Zeta Instruments, Inc.
|Zeta Instruments, Inc. Patent applications|
|Patent application number||Title||Published|
|20160033421||METHOD AND APPARATUS TO DETECT DEFECTS IN TRANSPARENT SOLIDS - A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.||02-04-2016|
|20140307255||MULTI-SURFACE SCATTERED RADIATION DIFFERENTIATION - An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.||10-16-2014|
|20140218724||Optical Inspector - An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating minor, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating minor and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample.||08-07-2014|
|20140218722||Optical Inspector - An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second lens, a field stop, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The first lens focuses scattered radiation from the sample to generate multiple scan lines at a first focal plane. The field stop is positioned at the first focal plane to block one or more scan lines at the first focal plane. The scan line not blocked by the field stop propagates to the second lens. The second lens de-scans the scan line and generates a point of scattered radiation at a second focal plane where the detector input is located.||08-07-2014|
|20120327414||System And Method For Monitoring LED Chip Surface Roughening Process - A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.||12-27-2012|
|20120176475||3D Microscope Including Insertable Components To Provide Multiple Imaging And Measurement Capabilities - A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).||07-12-2012|
|20120019626||3D Microscope And Methods Of Measuring Patterned Substrates - A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.||01-26-2012|
Patent applications by Zeta Instruments, Inc.