YIELD MICROELECTRONICS CORP.
|YIELD MICROELECTRONICS CORP. Patent applications|
|Patent application number||Title||Published|
|20130334586||NON-SELF-ALIGNED NON-VOLATILE MEMORY STRUCTURE - A non-self-aligned non-volatile memory structure, comprising: a semiconductor substrate; a left floating gate memory cell and a right floating gate memory cell; a control gate; and a gate insulation layer disposed among said two floating gate memory cells and said control gate. Drains of said two floating gate memory cells are connected to different voltage levels. Said control gate is over said two floating gate memory cells, to cover said floating gates of said two floating gate memory cells, so as to control said two floating gates simultaneously. Said non-self-aligned non-volatile memory structure mentioned above does not require line-to-line alignment of gates, thus reducing significantly the complexity of manufacturing process, and number of layers of photo masks required, in achieving production cost reduction.||12-19-2013|
|20130181276||NON-SELF ALIGNED NON-VOLATILE MEMORY STRUCTURE - A non-self aligned non-volatile memory structure includes a semiconductor substrate; a first gate insulation layer on said semiconductor substrate; a floating gate on first gate insulation layer; two doped regions in said semiconductor substrate, which are respectively on two sides of said first gate insulation layer, and adjoining said first gate insulation layer; a second gate insulation layer on said floating gate; and a control gate on said second gate insulation layer. Width of said control gate on said floating gate is less than that of said floating gate, and width of said control gate not on said floating gate is equal to or greater than width of said floating gate. Through the two non-self aligned gates, the non-volatile memory does not need to meet the requirement of gate line-to-line alignment, thus reducing complexity and cost of manufacturing process.||07-18-2013|
|20120040504||METHOD FOR INTEGRATING DRAM AND NVM - The present invention discloses a method for integrating DRAM and NVM, which comprises steps: sequentially forming on a portion of surface of a DRAM semiconductor substrate a first gate insulation layer and a first gate layer functioning as a floating gate; and implanting ion into regions of the semiconductor substrate, which are at two sides of the first gate insulation layer, to form two heavily-doped areas that are adjacent to the first gate insulation layer and respectively function as a drain and a source; respectively forming over the first gate layer a second gate insulation layer and a second gate layer functioning as a control gate. The present invention not only increases the transmission speed but also reduces the power consumption, the fabrication cost and the package cost.||02-16-2012|
|20120039131||LOW-VOLTAGE EEPROM ARRAY - A low-voltage EEPROM array, which has a plurality of parallel bit lines, parallel word lines and parallel common source lines is disclosed. The bit lines include a first bit line. The word lines include a first word line and a second word line. The common source lines include a first common source line and a second common source line. The low-voltage EEPROM array also has a plurality of sub-memory arrays. Each sub-memory array includes a first memory cell and a second memory cell. The first memory cell connects with the first bit line, the first common source line and the first word line. The second memory cell connects with the first bit line, the second common source line and the second word line. The first and second memory cells are symmetrical and arranged between the first and second common source lines.||02-16-2012|
|20120039129||COST SAVING ELECTRICALLY-ERASABLE-PROGRAMMABLE READ-ONLY MEMORY (EEPROM) ARRAY - A cost saving electrically-erasable-programmable read-only memory (EEPROM) array, having: a plurality of parallel bit lines, a plurality of parallel word lines, and a plurality of parallel common source lines. The bit lines are classified into a plurality of bit line groups, containing a first group bit lines; the word line includes a first and a second word lines; and the common source line includes a first common source line. And, a plurality of sub-memory arrays are provided. Each sub-memory array includes a first and a second memory cells disposed opposite to each other and located on two different sides of the first common source line; the first memory cell is connected to the first group bit lines, the first common source line, and the first word line, and the second memory cell is connected to the first group bit line, the first common source line, and the second word line.||02-16-2012|
|20110286281||REFERENCE CURRENT GENERATOR USED FOR PROGRAMMING AND ERASING OF NON-VOLATILE MEMORY - A reference current generator used for programming and erasing of the non-volatile memory. Wherein, a self-biasing reference generator is used to generate a first reference voltage of a negative temperature coefficient and a second reference voltage of a positive temperature coefficient. A voltage converter receives said first reference voltage and generate a third reference voltage having its temperature coefficient less than that of said first reference voltage, and said second reference voltage and said third reference voltage are input to a reference current source, such that said reference current source generates a reference current of low temperature sensitivity. Through said reference current source, said second reference voltage and said third reference voltage are used to compensate said negative temperature coefficient of a threshold voltage of a transistor, thus reducing difference of times required for programming and erasure under various operation temperatures.||11-24-2011|
|20110182124||NON-VOLATILE MEMORY LOW VOLTAGE AND HIGH SPEED ERASURE METHOD - A non-volatile memory low voltage and high speed erasure method, the non-volatile memory is realized through disposing a stacked gate structure having a control gate and a floating gate on a semiconductor substrate or in an isolation well, such that adequate hot holes are generated in proceeding with low voltage and high speed erasure operation through a drain reverse bias and making changes to gate voltage. In addition, through applying positive and negative voltages on a drain, a gate, and a semiconductor substrate or well regions, adequate hot holes are generated, so as to lower the absolute voltage in achieving the objective of reducing voltage of erasing memory.||07-28-2011|
Patent applications by YIELD MICROELECTRONICS CORP.