| WISEPAL TECHNOLOGIES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110194022 | IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME - An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a lens barrel and a lens layer. The lens barrel is disposed on the image sensor and located in the light non-gathering region and has a through hole exposing a portion of the image sensor in the light gathering region. A material of the lens barrel includes a thermoplastic with a melting point higher than soldering temperature. The lens layer is disposed on an end portion of the lens barrel away from the image sensor and covers the through hole. The lens layer includes a glass substrate and a lens disposed on the glass substrate and located in the light gathering region. | 08-11-2011 |
| 20110163225 | WAFER LEVEL OPTICAL APPARATUS - A wafer level optical apparatus includes a wafer level lens unit for receiving light. The wafer level lens unit includes a lens substrate having a partial surface with a slope greater than zero and at least one lens adhered to a surface of the lens substrate. | 07-07-2011 |
| 20110150449 | OPTICAL ZOOM SYSTEM - An optical zoom system including a photo sensor, a wafer level optical (WLO) lens module and a focusing motor is provided. The WLO lens module is located at the photo sensor. The WLO lens module includes at least one transparent substrate and at least one lens, wherein the lens is disposed on the transparent substrate. The focusing motor is located between the WLO lens module and the photo sensor. The focusing motor drives the WLO lens module to move toward or backward the photo sensor. | 06-23-2011 |
| 20110133301 | WAFER LEVEL OPTICAL IMAGING APPARATUS - A wafer level optical imaging apparatus includes a covering substrate that covers an imaging unit. A top shading layer is formed on a top surface of the covering substrate, and a bottom shading layer is formed on a bottom surface of the covering substrate. | 06-09-2011 |
| 20110049547 | FABRICATING METHOD AND STRUCTURE OF A WAFER LEVEL MODULE - A fabricating method and structure form a wafer level module with a solid adhesive film. A first solid adhesive film includes a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film. Openings are patterned through the first solid adhesive film. After removing parts of the first release film to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate. | 03-03-2011 |
