| YAGEO CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20110234365 | CHIP RESISTOR HAVING LOW RESISTANCE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a chip resistor having low resistance and a method for manufacturing the same. The chip resistor includes a substrate, a resistive layer, a pair of conducting layers and at least one protective layer. The substrate has a first surface. The resistive layer is disposed on the first surface of the substrate. The conducting layers are disposed adjacent to the first surface of the substrate. The at least one protective layer is disposed on the resistive layer or the conducting layers. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, thereby improving yield rate and efficiency while reducing manufacturing cost. | 09-29-2011 |
| 20110089025 | METHOD FOR MANUFACTURING A CHIP RESISTOR HAVING A LOW RESISTANCE - The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down. | 04-21-2011 |
| 20100201477 | CHIP RESISTOR AND METHOD FOR MAKING THE SAME - The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance. | 08-12-2010 |
| 20090217511 | METHOD FOR MAKING CHIP RESISTOR COMPONENTS - A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products. | 09-03-2009 |
| 20090167609 | ANTENNA FOR WWAN - An antenna for WWAN is disclosed, which includes a first radiating metal strip, a second radiating metal strip, a first ground strip, a connecting metal strip and a second ground strip. The first radiating metal strip has a first portion and a second portion. The second radiating metal strip is independent. The first portion is coupled with the second radiating metal strip to induce a first resonance. The second portion cooperates with the second radiating metal strip to induce a second resonance. The connecting metal strip connects the first radiating metal strip to the first ground strip. The second ground strip is independent. The ground strips are used for grounding effect and can be selectively connected to a ground end of a wireless electronic device. Therefore, the antenna can be mounted in any place of the wireless electronic device, and has stable electrical characteristic. | 07-02-2009 |
| 20090146884 | INTEGRATED ANTENNA FOR WORLDWIDE INTEROPERABILITY FOR MICROWAVE ACCESS (WIMAX) AND WLAN - The invention relates to an integrated antenna for worldwide interoperability for microwave access (WiMax) and wireless local area network (WLAN), which comprises a substrate, a grounding metal strip, a first radiating metal strip, and a second radiating metal strip. The first radiating metal strip is disposed on the substrate and is not connected to the grounding metal strip. The first radiating metal strip has a first portion and a second portion on two ends thereof. The first portion and the second portion are used to induce a first resonance mode and a second resonance mode, respectively. The second radiating metal strip is disposed on the substrate and is connected to the grounding metal strip. The second radiating metal strip is not connected to the first radiating metal strip. The second radiating metal strip is coupled to the first radiating metal strip to induce a third resonance mode. Therefore, the integrated antenna of the present invention is adapted to the frequencies of WiMax and WLAN. | 06-11-2009 |
