Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Capacitive sensor

Subclass of:

073 - Measuring and testing

073488000 - SPEED, VELOCITY, OR ACCELERATION

073514010 - Acceleration determination utilizing inertial element

073514160 - Specific type of electric sensor or specific type of magnetic sensor

Patent class list (only not empty are listed)

Deeper subclasses:

Entries
DocumentTitleDate
20130042686INERTIA SENSING APPARATUS - The invention relates to an inertia sensing apparatus, comprising a substrate, a first and second inertia sensing elements. The first inertia sensing element is connected to a substrate and has a containment space. The second inertia sensing element is connected to the substrate and is disposed in the containment space of the first inertia sensing element, wherein the first inertia sensing element and the second sensing element are connected to the substrate, and the first inertia sensing element and the second sensing element are not connected to each other, the first inertia sensing element and the second sensing element individually and independently detect at least one inertia motion of the inertia sensing apparatus. Therefore, the invention is based on the second inertia sensing element disposed in the containment space of the first inertia sensing element and they individually and independently detect at least one inertia motion of the inertia sensing apparatus, so as to decrease an area of the inertia sensing apparatus, thus reducing the chip size and prevent the two inertia sensing elements from coupling to result in decreasing the sensing precision.02-21-2013
20110179870DUAL-AXIS ACCELERATION DETECTION ELEMENT - A dual-axis acceleration detection element comprises a first detection element, a second detection element and a stationary unit. The first detection element is movable relative to the second detection element. The second detection element is movable relative to the stationary unit. The relative movements take place on different axes to detect acceleration on two different axes. The first detection element and the second detection element are interposed by corresponding detection electrodes, and the second detection element and the stationary unit also are interposed by other corresponding detection electrodes. Hence when the relative movements occur among the first and second detection elements and the stationary unit, overlapped areas of the detection electrodes change to generate and output a capacitance difference, thereby acceleration alteration can be detected.07-28-2011
20130074599CAPACITIVE ACCELEROMETER - A capacitive accelerometer includes a substrate and a first semiconductor layer. The first semiconductor layer is disposed on the substrate and includes a first mass, first and second support bases, first and second elastic members, and first and second comb capacitor sets. The first and second support bases are disposed at positions corresponding to first and second axes respectively. The first elastic member is connected to the first mass and the first support base in a manner of bending back and forth perpendicular to the first axis. The second elastic member is connected to the first mass and the second support base in a manner of bending back and forth perpendicular to the second axis. The first and second comb capacitor sets are disposed at positions corresponding to the second and first axes respectively and connected to the first mass. The first axis is perpendicular to the second axis.03-28-2013
20110192229MICRO ELECTRICAL MECHANICAL MAGNETIC FIELD SENSOR UTILIZING MODIFIED INERTIAL ELEMENTS - A micro electrical-mechanical system (MEMS) is disclosed. The MEMS includes a substrate, a first pivot extending upwardly from the substrate, a first lever arm with a first longitudinal axis extending above the substrate and pivotably mounted to the first pivot for pivoting about a first pivot axis, a first capacitor layer formed on the substrate at a location beneath a first capacitor portion of the first lever arm, a second capacitor layer formed on the substrate at a location beneath a second capacitor portion of the first lever arm, wherein the first pivot supports the first lever arm at a location between the first capacitor portion and the second capacitor portion along the first longitudinal axis, and a first conductor member extending across the first longitudinal axis and spaced apart from the first pivot axis.08-11-2011
20080257045Sensor device for detecting physical quantity - A sensor device includes a sensor chip, a circuit chip, a casing, a first adhesive member disposed between the sensor chip and the circuit chip, and a second adhesive member disposed between the circuit chip and the casing. The first adhesive member has an area smaller than that of the sensor chip and a distance between the first adhesive member and an outer peripheral edge of the sensor chip becomes a minimum at a portion adjacent to a centerline of the sensor chip. The second adhesive member has an area smaller than that of the circuit chip and a distance between the second adhesive member and an outer peripheral edge of the circuit chip becomes a minimum at a portion adjacent to a centerline of the circuit chip.10-23-2008
20100116056Micro-Electro-Mechanical System Device, Out-Of-Plane Sensor and Method for Making Micro-Electro-Mechanical System Device - The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a substrate with at least one opening; and a membrane supported on the substrate, the membrane including at least two thin segments and a thick segment connected together, wherein the two thin segments are not at the same level, and the thick segment is formed by a plurality of layers including at least two metal layers and a via layer, such that the membrane has a curve cross section.05-13-2010
20100116055MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE, OUT-OF-PLANE SENSOR AND METHOD FOR MAKING MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE - The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.05-13-2010
20100107764ACCELERATION SENSOR - An acceleration sensor includes a mount section arranged to be fixed to an object, a flexible section coupled to the mount section, a weight coupled to the mount section via the flexible section, and first and second opposed electrode unit. The first opposed electrode unit includes a first electrode placed on the weight and a second electrode spaced away from and facing the first electrode, and provides a first capacitance. The second opposed electrode unit includes a third electrode placed on the weight and a fourth electrode spaced away from and facing the third electrode, and provides a second capacitance. The first and third electrodes are arranged along a first direction. The second and fourth electrodes are spaced away from and face the first and third electrodes along a second direction perpendicular to the first direction, respectively. A component of an acceleration along the first direction applied to the object is detected based on the first and second capacitances. A control voltage is applied to the first and second opposed electrode units. The control voltage is changed when both of the first capacitance and the second capacitance simultaneously increase or decrease. This acceleration sensor detects the acceleration accurately.05-06-2010
20100107763TRANSDUCER WITH DECOUPLED SENSING IN MUTUALLY ORTHOGONAL DIRECTIONS - A microelectromechanical systems (MEMS) transducer (05-06-2010
20090308159Micromechanical Acceleration Sensor - With a sensor having a centrifugal mass in the form of a balancing rocker which is deflectable in the z-direction, to avoid asymmetrical clipping in the case of lever arms of the balancing rocker that are of different lengths, a limit-stop device, which shortens the possible deflection, is provided on the side of the shorter lever arm, or, in the case of lever arms of equal length, at least one additional mass disposed on the side on one lever arm is provided, so that the maximum mechanical deflection of the centrifugal mass is of equal magnitude on both sides of the asymmetrical balancing rocker.12-17-2009
20130055813ACCELEROMETER - An accelerometer can include a support structure having situated thereupon a stator electrode array including multiple stator electrodes (e.g., A, B, and C); and a proof mass positioned parallel to the stator electrode array and capable of displacement parallel thereto. A translator electrode array facing the stator electrode array can comprise multiple translator electrodes (e.g., a and b) can be situated on the proof mass. Further included is a drive circuitry to apply drive voltages to six capacitances formed by the stator and translator electrodes. The total force exerted on the proof mass by the drive voltages is held constant at about zero.03-07-2013
20130068023Motion Sensor Device and Methods for Forming the Same - A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.03-21-2013
20110011182CAPACITIVE ACCELERATION SENSOR - A capacitive acceleration sensor includes an acceleration sensor moving part and an acceleration sensor stationary part together forming a capacitor for detecting acceleration, a sealing structure hermetically enclosing but not contacting the acceleration sensor moving part, and at least one support pillar enclosed by but not directly contacted by the acceleration sensor moving part, both ends of the at least one support pillar being in contact with inside walls of the sealing structure. The acceleration sensor moving part is electrically connected to the at least one support pillar.01-20-2011
20130061674METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR - A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.03-14-2013
20090007669CAPACITIVE ACCELERATION SENSOR - A capacitive acceleration sensor is provided in which sticking of a mass body, made of silicon, to a first sealing substrate or a second sealing substrate, made of glass, is prevented. The capacitive acceleration sensor, including a first sealing substrate and a second sealing substrate each made of glass, is characterized by containing therebetween: an acceleration detecting portion, made of silicon, including a mass body 01-08-2009
20090007668Multi-axis capacitive transducer and manufacturing method for producing it - A capacitive transducer a first part containing a first set of capacitor plates and a second part relatively movable in a plane to the first part. The second part contains a second set of capacitor plates. Both sets of capacitor plates are built on a substrate, wherein the capacitor plates form a plurality of capacitors. The second part is relatively movable in all six degrees of freedom. One set of the plurality of capacitors measures displacements in a plane and a second set of the plurality capacitors measures displacements perpendicular to the plane.01-08-2009
20100089159ELECTRONIC STATOR END WINDING ACCELEROMETER SENSOR - An insulated accelerometer assembly is provided for attachment to a vibrated component. A base has a portion for engagement and connection with the vibrated component and to transmit vibration. An accelerometer senses vibration and is located at least partially within the base. A housing at least partially encloses the accelerometer and inhibits voltage discharge, corona damage, and voltage tracking on the accelerometer. The housing is made of an insulating material and has an interior for the accelerometer. The housing has a plurality of raised fins on the exterior. A mounting cap also inhibits voltage discharge, corona damage, and voltage tracking and secures the housing. The mounting cap is made of insulating material and has an exterior that includes a plurality of raised fins. A cable has an electrically conductive wire and has a shield to inhibit electrical noise.04-15-2010
20110132089Inertial Sensor - In order to provide an inertial sensor such as an acceleration sensor which can be downsized and in which a high SNR can be obtained as having a plurality of measurement ranges, an inertial sensor for detecting an inertial force of acceleration based on an electrostatic capacitance change of a detecting unit includes a plurality of detecting units D06-09-2011
20100139401SENSOR FOR DETECTING ACCELERATION - Exemplary embodiments relate to a sensor for detecting an acceleration acting on the sensor, having: a substrate, a mass unit, which acts as an inert mass in the event of the presence of an acceleration, a fixing structure, wherein the mass unit is articulated on the substrate in such a way that at least one pivot axis is defined, about which the mass unit can perform a rotation relative to the substrate as a result of an acceleration acting on the sensor, and the mass unit has an interial center of gravity, which is at a distance from the respective pivot axis, and at least one detection unit, with which a change in position between the mass unit and the substrate may be detected. The detection unit is arranged with respect to the mass unit in such a way that a deformation of the mass unit cannot be transferred to the detection unit.06-10-2010
20100000324ACCELERATION SENSOR AND METHOD OF FABRICATING IT - Provided is an acceleration sensor that has high detection sensitivity and that can enhance production efficiency. The acceleration sensor (01-07-2010
20110296915MULTI-AXIS CAPACITIVE ACCELEROMETER - A accelerometer includes a base, a pair of fixed sensing blocks anchored to the base, a plurality of elastic linkages connected to the base, and a movable sensing block sandwiched between the pair of fixed sensing blocks and suspended in the base by the elastic linkages for moving either along a first or a second axes or shifting along a third axes. Each fixed sensing block defines four fixed sensing sections and each fixed sensing section sets in space with respect to the other fixed sensing sections. A projection of each fixed sensing section along a third axes exceeds the movable sensing block in a direction of the first and second axis, respectively.12-08-2011
20110290023ELEMENT STRUCTURE, INERTIA SENSOR, AND ELECTRONIC DEVICE - The manufacturing of an element structure including two or more sensor element is to be facilitated. An element structure includes a first substrate including a first support layer and a first sensor element disposed on the first support layer and a second substrate including a second support layer and a second sensor element disposed on the second support layer, wherein the second substrate is disposed on the first substrate via a spacer member in a state in which the first sensor element and the second sensor element are disposed to face each other.12-01-2011
20090145230Displacement Measurement apparatus for microstructure and displcement measurement method thereof - A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.06-11-2009
20090145229DECELEROMETER FORMED BY LEVITATING A SUBSTRATE INTO EQUILIBRIUM - Coulomb islands are charged to create Coulomb forces which are applied between a first and second substrate. The Coulomb islands are used to levitate the first substrate over the second substrate into an equilibrium position. A processing unit monitors the values of capacitors formed between the substrates to provide feedback information to maintain the first substrate in this equilibrium position. The first substrate can be an accelerometer that can be used to calculate the direction and magnitude of a deceleration. The processing unit sends the digital information to a bus coupled to a plurality of air bags. The digital information identifies the appropriate air bags that need to be enabled to minimize the impact of a crash. Vertical changes in acceleration can also be detected making this invention applicable for flight vehicles.06-11-2009
20120024064TECHNIQUES FOR APPROXIMATING A DIFFERENCE BETWEEN TWO CAPACITANCES - A system includes a capacitance adjustment module and a control module. The capacitance adjustment module is configured to connect one or more of N capacitors in parallel with one of a first and second capacitance. The control module identifies the smaller of the first and second capacitances and identifies the larger of the first and second capacitances. Subsequently, the control module, during each of M iterations, instructs the capacitance adjustment module to connect at least one of the N capacitors across a set of nodes in parallel with the smaller identified capacitance, and determines whether the capacitance associated with the set of nodes is greater than the larger identified capacitance. After the M iterations, the control module approximates the difference between the first and second capacitances based on which of the N capacitors are connected across the nodes. M and N are integers greater than or equal to 1.02-02-2012
20090095081Semiconductor device - A semiconductor device according to the present invention includes a semiconductor substrate and an MEMS sensor provided on the semiconductor substrate. The MEMS sensor includes a vibratory first electrode and a plurality of second electrodes opposed to the first electrode at an interval.04-16-2009
20090095080CAPACITIVE DETECTOR - A capacitive detector that accurately detects a physical quantity with a simple circuitry. An acceleration sensor includes a capacitance converter, an amplifier, a detection element unit, and a signal controller. The capacitor converter, which includes an operational amplifier, a switch, and a capacitor, converts a change in differential capacitance, which is obtained by fixed electrodes and a movable electrode, to voltage. The operational amplifier has a non-inversion input terminal, which receives a reference voltage. The signal controller supplies voltage that is applied to the fixed electrodes of the detection element unit. The signal controller includes a bias supply unit, which applies a predetermined bias voltage to the fixed electrodes during a test mode.04-16-2009
20100122579MULTI-AXIS CAPACITIVE ACCELEROMETER - A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.05-20-2010
20110197678ACCELERATION SENSOR HAVING AN ELECTRODE BRIDGE - A capacitive micromechanical acceleration sensor has a substrate and a micromechanical functional layer situated above the substrate. A seismic mass, a suspension and fixed electrodes are situated in the micromechanical functional layer. The fixed electrodes are electrically connected to one another on a first and second side, respectively, of the suspension using buried conductor tracks. The fixed electrodes are connected to one another between the first and second side of the suspension using first and second conductors in the micromechanical functional layer.08-18-2011
20100077861Capacitive Accelerometer - Substantially hemispherical concave first and second surfaces of substantially equal radius and surface area face each other about a proof mass supported for movement between the surfaces. The surfaces and proof mass have electrically conductive portions allowing assessment of differential capacitance for measurement of acceleration. Electrically conductive portions are connected to a conditioning circuit in an embodiment.04-01-2010
20090277267In-plane sensor and method for making same - According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.11-12-2009
20110203373ACCELERATION SENSOR - An acceleration sensor includes a substrate, and a plurality of acceleration detection units supported by the substrate. Each of the plurality of acceleration detection units has a torsion beam supported by the substrate and distorted about a torsion axis line; a detection frame supported by the torsion beam so as to be rotatable about the torsion axis line; a detection electrode formed on the substrate so as to face the detection frame; a link beam supported by the detection frame at a position on an axis line deviated from the torsion axis line when seen in plane; and an inertia mass body supported by the link beam so as to be displaceable in a thickness direction of the substrate. The plurality of acceleration detection units include first and second acceleration detection units. The first and second acceleration detection units are disposed side by side along a direction of the first torsion axis line. Thereby, a highly accurate acceleration sensor that suppresses a vibration with a high frequency and a high acceleration can be obtained.08-25-2011
20100281980PHYSICAL QUANTITY SENSOR - A physical quantity sensor includes a support substrate, anchor portions fixed to a top surface of the support substrate, a movable portion positioned above the support substrate and supported by the anchor portions with support portions provided therebetween such that the movable portion is movable in a height direction, and detection portions for detecting a displacement of the movable portion. The support portions include beam portions provided between the movable portion and the anchor portions such that spring portions are provided between the beam portions and each of the movable portion and the anchor portions, the beam portions having a rigidity higher than a rigidity of the spring portions. The movable portion translates in the height direction owing to twisting of the spring portions and displacements in the height direction of distal ends of the beam portions, the movable portion being supported at the distal end.11-11-2010
20090266164CAPACITIVE SENSOR - A capacitive sensor includes a fixed electrode and a movable electrode that is movably supported by an anchor portion through a beam portion. The fixed electrode and the movable electrode are opposed to each other with a gap interposed therebetween, thereby constituting a detecting unit. A capacitance suitable for a size of the gap is detected to detect a predetermined physical value. At least one of an end of the beam portion connected to the anchor portion and an end of the beam portion connected to the movable electrode is provided with a stress moderating unit that moderates a stress.10-29-2009
20080282802Fabrication process and package design for use in a micro-machined seismometer or other device - An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material. A new method of soldering the capacitive plate to the suspension plate is also disclosed.11-20-2008
20110005319CAPACITIVE MEMS GYROSCOPE AND METHOD OF MAKING THE SAME - A capacitive MEMS gyroscope and a method of making the same are disclosed. The capacitive MEMS gyroscope comprises a semiconductor substrate and a suspended composite wheel. The semiconductor substrate comprises: a read-out circuitry; at least one bottom electrode disposed on top of the semiconductor substrate, centered to a rotation axis and electrically connected to the read-out circuitry; at least one contact pad disposed on the top of the semiconductor substrate, electrically to the read-out circuitry; the composite wheel, partially made of dielectric film and configured in suspension above and in parallel to the semiconductor substrate and centered to the rotation axis, comprises: at least one top electrode disposed on the composite wheel, aligned vertically with one of the bottom electrode, electrically to the read-out circuitry; at least one circumferential spring centered to the rotation axis, bridging the composite wheel and the semiconductor substrate and consisting of at least one top electrode which electrically connects the top electrode to the contact pad on the semiconductor substrate. The gyroscope of the present invention formed by depositing and photolithographically patterning has miniaturized size, low tolerance scope and high sensing accuracy, as well as low fabrication costs owing to special bulk MEMS fabrication device unnecessary.01-13-2011
20090139330INTEGRATED MEMS 3D MULTI-SENSOR - Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. The of sense the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.06-04-2009
20090049911Integrated micro electro-mechanical system and manufacturing method thereof - In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate, a technology capable of manufacturing the integrated MEMS without using a special process different from the normal manufacturing technology of a semiconductor integrated circuit is provided. A MEMS structure is formed together with an integrated circuit by using the CMOS integrated circuit process. For example, when forming an acceleration sensor, a structure composed of a movable mass, an elastic beam and a fixed beam is formed by using the CMOS interconnect technology. Thereafter, an interlayer dielectric and the like are etched by using the CMOS process to form a cavity. Then, fine holes used in the etching are sealed with a dielectric.02-26-2009
20110138913VERTICAL ACCELEROMETER - Provided is a vertical accelerometer for measuring acceleration applied perpendicular to a substrate to increase sensitivity thereof. The vertical accelerometer includes a substrate, and a plurality of unit vertical accelerometers, each having a detection mass disposed on the substrate to be rotated by acceleration applied perpendicular to the substrate, and a detection electrode formed at the detection mass. Here, the unit vertical accelerometers are provided to be in contact with the detection electrodes to detect the acceleration through variation in capacitance due to variation in area in which the contacted detection electrodes overlaps each other.06-16-2011
20090241668Acceleration sensor package - The acceleration sensor package comprises an acceleration sensor chip having a pad forming surface formed with a plurality of pads at at least one edge portion, a control chip having a terminal forming surface formed with connecting terminals, and a case body having a storage concave section for accommodating the acceleration sensor chip and the control chip therein and bottom face terminals respectively disposed at positions corresponding to the pads at a bottom face of the storage concave section. The pads of the acceleration sensor chip are respectively electrically connected to the bottom face terminals of the case body. A back surface located on the side opposite to the terminal forming surface, of the control chip is mated with its corresponding back surface located on the side of the pad forming surface, of the acceleration sensor chip.10-01-2009
20090100932ACCELERATION SENSOR - An acceleration sensor having a mass which is movably supported outside its center of gravity, first electrodes on the mass and second electrodes located at a distance therefrom forming a capacitive sensor in order to determine a change in position of the mass as a function of time. At least one spring element which generates a restoring force when the mass is deflected from its neutral position is provided on the side of the mass facing the capacitive sensor. The mass may be obtained by being exposed from a material layer, and the mass is surrounded, at least at its side faces, by this material.04-23-2009
20090100931Physical quantity sensor - A physical quantity sensor has a weight mass movable in a detection direction. Auxiliary capacitors are formed at both side ends of the weight mass in a non-detection direction by auxiliary movable electrodes and auxiliary fixed electrodes, respectively. When capacitances of the auxiliary capacitors change due to movement of the weight mass in the non-detection direction, a limiter circuit feedback-controls voltages applied to the auxiliary fixed electrodes to maintain the position of the weight mass unchanged. Thus, the weight mass is limited from moving in the non-detection direction thereby to improve accuracy in detection of the movement in the detection direction.04-23-2009
20110138914ACCELERATION SENSOR - An acceleration sensor includes: a rectangular moving electrode; a pair of beams which connect to centers of two opposite sides of the moving electrode, and support the moving electrode freely swingably; and first and second fixed electrodes which are provided on one side and other side of a boundary line, respectively, and are arranged to be opposed to a front surface of the moving electrode at a predetermined interval. A straight line that connects the pair of beams to each other is taken as the boundary line. Then, on a back surface of the moving electrode, first and second recessed portions are formed on one side of the boundary line and the other side thereof, respectively.06-16-2011
20090107238Pendulous accelerometer with balanced gas damping - A pendulous capacitive accelerometer including a substrate having a substantially planar upper surface with an electrode section, and a sensing plate having a central anchor portion supported on the upper surface of the substrate to define a hinge axis. The sensing plate includes a solid proof mass on a first side of the central anchor portion and a substantially hollow proof mass on a second side of the central anchor portion, providing for reduced overall chip size and balanced gas damping. The solid proof mass has a first lower surface with a first electrode element thereon, and the substantially hollow proof mass has a second lower surface with a second electrode element thereon. Both the solid proof mass and the hollow proof mass have the same capacitive sensing area. The sensing plate rotates about the hinge axis relative to the upper surface of the substrate in response to an acceleration.04-30-2009
20090199637Physical sensor - A physical sensor includes: a substrate having a silicon layer, an oxide film and a support layer; and a sensor portion having movable and fixed electrodes and a lower electrode. The movable electrode is supported by a beam on the support layer. The fixed electrode faces the movable electrode. The lower electrode is disposed on the support layer and faces the movable electrode. The physical sensor detects horizontal physical quantity based on a capacitance between the movable and fixed electrodes, and vertical physical quantity based on a capacitance between the movable and lower electrodes. The beam includes vertical and horizontal beams. The thickness of the vertical beam is smaller than the thickness of the horizontal beam.08-13-2009
20090241667ACCELEROMETER - An accelerometer includes a substrate having a surface and a movable electrode. The movable electrode is mounted on the surface of the substrate and movable along an axis substantially parallel to the surface of the substrate in response to acceleration. A light-permeable region is defined in the movable electrode. A plurality of photosensitive regions and a plurality of non-photosensitive regions are defined in the surface of the substrate. The photosensitive regions and the non-photosensitive regions are spatially separated. The light-permeable region overlies only a portion of one of the non-photosensitive regions when at rest, and the light-permeable region overlies a portion of at least one of the photosensitive regions when the accelerometer is subjected to acceleration, such that the corresponding photosensitive region generates an output current.10-01-2009
20090241666PIEZOELECTRIC SENSOR DYNAMIC RANGE IMPROVEMENT - A MEMS piezoelectric sensor comprises a plurality of capacitors some of which may be used for sensing and others used for feedback. The capacitors may be switched to connect or disconnect selected capacitors from the sensor. Embodiments convert a two port sensor into a four port sensor without significant changes in hardware design and improve SNR and correct for offset and out-of-axis errors due to process mismatch and variations.10-01-2009
20100147076Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricating the same - Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.06-17-2010
20100186511ACCELERATION SENSOR - A semiconductor device includes a semiconductor substrate and a semiconductor mass element configured to move in response to an applied acceleration. The mass element is defined by trenches etched into the semiconductor substrate and a cavity below the mass element. The semiconductor device includes a sensing element configured to sense movement of the mass element and a complementary metal-oxide-semiconductor (CMOS) circuit formed on the substrate.07-29-2010
20090314085MICROMECHANICAL ACCELERATION SENSOR HAVING AN OPEN SEISMIC MASS - A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.12-24-2009
201002124253-Axis Accelerometer With Gap-Closing Capacitive Electrodes - Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer.08-26-2010
20100212426ACCELERATION SENSOR AND ELECTRONIC DEVICE - An acceleration sensor includes: a support member; a fixed electrode provided on the support member; a movable unit; a movable electrode provided on the movable unit and disposed opposed to the fixed electrode to generate capacity; and a projection extending from the opposed surface of at least either the fixed electrode or the movable electrode in one direction within the surface.08-26-2010
20100242602PROCESS FOR FABRICATING A CAPACITANCE TYPE TRI-AXIAL ACCELEROMETER - A process for fabricating a capacitance type tri-axial accelerometer comprises of preparing a wafer having an upper layer, an intermediate layer and a lower layer, etching the lower layer of the wafer to form an isolated proof mass having a core and four segments extending from the core, etching the upper layer of the wafer to form a suspension and four separating plates, etching away a portion of the intermediate layer located between the four segments of the proof mass and the plates of the upper layer, and disposing an electrical conducting means to pass through the intermediate layer from the suspension to the core of the proof mass.09-30-2010
20100242603VERTICALLY INTEGRATED MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING - A microelectromechanical systems (MEMS) sensor device (09-30-2010
20100122578MICROMECHANICAL COMPONENT - A micromechanical component for detecting an acceleration. The component includes a conductive layer having a first and a second electrode and a rotatable flywheel mass in the form of a rocker having a first and a second lever arm. The first lever arm is situated opposite the first electrode, and the second lever arm is situated opposite the second electrode. The first lever arm has a first hole structure having a number of first cut-outs, and the second lever arm has a second hole structure having a number of second cut-outs. The first and the second lever arm have different masses. The component is characterized by the fact that the outer dimensions of the first and second lever arms correspond, and the first hole structure of the first lever arm differs from the second hole structure of the second lever arm. Furthermore, a method for manufacturing such a micromechanical component is provided.05-20-2010
20110056297MICROMECHANICAL SYSTEM FOR DETECTING AN ACCELERATION - A micromechanical system for detecting an acceleration includes a substrate, a rocker-like mass structure having a first lever arm and a diametrically opposed second lever arm, the lever arms being situated tiltably at a distance to the substrate and about an axis of rotation to the substrate, and first and second electrodes being provided on the substrate. Each electrode is diametrically opposed to a lever arm and each lever arm includes a section extending from the axis of rotation which is located between the electrodes above an intermediate space. The two sections have different masses.03-10-2011
20110056296PHYSICAL QUANTITY SENSOR, MANUFACTURING METHOD OF PHYSICAL QUANTITY SENSOR, AND ELECTRONIC APPARATUS - A physical quantity sensor includes: a fixing part; an elastic deforming part; a movable weight part coupled to the fixing part via the elastic deforming part; a fixed arm part extended from the fixing part; and a movable arm part extended from the movable weight part and provided to face the fixed arm part via a gap, wherein the fixed arm part and the movable arm part are laminated structures containing insulating layers and conductor layers, the fixed arm part has a first side surface conductor film provided on a side surface of the fixed arm part and a first connecting electrode part using the conductor layer and electrically connected to the first side surface conductor film, and the movable arm part has a second side surface conductor film provided on aside surface opposed to the first side surface conductor film and a second connecting electrode part using the conductor layer and electrically connected to the second side surface conductor film.03-10-2011
20110056295Micromechanical system - A micromechanical system includes a first movable element, which is connected to a substrate via a first spring element, and a second movable element, which is connected to the substrate via a second spring element. The first movable element and the second movable element are movable in relation to the substrate independent of one another. Furthermore, the first movable element and the second movable element are situated one above the other in at least some sections in a direction perpendicular to the substrate surface.03-10-2011
20090320596ACCELERATION SENSOR WITH COMB-SHAPED ELECTRODES - A micromechanical capacitive acceleration sensor having at least one seismic mass that is connected to a substrate so as to be capable of deflection, at least one electrode connected fixedly to the substrate, and at least one electrode connected to the seismic mass, the at least one electrode connected fixedly to the substrate and the at least one electrode connected to the seismic mass being realized as comb-shaped electrodes having lamellae that run parallel to the direction of deflection of the seismic mass, the lamellae of the two comb-shaped electrodes overlapping partially in the resting state.12-31-2009
20090183570Micromachined cross-differential dual-axis accelerometer - Micromachined accelerometer having one or more proof masses (07-23-2009
20090139331Accelerometer - A 3-dimensional MEMS accelerometer fabricated on a single planar substrate deploys three co-planar sensor elements. Each sensor element is a capacitive device deploying a static electrode plate and a parallel dynamic electrode plate supported by a torsion beam. The dynamic electrode plate also includes a proof mass portion that displaces the center of gravity to below the plane of the plate. Two of the sensor elements are identical and rotated by 90 degrees on the planar substrate. The third capacitive sensor has two pairs of adjacent capacitive plates, each one having a dynamic electrode plate is suspended by a torsion beam. The proof mass on each dynamic electrode plates however is offset laterally from the torsion axis in opposite directions from the other plates to cancel the their respective capacitance charges induced by in-plane acceleration. However, this arrangement also adds the capacitive change induced by acceleration orthogonal to the planar substrate.06-04-2009
20100288047MEMS SENSOR AND ELECTRONIC APPARATUS - A MEMS sensor includes: a supporting portion; a movable weight portion; a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable; a first fixed electrode portion protruding from the supporting portion; and a first movable electrode portion protruding from the movable weight portion and disposed so as to face the first fixed electrode portion, wherein the movable weight portion is formed by stacking a conductive layer and an insulating layer in a first direction, plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer, the conductive layer is connected to the first movable electrode portion, and one of the first fixed electrode portion and the first movable electrode portion has a first electrode portion and a second electrode portion in the first direction.11-18-2010
20130139595Three-Dimensional Micro-Electro-Mechanical-System Sensor - The present invention discloses a three-dimensional micro-electro-mechanical-system sensor. The sensor includes movable first electrodes, plural movable second electrodes, plural fixed third electrodes, and plural fixed fourth electrodes. The first electrodes and their adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and their adjacent fourth electrodes form at least one third capacitor. The capacitance change of the first capacitor reflects the displacement of the proof mass along a first axis, the capacitance change of the second capacitor reflects the displacement of the proof mass along a second axis, and the capacitance change of the third capacitor reflects the displacement of the proof mass along a third axis. The first, second, and third axes define a three-dimensional coordinate system.06-06-2013
20100313660MEMS DEVICE AND METHOD OF FABRICATING THE MEMS DEVICE - A MEMS device capable of detecting external force with high sensitivity is disclosed. The MEMS device includes: first and second support portions arranged on a substrate; a first movable portion that has a first movable electrode, is fixed to the first support portion at a position apart from the first movable electrode, and is displaced by the external force; and a second movable portion that has a second movable electrode arranged opposite to the first movable electrode, is fixed to the second support portion at a position apart from the second movable electrode, and is displaced by the external force, wherein the first movable portion is fixed to the first support portion between a gravitational center position of the first movable portion and an opposite position where the first movable electrode and the second movable electrode are opposed to each other, and the second movable portion is fixed to the second support portion at a position opposed to the opposite position while sandwiching a gravitational center position of the second movable portion therebetween.12-16-2010
20110023604MICROELECTROMECHANICAL Z-AXIS DETECTION STRUCTURE WITH LOW THERMAL DRIFTS - A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.02-03-2011
20090064785Integrated micro electro-mechanical system and manufacturing method thereof - In the manufacturing technology of an integrated MEMS in which a semiconductor integrated circuit (CMOS or the like) and a micro machine are monolithically integrated on a semiconductor substrate, a technology capable of manufacturing the integrated MEMS without using a special process different from the normal manufacturing technology of a semiconductor integrated circuit is provided. A MEMS structure is formed together with an integrated circuit by using the CMOS integrated circuit process. For example, when forming an acceleration sensor, a structure composed of a movable mass, an elastic beam and a fixed beam is formed by using the CMOS interconnect technology. Thereafter, an interlayer dielectric and the like are etched by using the CMOS process to form a cavity. Then, fine holes used in the etching are sealed with a dielectric.03-12-2009
20090064784MICROMACHINED SENSORS - The present invention provides a micromachined sensor. The micromachined sensor includes a proof mass movable with respect to a substrate. The proof mass includes a first portion, a second portion separated from the first portion and a third portion connecting the first portion to the second portion. A frame is positioned on the substrate and encloses the proof mass. A plurality of springs connects the proof mass to the frame. A plurality of first and second electrodes extends from the frame. A plurality of third electrodes extends from the first portion of the proof mass and is interleaved with the first electrodes. A plurality of fourth electrodes extends from the second portion of the proof mass and is interleaved with the second electrodes. A first support beam extends from the frame to the area between the first and second portions of the proof mass. A plurality of seventh and eighth electrodes extends from the first support beam. A plurality of fifth electrodes extends from the first portion of the proof mass and is interleaved with the seventh electrodes. A plurality of sixth electrodes extends from the second portion of the proof mass and is interleaved with the eighth electrodes03-12-2009
20110079081Manufacturing method for a micromechanical component and micromechanical component - A manufacturing method for a micromechanical component having the following steps: at least partially covering a first side of a substrate using a first insulating layer, forming at least one actuator plate electrode, at least one contact terminal, and at least one spring component from at least one first conductive material, covering at least the at least one actuator plate electrode, the at least one contact terminal, and the at least one spring component using a second insulating layer, forming at least one stator plate electrode from at least one second conductive material, forming at least one first trench in the substrate for producing a displaceable mass and a frame of a mounting, etching being performed in a first direction, and removing at least one partial mass of the second insulating layer, which is between the at least one actuator plate electrode and the at least one stator plate electrode, etching being performed in a second direction. Also described is a related micromechanical component.04-07-2011
20100132467HIGH-SENSITIVITY Z-AXIS VIBRATION SENSOR AND METHOD OF FABRICATING THE SAME - Provided is a high-sensitivity MEMS-type z-axis vibration sensor, which may sense z-axis vibration by differentially shifting an electric capacitance between a doped upper silicon layer and an upper electrode from positive to negative or vice versa when center mass of a doped polysilicon layer is moved due to z-axis vibration. Particularly, since a part of the doped upper silicon layer is additionally connected to the center mass of the doped polysilicon layer, and thus an error made by the center mass of the doped polysilicon layer is minimized, it may sensitively respond to weak vibration of low frequency such as seismic waves. Accordingly, since the high-sensitivity MEMS-type z-axis vibration sensor sensitively responds to a small amount of vibration in a low frequency band, it can be applied to a seismograph sensing seismic waves of low frequency which have a very small amount of vibration and a low vibration speed. Moreover, since the high-sensitivity MEMS-type z-axis vibration sensor has a higher vibration sensibility than MEMS-type z-axis vibration sensor of the same size, it can be useful in electronic devices which are gradually decreasing in size.06-03-2010
20100132466OPERATING METHOD AND CIRCUIT ARRANGEMENT FOR A CAPACITIVE MICROMECHANICAL SENSOR WITH ANALOG RESET - A method and a switch arrangement for operating a micromechanical capacitive sensor having at least one and at most two fixed electrodes and one differential capacitor formed by a movable central electrode that can be deflected by an external force, wherein the deflection of the electrode is measured. A fraction of the force acting on the central electrode, corresponding to the electrostatic restorative force, is compensated. Under closed-loop operation, a selection signal is influenced by a regulator supplementing a restore crosstalk signal so that the created capacitive restorative force acts in a compensatory manner against deflection of the central electrode.06-03-2010
20100223997ACCELEROMETER WITH OVER-TRAVEL STOP STRUCTURE - An accelerometer (09-09-2010
20100223998CAPACITIVE DISPLACEMENT TRANSDUCER - A broadband weak-motion inertial sensor includes a frame, a movable inertial mass, a forcing transducer for keeping the inertial mass stationary relative to the frame during operation, and a flexure for suspending the movable mass in the frame. Two or more closely spaced, substantially parallel capacitor plates, at least one attached to the frame, and one attached to the movable inertial mass, form a capacitive displacement transducer. The capacitor plates have a plurality of apertures with dimensions and arrangement chosen to simultaneously minimize damping induced thermal noise and give a high spatial efficiency. In an implementation, three capacitor plates are provided. The capacitor plates each have a same hexagonal pattern of circular holes; the holes are aligned on all included capacitor plates. Radius and spacing of the holes are dictated by a relationship that determines the minimum damping per unit capacitively effective area for a desired spatial efficiency, gap height and capacitor plate thickness. In an implementation, the capacitor plates are made of a printed circuit board material which, through etching of the thin conductive layer, can be mounted directly to a conductive frame and conductive inertial mass without the use of non-conductive spacers.09-09-2010
20100058864MULTI-AXIS CAPACITIVE ACCELEROMETER - A multi-axis capacitive accelerometer is disclosed. A first mass is disposed and held by an anchor supported by a substrate, wherein the first mass is asymmetrically suspended on the anchor by means of two cantilevers, so that the first mass rotates about a rotation axis, for sensing the acceleration in a first direction perpendicular to the substrate. A second mass is disposed in the first mass and suspended on the first mass by means of a set of springs to sense the acceleration in a second direction parallel to the substrate. Furthermore, a third mass can be disposed in the second mass, wherein the third mass is suspended on the second mass by means of another set of springs to sense the acceleration in a third direction. The first direction, the second direction and the third direction are mutually orthogonal to each other.03-11-2010
20110100126Capacitance Sensor - A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode.05-05-2011
20110030475SENSOR ELEMENT AND METHOD FOR OPERATING A SENSOR ELEMENT - A sensor element, in particular a multichannel acceleration sensor having a substrate and a seismic mass, the sensor element having a detecting element for detecting a deflection of the seismic mass relative to the substrate, and the sensor element having an excitation element for exciting a deflection of the seismic mass perpendicular to the main extension plane.02-10-2011
20100294040CAPACITIVE SENSOR AND 3-AXIS GYROSCOPIC SENSOR UTILIZING CAPACITIVE SENSORS - An exemplary capacitive sensor includes a casing, a fixed electrode, a spring, a moveable electrode, and a capacitance measuring circuit. The casing includes a base and a cylindrical wall. The fixed electrode is disposed on the cylindrical wall and includes a fixed arm section and at least one fixed prong section, wherein at least one fixed prong section is curved and extends outwards from one side of the fixed arm section. The spring is disposed on the base. The moveable electrode is attached to the spring and includes a movable electrode section and at least one movable prong section, wherein at least one movable prong section is curved and extends outwards from one side of the movable arm section, and the movable prong section and the fixed prong section oppose each other. The capacitance measuring circuit is configured for measuring the capacitance between the fixed electrode and the movable electrode.11-25-2010
20100275688CARRIER MODULATING ACCELEROMETER - An accelerometer module for measuring acceleration in a stabilized platform system includes a power supply configured to accept an input AC reference signal and to generate a regulated DC signal and a reference signal in phase with the input AC reference signal; an accelerometer configured to receive the regulated DC signal from said power supply and to generate an output signal in response to an external force acting on the accelerometer module and an analog multiplier unit configured to receive the output signal from the accelerometer and the reference signal from the power supply, and to modulate the reference signal with the output signal so as to output a modulated accelerometer signal. A method for servicing a stabilized platform system comprising is also provided.11-04-2010
20090126490INERTIA SENSOR AND INERTIA DETECTOR DEVICE - A detector device includes a drive circuit for outputting a drive pulse signal for displacing the variable block, a detection pulse signal applying unit by which the variable capacitance elements and the fixed capacitance element whose one end is connected in common are respectively applied, at their other ends, with detection pulse signals with a plurality of phases each having a predetermined phase difference at a timing synchronized with the drive pulse signal, and an inertia detection unit for detecting a difference in capacitance value between the variable capacitance elements to which the detection pulse signal having the phase difference is applied, or between the fixed capacitance element and the variable capacitance element, and detecting the applied inertial force based on the difference.05-21-2009
20090126491INERTIAL SENSOR - Techniques capable of suppressing fixation between a movable electrode and a fixed electrode in an inertial sensor and preventing the inertial sensor from malfunctioning are provided. The movable electrode, the fixed electrode provided so as to face the movable electrode, a peripheral conductor facing both the movable electrode and the fixed electrode, and a demodulation circuit and a voltage adjustment circuit which adjust the electric potential of the peripheral conductor so that the electric potential of the peripheral conductor becomes the same as the electric potential of the movable electrode are provided, and a change in the capacitance between the movable electrode and the fixed electrode is detected.05-21-2009
20090107239Semiconductor device - A semiconductor device according to the present invention includes a semiconductor substrate and an MEMS sensor provided on the semiconductor substrate. The MEMS sensor includes a first electrode having a plurality of first interdigital portions aligned in a prescribed direction X at an interval, a second electrode, having a plurality of second interdigital portions aligned in the direction X at an interval, so arranged that the second interdigital portions are opposed to the first interdigital portions in the direction X respectively, a third electrode having a plurality of third interdigital portions aligned in a direction Y orthogonal the direction X at an interval, a fourth electrode, having a plurality of fourth interdigital portions aligned in the direction Y at an interval, so arranged that the fourth interdigital portions are opposed to the third interdigital portions in the direction Y respectively, and a fifth electrode opposed to the first electrode, the second electrode, the third electrode and the fourth electrode in a direction Z orthogonal to the direction X and the direction Y.04-30-2009
20100300204ACCELERATION SENSOR - A micromechanical acceleration sensor includes a substrate with a substrate surface arranged in one plane, a first counter-electrode arranged on the substrate surface, a second counter-electrode arranged on the substrate surface, and a rocking mass arranged above the first counter-electrode and the second counter-electrode. The rocking mass is in this case connected to the substrate via a torsion spring which permits tilting of the rocking mass about an axis of rotation. Further provided are a first compensation counter-electrode arranged on the substrate surface and a second compensation counter-electrode arranged on the substrate surface. In addition, a first compensation electrode is arranged above the first compensation counter-electrode and a second compensation electrode is arranged above the second compensation counter-electrode.12-02-2010
20110162453MASS FOR USE IN A MICRO-ELECTRO-MECHANICAL-SYSTEM SENSOR AND 3-DIMENSIONAL MICRO-ELECTRO-MECHANICAL-SYSTEM SENSOR USING SAME - A 3-dimensional MEMS sensor, comprising: a first axis fixed electrode; a second axis fixed electrode; a third axis fixed electrode; a movable electrode frame including a first axis movable electrode, a second axis movable electrode, a third axis movable electrode, and a connection part connecting the movable electrodes, wherein the first axis movable electrode and the first axis fixed electrode form a first capacitor along the first axis, the second axis movable electrode and the second axis fixed electrode form a second capacitor along the second axis, and the third axis movable electrode and the third axis fixed electrode form a third capacitor along the third axis, the connection part including a center mass, wherein the center mass is at least connected with one of the first, second and third axis movable electrodes, and has an outer periphery and a first interconnecting segment connecting at least two adjacent sides of the outer periphery; at least one spring connecting with the movable electrode frame; and at least one anchor connecting with the spring, wherein the first, second and third axes are not parallel to one another such that they define a 3-dimensional coordinate system.07-07-2011
20120167685IN-PLANE CAPACITIVE MEMS ACCELEROMETER - A system for determining in-plane acceleration of an object. The system includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass—formed from a single piece of material—movably positioned a predetermined distance above the substrate. The proof mass includes a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.07-05-2012
20110252887Electrical Damping for Isolation and Control of Mems Sensors Experiencing High-G Launch - A system and method for damping undesired motion of a suspended structure that is connected by one or more flexures that have an elastic limit to a fixed structure in a MEMS sensor, wherein the undesired motion is caused by a high G acceleration pulse. At one or more of before and during a high G acceleration pulse that could move the suspended structure beyond the elastic limit of a flexure, the system actively generates an attractive force that acts to counteract motion of the suspended structure caused by the high G acceleration pulse, so as to maintain motion of the suspended structure within the elastic limit of the flexure.10-20-2011
20100116054MEMS-BASED CAPACITIVE SENSOR FOR USE IN A SEISMIC ACQUISITION SYSTEM - An apparatus includes a seismic acquisition system that includes an accelerometer. The accelerometer includes a capacitive MEMS-based sensor, a controller and a charge amplifier. The sensor includes a proof mass; input terminals to receive a first signal; and an output terminal that is electrically connected to the proof mass to provide a second signal. The first signal, which is regulated by the controller, controls an equilibrium restoring force for the sensor and causes the sensor to provide the second signal. The charge amplifier provides a third signal, which is indicative of a position of the proof mass. The charge amplifier has an input terminal to continuously receive the second signal during a time in which the first signal controls the equilibrium restoring force and causes the sensor to provide the second signal05-13-2010
20090308160VERTICAL ACCELERATION MEASURING APPARATUS - Provided is a vertical acceleration measuring apparatus including a substrate; a plumb that is separated from the substrate to operate; a plurality of movable electrode plates that are formed at an upper end of the plumb in a predetermined direction; a movable electrode plate supporting portion that is formed at the upper end of the plumb and supports the movable electrode plates; a fixed body that is formed at an upper end of the substrate; a fixed electrode plate supporting portion that is coupled to the fixed body adjacent to the upper end of the plumb; a plurality of fixed electrode plates that are supported by the fixed electrode plate supporting portion and arranged to face the movable electrode plates in parallel; and a connection spring that connects the fixed body and the movable electrode plate supporting portion.12-17-2009
20090293617SEMICONDUCTOR DEVICE WITH REDUCED SENSITIVITY TO PACKAGE STRESS - A microelectromechanical systems (MEMS) sensor (12-03-2009
20090293616 CAPACITIVE SENSOR WITH STRESS RELIEF THAT COMPENSATES FOR PACKAGE STRESS - A microelectromechanical systems (MEMS) capacitive sensor (12-03-2009
20120204643MEMS DEVICES EXHIBITING LINEAR CHARACTERISTICS - A micro electro mechanical system device has a first subassembly having sensor element including a coupler, and a second subassembly including a comb drive. The comb drive having stator plates and rotor plates and the coupler configured to displace the rotor plates relative to the stator plates providing a variable capacitance dependent on the displacement of the rotor plate.08-16-2012
20100024553MICROMECHANICAL Z-SENSOR - A micromechanical z-sensor includes a sensitivity, a torsion spring, and a seismic additional mass, the torsion spring having a spring width, and the seismic additional mass including webs having a web width. The web width is selected smaller than the spring width.02-04-2010
20110296917MICROMECHANICAL COMPONENT HAVING A TEST STRUCTURE FOR DETERMINING THE LAYER THICKNESS OF A SPACER LAYER AND METHOD FOR MANUFACTURING SUCH A TEST STRUCTURE - A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.12-08-2011
20120036931Method and Apparatus to Test an Accelerometer - A technique includes using an accelerometer to provide an output signal indicative of an acceleration experienced by a movable mass of a sensor of the accelerometer. The technique includes testing the accelerometer, and the testing includes using a closed loop including the sensor to provide the output signal of the accelerometer; injecting a test signal into the loop between an output terminal of the sensor and an output terminal of the accelerometer; and indicating a performance of the accelerometer based on a response of the accelerometer to the injection of the test signal.02-16-2012
20080314147VERTICALLY INTEGRATED 3-AXIS MEMS ACCELEROMETER WITH ELECTRONICS - A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.12-25-2008
20120031186INERTIAL SENSOR AND METHOD FOR MANUFACTURING AN INERTIAL SENSOR - An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.02-09-2012
20090031809SYMMETRICAL DIFFERENTIAL CAPACITIVE SENSOR AND METHOD OF MAKING SAME - A symmetrical differential capacitive sensor (02-05-2009
20100011860Micromechanical sensor element, method for manufacturing a micromechanical sensor element and method for operating a micromechanical sensor element - A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.01-21-2010
20120042729MEMS accelerometer with enhanced structural strength - The present invention discloses a MEMS (Micro-Electro-Mechanical System, MEMS) accelerator with enhanced structural strength. The MEMS accelerator is located on a substrate, and it includes: multiple springs, wherein each spring includes: an anchor, fixed on the substrate; an extensible part, which has a fixed end fixed on the anchor, and a free end floating above the substrate; a proof mass, connected to the free ends of the springs; and multiple in-plane sense electrodes, wherein the extensible part is folded back and forth to form a substantially polygon shape as a whole, in which the fixed end is located within the middle one third length of one side of the substantially polygon shape, and the free end is located within the middle one third length of an opposite side of the substantially polygon shape.02-23-2012
20120000287MICROELECTROMECHANICAL THREE-AXIS CAPACITIVE ACCELEROMETER - A micromechanical structure for a MEMS three-axis capacitive accelerometer is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.01-05-2012
20110154899MICROMECHANICAL COMPONENT AND METHOD FOR OPERATING A MICROMECHANICAL COMPONENT - A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.06-30-2011
20120204642MEMS Device Having Variable Gap Width and Method of Manufacture - A MEMS device (08-16-2012
20120152020INERTIAL SENSOR - Disclosed herein is an inertial sensor. There is provided an inertial sensor 06-21-2012
20120125103Z-AXIS CAPACITIVE ACCELEROMETER - A Z-axis capacitive accelerometer includes a substrate, a capacitance sensing plate, a proof mass and at least one pair of spring beams. The capacitance sensing plate includes two symmetrical sense areas to create differential capacitive measurement. A decoupling structure separates the proof mass and the capacitance sensing plate and their rotational motions from each other. In the proposed Z axis capacitive accelerometer, the distance of the capacitance sensing plate relative to its rotation axis is considerably increased, thereby effectively enhancing the sensitivity when measuring the Z-axis acceleration.05-24-2012
20120125105ACCELERATION AND ANGULAR VELOCITY DETECTION DEVICE - An acceleration and angular velocity detection device includes a first oscillation element and a second oscillation element that are movable in a direction along a first axis and a direction along a second axis, an oscillating portion oscillating the first and second oscillation elements in opposite directions along the first axis, a first detection capacitance element and a second detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the first oscillation element, a third detection capacitance element and a fourth detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the second oscillation element, a charge amplifier having a fully differential structure, and a detecting portion detecting an acceleration and an angular velocity of a rotation.05-24-2012
20120125104ANCHOR-TILT CANCELLING ACCELEROMETER - Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.05-24-2012
20120125102ACCELERATION SENSOR - An acceleration sensor includes a driver circuit for outputting a biased alternating-current (AC) voltage having a variable bias voltage, a detector element having a capacitance provided between a fixed electrode and a movable electrode changing depending on acceleration applied to the detector element, a current-voltage (C/V) converter for converting a current output from the movable electrode of the detector element into a voltage and outputting the voltage, a first operational amplifier outputting a voltage depending on the input voltage, a synchronous demodulator for synchronously detecting the voltage output from the first operational amplifier, and a defect detector for outputting a defect detection signal when the defect detector determines that the voltage output from the first operational amplifier is out of a predetermined range while the biased AC voltage output from the driver circuit is a predetermined voltage. This acceleration sensor can have a small size.05-24-2012
20120160029ACCELERATION SENSOR - An acceleration sensor of the present invention comprises a first mass body which is held by first beams and can be displaced by acceleration, fixed electrodes which are so arranged as to convert the displacement of the first mass body into the quantity of electricity, and a displaceability changing member for changing the displaceability of the first mass body when the displacement of the first mass body exceeds a predetermined range.06-28-2012
20100206076SENSOR ELEMENT - A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass.08-19-2010
20110179871TILT SENSOR UNIT - Acceleration sensors and a microcomputer are mounted on a sensor mounting board. At this time, the accelerations sensors are arranged so that, even in the case where any detection axes of the acceleration sensors is made horizontal, the other detection axes of the acceleration sensors cannot be horizontal. Then, the microcomputer selects an acceleration sensor in which detection accuracy is the best from among the acceleration sensors, and arithmetically operates a tilt angle of a tilt sensor unit based on an output signal of the selected acceleration sensor.07-28-2011
20100050771CAPACITIVE ACCELEROMETER - A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.03-04-2010
20100024554TRIAXIAL ACCELERATION SENSOR - An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis.02-04-2010
20090056448BIDIRECTIONAL READOUT CIRCUIT FOR DETECTING DIRECTION AND AMPLITUDE OF CAPACITIVE MEMS ACCELEROMETERS - There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.03-05-2009
20120186347MEMS SENSOR WITH DUAL PROOF MASSES - A microelectromechanical systems (MEMS) sensor (07-26-2012
20120186346MEMS SENSOR WITH FOLDED TORSION SPRINGS - A microelectromechanical systems (MEMS) sensor (07-26-2012
20120227494ACCELERATION SENSOR - An acceleration sensor includes a weight portion having a recess section and a solid section, beam portions, a movable electrode provided on the opposite surface of the weight portion from an open surface of the recess section to extend over the recess section and the solid section, a first fixed electrode arranged at the opposite side of the movable electrode from the recess section, and a second fixed electrode arranged at the opposite side of the movable electrode from the solid section. The acceleration sensor detects acceleration using a change in capacitance between the movable electrode and the fixed electrodes caused by rotation of the weight portion. The beam portions are shifted toward the recess section such that an angle between a perpendicular line extending from a gravity center position of the weight portion to the rotation axis and a surface of the movable electrode becomes equal to 45 degrees.09-13-2012
20080302184ACCELERATION SENSOR AND FABRICATION METHOD THEREOF - First and second semiconductor layers are attached to each other with an insulation layer sandwiched therebetween. An acceleration sensor device is formed in the first semiconductor layer. A control device for controlling the acceleration sensor device is formed on the second semiconductor layer. Through holes are formed in the second semiconductor layer, and an insulation layer is formed to cover the wall surfaces of the through holes. Through interconnections are formed within the through holes for electrically connecting the acceleration sensor device and the control device to each other. Accordingly, it is possible to obtain an acceleration sensor having excellent detection accuracy while having a reduced size, and a fabrication method thereof.12-11-2008
20110120221MEMS SENSOR, METHOD OF MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS - A MEMS sensor includes: a fixed portion; an elastically deformable portion; a movable weight portion coupled to the fixed portion via the elastically deformable portion, the movable weight portion including a coupling portion; a plurality of fixed electrode portions arranged in a first direction and protruding in a second direction perpendicular to the first direction; and a plurality of movable electrode portions protruding from the coupling portion in the second direction, provided to respectively face the plurality of fixed electrode portions, and arranged in the first direction, wherein the movable weight portion has an additional weight portion connected to the coupling portion.05-26-2011
20120297879INERTIAL SENSOR - An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.11-29-2012
20120318060CAPACITANCE DETECTOR FOR ACCELEROMETER AND GYROSCOPE AND ACCELEROMETER AND GYROSCOPE WITH CAPACITANCE DETECTOR - A capacitance-to-frequency converter is configured to convert a difference between first and second capacitances produced of a teeter-totter capacitive transducer as a result of a rotational force being applied to the teeter-totter capacitive transducer to a first signal having a first frequency that is a function of the rotational force, and to convert a sum of the first and second capacitances produced as a result of an acceleration force to a second signal having a second frequency that is a function of the acceleration force. The capacitance-to-frequency converter includes a first oscillator having a first oscillator frequency that changes in response to a change in the first capacitance; a second oscillator having a second oscillator frequency that changes in response to a change in the second capacitance; and a mixer having first and second mixer inputs connected outputs of the first and second oscillators.12-20-2012
20110265568Stacked lateral overlap transducer (slot) based three-axis accelerometer - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.11-03-2011
20120285245SENSING APPARATUS - A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.11-15-2012
20120240679TETHERED, LEVITATED-MASS ACCELEROMETER - The present invention has three aspects: 1. A concept for a force-balanced accelerometer in which the proof mass is levitated inside an enclosure and has an electrically conductive path to the enclosure. 2. A planar Implementation of the invention. 3. Implementation of the invention using MEMS (Micro Electro Mechanical System) technology.09-27-2012
20080216572Physical quantity sensor - A physical quantity sensor includes: a substrate; a movable element; two fixed elements; a carrier wave application element for applying two carrier waves to the fixed elements; a signal application element for applying a middle voltage to the movable element; and a detection circuit for detecting a physical quantity. The detection circuit executes a first self diagnosis process when the signal application element further applies a first self diagnosis signal to the movable element. The first self diagnosis signal has a first frequency for obtaining a resonant magnification equal to or larger than 1.1 times with respect to a resonant frequency of the movable element, so that the movable element is resonated and almost contacts or press contacts one fixed element. The detection circuit determines whether a sticking phenomenon occurs when the signal application element applies the first self diagnosis signal.09-11-2008
20080196501Semiconductor sensor and manufacturing method therefor - A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.08-21-2008
20110219877MICROMECHANICAL SENSOR - A micromechanical sensor having at least one movably mounted measuring element which is opposite at least one stationary electrode, the electrode being situated in a first plane, and being contacted by at least one printed conductor track which is situated in a second plane. A third plane is located between the first plane and the second plane, the third plane including an electrically conductive material.09-15-2011
20110219876MOTION DETECTION USING CAPACITOR HAVING DIFFERENT WORK FUNCTION MATERIALS - An apparatus for detecting mechanical displacement in a micro-electromechanical system includes a capacitor having first and second plates spaced from one another, the first and second plates having different work functions and being electrically connected with each other. The capacitor plates are movable with respect to one another such that a spacing between the plates changes in response to a force. A current through the capacitor represents a rate of change in the spacing between the plates at a given time.09-15-2011
20130152686System and Method of Reducing Noise in a MEMS Device - A MEMS system has an input for receiving a plurality of frequency division multiplexed variable capacitance signals, and a readout node electrically coupled with the input. Each variable capacitance signal is produced by a variable capacitor and has data relating to movement of microstructure associated with that variable capacitor. Moreover, each variable capacitance signal is produced by a variable capacitor that is different from the variable capacitor producing any of the other variable capacitance signals. The system further has a mixer electrically coupled with the readout node, and an output electrically coupled with the mixer. The mixer is configured to substantially continuously receive the plural variable capacitance signals. In addition, the output has an output interface for delivering the plurality of variable capacitance signals in parallel. The signals at the output should represent real time signals, as compared to stale sample and hold signals used in prior art systems.06-20-2013
20110296916ACCELEROMETER - A accelerometer includes a substrate define a stationary electrode thereon, a first moveable mass defining a conductive-layer thereon facing the stationary electrode, a plurality of first elastic elements coupled with a peripheral side of the first moveable mass, a first fixed element surrounding the first moveable mass and fixedly attached to the substrate, a plurality of first fixed electrodes extending outwardly from the first fixed element, a second moveable mass surrounding the first fixed electrodes, a plurality of first moveable electrodes extending inwardly from the second moveable mass toward the first fixed to element and parallel to the first fixed electrodes, respectively, a plurality of second elastic elements coupled with a peripheral side of the second moveable mass, and a second fixed element surrounding the second moveable mass and fixedly attached to the substrate.12-08-2011
20110303010MEMS THREE-AXIS ACCELEROMETER - A MEMS three-axis accelerometer includes a silicon substrate, a first electrode and a second electrode etched in the same silicon substrate. The first electrode is constituted by a mobile mass fitted with a plurality of mobile fingers extending laterally. The second electrode is composed of two conductive parts located on two opposite sides of the mobile mass. Each conductive part comprises a plurality of fixed fingers formed parallel to the mobile fingers. Each mobile finger is positioned between two contiguous fixed fingers to cooperatively form a microstructure with interdigital combs. The mobile mass is connected to the substrate by a spring.12-15-2011
20110303009TRI-AXIS ACCELEROMETER - An tri-axis accelerometer is disclosed. The tri-axis accelerometer includes a mass, a first group of capacitance, a third group of capacitance being neighbor to the first group of capacitance. The mass defines an upper surface, a lower surface parallel to the upper surface and a side wall connecting the upper surface and the lower surface. The first group of capacitance includes a first movable electrode and the third group of capacitance includes a third movable electrode. The first movable electrode is perpendicular to the third movable electrode.12-15-2011
20130186201Micro-Electro-Mechanical System Device, Out-of-Plane Sensor and Method for Making Micro-Electro-Mechanical System Device - The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.07-25-2013
20130192371ACCELERATOR SENSOR STRUCTURE AND USE THEREOF - A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.08-01-2013
20120055249PHYSICAL QUANTITY SENSOR - A physical quantity sensor includes an anchor portion, a movable portion displaceable in a height direction, a supporting portion rotatably connected to the anchor portion and the movable portion, and a detection portion. The supporting portion includes a first connection arm connecting the anchor portion and the movable portion to each other and a leg portion extending from the anchor portion in a direction opposite to the first connection arm, the leg portion being displaced in a direction opposite to a displacement direction of the movable portion when the supporting portion rotates. A stopper surface is disposed at a position to which a distal end portion of the leg portion is contactable when the leg portion is displaced in the direction opposite to the displacement direction of the movable portion. Displacement of the movable portion is restricted when the distal end portion of the leg portion contacts the stopper surface.03-08-2012
20120085169THREE PHASE CAPACITANCE-BASED SENSING - Various systems and methods for sensing are provided. In one embodiment, a sensing system is provided that includes a first electrode array disposed on a proof mass, and a second electrode array disposed on a planar surface of a support structure. The proof mass is attached to the support structure via a compliant coupling such that the first electrode array is positioned substantially parallel to and faces the second electrode array and the proof mass is capable of displacement relative to the support structure. The first electrode array includes a plurality of first patterns of electrodes and the second electrode array includes a plurality of second patterns of electrodes. The sensing system further includes circuitry configured to provide an input voltage to each of the second patterns of electrodes to produce an electrical null position for the first electrode array.04-12-2012

Patent applications in class Capacitive sensor