| ZHEN DING TECHNOLOGY CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20120103521 | ETCHING APPARATUS WITH SUCTION MECHANISM - An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa. | 05-03-2012 |
| 20120097784 | APPARATUS FOR TRANSPORTING FLEXIBLE PRINTED CIRCUIT BOARD STRIP - An apparatus for transporting an FPCB strip includes a feeding spool, a collecting spool, and a buffer device between the feeding spool and the collecting spool. The feeding spool is configured for feeding an FPCB strip. The collecting spool is for collecting the FPCB strip from the buffer device. The buffer device includes a container, a redirection cylinder and an air pump. The redirection cylinder has a cavity defined therein, and a plurality of air exit holes defined in a side wall thereof. The air exit holes are in communication with the cavity. The air pump is in communication with the container and the cavity of the redirection cylinder for evacuating the air in the container so as to retain the bent portion in situ in the container and blowing air into the cavity, so as to form a cushion of air at the air exit holes. | 04-26-2012 |
| 20120097326 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate. | 04-26-2012 |
| 20120066903 | METHOD OF MANUFACTURING FPCB SUBSTRATE - A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer. | 03-22-2012 |
| 20120023744 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n−2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions. | 02-02-2012 |
