Class / Patent application number | Description | Number of patent applications / Date published |
029250410 | ELECTRIC CONDENSER MAKING | 86 |
20080244885 | METHOD FOR FORMING A CAPACITOR HAVING A COPPER ELECTRODE AND A HIGH SURFACE AREA ALUMINUM INNER LAYER - High capacitance value capacitors are formed using bimetal foils of an aluminum layer attached to a copper layer. The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil is formed into a capacitor, where the copper layer is one electrode of the capacitor and the treated aluminum layer is in intimate contact with a dielectric layer of the capacitor. | 10-09-2008 |
20080263842 | THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME - An apparatus including a first electrode; a second electrode; a first and second ceramic material disposed between the first electrode and the second electrode, the second ceramic material having a greater electrical conductivity than the first ceramic material. A method including forming a first ceramic material film and a different second ceramic material film on a first electrode; and forming a second electrode on the second ceramic material film to form a capacitor structure having the first ceramic material film and the second ceramic material film disposed between the first electrode and the second electrode, wherein the first ceramic material has a conductivity selected to dampen undesired oscillations in electrical device operation to which the capacitor structure may be exposed. An apparatus including a first electrode; a second electrode; and a composite dielectric including a plurality of dielectric films including a different Curie temperature. | 10-30-2008 |
20090288279 | METHODS OF FABRICATING AN ARRAY CAPACITOR - Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas. | 11-26-2009 |
20090288280 | PROCESS FOR MANUFACTURING EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW - An EMI filtered terminal assembly includes at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor and the lead wire. Preferably, the feedthrough capacitor having counter-drilled holes on its top side is first bonded to a hermetic insulator. The counter-bore in the capacitor provides greater volume for the electro-mechanical attachment between the capacitor and the lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive. | 11-26-2009 |
20100107391 | TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE - A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for. | 05-06-2010 |
20110094075 | METHOD FOR FORMING A CAPACITOR MODULE CIRCUIT IN AN INVERTER USING IMPEDANCE MATCHING - The present invention is directed to methods for forming an inverter circuit for operating a drive motor of an electric vehicle, which can more effectively reduce the switching noise generated by a power module during the operation of an inverter. | 04-28-2011 |
20110119878 | METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR - Electrode lead terminals in a number not less than three are attached to a cathode foil and an anode foil. The electrode lead terminals include at least one cathode lead terminal attached to the cathode foil and at least one anode lead terminal attached to the anode foil. A winding core having an axis is prepared. The cathode foil and the anode foil are wound around the winding core, being overlapped each other. A cross section of the winding core perpendicular to the axis includes an outer edge having a portion along each side of a polygon with the above number of sides. Thereby, a method for manufacturing an electrolytic capacitor capable of suppressing displacement of a lead terminal can be provided. | 05-26-2011 |
20110119879 | METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor having an even conductive polymer layer and a method of manufacturing the same are provided. The method of manufacturing a solid electrolytic capacitor includes the steps of forming a conductive polymer layer on an anode element by bringing a dispersion containing a conductive solid and a first solvent into contact with the anode element having a dielectric film formed thereon, washing the anode element with a second solvent higher in boiling point than the first solvent, in which the conductive solid can be dispersed, after the conductive polymer layer is formed, and drying the anode element washed with the second solvent at a temperature not lower than the boiling point of the first solvent and lower than the boiling point of the second solvent. | 05-26-2011 |
20110126389 | METHOD OF MANUFACTURING ELECTROLYTIC CAPACITOR - An electrolytic capacitor is manufactured which includes at least one capacitor element having an anode portion, a dielectric film covering a part of the anode portion and a cathode portion located on the dielectric film; and a piece member attached to each anode portion. The dielectric film is formed on each of a plurality of anode portions including the anode portion. A connecting portion connecting the plurality of anode portions to each other is provided. After the step of providing the connecting portion, the cathode portion is formed on the dielectric film in order to form a plurality of capacitor elements including at least one capacitor element. After the step of forming the cathode portion, the piece member is cut out from the connecting portion in order to separate the plurality of capacitor elements from each other. | 06-02-2011 |
20110146042 | CAPACITOR METHOD OF FABRICATION - A method of manufacture of a polymer or ceramic polymer capacitor, of various sizes and voltage ratings. The fabrication equipment deposits a polymer or ceramic polymer dielectric layer on a carrier substrate with the electrode structure of the capacitor previously deposited on its surface. The sheet is often then fabricated into a capacitor by rolling into an axial style or the sheet is cut and stacked into a rectangular type. An alternate arrangement of the fabrication process has additional electrode layers deposited alternating with dielectric layers in continuous process until the desired number of layers is achieved. At that point the sheet is cut to form capacitors of a rectangular form. | 06-23-2011 |
20110214266 | Methods of Forming Capacitors - A method of forming a capacitor includes providing material having an opening therein over a node location on a substrate. A shield is provided within and across the opening, with a void being received within the opening above the shield and a void being received within the opening below the shield. The shield is etched through within the opening. After the etching, a first capacitor electrode is formed within the opening in electrical connection with the node location. A capacitor dielectric and a second capacitor electrode are formed operatively adjacent the first capacitor electrode | 09-08-2011 |
20110239424 | METHOD FOR MANUFACTURING CAPACITOR ELEMENT - A capacitor element is obtained by chemically converting an anode body comprising a niobium or niobium alloy in an electrolyte solution, which is obtained by dissolving an oxygen supply agent such as hydrogen peroxide, a freezing point depressant such as ethylene glycol, and an electrolyte such as phosphoric acid in water, at a solution temperature lower than the freezing point of a solution having the composition of the electrolyte solution excluding the freezing point depressant, for forming a dielectric layer in the surface of the anode body or repairing a dielectric layer formed in the surface of the anode body. An electrolytic capacitor is obtained by forming a cathode on the dielectric layer of the capacitor element, electrically connecting the anode body and the cathode respectively to external terminals, and then sealing them. | 10-06-2011 |
20110252613 | HIGH VOLTAGE AND HIGH EFFICIENCY POLYMER ELECTROLYTIC CAPACITORS - A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached there to. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V. | 10-20-2011 |
20110252614 | CAPACITOR COMPRISING FLEX CRACK MITIGATION VOIDS - A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures. | 10-20-2011 |
20110277287 | CELL ELECTRODE PLATE AND PROCESS FOR PRODUCING THE SAME - A cell electrode plate is constituted by band-like core member made of metal foil and a plurality of sheets of electrode active material applied discontinuously on and longitudinally of at least one of upper and lower surfaces of the core member, the mutually adjacent sheets of the electrode active material having mutually different end positions widthwise of the core member. Thereby, an increase in worn amount of surfaces of press rolls is prevented when the cell electrode plate is pressed by a roll press machine with the press rolls so as to prolong the service life of the press rolls. Thus, the number and/or amount of grinding the press rolls is reduced to reduce the roll maintenance cost and enhance production efficiency. | 11-17-2011 |
20120000045 | Method for Making Internally Overlapped Conditioners - The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners having A, B, and G master electrodes. | 01-05-2012 |
20120017408 | METHOD OF MANUFACTURING CAPACITOR ELEMENT - A capacitor element includes a pair of conductive layer, a plurality of first electrodes and second electrodes, and insulation caps for insulating these electrodes from the conductive layers. By anodizing a metal substrate in two stages, holes filled with the first electrodes and holes filled with the second electrodes are randomly distributed. | 01-26-2012 |
20120054994 | SOLID ELECTROLYTICAL CAPACITORS WITH IMPROVED ESR STABILITY - An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer. | 03-08-2012 |
20120079693 | EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR - A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs. | 04-05-2012 |
20120084955 | THIN FILM CAPACITOR AND METHOD OF FABRICATION THEREOF - Methods for fabricating a capacitor are provided. In the methods, a dielectric may be formed on a metal (e.g. nickel) substrate, and a copper electrode is formed thereon, followed by the thinning of the metal substrate from its non-coated face, and subsequently forming a copper electrode on the thinned, non-coated face of the substrate. | 04-12-2012 |
20120110807 | CONDUCTIVE PASTE COMPOSITION AND METHOD FOR PRODUCING MULTILAYER CERAMIC CAPACITOR USING THE SAME - Disclosed herein is a conductive paste composition. The conductive paste composition according to the exemplary embodiment of the present invention includes a conductive powder including nickel or a nickel alloy; a spherical particulate inhibitor including BaTiO | 05-10-2012 |
20120110808 | CAPACITOR REFORMATION METHOD AND APPARATUS - A method of reforming a wet-tantalum capacitor includes providing a medical device comprising a wet-tantalum capacitor. The capacitor has a rated voltage and including a hydrated anodic deposit. The method further includes charging the capacitor to a voltage that is less than approximately seventy-five percent of the rated voltage and at least partially discharging the capacitor after the charging step. The charging step is performed at a sufficient voltage to dehydrate the anodic deposit while not significantly decreasing the service life of the capacitor. | 05-10-2012 |
20120117771 | METHODS OF FABRICATING AN ARRAY CAPACITOR - Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas. | 05-17-2012 |
20120151726 | METHOD OF FORMING CAPACITOR STRUCTURE - In a capacitor structure and method of forming the same, a first electrode, a second electrode, and a first insulation layer are sequentially formed on a substrate. The first and second electrodes and the first insulation layer are covered with a second insulation layer on the substrate. A first plug is in contact with the second electrode through the second insulation layer. A second plug is in contact with the first electrode through the first and second insulation layer. A third insulation layer is formed on the second insulation layer. Third and fourth comb-shaped electrodes are formed in the third insulation layer. The third electrode is contact with the first plug and the fourth electrode is contact with the second plug while facing the third electrode. Thus, the teeth of the comb-shaped electrodes are alternately arranged and spaced apart in the third insulation layer. | 06-21-2012 |
20120216379 | ALL SOLID-STATE ELECTROCHEMICAL DOUBLE LAYER SUPERCAPACITOR - The present invention provides a method for fabricating a supercapacitor-like electronic battery. The steps for fabricating a supercapacitor-like electronic battery are as follows. A first current collector is formed on a substrate. A first electrode is formed on the first current collector. A first electrode is formed from a first solid state electrolyte and a first conductive material where the first conductive material is irreversible to the mobile ions contained in the first solid state electrolyte and the first conductive material exceeds the percolation limit. An electrolyte is formed on the first electrode. A second electrode is formed on the electrolyte. The second electrode is formed from a second solid state electrolyte and a second conductive material where the second conductive material is irreversible to the mobile ions contained in the second solid state electrolyte and the second conductive material exceeds the percolation limit. A second current collector is formed on the second electrode. | 08-30-2012 |
20120304430 | REACTION CONTAINER FOR MANUFACTURING CAPACITOR ELEMENT, AND METHOD FOR MANUFACTURING CAPACITOR ELEMENT - A reaction container for manufacturing a capacitor element, in which the liquid level in each individual chamber (compartment) of a container can be adjusted to the same level, adjustment to achieve uniformity of electrolytic solution in each individual chamber can also be performed, and with which a uniform dielectric layer or a uniform semiconductor layer can be formed with respect to a plurality of conductive members in a stable manner while maintaining a constant range of formation thereof. The reaction container ( | 12-06-2012 |
20130008000 | HIGH ASPECT RATIO OPENINGS - A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening. | 01-10-2013 |
20130111720 | SOLID ELECTROLYTIC CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME - A method of manufacturing a solid electrolytic capacitor includes steps (a) to (d). The step (a) forms at least two punched apertures in a metal plate, thereby forming a rung section between adjacent two of the punched apertures, the rung section having surfaces as a pair appearing as a result of formation of the punched apertures. The step (b) cuts the rung section out of the metal plate to form a pad member, the length of the rung section corresponding to a distance between the surfaces being determined to be the height of the pad member. The step (c) mounts the pad member on an anode terminal such that one of the surfaces faces the anode terminal. The step (d) electrically connects an anode section of a capacitor element to the other of the surfaces and electrically connects a cathode section of the capacitor element to the cathode terminal. | 05-09-2013 |
20130152351 | METHOD AND APPARATUS FOR PRODUCING A CERAMIC ELECTRONIC COMPONENT - A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer. | 06-20-2013 |
20130219679 | PATTERN-WISE DEFINING MICRO-WIRES WITH DIFFERENT HEIGHTS - A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area. | 08-29-2013 |
20140053383 | METHOD AND DEVICE FOR PRODUCING ELECTRODE WINDINGS - A method produces electrode windings, in which method a strip- or ribbon-like anode and a strip- or ribbon-like cathode are provided and flat collector lugs are formed on at least one longitudinal side of the anode and of the cathode at varying distances and/or contours are cut into the longitudinal sides of the electrodes. The anode and the cathode are wound up together with a strip- or ribbon-like separator to form a winding with the sequence anode/separator/cathode. The method is distinguished, in particular, in that the process of forming collector lugs and/or of cutting contours and the process of winding up overlap with respect to time. | 02-27-2014 |
20140123453 | Method for Stacking Electronic Components - A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: | 05-08-2014 |
20140182101 | METHOD OF IDENTIFYING DIRECTION OF STACKING IN STACKED CERAMIC CAPACITOR, APPARATUS FOR IDENTIFYING DIRECTION OF STACKING IN STACKED CERAMIC CAPACITOR, AND METHOD OF MANUFACTURING STACKED CERAMIC CAPACITOR - In a method of identifying a direction of stacking in a stacked ceramic capacitor, while density of magnetic flux generated from a magnetism generation apparatus is measured with a magnetic flux density measurement instrument, a stacked ceramic capacitor is caused to pass between a magnetism generation apparatus and the magnetic flux density measurement instrument and variation in magnetic flux density at least at the time of passage of the stacked ceramic capacitor is measured. Based on a result of measurement of magnetic flux density, a direction in which a plurality of internal electrodes are stacked in the stacked ceramic capacitor is identified. | 07-03-2014 |
20140208555 | PRECISION LASER ADJUSTABLE THIN FILM CAPACITORS - Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board. | 07-31-2014 |
20140245581 | LOW INDUCTANCE CAPACITOR ASSEMBLY - A low-inductance capacitor assembly ( | 09-04-2014 |
20140373323 | ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD - An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism. | 12-25-2014 |
20150082591 | ALIGNING DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING THE ALGINING DEVICE - In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig. | 03-26-2015 |
20150113780 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A method of manufacturing an electronic component includes the steps of: preparing a first block formed by stacking a plurality of green sheets serving as an element body; cutting the first block in a first direction into a plurality of second blocks such that a portion of an internal conductor connected to an external electrode is exposed at a cut surface; and cutting each of the plurality of second blocks in a second direction crossing the first direction such that the internal conductor exposed at each of both cut surfaces is located in the center of a portion serving as each element body in the first direction in each of the plurality of second blocks. | 04-30-2015 |
20150143680 | ULTRACAPACITOR VACUUM ASSEMBLY - A method for fabricating an EDLC includes (a) coating a porous activated carbon material onto current collector sheets to form carbon-based electrodes, (b) drying the carbon-based electrodes, (c) winding or stacking carbon-based electrodes interleaved with separator sheets to fabricate a jelly roll or prismatic electrode assembly, (d) inserting the electrode assembly into a package and forming electrical connections between the electrode assembly and package terminals, (e) filling the package with a liquid electrolyte, and (f) sealing the package. Steps (a)-(f) are performed in an atmosphere having a low moisture content. The atmosphere may be vacuum or purged with dry gas. | 05-28-2015 |
20160141106 | Method for Stacking Electronic Components - A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes: | 05-19-2016 |
029250420 | Solid dielectric type | 46 |
20080216298 | EMBEDDED CAPACITIVE STACK - A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled. | 09-11-2008 |
20080295310 | MULTI-TERMINAL TYPE LAMINATED CAPACITOR AND MANUFACTURING METHOD THEREOF - Electrode layers | 12-04-2008 |
20090000093 | Capacitor and method of manufacturing the same and capacitor unit - The present invention has a configuration which allows manufacturing a capacitor comprising a first electrode layer, conductive first convex sections layered on a surface of the first electrode layer, a first dielectric layer formed on a surface of the first convex sections and a surface of the first electrode layer, and a second electrode layer formed so as to be superimposed on the first convex sections and the first electrode layer via the first dielectric layer. | 01-01-2009 |
20090000094 | METHOD FOR MANUFACTURING METAL-INSULATOR-METAL CAPACITOR - A method of manufacturing a metal-insulator-metal (MIM) capacitor that includes at least one of the following steps: Sequentially forming a bottom metal film, an insulating film, and a top metal film over a wafer. Forming a first pattern for etching the top metal film and the insulating film. Etching the top metal film and the insulating film, using the formed first pattern, and then stripping the first pattern. Conducting a heat treatment and a cooling split for the wafer. Forming a metal pattern for etching the bottom metal film. Etching the bottom metal film, using the formed metal pattern, and then stripping the metal pattern. | 01-01-2009 |
20090007404 | Production Method of Multilayer Electronic Device - A production method of a multilayer electronic device, comprising the steps of forming an electrode layer | 01-08-2009 |
20090007405 | Capacitor device and method of manufacturing the same - A capacitor device includes a capacitor Q constituted by a lower electrode ( | 01-08-2009 |
20090031543 | Segmented End Electrode Capacitor and Method of Segmenting an End Electrode of a Capacitor - An exemplary embodiment providing one or more improvements includes a capacitor with a segmented end electrode and methods for segmenting an end electrode of a capacitor for reducing or eliminating instances of thermally induced damage of the capacitor. | 02-05-2009 |
20090126174 | METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CONDENSER - There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser. | 05-21-2009 |
20090126175 | MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - An example of a multi-layer ceramic capacitor may include multiple dielectric sheets. In a cross section of each dielectric sheet, there may be printed a first external electrode, a first internal electrode which includes one or more protrusions and which is joined to the first external electrode by way of an interposed dielectric portion, a second external electrode joined as a single body to the first internal electrode, and a second internal electrode joined to the first internal electrode with a dielectric portion positioned in a space defined by the protrusions. The dielectric sheets may be stacked alternately to be symmetrical, such that the first external electrodes and the second external electrodes are electrically connected and the protrusions of the first internal electrodes and the second internal electrodes are electrically connected. In this way, the areas of the internal electrodes can be maximized. | 05-21-2009 |
20090193637 | METHOD OF FORMING ANODE BODIES FOR SOLID STATE CAPACITORS - The present invention relates to the field of solid state capacitors, and in particular to capacitors that have an anode body formed of porous valve action material, such as tantalum, niobium or niobium monoxide. According to one aspect of the present invention, there is provided a method of forming capacitor anode bodies from valve action material comprising the steps of: providing a capacitor grade powder of the valve action material, charging the powder into moulding means, compacting the powder in the moulding means so as to shape the powder into an anode body shape, stabilising the body shape, for example by sintering of the material to form an inter-connected porous body, characterised in that the moulding process involves the use of lubrication means which is adapted to apply lubricant locally to lubricate the interface between an outside surface of the anode body and a moulding surface of the moulding means. By applying a lubricant directly to the parts of the mould and anode green that most require lubricant, it is possible considerably to reduce the amount of binder/lubricant that must be added to the valve action powder. In fact, in the case of tantalum, it has surprisingly been found that it is possible to avoid completely the need for an admixed binder/lubricant. This is thought to be because the compaction of the tantalum powder in the presence of an external lubricant provides sufficient structural integrity of the green to be manipulated and transported to a sintering station, without disintegrating. | 08-06-2009 |
20100024181 | PROCESSES FOR FORMING BARIUM TITANATE CAPACITORS ON MICROSTRUCTURALLY STABLE METAL FOIL SUBSTRATES - The present invention relates to a process for the manufacture of capacitors on metal foil using chemical solution deposition of a barium/titanium precursor formulation. The metal foil substrate is annealed and subsequently polished prior to the precursor formulation deposition in order to obtain a desirable process yield of capacitors without short circuits across the dielectric. | 02-04-2010 |
20100024182 | METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR - Disclosed is a method for manufacturing a solid electrolytic capacitor in which a capacitor element has conductive polymer solid electrolyte on a dielectric oxide film layer. The method includes the following processes: forming a manganese oxide layer on the dielectric oxide film layer; and chemically polymerizing a reaction solution containing a monomer, aromatic sulfonic acid, and a solvent using the manganese oxide layer as an oxidizing agent. Here, polyhydric alcohol capable of being coordinated to manganese ions released from the manganese oxide layer is made to coexist with the chemical polymerization reaction. | 02-04-2010 |
20100077582 | METHOD OF MANUFACTURING CHIP CAPACITOR INCLUDING CERAMIC/POLYMER COMPOSITE - A method of manufacturing a chip capacitor according to an aspect of the invention may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming at least one first opening and at least one second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the result into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals. | 04-01-2010 |
20100095498 | METHODS OF PRODUCING MULTILAYER CAPACITOR - A method of producing a multilayer capacitor has a step of preparing a plurality of first ceramic green sheets, a step of preparing a plurality of second ceramic green sheets, a step of laminating the plurality of first and second ceramic green sheets, and a step of cutting a ceramic green sheet laminate body along predetermined intended cutting lines to obtain laminate chips of individual multilayer capacitor units. In the step of preparing the first ceramic green sheets, first and second internal electrode patterns are formed so that the first and second internal electrode patterns are alternately arranged in a predetermined direction and in a direction perpendicular to the predetermined direction and so that portions corresponding to lead portions of first and second internal electrodes in the first and second internal electrode patterns are continuous across the predetermined intended cutting line. In the step of preparing the second ceramic green sheets, third and fourth internal electrode patterns are formed so that the third and fourth internal electrode patterns are alternately arranged in the predetermined direction and in the direction perpendicular to the predetermined direction and so that portions corresponding to lead portions of third and fourth internal electrodes in the third and fourth internal electrode patterns are continuous across the predetermined intended cutting lines. | 04-22-2010 |
20100125989 | Method for adjusting capacitance of capacitors without affecting die area - According to one exemplary embodiment, a method for adjusting geometry of a capacitor includes fabricating a first composite capacitor residing in a first standard cell with a first set of process parameters. The method further includes using a second standard cell having substantially same dimensions as the first standard cell. The method further includes using a capacitance value from the first composite capacitor to adjust a geometry of a second composite capacitor residing in the second standard cell, wherein the second composite capacitor is fabricated with a second set of process parameters. The geometry of the second composite capacitor can be adjusted to cause the second composite capacitor to have a capacitance value substantially equal to the capacitance value from the first composite capacitor. | 05-27-2010 |
20100192343 | METHOD OF MANUFACTURING CERAMIC CAPACITOR - In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes. | 08-05-2010 |
20110010905 | Capacitor forming method - The capacitor forming method utilizes a plurality of metal sheet manipulating rollers and a glass supply, which, in combination, make a metal-glass laminate and glass or devitrifying glass dielectric to form a capacitor. Several embodiments of the method manufacture ferroelectric crystal dielectrics by utilizing heat-treatment and annealing to form and devitrify glass while the glass is in a metal-glass spool or flat form. | 01-20-2011 |
20110099779 | Method of manufacturing capacitor-embedded PCB - A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate. | 05-05-2011 |
20110119880 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A solid electrolytic capacitor excellent in adhesion to a solid electrolyte with excellent ESR and heat resistance can be provided without reducing the material characteristics of a separator. This solid electrolytic capacitor comprises a capacitor element formed by winding an anodic foil prepared from a chemical conversion foil obtained by anodizing a metal having a valve action and a counter cathodic foil through a separator and a solid electrolyte employed as an electrolyte, while the separator is prepared from aramid fiber, and a silane coupling agent adheres to voids of the aramid fiber. | 05-26-2011 |
20110191998 | PRECISION LASER ADJUSTABLE THIN FILM CAPACITORS - Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board. | 08-11-2011 |
20110197409 | Method of fabricating cavity capacitor embedded in printed circuit board - A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor. | 08-18-2011 |
20110203085 | TITANIUM-BASED HIGH-K DIELECTRIC FILMS - This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO | 08-25-2011 |
20110232056 | METHOD FOR MANUFACTURING A SOLID ELECTROLYTIC CAPACITOR - A method includes the following steps: forming a porous anode body using powder of valve metal or an alloy thereof; forming a dielectric layer on the surface of the anode body; soaking the anode body having the dielectric layer in a liquid containing a conductive-polymer monomer, thereby making the monomer adhere to the dielectric layer of the anode body; forming a first conductive polymer layer by soaking the anode body having the monomer adhered thereto in an oxidizing agent solution, thereby polymerizing the monomer by liquid-phase chemical polymerization; forming a second conductive polymer layer by bringing the conductive-polymer monomer into contact with the surface of the anode body having the first conductive polymer layer in a gas phase, thereby polymerizing the monomer by gas-phase chemical polymerization; and forming a third conductive polymer layer by soaking the anode body having the second conductive polymer layer in a liquid containing a monomer of a conductive polymer layer, thereby polymerizing the monomer by electrolytic polymerization. | 09-29-2011 |
20110247186 | METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A method of manufacturing a multilayer ceramic capacitor includes forming a base dielectric layer, forming a unit ceramic capacitor by alternately depositing internal dielectric layers and internal electrode layers on a top surface of the base dielectric layer, and stacking another unit ceramic capacitor on the unit ceramic capacitor, wherein the number of unit ceramic capacitors being stacked is two or more. | 10-13-2011 |
20110252615 | METHOD OF MANUFACTURING CAPACITOR ELEMENT - There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes. | 10-20-2011 |
20110265299 | CAPACITOR WITH SACRIFICIAL LEAD WIRE CONFIGURATION AND IMPROVED MANUFACTURING METHOD THEREOF - The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode. | 11-03-2011 |
20110302753 | CAPACITOR PRODUCING METHOD, CAPACITOR PRODUCING DEVICE, AND CAPACITOR PRODUCING PROGRAM - In a capacitor producing method, a bottom electrode, a thin-film dielectric, and a top electrode are deposited on a substrate so as to form a capacitor, wherein defects including particles and electrical short-circuits between the bottom electrode and the top electrode are detected before the capacitor is divided into capacitor cells. Next, defects such as particles and electrical short-circuits between the bottom electrode and the top electrode are removed before the capacitor is divided into capacitor cells. | 12-15-2011 |
20110308053 | CAPACITOR FORMING METHOD - The capacitor forming method utilizes a plurality of metal sheet manipulating rollers and a glass supply, which, in combination, make a metal-glass laminate and glass or devitrifying glass dielectric to form a capacitor. Several embodiments of the method manufacture ferroelectric crystal dielectrics by utilizing heat-treatment and annealing to form and devitrify glass while the glass is in a metal-glass spool or flat form. | 12-22-2011 |
20120073100 | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR ELECTRONIC COMPONENT - A manufacturing method for an electronic component forms with a high degree of accuracy a portion of an outer electrode on a main surface of a dielectric block. Light irradiated from a second main surface side is detected by a detector disposed on a first main surface side, thereby detecting the positions of first and second inner electrodes, and a conductive layer is formed in a portion on a first main surface, determined based on the detection result by the detector, thereby forming first portions of individual first and second outer electrodes. | 03-29-2012 |
20120198673 | HELICAL CAPACITOR AND MANUFACTURING METHOD THEREOF - [Problem to be Solved] To provide a helical capacitor for controlling a high-frequency power which flows in power lines, and a manufacturing method of the helical capacitor. | 08-09-2012 |
20120204389 | SOLID ELECTROLYTIC CAPACITOR - A method of manufacturing a solid electrolytic capacitor includes steps (a) to (e). The steps (a) and (b) provide anode and cathode terminals to an insulating base respectively. The step (c) mounts a capacitor element on the insulating base. The step (d) coats the capacitor element with enclosure resin. The step (e) separates a first region of the insulating base to which the anode and cathode terminals are provided and on which the capacitor element is mounted from a second region of the insulating base which is different from the first region. The step (a) includes a step (a1) forming a first through hole in the insulating base, and a step (a2) plating an inner surface of the first through hole. The step (b) includes a step (b1) forming a second through hole in the insulating base, and a step (b2) plating an inner surface of the second through hole. | 08-16-2012 |
20120233828 | MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate. | 09-20-2012 |
20120297596 | HIGH VOLTAGE CAPACITORS - In a method of manufacturing a multilayer ceramic component, a ceramic capacitor body is formed from electrode layers and dielectric layers. First and second external terminals are attached on opposite ends of the ceramic capacitor body. The ceramic capacitor body is coated to assist in increasing breakdown voltage. The electrode layers include active electrode layers configured in an alternating manner such that a first end of the active electrodes extends from one end of the ceramic capacitor body inwardly and a next internal active electrode extends from an opposite end of the ceramic capacitor body inwardly. The active electrode layer includes side shields to provide additional shielding. | 11-29-2012 |
20130081240 | METHOD OF MANUFACTURING COMPLIMENTARY METAL-INSULATOR-METAL (MIM) CAPACITORS - A low capacitance density, high voltage MIM capacitor and the high density MIM capacitor and a method of manufacture are provided. The method includes depositing a plurality of plates and a plurality of dielectric layers interleaved with one another. The method further includes etching a portion of an uppermost plate of the plurality of plates while protecting other portions of the uppermost plate. The protected other portions of the uppermost plate forms a top plate of a first metal-insulator-metal (MIM) capacitor and the etching exposes a top plate of a second MIM capacitor. | 04-04-2013 |
20130298364 | CLAD FIBER CAPACITOR AND METHOD OF MAKING SAME - A clad capacitor and method of manufacture includes assembling a preform comprising a ductile, electrically conductive fiber; a ductile, electrically insulating cladding positioned on the fiber; and a ductile, electrically conductive sleeve positioned over the cladding. One or more preforms are then bundled, heated and drawn along a longitudinal axis to decrease the diameter of the ductile components of the preform and fuse the preform into a unitized strand. | 11-14-2013 |
20140068905 | CAPACITOR PRODUCING METHOD, CAPACITOR PRODUCING DEVICE, AND CAPACITOR PRODUCING PROGRAM - In a capacitor producing method, a bottom electrode, a thin-film dielectric, and a top electrode are deposited on a substrate so as to form a capacitor, wherein defects including particles and electrical short-circuits between the bottom electrode and the top electrode are detected before the capacitor is divided into capacitor cells. Next, defects such as particles and electrical short-circuits between the bottom electrode and the top electrode are removed before the capacitor is divided into capacitor cells. | 03-13-2014 |
20140189990 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions. | 07-10-2014 |
20140230210 | High Capacitance Multilayer with High Voltage Capability - New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case. These designs are compared to the prior art in examples below. | 08-21-2014 |
20140317897 | MULTILAYER CERAMIC CONDENSER AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other. | 10-30-2014 |
20140373324 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes a plurality of holes. An average opening diameter of the plurality of holes is not greater than about 2.5 μm. Some or all of the plurality of holes are embedded with the metal component of the outer external electrode. | 12-25-2014 |
20150107071 | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR ELECTRONIC COMPONENT - A manufacturing method for an electronic component forms with a high degree of accuracy a portion of an outer electrode on a main surface of a dielectric block. Light irradiated from a second main surface side is detected by a detector disposed on a first main surface side, thereby detecting the positions of first and second inner electrodes, and a conductive layer is formed in a portion on a first main surface, determined based on the detection result by the detector, thereby forming first portions of individual first and second outer electrodes. | 04-23-2015 |
20150310990 | MULTILAYER CERAMIC CAPACITOR - Aspects of a method of manufacturing a capacitor are provided. The method includes layering a plurality of dielectric plates. The plurality of dielectric plates includes a first dielectric plate having a first conductive region and a second conductive region on a surface of the first dielectric plate. The method further includes forming an inner electrode through an axis of the layered plurality of dielectric plates. The inner electrode electrically couples to the first conductive region on the surface of the first dielectric plate. The method further includes forming an outer electrode, where the outer electrode electrically couples to the second conductive region on the surface of the first dielectric plate. | 10-29-2015 |
20150310992 | STRUCTURE COMPRISING MULTIPLE CAPACITORS AND METHODS FOR FORMING THE STRUCTURE - Capacitors, apparatus including a capacitor, and methods for forming a capacitor are provided. One such capacitor may include a first conductor a second conductor above the first conductor, and a dielectric between the first conductor and the second conductor. The dielectric does not cover a portion of the first conductor; and the second conductor does not cover the portion of the first conductor not covered by the dielectric. | 10-29-2015 |
20160055977 | CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR - A capacitor includes: dielectric layers including a first dielectric layer, a second dielectric layer, and at least one intermediate dielectric layer laminated between the first dielectric layer and the second dielectric layer; first interlayer electrode and second interlayer electrode arranged alternately with each other between at least two layers among the dielectric layers; a first external electrode disposed on lateral surfaces of the dielectric layers and coupled to the first interlayer electrode; and a second external electrode disposed on lateral surfaces of the dielectric layers and coupled to the second interlayer electrode, wherein the intermediate dielectric layer includes first internal electrodes coupled to the first interlayer electrode, arranged in a plane direction of the intermediate dielectric layer and spaced apart from each other, and second internal electrodes coupled to the second interlayer electrode, arranged alternately with the first internal electrodes and spaced apart from the first internal electrodes. | 02-25-2016 |
20160071650 | Leadless Multi-Layered Ceramic Capacitor Stacks - A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode. | 03-10-2016 |
20160141116 | METAL POWDER, ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME - There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle. | 05-19-2016 |