Entries |
Document | Title | Date |
20080196245 | METHOD FOR MOUNTING ELECTRONIC COMPONENTS - A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted. | 08-21-2008 |
20080209719 | METHOD FOR MAKING A PROBE CARD - A method for making a probe card includes: mounting a plurality of probe needles on a probe-mounting seat; forming a conductive protective coating on tips of the probe needles; and bonding the probe needles to a printed circuit board through welding techniques after formation of the conductive protective coating on the tips of the probe needles. | 09-04-2008 |
20080222884 | Packaging for chip-on-board pressure sensor - A method of packaging for chip-on-board pressure sensor that includes a buffer layer with a coefficient of thermal expansion (CTE) intermediate between the transducer and a main chip-on-board substrate by which thermally induced package stresses can be greatly reduced or eliminated. Additionally, the use of a buffer layer with higher stiffness (elastic modulus) than the chip-on-board substrate further prevents or reduces flexural (bending) stresses from being transferred to the transducer. Such a buffer layer also enables a wider choice of materials for bonding and stable performance of pressure sensor in harsh media and environmental conditions. The pressure transducer can be adhesively bonded to a ceramic layer, which in turn can be adhesively bonded to an epoxy laminate chip-on-board substrate. | 09-18-2008 |
20080229575 | Semiconductor Chip Attachment - A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point. | 09-25-2008 |
20080235940 | APPARATUSES AND METHODS FOR FORMING SMART LABELS - Apparatuses and methods for forming displays are claimed. This invention relates to a display which may be conformal and which can receive information in order to alter or configure the display. In one embodiment, a flexible layer may be made to receive an array of blocks which drive a display material to provide an alterable or configurable display. This display is coupled to a receiver which receives data and drives the data onto the blocks causing the display to change. The receiver (and blocks) may be powered by a signal from a transmitter which beams the information to the receiver. The receiver in turn controls the update of the display information on the display. Another embodiment of the invention has a receiver coupled to each block. The receiver also may be independent from the block and may be deposited onto the flexible layer. | 10-02-2008 |
20080250635 | COMPONENT PLACEMENT MACHINE - A component placement machine includes: a transport device for transporting PCBs in an X-direction; first and a second feeder areas; at least one Y-slide beam that is drivable in the X-direction; and at least two placement heads on each Y-slide beam, which placement heads are independently drivable in the Y-direction and dependently drivable in the X-direction. Each feeder area includes at least one feeder for storing components. Such a machine enables a number of actions to be performed simultaneously. For example, within a certain period of time, a plurality of placement heads can simultaneously pick up components from a feeder, while other placement heads, which previously picked up components, may be moved to desired X-Y positions of the PCB which the previously picked up components may be placed, thereby resulting in an improved output. | 10-16-2008 |
20080271313 | METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE - A method, system, and apparatus for transfer of dies using a die plate is described herein. The die plate has a planar body. The body has a plurality of holes therethrough. A support structure and the die plate can be positioned to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure adheres to a first surface of the die plate. The dies can subsequently be transferred from the die plate to one or more destination substrates or other surfaces, by a punching mechanism. | 11-06-2008 |
20080276456 | Method for Producing a Number of Chip Cards - A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step. | 11-13-2008 |
20080295326 | Manufacture of a Layer Including a Component - A method for manufacturing a circuit-board layer on a base surface ( | 12-04-2008 |
20080295327 | FLEXIBLE CIRCUIT - The present application is directed to a method of producing a multilayer circuit. The method comprises providing a first electrically insulating layer comprising apertures through the layer and bonding the first electrically insulating layer with a first conductive layer. The first conductive layer is bonded to the first electrically insulating layer in register to the apertures in the electrically insulating layer and the multilayer circuit is produced at a sustained rate. | 12-04-2008 |
20080307642 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE - There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole. | 12-18-2008 |
20090000114 | HEAT SINK FORMED WITH CONFORMAL SHIELD - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 01-01-2009 |
20090025211 | ISOLATED CONFORMAL SHIELDING - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 01-29-2009 |
20090025212 | Wired circuit board and production method thereof - A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern | 01-29-2009 |
20090025213 | Substantially Continuous Layer of Embedded Transient Protection For Printed Circuit Boards - The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed. | 01-29-2009 |
20090031562 | TAPE FEEDER FOR COMPONENT MOUNTER PROVIDING STABLE TAPE FEEDING AND METHOD FOR MOUNTING A COMPONENT ON A CIRCUIT BOARD WITH COMPONENT MOUNTER - Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear. | 02-05-2009 |
20090056117 | Method of partially attaching an material for various types of printed circuit boards - In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment. | 03-05-2009 |
20090064494 | MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE - A manufacturing process for a Quad Flat Non-leaded (QFN) chip package structure is provided. First, a patterned conductive layer and a patterned solder resist layer on the patterned conductive layer are provided. A plurality of chips are bonded onto the patterned solder resist layer such that the patterned solder resist layer are between the chips and the patterned conductive layer. The chips are electrically connected to the patterned conductive layer by a plurality of bonding wires, wherein the chips and the bonding wires are at the same side of the patterned conductive layer. At least one molding compound is formed to encapsulate the patterned conductive layer, the patterned solder resist layer, the chips and the bonding wires. Then, the molding compound, the patterned conductive layer and the patterned solder resist layer are separated. | 03-12-2009 |
20090070994 | METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED - A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive. | 03-19-2009 |
20090077796 | SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate. | 03-26-2009 |
20090077797 | ELECTRIC CONNECTION ELEMENT, AND METHOD OF CONTACTING ELECTRIC COMPONENTS - In a method of contacting electric components, in particular solar cells, a surface area of an electric conductor is enlarged. The electric conductor is coated with an electrically conductive coating; thereby producing an electric connection element which is then placed onto an electric component with the enlarged surface area facing the electric component to thereby enable the coating to establish a firm connection between the electric conductor and the electric component. | 03-26-2009 |
20090090000 | In-mould molding touch module and method for manufacturing the same - An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode. | 04-09-2009 |
20090090001 | METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE - A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time. | 04-09-2009 |
20090090002 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT SUBSTRATE - A method of manufacturing an electronic component substrate is provided, the method allowing manufacturing yield to be improved. The method of manufacturing an electronic component substrate in which a plurality of electronic components are mounted on a first substrate includes the steps of: aligning and disposing the plurality of electronic components on a second substrate; transferring the electronic components on the second substrate onto the first substrate; detecting an electronic component un-mounted portion on the first substrate; and repairing by selectively re-transferring the electronic component from the second substrate onto the detected un-mounted portion on the first substrate. | 04-09-2009 |
20090100672 | ELECTRONIC COMPONENT PLACEMENT METHOD - In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads. | 04-23-2009 |
20090119910 | COMPONENT WITH BONDING ADHESIVE - A device comprising a component and an adhesive attached to at least one exterior portion of the component. When the component is on a printed circuit and passed through a reflow operation, the adhesive melts forming a physical bond between the component and the printed circuit. The printed circuit may be a flexible printed circuit or a printed circuit board. The adhesive may melt under and to at least one edge of the component. The adhesive may also melt under and to at least one edge of the component and under and to at least one edge of at least one second component adjacent to the component. | 05-14-2009 |
20090119911 | FORMING A THREE-DIMENSIONAL STACKABLE DIE CONFIGURATION FOR AN ELECTRONIC CIRCUIT BOARD - Forming a three-dimensional die configuration for an electronic circuit board includes locating a first electronic component in at least one cavity formed in a circuit board, and positioning a first substrate member in the at least one cavity. The first substrate member includes a first surface electrically connected to the first electronic component, and a second surface. A first surface of a double-sided land grid array is connected to the second surface of the first substrate member, and a first surface of a second substrate member is connected to a second surface of the double-sided land grid array. A second electronic component is mounted to a second surface of the second substrate member, and a portion of the second electronic component is covered with a thermal interface member. A cap member is mounted to the second electronic component and the thermal interface member to form a three-dimensional die configuration. | 05-14-2009 |
20090119912 | ELECTRONIC COMPONENT MOUNTING APPARATUS - This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component. | 05-14-2009 |
20090126188 | ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND MOUNTING METHOD - A thermo-compression tool removably fitted on a thermo-compression head in an electronic component mounting apparatus includes a base member which is removably fitted on a head-bottom face of the thermo-compression head and in which heating by heat transfer for thermo-compression is performed through the head-bottom face of the head, and a suck-up member having a suck-up surface which is formed so as to be smaller than a lower surface of the base member in correspondence to a size of the electronic component and by which the electronic component is sucked up and held, the suck-up member being fixed on the lower surface of the base member at a position displaced from a center thereof. As a result, in thermo-compressing and mounting of electronic components onto a plurality of unit boards segmented in a multi-piece board with a thermo-compression tool, occurrence of any thermal adverse influences of radiant heat of the thermo-compression tool on the thermosetting bonding material placed on before-mounting unit boards can be avoided. | 05-21-2009 |
20090126189 | METHOD FOR PRODUCING PRINTED CIRCUIT BOARD ASSEMBLY AND MOUNTING DEVICE - A mounting device for mounting an component onto a circuit board may include: a first memory to store mounting data associating a placement of a component in the mounting device with a mounting position of the component on the circuit board, a second memory to store reference data corresponding to a reference component, a placement data changer to change data specifying the placement of the component in the mounting device to data specifying a placement of the reference component in the mounting device, a mounting position data changer to change data specifying a mounting position of the component on the circuit board to data specifying a mounting position of the component that is previously indicated, and a mounter to mount the component at a position on the circuit board specified by the changed mounting data. | 05-21-2009 |
20090133252 | Chip Capacitor - Various capacitors for use with integrated circuits and other devices and fabrication methods are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first capacitor plate that has at least two non-linear strips and forming a second capacitor plate that has a non-linear strip positioned between the at least two non-linear strips of the first capacitor plate. A dielectric is provided between the non-linear strip of the second capacitor plate and the at least two non-linear strips of the first capacitor plate. | 05-28-2009 |
20090144970 | FABRICATING AN ARRAY OF MEMS PARTS ON A SUBSTRATE - A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises fabricating a MEMS part on a substrate, and detaching the MEMS part from the substrate. After detaching the MEMS part from the substrate, attaching the MEMS part to an application platform. | 06-11-2009 |
20090183364 | METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXIBLE CIRCUITS IN A SEMI-STACKING CONFIGURATION - A method of serially connecting devices utilizing flexible circuits in a semi-stacking configuration includes positioning a first flexible circuit on a carrier, the first flexible circuit includes a bottom surface and a top surface, a portion of the bottom surface is mounted to the carrier while another portion of the bottom surface is elevated at a first angle with respect to the carrier; coupling a first device on a portion of the top surface of the first flexible circuit, the first device being elevated at the first angle; positioning a second flexible circuit on the carrier, the second flexible circuit having an upper surface and a lower surface, a portion of the lower surface is mounted to the carrier while another portion of the lower surface is elevated at a second angle with respect to the carrier and overlapped over a top surface portion of the first device; and coupling a second device on a portion of the upper surface of the second flexible circuit, the second device being elevated at the second angle. | 07-23-2009 |
20090199399 | METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS - A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern. | 08-13-2009 |
20090211086 | ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS - The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board. | 08-27-2009 |
20090217515 | ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT - Manufacturing an electronic component | 09-03-2009 |
20090217516 | Method for Producing Optoelectronic Components, and Products Produced Thereby - The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto. | 09-03-2009 |
20090217517 | Laser-based technique for the transfer and embedding of electronic components and devices - A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system. | 09-03-2009 |
20090217518 | DEVICE-INCORPORATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF AS WELL AS PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF - A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet ( | 09-03-2009 |
20090249619 | OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS - An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure. | 10-08-2009 |
20090265928 | Circuit board and manufacturing method thereof - A circuit board may have a metal land supporting a pillar. The pillar may be fabricated by half-etching the metal land. An insulating layer may be provided on the circuit board so that the pillar of the metal land may be exposed through the insulating layer. | 10-29-2009 |
20090271980 | METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS - A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage. An amount of local convex warpage to be introduced into the integrated electronic panel assembly is then determined, which together with the fixed amount of global convex warpage provides a combined convex warpage to the integrated electronic panel assembly. Accordingly, the global and local convex warpage counteract the concavity to be introduced subsequently by a build-up layer processing and is sufficient to enable subsequent planar processing of a completed integrated electronic panel assembly. | 11-05-2009 |
20090271981 | METHOD OF FABRICATING A DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR STRIPPING FLEXIBLE-SUBSTRATE - A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible substrate is directly formed on the interfacing layer. The flexible substrate fully contacts the interfacing layer. A device structure is then formed on the flexible substrate. | 11-05-2009 |
20090293271 | PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A printed wiring board is manufactured by a method in which an alignment mark is formed in a metal foil, a bump is formed on the metal foil at a position determined based on the alignment mark, an electronic component is aligned with the bump based on the alignment mark, the electronic component is connected with the bump, and an insulation layer is formed over the electronic component. | 12-03-2009 |
20090300912 | Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface Area - An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers and an integrated-circuit (IC) device mounted on to the upper surface of the flex capacitor circuit and electrically connected to the flex capacitor circuit. The flex capacitor circuit is configured to provide bypass capacitance and, therefore, adds capacitance to the IC device when the IC device is mounted on the flex capacitor circuit. | 12-10-2009 |
20100018048 | CONNECTING METHOD OF ELECTRONIC COMPONENT - It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. | 01-28-2010 |
20100024210 | Product Optimization Process for Embedded Passives - A method is provided for manufacturing a multi-layer circuit board having embedded passive components. The method includes selectively removing portions of at least one layer of the multi-layer circuit board ( | 02-04-2010 |
20100050429 | COMPONENT MOUNTING METHOD - A component mounting method in which a component can be mounted with high mounting accuracy even onto a board that is long in a transportation direction in a component mounter, includes: calculating a first amount of correction for a component mounting position by recognizing positions of board marks in the first mounting area (S | 03-04-2010 |
20100050430 | Method for Holding and Carrying Substrate - A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices. | 03-04-2010 |
20100064511 | METHOD FOR COMPONENT MOUNTING - A method for component mounting which reduces the length of time that a component mounter called alternate mounting component mounter takes for mounting components is a method for component mounting used for a component mounter including plural mounting heads which alternately mount components onto a board. The method includes specifying, as a first mounting head, one of the plural mounting heads which moves a shortest distance to the board (S | 03-18-2010 |
20100083491 | ELECTONIC COMPONENT MOUNTING APPARATUS - A paste storage portion | 04-08-2010 |
20100083492 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board. | 04-08-2010 |
20100083493 | TRANSFER TAPE STRAP PROCESS - A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process. | 04-08-2010 |
20100083494 | Bonding Tool for Mounting Semiconductor Chips - A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions. | 04-08-2010 |
20100095522 | Method of manufacture of an identification wristband construction - A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at predetermined areas on the bottom substrate. A remainder of the circuit is deposited on the bottom substrate and dielectric materials. A transponder chip is secured to the bottom substrate to form a transponder. A second substrate is affixed to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and second substrate. | 04-22-2010 |
20100101081 | MANUFACTURING METHOD FOR PROTECTION CIRCUIT MODULE OF SECONDARY BATTERY - A manufacturing method for a protection circuit module of a secondary battery is disclosed. The method includes mounting a die type circuit device to an FPCB. The mounting of the circuit device includes bonding the circuit device to the FPCB by wire bonding. The method may further include forming a protective layer on the FPCB to cover the circuit device. The protective layer may be formed by coating insulation resin on the FPCB. | 04-29-2010 |
20100101082 | MOUNTING APPARATUS, MOUNTING METHOD AND BOARD IMAGING DEVICE TRANSFER METHOD EMPLOYED IN THE MOUNTING APPARATUS - A mounting apparatus mounts a component (A) on a board (W). The mounting apparatus is provided with a head unit ( | 04-29-2010 |
20100107410 | COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR TRANSPORTING SUBSTRATES THROUGH SUCH A COMPONENT PLACEMENT DEVICE - A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor. The substrate conveyor comprises a substrate feeding portion comprising at least two substrate feed tracks extending parallel to each other, a substrate processing portion located near the component feeder, which is connected to the substrate feeding portion and which comprises a single substrate processing track, a substrate discharging portion connected to the substrate processing portion, which comprises at least two substrate discharge tracks extending parallel to each other, as well as transfer means for transferring substrates from a second substrate feed track to a first substrate feed track and from a first substrate discharge track to a second substrate discharge track. | 05-06-2010 |
20100115767 | METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COMPONENTS - A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric layer, and a carrier board sequentially provided thereon with a second metal layer, a high dielectric material layer, and a third wiring layer with a plurality of first electrode plates thereon; laminating the core board, second dielectric layer, and carrier board to one another; removing the carrier board so as to expose the second metal layer; and patterning the second metal layer so as to form a fifth wiring layer having a plurality of second electrode plates and a plurality of second conductive vias electrically connected to the third wiring layer, thereby allowing the first electrode plates, high dielectric material layer, and second electrode plates together to form a plurality of capacitance components. | 05-13-2010 |
20100122455 | COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD - A component mounting apparatus | 05-20-2010 |
20100132189 | Method for taking an electronic component out of a carrier tape - A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall. | 06-03-2010 |
20100139088 | METHOD OF MANUFACTURING THE CIRCUIT APPARATUS, METHOD OF MANUFACTURING THE CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE CIRCUIT DEVICE - A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls. | 06-10-2010 |
20100146778 | PRODUCTION METHOD FOR ELECTRONIC CHIP COMPONENT - A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers. | 06-17-2010 |
20100146779 | METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED WIRING BOARD - A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable. | 06-17-2010 |
20100154210 | Method of manufacturing a printed circuit board having embedded electronic components - A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet. | 06-24-2010 |
20100170085 | METHOD FOR PRODUCING AN ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer. | 07-08-2010 |
20100186226 | FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION - A method for self-assembly is disclosed that accomplishes the assembly process in one step, obviating or mitigating the need for post-processing of an assembled macro-electronic device. Microcomponents are fabricated having a particular shape, and a template with embedded interconnects is fabricated having recessed binding sites that are sized to receive particular microcomponent types. The binding sites include a low melting point alloy for electrically connecting received microcomponents to the interconnect network. The template is placed in a liquid, and the microcomponents are introduced to the liquid such that the microcomponents flow or slide along the template propelled by gravity and/or fluid-dynamic forces and some of them are received into the binding sites, and retained by capillary forces. The liquid is heated before or after introduction of the microcomponents to melt the alloy. The fluid and/or template are then cooled to harden the alloy, binding the microcomponents. | 07-29-2010 |
20100199491 | MANUFACTURING METHOD OF IMAGE PICK-UP DEVICE, IMAGE PICK-UP DEVICE AND OPTICAL ELEMENT - A manufacturing method of image pick-up device preventing deform of the optical element by the reflow process includes, a step of forming an by curing a thermosetting resin material having viscosity of 50 to 50,000 mPa·s under measuring condition at 23° C. and 500 Hz, a step of placing the optical element together with an electronic parts on a substrate, and a step mounting the optical element and the electronic parts on the above mentioned substrate by performing a reflow process to the optical element and the electronic parts on the substrate. | 08-12-2010 |
20100212150 | Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same - A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core. | 08-26-2010 |
20100212151 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND OPERATION INSTRUCTION METHOD FOR USE WITH THE SAME - A challenge to be met by the present invention is to provide an electronic component mounting system that can provide accurate operation instruction by displaying an operation instruction screen on a display panel in sufficient amount of information and an operation instruction method for use in the electronic component mounting system. | 08-26-2010 |
20100229382 | METHOD OF ATTACHING AN ELECTRONIC DEVICE TO AN MLCC HAVING A CURVED SURFACE - A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch. | 09-16-2010 |
20100236063 | IMAGING DEVICE, AND METHOD FOR MANUFACTURING THE SAME - A vehicle-mounted camera ( | 09-23-2010 |
20100242272 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board (PCB) having embedded components. The method includes: forming a cavity in one side of a dielectric substrate; inserting a first component in the cavity such that an electrode thereof faces the one side of the dielectric substrate; mounting a second component on one side of the first component such that an electrode thereof faces the same direction as the electrode of the first component; forming a first dielectric layer on one side of the dielectric substrate such that the first dielectric layer covers the second component; and forming a second dielectric layer on the other side of the dielectric substrate such that the second dielectric layer covers the first component. | 09-30-2010 |
20100251542 | Electronic Device Comprising an Integrated Circuit and a Capacitance Element - An electronic device (ICD) comprises an integrated circuit (AIC) and a capacitance element (PIC). The integrated circuit (AIC) is provided with a plurality of circuit contact pairs (CI). The capacitance element (PIC) is provided with a plurality of capacitance contact pairs (CC). A capacitance is present between each of at least part of the capacitance contact pairs (CC). The plurality of capacitance contact pairs (CC) faces the plurality of circuit contact pairs (CI). At least a part of the capacitance contact pairs (CC) is electrically coupled in a pair-by-pair manner to at least a part of the circuit contact pairs (CI). | 10-07-2010 |
20100251543 | MULTI-FUNCTION MODULE - An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard. | 10-07-2010 |
20100263209 | ELECTRONIC COMPONENT MOUNTING APPARATUS - An electronic component mounting apparatus 1 includes a substrate conveyance mechanism 14 for conveying substrates 13 and 13 | 10-21-2010 |
20100269333 | Method for Mounting Flip Chip and Substrate Used Therein - The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes ( | 10-28-2010 |
20100325883 | CAMERA MODULE BACK-FOCAL LENGTH ADJUSTMENT METHOD AND ULTRA COMPACT COMPONENTS PACKAGING - The present invention relates to methods of manufacturing ultra-compact camera modules, adjusting them, post production, to precise focal point settings, and sealing the precisely aligned assembly to maintain the focal point. Also, the invention specifically relates to ultra-compact camera module apparatuses. | 12-30-2010 |
20110030208 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS - An apparatus and method for mounting electronic parts are discussed, which are capable of reducing costs. The electronic part mounting apparatus according to an embodiment includes a bulk feeder into which electronic parts in a bulk form are introduced, at least one inspection unit to inspect and align the electronic parts directed from the bulk feeder, an electronic part insertion unit to receive the electronic parts which have been completely inspected in the inspection unit, a positioning wheel installed to rotate along the bulk feeder, the inspection unit, and the electronic part inspection unit and serving to transfer the electronic parts, and a part supply unit to pick up the electronic parts received in the part insertion unit. | 02-10-2011 |
20110047794 | METHOD OF MOUNTING CAPACITOR ARRAY - A capacitor array | 03-03-2011 |
20110061232 | PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0. | 03-17-2011 |
20110072654 | Electronic Component Mounting Apparatus, Component Supply Apparatus, and Electronic Component Mounting Method - There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted. | 03-31-2011 |
20110088257 | MOUNTING APPARATUS - The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed. | 04-21-2011 |
20110099804 | PART MOUNTING DEVICE AND PART MOUNTING METHOD - The present invention addresses the problem to provide a part mounting device and a part mounting method which precisely mount the both end electrodes of the flexible board to mounting portions of both surfaces of the panel and thereby realize a highly reliable mounting. | 05-05-2011 |
20110107594 | PLANAR ELECTRICAL POWER ELECTRONIC MODULES FOR HIGH-TEMPERATURE APPLICATIONS, AND CORRESPONDING PRODUCTION METHODS - With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component ( | 05-12-2011 |
20110119909 | ALIGNMENT MODULE UTILIZING TRANSPARENT RETICLE TO FACILITATE TOOL CALIBRATION DURING THE HIGH TEMPERATURE PROCESS - An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. | 05-26-2011 |
20110119910 | METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A CARRIER SUBSTRATE - Methods and system for forming a microelectronic assembly ( | 05-26-2011 |
20110138620 | Method for manufacturing an electronic assembly - A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component. | 06-16-2011 |
20110146067 | ASSEMBLING METHOD OF A LIQUID CRYSTAL DISPLAY APPARATUS AND A CHIP MOUNTED WIRING SUBSTRATE SUITABLE FOR THE METHOD - A chip mounted circuit substrate (COF) | 06-23-2011 |
20110162202 | ELECTRONIC COMPONENT MOUNTING DEVICE AND WORK METHOD OF ELECTRONIC COMPONENT MOUNTING DEVICE - An object of the invention is to provide an electronic component mounting device and a work method of the electronic component mounting device, capable of ensuring safety of an operator who accesses a work line through a door portion, and avoiding reduction of workability. A space defined by a base ( | 07-07-2011 |
20110179641 | PRINTED ARTICLE - A printed article ( | 07-28-2011 |
20110197438 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes preparing a flexible printed wiring board having a first connection pad formed on a front surface, a second connection pad formed on a back surface, and a coating film covering regions of the flexible printed wiring board where the first and second connection pads are formed, and a semiconductor package having a third connection pad formed on a hack surface; mounting the semiconductor package on the front surface of the flexible printed wiring board so that the third connection pad is connected to the first connection pad; and folding the flexible printed wiring board so that the second connection pad is located above the front surface of the semiconductor package to face in the same direction as a front surface of the semiconductor package. | 08-18-2011 |
20110214286 | HEAD NOZZLE UNIT, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS - A head nozzle unit includes a pair of motion guides located parallel to each other, a pair of movable blocks disposed on the pair of motion guides and movable independently of each other, a guide member transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts disposed on opposite lateral surfaces of the guide member, the pair of head nozzle parts movable independently of each other and operable to pick up and mount electronic parts, and a driver that moves the pair of movable blocks in cooperation with one another and that moves the pair of head nozzle parts in predetermined directions. Further, an apparatus and method for mounting electronic parts includes the head nozzle unit. The pair of head nozzle parts alternately and sequentially performs a series of mounting processes of picking up the electronic parts and mounting the picked up electronic parts. | 09-08-2011 |
20110225818 | METHOD OF MANUFACTURING AN LED ILLUMINATOR DEVICE - A method of manufacturing an LED illuminator is provided. At least one flat heat pipe (FHP) is provided, on which a flat surface is formed. A treating tool is provided to fix the FHP. A printed circuit layer is formed on the flat surface, which includes an insulated layer, a conductive layer and a solder mask layer spread on the flat heat pipe in order, to form solder portions. After that, solder paste is applied on the solder portions, and LED elements are disposed on the solder portions correspondingly. Finally, the FHP and the LED elements are passed through a reflow oven, to accomplish an LED illuminator. The FHP further has locating holes, which are used for orientating the FHP and connecting a heat-dissipating module by a concise assembling element. | 09-22-2011 |
20110225819 | PROCESSOR INSTALLATION AND REMOVAL TOOL - A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented. | 09-22-2011 |
20110247210 | PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR SURFACE MOUNTING - A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink. | 10-13-2011 |
20110247211 | CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURING SAME - A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole extends through the substrate or prepreg on which the electronic component is mounted inside the circuit board. Conductors in the via holes enable a terminal on the surface of the electronic component to be electrically connected to a wiring pattern or another electronic component on the opposite side of the substrate or prepreg. Routing the connection through the electronic component itself saves space and reduces the length of the connection. | 10-13-2011 |
20110265320 | Electronic Thermometer with Flex Circuit Location - A method of making a probe for an electronic thermometer includes positioning a flex circuit together with a probe shaft. Connecting a locating member to the probe shaft. The locating member comprises a resilient locator that is resiliently deformed by engagement with the flex circuit thereby to bias the flex circuit to a selected position. The biasing of the flex circuit by the resilient locator is independent of movement of the probe shaft. | 11-03-2011 |
20110271524 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal. | 11-10-2011 |
20110277320 | Method of manufacturing a PCB having an embedded bare chip - A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. | 11-17-2011 |
20110289772 | COMPONENT MOUNTING APPARATUS AND METHOD - A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency. | 12-01-2011 |
20110289773 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 12-01-2011 |
20110308080 | METHOD FOR TESTING A CONTACT STRUCTURE - A method of testing a contact structure including exposing a gold layer of at least one contact structure of a support structure to a solution including glacial acetic acid and nitric acid; and determining a porosity of the gold layer of at least one contact structure after the exposing. | 12-22-2011 |
20110308081 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS - A component mounting method of mounting a component onto a board by a component mounting apparatus ( | 12-22-2011 |
20110314666 | METHOD FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRUCTURE USING THE SAME - According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers. | 12-29-2011 |
20110314667 | Method of manufacturing printed circuit board including electronic component embedded therein - A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed | 12-29-2011 |
20120011714 | METHOD AND DEVICE FOR CONTROLLING BOARD STOPPING POSITION AND METHOD FOR CONTROLLING BOARD MOUNTING POSITION - A method for controlling a board stopping position comprises a calculation step for calculating an extended length of the electronic component mounted on the board and extended from the board end portion in the transfer direction by one of the electronic component mounting machines and a correcting and stopping step for correcting a stopping timing of the conveyer belt to be stopped in response to the detection signal which is outputted from the board sensor and stopping the board at the mounting position, based on the calculated extended length of the electronic component in a subsequent stage electronic component mounting machine arranged subsequent to the one of the electronic component mounting machines. | 01-19-2012 |
20120011715 | THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING BATTERY AND RELATED METHODS - An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a battery component receiving recess. The multilayer circuit board may include at least one pair of liquid crystal polymer (LCP) layers, and at least one electrically conductive pattern layer on at least one of the LCP layers and defining at least one battery electrode adjacent to the battery component receiving recess. The electronic device may further include a battery component within the battery component receiving recess and coupled to the at least one battery electrode to define a battery. | 01-19-2012 |
20120017434 | METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC PAPER - There is provided a method of manufacturing electronic paper, the method including: preparing a substrate having a plurality of accommodating holes in order to accommodate electronic paper display elements; injecting insulating liquid into the individual accommodating holes; increasing the height of partitions forming the accommodating holes by mounting a mask on the partitions, the mask providing through-holes having a size similar to that of the accommodating holes; putting the electronic paper display elements into the accommodating holes; removing extra electronic paper display elements in excess of a predetermined number thereof by a removal unit in order that the predetermined number of electronic paper display elements are put into the accommodating holes; and removing the mask mounted on the partitions after the extra electronic paper display elements are removed from the accommodating holes. | 01-26-2012 |
20120017435 | Method of manufacturing PCB having electronic components embedded therein - A method of manufacturing a PCB having electronic components embedded therein, including: preparing a copper foil layer including a thin copper foil coated with a resin layer; fixing electronic components onto the resin layer; forming a core layer in which the electronic components are embedded; forming internal layer circuits which are electrically connected to the electronic components; forming an insulating layer on the internal layer circuits; and forming external layer circuits on the insulating layer such that the external layer circuits are electrically connected to the internal layer circuits. | 01-26-2012 |
20120030940 | Method of manufacturing component embedded printed circuit board - A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component. | 02-09-2012 |
20120030941 | ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME - An electronic component mounting device having high productivity while enhancing the electromagnetic shielding effect, and a method for manufacturing the same, including a housing formed by a conductive metal material and electronic components to be mounted inside the housing. The housing is configured by a first box body and a second box body fixed so that respective openings face each other and has a conductive layer stacked through an insulating layer arranged on an outer side of the first box body. The first box body includes a through-hole for retrieving a conductive wire connected to the electronic component to the conductive layer, and the through-hole is arranged at a position covered by the conductive layer. | 02-09-2012 |
20120036710 | OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS - An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure. | 02-16-2012 |
20120036711 | APPARATUS AND METHOD OF MOUNTING COMPONENT - An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate. | 02-16-2012 |
20120042512 | LED Chip-Based Lighting Products And Methods Of Building - A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate. | 02-23-2012 |
20120042513 | Manufacturing method of printed circuit board embedded chip - A method of manufacturing an electronic component embedded printed circuit board including: mounting an electronic component on an insulating layer in a fluidal condition so that a part of the electronic component is inserted into the insulating layer and another part of the electronic component is protruded out of a top surface of the insulating layer by pressing the electronic component onto the insulating layer; fixing the electronic component by curing the insulating layer; forming a metallic seed layer on a top surface of the insulating layer including an exposed surface of the electronic component; forming a plating layer on the metallic seed layer; forming via-holes at positions on the insulating layer, which correspond to pads of the electronic component and forming circuit patterns electrically conducted with the pads; and forming a solder resist layer including the via-holes electrically connected to the circuit patterns. | 02-23-2012 |
20120066900 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 03-22-2012 |
20120079717 | Assembly Method for Converting the Precursors to Capacitors - A method of assembling a packaged semiconductor device includes dropping a pre-formed capacitor precursor on a surface of a substrate. A pair of vias are formed in the pre-formed capacitor precursor if they don't already exist. The vias are filled with an electrically conductive material to form a chip capacitor. The filling of the vias provides an electrical contact between capacitor plates of the chip capacitor and electrically conductive contact regions on the substrate. | 04-05-2012 |
20120084976 | METHOD FOR ASSEMBLING CAMERA MODULE - The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module. | 04-12-2012 |
20120084977 | METHOD OF MANUFACTURING BLOCK MODULE - Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple. | 04-12-2012 |
20120102731 | Positioning Device For Inserting Pin Into PCB, Method and Apparatus For Inserting Pin Into PCB - A positioning device is provided for inserting a pin into a PCB. The positioning device includes an X-Y platform and a reference platform. The X-Y platform includes a positioning point and supports a PCB having a first receiving passageway for receiving a pin. The reference platform supports a reference template having a reference point that corresponds with the first receiving passageway. An x-axis guide rail and a y-axis guide rail is disposed on the X-Y platform, such that the positioning point on the X-Y platform is moveable relative to the reference template in an x-axis direction and/or a y-axis direction to align the first receiving passageway on the PCB with a fixed insertion point of a pin insertion machine. | 05-03-2012 |
20120110840 | CHIP MOUNTER - A chip mounter has a manipulator and a bed. The manipulator picks up an electronic component from an electronic component feeding device, transfers the electronic component to the electronic component mounted surface of a printed board, and mounts the electronic component on the electronic component mounted surface. The bed is located above the manipulator or sidewise relative to the manipulator for mounting the printed board vertically or downwardly. | 05-10-2012 |
20120110841 | COMPONENT MOUNTING APPARATUS AND METHOD THEREOF - A challenge to be met by the present invention is to feed a carrier tape with superior positional accuracy by means of a simple, inexpensive configuration, thereby enhancing punching accuracy of a component and implementing highly reliable component mounting. A carrier tape feeder that feeds a carrier tape ( | 05-10-2012 |
20120117796 | DEVICE MOUNTING METHOD AND APPARATUS USING THE METHOD - Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied. | 05-17-2012 |
20120117797 | PACKAGING OR MOUNTING A COMPONENT - A method includes forming a slot in a sheet through a conductive layer thereof, the slot having width in a first direction between first and second edges and length in a second, transverse direction between first and second ends, providing a non-conductive layer on the sheet, the non-conductive layer having at least one window including a first window with length greater than the slot length and width less than the slot width, the first window positioned with respect to the slot such that edges of the first window are inside the edges of the slot and ends of the first window are outside the ends of the slot, placing a component on the conductive layer within the first window so as to bridge the slot and cutting through the sheet and the non-conductive layer along first and second lines outside sides of the component and within the edges the slot. | 05-17-2012 |
20120144665 | IMPEDANCE TUNING FOR CIRCUIT BOARD SIGNAL PATH SURFACE PAD STRUCTURES - The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed. | 06-14-2012 |
20120151761 | ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD - A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode. | 06-21-2012 |
20120151762 | SLIDING PACKAGE RETENTION DEVICE FOR LGA SOCKETS - A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms. | 06-21-2012 |
20120159780 | METHOD FOR FABRICATING A TOUCH PANEL - The disclosure provides a method for fabricating the touch panel, including: providing a display panel, and the display panel includes a first substrate and a second substrate opposite to the first substrate; thinning the display panel to form a thinned display panel; and forming a touch panel on the outer surface of the thinned display panel. | 06-28-2012 |
20120204419 | METAL-CONTAINING TRANSACTION CARD AND METHOD OF MAKING THE SAME - A method of creating a single transaction card is disclosed and comprises embossing the single transaction card within a pocket to form embossed characters on a first surface of the single transaction card, filling the pocket with a fill panel to provide a substantially flush surface on a second surface of the single transaction card, wherein a third surface of the fill panel is in uniform, direct contact with an interior of the pocket. Another method is disclosed for machining a face pocket within a single transaction card and disposing a microchip therein. In various embodiments, a single transaction card is comprised of a continuous metal layer, such as, for example, titanium. | 08-16-2012 |
20120227258 | INSULATING LAYER FOR RIGID PRINTED CIRCUIT BOARDS - One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs. | 09-13-2012 |
20120246927 | SUCTION NOZZLE, MOUNTING APPARATUS, METHOD FOR MOUNTING ELECTRONIC COMPONENTS, AND METHOD FOR MANUFACTURING COMPONENT-MOUNTED SUBSTRATES - A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes includes a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode. | 10-04-2012 |
20120246928 | MOUNTING APPARATUS, ELECTRONIC COMPONENT PLACEMENT METHOD, AND SUBSTRATE MANUFACTURING METHOD - A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate. | 10-04-2012 |
20120260499 | MOUNTING METHOD FOR MOUNTING A CIRCUIT BOARD IN A HOUSING AND ASSOCIATED MOUNTING TOOL - A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate. | 10-18-2012 |
20120260500 | Monolithic Capacitive Transducer - A method of manufacturing a capacitive transducer by applying a first etching mask on a layer. Applying a second etching mask to define the movable set of fingers, the fixed set of fingers, a body, and springs, and the body is connected to the movable set of fingers and the springs while the movable set of fingers are interdigitated with the fixed set of fingers. Etching the layer and the first etching mask using the second etching mask and removing the second etching mask. Etching the layer such that one of the movable set of fingers and the fixed set of fingers is shorter than the other of the movable set of fingers and the fixed set of fingers. Releasing the body, the springs, and the movable set of fingers using etching, such that, upon applying a force to the body, the body moves parallel to the substrate. | 10-18-2012 |
20120285010 | METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS - A method and apparatus is provided for self-assembly of micro-components such as microchips onto a carrier substrate, provided with assembly locations for the components. The components are supplied to the carrier by a liquid flow, while a template substrate is arranged facing the carrier. The template is a substrate provided with openings aligned to the assembly locations. The carrier and template are submerged into a tank filled with the liquid, while the liquid flow is supplied to the template side together with the components, so that the components are guided towards the openings by the flow of liquid. Once a component is trapped into an opening of the template, substantially no further liquid flow through the opening is possible, so that following components are guided towards the remaining openings, thereby establishing a fast and reliable self-assembly process. | 11-15-2012 |
20120285011 | Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 11-15-2012 |
20120285012 | COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS - An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units ( | 11-15-2012 |
20120291273 | METHOD FOR MANUFACTURING AN LED LIGHT ENGINE WITH APPLIED FOIL CONSTRUCTION - An L.E.D. lamp assembly ( | 11-22-2012 |
20120297615 | HANDHELD COMPUTING DEVICE - A handheld computing device and handheld music player are disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless enclosure, and a support structure for supporting the operational assembly during use. The handheld music player includes an elongated extruded tube extending along a longitudinal axis. The elongated extruded tube has a first open end and a second open end opposite the first open end, and defines an internal lumen which is sized and dimensioned for slidable receipt of operational components of the handheld music player. The lumen includes rails for guiding the operational components to their desired position within the lumen. | 11-29-2012 |
20120304459 | COMPONENT MOUNTING APPARATUS AND METHOD FOR PHOTOGRAPHING COMPONENT - There is provided a component mounting apparatus, which includes: a nozzle which sucks a component; a nozzle supporting member, on which the nozzle is installed, which moves in a vertical direction with respect to an upper surface of a substrate on which the component sucked at the nozzle is mounted; an optical system which captures an image of a leading edge portion of the nozzle where the component is sucked in a component mounting operation, from a side direction, such that an optical axis of the optical system is inclined at a predetermined angle with respect to a sucking surface of the nozzle; and an analyzer which analyzes the image of the leading edge portion to determine whether a sucking state of the component sucked by the nozzle is normal or abnormal. | 12-06-2012 |
20120317802 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - It is an object to provide an electronic component mounting apparatus and an electronic component mounting method that make it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape | 12-20-2012 |
20120317803 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - In a component mounting device ( | 12-20-2012 |
20120317804 | ELECTRONIC COMPONENT MOUNTING DEVICE AND AN OPERATION PERFORMING METHOD FOR MOUNTING ELECTRONIC COMPONENTS - It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position. | 12-20-2012 |
20120324724 | METHOD FOR MAKING PHASE CHANGE MEMORY - A method for making phase change memory is provided. The method includes following steps. A substrate is provided. A plurality of first row electrode leads and the second row electrode leads is located on the substrate. A carbon nanotube layer is applied on the substrate to cover the first row electrode lead and the second row electrode lead. The carbon nanotube layer is patterned to form a plurality of carbon nanotube units located on the second row electrode lead. A phase change layer is applied on the surface of each carbon nanotube unit. A plurality of first electrodes, a plurality of second electrodes, a plurality of first row electrode leads and a plurality of second row electrode leads is located on the substrate. | 12-27-2012 |
20120324725 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening ( | 12-27-2012 |
20130000114 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - In a component mounting device ( | 01-03-2013 |
20130008023 | MODULAR CHIP STACK AND PACKAGING TECHNOLOGY WITH VOLTAGE SEGMENTATION, REGULATION, INTEGRATED DECOUPLING CAPACITANCE, AND COOLING STRUCTURE AND PROCESS - An electronic apparatus includes an electronic component electrically connected to a substrate positioned beneath the electronic component. A member includes a plurality of decoupling capacitors having different voltages, and the decoupling capacitors are electrically connected to the electronic component. A plurality of voltage planes in the member are electrically connected to the decoupling capacitors. The decoupling capacitors, via the voltage planes in the member, provide different voltages to the voltage planes and thus the electronic component. | 01-10-2013 |
20130014386 | MOUNTING APPARATUS, COATING APPARATUS, MOUNTING METHOD, COATING METHOD, AND PROGRAMAANM Baba; HiroshiAACI SaitamaAACO JPAAGP Baba; Hiroshi Saitama JPAANM Oowada; KenichiAACI SaitamaAACO JPAAGP Oowada; Kenichi Saitama JP - A mounting apparatus including: a holding portion capable of holding and releasing an electronic component including a plurality of electrodes; a movement mechanism configured to move the holding portion; a coating portion in which a coating object to be applied onto the plurality of electrodes is set; and a controller configured to control the holding portion to hold the electronic component, control the movement mechanism to move the holding portion to a position above the coating portion, control the holding portion to release the electronic component above the coating portion so that the coating object is applied onto the electrodes, control the holding portion to hold the released electronic component again, control the movement mechanism to move the holding portion to a position above one of a substrate and another electronic component, and control the electronic component to be mounted on one of the substrate and the another electronic component. | 01-17-2013 |
20130042472 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS - A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer. | 02-21-2013 |
20130047427 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In an electronic component mounting system | 02-28-2013 |
20130067740 | WELD GUN PART CLAMP DEVICE AND METHOD - A combination component handling and connecting device connectable to a multi-axis robot for use in moving and connecting components and subassemblies includes a housing and an actuator fixedly connected to the housing. The actuator includes an actuating link movable from a first position to a second position. Connected to the actuating link is an end effector for concurrent movement with the actuating link. The component handling and connecting device includes a clamp having a first jaw and a second jaw. The second jaw is connected to the actuating link for selectively moving the second jaw toward the first jaw operative to engage a component. | 03-21-2013 |
20130074329 | MOUNTING APPARATUS, ELECTRONIC COMPONENT MOUNTING METHOD, SUBSTRATE PRODUCTION METHOD, AND PROGRAM - A mounting apparatus includes a holding unit, a sensor unit, and a controller. The holding unit is configured to hold an electronic component, move toward a substrate while holding the electronic component, and mount the electronic component on the substrate. The sensor unit is configured to detect an oscillation of the holding unit. The controller is configured to judge, based on information on the oscillation detected by the sensor unit, timings at which a position of the electronic component held by the oscillating holding unit overlaps a mounting position on the substrate, and control a movement of the holding unit toward the substrate such that the electronic component is mounted on the substrate at any of the judged timings. | 03-28-2013 |
20130074330 | CELL ATTACHMENT METHOD - A method of manufacturing an electrical device comprises the steps of providing a substrate, providing an electrical component on the substrate, providing a first electrical contact on the substrate that is electrically connected to the electrical component, and providing an electrochemical cell on or integrating the substrate for providing electrical energy to said electrical component. The electrochemical cell comprises at least one electrochemical layer comprising a cured or dried ink and a first electrode contact electrically connected to said at least one electrochemical layer. The method further includes the step of securing the electrochemical cell to the substrate through an electrically conductive connection that provides both a structural connection and an electrical connection between the first electrical contact and the first electrode contact. | 03-28-2013 |
20130074331 | METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE - A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate. | 03-28-2013 |
20130104394 | Continuous Extrusion Process for Manufacturing a Z-directed Component for a Printed Circuit Board | 05-02-2013 |
20130111744 | BROAD-AREA LIGHTING SYSTEMS - In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements | 05-09-2013 |
20130125391 | MOUNTING APPARATUS, METHOD OF MOUNTING ELECTRONIC COMPONENT, METHOD OF MANUFACTURING SUBSTRATE, AND PROGRAM - A mounting apparatus includes a first mounting head, a second mounting head, and a controller. The first mounting head and the second mounting head are configured to each repeat a holding operation of holding an electronic component and a mounting operation of mounting the electronic component held on a substrate to alternately mount the electronic components on the substrate. The controller is configured to compare, when the first mounting head and the second mounting head complete the holding operation and are each in a state of being capable of mounting the electronic component, a first value relating to a remaining mounting time period of the first mounting head and a second value relating to a remaining mounting time period of the second mounting head, to cause the mounting operation by the mounting head corresponding to a larger value between the first value and the second value to be preferentially performed. | 05-23-2013 |
20130133190 | STACKED MOUNTING STRUCTURE AND METHOD OF MANUFACTURING STACKED MOUNTING STRUCTURE - A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area. | 05-30-2013 |
20130133191 | METHOD OF MANUFACTURING STORAGE APPARATUS - A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced. | 05-30-2013 |
20130133192 | METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD - A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position. | 05-30-2013 |
20130139382 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 06-06-2013 |
20130160288 | APPARATUS AND METHOD FOR MANUFACTURING DOUBLE-SIDED MOUNTING SUBSTRATE - Provided is an apparatus for manufacturing a double-sided mounting substrate, the apparatus including: a backup table provided under the printed circuit board at the mounting position which supports the lower surface of the printed circuit board; and a servo motor which elevates and lowers the backup table, wherein the servo motor elevates the backup table to mount the new electronic components and lowers the backup table to carry-in and to carry-away the printed circuit board based on a lower limit position of the backup table, and wherein the lower limit position of the backup table is a position separated downwardly from a reference surface at the mounting position by a distance obtained by adding a preset clearance to a sum of a maximum height of the mounted electronic components mounted on the lower surface of the printed circuit board and a thickness of the printed circuit board. | 06-27-2013 |
20130185933 | CAPACITOR-CIRCUIT BOARD INTERFACE FOR WELDING SYSTEM COMPONENTS - A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an extension portion with a terminal passageway formed therethrough. The extension portion is electrically connected to the circuit board with a terminal disposed in the terminal passageway. The extension portion is spaced away from a surface of the circuit board. A capacitor is electrically connected to the main riser portion with a fastener disposed in the fastener passageway. | 07-25-2013 |
20130192064 | METHOD FOR MANUFACTURING PACKAGED LIGHT EMITTING DIODE - A method for manufacturing packaged LED is provided in the present invention. A vacuum closed space is enclosed by a base plate and a cover plate, and LED chip on the base plate is disposed in the closed space. The cover plate includes a fluorescent layer, and space between the fluorescent layer and the LED chip is vacuum. Thus, heat generated by the LED chip may not affect fluorescent material inside the fluorescent layer so that the package of LED becomes more durable. | 08-01-2013 |
20130199033 | ANTENNA FEED SYSTEM - A microwave system comprises an antenna, antenna feed, a radio transceiver, and appropriate cabling among the aforementioned. Cost, performance and reliability improvements are achieved with further integration of these elements and with design improvements in the antenna feed. One improvement is the integration of the radio transceiver with the antenna feed. This improvement has many benefits including the to elimination of RF cables and connectors. Another improvement, is the incorporation of parasitic radiators and sub-reflectors as part to of the antenna feed. The entire antenna, including the feed design is optimized with 3D finite element method (FEM) software and numerical optimization software. Another improvement is the utilization of the digital cable to power the integrated radio transceiver and a center fed parabolic reflector | 08-08-2013 |
20130205587 | AREA-EFFICIENT DISTRIBUTED DEVICE STRUCTURE FOR INTEGRATED VOLTAGE REGULATORS - An area efficient distributed device for integrated voltage regulators comprising at least one filler cell coupled between a pair of PADS on I/O rail of a chip and at least one additional filler cell having small size replica of said device is coupled to said I/O rails for distributing replicas of said device on the periphery of said chip. The device is coupled as small size replica on the lower portion of said second filler cell for distributing said device on the periphery of said chip and providing maximal area utilization. | 08-15-2013 |
20130219711 | ELECTRONIC COMPONENT AND SELECTION METHOD - In an electronic component, a laminate is obtained by laminating a plurality of ceramic layers, and includes an upper surface and a bottom surface which are at ends of the laminate in the z-axis direction, end surfaces facing each other, and side surfaces facing each other. First capacitor conductors, second capacitor conductors, and the ceramic layers are laminated. One of the first capacitor conductors and one of the second capacitor conductors face each other via one of the ceramic layers. A first external electrode and a second external electrode are located on one of the end surfaces and one of the side surfaces, respectively, and are connected to the first capacitor conductors. A third external electrode and a fourth external electrode are located on the other one of the end surfaces and the other one of the side surfaces, respectively, and are connected to the second capacitor conductors. | 08-29-2013 |
20130247368 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M | 09-26-2013 |
20130247369 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M | 09-26-2013 |
20130247370 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system configured by linking together a plurality of inspecting-coating machines (M | 09-26-2013 |
20130255079 | METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE - A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip. | 10-03-2013 |
20130269184 | PICK AND PLACE NOZZLE - A vacuum nozzle for a pick and place machine that includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of wood. The tip may also be made of a material that is at least one of polar and porous. Further, a method of picking up and placing a light emitting diode includes providing a pick and place machine having a vacuum nozzle, wherein the vacuum nozzle includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of a material that is at least one of polar and porous. The method includes picking up the light emitting diode and placing the light emitting diode on an electronic assembly. | 10-17-2013 |
20130276302 | NOVEL ASSEMBLY METHODS FOR MEDICAL ELECTRICAL LEADS - A method for making a medical electrical lead electrode assembly includes the steps of: forming an insulative carrier from an insulative material; coupling at least one conductive component to the carrier by inserting a pre-formed tab of the conductive component through the carrier, from a first side thereof to a second side thereof, so that the conductive component is secured to the carrier with the tab extending along a surface of the second side of the carrier and an inward facing surface of an electrode portion of the conductive component being disposed against a surface of the first side of the carrier; coupling an elongate flexible conductor to the tab of the component; and forming an insulative layer over the second side of the carrier, the tab and the conductor electrically coupled to the tab. | 10-24-2013 |
20130291378 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE - An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head. | 11-07-2013 |
20130326871 | METHODS FOR SUPPRESSING POWER PLANE NOISE - Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes. | 12-12-2013 |
20140026410 | SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS AND SUBSTRATE-RELATED-OPERATION PERFORMING SYSTEM - A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion. | 01-30-2014 |
20140033527 | LOW-COST TRANSFORMER ASSEMBLY - Power is supplied on a circuit board assembly by attaching a drum core inductor to a circuit board. The drum core inductor has a first winding wound around the drum core inductor. The first winding has first and second ends coupled to the drum core inductor. A bobbin is attached to the circuit board. The bobbin has a second winding wound around the bobbin. The second winding has first and second ends coupled to the bobbin. The drum core inductor and the bobbin are attached to the circuit board. The drum core inductor is inside an opening of the bobbin. The drum core inductor and the bobbin are detached from each other. A power switch coupled to the first winding is switched to control a transfer of energy from an input power source through the first and second windings to a load coupled to the second winding. | 02-06-2014 |
20140047711 | METHOD FOR MOUNTING PROTECTIVE COVERS OVER IMAGE CAPTURE DEVICES AND DEVICES MANUFACTURED THEREBY - A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality of individual protective covers, providing a unitary component substrate including a plurality of individual component parts, bonding the unitary transparent substrate to the unitary component substrate, dividing the transparent substrate into a plurality of discrete protective covers, and separating the component parts from one another. According to one particular method, the component substrate is a semiconductor wafer having a plurality of integrated electronic image capture devices formed therein. According to another particular method, the component substrate is a circuit board having a plurality of individual device circuit boards formed therein. | 02-20-2014 |
20140059850 | Manufacturing Method Of Flexible Display Substrate - An embodiment of the invention provides a manufacturing method of flexible display substrate ( | 03-06-2014 |
20140059851 | Circuit board structure and method for manufacturing a circuit board structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern. | 03-06-2014 |
20140068932 | Magnetic Core Inductor Integrated with Multilevel Wiring Network - An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented. | 03-13-2014 |
20140090244 | SET-UP METHOD, COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM - The present invention relates to a setup method for deciding component feeding apparatuses to be attached to each of mounting machines in a component mounting system. The setup method includes a first step of deciding component feeding apparatuses to be attached to each of the mounting machines based on substrate data defining components to be mounted by each of the mounting machines; a second step of determining whether or not there is within the components included in the substrate data a sole mounted component to be mounted by only one mounting machine among the multiple mounting machines; and a third step of deciding, when the determination is made that the sole mounted component exists, to attach component feeding apparatuses feeding the sole mounted component or an alternative component capable of replacing the sole mounted component onto at least one mounting machine other than the only one mounting machine. | 04-03-2014 |
20140096378 | METHOD OF MAKING A LIGHT-EMITTING-DIODE LAMP TUBE - An automatic production method of making a light-emitting-diode lamp tube is disclosed. The method includes providing a circuit board in a shape of a long strip, printing a bonding layer, mounting electronic inserts, heating up the circuit board, assembling a heat dissipation seat, assembling a translucent cover and assembling an end cap, thereby accomplishing the lamp tube. By the abovementioned steps, the light-emitting-diode lamp tube can be produced automatically, the manufacturing process can be simplified to reduce the labor cost, and the yield factor can be improved considerably. | 04-10-2014 |
20140096379 | ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM - An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon. | 04-10-2014 |
20140096380 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 04-10-2014 |
20140130347 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component. | 05-15-2014 |
20140137402 | Sensor Device and Method for Manufacture - A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in. | 05-22-2014 |
20140144014 | METHOD OF PRODUCING A CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE - One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element. | 05-29-2014 |
20140150254 | ELECTRONIC COMPONENT MOUNTING METHOD AND SURFACE MOUNTING APPARATUS - An electronic component mounting method includes a removing step, a first mounting step, a first attaching step and a second mounting step. In the removing step, a first feeder holding first electronic components is removed from an attaching portion of a component feeding device when there is a reason for removing the first feeder from the attaching portion. In the first mounting step, electronic components other than the first electronic component, out of electronic components to be mounted on a board, are mounted on the board when the first feeder is removed from the attaching portion. In the first attaching step, the first feeder is attached to another attaching portion, to which no feeder is attached, after the removing step. In the second mounting step, the first electronic component is mounted on the board from the first feeder attached to the other attaching portion after the first attaching step. | 06-05-2014 |
20140150255 | Electronic Assembly - An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially. | 06-05-2014 |
20140150256 | TAPE FEEDER, COMPONENT MOUNTING APPARATUS, AND COMPONENT MOUNTING METHOD | 06-05-2014 |
20140157593 | METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRY - The present invention relates to a method of making a hybrid wiring board with built-in stopper and interposer. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting an interposer on the dielectric layer using the stopper as a placement guide for the interposer; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the interposer, the stopper and the stiffener and provides signal routing for the interposer. Accordingly, the stopper can accurately confine the placement location of the interposer and avoid the electrical connection failure between the interposer and the build-up circuitry. | 06-12-2014 |
20140196284 | LIGHTING MODULE AND INSTALLATION METHOD THEREFOR - A lighting module includes a ribbon-like containment body with a web wall having a first and a second face opposite to each other and a pair of side walls extending sidewise of the first face of the web wall to define a channel-like shape of the containment body, a ribbon-like mounting board for mounting light radiation sources, the mounting board being arranged in the channel-like shape of the containment body with a mounting surface facing away from the first face of the web wall of the containment body, and a light radiation source mounted on the mounting surface of the board for projecting light radiation from the channel-like shape of the containment body. The lighting module includes a pair of hook-like profiles protruding from and along the second face of the web wall of the containment body to permit mounting of the lighting module by hooking to a mounting element. | 07-17-2014 |
20140201990 | MANUFACTURING METHOD OF TOUCH DISPLAY DEVICE - A manufacturing method of touch display device includes steps of: providing a liquid crystal display unit and disposing at least one printed circuit layer on a display surface of the liquid crystal display unit; electrically connecting multiple transmitters and multiple receivers onto the printed circuit layer; positioning the liquid crystal display unit in a receiving space of a case; and providing a frame body and mounting the frame body onto the case to cover the printed circuit layer. The printed circuit layer is directly formed on the display surface of the liquid crystal display unit so that the cost for the circuit boards is saved. In this case, the manufacturing cost of the touch display device is lowered. Moreover, the total thickness of the touch display device is reduced and the installation is facilitated. | 07-24-2014 |
20140208587 | ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD - Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant. The second electronic component placement machine is arranged adjacent to and downstream of the resin dispensing machine. | 07-31-2014 |
20140208588 | Method for manufacturing an electronic module and an electronic module - This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued. | 07-31-2014 |
20140215816 | METHOD TO ASSEMBLE TRANSMITTER OPTICAL SUBASSEMBLY - A method to assemble a transmitter optical module is disclosed, where the optical module installs two lenses, one of which concentrates an optical beam emitted from a laser diode, while, the other collimates the optical beam concentrated by the former lens. The method has a feature that the first lens is firstly positioned in a point to collimate the optical beam coming from the laser diode, then, moved to a point, which is apart from the former point with respect to the laser diode, to concentrate the optical beam. The process performs the steps to position the lens by a jig to extract the optical beam passing through the first lens outside of the housing. | 08-07-2014 |
20140237814 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 08-28-2014 |
20140259654 | METHOD OF MANUFACTURING LED MODULE - The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates. | 09-18-2014 |
20140259655 | PRODUCTION METHOD OF ELECTROSTATIC CAPACITANCE ELEMENT - Provided is a production method of an electrostatic capacitance element, including preparing a dielectric sheet on which a conductor is not being applied, and a mask that has at least one basic pattern shape, making a basic-pattern green sheet by applying the conductor on the dielectric sheet through the mask, making a rotated basic-pattern green sheet in which the basic-pattern green sheet is rotated, making a laminate of the basic-pattern green sheet and the rotated basic-pattern green sheet, making a reversed basic-pattern green sheet by reversing at least one of the basic-pattern green sheet or rotated basic-pattern green sheet, laminating the reversed basic-pattern green sheet on the laminate with a dielectric sheet, on which a conductor is not being applied, interposed therebetween, and performing compression-bonding and baking treatments of a laminate of the basic-pattern green sheet, the rotated basic-pattern green sheet, the dielectric sheet and the reversed basic-pattern green sheet. | 09-18-2014 |
20140283379 | EMBEDDED COMPONENTS IN INTERPOSER BOARD FOR IMPROVING POWER GAIN (DISTRIBUTION) AND POWER LOSS (DISSIPATION) IN INTERCONNECT CONFIGURATION - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 09-25-2014 |
20140290054 | Systems and Methods for Encapsulating Electronics in a Mountable Device - A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer. | 10-02-2014 |
20140290055 | METHOD OF MANUFACTURING MOUNTING SUBSTRATE - In error coping executed when it is determined that an electronic component is a different type of component which is not a regular electronic component to be supplied from a part feeder in a component mounting process, production operation of the component mounting device is stopped, a component set timing at which the different type of component is set is specified on the basis of component set history information, all of the substrates to be target of production by the component mounting device after a specified component set timing are specified as substrates to be managed on which the different type of components are potentially mounted, and the production operation of all of the devices arranged downstream, and intended to produce the substrates to be managed is stopped. | 10-02-2014 |
20140290056 | EXPANSION DEVICE PLACEMENT APPARATUS - An apparatus that facilitates the accurate and uncomplicated placement of an adhesive circuit structure onto an integrated circuit card is described. The apparatus is configured to hold the adhesive circuit structure and an integrated circuit card such that the two components can be aligned for proper placement. | 10-02-2014 |
20150026972 | METHOD OF PRODUCING ELECTRONIC COMPONENTS AND METHOD OF PRODUCING SUBSTRATE-TYPE TERMINALS - A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces. | 01-29-2015 |
20150026973 | METHOD OF PRODUCING ELECTRONIC COMPONENTS - A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting. | 01-29-2015 |
20150033555 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE - A component mounting method includes: detecting feeder ID information of a parts feeder, which individually specifies a parts feeder, after a second parts feeder is attached to an attaching position of the feeder base having a feeder address, and confirming whether the second parts feeder is the same as a first parts feeder which was attached to and then detached from the attaching position; and calculating an attaching/detaching time from detachment of the first parts feeder to attachment of the second parts feeder if it is confirmed that the second parts feeder is the same as the first parts feeder. If the calculated attaching/detaching time is a given time or shorter, the mounting work is performed without performing a component checking operation which determines whether a kind of an electronic component accommodated in the second parts feeder is proper. | 02-05-2015 |
20150040388 | Application of Dielectric Layer and Circuit Traces on Heat Sink - A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application. | 02-12-2015 |
20150040389 | METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A method for manufacturing a wiring board with a built-in electronic component includes positioning an electronic component in a cavity of a substrate, forming intermediate structures each including an intermediate insulation layer and an intermediate wiring-pattern layer on upper and lower surfaces of the substrate, respectively, such that a component-accommodating substrate is formed, attaching a support sheet to a first surface of the component-accommodating substrate, forming a connection layer including insulation layers and wiring-pattern layers on a second surface of the component-accommodating substrate on the opposite side with respect to the first surface of the component-accommodating substrate, removing the support sheet from the component-accommodating substrate such that an intermediate laminate structure having the connection layer laminated on the second surface of the component-accommodating substrate is formed, and forming upper-layer structures each including an insulation layer and a wiring-pattern layer on upper and lower surfaces of the intermediate laminate, respectively. | 02-12-2015 |
20150047186 | METHOD OF ASSEMBLING A LIGHTING DEVICE WITH FLEXIBLE CIRCUITS HAVING LIGHT-EMITTING DIODES POSITIONED THEREON - A method of assembling a lighting device that has a base, an optic defining an optical chamber, a driver circuit positioned in electrical communication with the base, and a flexible circuit board positioned within the optical chamber along and generally circumscribing a longitudinal axis of the optical chamber and in electrical communication with the driver circuit. The flexible circuit board may comprise a plurality of longitudinal sections. Each longitudinal section may comprise a first inclined section, a second inclined section, and a plurality of light-emitting diodes (LEDs). The first inclined section may be positioned in the direction of the base relative to the second inclined section. The lighting device may further include a longitudinal translation device to translate longitudinally part of the flexible circuit board. | 02-19-2015 |
20150052745 | COMPONENT MOUNTING METHOD - In the component mounting method, it is determined whether a component shortage simultaneous occurrence in which predicted component shortage timings belong to the same time zone in component mounting apparatuses and component replenishment is necessary in the same time zone with respect to the component mounting apparatuses is present or not. When the component shortage simultaneous occurrence is determined to be present, the component shortage timing is moved up by a predetermined move-up time in any one of the component mounting apparatuses relating to the component shortage simultaneous occurrence and notified. | 02-26-2015 |
20150059170 | METHOD OF MANUFACTURING A WIRING BOARD - There is provided a method of manufacturing a wiring board, including the steps of: preparing an insulating layer | 03-05-2015 |
20150059171 | REEL FOR COMPONENT MOUNTING APPARATUS AND COMPONENT SUPPLYING METHOD IN COMPONENT MOUNTING APPARATUS - A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part. | 03-05-2015 |
20150074994 | PARTS MOUNTING SYSTEM AND PARTS MOUNTING METHOD - A parts mounting system includes: a parts checking section that detects parts information which is identification information applied to the electronic parts and includes a parts code for specifying parts of the electronic parts and a parts maker code for specifying the parts maker and checks the detected parts information with parts information previously registered in a storing part; and a parts data generation section that, when the detected parts information is unregistered parts information in which the parts code is stored in the storing part and the parts maker code of the parts code is not stored in the storing part, generates parts data of the electronic parts relating to the unregistered parts information based on previously registered parts data having the same parts code. | 03-19-2015 |
20150135526 | SECONDARY DEVICE INTEGRATION INTO CORELESS MICROELECTRONIC DEVICE PACKAGES - The present disclosure relates to the field of fabricating microelectronic device packages and, more particularly, to microelectronic device packages having bumpless build-up layer (BBUL) designs, wherein at least one secondary device is disposed within the thickness (i.e. the z-direction or z-height) of the microelectronic device of the microelectronic device package. | 05-21-2015 |
20150143693 | METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT - A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding. | 05-28-2015 |
20150334847 | TWO-STAGE POWER DELIVERY ARCHITECTURE - A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator. | 11-19-2015 |
20150358517 | MANUFACTURING METHOD FOR CAMERA MODULE - A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole. | 12-10-2015 |
20150366077 | METHOD FOR PRODUCING MOUNTED STRUCTURE - A method for producing a mounted structure according to an embodiment of the present invention includes a step of forming a circuit substrate, which includes an insulation layer and a conductive layer, on a support member by alternately stacking the insulation layer and the conductive layer on the support member; a step of forming a mounted structure, which includes the circuit substrate and an electronic component, on the support member by mounting the electronic component on the circuit substrate; and a step of removing the support member from the mounted structure. As a result, the efficiency in producing the mounted structure can be increased. | 12-17-2015 |
20150382474 | METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND SUBSTRATE FOR FABRICATING THE SAME - The present invention relates to the field of electronic device fabrication, provides a method for fabricating a flexible electronic device, and is intended to address the problems present in the prior art that the adhesive cannot be completely peeled off and the flexible substrate is damaged during peeling the flexible substrate from the rigid substrate in the flexible electronic device fabrication. The fabrication method comprises providing a channel on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channel; and reacting the chemical substance with the adhesive, and peeling the flexible substrate from the rigid substrate. The present invention also provides a substrate for fabricating a flexible electronic device. In the present invention, a channel is provided on the rigid substrate to enhance the efficiency and speed of the reaction between the chemical substance with the adhesive, so that the flexible substrate can be completely and automatically peeled from the rigid substrate rapidly, and the chemical substance which reacts with the adhesive will not cause a damage to the flexible substrate or the electronic device. | 12-31-2015 |
20160007472 | METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE - A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is foamed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed. | 01-07-2016 |
20160007481 | ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS - A method of assembling a packaged semiconductor device starts by dropping a pre-formed capacitor precursor on a surface of or within a first substrate. An integrated circuit die is dropped on either of the first substrate. If the pre-formed capacitor precursor lacks at least a first pair of vias for providing an electrical contact between capacitor plates of said chip capacitor, then at least a first pair of vias is formed in said pre-formed capacitor precursor. The first pair of vias are filled with an electrically conductive material to form the chip capacitor, wherein said filling of said vias provides an electrical contact between said first and second capacitor plates of said chip capacitor and said electrically conductive contact regions on said first substrate. A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of said electrically conductive material, and said second pattern comprises at least a second pair of overlaying areas free of said electrically conductive material. The first pair of areas overlay areas of the second pattern having said electrically conductive material and the second pair of areas overlay areas of the first pattern having said electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers. | 01-07-2016 |
20160007483 | FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT - A carrier board having two opposite surfaces is provided and a releasing film and a metal layer are formed on the two opposite surfaces respectively. Each metal layer formed with positioning pads is covered with a first hot-melt-dielectric layer where a passive component is disposed. The passive component has upper and lower surfaces each having electrode pads. Each first hot-melt-dielectric layer is disposed on a core board having a cavity to receive the passive component. A second hot-melt-dielectric layer is stacked on each core board. The first and second hot-melt-dielectric layers are heat pressed to form two dielectric layer units each having a top surface and a bottom surface. The carrier board and the releasing films are removed to separate the dielectric layer units. Wiring layers are formed on each top surface and each bottom surface and electrically connected to the electrode pads of the upper and lower surfaces respectively. | 01-07-2016 |
20160007512 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - An electronic component mounting system includes a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The distribution control unit mixedly distributes the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line. | 01-07-2016 |
20160007513 | ELECTRONIC CIRCUIT COMPONENT MOUNTING METHOD AND MOUNTING SYSTEM - A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body, and a bulk feeder which is head-side feeder moved to any position on a movement plane covering a circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder is improved. A reception order is determined, so as to reduce the number of times a mounting head moves between the circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder and the receiving of first type components supplied from the tape feeder and the receiving of second type components supplied from the bulk feeder are respectively performed together as a batch. | 01-07-2016 |
20160007514 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - A component mounting device that mounts on a board a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a mounting head which carries out a moving and mounting operation in which the fitting component is taken out from a component supply part by sucking and holding the fitting component, moved and mounted on the to-be-attached part, and pressed by a first load, and a pressing operation in which the fitting component is pressed by a second load larger than the first load, and a head control part which controls the mounting head to suck and hold a neighborhood of a central portion of an upper surface of the fitting component in the moving and mounting operation, and to press a press part corresponding to the to-be-attached part in the pressing operation. | 01-07-2016 |
20160014935 | METHODS RELATED TO PACKAGED MODULES HAVING TUNED SHIELDING | 01-14-2016 |
20160021761 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM - A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result. | 01-21-2016 |
20160029493 | COMPONENT MOUNTING LINE, COMPONENT MOUNTING APPARATUS, AND COMPONENT MOUNTING METHOD - A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area. | 01-28-2016 |
20160050766 | METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD - A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred. | 02-18-2016 |
20160073510 | HOLDING DEVICE, MOUNTING DEVICE, MOUNTING METHOD, AND METHOD OF MANUFACTURING CIRCUIT BOARD DEVICE - Provided is a holding device including a main body on which two surfaces that come into bump-contact with two ridge lines along a top surface of an element in a longitudinal direction, in one to one correspondence, are formed and which holds the element in a state that the two surfaces come into bump-contact with the two ridge lines, and a restriction unit that is provided in the main body, comes into contact with the top surface of the element, and restricts an inclination of the element with respect to the main body to be within an inclination limit. | 03-10-2016 |
20160081197 | COMPUTE INTENSIVE MODULE PACKAGING - A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system. | 03-17-2016 |
20160081241 | ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MOUNTING METHOD - Provided is a flip chip mounting apparatus for mounting chips ( | 03-17-2016 |
20160081242 | COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD - A component mounting apparatus includes transport mechanisms that transport boards, component supply sections, mounting heads, and a control unit that controls them based on mounting data. Each transport mechanism includes an upstream side operation area and a downstream side operation area. When the mounting data corresponds to an independent mounting mode in which each of the mounting heads is used to mount a component only onto a board on a corresponding mechanism, the control unit performs a control so that the upstream side operation area is used as a mounting area. When the mounting data corresponds to an alternating mounting mode in which both mounting heads are used to mount the components sequentially onto a board that is first carried into the downstream side operation area, the control unit performs a control so that the upstream side operation area is used as a standby area. | 03-17-2016 |
20160086836 | APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE - A method for automatically transferring multiple semiconductor devices from a first substrate to a second substrate comprises steps of providing a first substrate on which the semiconductor device is formed, providing a second substrate directly under the first substrate, automatically moving the first substrate toward the second substrate such that the semiconductor devices are close to the second substrate; connecting the semiconductor devices to the second substrate by exerting force to the second substrate, and taking out the semiconductor devices simultaneously from the first substrate. | 03-24-2016 |
20160088738 | THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CORELESS PACKAGES - An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the die, the build-up carrier including a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die; and an interference shield including a conductive material disposed on the die and a portion of the build-up carrier. The apparatus may be connected to a printed circuit board. A method including forming a build-up carrier adjacent a device side of a die including a plurality of alternating layers of patterned conductive material and insulating material; and forming a interference shield on a portion of the build-up carrier. | 03-24-2016 |
20160088740 | INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS & OPTICAL TOUCHSCREEN ASSEMBLIES - An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation. | 03-24-2016 |
20160100488 | COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR PICKING UP A COMPONENT AND PLACING A COMPONENT ON A SUBSTRATE - A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel. | 04-07-2016 |
20160113122 | SYSTEMS AND METHODS FOR ASSEMBLING LED CONNECTOR BOARDS - Systems and methods for assembling an LED connector board wherein the assembly can be provided with a metal track with an integrated recess for receiving an injection molded base, onto which a set of leaf spring connectors with extended insulating bosses for electrical wires can be secured. | 04-21-2016 |
20160120038 | Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith - A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region. | 04-28-2016 |
20160120039 | METHOD OF MANUFACTURING PRINTED-CIRCUIT BOARD ASSEMBLY - A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit. | 04-28-2016 |
20160128198 | Electronic Component - In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot. | 05-05-2016 |
20160132762 | METHOD OF MANUFACTURING CARDS THAT INCLUDE AN ELECTRONIC MODULE AND INTERMEDIATE PRODUCTS - Method of manufacturing at least one card each including an electronic module ( | 05-12-2016 |
20160143197 | METHOD FOR EQUIPPING PRINTED CIRCUIT BOARDS - A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section ( | 05-19-2016 |
20160144555 | PHOTOCURABLE COMPOSITION, METHODS FOR PRODUCING FILM, OPTICAL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC COMPONENT BY USING THE SAME, AND CURED PRODUCT - In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer, a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm. | 05-26-2016 |
20160150654 | METHODS OF FORMING OSCILLATOR SYSTEMS HAVING ANNULAR RESONANT CIRCUITRY - Systems and apparatus are provided for solid-state oscillators and related resonant circuitry. An exemplary oscillator system includes an amplifier having an amplifier input and an amplifier output and resonant circuitry coupled between the amplifier output and the amplifier input. In exemplary embodiments, the resonant circuitry includes an annular resonance structure that is substantially symmetrical and includes a pair of arcuate inductive elements. In accordance with one or more embodiments, the resonant circuitry includes an additional inductive element that is capacitively coupled to the annular resonance structure via an air gap to improve the quality factor of the resonant circuitry. | 05-26-2016 |
20160157359 | CUSTOMIZED MODULE LID | 06-02-2016 |
20160174424 | METHOD OF MOUNTING COMPONENT ONTO SUBSTRATE IN COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DEVICE | 06-16-2016 |
20160174425 | ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD | 06-16-2016 |
20160178143 | METHOD OF FABRICATING A LIGHT EMITTER | 06-23-2016 |
20160179146 | COMPUTER SYSTEM COMPONENT BAY | 06-23-2016 |
20160190759 | METHOD OF MANUFACTURING DOCK - A method of manufacturing a dock is disclosed. The method includes the steps of extending a cable through a collar and a through hole of a housing, securing a strain relief sleeve on a cable, electrically connecting a circuit board to the cable, disposing the strain relief sleeve and the circuit board in a containing space defined by an inner surface of the housing, and then bonding a cover plate and the collar to the housing, respectively. By the manufacturing method of the present invention, it is easy and not time consuming to manufacture the dock, and can prevent any crack or detaching of the electrical joints between the cable and the circuit board caused by dragging or compressing the cable. | 06-30-2016 |
20160192505 | THIN FAN, ELECTRONIC SYSTEM AND MANUFACTURING METHOD OF THIN FAN - A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecting structure on the housing, wherein the first signal connecting structure connects to the other terminal of the extended circuit; and disposing a metal layer on the layout area and the extended circuit. | 06-30-2016 |
20170238434 | System and Method for a Modular Multi-Panel Display | 08-17-2017 |
20190150335 | FEEDER MANAGEMENT METHOD AND FEEDER MANAGEMENT DEVICE | 05-16-2019 |