Yeh-Chiang Technology Corp.
|Yeh-Chiang Technology Corp. Patent applications|
|Patent application number||Title||Published|
|20110024098||SINTERED HEAT PIPE, MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD FOR GROOVE TUBE THEREOF - A sintered heat pipe, a manufacturing method thereof and a manufacturing method for a groove tube thereof are provided. The sintered heat pipe includes a groove tube, a sintered powder layer and a working fluid. The groove tube has a plurality of grooves and a first end and a second end opposite to the first end. Each groove extends along an axial direction of the groove tube. The first end and the second end are closed. The sintered powder layer is formed on an inside wall of the groove tube, and the groove tube is filled with the working fluid. The size of each powder in the sintered powder layer is greater than a width of each of the grooves.||02-03-2011|
|20100319882||ULTRA-THIN HEAT PIPE AND MANUFACTURING METHOD THEREOF - An ultra-thin heat pipe and a manufacturing method thereof are provided. The ultra-thin heat pipe includes a flat pipe body and a powder-sintered portion. The flat pipe body has an internal wall, a first groove set and a second groove set, wherein the first groove set and the second groove set are disposed on the internal wall and spaced apart from each other, and each groove of the first groove set and the second groove set is extended along an extension direction of the flat pipe body. The powder-sintered portion is disposed within the flat pipe body and connects both the first groove set and the second groove set for forming at least one vapor channel with the internal wall.||12-23-2010|
|20100314984||LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp including a connector, an LED module, an angle adjusting ring, an isolating ring, and a heat dissipating module is provided. The LED module is electrically connected to the connector and has at least one LED unit. The angle adjusting ring is disposed between the LED module and the connector for rotating the LED module, and includes at least one locking element for fixing the LED module on the connector. The isolating ring is disposed between the connector and the angle adjusting ring. The heat dissipating module is in contact with the LED module for preventing the LED module from overheating. The heat dissipating module includes at least one heat pipe and a plurality of fins connecting to the at least one heat pipe, where the at least one LED unit is disposed on the at least one heat pipe.||12-16-2010|
|20100279039||Heat pipe and method for manufacturing the same - A heat pipe comprises a metal tube and a sintered powder layer formed on an inner wall face of the metal tube. The sintered powder layer has a plurality of fine passages extending axially. The sintered powder layer may cover the inner wall face of the metal tube entirely or partially.||11-04-2010|
|20100266864||Ultra-thin heat pipe - An ultra-thin heat pipe comprises a flat metal tube and one or more sintered powder portions. The flat metal tube has an upper tube wall, a lower tube wall and two lateral walls connecting with the upper tube wall and the lower tube wall. The sintered powder portions extends axially and are formed on an inner face of at least one of the upper tube wall, the lower tube wall and the lateral walls such that vapor passage space is formed at one or more sides of the sintered powder portions.||10-21-2010|
|20100263833||Sintered heat pipe - A sintered heat pipe comprises: a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. With this structure, the liquid medium in the capillary grooves which moves toward a hot segment can be prevented from being blown by vapor moving toward the cold segment while the liquid medium condensed from the vapor at the cold segment can enter the capillary grooves without difficulty.||10-21-2010|
|20100181593||LED chip package - A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.||07-22-2010|
|20100177522||LED LAMP - An LED lamp has a base, a tubular conductor, a bulb and at least one LED. The base is metallic and has an electrical connector. The tubular conductor is filled with a fluid and mounted on the base and has a distal end and a proximal end. The bulb is pellucid and connected to the base. The at least one LED is mounted on the distal end of the tubular conductor and electrically connected to the connector of the base. The fluid in the tubular conductor may vaporize close to operating temperatures of the LED so transports heat away from the LED quickly and efficiently so allowing high power or multiple LEDs to be implemented, so improving brightness of the LED lamp and commercial applications.||07-15-2010|
Patent applications by Yeh-Chiang Technology Corp.