| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 029848000 | With molding of insulated base | 12 |
| 20090106976 | METHOD FOR REDUCING NOISE COUPLING IN HIGH SPEED DIGITAL SYSTEMS - Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer. | 04-30-2009 |
| 20080235942 | LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES - A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure. | 10-02-2008 |
| 20090199401 | METHOD FOR FORMING CAST FLEXIBLE SUBSTRATE AND RESULTANT SUBSTRATE AND ELECTRONIC DEVICE - A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface. | 08-13-2009 |
| 20110119912 | METHOD FOR MANUFACTURING TAPE WIRING BOARD - A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may he reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate tine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern. | 05-26-2011 |
| 20100000088 | METHOD FOR MAKING A THREE-DIMENSIONAL MULTI-LAYERED INTERCONNECT DEVICE - A method for making a three-dimensional interconnect device, the device including a plurality of interconnection layers. The method includes laminating a printed circuit board comprising a plurality of interconnection layers, inserting the printed circuit board in a three-dimensional mold, injecting a molding material into the mold, so as to form a three-dimensional structure encompassing the printed circuit board, and metallizing a portion of the outer surface of the three-dimensional structure, so that it is connected with at least one interconnection layer of the printed circuit board. | 01-07-2010 |
| 20120060368 | METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE - A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device. | 03-15-2012 |
| 20120060367 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate. | 03-15-2012 |
| 20100242274 | DETECTING TOUCH ON A CURVED SURFACE - Embodiments are disclosed herein that are related to input devices with curved multi-touch surfaces. For example, in one disclosed embodiment, a method of making a multi-touch input device having a curved touch-sensitive surface comprises forming on a substrate an array of sensor elements defining a plurality of pixels of the multi-touch sensor, forming the substrate into a shape that conforms to a surface of the curved geometric feature of the body of the input device, and fixing the substrate to the curved geometric feature of the body of the input device. | 09-30-2010 |
| 20120317806 | Method for Forming Package Substrate - A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion. | 12-20-2012 |
| 029849000 | Simultaneous circuit manufacturing | 3 |
| 20130025120 | WIRING BOARD AND MANUFACTURING METHOD FOR SAME - A wiring board having high connection reliability is provided. The wiring board comprises: an insulating base material ( | 01-31-2013 |
| 20120227261 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming on a support board a first resin insulation layer, forming a second resin insulation layer on the first resin insulation layer, forming in the second resin insulation layer an opening portion in which an electronic component having an electrode is mounted, accommodating the electronic component in the opening portion of the second resin insulation layer such that the electrode of the electronic component faces an opposite side of the first resin insulation layer, forming on the first surface of the second resin insulation layer and the electronic component an interlayer resin insulation layer, and forming in the interlayer resin insulation layer a via conductor reaching to the electrode of the electronic component. | 09-13-2012 |
| 20110099806 | Method of manufacturing a multilayer wiring board - First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers. | 05-05-2011 |
