| 20120016639 | OPTIMIZATION DESIGN METHOD FOR THE CHASSIS STRUCTURE OF AN ELECTRONIC DEVICE BASED ON MECHANICAL, ELECTRICAL AND THERMAL THREE-FIELD COUPLING - An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using the software Ansys; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using the software IcePak; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using the software FeKo; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary CAD model, the electromagnetic analysis parameter and the thermal analysis parameter, repeating the above processes until the requirement is satisfied. | 01-19-2012 |
