Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Thermoelectric; e.g., peltier effect

Subclass of:

062 - Refrigeration

062300100 - USING ELECTRICAL OR MAGNETIC EFFECT

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
062300300 Heat pump, selective heating and cooling 89
062300600 Interior of enclosure cooled; e.g., refrigerator 84
062300700 Including specific circuitry or heat exchanger material 52
062300400 Including dehumidifying and condensate handling 13
062300500 Made with flexible heat exchanger material; e.g., blanket, wearing apparel, etc. 6
Entries
DocumentTitleDate
20090100841SYSTEM FOR RECLAMATION OF WASTE THERMAL ENERGY - A waste heat reclamation device absorbs waste heat from a heat generating object. A thermocouple loop is used to convert thermal energy into electrical energy which may be utilized to provide electrical power to an electronic device that is the heat generating object. The invention increases the efficiency of electronic devices such as computer processing units.04-23-2009
20130042633TEMPERATURE CONTROL APPARATUS AND METHOD FOR THERMOREGULATION OF A HUMAN BODY - The present invention relates to a temperature control apparatus for thermoregulation of a human body, comprising at least one radiation absorption panel with at least one surface capable of absorbing thermal radiation, and a cooling device provided to cool said panel. A sleeping accommodation for a human being comprises a lying area and such a temperature control apparatus, wherein the radiation absorption panel is disposed adjacent to the lying are or above the lying area. The invention further relates to a corresponding method for thermoregulation of the human body.02-21-2013
20090158750NOVEL SOLID STATE THERMOVOLTAIC DEVICE FOR ISOTHERMAL POWER GENERATION AND COOLING - A method of addressing environmental warming and generating power, including positioning a device for generating electrical power in an environment experiencing undesired warming, the device including an active layer for intrinsically transducing thermal energy into electrical energy, and first and second electrical contacts having different work functions, respective first and second electron diffusion barriers positioned between and in electric communication with the active layer and respective first and second electrical contacts, wherein thermally generated electrons are separated to the first electrical contact and holes are separated to the second electrical contact, and wherein the introduction of thermal energy to the active layer increases the rate at which electron-hole pairs are formed, connecting the device to a power grid, removing thermal energy from the environment via conversion into electricity, and supplying electricity to the power grid, wherein the removal of thermal energy from the environment operates to cool the environment.06-25-2009
20130074520Multi Mode Thermal Management System and Methods - An apparatus comprises a cooling structure that includes a first plate, a second plate separated from the first plate, and an inlet adapted to receive a cooling fluid. The apparatus also comprises a first cooling portion coupled to the first plate and adapted to maintain a first temperature. The apparatus also includes a second cooling portion coupled to the second plate and adapted to maintain a second temperature, different from the first temperature.03-28-2013
20120174598METHOD FOR THE COMMENCEMENT DIAGNOSIS OF A HEAT STORAGE MATERIAL - The invention relates to a method and an apparatus for detecting the point in time of commencement of crystallization of a heat storage material (07-12-2012
20100024436DOWNHOLE TOOL WITH THIN FILM THERMOELECTRIC COOLING - Apparatus and method for cooling a die downhole are disclosed. The apparatus includes a semiconductor die. A thin film thermoelectric cooling layer is coupled to the semiconductor die, and a heat spreader is coupled to the thin film thermoelectric cooling layer. A method includes conveying a semiconductor die on a carrier to a downhole location and activating a thin film thermoelectric cooling layer coupled to the semiconductor die. The method further includes pumping heat from the thin film thermoelectric cooling layer using a heat spreader coupled to the thin film thermoelectric cooling layer.02-04-2010
20090120104THERMAL BLOCK UNIT - The present invention discloses a thermal block unit for thermal treatment of samples comprising temperature regulating units, temperature sensors for measuring temperature at different locations of the thermal block unit, a converter for converting signals from the temperature sensors into digital signals and a thermal block interface for communicating with an instrument.05-14-2009
20090308081INTEGRATED CIRCUIT CHIP COOLING USING MAGNETOHYDRODYNAMICS AND RECYCLED POWER - Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.12-17-2009
20130067935Heterogeneous Electrocaloric Effect Heat Transfer - Technologies are generally described herein for electrocaloric effect heat transfer devices, methods, and systems that may be effective to efficiently transfer and distribute thermal energy from a heat source utilizing coordinated application of out of phase electric signals to adjacent heat transfer stacks coupled with a thermal distribution layer. Some electrocaloric effect heat transfer stacks may include alternating layers of electrocaloric effect material and thermal rectifier material. The out of phase electric signals produce electric fields that bias the electrocaloric effect material of one heat transfer stack to a hot phase, emitting thermal energy, while biasing the electrocaloric effect material of an adjacent heat transfer stack to a cold phase, absorbing thermal energy. The thermal distribution layer allows for thermal energy from the material in the hot phase to be distributed to the material of the adjacent stack in the cold phase rather than back to the heat source.03-21-2013
20110011098HEAT RECYCLING SYSTEM - A heat recycling system for recycling heat from an electronic device includes a pipe with an inside tube and an outside tube coiled around the inside tube. The inside tube is connected to a first airduct to receive heated air from the electronic device. The outside tube is to receive cooling air from outside. A number of thermoelectric modules are formed in walls of the inside tube. A first end of each thermoelectric module is inserted into the outside tube, and a second end of each thermoelectric module is inserted into the inside tube. Therefore, the number of thermoelectric modules may generate current.01-20-2011
20130061603TEMPERATURE CONTROL DEVICE - A temperature control device for a climate control loop comprising at least one handle piece.03-14-2013
20120234021HEAT EXCHANGER - A heat exchanger comprises a housing, a guide member, a return member and a discharge member. The housing includes a plurality of parallel flow passages. The housing includes a first end face and a second end face each having openings. The guide member, the return member and the discharge member are fixed to the first end face or the second end face. The plurality of flow passages are connected by the return member into a single flow passage. The guide member and the discharge member are provided in the opening on a most upstream side and a most downstream of the single flow passage, respectively. At least one of the guide member, the return member and the discharge member integrally includes an attachment portion attached to the housing; and a protruding portion protruding more than the attachment portion toward the housing and including an inclined surface.09-20-2012
20080295522THERMO-ENERGY-MANAGEMENT OF SOLID-STATE DEVICES - The present invention reduces to practice discoveries made by the present inventors during their investigations into present-art-perceived-difficulties in thermal-management applications of solid-state devices.12-04-2008
20110277485Sports Fan Cooling Station - The sports fan cooling station is specifically designed for the sports fan(s) who enjoys outdoor sporting events. This cooling station utilizes the thermoelectric cooler peltier effect and AC power to cool individuals and beverages. The cooling station has a cooling hood that blocks the sunlight and cools the sports fan in a high heat stress environment. It also has a beverage cooler that cools beverages for the sports fan. In addition, the cooling station can be connected to multiple cooling hoods which can cool multiple sports fans at the same time. The cooling station is compact and portable. With this cooling station, sports fans can enjoy a sporting event and not worry about suffering from heat stress caused by hot weather.11-17-2011
20110283714Refrigerated Point-of-Use Holding Cabinet - A refrigerated point-of-use food holding cabinet keeps food products cold in compartments having cross sections that are substantially U-shaped. Food products are kept refrigerated using heat-absorbing, heat-exchangers thermally coupled to the U-shaped compartment. Refrigeration is provided by either a conventional reversed-Brayton cycle, one or more Peltier devices or a chilled, re-circulating liquid that does not change phase as it circulates but which is chilled by another refrigeration system, such as a conventional refrigeration system. An optional cover helps prevent food flavor transfers between compartments. Semiconductor temperature sensors and a computer effectuate temperature control.11-24-2011
20100175392ELECTROCALORIC REFRIGERATOR AND MULTILAYER PYROELECTRIC ENERGY GENERATOR - Provided are electrocaloric devices, pyroelectric devices and methods of forming them. A device which can be a pyroelectric energy generator or an electrocaloric cooling device, can include a first single-layer heat engine having a first side configured to be in contact with a first reservoir and a second side configured to be in contact with a second reservoir, wherein the first reservoir comprises a fluid. The device can also include a second single-layer heat engine having a first side in contact with the first reservoir and a second side in contact with a third reservoir and a channel disposed between the first single-layer heat engine and the second single-layer heat engine, the channel configured to transport the fluid from a first end to a second end. The device can further include one or more power supplies configured to apply voltages to the first and the second single-layer heat engine.07-15-2010
20100139289HEAT TRANSFER DEVICES BASED ON THERMODYNAMIC CYCLING OF A PHOTONIC CRYSTAL WITH COUPLED RESONANT DEFECT CAVITIES - A heat transfer device exploits the properties of photonic crystal solids with resonant defect cavities to execute a thermodynamic cycle to accomplish the conversion between heat flow and useful energy in the form of a heat engine or heat pump. The device comprises a photonic crystal having at least one and preferably several resonant defect cavities that radiate electromagnetic energy in an emission band. In a heat pump or refrigerator configuration, work means perform work on the photonic crystal to cycle the photonic crystal between a first state to permit the crystal to collect thermal energy from a cold region to heat the crystal and a second state to permit the photonic crystal to radiate electromagnetic energy to a hot region to cool the photonic crystal. The efficient collection of heat energy and radiation of electromagnetic energy in the cycle is accomplished by cycling the heat transfer into the photonic crystal and/or the crystal's emission band. In a heat engine configuration, the emission band is positioned so that the photonic crystal cycles between a first state to permit the crystal to collect thermal energy from the hot region to heat the crystal and a second state to permit the photonic crystal to radiate electromagnetic energy to the cold region to cool the crystal. This cycling transfers heat from the hot region to the cold region. The work means extracts mechanical work from this heat transfer either through the cyclic expansion and contraction, heating or radiation of the crystal.06-10-2010
20100101238HEATER-COOLER WITH BITHERMAL THERMOELECTRIC DEVICE - Disclosed embodiments include systems for heating and cooling the interior climate of a vehicle. In some embodiments, the system comprises a conduit having a first fluid channel, a second fluid channel, a fluid diversion channel configured to divert fluid flow between the first and second channels, and a thermoelectric device operatively connected to the fluid conduit. In certain embodiments, the thermoelectric device comprises a plurality of thermal zones. In some embodiments, the plurality of thermal zones comprises a first thermal zone connected to a first electric circuit switchable between a first polarity and a second polarity and a second thermal zone connected to a second electric circuit switchable between the first polarity and the second polarity independent of the polarity of the first electric circuit.04-29-2010
20100101237Temperature variation apparatus - The invention discloses a temperature variation apparatus for varying the temperature of a liquid. The temperature variation apparatus includes a metal tube, a power supply, a heat conductor, and a thermo-electric cooler (TEC). The liquid is poured into the metal tube. The power supply has an anode and a cathode respectively connected to two ends of the metal tube, so that the metal tube can be electrified to generate heat. The heat conductor encircles and contacts with the metal tube, and the thermo-electric cooler contacts with the heat conductor.04-29-2010
20120096871DYNAMIC SWITCHING THERMOELECTRIC THERMAL MANAGEMENT SYSTEMS AND METHODS - A dynamic switching thermoelectric thermal management system and method is disclosed. The thermal management system includes a heat dissipation device, a thermoelectric module, an ambient temperature sensor, a heat source temperature sensor, an energy storage device and a controller. One side of the thermoelectric module is thermally coupled to the heat source and another side is thermally coupled to the heat dissipation device. The controller periodically samples the temperature sensors and dynamically switches the thermoelectric module between a power generation mode in which the thermoelectric module uses the temperature difference between the heat source and ambient to charge the energy storage device, a cooling mode in which the thermoelectric module is powered to create a voltage difference across the thermoelectric module to cool the heat source, and an idle mode. The thermal management system can be integrated into a portable electronic device, for example a portable computing device.04-26-2012
20120023970COOLING AND HEATING WATER SYSTEM USING THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a cooling and heating water system using a thermoelectric module and a method of manufacturing the same. The cooling and heating water system using a thermoelectric module includes first and second substrates disposed to be spaced apart from each other, while facing each other; a cooling water line formed in the first substrate so as to flow cooling water therethrough; a heating water line formed in the second substrate so as to flow heating water therethrough; first and second insulating layers disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric device interposed between the first and second insulating layers, whereby it is possible to variously control a temperature of drinking water without generating noise by using the thermoelectric module in cooling the drinking water.02-02-2012
20100281882REFRIGERATING SYSTEM AND METHOD FOR REFRIGERATING - A Refrigerating system (11-11-2010
20090188259Integrated Thermoelectric Cooling Element and Positive Temperature Coefficient Heater - An integrated thermoelectric cooling element and a positive temperature coefficient heating element are integrated into a single package. A heat sink is shared between the thermoelectric cooling element and the positive temperature coefficient.07-30-2009
20110192172TEMPERATURE CONDITIONING SYSTEM METHOD TO OPTIMIZE VAPORIZATION APPLIED TO COOLING SYSTEM - Described herein is for a system and procedure to apply vaporization for heat transfer processes, particularly condensers in air conditioning and refrigeration systems both for upgrading units using the discontinued R22 refrigerant and for new equipments. The application can be applied to other cooling processes such as computer chip cooling, garments for medical, personal garments for military personnel. The application points to the features of different manifestations of vaporization for cooling in both natural and other equipments. The process can be extended for small and compact implementation on new equipments with maintenance improvement compared to water tower coolers, lower capitalization costs, modularity and ease of maintenance, and indoor installations enabling extension of capability of the cooling system with application of air flow condition. The advantages and implementation on new equipments for residential, industrial and large cooling units enable several advantages both economic, reliability, maintainability, indoor operation, reduction of cost of scaling problems and flexibility. Many additional applications are possible and are discussed herein, including high power computer chip cooling.08-11-2011
20110167839PACKAGED BEVERAGE TEMPERATURE ADJUSTMENT APPARATUS - A packaged beverage temperature adjustment apparatus includes: a temperature adjustment section configured to hold a packaged beverage, and adjust a temperature of the packaged beverage; and a rotation driving section configured to rotate the temperature adjustment section, the temperature adjustment section including at least one temperature adjustment unit abutting on a side face of the packaged beverage.07-14-2011
20110203295COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE - A cooling rack structure includes a cooling plate (08-25-2011
20110197596Heat-Dissipating Device For Supplying Cold Airflow - A heat-dissipating device (08-18-2011
20080236174THERMOELECTRIC DEVICES AND METHODS OF MANUFACTURE - Thermoelectric devices are provided. In one embodiment, a thermoelectric device may include a glass wafer defined by conductive vias, a second wafer, and a plurality of metal film disposed between the glass wafer and the second wafer and against solid, conductive, integral, end surfaces of the conductive vias. A nanogap may be disposed between the metal film and the second wafer. The nanogap may have been created by applying a voltage extending between the conductive vias and the second wafer. Methods of forming the devices, along with methods of using the devices to transform heat energy to electricity, and for refrigeration, are also provided.10-02-2008
20090266085Compostable materials recycling bin refrigeration device - A refrigeration device for compostable materials, comprising, a recycling bin adapted to receive compostable materials, a liner element adapted to receive the recycling bin; and refrigeration means adapted for cooling the liner element wherein when compostable materials are positioned within the recycling bin and the recycling bin is positioned within the liner element, the refrigeration means cools the liner element, the recycling bin and the compostable materials positioned therein.10-29-2009
20090199571Body temperature control system - In an embodiment, a system is provided. The system includes a heat exchanger including a thermal exchange block having a top surface and a bottom surface. The system further includes a first thermoelectric cooler abutting the top surface of the thermal exchanger block and a first heat sink thermally coupled to the first thermoelectric cooler. The system also includes a second thermoelectric cooler abutting the bottom surface of the thermal exchanger block and a second heat sink thermally coupled to the second thermoelectric cooler.08-13-2009
20090019861AIR CONDITIONING UNIT FOR MOTOR VEHICLES AND METHOD FOR ITS OPERATION - An air conditioning unit is disclosed for motor vehicles. The air conditioning unit includes with a compression refrigerant circuit where a refrigerant circulates, comprising comprehensively switched in series with respect to fluid flow at least one compressor upstream of a heat-delivering heat exchanger, and an expansion element upstream of a heat-absorbing heat exchanger, whereby into the flow path leading from the outlet of the heat-delivering heat exchanger to the expansion element an additional heat exchanger is integrated thermally coupled to at least one cooling means the temperature of which can be put to values below the temperature of the refrigerant in the compression refrigeration circuit at the position of the refrigerant's outflow from the heat-delivering heat exchanger, and a method for its operation.01-22-2009
20100146990THERMOELECTRIC COOLER FOR COMPRESSOR MOTOR - A refrigerant system has an electric motor positioned either inside or outside of a hermetically sealed shell containing a compressor pump unit and is mechanically coupled to drive this compressor pump unit. The electric motor has at least one thermoelectric cooler to cool, or assist in cooling, of at least one component of the electric motor.06-17-2010
20100257870VEHICLE AIR CONDITIONER - A vehicle air conditioner includes a heat storage unit having a heat storage medium, a first heat exchanger for heat exchange with air that is sent out of the vehicle, a second heat exchanger for heat exchange with air that is sent to the vehicle compartment, and a peltier device. The heat storage unit has a first inlet port and a first outlet port through which heat exchange medium flows in and out of the heat storage unit where heat is exchanged between the heat storage medium and the heat exchange medium. The peltier device is operable to provide one of positive heat and negative heat to the heat exchange medium flowing through the heat storage unit and also to provide the other of the positive heat and the negative heat directly or indirectly to the first heat exchanger.10-14-2010
20100192596SYSTEM AND METHOD FOR COOLED AIRFLOW FOR DERMATOLOGICAL APPLICATIONS - A system and method of providing a temperature controlled gaseous medium for dermatological applications is described. The gaseous medium may be cooled and applied to an area such as a skin area to provide an analgesic effect thereon. The system and method also include an automated defrost cycle for minimizing the effects of decreased hydraulic diameter due to freezing.08-05-2010
20100212328THERMOELECTRIC CONVERTER AND METHOD OF MANUFACTURING SAME - A thermoelectric converter made of a thermoelectric conversion material is provided in which metal or alloy particles having an average particle size of 1 to 100 nm are dispersed, wherein at least a part of the metal or alloy particles are dispersed at a distance not more than the mean free path of the phonon of the thermoelectric conversion material.08-26-2010
20120192574Heat Pipes And Thermoelectric Cooling Devices - In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.08-02-2012
20100122540THERMOELECTRIC COOLER FOR ECONOMIZED REFRIGERANT CYCLE PERFORMANCE BOOST - A refrigerant system incorporates an economizer circuit, and a thermoelectric cooler to provide a performance boost to the conventional economized refrigerant system. A thermoelectric cooler cools the refrigerant either directly in a main refrigerant circuit, or in an economized circuit, or both.05-20-2010
20120192573AIR-CONDITIONING CORE - The air-conditioning core includes a plurality of first Peltier devices, a plurality of first fins and a tube. Each of the first Peltier devices has a first surface and a second surface. The first fins are located on the first surfaces of the first Peltier devices. The tube is located adjacent to the second surfaces of the first Peltier devices. The tube has a main portion extending around the second surfaces of the first Peltier devices and also around the first fins for holding the first Peltier devices, an inlet portion connected to the main portion for allowing heat exchange medium of liquid to flow into the main portion, and an outlet portion connected to the main portion for allowing the heat exchange medium of liquid to flow out of the main portion. The outlet portion is located adjacent to the inlet portion.08-02-2012
20080229758Enhanced thermoelectric cooler with superconductive coolers for use in air-condioners - This is an enhanced thermoelectric cooler with superconductive heat-dissipatve coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.09-25-2008
20090038317Thermoelectric temperature-controlled container holder and method - A Thermoelectric-based container holder has a receptacle with a recess for receiving a container to be heated or cooled, a variable interface surface disposed within the holder and configured to flexibly contact an outside surface of the container to be heated or cooled where the variable surface interface is in thermal contact with the surface of the receptacle, and a thermoelectric assembly thermally connected to at least the variable surface interface.02-12-2009
20100293966VEHICLE AIR CONDITIONER - A vehicle air conditioner includes a first heat exchanger, wherein air around the first heat exchanger is supplied into a vehicle compartment, a heat storage unit, an in-vehicle circuit that connects between the first heat exchanger and the heat storage unit, a second heat exchanger, wherein air around the second heat exchanger is sent outside a vehicle, a vehicle system, wherein the vehicle system generates exhaust heat, an out-vehicle circuit, a connection circuit that connects between the in-vehicle and the out-vehicle circuits, a plurality of valves operating so that the in-vehicle circuit and the out-vehicle circuit are connected or disconnected from each other through the connection circuit and a control device for controlling states of the valves.11-25-2010
20110126551ELECTROSTATIC ATOMIZING DEVICE AND AIR CONDITIONER USING SAME - An electrostatic atomizing device includes an atomizing electrode which generates charged fine water particles negatively charged in the form of mist, by generating an electric field when a high negative voltage is applied thereto in a state in which water is supplied; a water supply portion which supplies the water to the atomizing electrode; a discharge detection portion which detects whether negative ion discharge, indicating discharge in which only negative ions are generated without generating the charged fine water particles, is occurring at the atomizing electrode or not; and a control portion which reduces the electric field intensity of the electric field generated by the atomizing electrode when the discharge detection portion detects the occurrence of the negative ion discharge.06-02-2011
20110016887DEFROSTING ASSEMBLY, REFRIGERATOR HAVING THE SAME, AND METHOD FOR CONTROLLING THE SAME - A defrosting assembly, a refrigerator having the same, and a method of controlling the same are provided. The refrigerator may include a food defrosting chamber, which may be divided from a food storage chamber that cools or freezes food, a defrosting device, which may be positioned in and may be removable from the food defrosting chamber, and a thermoelectric module, which may be positioned in the food defrosting chamber to heat an inside of the defrosting device and to cool an outside of the defrosting device. In a defrosting mode, frozen food may be rapidly defrosted by using the defrosting device, while in a general or a rapid cooling mode, the defrosting device may be used for food storage.01-27-2011
20120266608THERMOELECTRIC HEAT EXCHANGER CAPABLE OF PROVIDING TWO DIFFERENT DISCHARGE TEMPERATURES - A thermoelectric heat exchanger and a thermoelectric heating, ventilation and air conditioning system (HVAC) configured to provide a cooled fluid or air stream and a heated fluid or air stream. The thermoelectric heat exchanger may include a plurality thermoelectric devices (TEDs), also known as thermoelectric coolers (TECs) or Peltier coolers, in thermal communication. The thermoelectric devices may be arranged in a three dimensional array to provide compact packaging for the thermoelectric heat exchanger assembly. The thermoelectric heat exchanger may be configured to transfer thermal energy between a first thermoelectric device and a second thermoelectric device via evaporation and condensation of a working fluid or refrigerant contained within the thermoelectric heat exchanger.10-25-2012
20100132379LOW POWER DEHUMIDIFIER - A low power dehumidifier includes a body, a desiccation element, and heat transfer elements. The desiccation element has a dehumidifying region and a recycling region. Each of the heat transfer elements has a cooling end and a heating end configured for high-temperature condensation and high-temperature heating, respectively, thereby effectively recycling waste high heat generated by the dehumidifier and reducing power consumption.06-03-2010
20110079022HYBRID THERMOELECTRIC-EJECTOR COOLING SYSTEM - A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COP04-07-2011
20110061400HEAT EXCHANGER HAVING THERMOELECTRIC ELEMENT - A heat exchanger may include a housing including an intake port through which air is introduced into the housing from outside, a seat inlet supplying air to a vehicle seat, and an exhaust port through which a portion of the air introduced from outside is exhausted from the housing to outside, a blower unit mounted inside the housing and operated by a first motor to supply the air introduced into the housing through the intake port, out of the housing through the seat inlet, and a thermoelectric element disposed between the intake port and the seat inlet and heat-controlling the air introduced into the housing through the intake port.03-17-2011
20090314008SELF-COOLED VERTICAL ELECTRONIC COMPONENT - A self-cooled electronic component comprising a vertical monolithic circuit, in which the vertical monolithic circuit is electrically connected in series with a Peltier cooler so that the D.C. current flowing through the circuit supplies the cooler and in which the circuit and the cooler are placed against each other so that the cold surface of the cooler is in thermal contact with the circuit.12-24-2009
20100071384REFRIGERATION SYSTEMS AND METHODS FOR CONNECTION WITH A VEHICLE'S LIQUID COOLING SYSTEM - An exemplary refrigeration system for cooling food or beverages may use a liquid cooling system of a vehicle. The refrigeration system may include a compartment in which the food or beverages may be placed and removed, a chilled liquid coolant system having a connection through which liquid coolant is received from the liquid cooling system of the vehicle, and a heat exchanger operationally coupled with the chilled liquid coolant system and the compartment to transfer heat from the compartment into the liquid coolant. The refrigeration system may also include a second chilled coolant system through which a second coolant flows and a second heat exchanger operationally coupled with the second chilled coolant system and the compartment to transfer heat from the compartment. The chilled liquid coolant system and the second chilled coolant system may operate together as a cascade cooling system.03-25-2010
20100064695Flexible flow channel for a modular liquid-cooled thermal spreader - The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.03-18-2010
20120240596THERMOELECTRIC CONVERSION UNIT - A thermoelectric conversion unit includes first and second cases including first and second recesses that define first and second flow passages and have openings, first and second substrates, a plurality of thermoelectric devices in contact with the inner surfaces of the first and second substrates, a connector for joining the first and second cases, first and second fins protruding from the first and second substrates in the first and second flow passages. The first and second cases include first and second opposed portions opposed to the first and second substrates outside the first and second recess, respectively. A spacer for setting distance between the first opposed portion and the second opposed portion is provided. The spacer sets the distance between the first and second opposed portions to be longer than distance between the outer surface of the first substrate and the outer surface of the second substrate.09-27-2012
20110072835COOLING DEVICE FOR ELECTRONIC COMPONENTS - The refrigeration device for electronic components features a plate that is equipped on both sides with heat exchanger elements (03-31-2011
20110072834COOLING STRUCTURE OF ELECTRONIC EQUIPMENT - In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member. The amount of heat to be transported is decreased for a housing surface whose temperature rises by influence of the external environment, the amount of heat to be transported is increased for a housing surface which is not influenced by the external environment, and the temperature of the electronic component is stabilized within the allowable temperature range.03-31-2011
20110041515High Efficiency, Corrosion Resistant Heat Exchanger and Method of Use Thereof - Disclosed are anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Also disclosed are systems for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers. Further disclosed are methods for purifying liquids using the anodically protected, corrosion resistant, self cleaning, high efficiency, submerged tube and plate heat exchangers.02-24-2011
20120131930TEC DEVICE AND ELECTRICAL DEVICE APPLYING THE TEC DEVICE - A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.05-31-2012
20090293499THERMOELECTRIC HEAT PUMP - In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.12-03-2009
20110259018Thermoelectric module and method for manufacturing the same - Disclosed herein are a thermoelectric module including a first substrate and a second substrate that are opposite to each other and spaced from each other; first and second electrodes that are disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric element that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes, wherein at least any one of the first and second substrates has an insulating layer disposed on one surface and a fluid flowing line for moving a fluid transferring heat therein, and a method for manufacturing the same.10-27-2011
20100031674TE liquid cooler - A system for cooling fluid to cool and condition a race cart driver's suit, helmet or seat. The system includes Peltier effect thermoelectric coolers sandwiched to form water and air passages to cool liquid in use in a suit, helmet or seat and to expel waste heat. A thermoelectric cooler for cooling a driver worn device including a thermoelectric cooler having a first heat exchanger, an inlet for supplying one side of the first heat exchanger, and an inlet for air supplying an opposing side of the first heat exchanger. A pump for moving liquid from a reservoir on the TE cooler with a first heat exchanger to a second heat exchanger worn by a driver. A quick release device to detach the TE cooler from the second heat exchanger with a single motion depressing a single bar releases two quick connects.02-11-2010
20100024437High temperature compact thermoelectric module with gapless eggcrate - A high-temperature thermoelectric module. The module includes a two part molded egg-crate for holding in place and providing insulation and electrical connections for a number of thermoelectric n-legs and p-legs. A first part of the egg-crate is comprised of a ceramic material capable of operation at temperatures in excess of 600° C. and a second part comprised of a thermoplastic material having very low thermal conductivity. In preferred embodiments the high temperature ceramic is zirconia and the thermoplastic material is DuPont Zenite. The thermoelectric legs are also comprised of high-temperature and low-temperature material. In preferred embodiments the high temperature thermoelectric material is lead telluride and the low temperature material is bismuth telluride. In preferred embodiments metal felt spacers are provided in each leg to maintain proper electrical contacts notwithstanding substantial temperature variations. Preferably the module is sealed in an inert gas filled insulating capsule.02-04-2010
20110016886METHOD AND APPARATUS FOR SWITCHED THERMOELECTRIC COOLING OF FLUIDS - A method and system for efficiently cooling a fluid is provided. A cooling system includes a first chamber containing a first fluid, and a second chamber connected to the first chamber and containing a second fluid. The cooling system further includes one or more thermoelectric devices for cooling the second fluid in the second chamber, and a first body that acts as a thermal diode. The first body enables unidirectional transfer of heat from the thermoelectric devices to the first fluid. Further, the cooling system can be installed with one or more phase change materials or heat pipes that enhance the cooling efficiency of the cooling system. The thermoelectric devices are switched on for a certain time period, after which they are switched off and on repeatedly in cycles, depending on the temperature of the second fluid.01-27-2011
20090266084Thermoelectric device based refrigerant subcooling - A subcooler (10-29-2009
20100101236THERMAL MANAGEMENT SYSTEM HAVING THERMOELECTRIC MODULES - A thermal management system includes a first thermoelectric module, a second thermoelectric module, and a heat exchanger. The heat exchanger has a pipe having a first section, a second section and an intermediate section arranged between the first section and the second section. The intermediate section maintains the first section and the second section in spaced apart planes and the first thermoelectric module is thermally attached to the first section and the second thermoelectric module is thermally attached to the second section. The first thermoelectric module is spaced apart from the second thermoelectric module to enable fluid to flow between the first thermoelectric module and the second thermoelectric module.04-29-2010
20120042661SPLIT THERMO-ELECTRIC CYCLES FOR SIMULTANEOUS COOLING, HEATING, AND TEMPERATURE CONTROL - The invention is new types of split-thermo-electric structures for cooling, heating, or stabilizing the temperature of an object or for electric power generation. In a first type of structure the transport of the electric current between the heat absorbing and the heat dispersing sides of the structure is disengaged from the flow of heat between the sides of the thermo-electric structure. In a second type of structure a layer of thermo-electric material on the heat absorbing side of the structure is connected by connection layers to two or more layers of thermo-electric material on the heat dispersing side of the structure. In a third type of structure the elements of which the structure is comprised are arranged to cause different values of electric current to flow at the heat absorbing and the heat dispersing sides of the structure and through different elements in the interior of the structure.02-23-2012
20120151938HEAT EXCHANGER - A heat exchanger for installation in a motor vehicle includes a cooling channel, a heating channel, and heat pipes to thermally couple the cooling channel with the heating channel. A thermoelectrical generator is arranged on a cold side of at least one of the heat pipes and coupled with the heat pipe by a material joint. The material joint is realized by a liquid metal.06-21-2012
20120210730Method and Apparatus for Cooling a Vehicle Component - In certain embodiments, a system for cooling heat-generating components includes an engine cooling system operating to circulate a liquid coolant at a first temperature for the cooling of one or more engine components within the vehicle. A liquid cooler unit may receive the liquid coolant at the first temperature and decrease the temperature of the liquid coolant to a second temperature. A heat-generating component may be coupled to the liquid cooler unit and receive the liquid coolant at the second temperature. Heat generated by the heat-generating component may be transferred to the liquid coolant. A fluid return line may couple the heat-generating component to the engine cooling system. The fluid return line returns the liquid coolant that has received the heat from the heat-generating component to the engine cooling system.08-23-2012
20120125013AIR CONDITIONER - The air conditioner includes an air-conditioning core, a first air-conditioning passage, a liquid passage and a second air-conditioning passage. The core includes a Peltier device having first and second surfaces, a first surface-side passage and a second surface-side passage. The second surface-side passage has a first passage and a second passage that transfer heat therebetween. The first air-conditioning passage is connected to the first surface-side passage for allowing first air-conditioning air in the first air-conditioning passage to flow through the first surface-side passage. The liquid passage is connected to the first passage for allowing liquid that serves as a heat transfer medium to flow through the first passage. The second air-conditioning passage is connected to the second passage for allowing second air-conditioning air in the second air-conditioning passage to flow through the second passage. The first air-conditioning air and the second air-conditioning air are usable for air conditioning a room.05-24-2012
20120210731THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION METHOD FACILITATING COOLING OF AN ELECTRONIC COMPONENT - A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.08-23-2012
20120167597TEMPERATURE CONTROL SYSTEM FOR A LIQUID - A temperature control system (07-05-2012
20120167596ICE AND COLD WATER DISPENSING ASSEMBLY AND RELATED REFRIGERATION APPLIANCE - According to certain aspects of the disclosure, an ice and cold water dispensing assembly for a refrigeration appliance is disclosed including a reservoir holding water having a water level and an ice maker for making ice cubes to be held within the water within the reservoir. Structure is provided on the reservoir allowing the reservoir to be removably attached to the refrigeration appliance. A handle and a spout are attached to the reservoir and are configured for allowing manual dispensing of ice cubes or water from the reservoir when the reservoir is removed from the refrigeration appliance. An ice dispenser and a water dispenser are provided in the refrigeration appliance for dispensing ice cubes or water respectively from the reservoir when the reservoir is attached to the refrigeration appliance. Related refrigeration devices are also disclosed.07-05-2012
20100050658METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING THERMOELECTRIC COOLING COMPONENTS - An electronic device can be provided with a heat-generating component, a heat-dissipating component, and a thermoelectric cooling component. The thermoelectric cooling component may be configured to create a temperature difference between the heat-generating component and the heat-dissipating component. In some embodiments, the thermoelectric cooling component is configured to use the Peltier effect to create the temperature difference. In some embodiments, the thermoelectric cooling component may be positioned proximate to a hotspot of the heat-generating component.03-04-2010
20120073308APPARATUS AND METHOD FOR CONTROLLING THE TEMPERATURE OF A BLACK BODY - Provided is an apparatus for controlling temperature of a black body. The apparatus includes a black body emitting radiant energy of infrared rays; a first Peltier element adjacent to the black body, the first Peltier element having a 1a surface and a 1b surface that selectively emit or absorb heat; a copper plate adjacent to the 1b surface; a second Peltier element adjacent to the 2b surface, the second Peltier element having a 2a surface and a 2b surface that selectively emit or absorb heat; a heat transfer member comprising a bent surface adjacent to the 2a surface, and an arm extending toward both ends of the black body to be adjacent to the both ends of the black body and a control unit controlling the 2a surface to emit heat when the 1a surface emits heat, and the 2a surface to absorb heat when the 1a surface absorbs heat.03-29-2012
20110120145Vapor Compression Circuit and Method Including A Thermoelectric Device - A fluid compression circuit may include a compression mechanism, a volume, a heat exchanger, a fluid conduit, a thermoelectric device, and a heat-transfer device. The compression mechanism includes first and second members cooperating to form a fluid pocket. The volume receives discharge fluid from the fluid pocket. The heat exchanger is in communication with the volume. The fluid conduit is connected to at least one of the volume and the heat exchanger. The thermoelectric device may include a first side in heat-transfer relation with a member at least partially defining the volume and a second side in heat-transfer relation with ambient air and cooperating with the first side to define a temperature gradient generating electrical current in the thermoelectric device. The heat-transfer device may receive electrical current generated by the thermoelectric device and may be in heat-transfer relation with at least one of the heat exchanger and the fluid conduit.05-26-2011
20120079835AUXILIARY AIR CONDITIONER FOR VEHICLE - An auxiliary air conditioning apparatus may include a blower unit, wherein a blower may be provided therein to forcibly blow intake air, a temperature control unit fluid-connected to the blower unit to receive air blown from the blower unit, wherein the temperature control unit includes an evaporator and a heater therein and may be connected to an air duct to exhaust air that may be cooled by the evaporator or heated by the heater, an auxiliary temperature control unit fluid-connected to the blower unit to receive air blown from the blower unit and fluid-connected to the air duct, wherein the auxiliary temperature control unit includes a heat exchanger core provided therein, the heat exchanger core having a thermoelectric device, an auxiliary power supply supplying electrical power to the blower and the heat exchanger core, and an auxiliary cooling/heating control unit controlling operation of the blower and the heat exchanger unit.04-05-2012
20120317993APPARATUS AND METHOD FOR CONTROLLING WORKPIECE TEMPERATURE - An atmospheric controlled chamber includes a support assembly capable of holding a workpiece over a specific surface of the support assembly, a heat-transfer assembly located close to the support assembly and capable of transferring heat to and from the exterior of the chamber, and at least one thermopile device disposed in the support assembly. The thermopile device(s) is configured to transfer heat between the specific surface (or viewed as the held workpiece) and the heat-transfer assembly. A gas assembly is optionally surrounded by the chamber wall and capable of ensuring the existence and controlling the pressure of an essentially static gas between the held workpiece and the specific surface, wherein the gas is used as a thermal medium for conducting heat. The thermopile device acts as an efficient heat pump, so as to provide extra lower/higher workpiece temperature, a greater cooling/heating rates, and more flexible rate control.12-20-2012
20120324909HEAT EXCHANGER - A heat exchanger for exchanging heat between two media in a vehicle is provided. The heat exchanger includes at least one tube, especially a double-walled tube for carrying a first medium of a first temperature, a thermoelectric material being disposed on an inner wall of the tube, and at least one guide sheet, connected to the at least one tube, for carrying a second medium of a second temperature. The at least one guide sheet is designed to carry the second medium to the outer wall of the at least one tube to allow the exchange of heat between the first and the second medium.12-27-2012
20120090332Method and Apparatus for Utilizing In-Situ Measurements Techniques in Conjunction with Thermoelectric Chips (TECs) - According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.04-19-2012
20080236175MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING - An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.10-02-2008
20110232301METHOD FOR THERMOELECTRIC ENERGY CONVERSION IN AN EXHAUST GAS RECIRCULATION SYSTEM - A method for managing thermal energy in an internal combustion engine including an exhaust gas recirculation system and an engine cooling system includes recirculating a portion of an exhaust gas through the exhaust gas recirculation system that is in thermal communication with a first side of a thermoelectric device, flowing an engine coolant into thermal communication with a second side of a thermoelectric device, and controlling electric current between an electrical energy storage device and the thermoelectric device to transfer thermal energy between the recirculated exhaust gas and the engine coolant.09-29-2011
20130174577Heating and Cooling Unit with Semiconductor Device and Heat Pipe - Aspects of the invention support the changing of a serving surface temperature in order to cool or heat the serving surface. Heat is transferred to or from the serving surface through at least one Peltier device, a heat pipe, and a heat sink. The mode of operation is determined by changing the electrical power polarity to the at least one Peltier device. A control device may activate the at least one Peltier device from a measured temperature and a temperature setting with a hysteresis. A plurality of Peltier devices may be partitioned into different subsets so that the control device may activate a selected subset during different time intervals. When the measured temperature is outside a temperature range, all of the Peltier devices may be activated, while only a selected subset may be activated when the measured temperature is within the temperature range and until a hysteresis temperature is reached.07-11-2013
20130091866THERMOELECTRIC-ENHANCED, VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser, heat sink, and thermal conductive path are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.04-18-2013
20130091868THERMOELECTRIC-ENHANCED, VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) - Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.04-18-2013
20130091867CONTAMINANT SEPARATOR FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS - Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.04-18-2013
20130098068TEMPERATURE CONTROL DEVICE - A temperature control device includes: a top plate; a heat exchanger plate; a thermoelectric module including a temperature-control-side electrode disposed near the top plate, a heat-exchanger-side electrode disposed near the heat exchanger plate and a thermoelectric element of which one side is connected with the temperature-control-side electrode and the other side is connected with the heat-exchanger-side electrode; and a polyimide film provided on the thermoelectric module near the top plate. The thermoelectric module is spaced apart from and surrounded by a seal wall having a ceramic outer circumference and disposed between the polyimide film and the heat exchanger plate. An adhesion sheet or an adhesive is interposed between the seal wall and the polyimide film.04-25-2013
20130180264DUAL MODE AUTOMOBILE AIR-CONDITIONING SYSTEM AND METHODS OF USE - The present inventive disclosure is directed generally to an improved automobile air- conditioning system that can be operated while the automobile's engine is not running. In variations, a typical vapor-compression-cycle air-conditioning system is modified to allow the refrigerant compressor to be driven from either of two power sources: (1) from a traditional engine-mounted pulley system, or (2) from a DC-motor powered by an electrical source independent from the engine. In another variation, the air-conditioning system is driven by one or more thermal-electric-cooling (TEC) modules, wherein the TEC-based system is powered by an auxiliary DC-power source that in some variations is powered by, or at least supplemented by, a solar-energy grid. Additionally, a variation of the modified automobile air-conditioning system includes both the modified-compressor-based system and the TEC-based system, wherein the compressor-based system is used to initially cool-down an automobile passenger compartment, then is shutdown in favor of the TEC-based system.07-18-2013
20130192270HEAT TRANSFER SUBSYSTEM INTERCONNECTION ARRANGEMENTS FOR INFORMATION TECHNOLOGY - Arrangements for heat transfer subsystem interconnection for use in information technology and other heat-producing equipment are disclosed. The arrangements provide for plurality of individual subsystems, each having a thermal interface. These are configured so that two or more of the subsystems can be thermally interconnected by connecting their thermal interfaces. Each subsystem may comprise at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator. The thermoelectric device can incorporate quantum-process and quantum-well materials for higher heat transfer and thermoelectric generation efficiencies. In some implementations, the thermoelectric device is comprised by the thermal interface. In some implementations, a control system and electronics are used to selectively configure the thermoelectric device in either a thermoelectric cooler operating mode or in a thermoelectric generation operating mode.08-01-2013
20130199208LIQUID COOLING SYSTEM AND METHOD FOR COOLING AT LEAST ONE HEAT GENERATING COMPONENT - A liquid cooling system for cooling at least one heat generating component, comprises a liquid loop in which liquid is arranged to be circulated, and arranged to be cooled by a first stage cooling unit, where the cold side of at least one Thermo Electric Cooling unit is arranged at a position situated downstream of the first stage cooling unit and upstream of the at least one heat generating component to be cooled by liquid, where the at least one Thermo Electric Cooling unit is arranged in its operative state to cool the liquid in order to provide for further cooling power when the cooling power of the first stage cooling unit is not sufficient.08-08-2013
20120085105METHOD AND SYSTEM FOR MAXIMIZING THERMAL PROPERTIES OF A THERMOELECTRIC COOLER AND USE THEREWITH IN ASSOCIATION WITH HYBRID COOLING - A cooling system including a first cooling apparatus thermally exposed to a space to be cooled. The cooling system further includes a second cooling apparatus thermally exposed to the space to be cooled and thermally exposed to the first cooling apparatus. Heat discharged from the second cooling apparatus powers the first cooling apparatus.04-12-2012

Patent applications in class Thermoelectric; e.g., peltier effect

Patent applications in all subclasses Thermoelectric; e.g., peltier effect