Class / Patent application number | Description | Number of patent applications / Date published |
029842000 | Assembling terminal to base | 51 |
20080209720 | Method and Apparatus for Manufacturing a Probe Card - In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured. | 09-04-2008 |
20080222885 | METHOD FOR MANUFACTURING HYBRID PRINTED CIRCUIT BOARD - A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal. | 09-18-2008 |
20090158584 | Cable termination methods and apparatus - A termination for a multi-conductor cable is made by providing a metal structure that includes a plurality of parallel but spaced apart fingers that are joined together by a connecting member adjacent at least one end of each finger. Each of the conductors in the cable is connected to a respective one of the fingers at a location that is spaced from the connecting member. The cable and the fingers are then over-molded with an insulating material where the conductors are connected to the fingers. This over-molding leaves a portion of the length of each finger exposed. The connecting member is then severed and removed. | 06-25-2009 |
20090188108 | METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE - Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate. | 07-30-2009 |
20090282674 | ELECTRICAL INTERCONNECT STRUCTURE AND PROCESS THEREOF AND CIRCUIT BOARD STRUCTURE - An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core, an ultra fine pattern, and a patterned conductive layer. The core has a surface, and the ultra fine pattern is inlaid in the surface of the core. The patterned conductive layer is disposed on the surface of the core and is partially connected to the ultra fine pattern. Since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core. | 11-19-2009 |
20090300913 | Method for connecting tab pattern and lead wire - A method is for connecting a tab pattern formed on a base sheet and a lead wire, wherein the tab pattern includes: a tab main portion; and a connecting portion formed to continue from one edge line of the tab main portion and to extend from the tab main portion along an extension line that is substantially orthogonal to the edge line, and wherein the method includes: connecting the lead wire on the tab main portion by bonding the lead wire at a position being displaced from the extension line of the connecting portion for more than a given offset amount where the extension line is identical to a center line of the connecting portion, the position being within a given distance from the edge line of the tab main portion. | 12-10-2009 |
20090320281 | Apparatus and methods of forming package-on-package interconnects - Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. | 12-31-2009 |
20100000085 | LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES - A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. | 01-07-2010 |
20100018050 | Small Volume In Vitro Sensor and Methods of Making - A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent. | 01-28-2010 |
20100018051 | Small Volume In Vitro Sensor and Methods of Making - A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent. | 01-28-2010 |
20100031500 | METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE - Methods of fabricating a base layer circuit structure are provided. One fabrication method includes: providing an alignment carrier having a support surface; forming a plurality of electrically conductive structures above the support surface of the alignment carrier; disposing a structural material around and physically contacting the side surfaces of the electrically conductive structures formed above the support surface, the structural material having an upper surface coplanar with or parallel to the upper surface of one or more of the electrically conductive structures; exposing, if covered, the upper surfaces of the electrically conductive structures to facilitate electrical connection to the structures; and separating the alignment carrier from the base layer circuit structure. The base layer circuit structure includes the plurality of electrically conductive structures and the structural material surrounding and physically contacting the electrically conductive structures. | 02-11-2010 |
20100077608 | Alternating Via Fanout Patterns - Various techniques are disclosed for identifying different fanout via configurations that can be created using fanout vias, and then arranging those fanout via configurations in an alternating manner in order to increase the amount and/or area of routing channels available to route traces to the fanout vias. According to some of these techniques, a first fanout via configuration is selected, which can connect a component pin to a first layer of a multilayer printed circuit board. Next, a second fanout via configuration is selected, which can connect a component pin to a second layer of a multilayer printed circuit board different from the first layer. When the printed circuit board is designed, lines of these vias configurations are formed to correspond to a component that will be mounted on the printed circuit board. Each line will have a series of the first fanout via configuration alternating with a series of the second fanout via configuration. Further, two or more fanout via configurations of the same type can be arranged into a via configuration model. A printed circuit board design may then have lines of different via configuration models, such that each line has a series of one type of fanout via configuration model alternating with a series of another type of via fanout configuration model. Alternately or additionally, yet another type of fanout via configuration may be identified. Fanout via configurations of this other type may then be placed along a diagonal line bisecting the area of a printed circuit board design corresponding to the location at which a component will be mounted, in order to preserve routing channel area along the diagonal line. | 04-01-2010 |
20100083496 | COMPLIANT MEMBRANE THIN FILM INTERPOSER PROBE FOR INTEGRATED CIRCUIT DEVICE TESTING - A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto. | 04-08-2010 |
20100212153 | Method for Fabricating a Bond - The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor. To fabricate the bond, a portion of a provided contact conductor above the surface zone is pressed on to the protective layer and the body so that the protective layer is destroyed above the surface zone in achieving an electrically conductive bond between the metallic surface and the contact conductor. | 08-26-2010 |
20100306998 | DEVICE AND METHOD FOR FITTING PRINTED CIRCUIT BOARDS WITH CONTACT PINS - A device for fitting printed circuit boards ( | 12-09-2010 |
20110072656 | METHOD FOR FORMING A CURRENT DISTRIBUTION STRUCTURE - A method for forming an electrical structure. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive pad. The electrically conductive pad is electrically and mechanically connected to the interconnect structure. The plurality of wire traces comprises a first wire trace, a second wire trace, a third wire trace, and a fourth wire trace. The first wire trace and second wire trace are each electrically connected to a first side of the electrically conductive pad. The third wire trace is electrically connected to a second side of the electrically conductive pad. The fourth wire trace is electrically connected to a third side of said first electrically conductive pad. The plurality of wire traces are configured to distribute a current. | 03-31-2011 |
20110131805 | Electrical connector with low-stress, reduced-electrical-length contacts - An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB. | 06-09-2011 |
20120117799 | Miniaturized Spring Contact - A method of manufacturing an array of miniaturized spring contacts is disclosed. The invention teaches a symmetric design of the spring contact with two anchoring traces at each side of the spring contact, and teaches a method of forming the spring contact with a continuo us, zero-stress core member throughout the entire body of the spring contact; besides these, the invention enables easy manufacturing of integrated fine pitch spring contact arrays, allows fabrication of such spring contact arrays with extremely uniform spring height and good electrical and mechanical properties. | 05-17-2012 |
20130145619 | PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS - Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole. | 06-13-2013 |
20130152386 | METHODS AND APPARATUS TO FORM ELECTRICAL INTERCONNECTS ON OPHTHALMIC DEVICES - Methods and apparatus for forming interconnects on the surfaces of three dimensional substrates, including ophthalmic devices incorporating one or more electrical components may be utilized to provide high quality electrical and mechanical connections. | 06-20-2013 |
20130185935 | METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE - Methods of fabricating a base layer circuit structure are provided. One fabrication method includes: providing an alignment carrier having a support surface; forming a plurality of electrically conductive structures above the support surface of the alignment carrier; disposing a structural material around and physically contacting the side surfaces of the electrically conductive structures formed above the support surface, the structural material having an upper surface coplanar with or parallel to the upper surface of one or more of the electrically conductive structures; exposing, if covered, the upper surfaces of the electrically conductive structures to facilitate electrical connection to the structures; and separating the alignment carrier from the base layer circuit structure. The base layer circuit structure includes the plurality of electrically conductive structures and the structural material surrounding and physically contacting the electrically conductive structures. | 07-25-2013 |
20130232782 | Method of Producing an Interposer with Microspring Contacts - An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer. | 09-12-2013 |
20130283607 | METHOD OF MANUFACTURING RF ABLATION PROBE WITH UNIBODY ELECTRODE ELEMENT - An ablation probe and method of manufacturing the ablation probe are provided. The probe comprises a probe shaft and a unibody electrode element. The unibody electrode element comprises a common electrode base located at the distal end of the shaft, and a plurality of electrode tines distally extending from the electrode base. The electrode element may be created by forming divisions (such as slits or slots) from a first end of an electrically conductive elongate member towards an opposing second end of the elongate member. Alternatively, the divisions can be formed from a first end of an electrically conductive sheet towards an opposing second end of the sheet, and then bent or rolled to form the elongate member. In either case, the common electrode base can either be separately mounted to a probe shaft, or the probe shaft can be formed from the elongate member, in which case, the electrode base will be integrated with the probe shaft as a unibody structure. The electrode tines can be optionally shaped, e.g., to proximally evert. | 10-31-2013 |
20130283608 | Planar Contact with Solder - A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip. | 10-31-2013 |
20140041215 | METHODS AND APPARATUS FOR PRECISION INSERTION - Systems, apparatuses and methods are described herein for precision insertion. In various embodiments, a feeder device may be configured to feed an object such as wire from a wire source into a wire path. In various embodiments, a guidance device with a channel that at least partially defines the wire path may receive the wire fed from the feeder device. In various embodiments, a base may be provided for mounting at least one of a first substrate having a first aperture and a second substrate having a second aperture so that the first aperture of the first substrate is aligned with the second aperture of the second substrate. In various embodiments, the base may be configured to be movable relative to the guidance device to position the first substrate or second substrate so that the first or second aperture is aligned with the wire path. | 02-13-2014 |
20140208589 | Method And Tool For Assisting Alignment Of A Pin Header - The present invention relates to a method and tool for assisting alignment of one or more pin headers. In particular, the invention relates to a tool-assisted method of aiding alignment of one or more pin headers placed on a printed circuit board (PCB) prior to soldering, as well as to the tool itself. | 07-31-2014 |
20140237817 | LIQUID CRYSTAL ALIGNMENT LAYERS AND METHOD OF FABRICATION - Methods are provided for making layers with nano-and micro-patterned topographies by laser action or inkjet printing on a first surface. These topographies have a periodicity of 5 nm to 500 μm in a first direction in the plane of the first surface. These layers can be used as anisotropically patterned alignment layers in electro-optical devices and generate an orientational order of at least 0.30. | 08-28-2014 |
20140310956 | CONNECTOR SUPPORT SYSTEM - A connector support system for an automation system device is provided. The connector support system includes a device housing configured to hold a printed circuit board with a connector coupled to the printed circuit board. The connector support system also includes one or more support members coupled to a surface of the housing, wherein the one or more support members are configured to support the connector relative to the housing and configured to resist an overturning moment tending to remove the connector from the printed circuit board. | 10-23-2014 |
20150033556 | FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF - A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection. | 02-05-2015 |
20150305425 | HELMET CONFIGURED FOR ELECTRONICS - Integrated helmet systems provide convenient and modular use of electronic devices with a protective helmet. In addition to ease of use, weight savings and space savings also may be realized in certain embodiments. A flexible printed circuit board is used as a power bus to deliver electrical power from a battery pack to various electronic devices. Examples of devices used with protective helmets include: night vision goggles; helmet-mounted display units; ear phones; communication headsets; camera systems; biometric sensors; microprocessors; identify friend or foe devices (IFFs); and GPS devices. | 10-29-2015 |
20150318653 | DOCKING STATION HAVING CONNECTOR PRELOAD AND ISOLATOR SYSTEM - A method for mounting a rigid electrical connector, including selecting an electrical connector that is compatible with a predetermined portable electronic device; forming an aperture through an interface member, wherein the aperture is larger than the electrical connector; selecting an elastomeric potting material that is compatible with both the electrical connector and the interface member; locating the electrical connector in the aperture with a space between the electrical connector and the interface member; introducing the elastomeric potting material in an uncured state into the space between the electrical connector and the interface member; and while maintaining the space between the electrical connector and the interface member, curing the elastomeric potting material in the space therebetween. | 11-05-2015 |
20150318655 | MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY - A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands. | 11-05-2015 |
20160020121 | EMBEDDED PACKAGING WITH PREFORMED VIAS - Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front surface and contacts at the front surface; rigid metal posts disposed between at least one edge surface and a corresponding edge of the assembly, each metal post having a sidewall separating first and second end surfaces, the sidewalls have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation contacting at least the edge surfaces and the sidewalls; an insulation layer overlying the encapsulation; connection elements extending through the insulation layer, wherein at least some connection elements have cross sections smaller than those of the metal posts; a redistribution structure deposited on the insulation layer and electrically connecting first terminals with corresponding metal posts through the first connection elements, some metal posts electrically coupled with contacts of microelectronic element. | 01-21-2016 |
20160128206 | Method of Producing an Interposer with Microspring Contacts - An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer. | 05-05-2016 |
029843000 | By metal fusion bonding | 11 |
20080301935 | SUBSTRATE MANUFACTURING METHOD AND APPARATUS - A substrate manufacturing apparatus | 12-11-2008 |
20090007425 | Method for Manufacturing Multilayer Wiring Board - Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board ( | 01-08-2009 |
20090049688 | LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES - A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. | 02-26-2009 |
20090077798 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS - A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer. | 03-26-2009 |
20110000083 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING METAL BUMP - Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board. | 01-06-2011 |
20110119911 | Wired circuit board - A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer | 05-26-2011 |
20110126409 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process. | 06-02-2011 |
20140020246 | METHOD OF MOUNTING A CONNECTOR - A board-mountable connector is provided. The connector includes a shield and an insulative housing with a tongue. Terminals are supported by the housing in two rows and the rows extend from a mating interface to a board mounting interface. The terminals may be mounted to the board via surface mount technology in two rows that are at about 0.4 mm pitch. The two rows of terminals are configured in a signal, signal, ground triangular configuration so as to provide a triangular terminal arrangement that extends from the mating interface to the mounting interface. | 01-23-2014 |
20140075751 | METHOD FOR MANUFACTURING LED LEAD FRAME - The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas. | 03-20-2014 |
20140317919 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process. | 10-30-2014 |
20160375596 | METHOD OF ASSEMBLING A PERSONAL CARE PRODUCT - A method of assembling a heating element for a shaving razor by providing an insulating member having a base with a plurality of spaced apart electrical terminals. A flexible printed circuit board having a plurality of spaced apart electrical terminals is provided. The electrical terminals of the insulating member are soldered to the corresponding electrical terminals of the flexible printed circuit board. A liquid non electrically conductive underfiller encapsulant is dispensed between the base of the insulating member of the base of the flexible printed circuit board forming a water tight seal between each of the spaced apart electrical terminals of the insulating member and between each of the electrical terminals of the flexible printed circuit board by curing the liquid non electrically conductive underfiller encapsulant. | 12-29-2016 |
029844000 | By deforming or shaping | 6 |
20080244902 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same - A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically coupled to the conductive sites of a semiconductor chip. A dielectric layer is positioned between both substrates and the substrates are bonded together, such that the chips are internally located within the assembly and oriented in a stacked orientation. A method of making such an assembly is also provided, as is an electrical assembly utilizing same and an information handling system adapted for having such an electrical assembly as part thereof. | 10-09-2008 |
20090025214 | APPARATUS FOR FIXING FLEXIBLE PRINTED CIRCUIT MODULE TO SLIDING MECHANISM OF PORTABLE ELECTRONIC DEVICE - An apparatus ( | 01-29-2009 |
20100115768 | METHOD FOR ADAPTING AN ELECTRONIC COMPONENT FOR SURFACE MOUNTING - The invention relates to a method for adapting an electronic component with leads that are not suited to surface mounting on an electrical circuit. The method includes a step of bending said leads. The bending step shapes the leads of said component so that they are suitable for mounting on the surface of the electrical circuit. In particular, the invention applies to electronic components such as radio frequency and microwave power transistors, marketed notably in a straight-lead version. | 05-13-2010 |
20120117800 | Automated Twist Pin Assembling Method for Interconnecting Stacked Circuit Boards in a Module - Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module. | 05-17-2012 |
029845000 | With shaping or forcing terminal into base aperture | 2 |
20100024211 | Conductive elastomeric and mecchanical pin and contact system - A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector ( | 02-04-2010 |
20130283609 | METHOD FOR MANUFACTURING SUPPORTING BOARDS OF LIGHT EMITTING DIODE MODULES - A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed. | 10-31-2013 |