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Conductor or circuit manufacturing

Subclass of:

029 - Metal working

029592000 - METHOD OF MECHANICAL MANUFACTURE

029592100 - Electrical device making

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
029829000 On flat or curved insulated base, e.g., printed circuit, etc. 757
029874000 Contact or terminal manufacturing 154
029857000 Assembling terminal to elongated conductor 72
029868000 Assembling elongated conductors, e.g., splicing, etc. 31
029854000 Assembling electrical component directly to terminal or elongated conductor 22
029828000 Co-axial cable 11
029827000 Beam lead frame or beam lead device 2
20100122454METHOD FOR FORMING AN ISOLATED INNER LEAD FROM A LEADFRAME - A method for forming an isolated inner lead from a leadframe is revealed. The leadframe primarily comprises a plurality of leads, the isolated inner lead, and an external lead. Each lead has an inner portion having a finger. The isolated inner lead having two fingers is completely formed inside a molding area and is made of the same metal leadframe as the leads. One finger of the isolated inner lead and the fingers of the leads are linearly arranged. The other finger of the isolated inner lead is adjacent to a finger of the external lead. At least one of the inner portions divides the isolated inner lead from the external lead. The isolated inner lead is integrally connected to an adjacent one of the inner portions by a connecting block. A tape-attaching step is performed to mechanically connect the isolated inner lead where two insulating tapes are attached in a manner that the connecting block can be removed. Therefore, the isolated inner lead is electrically isolated from the leads and can be mechanically fixed to replace extra redistributing components during semiconductor packaging processes.05-20-2010
20090044402Method for manufacturing a pre-molding leadframe strip with compact components - A method for manufacturing a pre-molding leadframe strip with compact components is disclosed. The method forms a leadframe strip with an array of component regions, each component region including two metal parts for using as a chip-attached portion, a wire-bonded portion and two external electrical connection conductors. Next, the leadframe strip is plated with a metal layer having high conductivity and die bonding adhesion. Finally, a pre-molded structure on each of the component regions is formed to surround all the other portions of the leadframe strip with an exception of only the two external electrical connection conductors through a multiplicity of pre-molding processes, each pre-molding process molding the leadframe strip at an interval of one or more than one component regions.02-19-2009
Entries
DocumentTitleDate
20130000112APPARATUS AND METHOD FOR MANUFACTURING A MULTICHANNEL ELECTRODE ARRAY FOR CRANIAL NERVE STIMULATION - According to the present invention, an apparatus for manufacturing a multichannel electrode array for cranial nerve stimulation comprises: an electrode support (01-03-2013
20100058582METHOD AND DEVICE FOR THE APPLICATION OF AN ELONGATED CONDUCTOR TO A SOLAR ELEMENT - A method and device for the application of an elongated electric conductor to a solar element wherein the required length of the elongated electric conductor is readied and the conductor is strained through application of a tensile stress. The conductor is then fastened to the solar element. Straining of the elongated electric conductor is monitored to prevent exceeding of a tensile limit. During fastening onto the solar element at least one press-on roller is employed.03-11-2010
20100050428Method for Manufacturing a Solar Module - A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly.03-04-2010
20110192022Method for Forming an Enhanced Communication Cable - A cable and method of forming the cable are presented. The cable contains twisted wire pairs disposed in a cavity defined by a jacket. Each wire has a conductor and an insulator surrounding the conductor. The cable may also contain a spline that separates the twisted wire pairs. At least one of the insulators or the jacket is helically corrugated such that ridges extend radially inward or outward. The ridges of the insulators may be the same or different. The cable is extruded from an extruder. The jacket may contain corrugations after being extruded by the extruder. The cable may be passed through dies to form a helically corrugated jacket. The jacket heated by a heater prior to being passed through the dies, or may pass through the dies while still hot from the extruder.08-11-2011
20100115765Layout verification apparatus, layout apparatus, layout verification method, layout verification program, and wiring forming method - The layout verification apparatus includes: a verification unit for obtaining mask data indicating a mask pattern to be drawn on a mask based on layout and wiring data indicating positions of a group of primitive cells and positions of connection wires connected to the group of primitive cells, and for verifying a position of the mask pattern based on the mask data, so as to detect an error part; and a correction hint creating unit for creating correction hint information based on the error part, and for sending the correction hint information to a layout and wiring unit for correcting the layout and wiring data. The correction hint creating unit obtains terminal information indicating positions of a group of terminals included in the group of primitive cells and creates the correction hint information based on the terminal information so that the positions of the group of terminals are not changed by the layout and wiring unit.05-13-2010
20100115764STRESSED LIQUID CRYSTALS MATERIALS FOR LIGHT MODULATION - A new light modulating material using interconnected unidirectionally oriented microdomains of a liquid crystal, dispersed in a stressed polymer structure, is provided. The light modulating material is prepared by dissolving the liquid crystal in an uncured monomer and then curing the monomer so that the polymer forms a well-developed interpenetrating structure of polymer chains or sheets that is uniformly dispersed through the film. When the film is subjected to stress deformation the liquid crystal undergoes a change in its unidirectional orientation. The concentration of the polymer is high enough to hold the shear stress, but is as low as possible to provide the highest switch of the phase retardation when an electric field is applied. The new materials are optically transparent and provide phase modulation of the incident light opposed to the low driving voltage, linear electro-optical response, and absence of hysteresis. It has been shown that these new materials may be successfully used in display applications, optical modulator, and beam steering devices.05-13-2010
20130074328METHODS AND SYSTEMS FOR FORMING ELECTRONIC MODULES - A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.03-28-2013
20120174390METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP - The present invention provides a method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove.07-12-2012
20130031779Apparatus And Method For Stripping Electrical Bar Conductors, In Particular For Bar Windings of Electrical Machines - Stripping apparatus (02-07-2013
20090183362Method for manufacturing a transmission line equalizer - A method for manufacturing an equalizer used to compensate a digital signal passed by a transmission line, in which the digital signal can be presented as a frequency-domain function. The method includes measuring a the transmission line scattering-parameter; performing an integration and a differentiation about the transmission line scattering-parameter, the frequency-domain function, the ideal gain, and an equalizer scattering-parameter to get the component impedances of the equalizer; and manufacturing the equalizer circuit with the derived component impedances.07-23-2009
20130036605Electrical Connector With Spring For Missile Launch Rail - An electrical connector for testing of missile launch rail is provided. The electrical contacts of the connector move from a rear disengaged position to forward engaged positions via the energy of a compressed spring. The connector base has rail mounts for securing to a missile launch rail. A housing attaches to the base and houses a plunger, an insulator, electrical contacts, and a tube, which move forward and aft as a unit. A knob on a rear tube end enables user to limit the initial impact of the electrical contacts on contact pins or striker points of missile launch rail. The connector can provide electrical connection with launch rail pins as rail pins recede into the missile launch rail. Electrical contact position is governed, in part, by locating pins which ride in a track cut into an outer surface of the tube and move with rotation of an indexing ring.02-14-2013
20130036604STATIC DISSIPATION IN COMPOSITE STRUCTURAL COMPONENTS - A method to prevent the accumulation of static electricity in a pipe system for containing corrosive petroleum products is provided, for a total resistance of less than 1 MEG ohms to ground from all points. The pipe system has at least two pipe sections, each comprising a structural layer and a corrosion resistant layer. The corrosion resistant layer has at least a conductive surface area in contact with the fluid, with the conductive surface area defining an electrical pathway extending a length of the pipe section. Each pipe section has a tapered end exposing a portion of the corrosion resistant layer. The method comprises joining the two pipe sections at the tapered ends by a conductive adhesive overlay, and electrically connecting the conductive adhesive overlay to a grounding device, wherein the grounding device helps dissipate build-up of electrostatic charge in the pipe system carrying the fluid.02-14-2013
20100043221External electrode forming method - A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.02-25-2010
20100043220METHOD FOR CONNECTING A FLEXIBLE PRINTED CIRCUIT BOARD (PCB) TO A PRINTHEAD ASSEMBLY - The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path.02-25-2010
20100107408Reinforced Sensing and Stimulation Leads and Use in Detection Systems - A reinforced medical electrical lead for neurological applications has a reinforced construction for resisting the detachment of electrodes and lead connection terminals, thereby improving the robustness of the lead and extending the life of the lead by reducing the likelihood that a further surgical procedure will be required to remove the lead for repair or replacement thereof. The present reinforced lead construction maintains the integrity of the electrical connection between the conductor and the respective electrode and lead connection terminal by incorporating several reinforcing features in the lead construction in contrast to conventional lead constructions where it is possible to pull the electrodes and lead connection terminals away from their contact points with relatively little force.05-06-2010
20130047426METHOD FOR MANUFACTURING ELECTRONIC APPARATUS - Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.02-28-2013
20100095521METHOD FOR TREATING ELECTRICAL CABLE AT SUSTAINED ELEVATED PRESSURE - A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.04-22-2010
20130086803FORMING A TUBULAR AROUND INSULATED CONDUCTORS AND/OR TUBULARS - A method of forming a tubular around one or more insulated conductors includes providing one or more insulated conductors and a strip of carbon steel to a tubular assembly location. The strip of carbon steel is formed into a tubular shape in the tubular assembly location. At least a portion of the insulated conductors are provided lengthwise inside the tubular shape as the strip of carbon steel is being formed into the tubular shape such that the tubular shape at least partially surrounds the one or more insulated conductors. The longitudinal edges of the strip of carbon steel together are welded to form a carbon steel tubular around the insulated conductors.04-11-2013
20130086804COMPONENT-MOUNTING DEVICE, AND COMPONENT-MOUNTING METHOD - A tray feeder includes tray supply mechanisms and arranged in parallel. Each of the tray supply mechanisms has a function of retrieving a tray from a tray housing portion by a tray retrieving unit, and transferring the pallet up to a component pickup position set in the vicinity of a height at the upper end of the tray housing portion. A lock state of a door by a door lock mechanism is released only in a state where the tray retrieving unit is located at the component pickup position and blocks an interior of the tray feeder from a head transfer space in which the mounting head transfers.04-11-2013
20120216397METHOD FOR BUILDING SIDE ILLUMINATION FOR A WHEEL - This is directed to systems, processes, machines, and other means that allow side illumination for a wheel. The invention can enable a bicycle user to control the amount of light produced by lights installed into a wheel in an efficient manner.08-30-2012
20130067737Method for Manufacture of Multi-Layer Wire Structure for High Efficiency Wireless Communication - A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.03-21-2013
20130055565MANUFACTURE OF CORED WELDING ELECTRODES - The outer metal sheath of a cored welding electrode is made by twin roll casting without cold rolling.03-07-2013
20130055564LINEAR CAPACITANCE-TO-VOLTAGE CONVERTER USING A SINGLE AMPLIFIER FOR TRANSDUCER FRONT ENDS WITH CANCELLATION OF SPURIOUS FORCES CONTRIBUTED BY SENSOR CIRCUITRY - Capacitive transducer systems are disclosed that reduce nonlinearities due to feedthrough capacitances or residual electrostatic forces. The systems can include a core with a first input coupled to a first variable capacitor, a second input coupled to a second variable capacitor, and a core output coupled to a common node; an amplifier with input switchably coupled to common node and an output; a feedback path switchably coupling amplifier output to common node; and a main clock with first and second phases, that controls switches coupling system components. When clock is in first phase, first core input is coupled to reference voltage, second core input is coupled to negative reference voltage, and common node is coupled to amplifier output. When clock is in second phase, core inputs are grounded, and common node is coupled to amplifier input. The system can have single amplifier. Neutralization capacitor can cancel feedthrough and parasitic capacitances.03-07-2013
20090271977COPPER CONDUCTOR WITH ANODIZED ALUMINUM DIELECTRIC LAYER - An electrically insulated conductor for carrying signals or current includes a solid or stranded copper core of various geometries with only a single electrically insulating and thermally conductive layer of anodized aluminum (aluminum oxide). The device is made by forming a uniform thickness thin sheet or foil of aluminum to envelop the copper or copper alloy core. The aluminum has its outer surface partially anodized either before or after forming to the core in an electrolytic process to form a single layer of aluminum oxide.11-05-2009
20100083489CARBON NANOTUBE COLUMNS AND METHODS OF MAKING AND USING CARBON NANOTUBE COLUMNS AS PROBES - Carbon nanotube columns each comprising carbon nanotubes can be utilized as electrically conductive contact probes. The columns can be grown, and parameters of a process for growing the columns can be varied while the columns grow to vary mechanical characteristics of the columns along the growth length of the columns. Metal can then be deposited inside and/or on the outside of the columns, which can enhance the electrical conductivity of the columns. The metalized columns can be coupled to terminals of a wiring substrate. Contact tips can be formed at or attached to ends of the columns. The wiring substrate can be combined with other electronic components to form an electrical apparatus in which the carbon nanotube columns can function as contact probes.04-08-2010
20130061466MULTI-RESPONSE VIBRATION DAMPER ASSEMBLY - A damper assembly system that can provide for multiple frequency responses to control Aeolian vibration in EHV (Extra High Voltage) applications is disclosed. The damper assembly comprises an asymmetric design that enables two disparate frequency responses at either side of the clamp that attaches the damper to a suspended member or cable. Two additional frequency responses are enabled at an inlet point of each of the damper weights. The damper weights can have a rounded or egg-shape together with an inner cavity so as to control corona discharge in EHV applications. Additionally, the tuned weights can be of disparate mass as well as asymmetric distances from the clamp.03-14-2013
20130061467MEDICAL LEAD AND METHOD FOR MEDICAL LEAD MANUFACTURE - A lead employing a connection between a conductor and an electric element is provided. The connection includes a conductive pad electrically connected to at least one conductor and the electric element electrically connected to the conductive pad. The conductive pad can further include an elongated element to connect the pad to the electric element. The method for connecting a conductor to an electric element is also provided. The method includes forming a groove in the insulator of a lead body to expose the conductor. Placing a conductive pad within the groove and electrically connecting a conductive pad to the conductor. An electric element is then placed over the conductive pad and the electric element is electrically connected to the conductive pad.03-14-2013
20090265926POSITIONING DEVICE TO POSITION ONE OR MORE PLATES OF ELECTRONIC CIRCUITS, IN A METAL DEPOSITION UNIT, AND RELATIVE METHOD - A positioning device to position one or more plates of electronic circuits with respect to an operating unit. The device comprises a rotary member which rotates selectively between a first operating position and a second operating position, and a positioning member mounted on the rotary member. The positioning member comprises a frame, which is mounted removably on the rotary member, and a strip of transpirant material on which each plate is rested. The strip is wound between a pair of winding/unwinding rollers, pivoted on the frame. The positioning member also comprises heating means able to heat the wafer to take it to a determinate operating temperature.10-29-2009
20130067738Method for Manufacture of Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication - A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.03-21-2013
20130160287SYSTEMS AND LEADS WITH A RADIALLY SEGMENTED ELECTRODE ARRAY AND METHODS OF MANUFACTURE - A method of making a lead for a stimulation device includes forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions; disposing the at least one pre-electrode near a distal end of a lead body; joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form segmented electrodes from the thick-walled portions of the at least one pre-electrode.06-27-2013
20090235521Shield harness manufacturing method - A shield harness manufacturing device includes a sheet feeder, a conductor-winding mold, an insulator-winding mold, and a control unit. The conductor-winding mold winds an ALS sheet as an electrically conductive sheet around a wire bundle including at least one covered wire and at least one drain wire. The insulator-winding mold folds a PET sheet as an electrically insulating sheet into two halves and then wraps the ALS-wound wire bundle in the PET sheet over the entire length of the wire bundle. The sheet feeder feeds the ALS sheet into the conductor-winding mold through which the covered wire and the drain wire are passed. The ALS sheet is wound around the covered wire and the drain wire over the entire length of the wires. Thereafter, the ALS-wound wire bundle is inserted into the insulator-winding mold and the sheet feeder feeds the PET sheet into the insulator-winding mold.09-24-2009
20120233854Capacitive Full-Wave Circuit for LED Light Strings - A capacitive full-wave circuit for LED light strings makes use of capacitors and diodes together to drive a LED string with full AC waves. Different from the conventional four-diode full-wave rectifying circuit, one embodiment of capacitive full-wave circuit includes two capacitors and two diodes. Because of the large imaginary impedance, the capacitors not only limit and the voltage and current through the LEDs, but also consume almost no electrical power. The electrical current-voltage performance can be further improved by introducing four resistors with a cost of some additional power consumption. A LED light string module with the capacitive full-wave circuit is also presented, with the capacitive full-wave circuit integrated inside of a front power plug and a back power socket.09-20-2012
20080295324METHOD OF MAKING AN ELECTROCHEMICAL SENSOR - A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.12-04-2008
20080295323CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - An exemplary circuit board assembly includes a circuit board, at least one conductor, and a reinforcing board. The circuit board has at least one hole formed therein. Each conductor is received in one respective hole. The reinforcing board is attached to the circuit board and is electrically connected to the circuit board via the at least one conductor. The present invention also relates to a method of making the circuit board assembly.12-04-2008
20130160286METHOD OF MANUFACTURING ELECTRICAL CABLE, AND RESULTING PRODUCT, WITH REDUCED REQUIRED INSTALLATION PULLING FORCE - Disclosed is type THHN cable having a reduced surface coefficient of friction, and the method of manufacture thereof, in which the central conductor core and insulating layer are surrounded by a nylon sheath. A high viscosity, high molecular weight silicone based pulling lubricant for THHN cable, or alternatively, erucamide or stearyl erucamide for small THHN gauge wire, is incorporated, by alternate methods, with the nylon material from which the outer sheath is extruded, and is effective to reduce the required pulling force on the cable during installation.06-27-2013
20090300909LOW TEMPERATURE APPLICATIONS OF FLAME RETARDANT POWER CABLE - Jacketed power cables may have a core conductor and an outermost layer of cable jacketing material that may be PVC-based or polyolefin-based, and that may contain a flame retardant additive. These jacketed power cables may have sufficient flame retardancy and cold impact strength to be installed and/or used at temperatures below 0° C.12-10-2009
20120186077Method For Packaging Airtight Multi-Layer Array Type LED - A method for packaging an airtight multi-layer array type LED is disclosed. The method includes: integrally forming a metal substrate with an airtight metal frame surrounding an accommodating space; forming a light outlet platform surrounding a light outlet opening on a bottom of the accommodating space; forming two sets of sealing through hole pairs in the airtight metal frame, wherein each set of the sealing through hole pairs has one lead frame inserted therethrough, and all interstitial space in the two sets of the sealing through hole pairs is completely sealed with a sealing material; disposing the optical units and optical components in the accommodating space; sequentially forming a dice protection layer, a fluorescent layer, and a silicone layer on the LED dices; and installing an optical glass cover on the top surface of the airtight metal frame to seal the packaging structure of the present invention.07-26-2012
20120285008SKIN MATERIAL OF VEHICLE INTERIOR EQUIPMENT AND MANUFACTURING METHOD FOR THE SAME - A manufacturing method for a skin material of a vehicle interior equipment includes exposing a conductive wire material by removing a main fiber material from a first fabric material formed of the conductive wire material and the main fiber material that is weaker than the conductive wire material and electrically connecting a conductive member, which is used to supply electric power to the conductive wire material, to the exposed portion of the conductive wire material.11-15-2012
20110283531Means whereby electricity generated in sources outside of an instrument designed to be powered by an electric cell, can be decivered to said instrument whether or not said cell is encased in said instrument. - The embodiments specified comprise various devices whereby electricity generated outside of a cell-instrument can be delivered to said instrument's electric circuit directly, or delivered to said circuit through a charged cell encased in said instrument's cell-space.11-24-2011
20110099802CHARGING AND POWER SUPPLY FOR MOBILE DEVICES - Charging and power supply for mobile devices is disclosed. A USB-compliant charging and power supply circuit includes switch-mode battery charging circuitry for receiving power from an external power source and for supplying output power through an output node to an electronic system of an electronic communication device and a battery. Battery isolation circuitry includes a semiconductor switch connecting the output node to the battery. The battery isolation circuitry senses voltage at the output node and variably restricts current to the battery when the voltage is below a minimum voltage value by operationally controlling the semiconductor switch as current passes through it. During variable current restriction the electronic system is supplied required power with said battery being supplied any additional available power.05-05-2011
20090089997Method Of Forming An Electrical Circuit With Overlaying Integration Layer - In a method of forming an electrical circuit assembly, a substrate is provided including a plurality of first segments that form an electrical circuit. The first segments have surfaces that rise above surfaces of other segments that form the electrical circuit. All of the segments are deposited on the substrate via one or more shadow mask vapor deposition processes in a vacuum. A photoresist caused to cover all of the segments is hardened and then abraded until surfaces of the first segments are exposed, but surfaces of the other segments are not exposed, and a surface of the abraded photoresist is at the same level as the exposed surfaces of the first segments. Second segments can be deposited on the exposed surfaces of the first segments via a shadow mask vapor deposition process in a vacuum to a level above the top surface of the abraded photoresist.04-09-2009
20100263205Microcoil Construction - A microcoil is manufactured by rolling a trace unit in such a way as to form at least one winding. The trace unit is comprised of a conductive trace attached to a flexible insulating film. A preferred embodiment of the microcoil contains both a first winding and a second winding electrically connected and spaced apart by a joining portion. The microcoil may be used for internal magnetic resonance imaging of patient by attaching the microcoil to a catheter.10-21-2010
20100263204HIGH TEMPERATURE COMPOSITE TAPE AND METHOD FOR MANUFACTURING THE SAME - A method of manufacturing a composite tape used for producing printed circuit board is provided. The method includes the steps of: providing a mold-releasing layer on a first surface of a paper substrate layer; providing a composite adhesive layer on a second surface of the paper substrate layer, the composite adhesive layer being formed by polyurethane adhesive, polyester adhesive, or a mixture thereof; providing a plastic layer on a second surface of the composite adhesive layer; and providing an adhering layer on a second surface of the plastic layer. The composite tape according to the invention can not only bear high temperature up to 280° C. for a predetermined time, but also the tape does not detach or warp.10-21-2010
20120023743METHODS AND APPARATUS FOR SHIELDING CIRCUITRY FROM INTERFERENCE - This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.02-02-2012
20120023742Arrangement for Energy Conditioning - Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.02-02-2012
20120023741Arrangement for Energy Conditioning - Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.02-02-2012
20120192411METHOD FOR ELECTRICAL CONNECTION BETWEEN TWO SURFACES OF CERAMIC SUBSTRATE - The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.08-02-2012
20100077606METHOD OF FORMING A LEAD - An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.04-01-2010
20090165294LOW PROFILE WIRE BONDED USB DEVICE - A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.07-02-2009
20090089998Methods of Manufacturing Electrical Cables - A method forming at least a portion of a cable comprises providing at least one cable conductor core, extruding at least an inner layer of a polymeric insulation material over the at least one conductor core, providing a plurality of strength members having a coating of the polymeric insulation material, heating the at least one cable conductor core and the strength members, embedding the strength members into the inner layer of the cable conductor core, and extruding an outer layer of the polymeric insulation material over the cable conductor core and the plurality of strength members and bonding the outer layer to the inner layer and the coating to form the cable and provide a contiguous bond between the inner layer, the strength members, and the outer layer, wherein the polymeric insulation material of the inner layer, the strength member coating, and the outer layer are amended to enable the inner layer and the outer layer to melt at a greater rate than the strength member coating.04-09-2009
20100122453THERMALLY ENHANCED POWER CABLE REJUVENATION - A method for enhancing the dielectric properties of at least one in-service electrical cable section having a central stranded conductor encased in a polymeric insulation jacket and having an interstitial void volume in the region of the conductor. The method includes filling the interstitial void volume with at least one dielectric property-enhancing fluid and then confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the cable section and being below the elastic limit of the insulation jacket. The cable section is heated by imposing a potential of no more than about 500 volts across the conductor during at least a portion of the time required to complete the other described steps.05-20-2010
20090007422Connectible nanotube circuit - Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.01-08-2009
20090007421METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.01-08-2009
20080250632SYSTEM AND METHOD OF A CONFORMABLE CABLE - A method and system for providing a conformable cable are described. The method and system may include disposing a conformable material along at least a portion of a cable and configuring the cable into a desired position and shape in which the shape of the cord remains unchanged.10-16-2008
20120291269Vapor Lamp Assembly Technique and Power Supply - An LED lamp that couples a heatsink with LEDs mounted on it to a glass envelope with a surface area equivalent to approximately that of a conventional light bulb, and by using a coolant vapor within the glass envelop, the lamp can be made much lighter and more cheaply. The heat generated by the LEDs is dissipated by the glass surface and not conducted into the heatsink. The heatsink can thus be mostly for the power supply. This allows for a reduced operating temperature for the power supply components that allows for a longer expected life for the power supply. In addition, the LED light bulb of the present invention can have nearly the same shape and appearance as a standard incandescent bulb. The invention can also have an advanced flyback power supply.11-22-2012
20080276453Autoclavable Switch Assembly - A device includes a printed circuit board having a first surface and a second surface. The printed circuit board defines an opening therethrough from the first surface to the second surface and a circuit formed on the first surface of the printed circuit board with no portion of the circuit intersecting the opening. The second surface of the printed circuit board at least partially bounds a first channel in fluid communication with the opening. A method of venting includes displacing air within a cavity of a switch by moving the air through one or more channels formed in a layer defining cut-outs in fluid communication with the cavity. The air is moved through an opening formed in a printed circuit board. The layer is positioned at a first side of the printed circuit board. In addition, the method includes moving the air through a venting channel positioned at a second, opposite side of the printed circuit board and into the surrounding-environment.11-13-2008
20120291271SYSTEMS AND METHODS OF COUPLING ELECTRICAL CONDUCTORS - Systems and methods are provided for coupling a plurality of electrical conductors, such as wires. A connector is provided including a plurality of bores or channels formed into a preferably unitary connector body, wherein at least a portion of one or more of the bores or channels intersects at least a portion of another of the bores or channels. The bores or channels are preferably formed along bore axes, which may be coplanar. A method according to the present invention includes inserting an insulated electrical conductor into a connector body and rotating a conductive rotational member threaded into a bore or channel formed in a connector body so as to electrically contact the conductive portion of the insulated conductor and at least one other electrically conductive surface.11-22-2012
20120291270LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.11-22-2012
20090113701Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of preparing an insulating base layer, forming a wire on the insulating base layer, forming an insulating cover layer on the insulating base layer so as to cover the wire, and applying near-infrared light with a wavelength of more than 700 nm and less than 950 nm from either one of the insulating base layer and the insulating cover layer through the other insulating layer to thereby inspect a foreign substance with the light transmitted therethrough.05-07-2009
20090165293ELECTRONIC ASSEMBLY MANUFACTURING METHOD - A method is described for manufacturing electronic assemblies (07-02-2009
20090183363PROBE CARD, METHOD OF MANUFACTURING THE PROBE CARD AND ALIGNMENT METHOD - A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.07-23-2009
20090139084ARMORED CABLE AND METHODS AND APPARATUS FOR FORMING THE SAME - A method for forming an armored cable assembly includes: forming an armor sheath using an armor sheath forming apparatus, the armor sheath defining a sheath passage; forcibly feeding a transmission cable into the sheath passage upstream of an exit capstan to provide an excess length of the transmission cable in the armor sheath upstream of the exit capstan; and drawing the armor sheath downstream of the armor sheath forming apparatus using the exit capstan.06-04-2009
20110219611ENHANCED INTEGRATED CIRCUIT PACKAGE - A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.09-15-2011
20090199398Fiber connector and adapter - Fiberoptic connector and adapter assembly includes a fiberoptic connector received within an adapter. The connector has a cover on the connector housing. The cover pivots between open and closed positions to expose or cover, respectively, a optical fiber contained within the connector. Longitudinal guides of the connector are received cooperating with longitudinal guides of the adapter to direct the connector into the adapter in a prescribed alignment. A cam pin is carried on the adapter to engage a cam pin receiving slot on the cover to urge the cover to the open position as the connector is inserted into the adapter.08-13-2009
20120137511ROOM TEMPERATURE LOW CONTACT PRESSURE METHOD - In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide film; arranging a top and a bottom polyimide film to a top portion and a bottom portion of the stack to form the rigid flex circuit board; and selecting a suitable pressure and temperature at which to form the rigid flex assembly such that the one or more layers of polyimide film do not move with respect to one another during the fabrication.06-07-2012
20110219610LAY LENGTH AND RATIO MEASURING DEVICE FOR ELECTRICAL CABLE - A lay meter includes a computer based device, a light source for creating a light plane operably connected with the computer based device, a shadow based sensor a light plane operably connected with the computer based device, and signal processing circuits and software for processing sensed signals such that a clean square wave voltage signal is generated in direct response to the lays passing through the light plane.09-15-2011
20090064492METHOD OF MANUFACTURING RF ABLATION PROBE WITH UNIBODY ELECTRODE ELEMENT - An ablation probe and method of manufacturing the ablation probe are provided. The probe comprises a probe shaft and a unibody electrode element. The unibody electrode element comprises a common electrode base located at the distal end of the shaft, and a plurality of electrode tines distally extending from the electrode base. The electrode element may be created by forming divisions (such as slits or slots) from a first end of an electrically conductive elongate member towards an opposing second end of the elongate member. Alternatively, the divisions can be formed from a first end of an electrically conductive sheet towards an opposing second end of the sheet, and then bent or rolled to form the elongate member. In either case, the common electrode base can either be separately mounted to a probe shaft, or the probe shaft can be formed from the elongate member, in which case, the electrode base will be integrated with the probe shaft as a unibody structure. The electrode tines can be optionally shaped, e.g., to proximally evert.03-12-2009
20090070993METHOD FOR ESTABLISHING A HIGH SPEED MEZZANINE CONNECTION - A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment. A plurality of terminals are biased to protrude laterally into each wafer support aisle, and are spaced along the wafer support aisle such that each wafer is movable within the respective wafer support aisle between a first position, wherein each electrically conducting pathway is disposed between adjacent terminals, to a second position, wherein each electrically conducting pathway is in electrical contact with a terminal on the first wall and an associated terminal on the second wall.03-19-2009
20090211084INSULATION SLEEVE ASSEMBLING APPARATUS AND INSULATION SLEEVE ASSEMBLING METHOD - An insulation sleeve assembling apparatus that assembles a tubular insulation sleeve to a lead wire that is formed of a plurality of conductors includes an actuator unit that rotates the insulation sleeve while actuating the lead wire and the insulation sleeve in a direction in which the lead wire and the insulation sleeve approach each other.08-27-2009
20090205201Impedance Based Devices and Methods for Use in Assays - A device for detecting cells and/or molecules on an electrode surface is disclosed. The device detects cells and/or molecules through measurement of impedance changes resulting from the cells and/or molecules. A disclosed embodiment of the device includes a substrate having two opposing ends along a longitudinal axis. A plurality of electrode arrays are positioned on the substrate. Each electrode array includes at least two electrodes, and each electrode is separated from at least one adjacent electrode in the electrode array by an expanse of non-conductive material. The electrode has a width at its widest point of more than about 1.5 and less than about 10 times the width of the expanse of non-conductive material. The device also includes electrically conductive traces extending substantially longitudinally to one of the two opposing ends of the substrate without intersecting another trace. Each trace is in electrical communication with at least one of the electrode arrays.08-20-2009
20090211085ELECTRODE ASSEMBLY FOR PLASMA PROCESSING APPARATUS - An electrode assembly for a plasma processing apparatus includes a backing member secured to an electrode. First fastener members mounted in apertures in the backing member cooperate with second fastener members to hold the electrode assembly to a support member, such as a temperature-controlled top plate in a plasma processing chamber.08-27-2009
20090241331System and Method of Forming a Protective Covering for a Wire Harness - A system and method for forming a wire harness covering having a predetermined three-dimensional geometry is provided. The system and method make use of a mold and a post-molding fixture. In a first phase, the mold is used during an injection molding process to form a substantially flat and partially-cured harness covering having an intermediate, substantially two-dimensional shape. In a second phase, the post-molding fixture is used after the injection molding process to orient the harness with covering to a predetermined three-dimensional geometry corresponding to the desired final shape.10-01-2009
20090255110PHOTO-ETCHED EDM ELECTRODE - An electrical discharge machining electrode includes a body and one or more shaped teeth. The one or more shaped teeth of the body have a diffuser section and a metering section in electrical communication therewith. The body and the teeth may be formed by a process of photochemically etching a substrate made from an electrically conductive material.10-15-2009
20120192413GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME - Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.08-02-2012
20120192412METHOD AND APPARATUS FOR MOUNTING AND PROTECTION OF COMMUNICATION EQUIPMENT IN UNDERGROUND MINE - An apparatus for supporting communication equipment in an underground mine includes a pair of vertically extending laterally spaced and substantially parallel elongate members, a pair of horizontally extending members, each depending from and extending outwardly from proximate a lower end of a respective elongate member a distance approximately equal to a thickness of a power supply, an upper shield member attached to and extending outwardly from proximate an upper end of the pair of elongate members in the same direction as the pair of horizontally extending members, extending a distance approximately equal to a depth of power supply and having a width approximately equal to a width of the power supply, and a flexible sheet of material disposed over the pair of elongate members from below the upper shield to above the pair of horizontally extending members that is held in place by the communication node.08-02-2012
20110138614PRESSED IN CABLE TRANSITION METHOD - A transition for connecting a coaxial cable to a conductive metal part such as an antenna has a base and a sleeve. According to the method of the present invention the base is pressed into the groundplane of the antenna to provide a permanent conductive and mechanical connection. A low profile transition has a base and a channel portion parallel to the face of the base.06-16-2011
20080307640METHOD FOR REINFORCING THE CONNECTION OF FLAT CABLE MEMBER AND METHOD FOR MANUFACTURING IMAGE DISPLAY UNIT - The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of supplying fluid and the step of hardening the fluid to form the reinforcing material. The step of supplying the fluid includes the step of bringing the substrate connecting to the flat cable member close to a jig and then supplying the fluid to a region in which the reinforcing material is to be formed while preventing the outflow of the fluid with the jig.12-18-2008
20120266459SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBSTRATE - A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.10-25-2012
20120102729METHOD FOR TREATING ELECTRICAL CABLE AT SUSTAINED ELEVATED PRESSURE - A method for enhancing the dielectric properties of an electrical cable segment having a central stranded conductor encased in a polymeric insulation jacket and an interstitial void volume in the region of the conductor, including filling the interstitial void volume with a dielectric property-enhancing fluid at a pressure below the elastic limit of the polymeric insulation jacket, and confining the fluid within the interstitial void volume at a residual pressure greater than about 50 psig, with the pressure being imposed along the entire length of the segment but below the elastic limit of the polymeric insulation jacket. Preferably, the residual pressure is sufficient to expand the interstitial void volume along the entire length of the cable segment by at least 5%.05-03-2012
20100186225Flat Cable - A flat cable having at least two conductor planes, in which a number of electrical conductors running in the longitudinal direction of the cable are arranged, in which the electrical conductors in the flat cable thickness direction and/or in the flat cable width direction are kept at a defined distance from each other by means of a central insulation layer of predetermined thickness acting as a spacer insulator and are electrically insulated and positioned relative to each other and to the flat cable exterior by means of an outer insulation layer.07-29-2010
20100192369Electrochemical Cell - A method of manufacture of an electrochemical cell is provided. In one exemplary embodiment, at least one non-metal working electrode is provided, at least one counter electrode or counter/reference electrode is provided such that it is not co-planer with respect to the working electrode, and a spacer is provided interposed between the working and counter or counter/referenced electrode. In one embodiment the counter or counter/reference electrode can be separated from the working electrode by a distance of from about 20 microns to about 200 microns. Alternatively, the cell can have an effective volume of less than 1.5 microliters. A method of manufacture of an electrochemical apparatus is also provided. The method can include providing both a hollow electrochemical cell for measuring a concentration of glucose in a blood sample and a mechanism configured to determine a concentration of a redox mediator from, at least in part, a measured current of the cell. Other methods of manufacture of electrochemical apparatuses and electrochemical cells are also provided.08-05-2010
20100192370METHOD AND DEVICE FOR PRODUCING A WIRE FROM COPPER OR FROM A COPPER ALLOY - The invention describes the production of a wire from copper or from a copper alloy in a continuous method, starting from an alloy block which is extruded in an extrusion press into a raw wire and is drawn, without interruption, to the finished dimension in a drawing apparatus.08-05-2010
20100212148Methods For Manufacturing and Reclaiming Electrode For Plasma Processing Apparatus - A plurality of reference holes are formed in the surface of a first substrate made of a first material, and a plurality of columnar members are each fitted in the reference holes in such a manner that at least a part of each of the columnar members projects from the surface of the first substrate. Subsequently, an electrode surface layer made of a second material is formed on the surface of the first substrate in such a manner that an end portion of each of the columnar members are exposed at the surface and then the columnar members are removed. Thus obtained is a substrate-like electrode including at least an electrode surface layer provided with through holes having a cross section matching a sectional shape of the projecting portion of the columnar members.08-26-2010
20100257730Foldable RFID Device Interposer and Method - An RFID device interposer has folded ends that bring conductive lead end portions of conductive leads of the interposer to an underside of the interposer. The central conductive lead portions of the conductive leads remain on an upper surface of a dielectric substrate of the interposer. The folded ends of the interposer may be held together with an adhesive, or with thermal compression bonding. The interposer may also have an additional conductive material layer on an underside of the dielectric substrate. The conductive material layer may be capacitively coupled to the conductive leads of the interposer. The interposer may be tuned by varying the pressure used to secure the folded ends. This may be used to provide a better impedance match between a chip of the interposer, and the conductive leads and an antenna to which the interposer is coupled.10-14-2010
20100242269COMPACT LENS TURRET ASSEMBLY - An electronic camera module incorporates a sensor unit (09-30-2010
20090249617METHOD FOR MAKING IMPLANTABLE MEDICAL DEVICES HAVING CARBON NANOTUBE-BASED ANTI-ELECTROSTATIC COATINGS - A method of fabricating an implantable medical device having a receptacle adapted to receive a connector assembly attached to a proximal end of an implantable lead. A distal end portion of the implantable lead carries at least one electrode electrically connected with a terminal contact on the connector assembly. The receptacle contains at least one internal insulative sealing surface. An anti-static coating comprising carbon nanotubes is applied to the at least one internal insulative sealing surface.10-08-2009
20090038149Methods of Manufacturing Electrical Cables - A method of forming at least a portion of a cable comprises providing at least one conductor, extruding at least an inner layer of polymeric insulation over the at least one conductor to form a cable conductor core, embedding a plurality of conductors into the inner layer of the cable conductor core, and extruding an outer layer of polymeric insulation over the cable conductor core and the plurality of conductors and bonding the inner layer to the outer layer to form the cable and provide a contiguous bond between the inner layer, the conductors, and the outer layer, wherein embedding comprises heating a one of the inner layer and the conductors prior to embedding the conductors into the inner layer.02-12-2009
20100293783METHOD FOR INCREASING THE CURRENT CARRIED BETWEEN TWO HIGH VOLTAGE CONDUCTOR SUPPORT TOWERS - A method for increasing the current carried between two high voltage conductor support towers is provided. The method includes removing a first high voltage carrying cable mounted between the towers and replacing it with a composite core cable. This replacement of cable may be accomplished with existing cable hanging equipment and without the need for additional tooling.11-25-2010
20100293782METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - An object of one embodiment of the present invention is to provide a more convenient highly reliable light-emitting device which can be used for a variety of applications. Another object of one embodiment of the present invention is to manufacture, without complicating the process, a highly reliable light-emitting device having a shape suitable for its intended purpose. In a manufacturing process of a light-emitting device, a light-emitting panel is manufactured which is at least partly curved by processing the shape to be molded after the manufacture of an electrode layer and/or an element layer, and a protective film covering a surface of the light-emitting panel which is at least partly curved is formed, so that a light-emitting device using the light-emitting panel has a more useful function and higher reliability.11-25-2010
20110126406Lithographic Apparatus and Method of Manufacturing an Electrostatic Clamp for a Lithographic Apparatus - The invention relates to a method of manufacturing an electrostatic clamp configured to electrostatically clamp an article to an article support in a lithographic apparatus. The method includes providing a first layer of material, etching a recess in the first layer of material, and disposing an electrode in the recess of the first layer of material.06-02-2011
20110126405Off-Center Ground Return for RF-Powered Showerhead - An electrical ground (06-02-2011
20110030206MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME - Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.02-10-2011
20110126407AMPLIFIER CIRCUIT AND METHOD THEREFOR - In one embodiment, an amplifier circuit is formed to minimize pop and click noise on the outputs of the amplifier circuit. The amplifier circuit is configured to place an output stage of the amplifier circuit in a high impedance state to minimize the pop and click noise. In another embodiment, the amplifier circuit is configured to couple the inputs of two amplifiers together to minimize the pop and click noise.06-02-2011
20110083322OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.04-14-2011
20110239453Method and a device for aligning the overlapping ends of metal strips - The invention relates to a device for aligning overlapping ends of metal strips, particularly contact bands for photovoltaic solar cells, wherein the end of one of the metal strips is bent back. The device has an advance, displaceable first alignment element for aligning the upper end of one metal strip and a trailing, displaceable second alignment element for aligning the bent end of the other metal strip, and a contact element for the first alignment element and a contact element for the second alignment element. In this manner, a rapid and simple mechanical automated alignment of the overlapping ends of metal is made possible.10-06-2011
20110239454Substrate With Raised Edge Pads - A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.10-06-2011
20100058583METHOD OF MANUFACTURING IMPLANTABLE WIRELESS SENSOR FOR IN VIVO PRESSURE MEASUREMENT - A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.03-11-2010
20100071205Method and apparatus for attaching chip to a textile - Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.03-25-2010
20110072653Light Emitting Device and Manufacture Method Thereof - A manufacture method of a light emitting device is provided. Firstly, at least one circuit board is provided. A plurality of light emitting packages, a first undetermined power input end and a second undetermined power input end are disposed at the circuit board. The light emitting packages are electrically connected to the first undetermined power input end and the second undetermined power input end. Each of the first undetermined power input end and the second undetermined power input end has at least two first pads. The first pads of each of the first undetermined power input end and the second undetermined power input end are electrically isolated from each other. Next, the first undetermined power input end is selected to be a power input region for inputting an external power signal. Then, the first pads of the second undetermined power input end are electrically connected to each other.03-31-2011
20110061230Methods for Fabricating Current-Carrying Structures Using Voltage Switchable Dielectric Materials - A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.03-17-2011
20110047793METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY - The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.03-03-2011
20110247205SURGE SNAP-ON MODULE ASSEMBLY - A surge snap-on module assembly includes a plug connector adapted to be received by an electrical device. A second housing is connected to a first housing. A surge protection device is disposed between the first and second housings. At least one first opening is formed in the second housing. A plurality of wires pass through the at least one first opening and are connected to the surge protection device. Accordingly, the surge protection device protects electrical apparatus connected to the electrical device from electrical surges.10-13-2011
20100257729IMPLANTABLE BIFURCATED NEUROSTIMULATOR ADAPTERS - An adapter for coupling a pair of implantable neurostimulator lead extension plugs to a connector port of a neurostimulator device includes a connector coupled to a first end of an elongate body and a flexible bifurcation member coupled to a second end of the elongate body, wherein the bifurcation member includes a first branch, to which a first housing, having first and second ports, is coupled, and a second branch, to which a second housing, having first and second ports, is coupled. Openings of the first and second ports of each housing provide for side-by-side insertion of first and second connector terminals of one of the lead extension plugs. Contacts within each port provide for electrical coupling with corresponding contacts of the connector terminals of the plug, and are coupled to corresponding contacts of the adapter connector via conductors extending within the elongate body between the corresponding housing and connector.10-14-2010
20110173805Hard-disk Drive Insertion - A hard-disk drive insertion mechanism includes carrier mechanism that moves longitudinally with the hard-disk drive as it is being inserted toward said electrical connector. The carrier mechanism includes engagement features for engaging the hard-disk drive as it is being inserted. The insertion mechanism also includes a clamping mechanism that gradually clamps the hard-disk drive with elastomeric material before it engages an electrical connector.07-21-2011
20110154655Modular multichannel microelectrode array and methods of making same - Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.06-30-2011
20090205200TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL - A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.08-20-2009
20110173804Method for Producing a Housing Part for a Power Semiconductor Module and Method for Producing a Power Semiconductor Module - A method for producing a housing part for a power semiconductor module includes providing a connecting lug having a lower end with a foot region, providing a housing having a side wall with a lead-in bevel, and inserting the connecting lug into the lead-in bevel so that the foot region projects inward into an interior of the housing. The method further includes encapsulating at least a portion of the foot region of the connecting lug inserted into the lead-in bevel with a first plastic to produce a positively locking first connection between the connecting lug and the side wall.07-21-2011
20120198691Self-Adhesive Radiant Heating Underlayment - Provided herein is a self-adhesive radiant heat underlayment that may be utilized in flooring and/or outdoor applications. The heating underlayment has an adhesive backing that allows for conveniently adhering a flexible heating element place prior to applying a material over the top surface thereof. In one arrangement, a mesh grounding layer is provided to ground the flexible heating element to reduce unintended electrical tripping of the installed underlayment.08-09-2012
20120030937CABLE TAMPER PREVENTION - Apparatuses, devices, systems, and methods are provided for prevention of tampering with cables and associated systems. In one aspect, an anti-tamper adapter is provided that can inhibit or prohibit cable tampering for existing cables. In a further aspect, dummy plugs or blocking plugs can employ disclosed anti-tamper adapters to facilitate blocking ports or outlets that are intended to remain undisturbed for a period of time. The provided embodiments can economically and flexibly facilitate cable tamper prevention in a wide array of cable technologies.02-09-2012
20120030936METHOD FOR PRODUCTION OF A CONDUCTOR BAR FOR THE STATOR OF AN ELECTRICAL MACHINE, IN PARTICULAR OF A GENERATOR, AND AN APPARATUS FOR PRODUCTION OF A CONDUCTOR BAR - A method is disclosed for production of a conductor bar for the stator of a generator, which conductor bar has a plurality of internal partial conductors which are surrounded externally by insulation which includes an insulating ribbon which is wound around the partial conductors, with the insulating ribbon which is wound around the partial conductors being impregnated with an impregnation fluid. The conductor bar is compressed after the impregnation of the insulating ribbon and at least at times during a curing phase. An apparatus is likewise provided, and can be designed to compress at least an axial section of the conductor bar at least at times during a curing phase of the impregnated insulating ribbon.02-09-2012
20120030935Electrically active textiles, articles made therefrom, and associated methods - A method of making articles from electrically active textiles. First and second fabric pieces include conductors therein. A seam is established between the first and second fabric pieces. A determination is made, at the seam, based on one or more predetermined factors, which conductors of the first fabric piece intersect or overlap with which conductors of the second fabric piece. At the seam, an electrical and mechanical connection is formed between select conductors of the first fabric piece and select conductors of the second fabric piece.02-09-2012
20110162201Waterproof push-in wire connectors - A push-in wire connector having a sealant therein to enable formation of a waterproof electrical connection by axial insertion of a wire into a chamber contained an electrical conductor protected by the sealant with the electrical conductor displaceable into a waterproof electrical contact with the wire while both the conductor and the wire remain in the presence of the sealant.07-07-2011
20110252635Cable with offset filler - The present invention relates to cables made of twisted conductor pairs. More specifically, the present invention relates to twisted pair communication cables for high-speed data communications applications. A twisted pair including at least two conductors extends along a generally longitudinal axis, with an insulation surrounding each of the conductors. The conductors are twisted generally longitudinally along the axis. A cable includes at least two twisted pairs and a filler. At least two of the cables are positioned along generally parallel axes for at least a predefined distance. The cables are configured to efficiently and accurately propagate high-speed data signals by, among other functions, limiting at least a subset of the following: impedance deviations, signal attenuation, and alien crosstalk along the predefined distance.10-20-2011
20110005069SYSTEMS AND LEADS WITH A RADIALLY SEGMENTED ELECTRODE ARRAY AND METHODS OF MANUFACTURE - A method of making a lead for a stimulation device includes forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions; disposing the at least one pre-electrode near a distal end of a lead body; joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form segmented electrodes from the thick-walled portions of the at least one pre-electrode.01-13-2011
20110162200ELASTOMER ACTUATOR AND A METHOD OF MAKING AN ACTUATOR - A tubular elastomer actuator with a shape in a cross-sectional view which shape exposes at most one single axis of symmetry of a specific length, e.g., an oval shape. The actuator could be made from a sheet made from a plurality of plate shaped elements which are laminated together and rolled. Each plate shaped element may have a corrugation that gives the element an anisotropic structure, and contains an electrode on only one surface. The actuator displacement is the result of shrinkage displacement of the plate shaped elements upon the application of electrical field across their thickness.07-07-2011
20110047792WIRE STRUCTURE, METHOD FOR FABRICATING WIRE, THIN FILM TRANSISTOR SUBSTRATE, AND METHOD FOR FABRICATING THIN FILM TRANSISTOR SUBSTRATE - Provided are a wire structure, a method for fabricating a wire, a thin film transistor (TFT) substrate, and a method for fabricating a TFT substrate. The wire structure includes a barrier layer formed on a substrate and including copper nitride and a copper conductive layer formed on the barrier layer and including copper or a copper alloy03-03-2011
20110107593TOUCH PANEL, DISPLAY DEVICE WITH THE SAME, AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE - A display device is provided with a touch panel includes: a base substrate; a first transparent electrode layer located on the base substrate; an ultrasonic wave guiding layer located on the first transparent electrode layer; a second transparent electrode layer located on the ultrasonic wave guiding layer; an ultrasonic wave transmitting unit and an ultrasonic wave receiving unit located on the second transparent electrode layer; and a protecting layer located on the second transparent electrode layer.05-12-2011
20110131801CONNECTOR REMOVAL TOOL - A tool for engaging a telecommunications connector within a slot so that a releasable latch of the connector is released by the tool. The tool may be used to remove a telecommunications connector from a mating opening of a receptacle or may be used to insert a connector within a receptacle.06-09-2011
20110131800FRONT OPENING WAFER CONTANER WITH PATH TO GROUND EFFECTUATED BY DOOR - A front opening wafer carrier formed principally of plastic and comprising an enclosure portion and door has a path to ground with respect to the wafers, the path to ground effectuated by the door. The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door.06-09-2011
20110113624SHEET BONDING DEVICE AND SHEET BONDING METHOD - A sheet bonding device includes a detection unit that detects first position data of first marks in a first sheet provided with a first electrode, and second position data of second marks in a second sheet provided with a second electrode, a generation unit that generates third shape data from the first shape data based on a result of comparison of the first position data and the third position data, and generates fourth shape data from the second shape data based on a result of comparison of the second position data and the fourth position data, and a decision unit that changes relative positions of the third shape data and the fourth shape data, and determines a first relative position of the first electrode against the second electrode at which an area of overlapping in plan view of the third shape data and the fourth shape data is maximized.05-19-2011
20090293268PATTERNS OF CONDUCTIVE OBJECTS ON A SUBSTRATE AND METHOD OF PRODUCING THEREOF - According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes applying a coating layer of electrically conductive transparent compounds onto a substrate; depositing in a vacuum deposition chamber an electrically conductive material onto the coating layer to form an electrically conductive layer; applying an etch-resist material on selective areas of the electrically conductive layer, wherein the selective areas are substantially areas pre-designed to carry the conductive objects; and chemically etching the electrically conductive material from exposed areas of the electrically conductive layer that are not covered by the etch-resist material.12-03-2009
20100018045METHOD FOR MANUFACTURING ANTI-ELECTROMAGNETIC INTERFERENCE SHIELDS - A method for manufacturing anti-EMI shields on computer chassis, the method includes the following steps. The anti-EMI plate is glued to the computer chassis. The anti-EMI plate is pressed onto the plate by a pressing machine, and then the plate is quick dried with the anti-EMI plate by a drying machine. The plate is cut into desired dimension with the anti-EMI plate by a cutting machine, and the plate is stamped into desired shape with the anti-EMI plate by a stamping machine.01-28-2010
20100180437SYSTEMS AND METHODS FOR ELECTROMAGNETIC NOISE SUPPRESSION USING HYBRID ELECTROMAGNETIC BANDGAP STRUCTURES - A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.07-22-2010
20110302774METHOD FOR MANUFACTURING OSCILLATOR DEVICE AND OSCILLATOR DEVICE - An oscillator device manufacturing method includes: placing an oscillator provided with electrodes on a convex pedestal provided on an assembly table; arranging, on the assembly table, a frame member including an opening surrounded by a frame thereof and provided with electrode pads on the frame such that the opening is positioned at the pedestal; connecting the electrode pads to the electrodes of the oscillator placed on the pedestal via wires, while the frame member is arranged on the assembly table; removing the frame member from the assembly table together with the oscillator after the connecting, and bonding the frame member connected to the oscillator to a substrate. By using the method, the oscillator device including the oscillator suspended in air above the substrate can be efficiently manufactured. In stead of using the frame member, a frame body in which frame members are arrayed can be employed.12-15-2011
20120011712METHOD OF FORMING PWM CONTROLLER - In one embodiment, a PWM controller is configured to inhibit a drive signal responsively to a bulk input voltage remaining at a low value for a time interval.01-19-2012
20120011711STIMULATION LEAD, STIMULATION SYSTEM, AND METHOD FOR LIMITING MRI INDUCED CURRENT IN A STIMULATION LEAD - In one embodiment, a percutaneous stimulation lead for applying electrically stimulation pulses to tissue of the patient comprises: a plurality of electrode assemblies electrically coupled to a plurality of terminals through a plurality of conductors of the stimulation lead, wherein each electrode assembly is disposed in an annular manner around the lead body and each electrode assembly comprises (i) an electrode adapted to deliver electrical stimulation to tissue of a patient, (ii) an interior conductive layer, and (iii) a dielectric layer disposed between the electrode and the interior conductive layer; the electrode and interior conductive layer being capacitively coupled, the dielectric layer further comprising an inductor, the inductor being electrically connected to one of the plurality of conductors through the interior conductive layer, and the inductor being electrically coupled to the electrode.01-19-2012
20090094823METHOD OF MAKING A MICROWAVE FIELD DIRECTOR STRUCTURE HAVING V-SHAPED VANE DOUBLETS - A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of: 04-16-2009
20120204418CENTRALIZED ELECTRICAL DISTRIBUTION SYSTEM - Implementations of the present invention comprise systems, methods, and apparatus for distributing electric power to a plurality of access points within a plurality of spaces. In particular, implementations of the present invention allow for the distribution of electric power from a centralized panel manager, to one or more access points without the use of zone boxes. For example, a panel manager for distributing electric power in accordance with an implementation of the present invention can include a housing configured to allow at least one main input therein. The panel manager can also include a plurality of planar connection interfaces secured within the housing. The planar connection interface can be configured to mate with planar electrical connectors for the distribution of electric power to the plurality of access points.08-16-2012
20120060364STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY - Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack.03-15-2012
20120151759Hermetically-Sealed Feed-Through Device and Method of Assembly - A method of making a hermetically-sealed feed-through device includes inserting an elongate conductor or conductors within a hollow portion or portions of a plastic insulator body and inserting the plastic insulator body within a hollow outer jacket to form an assembly. At least one of the conductor or conductors, insulator body, or jacket of the assembly has a plurality of circumferential grooves. Thereafter, the assembly is crimped and/or is swage-crimped at ambient temperature to cause the materials of the conductor or conductors, insulator body, and outer jacket to be displaced or extrude into the grooves thereby creating mechanical interlocks between the conductor or conductors, insulator body, and outer jacket. Additional methods and feed-through devices made by the methods are also disclosed.06-21-2012
20120159777SOCKET SWITCH - An electric power socket (06-28-2012
20100205803ELECTROACTIVE POLYMER TRANSDUCERS FOR SENSORY FEEDBACK APPLICATIONS - Electroactive polymer transducers for sensory feedback applications are disclosed.08-19-2010
20100205802Two Piece Tube for Suction Coagulator - A method of manufacturing an electrosurgical tool includes the initial step of coupling a proximal end of a substantially malleable elongate tube-like shaft to a distal end of a housing. A tub-like dielectric sheath is disposed on the tube-like shaft. The method also includes the steps of coupling a tube-like electrode having a first thermal conductivity K08-19-2010
20120246920SPLIT COMPRESSION MID-SPAN GROUND CLAMP - A grounding clamp positioned on a coaxial cable at a location other than an end of the coaxial cable, wherein the grounding clamp includes an outer shell formed by the unity of a first split shell portion and a second split shell portion, the outer shell having a radial relationship with an elastomeric sleeve, the elastomeric sleeve being radially disposed over a conductive bonding contact, the conductive bonding contact being radially disposed over an outer conductive portion of the coaxial cable, wherein axial compression of a first split driver and a second split driver against the ends of the grounding clamp facilitates electrical contact between the outer shell and the conductive bonding contact and between the conductive bonding contact and the outer conductive portion of the coaxial cable. Furthermore, an associated method for maintaining ground continuity is also provided.10-04-2012
20120246922METHOD OF MANUFACTURING A HIGH CURRENT ELECTRODE FOR A PLASMA ARC TORCH - A method of manufacturing an electrode for use in a plasma arc torch is provided that includes forming a conductive body to define a proximal end portion, a distal end portion, a distal end face disposed at the distal end portion, a central cavity, and a central protrusion disposed within the central cavity near the distal end portion. A plurality of emissive inserts are inserted through the distal end face and into the central protrusion. The plurality of emissive inserts are pressed into the central protrusion and both a proximal end portion of the central protrusion and the plurality of emissive inserts are deformed such that the plurality of emissive inserts extend radially and outwardly from the distal end portion at an angle relative to the distal end portion.10-04-2012
20100287768MEHTOD OF MANUFACTURING ELECTROSTATIC CHUCK MECHANISM - There is provided a method of manufacturing an electrostatic chuck which is free from fluctuations in performance or incomplete detachment from the beginning of use, without being influenced by the impurities that remain on the surface of, or in the inside of, a dielectric layer at the time of manufacturing thereof, in case the dielectric layer which comes into contact with an article to be held by the electrostatic chuck is made of silicone rubber or resin. Before assembling the dielectric layer into the surface of a base having disposed thereon an electrode, or after the dielectric layer has been assembled into the surface of the base, a step is performed in which a heating plate that has been heated to a predetermined temperature is pressed against the contact surface of the dielectric layer.11-18-2010
20110179640ENHANCED MAGNETIC SELF-ASSEMBLY USING INTEGRATED MICROMAGNETS - Embodiments of the invention relate to a method and system for magnetic self-assembly (MSA) of one or more parts to another part. Assembly occurs when the parts having magnet patterns bond to one another. Such bonding can result in energy minima The magnetic forces and torques—controlled by the size, shape, material, and magnetization direction of the magnetic patterns cause the components to rotate and align. Specific embodiments of MSA can offer self-assembly features such as angular orientation, where assembly is restricted to one physical orientation; inter-part bonding allowing assembly of free-floating components to one another; assembly of free-floating components to a substrate; and bonding specificity, where assembly is restricted to one type of component when multiple components may be present.07-28-2011
20120311855APPARATUS FOR RESTRICTING MOISTURE INGRESS - Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.12-13-2012
20120167383EXPANDING CAM LOCK FOR SEALING SLAB GELS IN AN ELECTROPHORESIS APPARATUS - An expanding cam lock for use with an electrophoresis system is disclosed herein. In one example embodiment, the expanding cam lock includes a base plate with a first surface adapted to engage the first buffer core assembly and a follower plate having second surface adapted to engage the second buffer core assembly, buffer dam or buffer displacement dam. The base plate and the follower plate are slidably coupled together and are designed for insertion between the first buffer core assembly and the second buffer core assembly, buffer dam or buffer displacement dam in the electrophoresis container. A cam is positioned between and moveably coupled with the base plate and the follower plate. The cam is movable from a first position to a second position to urge the first and second surfaces to secure the gel cassette to the first and second buffer core assemblies.07-05-2012
20120210574PROBE INSERTION AUXILIARY AND METHOD OF PROBE INSERTION - A probe insertion auxiliary and a method of probe insertion are provided. A light source illuminates holes on a lower die to make the position of the holes clear for an operator. The probe insertion auxiliary includes a bottom and a clamp pair disposed on the bottom. The clamp pair has two clamp parts. The two clamp parts define a slit for disposing a probe chassis. Furthermore, the two clamp parts and the bottom form a space. A light source is disposed inside the space for illuminating the holes.08-23-2012
20120073130PROCESS FOR MANUFACTURING ELECTROSURGICAL FORCEPS WITH COMPOSITE MATERIAL TIPS - An electrosurgical forceps has at least the tip of one blade member formed of a composite material having aligned elongated particles of nickel interspersed in a matrix of silver particles.03-29-2012
20120073129MULTILAYER CERAMIC ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING THE SAME - In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.03-29-2012
20120222296MANUFACTURING METHOD OF FOREIGN OBJECT DETECTION APPARATUS - In a manufacturing method of a foreign object detection apparatus, an elastic insulator including an attaching section and an inner peripheral portion, on which a plurality of electrodes is disposed in such a manner that each of the electrodes is away from the others, is formed, a predetermined portion of the attaching section is removed, a feeding member is coupled with the electrodes, and a coupling portion of the electrodes and the feeding member and a portion of the elastic insulator are covered with a covering part.09-06-2012
20090019690Fabrication method of a nanotube-based electric connection having air gaps - A target layer with holes is formed on a bottom conducting layer. Nanotubes are formed in the holes from the bottom conducting layer. A flat insulating layer is then deposited on the target layer, the nanotubes passing through the insulating layer. Air gaps are then formed by selective decomposition of the target layer. The decomposition agent and/or decomposition by-products use the walls and the central holes of the nanotubes to pass between the target layer and the outside. After decomposition, the top conducting layer is formed on the insulating layer. The nanotubes then electrically connect the conducting layers.01-22-2009
20120227257COUPLER DEVICE - A coupler assembly is disclosed comprising: a mounting sleeve including at least one L-shaped slot; a mounting support including an insertion stud, the insertion stud configured to fit into the mounting sleeve; the insertion stud further including a radial through-hole: a compression spring disposed over the insertion stud, the compression spring functioning to exert a separation force between the mounting sleeve and the mounting support; and a retaining pin disposed in the radial through-hole wherein the insertion stud is inserted into the mounting sleeve by sliding an end of the retaining pin inside the at least one L-shaped slot.09-13-2012
20100236062Method and Apparatus for Visual Neural Stimulation - Existing epiretinal implants for the blind are designed to electrically stimulate large groups of surviving retinal neurons using a small number of electrodes with diameters of several hundred μm. To increase the spatial resolution of artificial sight, electrodes much smaller than those currently in use are desirable. In this study we stimulated and recorded ganglion cells in isolated pieces of rat, guinea pig, and monkey retina. We utilized micro-fabricated hexagonal arrays of 61 platinum disk electrodes with diameters between 6 and 25 μm, spaced 60 μm apart. Charge-balanced current pulses evoked one or two spikes at latencies as short as 0.2 ms, and typically only one or a few recorded ganglion cells were stimulated. Application of several synaptic blockers did not abolish the evoked responses, implying direct activation of ganglion cells. Threshold charge densities were typically below 0.1 mC/cm2 for a pulse duration of 100 μs, corresponding to charge thresholds of less than 100 pC. Stimulation remained effective after several hours and at high frequencies. To demonstrate that closely spaced electrodes can elicit independent ganglion cell responses, we utilized the multi-electrode array to stimulate several nearby ganglion cells simultaneously. From these data we conclude that electrical stimulation of mammalian retina with small-diameter electrode arrays is achievable and can provide high temporal and spatial precision at low charge densities. We review previous epiretinal stimulation studies and discuss our results in the context of 32 other publications, comparing threshold parameters and safety limits.09-23-2010
20100325880LONGITUDINAL SHIELD TAPE WRAP APPLICATOR WITH EDGE FOLDER TO ENCLOSE DRAIN WIRE - A shielded electrical wire and device and method for making the same is disclosed. The device includes a first folding die configured to fold a first edge of a shield tape a first direction from a central portion of the shield tape and to fold a second edge of the shield tape a second direction opposite to the first direction from the central portion of the shield tape, a second folding die configured to wrap the shield tape around at least two insulated conductors to apply a fold to the first edge of the shield tape so as to fold the first edge back over onto the central portion of the shield tape to form a receiving area, a third folding die configured to tighten the shield tape around the plurality of conductors while positioning the receiving area to receive a drain wire, a wire guide configured to install a drain wire in the receiving area, and a closing die configured to close the shield tape around the plurality of conductors and the drain wire to form an enclosure around the plurality of conductors with the second edge overlapping the receiving area at an outside surface of the enclosure.12-30-2010
20110119908ELECTRICAL CONTACT METHOD - An electrical contact method. An axle having an axis of rotation is provided. Cantilever arms are provided. Each cantilever arm has a first end and a second opposing end. The first end is connected to the axle. Each cantilever arm extends radially outward from the axle about perpendicular to the axis of rotation. At least two electrically conductive contacts is provided. At least one electrically conductive contact of the at least two electrically conductive contacts is disposed on the second end of each cantilever arm. A sample is supported on a support member. The electrically conductive contacts are pressed against a first surface of the sample. After the electrically conductive contacts are pressed, the electrically conductive contacts are revolved about the axis of rotation, wherein the at least one electrically conductive contact remains in electrical contact with the first surface.05-26-2011
20120233855NERVE CUFF, METHOD AND APPARATUS FOR MANUFACTURING SAME - A nerve cuff comprising a wall band member having an inner surface defining a lumen when the wall band member is in a closed configuration for receiving a nerve therethrough. At least one longitudinal and contiguous conductor extends within the lumen. The conductor is insulated and has at least one exposed portion thereby providing an electrode. When mounting the nerve cuff to a nerve, each electrode is in electrical communication with the nerve. A multi-channel nerve cuff further comprises a plurality of longitudinal ridges formed on the inner surface with each adjacent pair of ridges defining a longitudinal chamber. Each chamber comprises a respective conductor extending therein. When mounting the multi-channel nerve cuff to the nerve, the ridges abut the nerve providing for each chamber to isolate respective longitudinal portions of the nerve. A method and an apparatus for manufacturing such nerve cuffs are also disclosed.09-20-2012
20110225813METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS - A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials.09-22-2011
20110225812POWER ADAPTERS FOR POWERING AND/OR CHARGING PERIPHERAL DEVICES - A power adapter for a peripheral device such as portable electronics device is disclosed. The power adapter includes a housing that contains electrical components associated with the power adapter. The power adapter also includes a data port provided at a surface of the housing. The data port is configured to provide external power to the peripheral device.09-22-2011
20130008021METHOD FOR MANUFACTURING OUTER CONDUCTOR - Provided is a method for manufacturing an outer conductor of a higher-order-mode coupler in a low-cost, material-saving manner. A method for manufacturing an outer conductor (01-10-2013
20110265319System and Method for Rechargeable Power System for a Cargo Container Monitoring and Security System - A system and method for an integrated rechargeable power system for a container monitoring and security system is provided. The power system is affixed to a container and comprises an integrated photovoltaic area conforming to the container construction, a battery pack module, power conditioning circuitry or recharge unit, and a power controller unit. The photovoltaic unit may be conventional photovoltaic crystalline cell array, or a photovoltaic coating with is applied to the walls, door, or roof of a container.11-03-2011
20100229381ELECTRICAL CONNECTOR DEVICES AND METHODS FOR EMPLOYING SAME - An apparatus and method are disclosed that may include a contact pin; and a plurality of loops of conductive wire, coated with insulation material, disposed in proximity to the contact pin, wherein along at least one portion of the conductive wire, at least one edge of the contact pin extends through the insulation material and thereby forms conductive electrical contact with the conductive wire.09-16-2010
20120279058COMPOSITE STRUCTURE POWER DISTRIBUTION - A particular method includes exposing a plurality of fibers of a composite skin of an aircraft component by providing an opening in a layer of a first resin overlaying the plurality of fibers at an interior surface of the composite skin. The method also includes bonding a conductive patch in electrical contact with the plurality of fibers of the composite skin at the opening using a second resin. The method further includes preparing the aircraft component to receive a connector in electrical contact with the conductive patch.11-08-2012
20110277318CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR - A circuit device is made smaller in higher. The circuit device includes a wiring substrate, a first circuit element, and a second circuit element. The circuit substrate includes an insulating resin layer, a wiring layer provided on a main surface of the insulating resin layer, and a wiring layer provided on the other main surface of the insulating resin layer. The wiring layer includes first interconnectors to which the first circuit element connects, and wiring portions. The film thickness of the first interconnector is made thinner than that of the wiring portion. The wiring layer includes second interconnectors and wiring portions. The first interconnectors and the second interconnectors are connected through the medium of conductors.11-17-2011
20120137513METHOD OF CONSTRUCTING MRI COMPATIBLE ELECTRODE CIRCUIT - An MRI compatible electrode circuit construct is provided. The construct includes at least two filter components constructed from an electrode wire. One filter component may be a resonant LC filter at or near an electrode/wire interface that resolves the issue of insufficient attenuation by effectively blocking the RF induced current on the wire from exiting the wire through the electrode. The second filter component may include one or more non-resonant filter(s) positioned along the length of the electrode wire that resolve(s) the issue of excessive heating of the resonant LC filter by significantly attenuating the current induced on the wire before it reaches the resonant LC filter. The non-resonant filter(s) may also attenuate the RF current reflected from the resonant LC filter thereby resolving the issue of the strong reflected power from the resonant filter and the associated dielectric heating.06-07-2012
20120137512Method for Stacking Microelectronic Devices - Method for stacking microelectronic devices using two or more carriers, each holding microelectronic devices in an array so they may be registered. Each device is releasably held by its edges in a carrier to allow access to top and bottom surfaces of the device for joining. Arrays of devices held in two or more carriers are juxtaposed and joined to form an array of stacked devices. A resulting stacked device is released from the juxtaposed carriers holding each device by releasing forces of the corresponding carrier urging upon edges of the device, thereby permitting removal of the stacked device.06-07-2012
20130014384Single Phase Multilevel Inverter - Systems and methods are described that provide multilevel inverters having a plurality of levels using a simplified topology. For single phase systems, embodiments provide a full-bridge topology using bidirectional switching interconnections.01-17-2013
20130014385GROUNDING METHOD ADAPTED FOR POWER SUPPLYAANM Xu; MingAACI NanjingAACO CNAAGP Xu; Ming Nanjing CNAANM Sun; ChaoAACI NanjingAACO CNAAGP Sun; Chao Nanjing CN - A grounding method adapted for a power supply (for example, an adapter power supply, a three-phase AC-to-DC power supply, a DC-to-DC power supply, . . . , etc., but not limited thereto) is provided, and which includes: (a) providing a circuit body corresponding to the power supply, where the circuit body has an input part and an output part; (b) disposing the circuit body in a shielding layer; and (c) making at least one of the input part and the output part to be coupled with the shielding layer through at least one capacitor. In this case, the present invention can effectively solve the problem of common-mode interferences in the power supply.01-17-2013
20110146066DISPLAY SUBSTRATE, LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF REPAIRING THE SAME - A display substrate includes a signal line formed on a substrate, a connection pad receiving a driving signal from the signal line, at least one repair line formed along an outer periphery of the substrate, a first auxiliary repair line overlapping the signal line at a first position with an insulating layer disposed therebetween, a second auxiliary repair line overlapping the signal line at a second position with the insulating layer disposed therebetween, and a connection line connecting the second auxiliary repair line to the at least one repair line.06-23-2011
20120240395ELECTRODE-CHANGING DEVICE HAVING IMPROVED SAFETY - A device for changing the electrode of an electrode-holder tool of a welding device, with a first part configured to house an electrode-holder tool and including means to prevent the electrode-holder tool from moving, and a second part installed around the first part and covering the part of the electrode protruding outside the first part, where the second part can be separated from the first part by sliding along the electrode, and is able to rotate relative to the fixed part when it surrounds it, and where the second part is configured to tighten or untighten the mandrel and to attach the electrode and the second part, enabling it to be removed from the mandrel when the first part and the second part are separated.09-27-2012
20110232083FORMING APPARATUS AND FORMING METHOD OF WIRE JOINT PORTION - A forming apparatus for forming a wire joint portion including a connection portion and an insulative tube covering the connection portion is provided. The forming apparatus includes: a production information acquiring unit which acquires production information; a connection portion forming unit which fixes a plurality of wires selected on the basis of the production information, and then electrically connects conductor portions of the wires together to form the connection portion; a first fusing unit which fuses one open end portion of the insulative tube to close the one open end portion; an inserting unit which moves the wires so as to insert the connection portion into the insulative tube through the other open end portion of the insulative tube; a second fusing unit which fuses the other open end portion of the insulative tube and insulative sheaths of the wires together so as to form the wire joint portion.09-29-2011
20120246923PROCESS FOR CHANGING A SPENT ANODE AND SUPPORT AND SYSTEM FOR THE TEMPORARY STORAGE OF SUCH A SPENT ANODE - The process involves pouring a smothering powder onto a spent anode placed on a support to cover it, with the aim of limiting fluorinated gas emission by the anode.10-04-2012
20120246921FEED-THROUGH CONNECTOR ASSEMBLY FOR IMPLANTABLE PULSE GENERATOR AND METHOD OF USE - A connector assembly, and its method of assembly, for use in a medical device for connecting an IPG to a connector assembly for connecting the IPG to a relatively large plurality of electrodes that can support 24 or more stimulation channels for stimulating one or more stimulation regions of a patient. Also the IPG and the stimulation system and the stimulation therapy utilizing the connector assembly.10-04-2012
20130091700GROUNDING SYSTEM FOR A HEATED HOSE - A method of forming a grounded electrical circuit in a heated hose is provided. In one embodiment, the method includes: positioning a ground wire, a first heating wire, and a second heating wire axially within an inner wall of the hose; removing the end portions of the heated hose, such that end portions of the first heating wire, the second heating wire, and the ground wire are exposed; and positioning a ring around the first end portion of the hose. Exposed end portions of the first and second heating wires are folded to be positioned axially along an outer surface of the hose body. The exposed end portion of the grounding wire is folded radially inward, such that the grounding wire is positioned axially along an inner surface of the inner wall and against the ring. A stem of a first fluid coupling is inserted into the first end portion of the heated hose, such that the stem contacts the exposed end portion of the grounding wire.04-18-2013
20130111742Conductive Sleeved Fastener Assembly - A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.05-09-2013
20130125390WIRE LOOPS, METHODS OF FORMING WIRE LOOPS, AND RELATED PROCESSES - A method of forming a wire loop is provided. The method includes the steps of: (05-23-2013
20130139381Spring with Multiple Conducting Coils - An electrically conductive spring having first and second coils defining first and second electrical pathways for completing an electric circuit between two components which may move relative to each other. In one embodiment, the spring is a double start helical spring with first and second coils extending between respective, electrically insulated ends with the coils extending in alternating, spaced relation to each other.06-06-2013
20110214284HIGHLY CONDUCTIVE COMPOSITES - Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler.09-08-2011
20130145617ASSEMBLY OF OPTICAL SENSOR TO CARRIAGE PRINTER - A method of assembling an optical sensor assembly for a carriage of a carriage printer, the method includes providing a flexible circuit subassembly including a photosensor and a light source; providing a mounting member including a first cavity and a second cavity having an orientation that is different than an orientation of the first cavity; mounting the flexible circuit subassembly on the mounting member such that the photosensor is disposed in the first cavity and the light source is disposed in the second cavity; and affixing the mounting member to an outer housing, wherein a connector end of the flexible circuit subassembly extends outwardly from the mounting member and the outer housing06-13-2013
20100058581HYBRID FIBER/COPPER CABLE PREPARATION TOOL - A preparation tool includes a base with first and second ends and first and second major sides. A first cable insertion opening extends from the first end toward the second end. A first slot in the first major side communicates with the first opening for receiving a jacket cutting tool. A second insertion opening extends from the first end toward the second end. A second slot in the first major side communicates with the second opening for receiving a marking tool. A third cable insertion opening extends from the first end toward the second end and forms a stop surface therein. A recess formed in the first major side and in the second end defines a platform. A cable channel extends from the third insertion opening across the platform to the second end. Two pins project from the platform on opposite sides of the channel. The base includes a stationary portion and a pivotal portion. The pins are located on the stationary portion. The movable portion defines the second end of the base. The stationary portion defines a supplemental end surface facing in same direction as second end. The tool further includes a cutout aligned with the cable channel and extending from the platform to the second major side and extending from the supplemental end surface into the stationary portion of the base.03-11-2010
20100306997METHOD OF MANUFACTURING AN IMPLANTABLE LEAD - An implantable lead body for a medical device with improved conductor lumens separates and insulates conductors while permitting access to the conductors through the implantable lead outer surface. The implantable lead comprises a lead body, a stylet lumen, at least one conductor lumen, and at least one axial slit in the lead body. The lead body has a proximal end, a distal end, an internal portion, and an external portion. The stylet lumen is formed in the internal portion. The conductor lumen is formed in the internal portion and positioned near an outer surface of the internal portion such that there is only a web between the conductor lumen and the outer surface of the internal portion. The axial slit is formed in the lead body distal end between the conductor lumen and the outer surface of the internal portion.12-09-2010
20120272519Arrangement and method for installing cables - At least one cable is fastened to a longitudinal structure. The longitudinal structure is prepared to absorb the tensile load of the cable. The longitudinal structure is prepared to be bent together with the cable around an obstacle of a construction while they are positioned in reference to the construction.11-01-2012
20120272518FLEXIBLE SENSORS AND RELATED SYSTEMS FOR DETERMINING FORCES APPLIED TO AN OBJECT, SUCH AS A SURGICAL INSTRUMENT, AND METHODS FOR MANUFACTURING SAME - Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.11-01-2012
20110271521SPEAKER SYSTEM UTILIZING INPUT FROM A TRANSDUCER IN PROXIMITY TO A SEPARATE SPEAKER - A speaker system utilizes input from a transducer that receives an acoustical signal produced by a speaker that is separate from the speaker system. The acoustical signal is amplified and drives a speaker of the speaker system. The speaker system is thereby provided with the necessary electrical audio signal without the speaker system being wired into any existing sound system wiring. In automobiles, the transducer is in proximity to a speaker wired into the automobile's audio system, and the transducer obtains the acoustical signal to produce the electrical audio signal used by the speaker of the speaker system so that no access to high or low level electrical audio signals of the audio system of the automobile is necessary. Additionally, the speaker system may employ a power socket plug that is electrically coupled to the power input of the amplifier and that may be plugged into a power socket such as those typical of most vehicles to provide electrical power to the amplifier of the speaker system.11-10-2011
20110308078TECHNIQUE FOR LIMITING TRANSMISSION OF FAULT CURRENT - Several embodiments of a novel technique for limiting transmission of fault current are disclosed. Current power distribution systems typically have an impedance, or reactor, on the output of the network equipment to limit current in the case of a fault condition. A low resistance switch, which changes its resistance in the presence of high current, is connected in parallel with this reactor. Thus, in normal operation, the current from the power generator bypasses the reactor, thereby minimizing power loss. However, in the presence of a fault, the resistance of the switch increases, forcing the current to pass through the reactor, thereby limiting the fault current.12-22-2011
20110308077FIBER-BASED ELECTRIC DEVICE - A method of manufacturing a fiber-based electric apparatus includes providing an elongate, flexible fiber core and layering an electric device on the fiber core.12-22-2011
20130192062METHOD AND A DEVICE FOR BONDING WIRES TO A SUBSTRATE, IN PARTICULAR BY LASER - Disclosed are devices for making a bond between a wire and a substrate at a point, and to methods of making the bond. The device includes in particular a pressure foot, a base for supporting the substrate, a delivery source for delivering the wire, the pressure foot being suitable for occupying at least two positions that are respectively closer to and further from the base, the wire delivered by the source being suitable for passing between the pressure foot and the base, a presser finger suitable for occupying two positions respectively closer to and further from the base, an element for mounting the pressure foot and the presser finger to co-operate with the base in such a manner that they define between them a bonding space containing the point, and spot-bonding element suitable for acting at the point.08-01-2013
20130192063ELECTROMAGNETIC ENERGY DELIVERY DEVICES INCLUDING AN ENERGY APPLICATOR ARRAY AND ELECTROSURGICAL SYSTEMS INCLUDING SAME - An electrosurgical system for directing energy to tissue includes a generator assembly operable to supply power having a selected phase, amplitude and frequency, and an applicator array assembly. The applicator array assembly includes a shell assembly, a plurality of energy applicators disposed within the shell assembly, and a power divider unit electrically coupled to the generator assembly. The power divider unit is operable to divide power into the applicator array assembly.08-01-2013
20130199032MODULAR SYSTEM FOR DATA CENTER - A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another.08-08-2013
20120084974SERIAL CONNECTION EXTERNAL INTERFACE RISER CARDS AVOIDANCE OF ABUTMENT OF PARALLEL CONNECTION EXTERNAL INTERFACE MEMORY MODULES - A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.04-12-2012
20120084973ARRAY SUBSTRATE OF DISPLAY PANEL AND METHOD OF REPAIRING THE SAME - A method of repairing array substrate of display panel includes the following steps. An array substrate including a substrate, gate lines, data lines, common lines and repairing segments is provided. The gate lines and the data lines are intersected to define a plurality of pixel areas. The data lines include a first data line. The common lines include a first common line. The first data line has a broken line defect. A cutting process is performed to form a first cutting part and a second cutting part on the first common line, and thus the first common line between the first cutting part and the second cutting part forms a floating common repairing segment. A connecting process is performed to electrically connect the repairing segments, the first data line and the common repairing segment, so that the common repairing segment serves as a substitution line of the first data line.04-12-2012
20120084972CONCRETE EMBEDDED ELECTRICAL JUNCTION BOX - Applicant has disclosed an improved method and apparatus for installing electrical junction boxes in embedded concrete construction applications. In the preferred embodiment, a first box (with at least one attached conduit) is embedded in the bottom of a concrete deck at pour, wherein the box has an open bottom covered during the pour. After pouring, the cover is removed to expose the open bottom, through a plane of the deck, without having to break through the concrete. A second box, with an open top, is lifted up and fastened (preferably, screwed) to the embedded first box to complete a preferred electrical junction box. The second box is designed to be exposed to accept surface mount or exposed wiring methods. There is a passage between the first and second boxes for accepting wire pulled through the conduit(s).04-12-2012

Patent applications in class Conductor or circuit manufacturing

Patent applications in all subclasses Conductor or circuit manufacturing