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Means to fasten electrical component to wiring board, base, or substrate

Subclass of:

029 - Metal working

029700000 - MEANS TO ASSEMBLE OR DISASSEMBLE

029729000 - Means to assemble electrical device

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
029740000 Chip component 36
029741000 Multilead component 4
20120174389Tools for Seating Connectors on Substrates - The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.07-12-2012
20130067736PIN ADJUSTER FOR ELECTRONIC COMPONENT - A pin adjuster for electronic components adjusts and fixes pins of an electronic component while the electronic component is being installed on a circuit board such that the pins correspond in position to and connect to a plurality of contacts on the circuit board, respectively. The pin adjuster includes an insulating body and a plurality of channels. The channels each penetrate the insulating body and have an entry end and an exit end. The entry ends correspond in position to the pins of the electronic component, respectively, and the exit ends correspond in position to the contacts, respectively, such that the pins are adjusted and fixed in place by penetrating the channels, respectively. The pin adjuster enables the pins to be aligned with and connected to the contacts rapidly and precisely, thereby shortening the time taken to mount the electronic component on the circuit board and streamlining manual operation.03-21-2013
20090070992Pick And Place System For A Semiconductor Mounting Apparatus - A semiconductor mounting apparatus contains a pick and place system having a bonding head, which has a first drive system and a second drive system for displacing the bonding head in a predetermined direction. The first drive system has a first pivot arm and a first stationary situated drive, which is used to pivot the pivot arm back-and-forth within a predefined pivot range. The second drive system is mounted on the pivot arm and comprises a stationary situated electric motor.03-19-2009
20120167381Tools for Seating Connectors on Substrates - The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.07-05-2012
Entries
DocumentTitleDate
20130025118COMPONENT MOUNTING APPARATUS - A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a second memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information.01-31-2013
20110192021ELECTRONIC COMPONENT MOUNTING MACHINE AND ELECTRONIC COMPONENT LOADING HEAD - A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L08-11-2011
20100037456Vacuum Suction Nozzle and Electric Component Mounting Apparatus - A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceramic body causes static electricity generated on the vacuum suction nozzle to be dissipated to an electronic component mounting device. Dissipation of the static electricity reduces or eliminates electrostatic damage to the electronic component and electrostatic repulsion induced blow off during suction by the vacuum suction nozzle.02-18-2010
20130074326SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND SURFACE MOUNTER - A substrate stopped at a first position is transferred toward a second position and is stopped at the second position in an accurate and stable manner. An intermediate position arrival time AT is measured while the substrate is being transferred from a substrate stop position toward a mounting work position, and a transfer status of the substrate (whether or not an unexpected factor has occurred) is assessed based on the intermediate position arrival time AT. Before the substrate reaches the second position, a deceleration pattern is controlled by altering a deceleration start timing T03-28-2013
20100071201Component Placement Apparatus, Component Placement Setting Calculation Apparatus, Program, and Component Placement Setting Calculation Method - The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part 03-25-2010
20100071200COMPONENT SUPPLY APPARATUS AND SURFACE MOUNTER - It is intended to allow for efficiently performing a feeder replacement operation. A feeder 03-25-2010
20090307899METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A method of mounting conductive balls comprises a step of setting, on a substrate, a mask that includes a plurality of apertures for disposing conductive balls on the substrate and a filling step. The filling step includes using a head that moves along a surface of the mask, holding a group of conductive balls in an area that is part of the surface of the mask, and moving the area so that parts of a path taken by the area overlap. By limiting the area where filling is carried out and moving the conductive balls while gathering the conductive balls in this area, it is possible to prevent losses for the conductive balls, to increase the filling efficiency, and to suppress the number of unfilled apertures.12-17-2009
20090293265ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality.12-03-2009
20130212876SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.08-22-2013
20130180103BOARD PROCESSING APPARATUS - Provided is a board processing apparatus which includes a head unit for performing a predetermined operation for a board, and a moving device for moving the head unit in a uniaxial direction, wherein the moving device includes a guide rail and a sliding member that is moved along the guide rail. The head unit is fixed to the sliding member in such a manner that at least a portion of the head unit protrudes outwardly from an edge face of the sliding member oriented in a moving direction thereof.07-18-2013
20090193650ACF ATTACHMENT DEVICE AND ACF ATTACHMENT METHOD - There is provided an ACF attachment device that attaches ACFs to an electronic component for saving installation space, improving mounting tact time, and reducing costs in a liquid crystal driver mounting stage. A preliminary press bonding device (08-06-2009
20120186076GEARED INSERTION APPARATUS FOR A PCA - A apparatus for mounting an interposer PCA into a chassis is disclosed. The apparatus comprises a bracket attached to the PCA. A geared handle is rotatably attached to one end of the bracket. The geared handle is configured to rotate between an open position and a closed position. Two geared segments are rotatably attached to the opposite end of the bracket and are meshed with the geared handle. A slot is formed in each geared segment and two slots are formed in the geared handle. The slots engage with insertion/ejection flanges on the chassis. The engaged slots force the PCA down into mating connectors in the chassis when the handle is rotated from the open position to the closed position.07-26-2012
20110283530COMPONENT MOUNTING SYSTEM - An inspection camera unit that images an inspection target part of a circuit board can be mounted, replaceably with a mounting head, on a moving mechanism of any one of a plurality of mounting machine modules arranged in alignment along a direction of conveying the circuit board. Also, an inspection image processing unit that processes an image signal output from the inspection camera unit to inspect the inspection target part of the circuit board can be mounted, replaceably with a feeder, on a feeder mount base of any one of the mounting machine modules. The inspection image processing unit is provided with a computer for image processing, a display panel that displays inspection information, and others.11-24-2011
20120233853SOCKET FOR SEMICONDUCTOR DEVICE PROVIDED WITH CONTACT BLOCK - In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.09-20-2012
20110289768QUICK CIRCUIT BOARD PRESS-MOUNT DEVICE - A quick circuit board press-mount device comprises: a positioning device, having a positioning board and a back board, and the positioning board having an adjusting knob with a screw rod portion, and the back board having an adjusting notch; an adjusting device, having a combining board, an insert board extended forward from the front end of the combining board, and the insert board having a screw hole for securing the screw rod portion, and the insert board being inserted into the adjusting notch, and the insert board having a lateral connecting board extended from a side from the combining board, and the lateral connecting board having an elliptic adjusting slot for securing a position screw hole of the back board by a screw rod; and a press-mount element, coupled to the combining board, so that the circuit board module and the interface card can be mounted conveniently and quickly.12-01-2011
20110258848COMPONENT MOUNTING APPARATUS - In a component mounting apparatus, a picking member picks components and mounts them on a board through movements of a plurality of moving members driven by motors. The apparatus is provided with a regenerative electric power control section for controlling regenerative electric power produced by regenerating a motion energy when each of the motors is decelerated; power supply sections for the motors each for exchanging electric power with the regenerative electric power control section; and a control section. When two moving members are moved, the control section begins to start and accelerate one of the two moving members in synchronized relation with a timing of beginning to decelerate and stop the other moving member and controls the regenerative electric power control section to utilize a regenerative electric power which is obtained from the motor driving the other moving member, in starting the motor which drives the one moving member.10-27-2011
20100083488ELECTRONIC COMPONENT TAKING OUT APPARATUS, SURFACE MOUNTING APPARATUS AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT - A plurality of reference electronic components (M04-08-2010
20090288292SURFACE MOUNTING APPARATUS - A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base.11-26-2009
20090265925Temporarily Fixing Device - A temporarily fixing device includes a frame-shaped structure member having a hole in its central part and a stepped portion around the hole; a board mounted on the stepped portion of the frame-shaped structure member; a simultaneously-pressing member into which a base pressing the board to the stepped portion and a pressing portion pressing at least one or more circuit components onto the board are unitized in its connection part; a shaft provided on the frame-shaped structure member so as to rotatably and vertically movably support the base of the simultaneously-pressing member; and a pressure member normally pressing the simultaneously-pressing member to the surface of the frame-shaped structure member.10-29-2009
20090265924Electronic Component Mounting Head, and Apparatus and Method for Mounting Electronic Component - In an electronic component mounting apparatus including an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even under the condition that the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.10-29-2009
20100139085TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL - A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.06-10-2010
20090183361INSTALLATION HEAD ACTUATOR FOR ELECTRONIC PARTS AND INSTALLATION DEVICE FOR ELECTRONIC PARTS - In an electronic parts installation device, increasing throughput by brining parallel operation of motors, etc., to the maximum, and having high reliability by reducing contacts and/or interferences generating the parallel operations, an electronic parts installation head actuator 07-23-2009
20090064489ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD - In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.03-12-2009
20120227255SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.09-13-2012
20090205197Method of providing flexible heat sink installations for early blade board manufacturing - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.08-20-2009
20110225811Substrate-related-operation performing apparatus and substrate-related-operation performing system - A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.09-22-2011
20090241327MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS - In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H10-01-2009
20090241326MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS - An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.10-01-2009
20120266457COMPONENT SUPPLYING APPARATUS AND SURFACE MOUNTING APPARATUS - Maintenance of an electronic component working apparatus which carries out prescribed work using components is facilitated. A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulating means. The movement range regulating means allows the component storing section to move between a supply position P10-25-2012
20090313816DEVICE FOR ASSEMBLING COMPONENTS HAVING METAL BONDING PADS - A device for assembling components having metal bonding pads includes plates that can move relative to each other, bearing metal components respectively and leaving between them a flat chamber surrounding the components when the latter are in contact with each other. The flat chambers can be saturated with deoxidizing gaseous fluid.12-24-2009
20100223782COMPONENT MOUNTING CONDITION DETERMINING METHOD - In a component mounter of so-called alternate mounting, a component mounting condition determining method of determining a component mounting condition that equalizes operating times of a plurality of mounting heads is a component mounting condition determining method of determining a component mounting condition for the component mounter which includes the plurality of mounting heads that alternately mount components onto one board, the method including determining (S09-09-2010
20100242267TAPE FEEDER AND MOUNTING APPARATUS - When a component (X) is fed to a pickup position (09-30-2010
20090260226DEVICE FOR ASSEMBLING AN ELECTRONIC COMPONENT - The invention concerns a device (10-22-2009
20100000081ELECTRONIC COMPONENT BONDING MACHINE - In a construction in which the intermediate stage 01-07-2010
20090113698APPARATUS FOR ELECTRICALLY COUPLING A SEMICONDUCTOR PACKAGE TO A PRINTED CIRCUIT BOARD - An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.05-07-2009
20100180434ELECTRONIC COMPONENT MOUNTING APPARATUS - Before a user starts the operation of an electronic component mounting apparatus, user's input representing as to whether the user is an operator, a programmer or a manager/maintenance person is accepted and further user level information representing degree of skill of the user as to the safety measures is accepted. The power supply of a mechanical portion operating a head portion is interrupted in accordance with the state of the apparatus including at least the user level information and the open/close state of a safety cover for covering the movable range of the head portion.07-22-2010
20110030203ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.02-10-2011
20110030202ELECTRICAL CABLE WIRING HEAD DEVICE AND ELECTRICAL CABLE WIRING APPARATUS - An electrical cable wiring head apparatus is provided to rapidly wire an electrical cable while more effectively restraining the electrical cable from floating. An electrical cable wiring head device of the electrical cable wiring head apparatus moves along a wiring surface of a wiring plate to wire an electrical cable on the wiring surface. The electrical cable wiring head device comprises: a head section supported rotatably about a rotary axis and provided with a guide recess for leading the electrical cable to the wiring surface, the guide recess being offset from the rotary axis; a head rotating mechanism for rotating the head section; a guide pushing member including a shaft portion and a roller portion provided rotatably on a distal end of the shaft portion, the guide pushing member being supported movably along the rotary axis; and a guide pushing member drive mechanism for reciprocating the guide pushing member.02-10-2011
20100223781ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In an electronic component mounting system constituted by interconnecting a plurality of mounting apparatuses, a board ID code attached by digital data to the board is read in a board supply apparatus located in the uppermost stream and transmitted to the mounting apparatuses on the downstream side via communication means. By comparing the transmitted board ID code with mounting nonrequirement board code data (defective board code, read error code, dummy board code, etc.) preparatorily stored in a storage section in the mounting apparatus, it is determined whether or not execution of mounting operation of the board is required, and the board determined to be not required to be subjected to mounting is unloaded to the downstream side without carrying out mounting works and without line stop.09-09-2010
20100218371MANUFACTURING METHOD FOR A WIRELESS COMMUNICATION DEVICE AND MANUFACTURING APPARATUS - A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements.09-02-2010
20100192365MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.08-05-2010
20090217514Component mounting apparatus, vibration controlling apparatus, and vibration controlling method - A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.09-03-2009
20100058579ARRANGEMENT AND SYSTEM AT A COMPONENT MOUNTING MACHINE - A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine or in the component mounting machine to engage with the arrangement for feeding the components towards the picking position.03-11-2010
20100064510COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE - A suction nozzle (03-18-2010
20110067231ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL - An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material.03-24-2011
20110056071Component mounting apparatus, vibration controlling apparatus, and vibration controlling method - A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.03-10-2011
20110061229SYSTEM FOR FASTENING A RAIL, AND FASTENING OF A RAIL ON A SUBSTRATE - The present invention relates to a system and to a fastening of a rail on a substrate, with a guide plate for laterally guiding the rail that has a standing surface associated with the substrate, a support element to support the guide plate in the assembly position, a spring element supported on the guide plate and at least one spring arm for exerting a resilient holding force onto the foot of the rail, and a tensioning means for tensioning the spring element. The fastening can be assembled in that the support element has a support lug supported on the substrate in the assembly position to reach under the standing surface of the guide plate in a way that the guide plate is supported on the substrate via the support lug in the region where the guide plate and support lug overlap.03-17-2011
20100242268ELECTRONIC PARTS MOUNTING DEVICE - A paste supply unit that is located in a side opposed to an electronic parts supply table 09-30-2010
20090277002SURFACE MOUNTING APPARATUS - [Problems] To provide a surface mounting apparatus in which abutting members will not abut on a printed wiring board when the abutting members are lowered.11-12-2009
20100257728ELECTRONIC COMPONENT MOUNTING APPARATUS - Two concentrically-arranged annular reservoirs 10-14-2010
20100186222MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.07-29-2010
20100186221MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.07-29-2010
20090241325HAND PRESS - A hand press having an operation member provided at a main body with a pressure head section including a pressure head movable up and down relative to the main body and the pressure head section is configured to be pushed down by the operation member and to apply a pressing force, further, an elastic member is provided at the main body, and configured to apply an elastic force to the pressure head section such that a position of the pressure head located below a top dead center by a predetermined distance serves as an operation origin of the pressure head, and a switch is configured to turn ON when the pressure head section is located at a position above the operation origin.10-01-2009
20120005883METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL - An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.01-12-2012
20090300908ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD - It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency.12-10-2009
20120117794SURFACE MOUNT MACHINE NOZZLE - An exemplary surface mount machine nozzle includes a mounting element, a pneumatic suction nozzle and a fixing pin. The mounting element defines one of a pivot hole and an elongated perforation in a sidewall thereof. The pneumatic suction nozzle defines another one of the pivot hole and the elongated perforation therein. The fixing pin horizontally extends through the pivot hole and the perforation for connecting the mounting element and the pneumatic suction nozzle together. The fixing pin is slidable along the elongated perforation such that the pneumatic suction nozzle is telescopically slidable relative to the mounting element.05-17-2012
20120167380ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING MACHINE - An electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of the machines, an operation section placed to one direction side from a center in the board conveying direction of the machine on a machine side face is placed in an attitude in which the normal direction of an operation face is inclined toward the center line. A signal tower placed on one direction side from the center line on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle β toward the center line.07-05-2012
20100050424ASSEMBLING APPARATUS - An assembling apparatus for assembling an electronic component to a printed circuit board (PCB) includes a base, a fixing member fixed to the base, a sliding member slidably mounted to the base, and a driving device mounted to the base. The fixing member is configured for fixing the PCB. The sliding member is configured for supporting the electronic component. The driving device is capable of driving the sliding member to move relative to the fixing member to assemble the electronic component to the PCB.03-04-2010
20100050426SYSTEM FOR MOUNTING COMPONENTS ON BOARDS - Disclosed is a component mounting apparatus including two board transfer devices for respectively transferring circuit boards in respective directions parallel to each other and a component placing device provided with at least one component placing head for mounting the components on the boards positioned at predetermined mounting positions on the board transfer devices. Where two component placing heads are provided, they pick up components from two component supply devices and mount the picked-up components respectively on the boards loaded by the two board transfer devices. In this way, the component placing device mounts components simultaneously or alternately on two boards loaded respectively by the two board transfer devices. While one of the two board transfer devices is transferring a board thereon or while the one board transfer device is being adjusted to alter its transfer way width, one of the component placing heads for performing component mountings at the one board transfer device helps the other component placing head in performing component mountings at the other board transfer device. In a modified form, either one of the two transfer devices is used as bypass conveyor or return conveyor.03-04-2010
20100050425ROTARY POSITIONING MECHANISM - A rotary positioning mechanism used for positioning a circuit board to a bottom plate of a chassis is disclosed, which has a plurality of positioning holes concentrically formed on the circuit board and a plurality of positioning columns disposed on the bottom plate of the chassis corresponding to the positioning holes respectively. Each of the positioning holes has an inserting portion and a positioning portion, and each of the positioning columns has a head portion capable of passing through the inserting portion of the corresponding positioning hole and a neck portion connected to the head portion and capable of engaging with the positioning portion of the corresponding positioning hole. By rotating the circuit board relative to the bottom plate of the chassis, the neck portion of each of the positioning columns is engaged with the positioning portion of the corresponding positioning hole, thereby positioning the circuit board to the bottom plate of the chassis.03-04-2010
20100050423Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects - An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.03-04-2010
20090056111ALIGNMENT JIG FOR ELECTRONIC COMPONENT - A jig securing alignment and positional accuracy in all directions (x, y, z) for an electrical component to be soldered to a PCB is provided. The jig positions the IC in the x and y directions, and keeps the IC from rotating. The jig also holds the IC down during the soldering process to make sure that the IC remains parallel to the PCB before, during and after soldering. The jig attaches to mounting holes on the PCB and its placement can be automated or performed manually.03-05-2009
20090056112ELECTROSTATIC CHUCK MEMBER, METHOD OF MANUFACTURING THE SAME, AND ELECTROSTATIC CHUCK DEVICE - A plurality of protruded portions is formed through embossing and is distributed and arranged regularly or irregularly on an electrostatic chuck surface, and has a circular or almost circular top surface shape and a roundness (R) of 0.01 mm or more is applied to an edge part defined by an intersection of the top surface and a side surface and a portion to which the roundness is applied occupies a quarter of a height h of the protruded portion or more.03-05-2009
20120073127Alignment and Lead Insertion Device for an Electronic Component - An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.03-29-2012
20120255164ROTATION ANGLE DETECTION DEVICE, ROTATION ANGLE DETECTION METHOD, AND PART MOUNTING APPARATUS - A rotation angle detection device of the present invention includes: a support body; a rotating body that can rotate with respect to the support body about a rotation axis and move in a rotation axis direction; a rotation angle detection unit that has a magnet attached to either of the support body and the rotating body, and a magnetic sensor attached to the other of the support body and the rotating body and facing the magnet in the rotation axis direction, and that detects a rotation angle of the rotating body on the basis of an output signal of the magnetic sensor; and a position detection unit that detects that the rotating body is positioned at a detection position in which a distance between the magnet and the magnetic sensor in the rotation axis direction becomes a predetermined detection distance. The rotation angle detection unit reads the output signal of the magnetic sensor and determines the rotation angle of the rotating body with respect to the support body from the output signal when the position detection unit detects that the rotating body is positioned at the detection position.10-11-2012
20120233852ELECTRONIC COMPONENT MOUNTING APPARATUS - An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.09-20-2012
20120317798COMPONENT MOUNTING DEVICE - An electric power supplying circuit (12-20-2012
20100229379ASSEMBLY AID FOR PRINTED BOARD CONNECTORS - In order to simplify the assembly of printed board connectors, the invention proposes an assembly aid that features one or more recesses in accordance with the dimensions of the printed board connectors, wherein one or more printed board connectors to be assembled on a printed board can be inserted into said recesses. In this case, the contact spacing on the printed board corresponds with the arrangement of the printed board connectors in the assembly aid such that an exact alignment of the printed board connectors is realized.09-16-2010
20100229378ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.09-16-2010
20100132187PART MOUNTING APPARATUS AND METHOD - A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath.06-03-2010
20130014383MANIPULATOR, LOADER, AND POSITIONING STRUCTURE FOR PRODUCTION LINEAANM LIU; YU-CHINGAACI Tu-ChengAACO TWAAGP LIU; YU-CHING Tu-Cheng TWAANM YANG; FU-CHIAACI Tu-ChengAACO TWAAGP YANG; FU-CHI Tu-Cheng TWAANM YU; CHI-ANAACI Tu-Cheng, New TaipeiAACO TWAAGP YU; CHI-AN Tu-Cheng, New Taipei TWAANM LI; YAN-HAOAACI Shenzhen CityAACO CNAAGP LI; YAN-HAO Shenzhen City CNAANM XIA; XINGAACI Shenzhen CityAACO CNAAGP XIA; XING Shenzhen City CNAANM WU; WEN-ZHAOAACI Shenzhen CityAACO CNAAGP WU; WEN-ZHAO Shenzhen City CN - A manipulator includes a main body, and a grasping device mounted to the main body. The grasping device includes a mounting board and two grasping members secured on the mounting board. The two grasping members move towards and away from each other, each grasping member is able to grasp a loader at a specific position of the loader.01-17-2013
20130133187POSITIONING SYSTEM FOR POSITIONING A POSITIONING UNIT ALONG A LONGITUDINAL AXIS - A positioning system for positioning a positioning unit along a longitudinal axis includes: a linear guide arrangement for enabling a linearly guided motion parallel to the axis; a motor includes a moving motor member operatively connected to the linear guide arrangement and an elongated stationary motor member extending parallel to the axis; and a force transmission arrangement operatively connecting the moving motor member to the positioning unit, wherein the force transmission arrangement is arranged to provide a semi-rigid engagement between the positioning unit and the moving motor member, wherein the positioning unit and the moving motor member, respectively, are operatively connected to the linear guide arrangement by at least two guide engaging carriages, and wherein the positioning unit is attached to the guide engaging carriages by rigid or resilient positioning unit holders.05-30-2013
20090133248DEVICE FOR MOUNTING LIGHT EMITTING ELEMENT - A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element. A suction head is inserted between a first camera and a second camera having relatively fixed optic axes, a head reference mark of the suction head is captured with the first camera, the end face of a light emitting element suctioned by the suction head is captured with the second camera, the light axis emitted by the light emitting element is captured with a third camera, a stage is inserted between the first camera and the second camera, a board held on the stage is captured with the first camera, a stage reference mark of the stage is captured with the second camera, the relative position between the light emitting element and the suction head and the relative position between the board and the stage are calculated using the image information from both cameras, the suction head and the stage are moved to a mounting position, the head reference mark and the stage reference mark are recognized with the first and second cameras, and the suction head and the stage are subjected to position correction based on the relative position information.05-28-2009
20130118006ELECTRONIC COMPONENT MOUNTING DEVICE - In the substrate-bottom receiving mechanism 05-16-2013
20130139380CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME - A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board.06-06-2013
20130192061LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD IN LED PACKAGE MANUFACTURING SYSTEM - In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member 08-01-2013

Patent applications in class Means to fasten electrical component to wiring board, base, or substrate

Patent applications in all subclasses Means to fasten electrical component to wiring board, base, or substrate