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HARTSDALE, NY US

1. 20110035268 PAYMENT METHOD AND SYSTEM - payment by a bearer to a merchant by virtue of a means of payment 02-10-2011
2. 20110034043 COMMUNICATION WITH A MULTI-CONTACT PAD HAVING A USB APPLICATION 02-10-2011
3. 20110029298 Method of modelling noise injected into an electronic system 02-03-2011
4. 20110026909 OPTICAL SYSTEM FURNISHED WITH A DEVICE FOR INCREASING ITS DEPTH OF FIELD 02-03-2011
5. 20110022768 METHOD AND APPARATUS FOR ENHANCING UNIVERSAL SERIAL BUS APPLICATIONS 01-27-2011
6. 20110017873 DEVICE FOR POWERING THE PUMP OF A ROCKET ENGINE USING AN INERTIA WHEEL 01-27-2011
7. 20110010284 COMMISSION MANAGEMENT SYSTEM - and method for managing soft dollar and commission recapture services over communications network 01-13-2011
8. 20110009915 APPARATUS AND METHOD FOR MOVEMENT OF ELECTRICITY OR FLUID INTO AND OUT OF THE BODY 01-13-2011
9. 20110003402 RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE FILMS USED AS INTER METAL DIELECTRICS 01-06-2011
10. 20100326416 HIGH SPEED ABRASIVE CUTTING BLADE WITH SIMULATED TEETH 12-30-2010
11. 20100312233 Radio-frequency treatment of skin tissue with shock-free handpiece 12-09-2010
12. 20100171032 SELF CALIBRATION APPROACH FOR MASS SPECTROMETRY 07-08-2010
13. 20100042096 MIS electrosurgical handpiece - electrosurgical handpiece comprising a squeezable handle connected to extend and retract bipolar electrodes from a rigid 02-18-2010
14. 20100023006 RF intervertebral disc surgical system - spinal surgical system comprising a plurality of surgical components for cooperating with a electrosurgical 01-28-2010
15. 20090321545 CO-AXIAL BASKET MILL AND METHOD OF USE - For use in a basket mill having a process vessel in which particles are ground so as to reduce their size 12-31-2009
16. 20090302213 INTERACTIVE METHOD FOR IDENTIFYING IONS FROM MASS SPECTRAL DATA 12-10-2009
17. 20090296331 DUAL SCREEN PRESENTATION NOTEBOOK COMPUTER 12-03-2009
18. 20090210167 COMPUTATIONAL METHODS AND SYSTEMS FOR MULTIDIMENSIONAL ANALYSIS 08-20-2009
19. 20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS 08-06-2009
20. 20090197103 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS 08-06-2009
21. 20090152455 METHODS FOR CALIBRATING MASS SPECTROMETRY (MS) AND OTHER INSTRUMENT SYSTEMS AND FOR PROCESSING MS AND OTHER DATA 06-18-2009
22. 20090080833 APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGUIDES 03-26-2009
23. 20090076737 QUALITATIVE AND QUANTITATIVE MASS SPECTRAL ANALYSIS 03-19-2009
24. 20090062786 Tri-frequency electrosurgical instrument 03-05-2009
25. 20090039472 STRUCTURE AND METHOD FOR CREATING RELIABLE DEEP VIA CONNECTIONS IN A SILICON CARRIER 02-12-2009
26. 20090038004 ROLE CHANGE BASED ON COUPLING OR DOCKING OF INFORMATION HANDLING APPARATUS AND METHOD FOR SAME 02-05-2009
27. 20080302957 IDENTIFYING IONS FROM MASS SPECTRAL DATA 12-11-2008
28. 20080294160 RF endoscopic electrosurgical instrument 11-27-2008
29. 20080287947 RF intervertebral electrosurgical probe - electrosurgical instrument for spinal procedures comprises an elongated tubular member configured to fit 11-20-2008
30. 20080266502 METHOD OF PRODUCING UV STABLE LIQUID CRYSTAL ALIGNMENT 10-30-2008
31. 20080261715 GOLF CLUB WITH ADJUSTABLE CENTER OF GRAVITY HEAD 10-23-2008
32. 20080237458 AUTOMATED MASS SPECTRAL IDENTIFICATION - automated or fully automated mass spectral system and a method of operating the system to identify a sample ion 10-02-2008
33. 20080215010 APPARATUS AND METHOD FOR USING AN INTRAOSSEOUS SPACE FOR MOVING FLUID INTO AND OUT OF THE BODY 09-04-2008
34. 20080206979 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008
35. 20080203585 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008
36. 20080202792 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008