| ZHONGSHAN WEIQIANG TECHNOLOGY CO., LTD Patent applications |
| Patent application number | Title | Published |
|---|
| 20120080177 | HIGH-POWER FINLESS HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components. | 04-05-2012 |
| 20120080176 | HIGH-POWER FINNED HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components. | 04-05-2012 |
| 20120043884 | LED LAMP TUBE - An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects. | 02-23-2012 |
| 20110277955 | VAPOR CHAMBER - A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues. | 11-17-2011 |
| 20110277311 | VAPOR CHAMBER MANUFACTURING METHOD - A vapor chamber manufacturing method, comprises steps of material preparation, powder filling and sintering, pre-punching, supporting structure infilling, the first pressing, the first sealing, fluid injection, and vacuum processing; a sealing structure comprises a semi-finished vapor chamber with a vacuum cavity, a fluid injection port positioned on one side of the vapor chamber, and a supporting structure filled in the vacuum cavity and supporting the shape of the vapor chamber, wherein the fluid injection port is formed of one portion of one side of the vapor chamber by pressing and sealing, no fine metal pipe as fluid injection port is required herein; after the step of fluid injection, an integrated step of vacuum pumping, pressing and sealing is conducted within a vacuum chamber, to provide the product with higher performance and lower rejection rate. | 11-17-2011 |
| 20110221324 | LIGHT EMITTING DIODE (LED) LAMP - A light emitting diode (LED) lamp includes a standardized connector; an LED module; a heat dissipating module; an angle adjusting ring; and an isolating ring. The LED module is electrically connected to the standardized connector and includes a circuit board and at least one LED unit electrically connected to the circuit board. The heat dissipating module is for preventing the LED module from overheating and includes at least one heat pipe on which the LED unit is disposed, a rear heat dissipating shield, a piston module, a transmission module, a heat dissipating fan, and a convection fan. The angle adjusting ring is disposed between the LED module and the standardized connector for rotating the LED module so as to change a light emitting direction of the LED module. The isolating ring is used to avoid the electrical connection of the angle adjusting ring and the standardized connector. | 09-15-2011 |
