Englewood, CO US
|ZettaCore, Inc. Patent applications|
|Patent application number||Title||Published|
|20120125514||Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards - Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.||05-24-2012|
|20080269501||Synthesis of Phosphono-Substituted Porphyrin Compounds for Attachment to Metal Oxide Surfaces - A method of making a phosphono-substituted dipyrromethane comprises reacting an aldehyde or acetal having at least one phosphono group substituted thereon with pyrrole to produce a phosphono-substituted dipyrromethane; and wherein the phosphono is selected from the group consisting of dialkyl phosphono, diaryl phosphono, and dialkylaryl phosphono. Additional methods, intermediates and products are also described.||10-30-2008|
|20080209876||Liquid Composite Compositions Using Non-Volatile Liquids and Nanoparticles and Uses Thereof - A solvent composition comprising an organic solvent; dispersed nanoparticles; and a non-volatile electrolyte.||09-04-2008|
Patent applications by ZettaCore, Inc.