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YKK SNAP FASTENERS JAPAN CO., LTD.
Tokyo, JP
| YKK SNAP FASTENERS JAPAN CO., LTD. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080257745 | COPPER-TIN-OXYGEN ALLOY PLATING - The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances. | 10-23-2008 |