| ZyCube Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110127652 | THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME - A three-dimensional semiconductor integrated circuit device is provided. A first semiconductor chip includes a solid-state circuit and is smaller than a base, and is stacked on the base. The first chip is buried by a first filling material having approximately the same contour as the base. Buried electrodes that penetrate through the first chip along its thickness direction are formed in the first chip. A second semiconductor chip includes a solid-state circuit and is smaller than the base, and is stacked on the first chip. The second chip is buried by a second filling material having approximately the same contour as the base. Buried electrodes that penetrate through the second chip along its thickness direction are formed in the second chip. The first and second filling materials have processibilities required for forming the buried electrodes and thermal expansion coefficients equivalent to those of the first and second chips, respectively. | 06-02-2011 |
| 20090256260 | SEMICONDUCTOR DEVICE - A semiconductor device including a semiconductor element and a functional member fixed thereto with an adhesive film is provided, where the performance or reliability degradation due to moisture entered by way of the adhesive film itself or the interfaces between the adhesive film and members adjacent thereto can be suppressed with a simple structure. The semiconductor element has an active region for realizing a predetermined function, formed on a surface of the element. The functional member has a predetermined function and is fixed on a surface side of the semiconductor element with the adhesive film. A metal film covers a region including at least all outer side faces of the semiconductor element, all outer side faces of the adhesive film, an interface between the adhesive film and the semiconductor element, and an interface between the adhesive film and the functional member. | 10-15-2009 |
| 20090149023 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE - A method of fabricating a semiconductor device having a three-dimensional stacked structure is provided, which realizes easily the electrical interconnection between the stacked semiconductor circuit layers along the stacking direction by using buried interconnections. | 06-11-2009 |
| 20090115042 | SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME - A three-dimensional stacked structured semiconductor device comprising semiconductor circuit layers stacked on a support substrate, and a method of fabricating the device are provided. | 05-07-2009 |
