Inventors list |
Agents list |
Assignees list |
List by place |
Classification tree browser |
Top 100 Inventors |
Top 100 Agents |
Top 100 Assignees |
P.O. BOX 70250, US
1. 20110045610 UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMICONDUCTOR PROCESSING 02-24-20112. 20110025338 Monitoring of electroplating additives - The working electrode in the flow channel of a flow-through electrolytic detection cell is preconditioned by 02-03-2011
3. 20100320609 WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING 12-23-2010
4. 20100320081 APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING 12-23-2010
5. 20100308463 INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS 12-09-2010
6. 20100300888 PULSE SEQUENCE FOR PLATING ON THIN SEED LAYERS 12-02-2010
7. 20100297853 METHOD FOR PURIFYING ACETYLENE GAS FOR USE IN SEMICONDUCTOR PROCESSES 11-25-2010
8. 20100278623 MAGNETIC ROTATIONAL HARDSTOP FOR ROBOT - Rotational hardstop assemblies that provide greater than 360 degrees of non-continuous rotation for rotating 11-04-2010
9. 20100270004 TAILORED PROFILE PEDESTAL FOR THERMO-ELASTICALLY STABLE COOLING OR HEATING OF SUBSTRATES 10-28-2010
10. 20100267235 METHODS FOR DEPOSITING ULTRA THIN LOW RESISTIVITY TUNGSTEN FILM FOR SMALL CRITICAL DIMENSION CONTACTS AND INTERCONNECTS 10-21-2010
11. 20100267231 APPARATUS FOR UV DAMAGE REPAIR OF LOW K FILMS PRIOR TO COPPER BARRIER DEPOSITION 10-21-2010
12. 20100267230 METHOD FOR FORMING TUNGSTEN CONTACTS AND INTERCONNECTS WITH SMALL CRITICAL DIMENSIONS 10-21-2010
13. 20100261349 UV TREATMENT FOR CARBON-CONTAINING LOW-K DIELECTRIC REPAIR IN SEMICONDUCTOR PROCESSING 10-14-2010
14. 20100219920 MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL 09-02-2010
15. 20100200412 Process For Through Silicon Via Filling - semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the 08-12-2010
16. 20100187693 DIFFUSION BARRIER LAYERS - Provided are methods and apparatuses for depositing barrier layers for blocking diffusion of conductive materials from 07-29-2010
17. 20100159694 METHOD FOR DEPOSITING THIN TUNGSTEN FILM WITH LOW RESISTIVITY AND ROBUST MICRO-ADHESION CHARACTERISTICS 06-24-2010
18. 20100155254 WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS 06-24-2010
19. 20100151691 METHOD FOR IMPROVED THICKNESS REPEATABILITY OF PECVD DEPOSITED CARBON FILMS 06-17-2010
20. 20100144140 METHODS FOR DEPOSITING TUNGSTEN FILMS HAVING LOW RESISTIVITY FOR GAPFILL APPLICATIONS 06-10-2010
21. 20100116672 METHOD AND APPARATUS FOR ELECTROPLATING - apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive 05-13-2010
22. 20100099271 METHOD FOR IMPROVING PROCESS CONTROL AND FILM CONFORMALITY OF PECVD FILM 04-22-2010
23. 20100055924 APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON WAFERS 03-04-2010
24. 20100055904 METHOD FOR REDUCING TUNGSTEN ROUGHNESS AND IMPROVING REFLECTIVITY 03-04-2010
25. 20100055342 MODULATED ION-INDUCED ATOMIC LAYER DEPOSITION (MII-ALD) 03-04-2010
26. 20100044236 METHOD AND APPARATUS FOR ELECTROPLATING - apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive 02-25-2010
27. 20100041226 Process For Through Silicon Via Filing - semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the 02-18-2010
28. 20100035427 METHODS FOR GROWING LOW-RESISTIVITY TUNGSTEN FILM 02-11-2010
29. 20100032310 Method and apparatus for electroplating - apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive 02-11-2010
30. 20100032304 High Resistance Ionic Current Source - substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon 02-11-2010
31. 20100032303 Method and apparatus for electroplating including remotely positioned second cathode 02-11-2010
32. 20100015805 Wet Etching Methods for Copper Removal and Planarization in Semiconductor Processing 01-21-2010
33. 20100009533 Conformal Films on Semiconductor Substrates 01-14-2010
34. 20090305516 METHOD FOR PURIFYING ACETYLENE GAS FOR USE IN SEMICONDUCTOR PROCESSES 12-10-2009
35. 20090286381 Protective Layer To Enable Damage Free Gap Fill 11-19-2009
36. 20090283499 Fabrication of semiconductor interconnect structure 11-19-2009
37. 20090283037 Edge Profiling For Process Chamber Shields 11-19-2009
38. 20090277472 Photoresist Stripping Method and Apparatus 11-12-2009
39. 20090260571 Showerhead for chemical vapor deposition 10-22-2009
40. 20090239390 METHODS FOR PRODUCING LOW STRESS POROUS AND CDO LOW-K DIELECTRIC MATERIALS USING PRECURSORS WITH ORGANIC FUNCTIONAL GROUPS 09-24-2009
41. 20090163025 METHODS FOR FORMING ALL TUNGSTEN CONTACTS AND LINES 06-25-2009
42. 20090149022 METHOD FOR IMPROVING UNIFORMITY AND ADHESION OF LOW RESISTIVITY TUNGSTEN FILM 06-11-2009
43. 20090143911 High throughput method of in transit wafer position correction in system using multiple robots 06-04-2009
44. 20090142167 Loadlock designs and methods for using same 06-04-2009
45. 20090142163 Wafer position correction with a dual, side-by-side wafer transfer robot 06-04-2009
46. 20090132062 APPARATUS AND METHODS FOR PRECOMPILING PROGRAM SEQUENCES FOR WAFER PROCESSING 05-21-2009
47. 20090095220 TEMPERATURE CONTROLLED SHOWERHEAD - for chemical vapor deposition chambers enhances heat dissipation to enable accurate temperature control with an 04-16-2009
48. 20090095219 Temperature controlled showerhead - for chemical vapor deposition chambers enhances heat dissipation to enable accurate temperature control with an 04-16-2009
49. 20090095218 Temperature controlled showerhead - for chemical vapor deposition chambers enhances heat dissipation to enable accurate temperature control with an 04-16-2009