| ZARLINK SEMICONDUCTOR AB Patent applications |
| Patent application number | Title | Published |
|---|
| 20110091168 | OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS - There is provided an opto-electrical assembly. The assembly comprises an optical carrier and one or more optical elements and possibly also electrical elements, such as optical flip-chip die, attached to the optical carrier, and configured for electrical and optical communication with the optical carrier. The assembly further comprises a flexible electrical and optical connectors attached to the optical carrier, and configured to provide electrical and optical communication between the one or more optical and electrical elements and further circuitry. Wherein the flexible connectors are configured to allow for relative movement of the optical carrier and further circuitry during use of the assembly. | 04-21-2011 |
| 20110089438 | OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS - Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar). | 04-21-2011 |
| 20110064363 | SELF-ALIGNED CARRIER ASSEMBLY FOR OPTICAL DEVICE SUPPORTING WAFER SCALE METHODS - Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier. | 03-17-2011 |
| 20110062572 | SELF-ALIGNED SILICON CARRIER FOR OPTICAL DEVICE SUPPORTING WAFER SCALE METHODS - Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy. Preferably, the optical dies have a polymer mass to assist the heat transfer to the silicon substrate. | 03-17-2011 |
| 20110028113 | METHOD OF IMPROVING SENSITIVITY AND INTERFERENCE REJECTION IN WIRELESS RECEIVERS - A wireless receiver for receiving a signal with a characteristic pattern includes a predictor for predicting the presence of a non-zero value of the characteristic pattern. A tracker tracks a noise component in the received signal between predicted non-zero values. The resulting noise component is subtracted from the received signal to output a processed signal, which is then decoded by a pattern discriminator and demodulator. The wireless receiver is less sensitive to noise and interference. | 02-03-2011 |
| 20080199187 | FIBER OPTIC CABLE ASSEMBLY FOR OPTICAL TRANSCEIVER - Disclosed is an optical floating sub-assembly, comprising a thermally conductive non rigid substance between the heat sink carrier and external casing, to minimize mechanical stress on the optical assembly. Also disclosed is a printed circuit board as an electrical interface, comprising two modules capable of converting an electrical signal to an optical signal, transmitting the optical signal and then converting the optical signal back to an electrical signal. Also disclosed is an optical assembly, comprising a heat sink with mechanical features for optical alignment. | 08-21-2008 |
