ZHONGSHAN WEIQIANG TECHNOLOGY CO., LTD Patent applications |
Patent application number | Title | Published |
20130229799 | LED PROJECTION LAMP - The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a plurality of U-shaped first heat pipes; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a plurality of U-shaped second heat pipes. | 09-05-2013 |
20130223064 | LED PROJECTION LAMP - The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a first vapor chamber; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a second vapor chamber. | 08-29-2013 |
20120313526 | LED LIGHTING SYSTEM AND HIGH-POWER LED LAMP - The present invention relates to a high-power LED lamp. The lamp includes an LED module, an inner heat sink disposing air passages along an axial direction thereof, a heat pipe assembly including multiple U-shaped heat pipes, and an outer heat sink. Middle sections of the heat pipes form a smooth surface on which the LED module is attached. Straight sections of the heat pipes are coiled around the inner heat sink. The smooth surface is located at an end of the inner heat sink not to block the air passages of the inner heat sink. An annular vapor chamber is packaged a grid-shaped configuration of the heat pipes and attached to each heat pipe. The invention achieves fast heat conduction and dissipates the heat via the inner and outer heat sinks. | 12-13-2012 |
20120313525 | LED LIGHTING SYSTEM AND HIGH-POWER LED LAMP - The present invention relates to a high-power LED lamp. The lamp includes an LED module, an inner heat sink disposing air passages along an axial direction thereof, a heat pipe assembly including multiple U-shaped heat pipes, and an outer heat sink. Middle sections of the heat pipes form a smooth surface on which the LED module is attached. Straight sections of the heat pipes are coiled around the inner heat sink. The smooth surface is located at an end of the inner heat sink not to block the air passages of the inner heat sink. An annular vapor chamber is packaged a grid-shaped configuration of the heat pipes and attached to each heat pipe. The invention achieves fast heat conduction and dissipates the heat via the inner and outer heat sinks. | 12-13-2012 |
20120248487 | LIGHT EMITTING DIODE PACKAGING STRUCTURE - The present invention discloses an LED packaging structure, which comprises a metal housing having a cavity and two open ends, a sintered two-phase-flow heat transfer device having a flat top mounting plane, a lens disposed in the first open end, at least one LED chip mounted in the cavity of the metal housing and on the mounting plane of the two-phase-flow heat transfer device; the LED chip is connected with an electrical connection device, and wherein the sintered two-phase-flow, electrical connection device and LED chip are fixed together through a fixing base; as using a sintered two-phase-flow heat transfer device for heat dissipation, the heat generated by the LED could be expelled in time for dealing with long-term continual work, and thus the LED chip could have a longer service life; in addition, the lens used in the present invention could improve the luminescent efficiency. | 10-04-2012 |
20120243256 | LED LIGHTING DEVICE WITH LIGHT GUIDE PLATE - A light guide plate includes a lateral side through which light enters and a front side through which light exits. A phosphor is coated on the lateral side. A light source includes a plurality of light emitting diodes (LEDs) having wavelengths of 230-520 nanometers (nm). The LEDs are mounted proximate to the lateral side and corresponding to, but separated from, the phosphor. A reflector includes a reflective surface and is mounted on a back side of the light guide plate with the reflective surface facing the light guide plate. A frame fixes the light guide plate, the light source, and the reflector. Colors of the phosphor and the light source are complementary. The phosphor absorbs light from the light source to transition into an excited state. The light guide plate outputs light from the light source and the phosphor through the front side. | 09-27-2012 |
20120235580 | Network controlled interior lighting system - A network controlled indoor lighting system is disclosed, which is constructed based on a device control unit with network connectivity, and a remote controller containing the software for users to control the interior lighting system. The system allows users to control a plurality of LED lamps in terms of brightness, color temperature, beam angle and illumination direction. The system has single/multi-point control, and online error diagnosis. | 09-20-2012 |
20120080177 | HIGH-POWER FINLESS HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components. | 04-05-2012 |
20120080176 | HIGH-POWER FINNED HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components. | 04-05-2012 |
20120043884 | LED LAMP TUBE - An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects. | 02-23-2012 |
20110277955 | VAPOR CHAMBER - A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues. | 11-17-2011 |
20110277311 | VAPOR CHAMBER MANUFACTURING METHOD - A vapor chamber manufacturing method, comprises steps of material preparation, powder filling and sintering, pre-punching, supporting structure infilling, the first pressing, the first sealing, fluid injection, and vacuum processing; a sealing structure comprises a semi-finished vapor chamber with a vacuum cavity, a fluid injection port positioned on one side of the vapor chamber, and a supporting structure filled in the vacuum cavity and supporting the shape of the vapor chamber, wherein the fluid injection port is formed of one portion of one side of the vapor chamber by pressing and sealing, no fine metal pipe as fluid injection port is required herein; after the step of fluid injection, an integrated step of vacuum pumping, pressing and sealing is conducted within a vacuum chamber, to provide the product with higher performance and lower rejection rate. | 11-17-2011 |
20110221324 | LIGHT EMITTING DIODE (LED) LAMP - A light emitting diode (LED) lamp includes a standardized connector; an LED module; a heat dissipating module; an angle adjusting ring; and an isolating ring. The LED module is electrically connected to the standardized connector and includes a circuit board and at least one LED unit electrically connected to the circuit board. The heat dissipating module is for preventing the LED module from overheating and includes at least one heat pipe on which the LED unit is disposed, a rear heat dissipating shield, a piston module, a transmission module, a heat dissipating fan, and a convection fan. The angle adjusting ring is disposed between the LED module and the standardized connector for rotating the LED module so as to change a light emitting direction of the LED module. The isolating ring is used to avoid the electrical connection of the angle adjusting ring and the standardized connector. | 09-15-2011 |