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PIEZOELECTRIC DEVICE MAKING

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029 - Metal working

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DocumentTitleDate
20090249599GAS SENSOR MANUFACTURING PROCESS - A surface acoustic wave gas sensor, in particular a vacuum or hydrogen sensor, includes a piezoelectric substrate (10-08-2009
20090193636CERAMIC MULTI-LAYER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50 N.08-06-2009
20090193635METHOD FOR PRODUCING PIEZOELECTRIC ACTUATOR AND METHOD FOR PRODUCING LIQUID TRANSPORT APPARATUS - A vibration layer is formed by the AD method on a cavity plate before forming pressure chambers, a common electrode is formed on the vibration layer, and a piezoelectric layer is formed on the common electrode by the AD method. Subsequently, the pressure chambers are formed in the cavity plate by the etching. After that, individual electrodes are formed on the piezoelectric layer. Subsequently, the stack of the cavity plate, the vibration layer, the common electrode, the piezoelectric layer, and the individual electrodes is heated at about 850° C. to simultaneously perform the annealing of the piezoelectric layer and the sintering of the individual electrodes and the common electrode. Accordingly, the atoms of the cavity plate are suppressed from being diffused into the driving portions of the piezoelectric layer.08-06-2009
20110191997MICROMACHINED PIEZOELECTRIC ULTRASOUND TRANSDUCER ARRAYS - A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).08-11-2011
20110191996Method for manufacturing quartz crystal resonator, quartz crystal unit and quartz crystal oscillator - A method for manufacturing a quartz crystal unit comprises the steps of disposing at least one metal film on each of two opposite surfaces of a quartz crystal wafer, disposing a resist on the at least one metal film, etching the quartz crystal wafer to form a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, forming an electrode on each of two opposite side surfaces of each of the first and second quartz crystal tuning fork tines so that the quartz crystal tuning fork resonator vibrates in a flexural mode of an inverse phase, removing the resist disposed on the at least one metal film before the forming step of the electrode, mounting the quartz crystal tuning fork resonator on a mounting portion of a case by a conductive adhesive or a solder, and adjusting an oscillation frequency of the quartz crystal tuning fork resonator after the mounting step.08-11-2011
20110191995Method for manufacturing piezoeletric resonator - To provide a method for manufacturing a piezoelectric resonator which can conduct frequency matching with high reliability when performing rough adjustment of the frequency by adjusting the shape of a piezoelectric oscillating piece before forming an electrode film, and thereby it becomes possible to avoid reduction of the yield. Etching for forming the shape of a piezoelectric oscillating piece, and etching for forming grooves are conducted simultaneously, and after forming the grooves, the shape formation of the piezoelectric oscillating piece is started again from the same depth as the groove in a state of covering the groove with a metal film, and after the shape formation, matching of frequency is conducted by etching the side surface of the piezoelectric oscillating piece in succession. By composing such a structure, it is possible to conduct rough adjustment of frequency at a low etching rate so that the frequency matching can be performed with no due difficulty and with high accuracy.08-11-2011
20100071180PIEZOELECTRIC ELEMENT, DROPLET-EJECTING HEAD, DROPLET-EJECTING APPARATUS, AND METHOD OF PRODUCING A PIEZOELECTRIC ELEMENT - The present invention provides a piezoelectric element including a piezoelectric body and top and bottom electrodes holding the piezoelectric body therebetween, wherein an interlayer dielectric is interposed between the piezoelectric body and the top electrode in an area other than the active area of the piezoelectric body, and the top electrode is layered directly on the piezoelectric body in the active area of the piezoelectric body.03-25-2010
20100146756PIEZOELECTRIC ACTUATOR INKJET HEAD AND METHOD OF FORMING THE SAME - A piezoelectric actuator of an inkjet head and a method of forming the piezoelectric actuator. The piezoelectric actuator is formed on a vibration plate to provide a driving force to each of a plurality of pressure chambers. The piezoelectric actuator includes a lower electrode formed on the vibration plate, a piezoelectric layer formed on the lower electrode at a position corresponding to each of the pressure chambers, a supporting pad formed on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, and an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad. The upper electrode is bonded to a driving circuit above the supporting pad to receive a voltage from the driving circuit. The piezoelectric layer may have substantially the same length as the pressure chamber. The supporting pad may be formed of a photosensitive polymer and may have substantially the same height as the piezoelectric layer. The upper electrode may include a first portion formed on the piezoelectric layer and a second portion formed on the supporting pad, and the second portion may be wider than the first portion.06-17-2010
20130074300PROCESS FOR PRODUCING AN ACTUATOR HAVING A STACK OF ALTERNATING INTERMEDIATE ELECTRODE LAYERS AND PIEZOELECTRIC MATERIAL LAYERS - A process for producing an actuator configured to generate powerful ultrasonic waves and that includes a stack of alternating intermediate electrode layers and piezoelectric material layers. The method includes: forming an initial stack of alternating intermediate electrode layers and piezoelectric material layers, each end of the stack being a piezoelectric material layer or an intermediate electrode layer; firmly attaching adjacent layers to one another; cutting the initial stack into elementary blocks; and connecting the intermediate electrode layers together, in each elementary block.03-28-2013
20130081239METHOD OF MANUFACTURING ACTUATOR FOR MICRO EJECTOR - There is provided a method of manufacturing an actuator for a micro ejector. The method of manufacturing an actuator for a micro ejector may include: forming grooves in a first surface of a piezoelectric element; attaching the first surface of the piezoelectric element to a substrate; and machining a second surface of the piezoelectric element.04-04-2013
20120174360Method for Manufacturing Piezoelectric Vibration Device - A method for manufacturing a piezoelectric vibration device wherein a substrate is prepared, and a piezoelectric resonator element is mounted on the substrate. Before or after a packaging member is joined to the substrate, the piezoelectric resonator element is exposed to an environment at a higher temperature than ambient temperature and a higher humidity than ambient humidity, and then an electrical property is measured to detect attachment of dust and/or foreign matter according to a variation of the electrical property.07-12-2012
20100043191METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE AND SURFACE ACOUSTIC WAVE DEVICE - A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the piezoelectric substrate from the one principal surface of the piezoelectric substrate, thereby forming a recessed portion including the bottom surface in which the IDT electrodes are embedded, and a step of bonding a cover member to the piezoelectric substrate.02-25-2010
20100043189Method for Manufacturing Surface Acoustic Wave Apparatus - Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.02-25-2010
20100043190ULTRASOUND PROBE AND PRODUCTION METHOD OF THE SAME - An ultrasound probe comprising a transmitting piezoelectric layer, an electrode layer and a receiving piezoelectric layer laminated in that order, the ultrasound probe transmitting and receiving an ultrasound, wherein a polarization treatment on the receiving piezoelectric layer is carried out by providing a peelable dielectric layer on the receiving piezoelectric layer.02-25-2010
20090158566Temperature Stable MEMS Resonator - One embodiment of the present invention sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with oxide. By growing oxide within the slots, the amount of oxide growth on the outside surfaces of the MEMS resonator may be reduced. Furthermore, by situating the slots in the areas of large flexural stresses, the contribution of the embedded oxide to the overall TCF of the MEMS resonator is increased, and the total amount of oxide needed to decrease the overall TCF of the MEMS resonator to a particular target value is reduced. As a result, the TCF of the MEMS resonator may be reduced in a manner that is more effective relative to prior art approaches.06-25-2009
20100107390Multilayer Piezoelectric Device and Method for Manufacturing the Same - A multilayer piezoelectric device including a body having internal electrode layers and piezoelectric ceramic layers alternately stacked. The internal electrode layers contain Cu as a major component, the piezoelectric ceramic layers contain a compound oxide represented by Pb(Ti, Zr)O05-06-2010
20100107389METHOD OF FABRICATING AN ELECTRODE FOR A BULK ACOUSTIC RESONATOR - In one embodiment, a method of producing a resonator in thin-film technology is described. The resonator comprises a piezoelectric layer arranged at least partially between a lower electrode and an upper electrode, the resonator being formed over a substrate. The method comprises: forming the lower electrode of the resonator over the substrate; depositing and patterning an insulating layer over the substrate, the insulating layer comprising a thickness substantially equal to a thickness of the lower electrode; removing a portion of the insulating layer to partially expose a surface of the lower electrode; removing a portion of the insulating layer over the surface of the lower electrode by chemical mechanical polishing; forming the piezoelectric layer over the lower electrode; and producing the upper electrode on the piezoelectric layer.05-06-2010
20100107388METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method for manufacturing an electronic device, an ion implantation layer is formed at a desired depth from one principal surface of a piezoelectric single crystal substrate by implanting hydrogen ions into the piezoelectric single crystal substrate under desired conditions. The piezoelectric single crystal substrate in which the ion implantation layer has been formed is bonded to a supporting substrate, and a piezoelectric thin film is then formed by the application of heat using the ion implantation layer as a detaching interface. This heated detachment is performed at a reduced pressure less than atmospheric pressure and at a heating temperature determined in accordance with the reduced pressure.05-06-2010
20100107387Bulk acoustic wave resonator, filter and duplexer and methods of making same - A resonator having a membrane formed of a piezoelectric layer sandwiched between first and second electrode is suspended above a cavity formed from the back surface of the support structure. In one embodiment, the cavity walls are substantially perpendicular to the back surface. In another embodiment, the first electrode is formed in the cavity such that it is electrically connected to an electrode on the back surface of the support structure. In yet another embodiment, the cavity is formed via an etch through via holes in the back surface of the support structure, which leads to greater flexibility in designing a method of manufacture while reducing the need for alignment relative to other designs.05-06-2010
20100071179METHOD FOR PRODUCING CYRSTALLOGRAPHICALLY ORIENTED CERAMIC - A method for producing a piezoelectric/electrostrictive body 03-25-2010
20120180276MANUFACTURING METHOD OF INKJET HEAD - A manufacturing method of an inkjet head including, forming an insulating layer which is compact compared to a piezoelectric member with respect to a region other than a driving unit which ejects ink, in the piezoelectric member, and forming an electrode for applying a driving voltage to the driving unit, by performing electroless plating with respect to the driving unit and the insulating layer.07-19-2012
20100325855COMPOSITE PASSIVE MATERIALS FOR ULTRASOUND TRANSDUCERS - Provided herein are composite passive layers for ultrasound transducers having acoustic properties that can be easily tailored to the needs of the transducer application using current microfabrication techniques. In an embodiment, a passive layer comprises metal posts embedded in a polymer matrix or other material. The acoustic properties of the passive layer depend on the metal/polymer volume fraction of the passive layer, which can be easily controlled using current microfabrication techniques, e.g., integrated circuit (IC) fabrication techniques. Further, the embedded metal posts provide electrical conduction through the passive layer allowing electrical connections to be made to an active element, e.g., piezoelectric element, of the transducer through the passive layer. Because the embedded metal posts conduct along one line of direction, they can be used to provide separate electrical connections to different active elements in a transducer array through the passive layer.12-30-2010
20090307885PIEZOELECTRIC FILM POLING METHOD AND PIEZOELECTRIC ELEMENT STRUCTURE MANUFACTURING METHOD - A piezoelectric film poling method in which, with respect to an unpoled piezoelectric film formed on a substrate by a vapor phase growth method and having a Curie point Tc not higher than 300° C., an electric field greater than a coercive electric field of the film is applied in a predetermined direction under a temperature condition not higher than 0° C. to orient spontaneous polarization of the film in the predetermined direction.12-17-2009
20090307884Resonator system with a plurality of individual mechanically coupled resonators and method of making same - A method of fabricating a MEMS piezoelectric resonator system includes forming a stack of layers on a substrate, the stack comprising at least one piezoelectric material layer spaced from the substrate by a sacrificial layer, patterning the stack to form a plurality of edge coupled resonators, and removing at least a portion of the sacrificial layer to suspend the resonators relative to the substrate.12-17-2009
20090113686Piezoelectric Actuator, Ink-Jet Head Provided with the Same, Ink-Jet Printer, and Method for Manufacturing Piezoelectric Actuator - A piezoelectric actuator includes a metallic vibration plate, an insulating layer, a plurality of individual electrodes, a piezoelectric layer and a common electrode. The insulating layer is formed on the top surface of the vibration plate. The individual electrodes are formed on the top surface of the insulating layer. The piezoelectric layer is formed on the top surfaces of the individual electrodes. The common electrode is formed on the top surface of the piezoelectric layer over the individual electrodes. A plurality of terminals and a plurality of wirings are formed on the top surface of the insulating layer. Each of the terminals is associated with one of the individual electrodes. Each of the wirings connects one of the individual electrodes and the associated terminal.05-07-2009
20120216378METHOD AND SYSTEM FOR PROVIDING A PIEZOELECTRIC MULTILAYER - A method and system for fabricating a piezoelectric multilayer are described. The method and system include providing conductive layers. Alternating conductive layers are electrically connected. A first plurality of alternating conductive layers is electrically isolated from a second plurality of alternating conductive layers. Piezoelectric layers are interleaved with the conductive layers. Apertures are provided in the piezoelectric layers. A first conductive plug electrically connects the first plurality of alternating conductive layers, includes a first plurality of segments, and is in apertures in the piezoelectric layers. Each of the first plurality of segments extends through one of the piezoelectric layers. A second conductive plug electrically connects the second plurality of alternating conductive layers, includes a second plurality of segments, and is in a second portion of the plurality of apertures. Each of the second plurality of segments extends through one of the plurality of piezoelectric layers.08-30-2012
20100269320TUNING FORK RESONATOR ELEMENT AND TUNING FORK RESONATOR - A tuning fork resonator element that has a base portion, first and second resonating arms extending from the base portion in a first direction, and a support frame sandwiching the first and second resonating arms and being connected to the base portion includes: a first excitation electrode, formed in an area close to a connection portion with the base portion of the support frame, being connected to a mount electrode with a conductive adhesive; a second excitation electrode, formed in at least one of an area sandwiching the first and second resonating arms of the support frame and an area positioned farther than the first and second resonating arms in the first direction, being connected to a mount electrode with the conductive adhesive; and a cut portion of the support frame formed on an external surface of the support frame.10-28-2010
20100269319METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE - A method for manufacturing a surface acoustic wave device includes a substrate thickness reduction step of reducing the thickness of a piezoelectric substrate by machining a principal surface of the piezoelectric substrate, and a bonding step of bonding a support substrate having a smaller coefficient of linear expansion than the piezoelectric substrate through a resin adhesive layer to the piezoelectric substrate the thickness of which is reduced.10-28-2010
20090271964PIEZOELECTRIC ACTUATOR, METHOD OF MANUFACTURING SAME, AND LIQUID EJECTION HEAD - The piezoelectric actuator comprises: a supporting substrate; a thermal stress controlling layer which is formed on the supporting substrate; and a piezoelectric body which is formed as a film onto the thermal stress controlling layer on the supporting substrate at a higher temperature than room temperature, wherein the thermal stress controlling layer reduces a film stress induced by formation of the piezoelectric body.11-05-2009
20090271962Electronic device and method of making same - The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 11-05-2009
20090056094Piezoelectric composite nanofibers, nanotubes, nanojunctions and nanotrees - Piezoelectric nanostructures, including nanofibers, nanotubes, nanojunctions and nanotrees, may be made of piezoelectric materials alone, or as composites of piezoelectric materials and electrically-conductive materials. Homogeneous or composite nanofibers and nanotubes may be fabricated by electrospinning. Homogeneous or composite nanotubes, nanojunctions and nanotrees may be fabricated by template-assisted processes in which colloidal suspensions and/or modified sol-gels of the desired materials are deposited sequentially into the pores of a template. The electrospinning or template-assisted fabrication methods may employ a modified sol-gel process for obtaining a perovskite phase in the piezoelectric material at a low annealing temperature.03-05-2009
20110010904Method for Manufacturing a Piezoelectric Ceramic Body - The present invention relates to a method of manufacturing a piezoelectric ceramic body and devices therefrom. The method comprises mixing a piezoelectric ceramic powder with a polymer binder and surfactant to form a slip mixture, casting the slip mixture into a mold and setting to the slip mixture in the mold to form a green body, cutting the green body to form a cut green body with an array of micron-sized ceramic elements and separation, and sintering the cut green body to form a sintered ceramic body. The sintered ceramic body can be further process to encasing in a polymer material to form a piezoelectric ceramic-polymer composite. The piezoelectric ceramic-polymer composite can be further processed to form devices such as acoustic transducers and sensors.01-20-2011
20130061438PIEZOELECTRIC SPEAKER AND METHOD OF MANUFACTURING THE SAME - In a piezoelectric speaker, an acoustic diaphragm is thicker than a piezoelectric thin film and is formed of a more flexible and higher elasticity material than the piezoelectric thin film, thereby greatly improving output sound pressure in a low frequency band and reducing sound distortion. Further, the piezoelectric thin film is attached to the acoustic diaphragm in an inclined structure in which the piezoelectric thin film is horizontally turned from the acoustic diaphragm, thereby preventing a standing wave from being created by structural symmetry and minimizing sound distortion.03-14-2013
20090235502OSCILLATOR DEVICE, OPTICAL DEFLECTOR AND OPTICAL INSTRUMENT USING THE SAME - An oscillator device and a method of producing the same, that enables adjustment of an inertia moment or a gravity center position of an oscillating member through wide range and at high speed, wherein the oscillating member oscillates about an oscillation axis 09-24-2009
20090235501SYSTEMS AND METHODS OF A TRANSDUCER HAVING A PLASTIC MATCHING LAYER - Systems and methods of a transducer having a plastic matching layer. At least some of the illustrative embodiments are methods including providing a transducer housing having a proximal end and a distal end, and bonding a plastic to the distal end of the transducer housing (the plastic fluidly sealing and occluding the distal end). The bonding further includes inserting a cylinder comprising a mold-release chemical into the transducer housing, bonding plastic onto the distal end of the transducer housing, and removing the cylinder when the plastic has hardened.09-24-2009
20090235500Lithium niobate wafers with narrow distribution of surface acoustic wave properties - A method is provided of growing crystals from compounds that melt congruently with negligible volatilization. The composition of one or more crystal samples is measured. A determination is made of a deviation of crystal composition from congruency. A determination is made of an initial melt composition and a source material composition correction relative to the deviation. Crystals are grown using the composition correction to yield reproducible material for surface acoustic substrate manufacturing.09-24-2009
20100088868METHOD FOR MANUFACTURING COMPOSITE PIEZOELECTRIC SUBSTRATE - A method for manufacturing a composite piezoelectric substrate is capable of forming an ultra-thin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. A piezoelectric substrate and a supporting substrate are prepared, ions are implanted from a surface of the piezoelectric substrate to form a defective layer in a region at a predetermined depth from the surface of the piezoelectric substrate, impurities that are adhered to at least one of the surface of the piezoelectric substrate in which the defective layer is formed and a surface of the supporting substrate are removed to directly expose the constituent atoms of the surfaces and to activate the surfaces, the supporting substrate is bonded to the surface of the piezoelectric substrate to form a bonded substrate body, the bonded substrate body is separated at the defective layer formed in the piezoelectric substrate so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form a composite piezoelectric substrate, and the surface of the separation layer of the composite piezoelectric substrate is smoothed.04-15-2010
20080295309Multi-nozzle ink jet head and manufacturing method thereof - A multi-nozzle ink jet head using piezoelectric elements and a manufacturing method thereof are disclosed. A head (12-04-2008
20110107569Large-Scale Lateral Nanowire Arrays Nanogenerators - In a method of making a generating device, a plurality of spaced apart elongated seed members are deposited onto a surface of a flexible non-conductive substrate. An elongated conductive layer is applied to a top surface and a first side of each seed member, thereby leaving an exposed second side opposite the first side. A plurality of elongated piezoelectric nanostructures is grown laterally from the second side of each seed layer. A second conductive material is deposited onto the substrate adjacent each elongated first conductive layer so as to be coupled the distal end of each of the plurality of elongated piezoelectric nanostructures. The second conductive material is selected so as to form a Schottky barrier between the second conductive material and the distal end of each of the plurality of elongated piezoelectric nanostructures and so as to form an electrical contact with the first conductive layer.05-12-2011
20120284979ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.11-15-2012
20110277286METHODS FOR WAFER LEVEL TRIMMING OF ACOUSTICALLY COUPLED RESONATOR FILTER - In one aspect of the present invention, a method of manufacturing an acoustically coupled device includes the steps of providing a substrate; forming a sacrificial layer in or on a selected portion of the substrate; forming a first resonator on the sacrificial layer such that the first resonator has an edge portion extending onto the substrate; trimming the first resonator to a targeted frequency value within a desired tolerance; forming an acoustic decoupler on the first resonator; forming a second resonator on the acoustic decoupler; removing the sacrificial layer to form an air cavity beneath the bottom surface of the first resonator; and trimming the second resonator to achieve a desired device performance.11-17-2011
20100132176METHOD OF FORMING THICK LAYER BY SCREEN PRINTING AND METHOD OF FORMING PIEZOELECTRIC ACTUATOR OF INKJET HEAD - A method to form a thick layer by screen printing and a method to form a piezoelectric actuator of an inkjet head. The method to form the thick layer including forming a guide groove in a surface to a predetermined depth, and forming the thick layer by applying a material to the surface inside the guide groove through screen printing. The method to form the piezoelectric actuator including forming an insulating layer on a top surface of a vibration plate and forming a guide groove in the top surface of the vibration plate or an insulating layer to a predetermined depth at a position corresponding to each of a plurality of pressure chambers, forming a lower electrode on the top surface of the insulating layer; forming a piezoelectric layer inside the guide groove by screen printing, and forming an upper electrode on a top surface of the piezoelectric layer.06-03-2010
20090199380METHOD AND MECHANISM OF PZT MICRO-ACTUATOR ATTACHMENT FOR THE HARD DISK DRIVER ARM - A fixture with a shaped molding may hold a first micro-actuator part and a second micro-actuator part in place for coupling while maintaining the structure of the first micro-actuator part. The first micro-actuator part and the second micro-actuator part may be a frame or a strip of piezoelectric material. A vacuum nozzle system embedded in the fixture may hold the first micro-actuator part in place. A mobile vacuum nozzle system may hold the second micro-actuator in place and positions the second micro-actuator part relative to the first micro-actuator part. A camera system may monitor the process. A dispense may apply epoxy between the first and second micro-actuator part. An ultraviolet source may provide ultraviolet radiation for curing.08-13-2009
20090271963Piezoelectric actuator and manufacturing method thereof, magnetic disk apparatus - A piezoelectric actuator comprises a body of a piezoelectric material, electrode patterns embedded in the body, and a sidewall protective film of a piezoelectric material covering at least a sidewall surface of the body, the sidewall protective film covering the electrode patterns at the sidewall surface of the body.11-05-2009
20110289744METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT - There is disclosed a method of manufacturing a piezoelectric element including a step of preparing a green sheet A including a portion which becomes a fired piezoelectric body later, by use of a piezoelectric material; a step of joining, to at least one surface of the green sheet A, a green sheet B having an opening in a portion facing the portion which becomes the fired piezoelectric body later, followed by firing to obtain the fired piezoelectric body provided with a reinforcing plate to which the reinforcing plate formed owing to the firing of the green sheet B is attached; and a step of forming a film-like electrode in a portion obtained by the firing of the green sheet A in the fired piezoelectric body provided with the reinforcing plate.12-01-2011
20110214265Piezoelectric component and manufacturing method thereof - An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.09-08-2011
20110214263METHOD OF MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a package manufacturing method capable of hot-molding a substrate into a desired shape, and a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A molding step is a step in which in a penetration hole forming step, through-holes are formed by pressing and heating a base substrate wafer with a through-hole forming mold having convex portions corresponding to the through-holes. The through-hole forming mold is formed of a material having an open porosity equal to or larger than 14%.09-08-2011
20110214264PIEZOELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME - A piezoelectronic device and a method of fabricating the same are disclosed. The piezoelectronic device of the present invention comprises: a plurality of carbon nanotubes; at least one piezoceramic layer covering the plurality of carbon nanotubes; and a supporting material for supporting the carbon nanotubes and disposed between the carbon nanotubes, the supporting layer being coated with at least one piezoceramic layer, wherein the plurality of carbon nanotubes is arranged in a comb-shape. The piezoelectronic device of the present invention is advantageous in having excellent elasticity (durability) and excellent piezoelectronical property. The induced current obtained from the piezoelectronic device of the present invention is about 1.5 μA or above as well as induced voltage being over 1V when the size of the piezoelectronic block is 2.5 mm×1 mm×1 mm (length×width×height).09-08-2011
20090205179METHOD OF FABRICATING PIEZOELECTRIC VIBRATION PIECE, PIEZOELECTRIC VIBRATING PIECE, WAFER, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE - To carry out frequency adjustment easily, accurately and efficiently without being influenced by a size of a piezoelectric vibrating piece and achieve low cost formation and promotion of maintenance performance, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating piece having a piezoelectric vibrating plate 08-20-2009
20120096697METHOD OF FORMING ACOUSTIC RESONATOR USING INTERVENING SEED LAYER - A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.04-26-2012
20080244884Method for Forming Ceramic Thick Film Element Arrays with Fine Feature Size, High-Precision Definition, and/or High Aspect Ratios - A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.10-09-2008
20100263182PIEZOELECTRIC TACTILE SENSOR - A piezoelectric tactile sensor comprises a piezoelectric membrane with a top surface, a transducer of elastic column with a bottom end surface to overlay over the top surface of the piezoelectric membrane and plural microelectrodes being sandwiched between the top surface of the piezoelectric membrane and the bottom end surface of the transducer in spread manner. When the transducer is subjected to an external stress, the piezoelectric membrane will generate uneven stress distribution to initiate dispersed microelectrodes output a corresponding induced voltage signal for being analyzed to figure out the direction and magnitude of the external stress.10-21-2010
20100263181ROLLED ELECTROACTIVE POLYMERS - The invention describes rolled electroactive polymer devices. The invention also describes employment of these devices in a wide array of applications and methods for their fabrication. A rolled electroactive polymer device converts between electrical and mechanical energy; and includes a rolled electroactive polymer and at least two electrodes to provide the mechanical/electrical energy conversion. Prestrain is typically applied to the polymer. In one embodiment, a rolled electroactive polymer device employs a mechanism, such as a spring, that provides a force to prestrain the polymer. Since prestrain improves mechanical/electrical energy conversion for many electroactive polymers, the mechanism thus improves performance of the rolled electroactive polymer device.10-21-2010
20120023720PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.02-02-2012
20120023719MANUFACTURING METHOD FOR A ZINC OXIDE PIEZOELECTRIC THIN-FILM WITH HIGH C-AXIS ORIENTATION - A manufacturing method for a Zinc Oxide (ZnO) piezoelectric thin-film with high C-axis orientation comprises the steps of providing a substrate having a base, a SiO02-02-2012
20090276990Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator - A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.11-12-2009
20100077581Process for producing piezoelectric ceramic devices - An improved process for producing a piezoelectric ceramic device is disclosed, wherein the process includes the following steps: securing a metal plate in a mold cavity body by maintaining a binding area on a top surface of the metal plate, and that the top surface other than the binding area is enveloped, confined and secured; coating a metal paste on the binding area; placing a piezoelectric ceramic powder on the metal paste; pressing a pressing pillar on the piezoelectric ceramic powder; securing the pressing pillar in position; heating the mold cavity body so as to sinter the piezoelectric ceramic powder as a sintered body, and heating the mold cavity body so as to treat the sintered body to become a not-yet polarized piezoelectric ceramic sheet. Therefore, the same mold is employed for the piezoelectric ceramic powder sintering, the heat treatment, and the positioning and binding to the metal plate.04-01-2010
20090144955ULTRASOUND RADIATING MEMBERS FOR CATHETER - A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into the slab. The method further comprises making a plurality of cuts through the top surface and into the slab. The cuts form a plurality of polygons that are generally centered about one of the holes. The method further comprises plating the slab with an electrically conductive material. The method further comprises removing the electrically conductive material from the top surface of the slab. The method further comprises cutting the slab substantially parallel to the top surface.06-11-2009
20090144956PIEZOELECTRIC VIBRATOR AND METHOD OF FABRICATING PIEZOELECTRIC VIBRATOR, AND OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO WAVE TIMEPIECE HAVING PIEZOELECTRIC VIBRATOR - To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 06-11-2009
20080209703Piezoelectric vibrators, piezoelectric devices comprising same, and methods for producing same - Processes are disclosed for making piezoelectric vibrators, particularly those having a tuning-fork configuration. An exemplary process includes preparing a flat plate of piezoelectric crystal material exhibiting anisotropic etching properties. A corrosion-resistant film is formed on both major surfaces of the piezoelectric material. A first coating of photoresist is formed on the surfaces of the corrosion-resistant film. A lithographic exposure is performed of the pattern of a piezoelectric vibrating device on only one side of the piezoelectric plate. Then, the corrosion-resistant film, appearing unprotected on the one surface, is removed after developing the photoresist. A first etching is performed of the piezoelectric material appearing unprotected after removal of the corrosion-resistant film.09-04-2008
20080307623Method of manufacturing an ultrasonic sensor - A method of manufacturing an ultrasonic sensor including a case, a piezoelectric element having first and second electrodes, and a conductive member having first and second conductive parts is disclosed. The method includes the steps of a) forming the conductive member by integrally forming the first and second conductive parts and a joining part that joins portions of the first and second conductive parts, b) mounting the piezoelectric element and the conductive member in the case so that the first conductive part is connected to the first electrode and the second conductive part is connected to the second electrode, and the joining part and the portions of the first and second conductive parts joined by the joining part are positioned outside of the case, c) supplying a filling material into the case, and d) removing the joining part after step c).12-18-2008
20090119896MULTILAYERED PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING THE SAME - A multilayered piezoelectric element in which braking to displacement of piezoelectric material layers is suppressed and insulating films suitable for thinning of the piezoelectric material layers are formed. A method of manufacturing the element includes the steps of: (a) forming a multilayered structure including piezoelectric material layers, at least one first electrode layer, and at least one second electrode layer; (b) discharging a liquid synthetic resin from a nozzle provided in a dispenser to apply it to an end portion of the first electrode layer in a first region within side surfaces of the multilayered structure and curing the liquid synthetic resin to form a first insulating film; and (c) discharging the liquid synthetic resin from the nozzle to apply it to an end portion of the second electrode layer in a second region and curing the liquid synthetic resin to form a second insulating film.05-14-2009
20110203083PIEZOELECTRIC VIBRATING PIECES COMPRISING EDGE MESA STEPS, AND METHODS FOR MANUFACTURING SAME - An exemplary method for a producing a piezoelectric vibrating piece having at least one mesa step includes forming a metal film on a main surface of a piezoelectric wafer. A through-groove is formed through the thickness of the wafer to form a plan profile of a desired piezoelectric substrate. A film of photoresist is formed on the surface of the metal film. A resist is applied, exposed, and formed into a resist pattern that defines a first mesa step along at least a portion of the plan profile. In regions not protected by the metal film, the piezoelectric substrate is etched to a defined depth to form a mesa step. The denuded edge surface of the metal film is edge-etched. A second mesa step, inboard of the first mesa step, can be formed by repeating the edge-etching and substrate-etching steps using the metal film as an etch protective film.08-25-2011
20080216297PIEZOELECTRIC ACTUATOR, METHOD OF MANUFACTURING PIEZOELECTRIC ACTUATOR, AND LIQUID EJECTION HEAD - The piezoelectric actuator comprises: a substrate; a constraint force buffering layer which is formed on the substrate and made of a hardness control material having low hardness; and a piezoelectric element which is formed directly on the constraint force buffering layer.09-11-2008
20100275423SYSTEM FOR PRELOADING PIEZOELECTRIC ACTUATORS AND METHOD - A system for preloading piezoelectric actuators includes a fixture, a preloading mechanism configured to apply a mechanical force to a piezoelectric element supported by the fixture, and a sensor configured to sense an electrical property induced by the mechanical force in an electrical circuit having the piezoelectric element therein. A control device is coupled with the sensor and configured to generate a signal based on the sensed electrical property. A method of setting or testing preload includes applying a mechanical force to a piezoelectric element, and correlating an electrical property induced by the mechanical force with a magnitude of the mechanical force. Closed loop control allows preload to be set highly accurately.11-04-2010
20100005638RECESS-PROTRUSION STRUCTURE BODY, PROCESS FOR PRODUCING THE SAME, PIEZOELECTRIC DEVICE, AND INK JET RECORDING HEAD - In a step (A), a selectively removable resist layer or a selectively removable sacrifice layer is formed in a predetermined pattern in a protrusion non-forming region on a base plate. In a step (B), a pillar-shaped structure film is formed on a side of the base plate, on which side the resist layer or the sacrifice layer has been formed in the predetermined pattern. The pillar-shaped structure film contains a plurality of pillar-shaped bodies, each of which extends in a direction nonparallel with a base plate surface of the base plate. In a step (C), the resist layer or the sacrifice layer, and a region of the pillar-shaped structure film, which region is located on the resist layer or the sacrifice layer, are removed by use of a lift-off technique. At least one protruding region, which contains the pillar-shaped bodies, is thus formed.01-14-2010
20090038131Method for manufacturing quartz crystal resonator, quartz crystal unit and quartz crystal oscillator - A quartz crystal unit comprises a quartz crystal tuning fork resonator capable of vibrating in a flexural mode of an inverse phase and having at least one groove having at least one stepped portion formed in at least one of opposite main surfaces of each of first and second quartz crystal tuning fork tines. An electrode is disposed on the at least one stepped portion of the at least one groove so that the electrode of the first quartz crystal tuning fork tine has an electrical polarity opposite to an electrical polarity of the electrode of the second quartz crystal tuning fork tine. The quartz crystal unit comprising the quartz crystal tuning fork resonator has a capacitance ratio r02-12-2009
20090038130Method for manufacturing a piezoelectric actuator - A method for manufacturing a piezoelectric actuator, the method comprising: co-extruding alternating strips of a high permittivity material and a low permittivity material to form a green tape comprising said alternating strips of said high permittivity material and said low permittivity material; cutting said green tape to form a plurality of sheets, each sheet comprising a high permittivity region and at least two low permittivity regions adjacent to the high permittivity region; applying at least one conductive region to each one of two or more of the sheets to overly the high permittivity region and to leave exposed at least one low permittivity region; and stacking a plurality of sheets to form an actuator stack comprising adjacent sheets, wherein the or each conductive region on each sheet is offset with respect to a conductive region on a different sheet within the actuator stack.02-12-2009
20130212848Method for Monitoring Flexural Vibrations of a Piezoactuator - In the method for monitoring flexural vibrations of a piezoactuator, a small-signal spectrum of a piezoactuator, which is provided and mounted for the purpose of exciting longitudinal vibrations, is measured and an excitation of a transverse vibration in the piezoactuator is detected from resonances occurring in the small-signal spectrum.08-22-2013
20090265903Coupled Resonator Device and Method for Manufacturing a Coupled Resonator Device - A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.10-29-2009
20090265904METHOD FOR MANUFACTURING BOUNDARY ACOUSTIC WAVE DEVICE - A method for manufacturing a boundary acoustic wave device prevents formation of discontinuous portions in a dielectric film without a significant decrease in the thickness of an IDT when the dielectric film is formed by deposition and without deterioration of electrical characteristics. The method includes the steps of forming an IDT on a piezoelectric substrate, forming a lower dielectric film so as to cover the IDT, conducting a planarizing step so as to smooth the rough surface of the lower dielectric film, and forming an upper dielectric film so as to cover the lower dielectric film of which the rough surface is smoothed.10-29-2009
20080235927METHOD FOR PRODUCING PIEZOELECTRIC ACTUATOR - A method for producing a piezoelectric actuator includes forming a diffusion preventing layer on one surface of a substrate formed of a metallic material for preventing a diffusion of a metal from the substrate, heating a diffusion preventing layer at a first temperature in order to relieve a residual stress in the diffusion preventing layer, forming an electrode on a surface of the diffusion preventing layer, the surface not facing the substrate, forming a piezoelectric layer of a piezoelectric material on a surface of the electrode, the surface not facing the diffusion preventing layer, and annealing the piezoelectric layer at a second temperature. Accordingly, it is possible to prevent the electrode from being exfoliated from the diffusion preventing layer. Moreover, it is possible to prevent a crack being developed in the piezoelectric layer.10-02-2008
20110203084METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a method of manufacturing a package capable of forming a penetration electrode at a low cost without conduction defects while maintaining the airtightness of a cavity, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. In a glass frit application step, a glass frit is applied onto a first surface so that a first opening on the first surface side of a penetration hole is blocked under a depressurized atmosphere in a state where a second surface side of the penetration hole is blocked. In a glass frit filling step, an atmospheric pressure is increased so that the glass frit is filled in the penetration hole by a pressure difference which is generated between the inside of the penetration hole and the outside of the penetration hole.08-25-2011
20080282521Method for manufacturing quartz crystal unit and electronic apparatus having quartz crystal unit - In a method for manufacturing a quartz crystal unit and an electronic apparatus having the quartz crystal unit, each of the quartz crystal unit and the electronic apparatus having the quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork resonator capable of vibrating in a flexural mode of an inverse phase, and having first and second quartz crystal tuning fork tines by etching a quartz crystal wafer; disposing an electrode on each of two of side surfaces of each of the first and second quartz crystal tuning fork tines so that the electrodes on the side surfaces of the first quartz crystal tuning fork tine have an electrical polarity opposite to an electrical polarity of the electrodes on the side surfaces of the second quartz crystal tuning fork tine; mounting the quartz crystal tuning fork resonator on a mounting portion of a case; and connecting a lid to the case to cover an open end thereof, the quartz crystal unit comprising the quartz crystal tuning fork resonator with a piezoelectric constant e′11-20-2008
20080282520Method for manufacturing quartz crystal unit and electronic apparatus having quartz crystal unit - In a method for manufacturing a quartz crystal unit and an electronic apparatus having the quartz crystal unit, each of the quartz crystal unit and the electronic apparatus having the quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork resonator capable of vibrating in a flexural mode of an inverse phase, and having first and second quartz crystal tuning fork tines by etching a quartz crystal wafer; disposing an electrode on each of two of side surfaces of each of the first and second quartz crystal tuning fork tines so that the electrodes on the side surfaces of the first quartz crystal tuning fork tine have an electrical polarity opposite to an electrical polarity of the electrodes on the side surfaces of the second quartz crystal tuning fork tine; mounting the quartz crystal tuning fork resonator on a mounting portion of a case; and connecting a lid to the case to cover an open end thereof, the quartz crystal unit comprising the quartz crystal tuning fork resonator with a piezoelectric constant e′11-20-2008
20080289162Method of manufacturing a piezoelectric vibrator - A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.11-27-2008
20130117980ELECTROACTIVE POLYMER ACTUATOR AND METHOD OF MANUFACTURING THE SAME - A multilayer electroactive polymer actuator and a method of manufacturing the same. The multilayer electroactive polymer actuator is divided into an actuating area and a non-actuating area. A plurality of driving electrodes, each formed on a side of the respective polymer layer to correspond to the actuating area. A plurality of extension electrodes connected to the driving electrodes and a common electrode for vertically connecting the extension electrodes are formed to correspond to the non-actuating area. A via hole is formed through the plurality of non-actuating layers and has a diameter which increases in a stepwise manner upwards. The common electrode is formed in the via hole. The driving electrode includes an alloy of aluminum and copper. The extension electrode is formed of material having a small reactivity with respect to laser as compared to the reactivity of the polymer layer.05-16-2013
20100125988PROCESS FOR FABRICATING PIEZOELECTRIC ELEMENT - A method for fabricating a piezoelectric element capable of ensuring high piezoelectric characteristics by preventing generation of unnecessary electric field in a piezoelectric thin film layer during the fabrication process. The method for fabricating a piezoelectric element comprises a first step for depositing a lower electrode layer, a piezoelectric thin film layer and an upper electrode layer sequentially on a substrate, a second step for performing etching including dry etching, a third step for performing polarization by applying a voltage between the lower electrode layer and the upper electrode layer, and a fourth step for segmenting into individual piezoelectric elements wherein the lower electrode layer and the upper electrode layer are held in short circuit state at least when dry etching is performed.05-27-2010
20080271300METHOD OF MANUFACTURING ORIENTATION FILM AND METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD - A method of manufacturing an orientation film which method is suitable for manufacturing an orientation film containing a ceramic at low cost. The method includes the steps of: (a) forming a ceramic film on a seed substrate in which crystal orientation is controlled at least on a surface thereof by using an aerosol deposition method of injecting powder toward a substrate and depositing the powder on the substrate; and (b) heat-treating the ceramic film formed at step (a) to form an orientation film in which crystal grains contained in the ceramic film is oriented.11-06-2008
20100132174METHOD OF MANUFACTURING FILM BULK ACOUSTIC RESONATOR USING INTERNAL STRESS OF METALLIC FILM AND RESONATOR MANUFACTURED THEREBY - A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.06-03-2010
20090178260VIBRATING PIECE MANUFACTURING METHOD AND VIBRATOR MANUFACTURING METHOD - A vibrating piece manufacturing method includes: (a) preparing a supporting body having first and second surfaces, the first and second surfaces defining a thickness while being directed toward opposite directions, the supporting body including a base and a plurality of arms, the arms extending side-by-side in a direction orthogonal to a direction of the thickness from the base, a lower electrode film being disposed on the first surface of each of the arms, a piezoelectric film being disposed on the lower electrode films, at least one upper electrode film being disposed on the piezoelectric film, at least a part of the second surface of each of the arms being an exposed area; and (b) etching the exposed area of the second surface so as to reduce the thickness to reduce flexural rigidity of the arms with respect to the thickness direction.07-16-2009
20090133237PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING PIEZOELECTRIC RESONATORS - A piezoelectric resonator comprises a piezoelectric material layer 05-28-2009
20090000091PIEZOELECTRIC THIN-FILM RESONATOR AND METHOD FOR PRODUCING THE SAME - A method for producing a piezoelectric thin-film resonator includes forming a sacrificial layer on a substrate, performing a plasma treatment on the sacrificial layer so that the surface roughness (Ra) of end surface portions of the sacrificial layer is about 5 nm or less, forming a strip-shaped dielectric film so as to be continuously disposed on the surface of the substrate and the end surface portions and the principal surface of the sacrificial layer, forming a piezoelectric thin-film area including a lower electrode, an upper electrode, and a piezoelectric thin-film disposed therebetween so that a portion of the lower electrode and a portion of the upper electrode surface each other at an area on the dielectric film, the area being disposed on the upper portion of the sacrificial layer, and removing the sacrificial layer to form an air-gap between the substrate and the dielectric film.01-01-2009
20090064477PIEZOELECTRIC OSCILLATING CIRCUIT, METHOD FOR MANUFACTURING THE SAME AND FILTER ARRANGEMENT - In a method for manufacturing a piezoelectric oscillating circuit in thin film technology, wherein the oscillating circuit includes a predetermined natural frequency and a plurality of layers, first of all at least a first layer of the piezoelectric oscillating circuit is generated. Subsequently, by processing the first layer a frequency correction is performed. Subsequently, at least a second layer of the piezoelectric oscillating circuit is generated and processed for performing a second frequency correction.03-12-2009
20090064476PIEZOELECTRIC MATERIALS BASED ON FLEXOELECTRIC CHARGE SEPARATION AND THEIR FABRICATION - An example flexoelectric piezoelectric material has a piezoelectric response, which may be a direct piezoelectric effect, a converse piezoelectric effect, both effects, or only one effect. A flexoelectric piezoelectric material comprises shaped elements of a material, which may be a substantially isotropic and centrosymmetric material. The shaped elements, such as cones, pyramids, wedges, or other tapered elements, may provide an electrical response in response to stress or strain gradients due to a flexoelectric effect in the material, and may provide a mechanical response in response to electric field gradients. Examples of the present invention include improved methods of fabricating devices comprising such shaped elements, and multi-layer devices having improved properties.03-12-2009
20090199381STACKED PIEZOELECTRIC ELEMENT, MANUFACTURING METHOD THEREOF AND VIBRATION WAVE DRIVING APPARATUS - A stacked piezoelectric element comprising that can suppress periodic damping on miniaturization of a vibration wave motor and improve its performance. A stacked piezoelectric element comprises piezoelectric layers and electrode layers alternately stacked to have a shape of a cylinder. The electrode layers are divided into a plurality of electrode layer regions along a circumferential surface of the shape of a cylinder.08-13-2009
20090199379ARRANGEMENT WITH A COATED PIEZOELECTRIC ACTUATOR - An arrangement is proposed for forming a piezoelectric actuator, which has at least one piezoelectric element that in each case consists of a multi-layer structure of piezoelectric-layers, wherein internal electrodes arranged between the piezoelectric-layers in the direction of the build-up of the layers of the piezoelectric element, have an electrical voltage of different polarity alternately applied to them. Around the piezoelectric element, or in the case of multiple piezoelectric elements positioned in series in the activation direction, around the piezoelectric elements, and at least partially around the actuator head and the actuator foot there is arranged a covering system made from at least one layer of an insulating material. The at least one layer encloses the joints between the piezoelectric element or elements and the actuator head and the actuator foot, forming a seal.08-13-2009
20110219592METHOD FOR MANUFACTURING PIEZOELECTRIC ACTUATOR - In sputter etching to improve the adhesion between upper electrodes and lead electrodes, the sputter etching of surfaces of the upper electrodes under an Ar gas flow at a flow rate of 60 sccm or more can reduce the residence time of Ar ions on the surfaces of the upper electrodes because of the Ar gas flow. This can prevent the charging of the upper electrodes due to the buildup of ionized Ar gas on the surfaces, reduce the influence of charging on piezoelectric elements, and provide a method for manufacturing a piezoelectric actuator that includes the piezoelectric elements each including a piezoelectric layer having small variations in hysteresis characteristics and deformation characteristics.09-15-2011
20110219593PATTERN FORMING METHOD, PATTERN FORMING APPARATUS, PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIEC - Provided are a pattern forming method and apparatus capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator having the electrode pattern formed by the pattern forming method and apparatus, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator.09-15-2011
20090070975METHOD OF FORMING MICROMACHINED FLUID EJECTORS USING PIEZOELECTRIC ACTUATION - A method of forming a fluid ejector includes forming a recess well into a silicon wafer on a first side of the silicon wafer, and filling the recess well with a sacrificial material. A thin layer structure is deposited onto the first side of a silicon wafer covering the filled recess well. Then a thin film piezoelectric is bonded or deposited to the thin layer structure, and a hole is formed in the thin layer structure exposing at least a portion of the sacrificial material. The sacrificial material is removed from the recess well, wherein the hole in the thin layer in the recess well with the sacrificial material removed, form a fluid inlet. An opening area in the silicon wafer is formed on a second side of the silicon wafer. Then a nozzle plate is formed having a recess portion and an aperture within the recess portion. The nozzle plate is attached to the second side of the silicon wafer, with the recess portion positioned within the open area. The thin layer structure and the recess portion of the nozzle plate define a depth of a fluid cavity defined by the thin layer structure, the recess portion of the nozzle plate and the sidewalls of the silicon wafer.03-19-2009
20090049670METHODS OF FABRICATING A MEMBRANE WITH IMPROVED MECHANICAL INTEGRITY - Methods for fabricating robust films across a patterned underlying layer's edges or steps are disclosed. The novel methods diminish the negative effects of electrode steps or edges on the integrity of a membrane. Thus, the methods are particularly applicable to membrane release technology. The height of the step or edge is eliminated or reduced to increase the mechanical integrity of the film.02-26-2009
20090100657PIEZOELECTRIC RESONATOR HAVING IMPROVED TEMPERATURE COMPENSATION AND METHOD FOR MANUFACTURING SAME - A piezoelectric resonator includes a piezoelectric layer having a first resonance frequency temperature coefficient of a first sign, a first and a second electrode, the piezoelectric layer being arranged between the first and second electrodes, and a compensation layer arranged between the first electrode and the piezoelectric layer, of a compensation material having a second resonance frequency temperature coefficient of a second sign opposite to the first one, wherein the compensation material is provided with a modification material to increase a conductivity of the compensation layer in a direction of the first electrode and the piezoelectric layer.04-23-2009
20090205182METHOD OF MANUFACTURING LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT - A method of manufacturing a liquid ejection head that includes a flow channel-forming substrate having pressure-generating chambers communicated with nozzle openings configured to eject liquid, and a piezoelectric element including a lower electrode film disposed in a region of the flow channel-forming substrate opposing the pressure-generating chambers, a piezoelectric layer, and an upper electrode film includes forming a lower electrode film at one side of a flow channel-forming substrate, forming a dummy layer by firing a piezoelectric material on the lower electrode film, exposing the lower electrode film by removing the dummy layer, forming a piezoelectric layer on the exposed lower electrode film, the piezoelectric layer being constituted by at least one piezoelectric film formed by conducting a piezoelectric film-forming process of firing a piezoelectric material, and forming an upper electrode film on the piezoelectric layer.08-20-2009
20090205181PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME - A piezoelectric/electrostrictive element with improved moisture resistance while having less degradation in its piezoelectric/electrostrictive properties and a method of manufacturing such a piezoelectric/electrostrictive element are provided. A laminated vibrator of a piezoelectric/electrostrictive element has a structure in which an electrode film, a piezoelectric/electrostrictive film, another electrode film, another piezoelectric/electrostrictive film, and another electrode film are laminated one above the other. In the manufacture of the piezoelectric/electrostrictive element, the laminated vibrator and a counter electrode are immersed in an electrodeposition coating fluid containing a coating component so that the electrodeposition coating fluid is brought into contact with the surfaces of the laminated vibrator and the counter electrode. Thereafter, voltage is applied between an internal electrode film and the counter electrode to induce electrophoresis of the coating component toward a surface-exposed defect, whereby the coating material is selectively electrodeposited on the surface-exposed defect.08-20-2009
20090205180 METHOD OF MANUFACTURING OF A LIQUID JET HEAD, METHOD OF MANUFACTURING OF A PIEZOELECTRIC ELEMENT AND A LIQUID JET APPARATUS - In a step of forming a piezoelectric precursor film, an application solution is applied onto each of flow passage forming substrate wafers to form piezoelectric precursor films one by one on each of the plurality of flow passage forming substrate wafers constituting a flow passage forming substrate wafer group, and an order of the flow passage forming substrate wafers for starting the application of the application solution to be turned into each of the piezoelectric precursor films is varied by the predetermined number of wafers of the flow passage forming substrate wafer group.08-20-2009
20090205176METHOD FOR MANUFACTURING A LIQUID JET HEAD AND A METHOD FOR MANUFACTURING AN ACTUATOR APPARATUS - In order to improve reliability, there are provided a step of forming lower electrode 08-20-2009
20110138593METHOD FOR PRODUCING A MONOLITHIC PIEZO ACTUATOR WITH STACK ELEMENTS, MONOLITHIC PIEZO ACTUATOR WITH STACK ELEMENTS, AND USE OF THE PIEZO ACTUATOR - A piezo actuator has a stack element and at least one further stack element, wherein each of the stack elements has stacked piezoceramic layers and electrode layers arranged between the piezoceramic layers, each of the electrode layers extends to at least one of at least two lateral surface sections of the stack element which have external metallizations on them, and are connected to the electrode layers such that adjacently stacked electrode layers can have different electrical potentials applied to them indirectly via the external metallizations, the stack elements are arranged above one another to form a monolithic total stack, and connected to one another by at least one connecting layer. The following steps are provided: a) provision of the total stack and b) production of a load-relieving crack in the connecting layer. An electrical connector in the form of a wire can be fitted on the relevant external metallization regions.06-16-2011
20090205178METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATING PIECE, WAFER, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE - To carry out frequency adjustment easily, accurately and efficiently and achieve low cost formation and promotion of maintenance performance without being influenced by a size of a piezoelectric vibrating piece, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating pieces having a piezoelectric plate 08-20-2009
20100146755METHOD OF MANUFACTURING AN ACOUSTIC MIRROR FOR A PIEZOELECTRIC RESONATOR AND METHOD OF MANUFACTURING A PIEZOELECTRIC RESONATOR - A mirror for a piezoelectric resonator consisting of alternately arranged layers of high and low acoustic impedance is manufactured by at first producing a first layer on which a second layer is produced, so that the second layer partially covers the first layer. Then, a planarization layer is applied on the first layer and on the second layer. Subsequently, a portion of the second layer is exposed by structuring the planarization layer, wherein the portion is associated with an active region of the piezoelectric resonator. Finally, the resulting structure is planarized by removing the portions of the planarization layer remaining outside the portion.06-17-2010
20080307622Method for producing piezoelectric film actuator, and composite structure having piezoelectric layer - A method for producing a piezoelectric film actuator is provided. This method includes the steps of preparing an intermediate transfer member having a porous layer formed thereon, with a vibrating plate and a piezoelectric layer being provided on the porous layer; bonding the vibrating plate to a nozzle substrate to form a composite structure; and separating the intermediate transfer member from the composite structure at the porous layer to transfer the vibrating plate and the piezoelectric layer to the nozzle substrate.12-18-2008
20100146754ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME - A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001λ, where the wavelength of an acoustic wave is λ.06-17-2010
20100154183Thread forming fasteners for ultrasonic load measurement and control - An ultrasonic load measurement transducer is mated with a thread-forming fastener to provide a load indicating thread-forming fastener that can be used for the precise and reliable assembly of critical bolted joints, such as those in the automobile and aerospace industries, among others. Steps can then be taken to accurately measure and control the load in the thread-forming fastener during tightening, and to inspect the load in the thread-forming fastener after assembly. A similar result can be achieved for a thread-locking fastener by mating an ultrasonic transducer with the thread-locking fastener assembly.06-24-2010
20100162545METHODS FOR MANUFACTURING CRYSTAL OSCILLATOR DEVICES - Crystal devices are disclosed, of which an exemplary device includes a crystal frame comprising a crystal vibrating piece having an electrode pattern and an outer frame supporting the crystal vibrating piece. The device also includes a crystal package base including at least one connection electrode formed on a first main surface and at least one external electrode formed on a second main surface, wherein the second main surface is opposite the first main surface. The crystal frame and crystal base are layered together with a lid wafer to form a 3-layer sandwich. The layers of the sandwich are bonded together by siloxane bonding, which results in the connection electrodes contacting the electrode pattern on the crystal vibrating piece.07-01-2010
20120102696PIEZOELECTRIC DEVICE, PROCESS FOR PRODUCING THE SAME, AND LIQUID DISCHARGE DEVICE - A piezoelectric device includes a substrate; and a laminated film formed above the substrate. The laminated film includes a lower electrode layer, a piezoelectric layer, and an upper electrode layer formed in this order, and the lower electrode layer is a metal electrode layer containing as one or more main components one or more nonnoble metals and/or one or more nonnoble alloys. Preferably, the one or more main components are one or more of the metals Cr, W, Ti, Al, Fe, Mo, In, Sn, Ni, Cu, Co, and Ta, and alloys of the metals.05-03-2012
20120102695PIEZOELECTRIC PRINTHEAD AND RELATED METHODS - A piezoelectric printhead and related methods provide a first metallic electrode and a second metallic electrode deposited over a top surface and a bottom surface, respectively, of a piezoceramic plate. The second electrode is segmented into a plurality of electrode segments. A diaphragm is positioned over a plurality of pressure chambers, where the diaphragm includes a conductor positioned over each chamber. The piezoceramic plate is attached to the diaphragm such that each conductor on the diaphragm faces multiple electrode segments.05-03-2012
20100192341PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE, INK JET DEVICE - Providing a manufacturing method of a piezoelectric element by which even if an electrode and a piezoelectric film stacked on a substrate are baked at a high temperature, the electrode does not oxidize and mutual diffusion between the substrate, the electrode and the piezoelectric film may be suppressed. The electrode is adapted as a laminated layer body which includes an electroconductive oxide layer, a mixture layer having an electroconductive oxide and electroconductive metal, and an electroconductive metal layer including the electroconductive metal from a substrate side, and the mixture layer above is adapted as a graded composition structure in which a ration of the electroconductive oxide is highest in an interface with the electroconductive oxide layer and lowest in an interface with the electroconductive metal layer.08-05-2010
20090077782METHOD FOR PRODUCING ACTUATOR DEVICE AND METHOD FOR PRODUCING LIQUID EJECTING HEAD - A method for producing an actuator device includes forming a lower electrode above a substrate, forming thereon a piezoelectric layer including multiple piezoelectric films by repeatedly sintering a piezoelectric precursor film containing titanium, zirconium, and lead, and forming an upper electrode above the piezoelectric layer. A titanium seed layer is formed above the lower electrode and a piezoelectric precursor film is crystallized by sintering to form a first piezoelectric layer above the titanium seed layer. An intermediate titanium seed layer is formed above the first piezoelectric layer and a piezoelectric precursor film is crystallized by sintering, forming a second piezoelectric layer above the intermediate titanium seed layer. At least one piezoelectric precursor film is stacked above the second piezoelectric layer and crystallized by sintering at a temperature higher than a temperature at which the first and second piezoelectric layers are formed, thereby forming a third piezoelectric layer.03-26-2009
20090077781PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing tuning-fork type piezoelectric vibrating devices. In an exemplary method a metal film is formed on both surfaces of a piezoelectric wafer, followed by application of photoresist. A first metal-film-etching step etches the metal film after removal of the photoresist layer outside the profile outline of the devices. A first piezoelectric-etching step etches the wafer surface but not through to the rear surface; thus, outside the profile outline the metal film is removed. A second metal-film-etching step etches the metal film after removal of the photoresist layer from first groove regions. A second piezoelectric-etching step etches outside the profile outline and the groove regions through to the rear surface.03-26-2009
20100192342PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.08-05-2010
20100192340Method of manufacturing quartz-crystal resonator - To provide a method of manufacturing a quartz-crystal resonator, in which without adding new processes, a desired quartz-crystal piece can be obtained from a quartz-crystal wafer by etching and electrodes can be provided without restraint. When a quartz-crystal piece 08-05-2010
20100212129METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING ACTUATOR DEVICE - A method for manufacturing a liquid ejecting head, which has a piezoelectric element including a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer on the opposite side of the first electrode. The liquid ejecting head ejects liquid droplets from a nozzle opening by generating pressure in a pressure-generating chamber using the piezoelectric element. The method includes forming the first electrode, forming a piezoelectric precursor film on the first electrode, first heat treatment of forming a piezoelectric film by crystallizing the piezoelectric precursor film by heat treatment, forming the second electrode, and second heat treatment of heating the piezoelectric layer composed of the piezoelectric film at a temperature of 150° C. or more while applying a voltage between the first electrode and the second electrode.08-26-2010
20100212126Method for Manufacturing a Transmitter/Receiver and Apparatus Obtained by Means of Such a Method - A method for manufacturing a transmitter/receiver (08-26-2010
20100236038METHOD OF MANUFACTURING A PACKAGE, AND PACKAGE, ELECTRONIC DEVICE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK - There is There is provided a method of manufacturing a package 09-23-2010
20100223769Crystal device and method for manufacturing crystal device - An object of the present invention is to provide a crystal device that has stable vibration characteristics and that offers high reliability and high accuracy. The crystal device includes a first major face, which contains a portion of a base and a portion of a vibrating prong within a single plane, formed on the crystal plate, and a second major face, which contains another portion of the base and another portion of the vibrating prong within a single plane, formed on a crystal plate, wherein the first major face and the second major face have different outer shapes. The shapes of the first and second major faces can be produced by first forming mask layer patterns on a crystal substrate by exposure through different mask patterns and then etching the crystal substrate using the thus formed mask layer patterns.09-09-2010
20100223768METHOD OF MANUFACTURING LIQUID TRANSPORTING APPARATUS - There is provided a method of manufacturing liquid transporting apparatus including: providing a channel unit; providing a piezoelectric actuator having a first and second active portion corresponding to a central portion and an outer periphery portion of the pressure chamber, respectively. The first and second active portions are sandwiched between an upper electrode and an intermediate electrode, and between the upper electrode and a lower electrode, respectively. The method further includes joining the channel unit and the piezoelectric actuator by positioning such that the intermediate electrode overlaps the central portion of the pressure chamber. Accordingly, since it is possible to make the first active portion overlap the central portion of the pressure chamber, it is possible to apply a appropriate pressure to the liquid in the pressure chamber without excessively small deformation of the first active portion.09-09-2010
20100236037PIEZOELECTRIC ULTRACAPACITOR - Piezoelectric ultracapacitor is disclosed capable of converting the kinetic energy of ordinary motion into an electrical potential. The piezoelectric ultracapacitor of the present invention may be used in various contexts, including power generation, switching and control and memory.09-23-2010
20100212128Fabricating method of inkjet printer head - A method of fabricating an inkjet printer head, the method including: forming a nozzle part and a restrictor in a lower board and forming an ink chamber and an ink inlet in an upper board; joining the lower board onto an upper portion of the lower board; and joining a piezoelectric element onto a membrane of the upper board, wherein the membrane is formed, after a portion of the upper board is removed to form the ink chamber, by the remaining portion.08-26-2010
20100212127Process for Adapting Resonance Frequency of a BAW Resonator - A method of manufacturing a filter circuit including series and parallel coupled BAW resonators is given which compensates for frequency tolerances of the resonators which are due to the manufacturing process. The new method includes measuring a resonance frequency of at least one type of the BAW resonators produced on a wafer and defining a deviation from a desired frequency. A trimming layer is then deposited onto the entire wafer. At last, a thickness portion of the trimming layer is selectively removed, the portion being dependent on a location on the wafer and on the calculated deviation of the resonance frequency at this location.08-26-2010
20100236036Injection Molded Energy Harvesting Device - Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.09-23-2010
20100242242METHOD FOR MANUFACTURING PIEZOELECTRIC ACTUATOR - There is provided a method for manufacturing a piezoelectric actuator where the planar shape is adjusted by subjecting the piezoelectric body layer located on one of the outer surfaces in the two or more piezoelectric body layers to a polarization treatment to control remnant polarization of the piezoelectric body layer. The piezoelectric actuator is used as a drive portion of a piezoelectric drive type variable capacitor. The variable capacitor has high mechanical strength and excellent reliability for a long period of time. The relation between the displacement amount of the piezoelectric actuator and the capacity of the capacitor is stable, and the variable capacity is wide.09-30-2010
20100218353RESONATOR SENSOR ASSEMBLY - An improved method and assembly, wherein the method generally includes the steps of providing a coated or uncoated sensor element having an exposed sensing surface; attaching the sensor element to a platform so that the exposed sensing surface is spaced from the platform; and optionally applying a protective layer over the platform while maintaining the sensing surface as exposed. The assembly includes a resonator having a free portion with a sensing surface is incorporated onto a platform, components of the sensor are physically shielded from harsh operating conditions, the requisite space is maintained between the free portion of the resonator and the platform, and the sensing surface of the resonator remains exposed for sensing.09-02-2010
20100251527PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.10-07-2010
20090260207INKJET HEAD, METHOD OF MANUFACTURING INKJET HEAD, AND INKJET RECORDING APPARATUS - An inkjet head, comprising: 10-22-2009
20090205183METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE - To fabricate a plurality of piezoelectric vibrating pieces while firmly preventing a defect, a crack, or a breakage from being brought about at a wafer in the midst of fabrication, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a plurality of piezoelectric vibrating pieces from a wafer S, the method including a film forming step of respectively forming metal films M on both faces of the wafer, a patterning step of removing a region of the metal film on an inner side of an outer peripheral end of the wafer by a constant distance H, thereafter, patterning the metal film M to outer shapes of the plurality of piezoelectric vibrating pieces, an outer shape forming step of forming outer shapes of the plurality of piezoelectric vibrating pieces at the wafer a size of which is reduced by an amount of the constant distance by selectively removing the wafer by wet etching by constituting a mask by the patterned metal film, and a removing step of removing the metal film.08-20-2009
20090205177METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, RADIOWAVE TIMEPIECE, WAFER AND JIG FOR WAFER - To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 08-20-2009
20080313874PIEZOELECTRIC VIBRATOR AND FABRICATING METHOD THEREOF - The present invention relates to piezoelectric vibrators such as a resonator used as a timing element, discriminator, filter or the like, and fabricating methods thereof. The piezoelectric vibrators of the present invention may be fabricated by forming a piezoelectric body of piezoelectric sheets, of which the thickness is controlled, and simultaneously sintering the sheets along with cover layers, on which grooves are formed. Also, the piezoelectric vibrator of the present invention is fabricated by laminating the piezoelectric sheets, of which the thickness is controlled, providing internal electrodes between the sheets, and forming external electrodes insulated from the internal electrodes.12-25-2008
20090320255PIEZOCERAMIC MULTILAYER ACTUATOR AND METHOD FOR THE PRODUCTION THEREOF - According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks (12-31-2009
20090113685Methods to make piezoelectric ceramic thick film array and single elements and devices - A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.05-07-2009
20090106960Piezoelectric resonator and method for manufacturing thereof - A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.04-30-2009
20100293770METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE - Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (11-25-2010
20100313399METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.12-16-2010
20120066876CREATING AN IMPROVED PIEZOELECTRIC LAYER FOR TRANSDUCERS - A method for forming a transducer, the method includes the steps of providing a substrate; providing a dielectric on the substrate; providing a first piezoelectric layer of the dielectric; providing a metal layer on the first piezoelectric layer; etching the metal layer to form a predetermined pattern having at least two electrodes; providing a second piezoelectric layer on the first piezoelectric layer and the etched metal layer; and etching a portion of the substrate surrounding the transducer to permit the transducer to move in a bender configuration.03-22-2012
20110000060FLEXIBLE PIEZOELECTRIC DEVICE AND FLEXIBLE CAPACITOR MANUFACTURED BY THE SAME, AND MANUFACTURING METHOD FOR FLEXIBLE SENSORS - Provided are a method for manufacturing a flexible device, a flexible device, a flexible piezoelectric device and a flexible capacitor manufactured by the same, and a method for manufacturing a flexible sensor. A method for manufacturing a flexible device includes: laminating a first metal layer on a silicon oxide layer on a silicon substrate; laminating a device on the first metal layer; annealing the first metal layer to oxidize the first metal into a first metal oxide; etching the first metal oxide so as to separate the device from the silicon oxide layer; and transferring the separated device to a flexible substrate using a transfer layer. According to the disclosed method for manufacturing a flexible device, differently from the prior art where the silicon substrate itself is etched, the metal oxide layer laminated on the silicon substrate is etched to separate the device from the substrate. As a result, physical damage of the silicon substrate may be prevented and the cost of using the expensive single-crystal silicon substrate may be reduced.01-06-2011
20120030916MANUFACTURING METHOD FOR THIN BOARD-SHAPED FIRED PIEZOELECTRIC BODY - A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.02-09-2012
20110239423MANUFACTURING METHOD OF PIEZOELECTRIC ACTUATOR - After the piezoelectric element forming process, in the etching process, etching is performed on a portion of at least the vibrating plate between the lead-out electrodes formed afterwards in the lead-out electrode forming process in a condition where the upper electrode film etching residual is removed and the vibrating plate is not removed. In the piezoelectric element forming process, even if the upper electrode film etching residual is generated between the lead-out electrodes, the upper electrode film etching residual is divided up due to the etching and it is possible to maintain insulation between the lead-out electrodes formed in the upper electrode film etching residual. Accordingly, it is possible to obtain the manufacturing method of the piezoelectric actuator which reduces driving defects in the piezoelectric actuator generated by short circuiting between the lead-out electrodes.10-06-2011
20110239422METHOD FOR MANUFACTURING A LIQUID EJECTING HEAD AND METHOD FOR FABRICATING PIEZOELECTRIC ELEMENTS - A method for manufacturing a liquid ejecting head, that has piezoelectric elements and offers a good displacement characteristic, including forming a first electrode film on a flow channel substrate; forming a first ferroelectric film on the first electrode film; etching the first ferroelectric film and the first electrode film with a resist film formed on the first ferroelectric film as the mask; removing the resist film by ashing with oxygen plasma; forming a protective resist film so as to cover the central portion of the substrate; removing partly the resist film by ashing with oxygen plasma; removing the resist film and the protective resist film by treatment with an organic remover; forming additional ferroelectric films; forming a second electrode film; and shaping the second electrode film and the ferroelectric films other than the first ferroelectric film into a certain pattern10-06-2011
20100018021Hysteretic MEMS two-dimensional thermal device and method of manufacture - A MEMS hysteretic thermal device may be formed having two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, whereas the second beam segment is configured to move in a direction having a component parallel to the substrate surface. By providing this two-dimensional motion, a single MEMS hysteretic thermal device may by used to close a switch having at least one stationary contact affixed to the substrate surface.01-28-2010
20100083474Piezoelectric Element and Method for Manufacturing the Piezoelectric Element - A piezoelectric element includes a piezoelectric ceramic body containing an internal electrode. The piezoelectric ceramic body is mainly made of a perovskite complex oxide containing an alkali metal niobate-based compound containing at least one element selected from among K, Li, and Na. The internal electrode is made of a base metal material, such as Ni or Cu. The piezoelectric element is produced by co-sintering the internal electrode and the piezoelectric ceramic body. Thus, there is provided an inexpensive piezoelectric element that can be properly used in practice even though it has been fired in a reducing atmosphere.04-08-2010
20110088234TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS - A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.04-21-2011
20100058568MULTI-BAND FILTER MODULE AND METHOD OF FABRICATING THE SAME - A multi-band filter module and a method of fabricating the same are provided. The multi-band filter module includes a piezoelectric substrate, a first filter provided on the piezoelectric substrate, and a second filter provided adjacent to the first filter on the piezoelectric substrate, and operating in a frequency band that is lower than that of the first filter.03-11-2010
20100064493PIEZOELECTRIC ACTUATOR FOR TUNABLE ELECTRONIC COMPONENTS - An actuating assembly for tuning a circuit and a process for forming a carrier substrate containing a membrane, a conductive layer, and piezoelectric actuators are disclosed. The actuating assembly comprises a membrane overlying a circuit to be tuned, a conductive element connected with the membrane, and a piezoelectric arrangement. Changes in shape of the piezoelectric arrangement allow a deflection of the membrane and a corresponding controllable upward or downward movement of the conductive element. In the process, a membrane and a piezoelectric structure are formed on a substrate.03-18-2010
20100064492LAMB WAVE TYPE FREQUENCY DEVICE AND METHOD THEREOF - A Lamb wave type high frequency device comprises: a piezoelectric substrate; an interdigital transducer (IDT) electrode formed on a first main surface of the piezoelectric substrate; a reinforcing substrate connected to a second main surface of the piezoelectric substrate; a space portion formed in one of the piezoelectric substrate and the reinforcing substrate, an area of the space portion being larger than a region in which a Lamb wave is propagated; and a connecting surface formed in a periphery of the space portion.03-18-2010
20080229566Method for manufacturing acceleration sensing unit - A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element substrate on the element support substrate such that the fixed ends of each stress sensing element are situated on the fixed part and the movable part; fixing the fixed ends onto the fixed part and the movable part, and dividing the element supporting part and the supporting part.09-25-2008
20110061216LIQUID DISCHARGING HEAD, METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD, AND IMAGE FORMING APPARATUS - A method for manufacturing a liquid discharging head, the method including forming a plurality of nozzles that discharge liquid droplets, forming a plurality of piezoelectric elements that generate pressure for discharging liquid droplets from the respective nozzles; and performing a repolarization process on the piezoelectric elements to set non-uniformity of the droplet discharging characteristics of the nozzles to be in a predetermined range by combining adjustment of a polarization sensitivity and adjustment of a polarization voltage for each of the piezoelectric elements.03-17-2011
20110061215PROCESS FOR FABRICATING AN OPTIMALLY-ACTUATING PIEZOELECTRIC MEMBRANE - In a process for fabricating a membrane, including, on a substrate, a thin-film multilayer including a film of piezoelectric material placed between a top electrode film and a bottom electrode film and an elastic film supporting said piezoelectric film, the process includes: determining at least one concavity/convexity curvature of said membrane along an axis parallel to the plane of the films so that at least one inflection point is defined, said point allowing a first region and a second region, corresponding to a concave part and a convex part or vice versa, to be isolated; depositing, on the surface of the substrate, a thin-film multilayer including at least one film of piezoelectric material, one bottom electrode film and one top electrode film; and structuring at least one of the electrode films to define at least said first membrane region, in which an electric field perpendicular to the plane of the films may be applied, and at least said second region, in which an electric field parallel to the plane of the films may be applied.03-17-2011
20110173787MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE - A manufacturing method of a piezoelectric device includes: forming a lid for sealing a cavity of a package base by forming a recess part and forming a through hole in an inner surface of the recess part in a metal plate; fixing the lid to the package base containing a piezoelectric vibrating reed so that the recess part may project toward the package base side; providing a metal piece in the recess part; decompressing the cavity via the through hole; and closing the through hole by applying a laser to the metal piece to melt the metal piece, wherein, at forming of the lid, the through hole is formed in a direction orthogonal to a thickness direction of the metal plate.07-21-2011
20090000092Method for the manufacture of a piezoelectric actuator - A piezoelectric actuator comprised of a multi-layered construction of piezoelectric layers interleaved with inner electrodes in which the inner electrodes are contacted on alternating sides by outer electrodes and the regions between the outer electrodes are provided with a suitable insulation has an insulating layer which is comprised of a material with properties virtually identical to those of the piezoelectric layers which is applied to the external surface of the piezoelectric actuator in the region between the outer electrodes.01-01-2009
20090100656METHOD FOR MANUFACTURING PIEZOELECTRIC FILM ELEMENT, AND PIEZOELECTRIC FILM ELEMENT - A method for manufacturing a piezoelectric film element includes foursteps. The first is to form a bottom electrode on a Si substrate. The second is to form a seed layer with a layered perovskite structure on the bottom electrode. The third is to form a Bi04-23-2009
20110041304PIEZOELECTRIC DEVICE, LIQUID DROPLET EJECTING HEAD USING THE SAME, AND PROCESS FOR PRODUCING THE SAME - The piezoelectric device includes a piezoelectric film that expands or contracts according to variations in voltage applied, a first electrode provided on a first side of the film, and a second electrode provided on a second side of the film. The film is formed on the second electrode by a vapor phase deposition and mainly composed of Pb02-24-2011
20120030915MANUFACTURING METHOD OF A PIEZOELECTRIC ELEMENT AND A LIQUID EJECTING HEAD - A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.02-09-2012
20120198672METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE - A method for manufacturing an acoustic wave device includes: bonding a piezoelectric substrate to a first surface of a first support substrate; thinning the piezoelectric substrate after the bonding to thus form a piezoelectric layer; forming a first electrode on a first surface of the piezoelectric layer; forming holes in the first support substrate located below the first electrode; and bonding a second support substrate to a second surface of the first support substrate opposite to the first surface after the forming of holes.08-09-2012
20110162181Device for polling piezoelectric element and polling method using the same - A device for polling a piezoelectric element includes: a polling chamber in which a plurality of piezoelectric elements are disposed; a power supply unit providing voltage to poll the piezoelectric elements; a capacitance measurement unit connected with the piezoelectric elements to measure the capacitance of the piezoelectric elements; and a switching system connected with the power supply unit and the piezoelectric elements within the polling chamber, and selectively providing the voltage of the power supply unit to the piezoelectric elements.07-07-2011
20110107570DUPLEXER USING AN EMBEDDED PCB AND METHOD OF FABRICATING THE SAME - A high-integrated duplexer and a fabrication method thereof. The duplexer has a first filter to pass a signal of a transmitted frequency band, a second filter to pass a signal of a received frequency band, an embedded PCB having the first and second filters bonded on a certain area of a surface of an upper side in a predetermined distance from each other, and an isolation part to prevent a signal interference between the first and second filters, and a packaging substrate to package the entire upper side of the embedded PCB so that the packaging substrate is located above and separated from the first and second filters by a predetermined distance. The fabricated high-integrated duplexer has a small size and high performance.05-12-2011
20110131774METHOD OF MANUFACTURING STACKED THIN FILM PIEZOELECTRIC FILTER - A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency.06-09-2011
20100024180ELECTROACTIVE POLYMER PRE-STRAIN - The present invention provides electroactive polymers, transducers and devices that maintain pre-strain in one or more portions of an electroactive polymer. Electroactive polymers described herein may include a pre-strained portion and a stiffened portion configured to maintain pre-strain in the pre-strained portion. One fabrication technique applies pre-strain to a partially cured electroactive polymer. The partially cured polymer is then further cured to stiffen and maintain the pre-strain. In another fabrication technique, a support layer is coupled to the polymer that maintains pre-strain in a portion of an electroactive polymer. Another embodiment of the invention cures a polymer precursor to maintain pre-strain in an electroactive polymer.02-04-2010
20090165271METHOD FOR PRODUCING PIEZOELECTRIC ACTUATOR AND METHOD FOR PRODUCING LIQUID DISCHARGE HEAD - A method for producing a piezoelectric actuator having a diffusion-preventive layer and a piezoelectric layer stacked on a vibration plate includes providing the vibration plate having a surface on which a groove is formed; and blowing an aerosol containing ceramics particles toward an area, on the surface of the vibration plate, in which the groove is formed from a first direction and a second direction different from the first direction by using an aerosol deposition method to form the diffusion-preventive layer on the vibration plate. The aerosol is blown toward the vibration plate in the first and second directions. Therefore, the material particles contained in the aerosol can be collided with the inner walls of the groove formed on the vibration plate as well, and thus the diffusion-preventive layer can be formed on the vibration plate without causing any unevenness.07-02-2009
20090282662CAVITATION REACTOR AND METHOD OF PRODUCING HEAT - A cavitation reactor of low mass is disclosed capable of generating more heat than is input. The cavitation reactor may be formed of a variety of fabrication techniques, include techniques used to form semiconductor devices.11-19-2009
20090313798RUGGED PIEZOELECTRIC ACTUATORS AND METHODS OF FABRICATING SAME - Processes of fabricating an actuator comprises bonding an unpolled element to a substrate and thereafter poling the bonded element for providing the element with an electro-active response property. In differing modes of the process, the unpolled element can comprise one or more of (for example) a piezoelectric material (e.g., lead zirconate titanate); a piezorestrictive material; and/or a ferroelectric material. Actuators fabricated by the processes are also described.12-24-2009
20120304429MANUFACTURING METHODS OF PIEZOELECTRIC FILM ELEMENT AND PIEZOELECTRIC DEVICE - A manufacturing method of a piezoelectric film element includes forming a lower electrode on a substrate, forming a piezoelectric film including a lead-free alkali niobate based compound having a perovskite structure on the lower electrode, forming a mask pattern on the piezoelectric film, dry-etching the piezoelectric film via the mask pattern, removing the mask pattern after the dry etching, and heat-treating the piezoelectric film in an oxidizing atmosphere. A manufacturing method of a piezoelectric device includes forming an upper electrode on the piezoelectric film of the piezoelectric film element formed by the manufacturing method of the piezoelectric film element, and connecting an electric voltage applying means or an electric voltage detecting means to the lower electrode and the upper electrode.12-06-2012
20090300894AT CUT QUARTZ CRYSTAL RESONATOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME - An AT cut quartz crystal resonator element includes a quartz crystal element piece having an exciting part formed from an AT cut quartz crystal plate in a rectangular shape having an X-axis direction of a quartz crystal set to a long side, and an exciting electrode formed on each of front and back main surfaces of the exciting part, in which each side surface in the longitudinal direction of the exciting part is composed of two faces, an m-face of a quartz crystal and a crystal face other than the m-face.12-10-2009
20110056059METHOD OF PRODUCING PIEZOELECTRIC/ELECTROSTRICTIVE FILM TYPE DEVICE - Provided is a method of producing a piezoelectric/electrostrictive film type device, the method making it possible to increase the coating ratio of the lowermost electrode film and also, to prevent the deviation of the plane position of the lowermost electrode film from the plane position of the cavity. In the production of a piezoelectric/electrostrictive film provided with a substrate formed with a cavity and an vibrating laminate obtained by laminating a lower electrode film, a piezoelectric/electrostrictive film and an upper electrode film which are aligned with the plane position of the cavity, on the surface of the substrate, the lower electrode film is formed using, as a mask, the substrate in which a light-shielding agent is filled in the cavity by photolithography. The lower electrode film is formed by electroless plating after the catalyst layer is formed.03-10-2011
20120005871METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A method for manufacturing a piezoelectric element includes a process for forming a first conductive layer, a process for forming a piezoelectric layer having a region serving as an active region, a process for forming a second conductive layer, which overlaps with the region, a process for forming a third conductive layer, which overlaps with the region, on the second conductive layer, a process for forming an opening portion that divides the third conductive layer into a first portion and a second portion, a process for forming a resist layer that covers the opening portion and a peripheral portion at the side of the opening portion of the first portion and the second portion; a process for etching the third conductive layer to form a first conductive portion and a second conductive portion, and a process for etching the second conductive layer to form a third conductive portion.01-12-2012
20080295308Method of forming an array of piezoelectric actuators on a membrane - A method of forming an array of piezoelectric actuators on a membrane (12-04-2008
20120204388METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A method of manufacturing a piezoelectric vibrating reed includes an electrode mark group detecting process of detecting a wafer side mark group and an electrode mask side mark group, and an electrode mask placing process of placing the electrode film mask on the wafer while aligning the wafer side mark group and the electrode mask side mark group, wherein the wafer side mark group and the electrode mask side mark group are constituted by marks having sizes different from each other, the smallest wafer side mark and the electrode mask side mark are used for the alignment of the mutual marks, respectively, and the wafer side mark and the electrode mask side mark except for the smallest wafer side mark and the electrode mask side mark are used in the electrode mark group detecting process.08-16-2012
20100313398PROCESS FOR THE COLLECTIVE FABRICATION OF CALIBRATION-FREE SENSORS BASED ON ACOUSTIC WAVE DEVICES - The invention relates to a process for the collective fabrication of a remotely interrogable sensor having at least one first resonator and one second resonator. Each resonator exhibits respectively a first and a second operating frequency. A first series of first resonators are fabricated. The first resonators each have a first operating frequency belonging to a first set of frequencies centered on a first central frequency. A second series of second resonators are fabricated. The second resonators each having a second operating frequency belonging to a second set of frequencies centered on a second central frequency. A series of pairings of a first resonator and of a second resonator are conducted so as to form pairs of resonators exhibiting a difference of operating frequencies which is equal to the difference of the first and second central frequencies.12-16-2010
20100095497MONOLITHIC DUPLEXER - A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.04-22-2010
20090133238Multi-Layer Piezoelectric Element and Method for Manufacturing the Same - A multi-layer piezoelectric element having high durability wherein the internal electrodes and the external electrodes do not break even when operated continuously over a long time under high electric field and high pressure is provided.05-28-2009
20120117769METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT - There is provided a method for manufacturing a piezoelectric element, the method having a step of polarizing the fired piezoelectric body while fixing at least two positions in a direction perpendicular to the polarization direction. The method is a means for obtaining a piezoelectric element provided with a thin and flat fired piezoelectric body with no warpage.05-17-2012
20120117770METHOD OF MANUFACTURING PIEZOELECTRIC FILM, PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS - A method of manufacturing a piezoelectric film using a piezoelectric film-forming composition. The piezoelectric film-forming composition contains Bi, Fe, Mn, Ba, and Ti and the mole ratio of Bi to the total amount of Fe and Mn is 1.02 or more 1.08 or less.05-17-2012
20120159754POLLING METHOD OF PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING INERTIAL SENSOR USING THE SAME - Disclosed herein is a method of manufacturing an inertial sensor using a polling method of a piezoelectric element performing a polling after packaging the piezoelectric element, the method of manufacturing an inertial sensor including: forming a driving electrode and a sensing electrode on a flexible substrate on which a piezoelectric material is deposited; electrically connection the driving electrode and the sensing electrode; packaging the flexible substrate; polling by applying voltage and heat to the driving electrode and the sensing electrode; and electrically separating the driving electrode from the sensing electrode by applying heat to the driving electrode and the sensing electrode.06-28-2012
20100175236METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method for manufacturing a piezoelectric device, an ion implantation layer is formed at a desired depth from one principal surface of a piezoelectric single crystal substrate by implanting hydrogen ions into the piezoelectric single crystal substrate under desired conditions. The piezoelectric single crystal substrate in which the ion implantation layer has been formed is bonded to a supporting substrate, and THG laser light is irradiated from the supporting substrate side. Since the optical absorptance of the piezoelectric single crystal substrate to the THG laser light is higher than that of the supporting substrate, the irradiated light is absorbed primarily at the bonding surface side of the piezoelectric single crystal with the supporting substrate and heat is locally generated. With the generated heat, a piezoelectric thin film is detached from the piezoelectric single crystal substrate using the ion implantation layer as a detaching interface, and a piezoelectric composite substrate including a piezoelectric thin film and the supporting substrate is formed.07-15-2010
20100287751METHOD FOR PRODUCING FUNCTIONAL COMPOSITE MATERIAL - Disclosed is a method for more easily producing a functional composite material internally containing a piezoelectric fiber.11-18-2010
20110179614PIEZOELECTRIC MIRROR DEVICE, OPTICAL EQUIPMENT INCORPORATING THE SAME, AND PIEZOELECTRIC MIRROR DEVICE FABRICATION PROCESS - A piezoelectric mirror device fabrication process, including: dividing a silicon wafer into a multiplicity of segments, wherein on one surface of said silicon wafer per segment, a pair of lower electrodes, a mirror portion positioned between said lower electrodes and a pair of mirror support portions adapted to join said mirror portion to said lower electrodes are formed of an electrically conductive material having a Young's modulus of up to 160 GPa and a melting point higher than that of a piezoelectric element to be formed later; stacking the piezoelectric element and an upper electrode on said lower electrodes; removing the silicon wafer in a desired pattern from another surface of said silicon wafer per segment and obtaining a multiplicity of piezoelectric mirror devices; and dicing said multiplicity of piezoelectric mirror devices into individual ones.07-28-2011
20110179613PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method capable of manufacturing a package easily and efficiently. The package manufacturing method includes a jig disposing step of disposing a covering jig covering an outer peripheral portion on one surface of a first board so as to expose a hole forming region through a jig opening formed on the covering jig; and a filling step of filling a filling material constituting at least a part of penetration electrodes into holes. The filling step includes a metal mask disposing step of disposing a metal mask 07-28-2011
20120073099METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - An ion implantation layer is formed in a piezoelectric single crystal substrate by implanting hydrogen ions. A lower electrode is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer is formed. A sacrificial layer is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer and the lower electrode are formed. The formation of the sacrificial layer is performed by direct formation thereof on the surface of the piezoelectric single crystal substrate, for example, by sputtering or coating. A support layer is formed on the piezoelectric single crystal substrate on which the sacrificial layer is formed, and after the surface of the support layer is planarized, a support base material is bonded thereto.03-29-2012
20090320256PIEZOELECTRIC SUBSTRATE, PIEZOELECTRIC ELEMENT, LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE APPARATUS - A piezoelectric substrate of a perovskite-type oxide is expressed by a general formula of ABO12-31-2009
20090044390METHOD FOR PRODUCING DIELECTRIC FILM, METHOD FOR PRODUCING PIEZOELECTRIC ELEMENT, METHOD FOR PRODUCING LIQUID-JET HEAD, DIELECTRIC FILM, PIEZOELECTRIC ELEMENT, AND LIQUID-JET APPARATUS - A method for producing a dielectric film, comprising: a coating step of coating a colloidal solution containing an organometallic compound containing a metal constituting a dielectric film containing at least a lead component to form a dielectric precursor film; a drying step of drying the dielectric precursor film; a degreasing step of degreasing the dielectric precursor film; and a firing step of firing the dielectric precursor film to form a dielectric film, and wherein the drying step includes a first drying step of heating the dielectric precursor film to a temperature lower than the boiling point of a solvent, which is a main solvent of the material, and holding the dielectric precursor film at the temperature for a certain period of time to dry the dielectric precursor film, and a second drying step of drying the dielectric precursor film at a temperature in the range of 140° C. to 170° C., the degreasing step is performed at a degreasing temperature of 350° C. to 450° C. and at a heating-up rate of 15 [° C./sec] or higher, and the firing step is performed at a heating-up rate of 100 [° C./sec] to 150 [° C./sec].02-19-2009
20100325854METHOD FOR POLARIZING A PIEZOCERAMIC MATERIAL - In a method for polarizing a piezoceramic material, first, a base is provided that is made of non-polarized piezoceramic material and has at least two opposite planar electrodes and at least one predetermined breaking point because of which a stress relief fracture forms when a voltage having a first voltage value is applied. A number of voltage pulses, the amplitudes of which follow a time-related envelope curve, is applied to the electrodes of the base. The amplitudes of the voltage pulses in a first section of the envelope curve are higher than the first voltage value, and the amplitudes of the voltage pulses in a second section of the envelope curve that follows the first section have a second voltage value which is sufficient to permanently polarize the piezoceramic material.12-30-2010
20120297595METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE - A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.11-29-2012
20120079692ARRAY OF BAW RESONATORS WITH MASK CONTROLLED RESONANT FREQUENCIES - Methods that create an array of BAW resonators by patterning a mass load layer to control the resonant frequency of the resonators and resonators formed thereby, are disclosed. Patterning the surface of a mass load layer and introducing apertures with dimensions smaller than the acoustic wavelength, or dimpling the mass load layer, modifies the acoustic path length of the resonator, thereby changing the resonant frequency of the device. Patterns of variable density allow for further tuning the resonators and for individualized tuning of a resonator in an array of resonators. Patterning a reflowable material for the mass load layer, thereby providing a variable pattern density and distribution followed by elevating the temperature of the mass load layer above its melting point causes the material to liquefy and fill into the apertures to redistribute the mass load layer, thereby, upon subsequent cooling, providing resonators with a predetermined desired resonant frequency.04-05-2012
20120079691METHOD OF MANUFACTURING PACKAGES, PIEZOELECTRIC VIBRATORS OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK - The present invention provides a novel method of producing piezoelectric vibrators in which a plurality of substrates are formed at once from a wafer, and the wafer is formed with a plurality of electrode holes formed in the respective substrates. Using holders each having a plurality of electrode columns held thereon, the plurality of electrode columns are substantially simultaneously inserted in the electrode holes formed in the wafer.04-05-2012
20120079690METHOD OF PIEZOELECTRIC VIBRATING PIECE, WAFER, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - The present invention provides a novel method of producing piezoelectric vibration pieces in which a plurality of piezoelectric vibration pieces are formed at once from a wafer, using a plurality of photoresist processes. The wafer is marked with wafer marks each unique to a different one of photoresist masks to prevent a wrong use of the photoresist masks during the photoresist processes.04-05-2012
20110265298METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.11-03-2011
20100180415PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREFOR - A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body. Also, the flange is joined with the frame wall such that a clearance between the first end and the joining portion of the flange nearest to the first end is larger than a clearance between a second end in a second direction opposite to the first direction of the main body and the joining portion of the flange nearest to the second end.07-22-2010
20130014361METHOD OF MANUFACTURING A PIEZOELECTRIC VIBRATOR - A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.01-17-2013
20100132175ELECTROACTIVE SOLID-STATE ACTUATOR AND METHOD OF MANUFACTURING THE SAME - The present invention provides an electroactive solid-state actuator, including a solid polymer electrolyte film having first and second main surfaces facing each other, and first and second conductive polymer layers infiltrated into the first and second main surfaces of the solid polymer electrolyte film. Further, a method of manufacturing the electroactive solid-state actuator is provided, the method including preparing a solid polymer film having first and second main surfaces facing each other, infiltrating a monomer of a conductive polymer into the first and second main surfaces of the solid polymer film, followed by polymerization, to form first and second conductive polymer layers, and immersing the solid polymer film into an ionic liquid or liquid electrolyte to be converted to an electrically conductive polymer.06-03-2010
20110146041METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE - A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded.06-23-2011
20080222866MULTILAYERED PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING THE SAME - In a multilayered piezoelectric element having a multilayered structure in which electrode layers and piezoelectric material layers are alternately stacked, an internal electrode and a side electrode can be strongly connected. The element includes a first electrode layer having an end portion that protrudes to an outer side than adjacent piezoelectric material layers on a first side surface of the multilayered structure and providing a first insulating region between a second side surface and itself, a second electrode layer having an end portion that protrudes to an outer side than adjacent piezoelectric material layers on the second side surface of the multilayered structure and providing a second insulating region between the first side surface and itself, a first side electrode connected to the end portion of the first electrode layer, and a second side electrode connected to the end portion of the second electrode layer.09-18-2008
20080222865PIEZOELECTRIC ELEMENT AND METHOD FOR MANUACTURING PIEZOELECTRIC ELEMENT - A piezoelectric element with a substrate, a first electrode film disposed on the substrate, a piezoelectric film disposed on the first electrode film, and a second electrode film disposed on the piezoelectric film, and a method of forming same. The piezoelectric film has a laminated structure composed of a plurality of crystallized piezoelectric thin films. The piezoelectric film has a predetermined thickness and is formed by repeated cycles of a film formation step of forming a piezoelectric thin film and a crystallization heat treatment step of heat-treating the piezoelectric thin film to effect crystallization.09-18-2008
20080222864Method for forming a multi-frequency surface acoustic wave device - Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.09-18-2008
20130167340FABRICATION METHOD OF ACOUSTIC WAVE DEVICE - A fabrication method of an acoustic wave device includes: forming a metal layer between regions that are located on a piezoelectric substrate and in which acoustic wave chips are to be formed, at least a part of a region of the metal layer extending to an extension direction of a dicing line for separating the acoustic wave chips; and scanning the dicing line of the piezoelectric substrate by a laser beam so that the at least a part of the region of the metal layer is not irradiated with the laser beam.07-04-2013
20130167341METHOD FOR MANUFACTURING QUARTZ CRYSTAL UNIT, QUARTZ CRYSTAL OSCILLATOR AND ELECTRONIC APPARATUS - A method for manufacturing a quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork shape having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, a quartz crystal tuning fork resonator having the quartz crystal tuning fork shape, forming at least one groove in at least one of opposite main surfaces of each of the first and second quartz crystal tuning fork tines, determining each of a length of the at least one groove and an overall length of the quartz crystal tuning fork resonator so that a series resistance R07-04-2013
20130167342ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer.07-04-2013
20130111719METHOD FOR IMPLANTING A PIEZOELECTRIC MATERIAL - A method of producing a structure made of a piezoelectric material, including: a) production of a stack including at least one metal layer and at least one conductive layer on a substrate made of piezoelectric material, wherein at least one electrical contact is established between the conductive layer and a metal element outside the stack; b) an ionic and/or atomic implantation, through the conductive layer and the metal layer; c) transfer of the substrate onto a transfer substrate, followed by fracturing of the transferred piezoelectric substrate, in an embrittlement area.05-09-2013
20110265297Method of manufacturing inkjet head - There is provided a method of manufacturing an inkjet head. A method of manufacturing an inkjet head according to an aspect of the invention may include: forming a piezoelectric actuator on a dummy substrate; cutting the piezoelectric actuator into head cell units of an inkjet head; preparing an inkjet head substrate including an ink chamber formed at a position corresponding to the piezoelectric actuator; bonding the dummy substrate and the inkjet head substrate to each other so that the piezoelectric actuator and the ink chamber correspond to each other; and removing the dummy substrate.11-03-2011
20130125359PIEZOELECTRIC MATERIAL, PIEZOELECTRIC DEVICE, AND METHOD OF PRODUCING THE PIEZOELECTRIC DEVICE - Provided are a bismuth-based piezoelectric material whose insulation property is improved while its performance as a piezoelectric body is not impaired and a piezoelectric device using the piezoelectric material. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1):05-23-2013
20080196227DIELECTRIC DEVICE AND ITS MANUFACTURING METHOD - A manufacturing method of a dielectric device includes steps described below. (1) Mixing step: Powders serving as a matrix and additive powders for sintering the matrix are mixed. (2) Mixture heat-treating step: The mixture of the matrix and the additive that has been subject to the mixing step is heat-treated. (3) Deposition layer formation step: The material powders obtained through the mixture heat-treating step are injected toward a substrate so as to form a deposition layer on the substrate. (4) Deposition layer heat-treating step: The deposition layer formed on the substrate through the deposition layer formation step is heat-treated so as to form the dielectric layer on the substrate.08-21-2008
20130145589METHOD OF MANUFACTURING LIQUID EJECTING HEAD, METHOD OF MANUFACTURING LIQUID EJECTING APPARATUS AND METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT - A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer, and forming a second electrode on the piezoelectric layer.06-13-2013

Patent applications in class PIEZOELECTRIC DEVICE MAKING