| Yokohama Rubber Co., Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090298965 | Highly heat-conductive epoxy resin composition - A highly heat-conductive epoxy resin composition, which comprises epoxy resin in a liquid state at room temperature, a latent curing agent, a highly heat-conductive filler, and a non-ionic surfactant, where preferably the latent curing agent is mixed with a portion of the epoxy resin in a liquid state at room temperature to form a master batch, can keep a relatively low viscosity, even if a large amount of the filler is contained, and can be cured at a relatively low temperature for a short time, and has a distinguished storage stability as one-component composition. | 12-03-2009 |
| 20080228411 | Tire Abrasion Predicting Method, Tire Designing Method, Tire Manufactring Method Tire Abrasion Predicting Sytem, and Program - In a prediction of abrasion characteristic of a tire, a characteristic curve of a tire axis force generated on a tire rotation axis at the slip ratio applied to the tire and changed depending upon the slip ratio is acquired. From the characteristic curve, values of tire dynamic element parameters determining the characteristic curve are derived based on a tire dynamic model constituted by the tire dynamic element parameters. Furthermore, a tire sliding amount based on a sliding region, the sliding region and an adhesive region formed on the contact patch of the tire at the applied slip ratio are calculated by applying the values of the tire dynamic element parameters to the model. Lastly, an abrasion characteristic of a tread part of the tire at the applied slip ratio is predicted by using the tire sliding amount with abrasion characteristic data of a tread rubber of the tread part. According to the prediction results, a tire is designed and produced. | 09-18-2008 |
