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On flat or curved insulated base, e.g., printed circuit, etc.

Subclass of:

029 - Metal working

029592000 - METHOD OF MECHANICAL MANUFACTURE

029592100 - Electrical device making

029825000 - Conductor or circuit manufacturing

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
029846000 Manufacturing circuit on or in base 283
029832000 Assembling to base an electrical component, e.g., capacitor, etc. 273
029830000 Assembling bases 49
029842000 Assembling terminal to base 33
029831000 Assembling formed circuit to base 20
Entries
DocumentTitleDate
20080307641Method of fabricating paste bump for printed circuit board - This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board.12-18-2008
20110289770APPARATUS FOR AND METHOD OF MANUFACTURING TEMPORARY SUBSTRATE - An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.12-01-2011
20120174391PROCESS FOR FABRICATING WIRING BOARD - A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.07-12-2012
20120180310Ceramic Multi-Layer Component And Method For The Production Thereof - A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50N.07-19-2012
20130067739Electro-optical Assembly Fabrication - A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.03-21-2013
20130055566METHOD FOR INTRODUCING ELECTRICAL INSULATIONS IN PRINTED CIRCUIT BOARDS - A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.03-07-2013
20090271978Foil Perforating Needle For Detaching A Small Die From The Foil - A foil perforation needle for perforating a foil and detaching a die from the foil has a shaft, which passes at one end into a blade having a cutting edge. The cutting edge minimizes the strain per unit area occurring upon impact on the foil and, after the perforation of the foil, upon impact on the die.11-05-2009
20130061468MANUFACTURING METHOD OF PACKAGE CARRIER - A manufacturing method of a package carrier is provided. A substrate having an upper and lower surface is provided. A first opening communicating the upper and lower surface of the substrate is formed. A heat conducting element is disposed inside the first opening, wherein the heat conducting element is fixed in the first opening via an insulating material. At least a through hole passing through the substrate is formed. A metal layer is formed on the upper and lower surface of the substrate and inside the through hole. The metal layer covers the upper and lower surface of the substrate, the heat conducting element and the insulating material. A portion of the metal layer is removed. A solder mask is formed on the metal layer. A surface passivation layer is formed and covers the metal layer exposed by the solder mask and the metal layer located inside the through hole.03-14-2013
20090100670Input device and its manufacturing method - The integrated structure of the stress sensor section with the control section facilitates the confirmation of the matching of both sections before the input device is incorporated into an electronic device. For example, it is possible to select only the input device which exhibits favorable matching as a result of the confirmation and to incorporate it in the electronic device. Therefore, with the above-described structure of the present invention, an input device that enables constantly favorable matching of both the stress sensor section and the control section can be provided.04-23-2009
20120233857PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance does not contact with the second through holes.09-20-2012
20120233856APPARATUS FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided an apparatus and method for manufacturing a light emitting device package improved in terms of the reliability and process efficiency of a light emitting device. The apparatus includes a heating block including a recessed portion provided in an area in which a light emitting device package is disposed, and a protruding portion disposed within the recessed portion while corresponding to a recess formed in a lower surface of the light emitting device package; and a clamp disposed on a lead frame of the light emitting device package and fixing the lead frame and the light emitting device package to the heating block.09-20-2012
20110138618Thin-type keycap structure, keypad structure including the same, and method of making the same - A method of making a thin-type keycap structure including performing a compression molding on a plastic film and a resin together with a mold including a top mold and a bottom mold to form a compression-molded laminate, in which a first surface of the plastic film faces the bottom mold, the resin faces the top mold, the compression-molded laminate includes a plastic film surface and a resin surface, the plastic film surface includes a plurality of bulged portions corresponding to the first recessions of the surface of the bottom mold, and the bulged portions each include a portion of the plastic film and a portion of the resin.06-16-2011
20110138615CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board.06-16-2011
20120285009PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD - A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.11-15-2012
20100126007METHOD FOR PRODUCING A RIGID MAGNETIC CIRCUIT COMPONENT - A method for producing a rigid magnetic circuit component for an electromagnetically operable valve includes: a) providing a base element made of a magnetic or a magnetizable material, b) complete first heat treatment of the base element, c) a local second heat treatment of the base element so as to form a subregion having a microstructure of martensite and residual austenite in the otherwise martensitic base element, and d) installing the finished processed base element as the magnetic circuit component in a magnetic circuit.05-27-2010
20110283532FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME - A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.11-24-2011
20120005889MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.01-12-2012
20110289771METHOD FOR PRODUCING CONDUCTIVE SHEET AND METHOD FOR PRODUCING TOUCH PANEL - A first exposure treatment for irradiating a first photosensitive layer formed on one main surface of a transparent support with a first light thereby to expose the first photosensitive layer and a second exposure treatment for irradiating a second photosensitive layer formed on the other main surface of the transparent support with a second light to expose the second photosensitive layer are performed such that the first light incident on the first photosensitive layer does not substantially reach the second photosensitive layer and the second light incident on the second photosensitive layer does not substantially reach the first photosensitive layer.12-01-2011
20090293269Method For Selectively Processing Surface Tension Of Solder Mask Layer In Circuit Board - A method for selectively processing a surface tension of a solder mask layer in a circuit board is provided. The method conducts surface tension processing to the flip-chip area and the non-flip-chip area of the solder mask layer in the circuit board. Therefore, the underfill used in packaging configures relative contact angles at the flip-chip area and the non-flip-chip area of the solder mask layer, respectively. In such a way, the present invention is adapted to solve the difficulties of the underfill void bulb and the overflowing contamination at the same time.12-03-2009
20100071206Low cost die release wafer - Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer.03-25-2010
20090089999Analyte Monitoring Device and Methods of Use - An analyte monitor includes a sensor, a sensor control unit, and a display unit. The sensor has, for example, a substrate, a recessed channel formed in the substrate, and conductive material disposed in the recessed channel to form a working electrode. The sensor control unit typically has a housing adapted for placement on skin and is adapted to receive a portion of an electrochemical sensor. The sensor control unit also includes two or more conductive contacts disposed on the housing and configured for coupling to two or more contact pads on the sensor. A transmitter is disposed in the housing and coupled to the plurality of conductive contacts for transmitting data obtained using the sensor. The display unit has a receiver for receiving data transmitted by the transmitter of the sensor control unit and a display coupled to the receiver for displaying an indication of a level of an analyte. The analyte monitor may also be part of a drug delivery system to alter the level of the analyte based on the data obtained using the sensor.04-09-2009
20100275440HIGHLY CONDUCTIVE THERMAL INTERFACE AND NO PUMP-OUT THERMAL INTERFACE GREASES AND METHOD THEREFORE - A high performance thermal conductive composition derived from an unsaturated diorganopolysiloxane and a saturated diorganopolysiloxane, a thermally conductive filler, and a silicone crosslinking agent without any cure step. The compositions unexpectedly have high thermal conductivity W-mK values, no observed pump-out, and good processing properties.11-04-2010
20080250633Method for Building a Device Having Fluidic and Electrical Functions - A method for building a device having fluidic and electrical functions, comprising: mounting a building part with fluidic and electrical functions on a substrate that is provided with a fluidic circuit; fluidically connecting the building part with the substrate; electrically connecting the building part with the substrate; and mechanically connecting the building part with the substrate, wherein use is made of flip-chip technology; and a seal is made by means of a gasket. With such a method a hybrid microfluidic system can be built in which materials and processes for realizing the various connections (fluidic and mechanical and electrical) can be selected in principle independently of each other so the individual processes can be optimized independently of each other in a large measure. With the application of flip-chip technology, great accuracy in the positioning of the building parts can be achieved. The electrical connection is made by means of a current material and a well-developed process. Because in principle conventional, available equipment and technology can be used, development and production costs can remain low.10-16-2008
20090265927INPUT DEVICE AND ITS MANUFACTURING METHOD - The integrated structure of the stress sensor section with the control section facilitates the confirmation of the matching of both sections before the input device is incorporated into an electronic device. For example, it is possible to select only the input device which exhibits favorable matching as a result of the confirmation and to incorporate it in the electronic device. Therefore, with the above-described structure of the present invention, an input device that enables constantly favorable matching of both the stress sensor section and the control section can be provided.10-29-2009
20080276454Method of Manufacturing a Package Carrier For Enclosing at Least One Microelectronic Element and Method and Method of Manufacturing a Diagnostic Device - A package enclosing at least one microelectronic element (11-13-2008
20120291272METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD - An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.11-22-2012
20090025210CIRCUIT BOARD STRUCTURE WITH CONCAVE CONDUCTIVE CYLINDERS AND METHOD FOR FABRICATING THE SAME - A method for fabricating a circuit board structure with concave conductive cylinders is provided. Firstly, a conductive layer is provided; a plurality of conductive cylinders are formed on a surface of the conductive layer; a dielectric layer is formed on the surface of the conductive layer with the conductive cylinders; the tips of the conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer; removing the exposed tips of the conductive cylinders such that the height of the conductive cylinders is lower than the height of the dielectric layer, and the conductive cylinders sunk into the dielectric layer.01-29-2009
20090064493PRINTED CIRCUIT BOARD - A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.03-12-2009
20090100671Printed circuit board and manufacturing method thereof - A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.04-23-2009
20110138617Thin multi-chip flex module - A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.06-16-2011
20110138616Printed circuit board manufacturing system - A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.06-16-2011
20090241332Circuitized substrate and method of making same - A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided.10-01-2009
20100146777SURFACE TREATMENT METHOD, CIRCUIT LINES FORMATION METHOD, CIRCUIT LINES FORMATION APPARATUS, AND PRINTED CIRCUIT BOARD FORMED THEREBY - The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.06-17-2010
20120266460METHOD OF MANUFACTURING INERTIAL SENSOR - Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 10-25-2012
20120102730MIRROR ASSEMBLY WITH RECESSED MIRROR - A mirror device and a method for manufacturing the mirror device are presented. The mirror device includes a mirror formed from a first substrate and a hinge/support structure formed from a second substrate. The hinge/support structure includes a recessed region and a torsional hinge region. The mirror is coupled to the hinge/support structure at the recessed region. Further, a driver system is employed to cause the mirror to pivot about the torsional hinge region.05-03-2012
20120030939Wired circuit board and producing method thereof - A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.02-09-2012
20090293270METHOD OF ASSEMBLING AN ELECTRODE ARRAY THAT INCLUDES A PLASTICALLY DEFORAMBLE CARRIER - A method of assembling an implantable electrode array from a coupon (12-03-2009
20100212149LIGHT AND PROCESS OF MANUFACTURING A LIGHT - A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.08-26-2010
20100242270Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module - A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.09-30-2010
20090249618METHOD FOR MANUFACTURING A CIRCUIT BOARD HAVING AN EMBEDDED COMPONENT THEREIN - A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.10-08-2009
20100313414Processes and structures for IC fabrication - The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process extrudes interconnect wires over a desired location of the bond pads, and then subsequently laser cuts a correct length of the interconnect wires.12-16-2010
20100313413Processes and structures for IC fabrication - The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The process can separate the integrated circuits into an analog portion and a digital portion with the analog portion comprising passive components utilizing dielectric materials different than silicon dioxide and active components utilizing channel materials different than substrate single crystal silicon.12-16-2010
20100180438Method for Making Arrangement for Energy Conditioning - Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.07-22-2010
20110030207MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature; and the interlayer connection material is larger in thickness than the interlayer connection material of the same wiring layer at normal temperature. This causes a difference in the coefficient of thermal expansion between the different materials in the thickness direction of the printed wiring board in the environment in which it is used resulting in high connection reliability.02-10-2011
20110083323Method For Fabricating An Interlayer Conducting Structure Of An Embedded Circuitry - A method for fabricating an interlayer conducting structure of an embedded circuitry is disclosed. In accordance with the method for fabricating an interlayer conducting structure of an embedded circuitry of the present invention, there is no laser conformal mask formed prior to laminating the first and second lamination plates. Instead, after the first and second lamination plates are laminated, a laser boring process is directly conducted to form a via hole. In such a way, even when there is an offset between the first and the second lamination plates in alignment, the risk of short circuit between different layers of lamination plates can be lowered without improving an interlayer offset value.04-14-2011
20110099803METHOD OF IMPROVING ISOLATION BETWEEN CIRCUITS ON A PRINTED CIRCUIT BOARD - A method of improving electrical isolation between a first circuit and a second circuit sharing a common substrate having an effective dielectric constant greater than that of air. The first and second circuits are spaced apart and separated from one another by an intermediate portion of the substrate. The method includes removing a portion of the intermediate portion to replace the portion removed with air thereby reducing the effective dielectric constant of the intermediate portion. By reducing the effective dielectric constant of the intermediate portion, electrical isolation between the first and second circuits is improved thereby reducing crosstalk between the first and second circuits. In particular implementations, the method may be used to reduce alien crosstalk between adjacent communication outlets in a patch panel.05-05-2011
20110056075PLANAR LAYER WITH OPTICAL PATH - A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.03-10-2011
20110056074APPARATUS AND METHOD FOR ELECTRONIC CIRCUIT MANUFACTURE - An apparatus and method are described for use in the manufacture of non-planar circuit modules. The apparatus includes a holder for holding a non-planar circuit module, an activation source for activating one or more localised regions of a non-planar circuit module held by the holder, and positioning apparatus for providing relative movement between the activation source and a non-planar circuit module held by the holder. The relative movement between the activation source and a non-planar circuit module held by the holder includes translational movement along at least one axis and rotational movement about at least one axis. A parallel positioning machine may provide such relative movement.03-10-2011
20110154657MANUFACTURING METHOD OF PACKAGE CARRIER - A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.06-30-2011
20100263207Panelizing Method for Printed Circuit Board Manufacturing - The invention relates to a method for connecting at least two printed circuit board modules to form a printed circuit board panel by means of a virtual panel. The method for connecting printed circuit board modules uses positioning tags and counterparts thereof, which align the printed circuit board modules to a target location on the printed circuit board panel.10-21-2010
20100263206Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.10-21-2010
20110173806SUBSTRATES HAVING VOLTAGE SWITCHABLE DIELECTRIC MATERIALS - A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.07-21-2011
20110252636METHOD OF MANUFACTURING VARIABLE WAVELENGTH INTERFERENCE FILTER AND VARIABLE WAVELENGTH INTERFERENCE FILTER - A method of manufacturing a variable wavelength interference filter includes forming an electrostatic gap forming groove, a wiring forming groove extending from the electrostatic gap forming groove to an outer peripheral edge of the chip region, and an air communication groove through which the wiring groove forming groove communicates with the outside of the first substrate, in a chip region of a first substrate.10-20-2011
20110154658CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.06-30-2011
20090277004TRANSFER PRODUCT, TRANSFER PRODUCT FABRICATION METHOD, AND TRANSFER PRODUCT ARRANGEMENT POSITION IDENTIFYING METHOD - It identifies the on-substrate arrangement position information of the transfer products which are fabricated on the same substrate without increasing the fabrication processes.11-12-2009
20110173807DISPERSION FOR DISPOSING FINE PARTICLE AT PREDETERMINED POINT ON SUBSTRATE BY INK-JET PRINTING - It is provided a dispersion for positioning and adhering fine particles at predetermined positions on a substrate upon heating by ink jet printing. The dispersion comprises spacers, a solvent and an adhesive additive. The adhesive additive has an average molecular weight (Mw) of 3600 or lower and a property of forming a polymer upon heating.07-21-2011
20120030938Method of manufacturing printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.02-09-2012
20120198692UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni / ELECTROLYTIC Cu STACK - An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A photoresist is applied on both electroless Cu layers and lithographically patterned. First electrolytic Cu portions are formed on exposed surfaces of the electroless Cu layers, followed by formation of electrolytic Ni portions and second electrolytic Cu portions. The electrolytic Ni portions provide enhanced resistance to electromigration, while the second electrolytic Cu portions provide an adhesion layer for a solder mask and serves as an oxidation protection layer. Some of the first electrolytic Cu may be masked by lithographic means to block formation of electrolytic Ni portions and second electrolytic Cu portions thereupon as needed. Optionally, the electrolytic Ni portions may be formed directly on electroless Cu layers.08-09-2012
20110113625ORTHOGONAL HEADER - An electrically-conductive contact for an electrical connector is disclosed. Such a contact may include a lead portion, an offset portion extending from an end of the lead portion, and a mounting portion that may extend from a distal end of the offset portion. The lead portion and the distal end of the offset portion may each define an imaginary plane that may intersect at a non-zero, acute angle. An electrical connector that is suitable for orthogonal connector applications may include a connector housing securing two such electrical contacts. The distance between the respective mounting portions of the two such contacts may be defined independently of the contact pitch.05-19-2011
20110252638MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals, and second via conductors that electrically connect the second layered electrode to the second external terminals.10-20-2011
20110252637STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT - A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.10-20-2011
20100018046Method for the production of an identification carrier or electronic key for electronically actuated locks - In a method for producing an identification carrier or electronic key for electrically actuatable locks, an integrated circuit having at least one memory component is applied on a carrier by a printing process and an identification code is stored in the memory component.01-28-2010
20110302775METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.12-15-2011
20110302776ELECTRONIC-CIRCUIT ASSEMBLING PROCESS AND ELECTRONIC-CIRCUIT ASSEMBLING SYSTEM - An electronic-circuit assembling process to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting electronic circuit components supplied from a component supplier, onto a circuit board, wherein the electronic circuit components includes at least one of different-property components having respective different electrical properties. The process includes: (a) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a-i) a property-related information that enables recognition of the electrical property of the different-property component supplied from the component supplier and (a-ii) a different-property-component supply position that is a position of the component supplier supplying the different-property component, such that the different-property-component-related information is obtained by detecting the property-related information and/or the different-property-component supply position; (b) a mounting step of mounting, based on information related to the different-property-component supply position, the electronic circuit components including the different-property component, onto the circuit board; and (c) a property-related information providing step of providing the circuit board with the property-related information of the different-property component mounted on the circuit board.12-15-2011
20100018047SURFACE MOUNT PACKAGE - A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.01-28-2010
20120144664TV TUNER AND THE MANUFACTURING METHOD THEREOF - A TV tuner includes an Ultra High Frequency (UHF)/Very High Frequency (VHF) tracking filter, an UHF/VHF matching circuit and a single conversion Tuner IC. The UHF/VHF tracking filter includes a first Low-Temperature Co-fired Ceramics (LTCC) inductor, a first varactor diode and a fine-tune capacitor electrically connected to determine the maximum gain frequency of the UHF/VHF tracking filter. The UHF/VHF matching circuit includes a second LTCC inductance, a second varactor diodes and a fine-tune capacitor electrically connected to determine the maximum gain frequency of the UHF/VHF matching circuit.06-14-2012
20120304458METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X12-06-2012
20120060365Method of manufacturing a printed circuit board having metal bumps - A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.03-15-2012
20120042510METHOD OF FABRICATING A METALLIC MICROSTRUCTURE AND MICROSTRUCTURE OBTAINED IN ACCORDANCE WITH THIS METHOD - The present invention concerns a method of fabricating a plurality of metallic microstructures, characterized in that it includes the steps consisting in: 02-23-2012
20120005888PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.01-12-2012
20120005887CORELESS SUBSTRATE, METHOD OF MANUFACTURING SAME, AND PACKAGE FOR MICROELECTRONIC DEVICE INCORPORATING SAME - A coreless substrate includes a stiffener material (01-12-2012
20120005886Method of manufacturing printed circuit board having buried solder bump - A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.01-12-2012
20120042509METHOD FOR MANUFACTURING PROBE CARD - A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.02-23-2012
20120042511METHOD OF PRODUCING CIRCUIT BOARD - Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.02-23-2012
20120011713METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n−2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n−2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions.01-19-2012
20100242271DIELECTRIC LAMINATION STRUCTURE, MANUFACTURING METHOD OF A DIELECTRIC LAMINATION STRUCTURE, AND WIRING BOARD INCLUDING A DIELECTRIC LAMINATION STRUCTURE - A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness of from 0.3 to 10 μm. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 μm, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 μm, and a minimum via pitch is from 100 to 350 μm.09-30-2010
20090133251MANUFACTURE OF A CIRCUIT BOARD AND CIRCUIT BOARD CONTAINING A COMPONENT - A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line.05-28-2009
20100175246COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD - In a component mounting line 07-15-2010
20120167384Method of Making a Low Profile Flip Chip Power Module - A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described.07-05-2012
20120311857Method for Contacting a Lighting Device, Tool for Performing the Method and Connection Element for Attachment on a Lighting Device - A method for contacting a lighting device is provided, wherein the lighting device has a circuit board which is covered at least partly by a sealing compound layer; wherein the lighting device can be separated at a separating point into two lighting device sections and each of the lighting device sections has at least one electrical contact. The method may include: removing at least the sealing compound layer on both sides of the separation point so that the contacts remain covered by a thinner, remaining sealing compound layer; separating the lighting device at the separation point; attaching a connection element at least to the remaining sealing compound layer of at least one of the lighting device sections, wherein the connection element has at least one contacting element, which contacts a respective contact covered by the remaining sealing compound layer after a separation or penetration of the remaining sealing compound layer;12-13-2012
20120311856SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND METHOD FOR PRODUCING SAME - Disclosed is a method for producing a substrate for mounting a light-emitting element, whereby a substrate for mounting a light-emitting element such that power can be supplied via a columnar metal body even if the side surfaces of the columnar metal body do not have pads can be produced by means of a low-cost and easy step that does not involve lamination of a metal foil, plating, or the like. Further disclosed are a substrate for mounting a light-emitting element and a light-emitting element package. The substrate for mounting a light-emitting element is provided with: at least two columnar metal bodies (12-13-2012
20120255165Method for Fabricating Heat Dissipation Substrate - A method for fabricating a heat dissipation substrate is disclosed. The method includes the steps of: providing a substrate, wherein the substrate includes a metal layer, an insulation layer, and a first conductive layer, of which the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer; removing the partial metal layer for forming a metal bulk; providing an adhesive layer, wherein the adhesive layer includes an opening, and the opening is corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; forming a third conductive layer in the hole.10-11-2012
20100325882System And Method For Processor Power Delivery And Thermal Management - A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.12-30-2010
20100325881 METHOD FOR PRODUCING A CIRCUIT BOARD LAYER (CIRCUIT LEVEL), FOR AN IN PARTICULAR MULTILAYER CIRCUIT BOARD (CERAMIC SUBSTRATE) - A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.12-30-2010
20110225816METHOD OF MANUFACTURING A MULTILAYER PRINTED CIRCUIT BOARD WITH A BUILT-IN ELECTRONIC DEVICE - A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.09-22-2011
20110225815ELECTRODE FORMING METHOD AND ELECTRODE FORMING APPARATUS - The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.09-22-2011
20120079716METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.04-05-2012
20110296678Method and structure for directly connecting coaxial or micro coaxial cables to the interior side of pads of a printed circuit board to improve signal integrity of an electrical circuit - A method and an apparatus for connecting a coaxial (or a micro coaxial) cable to the bottom side of a printed circuit board (PCB) in order to improve signal integrity of a test circuit. A coaxial or a micro coaxial cable is directly connected to a coaxial cable to the bottom sides of pads located on an exterior later of the PCB.12-08-2011
20120324723METHOD OF MANUFACTURING CORELESS SUBSTRATE - The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.12-27-2012
20130174416Method for Manufacturing Flexible Multilayer Electrical Articles with Improved Layer Adhesion - A process for manufacturing a multilayer article, the article comprising two crosslinked semiconductive layers separated by and bonded to an insulation layer, the semiconductive layers formed from a peroxide-crosslinkable olefin elastomer and the insulation layer comprising composition comprising a silane-grafted olefinic elastomer, the process comprises the steps of: (A) injecting the silane-grafted olefinic elastomer between the two crosslinked semiconductive layers so as to have direct contact with each semiconductive layer, and (B) crosslinking the silane-grafted olefinic elastomer in the absence of a peroxide catalyst.07-11-2013
20120246924METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.10-04-2012
20130133189ROBOT SYSTEM AND METHOD OF MANUFACTURING WORKPIECE - A robot system according to an aspect of an embodiment includes a supply unit and a robot. The supply unit is fixedly provided at a predetermined position to supply a feed material that is used for processing a workpiece. The robot transfers the unprocessed workpiece handed from an operator at a predetermined transfer position to the vicinity of the supply unit to process the workpiece by using the feed material supplied from the supply unit and then transfers the processed workpiece to the transfer position.05-30-2013
20130145618AIR CURRENT GENERATING APPARATUS AND METHOD FOR MANUFACTURING SAME - In one embodiment, an air current generating apparatus includes: a dielectric substrate exposed to gas: a first electrode disposed inside the dielectric substrate; a second electrode disposed near a surface of the dielectric so as to correspond the first electrode and having a sharp shape; and a power source applying a voltage between the first and second electrodes and plasmatizing part of the gas to generate an air current.06-13-2013
20110271522METHOD FOR MAKING AN ELECTRONIC ASSEMBLY - In an embodiment of the present invention a method for making an electronic assembly is provided. The method comprises positioning a substrate having a plurality of segmented portions. A first segmented portion has a first plurality of conductive traces terminating to form a first plurality of conductive pads. A second segmented portion has a second plurality of conductive traces terminating to form a second plurality of conductive pads. A flex circuit is placed onto the conductive pads. The flex circuit includes a third plurality of conductive traces terminating at a first end to form a first plurality of connecting pads and terminating at a second end to form a second plurality of connecting pads. Electronic components are electrically coupled to the first and second plurality of conductive traces to form a primary PCB and a daughter PCB. The connecting pads are electrically coupled to the conductive pads for electrically coupling the daughter PCB to the primary PCB.11-10-2011
20110308079FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.12-22-2011
20120017433METHOD OF MANUFACTURING TOUCH SCREEN - Disclosed herein is a method of manufacturing a touch screen, including: (A) preparing a transparent substrate; (B) forming a patterned transparent electrode including a conductive polymer on the transparent substrate and allowing patterns of the transparent electrode in different columns to be connected by a connection part; and (C) removing the connection part of the transparent electrode. The method of manufacturing a touch screen forms the transparent electrode so that the patterns in different columns are definitely spaced apart from each other to accurately detect touched positions.01-26-2012
20120055015METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION - The present invention relates to a method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.03-08-2012
20120084975COMMON CARRIER FOR THE INTEGRATED MANDREL BATTERY ASSEMBLY - A system for the automated coiling of a jelly roll electrode assembly for controlled assembly and tensioning of jelly roll assembly is provided. The system includes: a shuttle, and a mandrel to which electrodes are welded; a base, mateable with the shuttle and on which the battery head assembly is mounted for welding to the mandrel; and a coiling device. The coiling device has an upper spool, a lower spool, holding a separator strip and a platform between the two holding the base. The separator strip is threaded through a passage in the mandrel separating positive and negative portions. Rotating the mandrel coils the positive electrode, the separator strip and the negative electrode to coil around the mandrel. The coiling device may include a feedback loop braking one or both spools and allowing the coiling tension to be programmed to a desired level.04-12-2012
20130205586ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.08-15-2013

Patent applications in class On flat or curved insulated base, e.g., printed circuit, etc.

Patent applications in all subclasses On flat or curved insulated base, e.g., printed circuit, etc.