ZHEN DING TECHNOLOGY CO., LTD. Patent applications |
Patent application number | Title | Published |
20150136457 | INTERPOSER AND METHOD FOR MANUFACTURING SAME - An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a bottom surface and a top surface, and defines a receiving through hole extending through the bottom surface and the top surface. The photosensitive dielectric film is mounted on the bottom surface. The photosensitive dielectric film defines a through hole spatially corresponding to and communicating with the receiving through hole. The conductive layer is mounted on an end of the photosensitive dielectric film away from the insulating substrate. The conductive layer covers an end of the through hole. | 05-21-2015 |
20150034364 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME - An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening. | 02-05-2015 |
20150024552 | SUBSTRATE, CHIP PACKAGE AND METHOD FOR MANUFACTURING SUBSTRATE - A substrate includes a first wiring substrate, a second wiring substrate, and an adhesive sheet. The first wiring substrate includes a number of first connecting pads and a first penetrating room. The second wiring substrate includes a number of second connecting pads. The adhesive sheet includes a number of through holes and a second penetrating room. The through holes are filled with a conducting material. The adhesive sheet and the first wiring substrate are orderly pressed on the second wiring substrate. The conducting material is connected to the first connecting pads and the second connecting pads. The first penetrating room of the first wiring substrate and the second penetrating room of the adhesive sheet cooperatively form a receiving recess. | 01-22-2015 |
20140374153 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A PCB includes at least three single layer circuit boards laminated together. The single layer circuit boards include two outer circuit boards and at least one inner circuit board. Each single layer circuit board includes a dielectric layer and a conductive layer on a surface of the dielectric layer. The dielectric layer is selected from a material of thermoplastic resin. Each single layer circuit board defines at least one blind hole passing through the dielectric layer and is ended at the conductive layer. Each blind hole is filled with a filler material electrically connected to the conductive layer. The conductive layer of the at least one inner circuit board forms a first conductive circuit pattern, and the conductive layers of the outer circuit boards each form a second conductive circuit pattern. The second conductive circuit pattern is electrically connected to the first conductive circuit pattern by the filler material. | 12-25-2014 |
20140361439 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A packaging substrate includes a first wiring layer, a first dielectric layer formed on the first wiring layer, a second wiring layer formed on the first dielectric layer, and a number of copper pillar bumps. Each copper pillar bump includes a base portion and a protruding portion. The base portion is connected to the first wiring layer, and the protruding portion is formed on the base portion. A size of the protruding portion is less than a size of the base portion, and a size of the copper pillar bump gradually increases from the protruding portion to the base portion. | 12-11-2014 |
20140353006 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a second receiving hole. The second receiving hole and the first receiving hole cooperatively form a receiving cavity. The first adhesive sheet includes a supporting surface. The electronic device is received in the receiving cavity, and includes two electrodes. The second adhesive sheet is adjacent to the second wiring layer, and includes a bottom surface. The third wiring layer is formed on the supporting surface and contacts with the two electrodes. The fourth wiring layer is formed on the bottom surface. | 12-04-2014 |
20140305683 | COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence. | 10-16-2014 |
20140300009 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A package structure includes a flexible-rigid PCB and a chip. The flexible PCB includes a flexible PCB, a glue piece and an outer trace layer. The flexible PCB includes two bending portions and a fixing portion connected between the two bending portions, and includes an insulating layer and an inner trace layer formed on the insulating layer. The glue piece is adhered to the fixing portion. The outer trace layer is adhered to the glue piece and includes conductive pads. The fixing portion, the glue piece and the outer trace layer form a rigid portion, the bending portions form flexible portions. The chip is packaged on the rigid portion and includes electrode pads electrically connected to the conductive pads. | 10-09-2014 |
20140185259 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts. | 07-03-2014 |
20140185257 | PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTURING SAME - A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer. | 07-03-2014 |
20140182900 | RIGID-FLEX PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME - An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility. | 07-03-2014 |
20140182899 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A rigid-flexible printed circuit board includes a first circuit substrate, a third circuit substrate, and an adhesive sheet sandwiched between the first circuit substrate and the third circuit substrate. The first circuit substrate is a rigid circuit substrate. The third circuit substrate is a flexible circuit substrate, and includes an exposed area and two lamination areas. The exposed area is sandwiched between the two lamination areas. The first circuit substrate and the adhesive sheet are only laminated onto the two lamination areas. A dielectric layer of the first circuit substrate is a rigid epoxy glass cloth laminate, and a dielectric layer of the third circuit substrate is a flexible epoxy glass cloth laminate. | 07-03-2014 |
20140182892 | PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTRUING SAME - A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste. | 07-03-2014 |
20140175646 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - An exemplary package substrate includes a package substrate, a first connection substrate, a first chip, a dielectric adhesive sheet, a second chip, and a second connection substrate. The package substrate includes many first and second electrical contact pads. The first connection substrate includes many third and fourth electrical contact pads. Each fourth electrical contact pad is electrically connected to one first electrical contact pad. The first chip includes many first electrode pads. Each first electrode pad is electrically connected to the corresponding third electrical contact pad. The second chip is connected to the first chip by the dielectric adhesive sheet, and includes many second electrode pads. The second connection substrate includes many fifth and sixth electrical contact pads. Each fifth electrical contact pad is electrically connected to one second electrode pad, and each sixth electrical contact pad is electrically connected to one second electrical contact pad. | 06-26-2014 |
20140158410 | POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD - A polyimide is formed by dehydrating a polyamic acid. The polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride. The diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane, and the fluorine dianhydride is 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride. When a color of the polyimide is defined by Lab color space, b component is set from about −10 to about +10. The disclosure further relates to a copper-clad laminate, a flexible printed circuit, and a method for manufacturing the flexible printed circuit. | 06-12-2014 |
20140158407 | PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES - A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and includes two conductive pads and a grid-shaped conductive trace pattern. the grid-shaped conductive trace pattern includes a plurality of conductive traces, the conductive traces form a plurality of strips connected one by one, each strip includes a plurality of triangles arranged in a line, each two adjacent triangles in a same strip have a same side, each two adjacent triangles in different strips have a same side, two distal ends of each strip are connected to the two conductive pads respectively. The transparent cover layer s the grid-shaped conductive trace pattern and parts of the first surface without forming the conductive trace layer. | 06-12-2014 |
20140151092 | PCB WITH VISIBLE CIRCUIT AND METHOD FOR MAKING AND USING PCB WITH VISIBLE CIRCUIT - A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA). | 06-05-2014 |
20140146504 | CIRCUIT BOARD, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A circuit board includes at least one core substrate, at least one insulating layer and at least one dielectric sheet. An opening is defined in the insulating layer corresponding to the core substrate. An area of cross-section of the opening is larger than that of the core substrate. The core substrate is received in the opening. The dielectric sheet is positioned on one side surface of the core substrate and the insulating layer. A cavity is defined in the circuit board. A number of pads of the core substrate are exposed via the cavity. The present disclosure also provides a method for manufacturing the circuit board and package structure. | 05-29-2014 |
20140144685 | PRINTED CIRCUIT BOARD WITH CIRCUIT VISIBLE AND METHOD FOR MANUFACTURING SAME - A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade. | 05-29-2014 |
20140144675 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating layers and the third wiring layers are alternately arranged on the first wiring layer, such that there is one first insulating layer sandwiched between each two adjacent wiring layers of the first wiring layer and the third wiring layers. The first high density wiring substrate includes first high density wiring layers and third insulating layers, which are alternately arranged on each other. An outmost first high density wiring layer is exposed outside to define third electrical contact pads corresponding to the first electrical contact pads. | 05-29-2014 |
20140118951 | INTERPOSER AND PACKAGE ON PACKAGE STRUCTURE - A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure. | 05-01-2014 |
20140117553 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body. | 05-01-2014 |
20140110152 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first outer electrically conductive pattern layer, a first insulation layer, a first inner electrically conductive pattern layer, a connection adhesive sheet, a second inner electrically conductive layer, a second insulation layer, a second outer electrically conductive pattern layer, and a identification mark, which are arranged in that order. The first outer electrically conductive pattern layer includes many first gold fingers. The second outer electrically conductive pattern layer includes many second gold fingers. The blind hole corresponds to the identification mark. The first outer electrically conductive pattern layer, the second outer electrically conductive pattern layer, and the at least one identification mark are simultaneously formed. | 04-24-2014 |
20140085833 | CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME - A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer. | 03-27-2014 |
20140083757 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via. | 03-27-2014 |
20140083744 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion. | 03-27-2014 |
20140078706 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads. | 03-20-2014 |
20140061951 | PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a package on package structure includes the step of: providing a package body comprising a first package device and a connection substrate, the first package device comprising a number of first solder pads, the connection substrate comprising a substrate main body and a number of first electrically conductive posts, the first electrically conductive posts spatially corresponding to and being connected to the first solder pads, and a solder paste printed on each first electrically conductive post; attaching a second device on the second surface of the connection substrate, thereby obtaining a stacked structure, the second package device comprising a number of second solder pads; and solidifying the solder paste on each first electrically conductive post, such that each second solder pad is soldered to the corresponding first electrically conductive post using the solder paste, thereby obtaining a package on package structure. | 03-06-2014 |
20140061903 | PACKAGE ON PACKAGE STRUCTRUE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a package on package structure includes the steps of: providing a connection substrate comprising a main body and electrically conductive posts, the main body comprising a first surface and an opposite second surface, each electrically conductive post passing through the first and second surfaces, and each end of the two ends of the electrically conductive post protruding from the main body; arranging a first package device on a side of the first surface of the connection substrate, arranging a package adhesive on a side of the second surface of the connection substrate, thereby obtaining a semi-finished package on package structure; and arranging a second package device on a side of the package adhesive furthest from the first package device, thereby obtaining a package on package structure. | 03-06-2014 |
20140060902 | PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the c conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer. | 03-06-2014 |
20140054079 | MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB. | 02-27-2014 |
20140054075 | PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask. | 02-27-2014 |
20140054074 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar. | 02-27-2014 |
20140053397 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a PCB includes certain steps. A printed circuit board sheet is provided. The printed circuit board includes an unwanted portion and a printed circuit board unit which includes a plurality of contact pads. An imaginary boundary line is defined between the printed circuit board unit and the unwanted portion. Each of the contact pads defines an outline. A nearest distance between the outline and the imaginary boundary line is less than 4 millimeters. The printed circuit board sheet is punched along the imaginary boundary line, forming one hollow portion or a plurality of through slots. A plurality of burrs is generated on an inner surface of the hollow portion or the through slots. The burrs are removed using a low-energy laser cutting process, thereby obtaining a printed circuit board. A laser power used in the low-energy laser cutting process is 5-8 watts. | 02-27-2014 |
20140036465 | PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via. | 02-06-2014 |
20140027893 | CIRCUIT SUBSTRATE FOR MOUNTING CHIP, METHOD FOR MANUFACTURING SAME AND CHIP PACKAGE HAVING SAME - A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same. | 01-30-2014 |
20140027164 | PRINTED CIRCUIT BOARD WITH PATTERNED ELECTRICALLY CONDUCTIVE LAYER THEREIN VISIBLE AND METHOD FOR MANUFACTURING SAME - This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure. | 01-30-2014 |
20130341073 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A packaging substrate includes an insulating layer, a wiring layer and a solder mask. The insulating layer and the solder mask being arranged on two opposite sides of the wiring layer. The insulating layer defines a via hole. The wiring layer covers the via hole. The wiring layer includes a pad area. Two sides of the pad area are respectively exposed outside from the solder mask and in the via hole. | 12-26-2013 |
20130318785 | METHOD FOR MANUFACTURING IC SUBSTRATE - A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units. | 12-05-2013 |
20130313002 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a multilayer printed circuit board includes the step as follows: providing a glass wiring substrate, the glass wiring substrate comprising a first electrically conductive pattern, a glass base, and a second electrically conductive pattern, the second electrically conductive pattern comprising a plurality of first solder pads; laminating a first lamination substrate onto the glass wiring substrate, the first lamination substrate comprising a first base layer and a first electrically conductive material layer on the first base layer, such that the first base layer is sandwiched between the first electrically conductive pattern and the first electrically conductive material layer; patterning the first electrically conductive material layer to form a third electrically conductive pattern, and electrically connecting the third electrically conductive pattern to the first electrically conductive pattern, and forming a first solder mask on the glass wiring substrate, thereby obtaining a multilayer printed circuit board. | 11-28-2013 |
20130284692 | RESIN COATED COPPER FOIL, METHOD FOR MANUFACTURING SAME AND MULTI-LAYER CIRCUIT BOARD - A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 4,4′-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board. | 10-31-2013 |
20130220683 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board includes an inner substrate, a stuffing layer, an adhesive layer and a plurality of second copper trace layer. The inner substrate includes an insulating layer and an copper trace layer formed on a surface of the insulating layer. The first surface includes a low copper density region. In the low copper density region, the area of first surface covered by the copper trace layer is less than 60 percent of the area of the low copper density region. The stuffing layer is only formed on the first inner substrate in the region. The present disclosure also provides a method for manufacturing the printed circuit board. | 08-29-2013 |
20120260501 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB. | 10-18-2012 |
20120211267 | PRINTED CIRCUIT BOARD SUBSTRATE - A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board. | 08-23-2012 |
20120175249 | APPARATUS FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD - A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material. | 07-12-2012 |
20120160803 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained. | 06-28-2012 |
20120160554 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME - An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals. | 06-28-2012 |
20120160398 | APPARATUS AND METHOD FOR PRESSING PRINTED CIRCUIT BOARD - An apparatus for heating and pressing a printed circuit board includes a first pressing member, a second pressing member, a driving member, a heater and an electromagnetic assembly. The driving member is configured for driving the first pressing member and the second pressing member to move toward or away from each other. The heater is configured for heating one of the first and second walls, and the electromagnetic assembly is capable of generating a magnetic field to attract the second wall to create additional pressure. | 06-28-2012 |
20120103521 | ETCHING APPARATUS WITH SUCTION MECHANISM - An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa. | 05-03-2012 |
20120097784 | APPARATUS FOR TRANSPORTING FLEXIBLE PRINTED CIRCUIT BOARD STRIP - An apparatus for transporting an FPCB strip includes a feeding spool, a collecting spool, and a buffer device between the feeding spool and the collecting spool. The feeding spool is configured for feeding an FPCB strip. The collecting spool is for collecting the FPCB strip from the buffer device. The buffer device includes a container, a redirection cylinder and an air pump. The redirection cylinder has a cavity defined therein, and a plurality of air exit holes defined in a side wall thereof. The air exit holes are in communication with the cavity. The air pump is in communication with the container and the cavity of the redirection cylinder for evacuating the air in the container so as to retain the bent portion in situ in the container and blowing air into the cavity, so as to form a cushion of air at the air exit holes. | 04-26-2012 |
20120097326 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate. | 04-26-2012 |
20120066903 | METHOD OF MANUFACTURING FPCB SUBSTRATE - A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer. | 03-22-2012 |
20120023744 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n−2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions. | 02-02-2012 |