Class / Patent application number | Description | Number of patent applications / Date published |
029601000 | With other electrical component | 39 |
20080295318 | Method and Device for Continuously Producing Electronic Film Components and an Electronic Film Component - The invention relates to a method and device for continuously producing electronic film components, during which chip modules ( | 12-04-2008 |
20090000107 | METHOD AND ARRANGEMENT FOR PRODUCING A SMART CARD - A method is provided for producing a smart card comprising a chip module with at least one contacting area, the chip module arrangeable in a mounting location of a substrate, wherein one contacting loop is formed from a wire connector fed by a wire guiding unit for at least one of the contacting areas, respectively by attaching a first section of the wire conductor to a surface of the substrate outside the mounting location, wherein a second section of the wire conductor proximate to the first section is guided to form the contacting loop along with and protruding from the surface, wherein a subsequent third section of the wire conductor is attached to the surface outside the mounting location, wherein the chip module is inserted into the mounting location and wherein the second section is bent over and electrically contacted to the contacting area. | 01-01-2009 |
20090249611 | Method For Manufacturing Products Compricing Transponders - The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection. | 10-08-2009 |
20100126000 | METHOD OF MAKING RFID DEVICES - A method of producing antennas for RFID devices includes cutting or otherwise physically separating the antennas from a preformed sheet of conductive material that includes apertures in the conductive material. Cutting locations relative to the apertures may be selected based on desired performance characteristics of the antenna and/or of the RFID device for which the antenna is to be used. The cutting locations may include one or more cuts through the aperture, and other cuts that do not pass through an aperture. The cutting locations may be selected as a function of such parameters as the desired bandwidth of the antenna and the operating frequency of the antenna. The method allows production of antennas with different characteristics, from a previously-prepared supply of sheet conductive material. This facilitates the ability to make small production runs of antennas, and/or to reduce the lead time for providing antennas with specified characteristics. | 05-27-2010 |
20100229375 | METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA CONDUCTORS - A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing. | 09-16-2010 |
20100236053 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured. | 09-23-2010 |
20110247198 | METHOD FOR MAKING AN ASSEMBLY OF CHIPS BY MEANS OF RADIOFREQUENCY TRANSMISSION-RECEPTION MEANS MECHANICALLY CONNECTED BY A RIBBON - A method for making an assembly of chips equipped with radiofrequency transmission-reception means, including successively: making a plurality of chips, on a substrate, each chip having at least one reception area, connecting the reception areas of the chips of the assembly in series with an electrically insulating flat ribbon having a plurality of metallic patterns electrically insulated from one another, each pattern forming at least a part of a flat antenna electrically connected at the level of at least one connection area of the antenna to a corresponding reception area, and separating the chips at the level of the substrate, the chips being mechanically connected to one another by the ribbon. | 10-13-2011 |
20110271520 | METHOD FOR MOUNTING ELECTRONIC DEVICE AND ANTENNA IN TIRE - The invention provides a monitoring device and tire combination wherein an antenna is mounted to the tire in a location spaced from the monitoring device. In one embodiment, the antenna may be mounted to the tire sidewall outside the body cords of the tire. The antenna may be mounted on the outer surface of the sidewall or embedded within the body of the sidewall. The antenna is connected to the monitoring device with a connector. The connector may be electrically coupled to the monitoring device or may be connected to the monitoring device with a plug and socket connection. When the antenna is outside the body cord, the connector may extend from the antenna through the bead filler, over the top of the turn up, or under the bead ring. | 11-10-2011 |
20120000065 | METHOD OF CONTINUOUSLY PRODUCING ELECTRONIC FILM COMPONENTS - Electronic components each having a chip module with module contacts and an antenna having antenna contacts is made by securing a plurality of the chip modules the inner face of a module film strip having an outer periphery projecting past the chip module with the chip modules spaced from one another at a uniform predetermined module spacing. A plurality of the antennas are secured to an inner face of an elongated antenna strip with the antennas spaced from one another by a predetermined antenna spacing. The module strip is longitudinally subdivided into sections each of which is of a length equal to the predetermined module spacing and each of which carries a respective chip module. The module-strip sections are pressed against the antenna strip such that the module contacts of each of the chip modules engage and bear on the antenna contacts of a respective antenna. | 01-05-2012 |
20120030931 | ELECTRONIC DEVICE WITH EDGE SURFACE ANTENNA ELEMENTS AND RELATED METHODS - An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry. | 02-09-2012 |
20120060359 | Method, System and Apparatus for Making Short Run Radio Frequency Identification Tags and Labels - The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods. | 03-15-2012 |
20120066894 | LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS - A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure. | 03-22-2012 |
20120137506 | APPARATUS FOR FORMING A WIRELESS COMMUNICATION DEVICE - A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements. | 06-07-2012 |
20120210564 | CIRCUIT OBFUSCATION - An obfuscated radio frequency circuit may include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having differing dielectric constants to obfuscate functions of the circuit. | 08-23-2012 |
20120222290 | METHOD AND SYSTEM FOR PREPARING WIRELESS COMMUNICATION CHIPS FOR LATER PROCESSING - A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers is used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. | 09-06-2012 |
20130014382 | METHOD AND SYSTEM FOR MANUFACTURING AN ELECTRONIC INTERFACE APPARATUS - A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess. | 01-17-2013 |
20130091695 | METHOD OF MANUFACTURING A THERMALLY-ASSISTED MAGNETIC RECORDING HEAD THAT SUPPRESSES PROTRUSION OF A PLASMON GENERATOR - A method of manufacturing a thermally-assisted magnetic recording head includes the steps of: forming a preliminary head section that has a surface to be polished and includes a magnetic pole, a waveguide, and a preliminary plasmon generator; causing a volumetric expansion of the preliminary plasmon generator with heat by introducing light into the core of the waveguide of the preliminary head section; and polishing the surface to be polished of the preliminary head section into a medium facing surface. The preliminary plasmon generator has an end face located in the surface to be polished. In the step of polishing the surface to be polished, the surface to be polished is subjected to polishing with the preliminary plasmon generator expanded in volume, whereby the end face of the preliminary plasmon generator is polished into the front end face, and the preliminary plasmon generator thereby becomes the plasmon generator. | 04-18-2013 |
20130104387 | ON PCB DIELECTRIC WAVEGUIDE | 05-02-2013 |
20130125386 | Wireless Temperature Measurement System And Methods Of Making And Using Same - A temperature measurement system capable of operating in harsh environments including a temperature sensor having an antenna, diode, and dielectric layer disposed on the object of interest is provided, wherein the antenna includes a buried portion that extends through and is electrically coupled to the object of interest, and an exposed portion disposed upon an outer surface of the dielectric layer and the diode is coupled between the object of interest and the exposed portion of the antenna. The antenna is configured to receive interrogating signals from a transmitter, and to transmit response signals corresponding to the resonant frequency of the temperature sensor and its harmonics, which are indicative of the measured temperature of the object of interest. A receiver detects the response signals and correlates the frequency to a known temperature response of the dielectric material. Methods of making and using the temperature measurement system are also provided. | 05-23-2013 |
20130145612 | HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION - A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents. | 06-13-2013 |
20130199026 | TECHNOLOGY ENHANCEMENT CLIP FOR HARD TAGS - A technology clip and method for supplementing a security tag with the technology clip for application to a product. The technology clip includes a technology element providing for an additional security and/or an identification feature when coupled to a tag, thus enhancing features of the security tag. The technology clip attaches about the tag and remains secured to the tag for when the tag is affixed to merchandise. | 08-08-2013 |
20130239403 | HEADER DESIGN FOR IMPLANTABLE PULSE GENERATOR - In one embodiment, an implantable pulse generator for electrically stimulating a patient comprises: a metallic housing enclosing pulse generating circuitry; a header mechanically coupled to the metallic housing, the header adapted to seal terminals of one or more stimulation leads within the header and to provide electrical connections for the terminals; the header comprising an inner compliant component for holding a plurality of electrical connectors, the plurality of electrical connectors electrically coupled to the pulse generating circuitry through feedthrough conductors, wherein the plurality of electrical connectors are held in place in recesses within the compliant inner component, the header further comprising an outer shield component adapted to resist punctures, the outer shield component fitting over at least a portion of the inner compliant component. | 09-19-2013 |
20130291375 | METHOD FOR PRODUCING AN RFID TRANSPONDER - A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet. | 11-07-2013 |
20140020236 | HIGHLY CONFIGURABLE RADIO FREQUENCY (RF) MODULE - The disclosed embodiments relate to a communication device ( | 01-23-2014 |
20140047703 | Foil Laminate Intermediate and Method of Manufacturing - The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies. | 02-20-2014 |
20140059841 | TRANSFERRING AN ANTENNA TO AN RFID INLAY SUBSTRATE - Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites. | 03-06-2014 |
20150020377 | APPARATUSES AND METHODS RELATING TO FINDABLE BALLS - Golf balls for use with a system for finding golf balls and methods for making such golf balls. In the case of one exemplary golf ball, the ball includes a shell, a core material and a tag having a diode which is coupled to an antenna which has at least a portion formed from an elastic conductive material, such as an elastic conductive ink. The core material may include a void for receiving at least part of the diode. Other golf balls are described and methods for making balls are also described. | 01-22-2015 |
20150033545 | METHOD FOR MANUFACTURING ANTENNA PART - Provided is a method of manufacturing an antenna part that can be produced easily and inexpensively, the method comprising the steps of: forming a coil part | 02-05-2015 |
20150068028 | PROCESS FOR MAKING BIOSENSOR - A process for making a biosensor comprising a hollow coil having wires coiled in parallel and an electronic circuit component connected to the coil, the process including: 1) providing a mandrel on which wires including at least a first wire, a second wire and a third wire are wound in parallel, 2a) immersing the mandrel in a first buffer solution comprising a first bioreceptor, a first monomer and optional additives, 2b) arranging the wires such that the first wire may be used as a working electrode, the second wire may be used as a counter electrode and the third wire may be used as a reference electrode of a three electrode electrochemical cell used in an electropolymerisation process, 3) passing electric current through the first wire to form a first biocompatible coating of a first polymer polymerized from the first monomer comprising the first bioreceptor on the first wire, 4) removing the coil from the mandrel, 5) connecting the wires to their respective points of the electronic circuit component such that the first wire may be used as a working electrode, the second wire may be used as a counter electrode and the third wire may be used as a reference electrode and wherein the electronic circuit component is configured such that it can generate an input signal for a wireless receiver based upon the activity of the bioreceptor and wirelessly send the input signal to the wireless receiver. | 03-12-2015 |
20150096167 | IMPLANTABLE MEDICAL DEVICES HAVING HOLLOW CAP COFIRE CERAMIC STRUCTURES AND METHODS OF FABRICATING THE SAME - An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first end being open to provide access to the hollow cavity and the second end being closed. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure. | 04-09-2015 |
20150107092 | Manufacture Of A Smart Card - A method and device for manufacturing a smart card inlay includes attaching a first and a second end of a single wire antenna to a single first substrate, fixing the wire antenna, aside from the first and second ends thereof, to a second substrate. The method further includes thereafter relocating the first substrate relative to the second substrate such that the first and second ends of the wire antenna are at locations on the second substrate suitable for connection to a chip module, thereafter connecting the first end and the second end to the chip module, and thereafter removing the first substrate. | 04-23-2015 |
20150295301 | COAXIAL TRANSMISSION LINE SLOT FILTER WITH ABSORPTIVE MATRIX - A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face. | 10-15-2015 |
20150302291 | METHOD FOR MANUFACTURING ANTENNA SHEET - A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other. | 10-22-2015 |
20150334848 | ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER - Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed. | 11-19-2015 |
20150372393 | MICRO ASSEMBLED HIGH FREQUENCY DEVICES AND ARRAYS - Phased-array antenna systems can be constructed using transfer printed active components. Phased-array antenna systems benefit from a large number of radiating elements (e.g., more radiating elements can form sharper, narrower beams (higher gain)). As the number of radiating elements increases, the size of the part and the cost of assembly increases. High throughput micro assembly (e.g. by micro-transfer printing) mitigates costs associated with high part-count. Micro assembly is advantaged over monolithic approaches that form multiple radiating elements on a semiconductor wafer because micro assembly uses less semiconductor material to provide the active components that are necessary for the array. The density of active components on the phased-array antenna system is small. Micro assembly provides a way to efficiently use semiconductor material on a phased array, reducing the amount of non-active semiconductor area (e.g., the area on the semiconductor material that does not include transistors, diodes, or other active components). | 12-24-2015 |
20160007445 | HIGH-FREQUENCY SIGNAL PROCESSING METHOD - The high-frequency signal processing method provides at least two isolation terminals between adjacent signal transmission conductor sets. For two adjacent signal transmission conductor sets of a substrate, at least two vias through the substrate are embedded with conductive pillars, respectively. Each conductive pillar penetrates the dielectric layers of the substrate from a top side to a bottom side of the substrate. Each via with the embedded conductive pillar functions as an isolation terminal. The signal transmission conductor sets are as such segregated by the isolation terminals and the isolation terminals provides two layers of shielding. With the present invention, there is no requirement of having a casing and the miniaturization of form factors of the electronic appliances is not compromised. The dual isolation terminals significantly suppress the strength and influence of interference produced by a signal transmission conductor. | 01-07-2016 |
20160071704 | INDUCTIVELY COUPLED RF PLASMA SOURCE WITH MAGNETIC CONFINEMENT AND FARADAY SHIELDING - Disclosed is an inductively coupled RF plasma source that provides both magnetic confinement to reduce plasma losses and Faraday shielding to suppress parasitic capacitive components. The inductively coupled RF plasma system comprises an RF power source, plasma chamber, an array of permanent magnets, and an antenna array. The plasma chamber is comprised of walls and a dielectric window having an inner and outer surface wherein the inner surface seals the volume of the plasma chamber. The array of parallel conductive permanent magnets is electrically interconnected and embedded within the dielectric window walls proximate to the inner surface and coupled to ground on one end. The permanent magnet array elements are alternately magnetized toward and away from plasma in the plasma chamber to form a multi-cusp magnetic field. The antenna array may be comprised of parallel tubes through which an RF current is circulated. The antenna array is oriented perpendicular to the permanent magnet array. | 03-10-2016 |
20160080014 | HIGHLY CONFIGURABLE RADIO FREQUENCY (RF) MODULE - The disclosed embodiments relate to a communication device ( | 03-17-2016 |
20160172743 | METHOD OF ASSEMBLY USING MOVING SUBSTRATES, INCLUDING CREATING RFID INLAYS | 06-16-2016 |