uniform vertical height for carrying clamping loads and avoiding signal loss along a signal carrying trace due to compression of the flex seal, minimizing fluid leak paths between two flange surfaces, providing stability in compression, and enabling electrical communication in an environment having an operating fluid. | 05-16-2013 |
| 20130125660 | REMOTE FIRE EXTINGUISHER STATION INSPECTION - An apparatus for remote inspection of fire extinguishers at one or a system of fire extinguisher stations includes, e.g., at each fire extinguisher station: a detector for lack of presence of a fire extinguisher in its installed position at the fire extinguisher station; a detector for out-of-range pressure of contents of the fire extinguisher at the fire extinguisher station; a detector for an obstruction to viewing of or access to the fire extinguisher at the fire extinguisher station; and a device for transmission of inspection report information from the fire extinguisher station to a remote central station. | 05-23-2013 |
| 073754000 | Semiconductor | 19 |
| 20100107774 | ULTRA-MINIATURE MULTI-HOLE PROBES HAVING HIGH FREQUENCY, HIGH TEMPERATURE RESPONSES - Embodiments of an ultra miniature pressure probe are disclosed. The pressure probe can include a probe body, a plurality of transducer ports, and a plurality of transducers. The probe body can be a longitudinal tubular body having a front conical end. The transducer ports can be disposed about the front end of the body. The transducers can be leadless SOI transducers, each having an active deflection area associated with a semiconductor substrate. Each transducer can be in communication with a header for supporting the transducer. The header can have a thickness substantially less than the probe diameter and can comprise a flange about an edge of the header. Each of the plurality of transducer ports can define an aperture and a counter-bore, wherein each transducer is positionable in an associated transducer port with the flange of the header of the transducer being welded to the counter-bore of the transducer port. | 05-06-2010 |
| 20100064818 | METHOD OF FLIP CHIP MOUNTING PRESSURE SENSOR DIES TO SUBSTRATES AND PRESSURE SENSORS FORMED THEREBY - A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor. | 03-18-2010 |
| 20090235754 | ENCAPSULATION COMPOSITION FOR PRESSURE SIGNAL TRANSMISSION AND SENSOR - An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing. | 09-24-2009 |
| 20120285254 | PRESSURE SENSOR - A pressure sensor includes: a pressure conversion unit and a signal processing circuit installed in a semiconductor substrate. The pressure conversion unit includes: a diaphragm formed by partially thinning the semiconductor substrate; and a plurality of piezo resistive elements formed on a surface of the diaphragm. The signal processing circuit is constituted by a complementary metal-oxide semiconductor (CMOS) integrated circuit formed in a p-type conductive region disposed around the diaphragm on the surface of the semiconductor substrate, and the piezo resistive elements are provided by forming an n-type conductive region in the p-type conductive region on the surface of the diaphragm by diffusion of n-type impurities and diffusing p-type impurities in the n-type conductive region. | 11-15-2012 |
| 20090165564 | SEMICONDUCTOR PRESSURE SENSOR AND DATA PROCESSING DEVICE - For example, to adjust an offset of a pressure sensor, there are provided an external resistor RE and an internal resistor circuit that is connected to both ends of RE and formed in a semiconductor chip such as a processor. The internal resistor circuit includes N pieces of internal resistors RI connected in series between both ends of RE, and (N+1) pieces of switches selecting one of voltages of respective nodes of the serial resistors and outputs the same as a signal. RE has a high absolute value precision of, e.g., several ten ohms to several hundred ohms, and RI has a high relative value precision of, e.g., several kilo-ohms. Therefore, an offset adjustment range is decided at a high absolute value precision mainly by RE, and with regard to the arrangement resolution, a high precision can be obtained along with the relative value precision of the RI. | 07-02-2009 |
| 20080264174 | Pressure sensor with sensing chip protected by protective material - A pressure sensor is provided, which includes a case, a sensing chip located in the case for detecting pressure, and a protective material for covering and protecting the sensing chip in the case. Corners of the case, which are in contact with the protective material are each formed into a rounded shape. A curvature radius of each of the corners is adapted to be 0.5 mm or more. | 10-30-2008 |
| 20110005326 | SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE - A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate. | 01-13-2011 |
| 20090199648 | TRANSISTOR-TYPE PRESSURE SENSOR AND METHOD FOR FABRICATING THE SAME - A transistor-type pressure sensor is provided, having an upper and a lower substrates, a source/drain formed on the lower substrate and separated from each other, a channel layer formed between and on the source/drain, a dielectric layer and a gate. The gate is substantially formed between the source and the drain. The surface of the gate, being in contact with the dielectric layer, has a stepped surface profile, so that the channel length/width ratio can be changed due to the pressure sensed by the pressure sensor. | 08-13-2009 |
| 20090255344 | Pressure sensor module and method for manufacturing the same - For a pressure sensor module comprising a printed circuit board and a pressure cell, wherein the pressure cell has a measuring opening, and the pressure cell is encapsulated by injection molding compound in such a manner that the measuring opening is kept open, the pressure cell, as viewed from the measuring opening, is attached on the rear side of the printed circuit board. The printed circuit board has a recess in the area of the measuring opening, and the injection molding compound encloses the attachment area of the pressure cell on the printed circuit board. Thereby, the use of different adhesives, also soft adhesives, for the connection of the pressure cell with the printed circuit board is possible without this attachment area being attacked by the surrounding media. | 10-15-2009 |
| 20090314096 | PRESSURE SENSOR DEVICE - A semiconductor pressure sensor for a pressure sensor device has a pressure detection element which includes a membrane made of semiconductor material, particularly silicon. The sensor includes a support having a three-dimensional body passed through by a detection passage. The detection element is made integral with a first end face of the three-dimensional body, substantially at a respective end of the detection passage. The support is configured to serve the function of a mechanical and/or hydraulic adaptor or interface, with the aim of mounting the sensor into a pressure sensor device, particularly to allow mounting the pressure sensor into a pressure sensor device configured for mounting a sensor of the type referred to as monolithic or ceramic. | 12-24-2009 |
| 20100313667 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR TESTING - Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection. | 12-16-2010 |
| 20110000304 | PRESSURE SENSOR AND MANUFACTURING METHOD - A semiconductor substrate, provided with a differential pressure diaphragm, and a glass pedestal, which is provided on the bottom side of the semiconductor substrate, are provided, wherein: the bottom surface of the semiconductor substrate and the top surface of the glass pedestal are bonded together; a pressure introducing hole is formed in the glass pedestal so as to pass through the glass pedestal, connecting between the top and bottom surfaces of the glass pedestal; the pressure introducing hole is formed with a first diameter for the pressure introducing hole at the bottom surface of the glass pedestal from the bottom surface of the glass pedestal to a first position; and a second diameter for the pressure introducing hole at the top surface of the glass pedestal is larger than the first diameter; where a metal thin film layer is deposited on the bottom surface of the glass pedestal. | 01-06-2011 |
| 20100058876 | SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR - A semiconductor device includes a first cavity within a semiconductor substrate and a second cavity within the semiconductor substrate. The second cavity is open to an atmosphere and defines a first lamella between the first cavity and the second cavity. The semiconductor device includes a first sense element configured for sensing a pressure on the first lamella. | 03-11-2010 |
| 20090126499 | Ultra miniature multi-hole probes having high frequency response - A pressure probe includes a longitudinal tubular housing symmetrically disposed about a central axis and having an ultra miniature conical front end and an opened back end. A plurality of aperture ports having an opening are disposed about the front end. A plurality of ultra small leadless transducers has a central active deflecting area in a semiconductor substrate, and a layer of oxide on a bottom surface. At least one sensor network is disposed within the active area on the oxide layer. A glass contact wafer is bonded to the non-deflecting portion of sensing network and has a number of apertures surrounding the active area suitable for interconnection with header. A header encloses each transducer and is of a shape and size to be positioned in an associated aperture port of the probe housing. At least one lead is coupled to a header pin extending from bottom of the aperture and directed through the bottom opening into the hollow of the probe housing. | 05-21-2009 |
| 20100175483 | PRESSURE SENSOR DISCONNECT DETECTION FOR A BLOOD TREATMENT DEVICE - A system is disclosed for detecting an electrical sensor, the system includes a sensor signal processing circuit further comprising an input port to receive a connector including the output signal lines of the sensor, a resistor connected to the output signal line of said input port, wherein the resistor is connected to a predetermined voltage; a sensor circuit having a connector adapted to connect to the connector, wherein the sensor circuit has a resistance substantially less than the pull-resistor, and the sensor signal processing circuit detects an unconnected sensor based on the voltage applied by the resistor. | 07-15-2010 |
| 20120144923 | SEMICONDUCTOR PRESSURE SENSOR - A semiconductor pressure sensor includes: a case; a pressure inlet port through which a measurement target fluid is introduced into the case; an atmosphere inlet port through which atmosphere is introduced; and a sensor chip configured to measure the pressure of the fluid with respect to atmospheric pressure. The pressure inlet port and the atmosphere inlet port are disposed on the same surface side of the case. The pressure inlet port is communicated with the inside of the case. | 06-14-2012 |
| 20120152029 | SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a semiconductor pressure sensor, a multilayer structure including a polysilicon diaphragm, a polysilicon gauge resistor formed on a side of a space which is to serve as a vacuum chamber below the polysilicon diaphragm, and a group of insulating films containing the polysilicon diaphragm and the polysilicon gauge resistor and having an etching solution introduction hole in contact with a sacrificial layer is formed on the sacrificial layer. Then, an etching solution is supplied through the etching solution introduction hole and the sacrificial layer is etched with the etching solution, to thereby obtain a diaphragm body formed of the multilayer structure, which functions on the vacuum chamber, and a surface of a silicon substrate below a first opening of a first insulating film is etched to thereby form the space which is to serve as the vacuum chamber and a diaphragm stopper disposed in the space, protruding toward near the center of the diaphragm body. With this structure, it is possible to provide a technique for suppressing the variation in the performance of a semiconductor pressure sensor when the semiconductor pressure sensor is downsized. | 06-21-2012 |
| 20120118068 | Semiconductor Pressure Sensor, Pressure Sensor Apparatus, Electronic Equipment, and Method of Manufacturing Semiconductor Pressure Sensor - A semiconductor pressure sensor ( | 05-17-2012 |
| 20080229840 | Semiconductor device - A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip. | 09-25-2008 |
| 073755000 | Pirani type | 4 |
| 20090056464 | PIRANI PRESSURE GAUGE - A Pirani pressure gauge comprises a heated, coiled sensing element formed from an alloy comprising platinum and iridium, for example, 90/10 Pt/Ir. This enables the gauge to be deployed in a corrosive environment and reliably measure pressures as low as 10 | 03-05-2009 |
| 20100154554 | MICRO-THERMISTOR GAS PRESSURE SENSOR - An apparatus and method precisely measure gas pressure over a large dynamic range and with good immunity to temperature fluctuations, encompassing applications such as gas sensing, bolometer imaging and industrial process monitoring. The micro-thermistor gas pressure sensor assembly includes a suspended platform micro-thermistor sensor device exposed to the gas pressure of a given atmospheric environment, an electrical readout circuit connected to the suspended platform micro-thermistor sensor device, wherein the suspended platform micro-thermistor sensor device acts as a variable electrical resistance in the readout electrical circuit, a binary-wave voltage source connected to the suspended platform micro-thermistor sensor device, and an ohmmeter. | 06-24-2010 |
| 20100132475 | PIRANI VACUUM GAUGE - A pirani vacuum gauge in which a response to a rapid pressure rise is improved and restrictions on a mounting direction of a container on a chamber to be measured for pressure are eliminated is provided. The Pirani vacuum gauge includes a heat filament of metal wire and a support unit for supporting the heat filament in a container, wherein a gas pressure is measured based on an amount of heat conducted away from the heat filament by gas molecules colliding with the heat filament, characterized in that a body of the container is filled with metal material, but a first cylindrical bore and a second cylindrical bore extend through the body, the heat filament being inserted into the first cylindrical bore and the support unit being inserted into the second cylindrical bore. | 06-03-2010 |
| 20090199649 | PIRANI VACUUM GAUGE - A Pirani vacuum gauge in which a response to a rapid pressure rise is improved and restrictions on a mounting direction of a container on a chamber to be measured for pressure are eliminated is provided. The Pirani vacuum gauge includes a heat filament of metal wire and a support unit for supporting the heat filament in a container, wherein a gas pressure is measured based on an amount of heat conducted away from the heat filament by gas molecules colliding with the heat filament, characterized in that a body of the container is filled with metal material, but a first cylindrical bore and a second cylindrical bore extend through the body, the heat filament being inserted into the first cylindrical bore and the support unit being inserted into the second cylindrical bore. | 08-13-2009 |
