Class / Patent application number | Description | Number of patent applications / Date published |
029827000 | Beam lead frame or beam lead device | 7 |
20090044402 | Method for manufacturing a pre-molding leadframe strip with compact components - A method for manufacturing a pre-molding leadframe strip with compact components is disclosed. The method forms a leadframe strip with an array of component regions, each component region including two metal parts for using as a chip-attached portion, a wire-bonded portion and two external electrical connection conductors. Next, the leadframe strip is plated with a metal layer having high conductivity and die bonding adhesion. Finally, a pre-molded structure on each of the component regions is formed to surround all the other portions of the leadframe strip with an exception of only the two external electrical connection conductors through a multiplicity of pre-molding processes, each pre-molding process molding the leadframe strip at an interval of one or more than one component regions. | 02-19-2009 |
20100122454 | METHOD FOR FORMING AN ISOLATED INNER LEAD FROM A LEADFRAME - A method for forming an isolated inner lead from a leadframe is revealed. The leadframe primarily comprises a plurality of leads, the isolated inner lead, and an external lead. Each lead has an inner portion having a finger. The isolated inner lead having two fingers is completely formed inside a molding area and is made of the same metal leadframe as the leads. One finger of the isolated inner lead and the fingers of the leads are linearly arranged. The other finger of the isolated inner lead is adjacent to a finger of the external lead. At least one of the inner portions divides the isolated inner lead from the external lead. The isolated inner lead is integrally connected to an adjacent one of the inner portions by a connecting block. A tape-attaching step is performed to mechanically connect the isolated inner lead where two insulating tapes are attached in a manner that the connecting block can be removed. Therefore, the isolated inner lead is electrically isolated from the leads and can be mechanically fixed to replace extra redistributing components during semiconductor packaging processes. | 05-20-2010 |
20130298393 | Selective Leadframe Planishing - A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the leadframe surface is roughed. A first set of leadframe areas is planished. A second set of leadframe areas are offsetted and the tape is cut into strips. | 11-14-2013 |
20130298394 | METHOD FOR FABRICATING BIOSENSOR - A method for fabricating a plurality of biosensors includes the steps of: providing a base with a surface; forming a carbon nanotube array including a plurality of carbon nanotubes substantially parallels to each other on the surface; forming a plurality of lead pairs on the surface, the plurality of lead pairs divides the plurality of carbon nanotubes into a plurality of first carbon nanotubes and a plurality of second carbon nanotubes; eliminating the plurality of second carbon nanotubes; cutting the plurality of first carbon nanotubes to form a plurality of third carbon nanotubes and a plurality of fourth carbon nanotubes; and fabricating a plurality of receptors to electrically connect the plurality of third carbon nanotubes to the plurality of fourth carbon nanotubes. | 11-14-2013 |
20140130346 | SENSOR PACKAGE - Sensor package | 05-15-2014 |
20140290051 | METHOD OF MANUFACTURING A DATA CARRIER PROVIDED WITH A MICROCIRCUIT - The present invention consists to a method of manufacturing a data carrier ( | 10-02-2014 |
20150348801 | STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF - A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts. | 12-03-2015 |