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Metal fusion bonding

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Class / Patent application numberDescriptionNumber of patent applications / Date published
228101000 PROCESS 942
228033000 INCLUDING MEANS TO APPLY FLUX OR FILLER TO WORK OR APPLICATOR 55
228200100 INCLUDING MEANS TO PROVIDE HEAT BY FRICTION BETWEEN RELATIVELY MOVING SURFACES (I.E., FRICTION WELDER) 47
228100100 MEANS TO APPLY VIBRATORY SOLID-STATE BONDING ENERGY (E.G., ULTRASONIC, ETC.) TO WORK 35
228440300 INCLUDING MEANS TO FORCE OR CLAMP WORK PORTIONS TOGETHER DURING BONDING 19
228008000 WITH CONTROL MEANS RESPONSIVE TO SENSED CONDITION 16
228400100 WITH MEANS TO JUXTAPOSE AND BOND PLURAL WORKPIECES 16
228264000 PROCESS OF DISASSEMBLING BONDED SURFACES, PER SE (E.G., DESOLDERING) 13
228470100 WITH MEANS TO HANDLE WORK OR PRODUCT 13
228560300 SOLDER FORM 12
228045000 INCLUDING MEANS TO MOVE OR GUIDE APPLICATOR 8
228019000 WITH MEANS TO REMOVE, COMPACT, OR SHAPE APPLIED FLUX OR FILLER 7
228051000 METALLIC HEAT APPLICATOR (E.G., SOLDERING IRON, ETC.) 7
228150100 WITH MEANS TO DEFORM WORK, FILLER, OR FLUX PORTION BEFORE FUSION 6
228046000 WITH MEANS TO COOL WORK OR PRODUCT 5
20110198388Flux-free chip to wafer joint serial thermal processor arrangement - A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers,08-18-2011
20100170934METHODS AND SYSTEMS FOR MITIGATING RESIDUAL TENSILE STRESSES - Residual tensile stresses can be mitigated through methods and systems provided by the present invention. Such a method can include securing a metal member (07-08-2010
20100001040DEVICE AND METHOD FOR BRAZING A HEAT PIPE - The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.01-07-2010
20110049220ASSEMBLY FOR HEAD WELDING - The assembly is intended for application to manufacturing of tubes, bottles, boxes. Characterized by improved quality of the weld and low reject percentage. It has a mandrel (03-03-2011
20080237300Method and apparatus for soldering interconnectors to photovoltaic cells - A method and apparatus for soldering interconnectors to photovoltaic cells that, after soldering, prevents bending of the photovoltaic cells due to heat warping caused by heat contraction of the lead wires. The interconnectors are positioned at predetermined positions on the photovoltaic cell, the interconnectors and the photovoltaic cells are held tightly together, and the solder is melted as the photovoltaic cells are heated, after which the photovoltaic cells are sequentially cooled in the long direction of the interconnectors with cold blasts from the end of the photovoltaic cells in the long direction of the interconnector.10-02-2008
228018000 COMBINED 5
20100213243TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT - The present invention relates to a transfer device (08-26-2010
20100230469CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD - In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.09-16-2010
20110132966ALTERNATIVE IGNITION SOURCE SYSTEM FOR AN EXOTHERMIC REACTION MOLD DEVICE - An alternative ignition source system for an exothermic reaction mold device for welding conductors. The system includes a crucible in a block with an open top so that the crucible receives an exothermic weld material. The conductors to be welded exothermically are placed in the weld cavity of the mold. A lid covers the open top wherein the lid has a opening therethrough. An electronic thermal igniter assembly has an ignition component receivable through the opening in the lid so that the exothermic weld material may be ignited either by the electronic thermal igniter assembly or may be ignited by a spark.06-09-2011
20090057373Multi-Purpose End Effector for Welder - A multi-purpose end effector for a welding robot includes a base plate mounted on a robot and carrying a plurality of tools including a welder, a cleaning wheel for cleaning a workpiece, and a buffing wheel for buffing the weld. The tools are arranged in serial order on the base plate beginning with the cleaning wheel to clean workpieces, then the welder for welding the workpieces, and then the buffing wheel to buff the weld.03-05-2009
20110272450DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND APPARATUS - A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps.11-10-2011
228007000 WITH MACHINE PART RESPONSIVE TO TEMPLATE OR PATTERN OR TO INDICIA CARRIED BY AUXILIARY RECORD (E.G., TAPE, CARD, ETC.) 4
20110006105POWER CAPACITOR - Equipment for carrying out a method for manufacturing a power capacitor including at least one capacitor element. The equipment includes a solder pot. A solder head includes a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically). A press unit fixes the capacitor elements. The solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.01-13-2011
20130098971WELDING TARGET POSITION MEASUREMENT DEVICE - According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.04-25-2013
20120074203ENHANCED WELDING DEVICE - The present invention relates to a welding device suitable for joining by welding a first and a second part at a weld joint, said parts defining a joint face between said parts, the device comprising: a traveling support mean (03-29-2012
20120312862GANTRY-BASED WELDING SYSTEM AND METHOD - A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece on a headstock assembly and a tailstock assembly, which define a workpiece or weldment rotational axis extending therebetween. The tailstock assembly can be located at different positions within a workstation for accommodating different lengths of workpieces. Encoders are installed at the moving elements of the system for precisely tracking and providing output to the computer controller. Primary and secondary power/data distribution systems include cable and hose carriers for providing mobile power/data connections to the gantry and also to the robotic arc welders mounted thereon. The power/data distribution systems are elevated above a facility floor to avoid interfering with equipment, personnel and activities at floor level.12-13-2012
228013000 WITH MEANS TO CUT OR SEPARATE WORK, FILLER, FLUX, OR PRODUCT 3
20110168761APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE - An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block.07-14-2011
20120286024STRIP JOINING APPARATUS FOR PIPE MILL EQUIPMENT - Disclosed herein is a strip joining apparatus for pipe mill equipment. The strip joining apparatus cuts a trailing end of a preceding steel strip and a leading end of a following steel strip, and puts the cut surfaces of the two steel strips into contact with each other, and then welds them to each other. Particularly, a cutting blade of a first cutting unit and a cutting blade of a second cutting unit are inclined in the downward direction at predetermined angles relative to each other. Thus, the ends of the two steel strips, which are respectively cut by the cutting blades, define a ‘V’-shape groove. In this state, the cut ends of the two steel strips are put in close contact with each other and are welded to each other, so that the quality of welding of the junction between the thick strips can be enhanced.11-15-2012
20090045243Butt welding and feeding machine - Rolls of steel plates fed to a butt welding and feeding machine, a seamless welding between two adjoining juxtaposed steel plates must be first trimming off both butt ends or leading and trailing edge flanges. After trimming, the trimmed leading and trailing edges flush against each other. Welding torch opposite to a junction line moves along a transversal rail to weld two adjoining juxtaposed steel plates together. Preceding and following steel plates are fed with precision throughout both feeding, discharging rollers driven by servo motors. Steel plate held by a number of jaws urged by springs can reduce inner stress or friction happened between the steel plates; in addition, a gas cutting, machine for trimming off the butt ends, trimmed leading and trailing edges facilitate welding more promptly and efficiently. A good shelf at a front end of the machine can facilitate storing and fixing rolls of steel coil.02-19-2009
228059000 HEAT SHIELD 2
20080272179THERMAL INSULATION FOR A BONDING TOOL - A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.11-06-2008
20120298726PLUMBER'S HEAT SHIELD - A plumber's heat shield comprises an arcuate metallic shell attached to a spring-clamp by means of an obedient shaft which enables the heat shield to be moved to any position relative to the spring-clamp. The arcuate shell is preferably formed from aluminum or other material having high infrared reflectivity. The obedient shaft is preferably formed from helically-wound steel spring outer sheath surrounding a ductile copper wire core. The spring steel outer sheath prevents the ductile copper wire core from being bent at too sharp of a radius (which would cause the ductile core to work-harden and fracture) while at the same time protecting the ductile copper wire core from the open-flame of the soldering torch.11-29-2012
228560100 SPECIALIZED POT 2
20110036899MODULAR SOLDERING APPARATUS - In a modular soldering apparatus a pump assembly (02-17-2011
20090095793SELECTIVE SOLDERING APPARATUS WITH MULTIPLE PUMPS AND THIMBLE PLATE AND NITROGEN COOLED PUMP BEARING ASSEMBLY - A soldering apparatus comprises a solder bath, a body positioned in the bath and having a plurality of main conduits for feeding solder from a solder pump to a nozzle or thimble. Each conduit communicates with a pump chamber and a conduit in a thimble plate on which the thimbles are mounted. The thimble plate is readily replaced by lifting the main body clear of the solder on lifting mechanisms. Thimbles can be positioned at any desired location on the plate, conduits being formed in the plate to lead from the outlet of a respective conduit.04-16-2009
228050000 SEAM BACKUP MEANS 2
20090084829MAGNETIC PLUG WELD TOOL - A magnetic based welding tool having an adjustment knob, a pivot arm, and a copper alloy pad, designed to assist with welding holes, for example, in sheet metal, that are to be welded closed with a MIG or TIG welder, by providing a backup to the hole, to keep the welding material from coming through the hole in excess amounts, and a magnetic base to hold the tool onto a ferrous metal panel, such as steel, with an adjustable arm to keep the copper alloy pad away from the magnetic base and in firm contact with the surface to be welded.04-02-2009
20100001041MAGNETIC PLUG WELD TOOL - A magnetic plug weld tool includes an arm, a copper alloy plate that is rotatably connected to one end of the arm, and a magnetic base that is connected to the arm. The arm is configured to apply a force to the copper alloy plate using the magnetic base.01-07-2010
228300100 MEANS TO BOND BY APPLYING ONLY PRESSURE (E.G., FOR COLD WELDING, ETC.) 2
20080245843Joining Method and Device Produced by this Method and Joining Unit - A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required.10-09-2008
20090014498COMPRESSION BONDING DEVICE - A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.01-15-2009
228025000 INCLUDING APPLICATOR MOVABLE DURING FUSION 2
20110121053Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant.05-26-2011
20110049217WELDING APPARATUS - A welding apparatus (03-03-2011
228057000 MISCELLANEOUS 2
20100243713METAL LIP SEAL AND MACHINE FITTED WITH SAID SEAL - This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements.09-30-2010
20110084117Device for assembly by brazing an end cap onto a cylindrical body and vacuum cartridge comprising one such device - The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device being characterized in that the above-mentioned cover is shaped in such a way that, on the above-mentioned end surface of the cylindrical body, the circular peripheral part of the above-mentioned cover exerts a compressive stress, after brazing, on substantially the whole contact area between the end surface of the cover and the end surface of the cylindrical body.04-14-2011

Patent applications in class Metal fusion bonding

Patent applications in all subclasses Metal fusion bonding